JP2009154502A - Method for manufacturing liquid discharge head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid discharge head capable of preventing the generation of cracks in flow channel forming substrates. <P>SOLUTION: The method includes a step for integrally forming a plurality of flow channel substrates 10 in a silicon wafer 110 and for forming break patterns 200 in which a plurality of through-holes 201 are formed in line at a predetermined interval between respective flow channel forming substrates 10 of the silicon wafer 110, a step for connecting substrates 20 to the flow channel forming substrates 10, and a step for dividing the silicon wafer 110 to the plurality of flow channel forming substrates 10 along the break patterns 200, and the through-holes 201A are continuously formed in parts corresponding to lowly rigid parts 150 of the silicon wafer 110 when forming the break patterns 200. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head having a flow path forming substrate made of a silicon substrate having a pressure generating chamber communicating with a nozzle for ejecting droplets.

  A typical example of the liquid ejecting head is an ink jet recording head that ejects ink droplets as droplets. As the structure of this ink jet recording head, for example, pressure generating means such as a piezoelectric element is provided on one side of a flow path forming substrate on which a pressure generating chamber is formed, and a nozzle is provided on the other side of the flow path forming substrate. A nozzle plate in which a nozzle plate is bonded is known.

  Here, the flow path forming substrate constituting the ink jet recording head is formed by, for example, integrally forming a plurality of silicon wafers on a silicon wafer and then dividing the silicon wafer along a break pattern (for example, Patent Documents). 1). When the flow path forming substrate is formed by such a method, generally, the silicon wafer is divided after the nozzle plate or the like is bonded to the flow path forming substrate in a silicon wafer state.

  By the way, the peripheral part of a flow path formation board | substrate has what has the positioning hole for positioning with a nozzle plate etc., for example (for example, refer patent document 2).

JP 2007-201015 A JP 2003-159801 A

  When manufacturing an ink jet recording head in which positioning holes are formed at the peripheral edge of the flow path forming substrate in this way, cracks occur in the portions between the through holes and the positioning holes that constitute the break pattern in the silicon wafer state. There is a problem that it ends up.

  Specifically, when a bonded substrate made of a material different from the flow path forming substrate, for example, a nozzle plate, is bonded to a silicon wafer in which a plurality of flow path forming substrates are integrally formed, heat is subsequently applied to these bonded bodies. Then, the bonded body may be warped due to the difference in linear expansion coefficient between the two. Due to the warpage of the joined body, there is a problem that a crack occurs in a portion between the positioning hole of the flow path forming substrate and the through hole constituting the break pattern as described above. Moreover, even when a recess is formed in the flow path forming substrate by removing a part in the thickness direction, there is a possibility that a crack may occur between the recess and the through hole.

  Such a problem may occur not only in an ink jet recording head that ejects ink droplets but also in manufacturing a liquid ejecting head that ejects droplets other than ink droplets.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a method of manufacturing a liquid jet head capable of preventing the occurrence of cracks in a flow path forming substrate.

The present invention for solving the above-mentioned problems is a flow path forming substrate comprising a silicon substrate in which a pressure generating chamber is formed which communicates with a nozzle and is applied with a pressure for ejecting droplets from the nozzle, and the flow path forming A bonding substrate made of a material different from that of the flow path forming substrate and bonded to the substrate, and a part of the outer edge portion on one side of the flow path forming substrate has lower rigidity than the other portion of the outer edge portion A method of manufacturing a liquid jet head having a low rigidity portion, wherein a plurality of the flow path forming substrates are integrally formed on a silicon wafer, and a plurality of through holes are formed at predetermined intervals between the flow path forming substrates of the silicon wafer. A step of forming a break pattern arranged in a row; a step of bonding the bonding substrate to the flow path forming substrate; and dividing the silicon wafer into a plurality of flow path forming substrates along the break pattern And forming the break pattern, wherein the through hole is continuously formed in a portion corresponding to the low-rigidity portion of the silicon wafer. Is in the way.
In the present invention, since the break pattern through-holes are continuously formed in the portion corresponding to the low-rigidity portion, the low-rigidity is caused by the difference in the linear expansion coefficient between the flow path forming substrate and the bonding substrate. It is possible to prevent cracks from occurring in the part.

