JP2009143018A - Inkjet head and manufacturing method for inkjet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet head in which a channel regulating member for regulating an inflow of ink into a channel is adhesively formed without causing the block of the channel by an adhesive at a predetermined point of a head chip rear surface where a wiring electrode electrically connected with a driving element in the channel is formed. <P>SOLUTION: The wiring electrode 14 electrically connected with the driving element is formed to overlie the rear surface of the head chip of a shear mode type from an opening of the channel 12 to the upper end 1a and/or the lower end 1b of the rear surface. The upper end side and/or the lower end side are made to be electrical connection regions A1 and B1 to an external wiring cable. In the inkjet head, a laminate 15 which forms a flat surface the periphery of the opening of the channel 12 including an end 14a of the opening part of the channel 12 of the wiring electrode 14 and excluding the electrical connection regions A1 and B1 is formed on the rear surface of the head chip. The channel regulating member 16 is bonded to cover the opening of the channel 12 within a range of a front surface of the laminate 15. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inkjet head and a method for manufacturing the inkjet head. More specifically, the invention relates to a head chip in which drive walls composed of channels and piezoelectric elements are alternately arranged, and the openings of the channels are arranged on the front and rear surfaces, respectively. The present invention relates to an inkjet head provided with a flow path regulating member that regulates the inflow of ink into a channel on the rear surface, and an inkjet head manufacturing method.

  Conventionally, a drive voltage is applied to a drive electrode formed on a drive wall that divides a channel to cause shear deformation of the drive wall, and ink generated in the channel is ejected from a nozzle by using the pressure generated at that time. For example, Patent Documents 1, 2, and 3 include a so-called harmonica type head chip in which opening portions of channels are respectively arranged on the front surface and the rear surface.

  Some rear surfaces of such head chips are provided with a flow path regulating member that regulates the inflow of ink into the channel. For example, in the ink jet head described in Patent Document 1, an ink flow that communicates only with the ejection channel over the entire rear surface of the harmonica type head chip in which ejection channels that eject ink and air channels that do not eject ink are alternately arranged. The opening of the air channel is closed so that ink is not supplied into the air channel by adhering a flow path regulating member having a passage hole.

  Further, in the inkjet head described in Patent Document 2, all channels are ejection channels that eject ink, and a flow path in which ink flow path holes communicating with each channel are opened over the entire rear surface of the harmonica type head chip. By adhering the regulating member, the inlet of the ink into each channel is narrowed. Thereby, the vibration of the ink meniscus of the nozzle when the head is driven at high speed can be effectively suppressed, and the ejection can be stabilized.

  By the way, in the harmonica type head chip, an electrode for applying a driving voltage to the driving electrode formed on the wall surface of the driving wall facing the channel needs to be drawn out of the channel. In this case, as described in Patent Documents 2 and 3, the wiring electrode electrically connected to each drive electrode is connected to the upper end and / or the lower end of the rear surface of the head chip from one side of the opening opening in a rectangular shape on the rear surface of the head chip. Since the method of drawing out toward the surface is simple, it is preferable. As a method for forming such a wiring electrode, a method of forming a laminated layer on the rear surface of the head chip 1 by a vapor deposition method or a sputtering method is generally used.

Further, in Patent Document 3, a wiring board on which wirings of the same pitch as the wiring electrodes are formed is bonded to the rear surface of the head chip from which the wiring electrodes are drawn, and each wiring electrode of the head chip and each wiring of the wiring board are joined. A technique is disclosed in which a drive voltage is easily applied to each drive electrode by electrically connecting one end thereof to each other and joining an FPC at the end of the wiring board.
JP 2004-90374 A JP 2006-35454 A JP 2006-82396 A

  The flow path regulating member provided on the rear surface of the head chip is formed of a resin film such as polyimide, and is adhered to the rear surface of the head chip by using an epoxy adhesive and then pressed.

  When adhering the flow path regulating member, the adhesive oozes out from the ink flow path hole when pressurized, and therefore it is necessary to apply a large amount of adhesive in consideration of the loss due to the oozing. On the other hand, when a large amount of adhesive is applied, a large amount of excess adhesive may flow into the channel and block the channel. For this reason, when adhering the flow path regulating member, it is necessary to control the outflow of excess adhesive by uniformly pressurizing the entire surface.

  However, as described in Patent Documents 2 and 3, in the case where the wiring electrodes are stacked and formed on the rear surface of the head chip by patterning, the wiring electrodes themselves have a thickness. When the entire surface of the flow path regulating member is pressed to adhere and adhere to the rear surface of the head chip, the pressure is concentrated on the surface of the wiring electrode having the highest height. The applied pressure becomes relatively weak, and the pressure applied to the entire flow path regulating member becomes non-uniform. If there is a difference in the applied pressure around the step due to the wiring electrode, there is a problem that excess adhesive flows into the channel from the vicinity of the wiring electrode having a weak applied pressure.