  As a more specific configuration, for example, a part of the peripheral edge of the flow path forming substrate has a thin part thinner than the other part of the peripheral edge across the outer edge of the flow path forming substrate. Provided, and the thin portion constitutes the low-rigidity portion. Further, for example, a part of the peripheral edge of the flow path forming substrate is provided with a penetrating portion that penetrates the flow path forming substrate in the thickness direction in the vicinity of the outer edge of the flow path forming substrate, A narrow portion between the end portion of the substrate and the penetrating portion constitutes the low rigidity portion. Even with such a structure, it is possible to prevent the low-rigidity portion from cracking due to the difference in the linear expansion coefficient described above.

  Here, the bonding substrate is, for example, a nozzle plate in which the nozzle is formed. The nozzle plate is formed of a material having a linear expansion coefficient different from that of a silicon single crystal, for example, stainless steel (SUS). Even when such a nozzle plate and the flow path forming substrate have different linear expansion coefficients. It is possible to prevent cracks from occurring in the low rigidity portion.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
1 is an exploded perspective view of an ink jet recording head manufactured by a manufacturing method according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a cross-sectional view of FIG. As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and an elastic film 50 made of silicon dioxide is previously formed on one surface thereof by thermal oxidation. Yes.

  In the flow path forming substrate 10, a plurality of pressure generating chambers 12 partitioned by a partition wall 11 are arranged in parallel in the width direction. Further, an ink supply path 13 and a communication path 14 that are partitioned by a partition wall 11 and communicate with each pressure generation chamber 12 are provided on one end side in the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10. Furthermore, a communication portion 15 that communicates with each communication path 14 is provided outside the communication path 14.

  The ink supply path 13 communicates with one end side in the longitudinal direction of the pressure generation chamber 12 and has a smaller cross-sectional area than the pressure generation chamber 12. For example, in the present embodiment, the ink supply path 13 is smaller than the width of the pressure generation chamber 12 by narrowing the flow path on the pressure generation chamber 12 side between the communication portion 15 and each pressure generation chamber 12 in the width direction. It is formed with a width. In this embodiment, the ink supply path 13 has the flow path narrowed from one side, but the flow path width may be narrowed from both sides. Further, instead of reducing the width of the flow path, the thickness of the flow path may be reduced. Each communication path 14 is formed by extending the partition walls 11 on both sides in the width direction of the pressure generating chamber 12 to the communication part 15 side to partition the space between the ink supply path 13 and the communication part 15. The communication portion 15 communicates with a reservoir portion 32 of the protective substrate 30 described later, and constitutes a part of a reservoir that becomes a common ink chamber (liquid chamber) of each pressure generating chamber 12.

  Adhered to the opening surface side of the flow path forming substrate 10 is a nozzle plate 20, which is a bonded substrate having a nozzle 21 communicating with the vicinity of the end of each pressure generating chamber 12 on the side opposite to the ink supply path 13. It is joined by an agent. In this embodiment, the nozzle plate 20 is formed of a material having a linear expansion coefficient different from that of the flow path forming substrate 10, for example, stainless steel (SUS).

  Further, on the surface of the nozzle plate 20 opposite to the flow path forming substrate 10, a recording portion 22 in which head information is recorded on the peripheral portion thereof is formed. Specifically, the recording unit 22 is, for example, a two-dimensional code such as a QR code, a bar code, or the like. The recording unit 22 may be a character or a symbol. The head information recorded in the recording unit 22 includes, for example, at least one of a lot number, ink ejection characteristics (liquid ejection characteristics), failure history, repair history, and the like.

  The recording unit 22 is formed by, for example, mechanically cutting the surface of the nozzle plate 20 or cutting by laser processing or the like. When such a recording portion 22 is formed on the surface of the nozzle plate 20, a minute projection called a “convex dent” (illustrated) is formed on the joint surface of the nozzle plate 20 with the flow path forming substrate 10 due to an impact during processing. None) is formed. When the flow path forming substrate 10 and the nozzle plate 20 are bonded with an adhesive, since the thickness of the adhesive is about several μm, if such a protrusion is formed on the nozzle plate 20, the protrusion There may be a problem that an excessive gap is formed between the flow path forming substrate 10 and the nozzle plate 20 in contact with the flow path forming substrate 10 and the adhesive flows out into the flow path or the like. .

  Therefore, a recess 16 having a depth capable of accommodating the protrusion of the nozzle plate 20 is formed at a position facing the recording unit 22 on the side of the flow path forming substrate 10 where the nozzle plate 20 is joined. The recess 16 is formed independently of the liquid flow path having the pressure generation chamber 12 and is formed in the same size or larger than the recording unit 22. In the present embodiment, the recess 16 is formed on the peripheral edge of the flow path forming substrate 10 across the end of the flow path forming substrate 10. That is, the recess 16 is continuously formed from the region facing the recording unit 22 to the end of the flow path forming substrate 10.

As described above, the elastic film 50 is formed on the surface of the flow path forming substrate 10 opposite to the nozzle plate 20, and an insulating film made of, for example, zirconium oxide (ZrO ₂ ) is formed on the elastic film 50. 55 is formed. Further, on the insulator film 55, for example, a lower electrode film 60 made of platinum (Pt), iridium (Ir), and the like, and a piezoelectric layer 70 made of a piezoelectric material such as lead zirconate titanate (PZT), and the like. A piezoelectric element 300 composed of an upper electrode film 80 made of iridium (Ir) or the like is formed. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In the present embodiment, the lower electrode film 60 is used as a common electrode of the piezoelectric element 300 and the upper electrode film 80 is used as an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for convenience of a drive circuit and wiring.

  A lead electrode 90 made of, for example, gold (Au) or the like is drawn from the upper electrode film 80 of each piezoelectric element 300 so that a voltage is selectively applied to each piezoelectric element 300 via the lead electrode 90. It has become.

  A protective substrate 30 having a piezoelectric element holding portion 31 for protecting the piezoelectric element 300 is joined to a surface facing the piezoelectric element 300 on the surface of the flow path forming substrate 10 on the piezoelectric element 300 side. Since the piezoelectric element 300 is disposed in the piezoelectric element holding portion 31, it is protected in a state where it is hardly affected by the external environment. The piezoelectric element holding part 31 may be sealed or may not be sealed.

  In the protective substrate 30, a reservoir portion 32 that penetrates the protective substrate 30 in the thickness direction is formed in a region facing the communication portion 15 of the flow path forming substrate 10. The reservoir portion 32 communicates with the communication portion 15 through openings provided in the elastic film 50 and the insulator film 55, and the reservoir 100 that is common to the plurality of pressure generating chambers 12 by the communication portion 15 and the reservoir portion 32. Is configured. Further, an exposure hole 33 penetrating the protection substrate 30 in the thickness direction is provided in a region between the piezoelectric element holding portion 31 and the reservoir portion 32 of the protection substrate 30, and the lower electrode film 60 is provided in the exposure hole 33. And the tip of the lead electrode 90 are exposed. Although not shown, the lower electrode film 60 and the lead electrode 90 exposed in the exposure hole 33 are electrically connected to a drive IC or the like for driving the piezoelectric element 300 by connection wiring extending in the exposure hole 33. It is connected.

  Examples of the material of the protective substrate 30 include glass, ceramic material, metal, resin, and the like, but it is preferable that the protective substrate 30 be formed of a material that is substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. A silicon single crystal substrate made of the same material as the path forming substrate 10 is preferably used.

  Further, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto a region corresponding to the reservoir portion 32 of the protective substrate 30. The sealing film 41 is made of a material having low rigidity and flexibility, and one surface of the reservoir portion 32 is sealed by the sealing film 41. The fixing plate 42 is made of a hard material such as metal. Since the region of the fixing plate 42 that faces the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. ing.

  In such an ink jet recording head of the present embodiment, ink is taken in from an external ink supply means (not shown), filled with ink from the reservoir 100 to the nozzle 21, and then in accordance with a recording signal from a drive IC (not shown). A voltage is applied to each piezoelectric element 300 corresponding to the pressure generation chamber 12 to cause the piezoelectric element 300 to bend and deform. As a result, the pressure in each pressure generating chamber 12 is increased and ink droplets are ejected from the nozzle 21.

  Hereinafter, a method for manufacturing such an ink jet recording head will be described. Incidentally, a plurality of flow path forming substrates 10 and protective substrates 30 constituting such an ink jet recording head are integrally formed on a silicon wafer in the assembly stage. For example, in the case of the flow path forming substrate 10, as shown in FIG. 3A, a plurality of flow path forming substrates 10 are integrally formed on a flow path forming substrate wafer 110 which is a 6-inch silicon wafer. A plurality of flow path forming substrates 10 are formed by dividing the flow path forming substrate wafer 110 along a planned cutting line indicated by a dotted line in the drawing. On the planned cutting line, as shown in FIG. 3B, a break pattern 200 in which a plurality of through holes 201 are arranged at a predetermined interval is formed. The break pattern 200 has a fragile portion 202 between the through holes 201, and the fragile portion 202 is cracked by applying an external force to the flow path forming substrate wafer 110. As a result, the flow path forming substrate wafer 110 is divided into a plurality of flow path forming substrates 10 along the break pattern 200. In FIG. 3, the through-hole 201 is simplified and shown as a rectangular opening shape, but this through-hole 201 is actually an opening shape along the crystal plane of the flow path forming substrate wafer 110 that is a silicon wafer. Formed. For example, in this embodiment, since the flow path forming substrate wafer 110 is a silicon wafer having a plane orientation (110), the through hole 201 has an opening shape along two (111) planes perpendicular to the (110) plane. Formed.

  4, 5, and 7 are cross-sectional views of the flow path forming substrate wafer in the longitudinal direction of the pressure generating chamber, and FIG. 6 is an enlarged plan view and cross sectional view of a part of the flow path forming substrate wafer. It is. With reference to FIGS. 4 to 7, a method of manufacturing the ink jet recording head according to the present embodiment will be described.

  First, as shown in FIG. 4A, the piezoelectric element 300 and the lead electrode 90 are formed on the flow path forming substrate wafer 110, which is a silicon wafer having a predetermined thickness, via a vibration plate. That is, the elastic material 50, the insulator film 55, the lower electrode film 60, the piezoelectric layer 70, the upper electrode film 80, and the lead electrode 90 are formed by sequentially laminating and patterning a predetermined material on the flow path forming substrate wafer 110. To do. Since the manufacturing method of the piezoelectric element 300 and the like is a known technique, detailed description thereof is omitted.

  Next, as shown in FIG. 4B, a protective substrate wafer 130, which is a silicon wafer on which a plurality of protective substrates 30 are integrally formed, is placed on a flow path forming substrate wafer 110, for example, an epoxy-based substrate. Bonding is performed by an adhesive layer 35 made of an adhesive or the like. Here, a piezoelectric element holding portion 31, a reservoir portion 32, and an exposure hole 33 are formed in advance on the protective substrate wafer 130. Further, similarly to the break pattern 200 of the flow path forming substrate wafer 110 described above, through holes 211 constituting the break pattern 210 are also formed between the protective substrates 30 of the protective substrate wafer 130.

  Next, as shown in FIG. 4 (c), after the flow path forming substrate wafer 110 is thinned to a predetermined thickness, as shown in FIG. 5 (a), on the flow path forming substrate wafer 110, For example, the protective film 51 is newly formed and patterned into a predetermined shape. Then, as shown in FIG. 5B, the flow path forming substrate wafer 110 is anisotropically etched (wet etching) using the protective film 51 as a mask, and the pressure generating chamber 12 is applied to the flow path forming substrate wafer 110. The ink supply path 13, the communication path 14, the communication part 15, the recess 16, and the through holes 201 constituting the break pattern 200 are formed.

  In a state where a plurality of the flow path forming substrates 10 are integrally formed on the flow path forming substrate wafer 110 as described above, as shown in FIG. 6, the outer edge portion of each flow path forming substrate 10 (the end of the flow path forming substrate 10). A low-rigidity portion 150 having lower rigidity than other portions of the outer edge portion of the flow path forming substrate 10 is formed in a part of the vicinity of the portion. In the present embodiment, the recess 16 is formed in the outer peripheral portion of each flow path forming substrate 10, so that the outer edge portion of the flow path forming substrate 10 is thinner than the other portions of the outer edge portion. The portion 10a exists, and the low-rigidity portion 150 is constituted by the thin portion 10a. That is, the rigidity of the low-rigidity portion 150 is lower than that of other portions because the thickness is thinner than the other portions of the outer edge portion of the flow path forming substrate 10.

  Then, when the break pattern 200 is formed by etching as described above, in the present invention, the through hole 201A constituting the break pattern 200 is formed in the portion corresponding to the low rigidity portion 150 of the flow path forming substrate wafer 110. It was made to form continuously over the part corresponding to the low-rigidity part 150. That is, the break pattern 200 is basically composed of the through holes 201 and the weak portions 202 between the through holes 201, but the weak portions 202 are provided in addition to the portions corresponding to the low rigidity portions 150. Only the through-hole 201A is provided.

  Next, as shown in FIG. 7A, the protective film 51 on the surface side where the pressure generation chamber 12 of the flow path forming substrate wafer 110 is opened is removed, and a nozzle plate is formed in a portion corresponding to each flow path forming substrate 10. 20 are respectively bonded by an adhesive 25. For example, when a thermosetting adhesive is used as the adhesive 25, the adhesive 25 is heated and cured with the uncured adhesive 25 sandwiched between the flow path forming substrate wafer 110 and the nozzle plate 20. .

  Here, due to the heating when the adhesive 25 is cured, the flow path forming substrate wafer 110 is deformed (warped) due to the difference in linear expansion coefficient between the flow path forming substrate wafer 110 and the nozzle plate 20. As a result, the stress accompanying the deformation of the flow path forming substrate wafer 110 is applied to the low rigidity portion 150. And when the through-hole 201 and the weak part 202 are formed as the break pattern 200 in the area | region facing the low-rigidity part 150, there exists a possibility that a crack may arise toward the low-rigidity part 150 from the through-hole 201. FIG.

  Since each flow path forming substrate 10 tends to be deformed in a spreading direction by heating, for example, in a portion where the flow path forming substrates 10 are arranged in a staggered pattern on the flow path forming substrate wafer 110, FIG. As indicated by arrows in the middle, stresses in different directions of the adjacent flow path forming substrates 10 act on each flow path forming substrate 10. That is, a plurality of directions of stress act on each flow path forming substrate 10 arranged in a staggered manner. For this reason, the low-rigidity part 150 provided in the outer edge part of the flow-path formation board | substrate 10 arrange | positioned in zigzag form is easy to produce a crack especially.

  However, in the present invention, since only the through hole 201A is continuously formed in the portion corresponding to the low rigidity portion 150 as described above (FIG. 6), the stress applied to the low rigidity portion 150 by the through hole 201A is reduced. It is possible to prevent the low-rigidity portion 150 from cracking because it is mitigated. Of course, the occurrence of cracks in the low rigidity portion 150 of the flow path forming substrate 10 arranged in a staggered manner can also be prevented. Moreover, it is possible to prevent the low-rigidity portion 150 from cracking not only when the adhesive 25 is cured but also due to any factor.

  After that, as shown in FIG. 7B, the compliance substrate 40 is bonded to the protective substrate wafer 130, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 are bonded using, for example, an expanded tape. Divide along break patterns 200 and 210. Thereby, the ink jet recording head having the above-described structure is manufactured.

  In the present embodiment, the low-rigidity portion 150 configured only by the thin-walled portion 10a has been described. For example, as illustrated in FIG. 8, the low-rigidity portion 150A partially configured by the thin-walled portion 10a is provided. However, there is a risk of cracking. That is, when the concave portion 16 is provided in a part of the peripheral edge portion of the flow path forming substrate 10 and the width of the wall portion 17 is relatively narrow, the low-rigidity portion 150A configured by the wall portion 17 and the thin portion 10a. Even so, cracks may occur. Even when the ink jet recording head having such a structure is manufactured, the through-hole 201A constituting the break pattern 200 is continuously formed in the portion corresponding to the low-rigidity portion 150A. It is possible to prevent the crack from occurring in the portion 150A.

(Embodiment 2)
FIG. 9 is a schematic perspective view of the ink jet recording head according to the second embodiment, and FIG. 10 is a diagram illustrating the manufacturing method according to the second embodiment, and is an enlarged plan view of a part of the flow path forming substrate wafer. It is a figure and sectional drawing. In addition, the same code | symbol is attached | subjected to the same member and the overlapping description is abbreviate | omitted.

  As shown in FIG. 9, the ink jet recording head according to the present embodiment is not provided with the recording portion of the nozzle plate 20 and the recess of the flow path forming substrate 10. Positioning holes 18 that are penetrating portions that penetrate the flow path forming substrate 10 in the thickness direction are provided. Further, the configuration is the same as that of the first embodiment except that the positioning holes 34 and 23 are formed in the protective substrate 30 and the nozzle plate 20 corresponding to the positioning holes 18, respectively. These positioning holes 18, 23, and 34 are used for positioning the flow path forming substrate 10, the nozzle plate 20, and the protective substrate 30 by inserting positioning pins in the manufacturing process.

  Such an ink jet recording head according to this embodiment is also manufactured by the manufacturing method described in the first embodiment. Then, in a state where a plurality of flow path forming substrates 10 are integrally formed on the flow path forming substrate wafer 110, as shown in FIG. 10, the outer edge portion of each flow path forming substrate 10 (the end of the flow path forming substrate 10). In a part of the vicinity, a low-rigidity portion 150B having a lower rigidity than other portions of the outer edge portion of the flow path forming substrate 10 is formed. In this embodiment, since the positioning hole 18 is formed in the outer peripheral portion of each flow path forming substrate 10, the portion between the positioning hole 18 and the end portion of the flow path forming substrate is the other edge portion. The narrow portion 10b is thinner than the portion. And the low rigidity part 150B whose rigidity is lower than the other part of an outer edge part is comprised by this narrow part 10b.

  Even when such a low-rigidity portion 150B is present in the flow path forming substrate 10, the through-hole 201A constituting the break pattern 200 is continuously formed over a portion corresponding to the low-rigidity portion 150B. Thus, it is possible to prevent the low rigidity portion 150B from being cracked.

(Other embodiments)
As mentioned above, although embodiment of this invention was described, of course, this invention is not limited to these embodiment. For example, in the above-described embodiment, an ink jet recording head having a thin film type piezoelectric element manufactured by applying a film forming and lithography method is exemplified. Of course, the present invention is a manufacturing method of such an ink jet recording head. The method is not limited. The present invention is, for example, a piezoelectric element (so-called thin film type) in which each layer is formed by film formation and lithography, or a piezoelectric material and an electrode forming material that are alternately stacked to expand and contract in the axial direction (so-called longitudinal vibration type) The present invention can also be applied to a method of manufacturing an ink jet recording head having a piezoelectric element.

  Furthermore, the present invention provides an ink jet recording head in which a heat generating element is disposed in a pressure generating chamber and a droplet is ejected from a nozzle by a bubble generated by heat generated by the heat generating element, or between a diaphragm and an electrode. The ink jet recording head can be applied to a method of manufacturing an ink jet recording head including a so-called electrostatic actuator in which a vibration plate is deformed by electrostatic force to discharge a droplet from a nozzle.

  Furthermore, in the above-described embodiment, the present invention has been described with respect to an example of a method for manufacturing an ink jet recording head. However, the present invention is not limited to this, and the present invention is intended for a wide range of methods for manufacturing a liquid jet head. Of course, the present invention can also be applied to a manufacturing method for ejecting liquids other than ink. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

FIG. 3 is an exploded perspective view of the recording head according to the first embodiment. 2A and 2B are a plan view and a cross-sectional view of the recording head according to the first embodiment. It is the schematic of the wafer for flow path formation substrates, and a break pattern. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 6A and 6B are a plan view and a cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 6A and 6B are a plan view and a cross-sectional view illustrating a modified example of the recording head according to the first embodiment. 6 is a schematic perspective view of a recording head according to Embodiment 2. FIG. 5A and 5B are a plan view and a cross-sectional view illustrating a manufacturing process of a recording head according to a second embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 10a Thin part, 10b Narrow part, 11 Partition, 12 Pressure generating chamber, 13 Ink supply path, 14 Communication path, 15 Communication part, 16 Recessed part, 17 Wall part, 18 Positioning hole, 20 Nozzle plate , 21 nozzle, 22 recording unit, 25 adhesive, 30 protective substrate, 40 compliance substrate, 50 elastic film, 55 insulator film, 60 lower electrode film, 70 piezoelectric layer, 80 upper electrode film, 90 lead electrode, 110 flow Wafer for path forming substrate, 130 Wafer for protective substrate, 150 Low rigidity portion, 200 Break pattern, 201 Through hole, 202 Fragile portion, 300 Piezoelectric element

Claims (4)

A flow path forming substrate made of a silicon substrate in which a pressure generation chamber is formed which communicates with the nozzle and is supplied with pressure for ejecting droplets from the nozzle, and the flow path forming substrate bonded to the flow path forming substrate And a bonding substrate made of a material different from that of the flow path forming substrate, and a low-rigidity portion whose rigidity is lower than that of the other portion of the outer edge portion at a part of the outer edge portion on one side of the flow path forming substrate. A manufacturing method comprising:
Forming a plurality of the flow path forming substrates integrally on a silicon wafer and forming a break pattern in which a plurality of through holes are arranged at predetermined intervals between the flow path forming substrates of the silicon wafer; and Bonding the bonding substrate to a path forming substrate, and dividing the silicon wafer into a plurality of the flow path forming substrates along the break pattern,
In addition, when the break pattern is formed, the through hole is continuously formed in a portion corresponding to the low rigidity portion of the silicon wafer.   A part of the peripheral edge of the flow path forming substrate is provided with a thin part having a thickness smaller than the other part of the peripheral part across the outer edge of the flow path forming substrate, and the thin part is The method of manufacturing a liquid jet head according to claim 1, wherein the low-rigidity portion is configured.   A part of the peripheral edge of the flow path forming substrate is provided with a penetrating portion penetrating the flow path forming substrate in the thickness direction in the vicinity of the outer edge of the flow path forming substrate. 2. The method of manufacturing a liquid jet head according to claim 1, wherein a narrow portion between the first portion and the penetrating portion constitutes the low-rigidity portion.   The method of manufacturing a liquid jet head according to claim 1, wherein the bonding substrate is a nozzle plate in which the nozzles are formed.

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