  In addition, since the pressure applied around the channel opening is non-uniform, there is also a problem that adhesion failure occurs around the opening. There is a head chip in which ejection channels that eject ink and air channels that do not eject ink are alternately arranged. In such a head chip, there is a possibility that ink flows into the air channel. Further, even when a flow path regulating member is provided so as to narrow the flow path of the ink inlet of the ejection channel, there is a possibility that the original ejection performance cannot be exhibited due to the ink flowing from the poorly bonded part.

  Further, in the aspect in which the wiring substrate is bonded to the rear surface of the head chip as described in Patent Document 3, the wiring substrate can be bonded to the rear surface of the head chip and provided on the wiring substrate and the wiring substrate formed on the rear surface of the head chip. In order to secure a region where the wiring is electrically connected, it is necessary to expose the wiring electrode in a predetermined region at the upper end and the lower end excluding the channel opening on the rear surface of the head chip. Therefore, when the flow path regulating member is provided on the rear surface of such a head chip, it is necessary to perform the bonding operation at a position outside the predetermined region and precisely aligned to correspond to the opening of each channel. There is a problem that workability is bad.

  Accordingly, an object of the present invention is to provide a flow path regulating member that regulates the inflow of ink into the channel at a predetermined position on the rear surface of the head chip in which wiring electrodes that are electrically connected to the drive electrodes in each channel are stacked. An object of the present invention is to provide an ink jet head formed in close contact with a channel without being blocked by an adhesive.

  Another object of the present invention is to provide a flow path regulating member that regulates the inflow of ink into the channel on the rear surface of the head chip in which wiring electrodes electrically connected to the drive electrodes in each channel are stacked. The pressure applied during bonding can be applied uniformly to the periphery of the opening of the channel to suppress the flow of excess adhesive into the channel and to be in close contact with the outer periphery of the opening. An object of the present invention is to provide an ink jet head manufacturing method that can be easily formed at a predetermined position on the rear surface.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

  According to the first aspect of the present invention, the drive walls composed of the channels and the piezoelectric elements are alternately arranged in parallel, and the opening portions of the channels are disposed on the front surface and the rear surface, respectively, and the wall surface of the drive wall facing the channel is provided. A drive electrode, and a head chip that shears the drive wall by applying a drive voltage to the drive electrode to generate pressure for discharging the ink in the channel; and a rear surface of the head chip In addition, a wiring electrode that is electrically connected to the drive electrode is laminated from the opening of the channel to the upper end and / or the lower end of the rear surface, and the upper end side and / or the lower end side is an electrical connection region with an external wiring. In the inkjet head, the back surface of the head chip includes an end portion of the wiring electrode on the opening side of the channel, and the electrical connection region Forming a laminate with the outer periphery of the channel opening except for a flat surface, and restricting the inflow of ink into the channel so as to cover the channel opening within the range of the surface of the laminate An ink jet head, wherein a flow path regulating member is bonded.

  The invention according to claim 2 is the ink jet head according to claim 1, wherein the laminate is integrally formed with the wiring electrode by using the same metal material as the wiring electrode.

  A third aspect of the invention is the ink jet head according to the first aspect, wherein the laminated body is formed of an insulating material with a thickness equal to or greater than the thickness of the wiring electrode.

  A fourth aspect of the invention is the ink jet head according to the third aspect, wherein the laminate is formed independently for each opening of the channel.

  A fifth aspect of the present invention is the ink jet head according to the third aspect, wherein the laminated body is formed in a size extending over a plurality of openings of the channel.

  The invention according to claim 6 is characterized in that the channels are all discharge channels for discharging ink, and the flow path regulating member is formed so as to reduce an opening area of the opening of the channel. It is an inkjet head in any one of Claims 1-5.

  According to a seventh aspect of the present invention, in the channel, an ejection channel that ejects ink and an air channel that does not eject ink are alternately arranged, and the flow path regulating member includes an opening of the air channel. 6. The inkjet head according to claim 1, wherein the inkjet head is formed so as to be closed.

  The invention according to claim 8 is the ink jet head according to claim 7, wherein the flow path regulating member is formed so as to restrict an opening area of the opening of the discharge channel.

  According to the ninth aspect of the present invention, drive walls made up of channels and piezoelectric elements are alternately arranged side by side, and openings of the channels are arranged on the front surface and the rear surface, respectively, on the wall surface of the drive wall facing the channel. A drive electrode, and a head chip that shears the drive wall by applying a drive voltage to the drive electrode to generate pressure for discharging the ink in the channel; and a rear surface of the head chip In addition, a wiring electrode that is electrically connected to the drive electrode is laminated from the opening of the channel to the upper end and / or the lower end of the rear surface, and the upper end side and / or the lower end side is an electrical connection region with an external wiring. In the inkjet head manufacturing method, the rear surface of the head chip includes an end of the wiring electrode on the channel opening side, and After patterning a laminate that flattenes the outer periphery of the opening of the channel excluding the general connection region, a resin film is pressure-bonded to the rear surface of the head chip using an adhesive, and then the resin film is By removing unnecessary portions by patterning, the resin film is left in the range of the surface of the laminate, and a flow path regulating member that regulates the inflow of ink into the channel is formed by the remaining resin film An ink jet head manufacturing method characterized in that:

  The invention according to claim 10 is characterized in that the patterning of the resin film is performed in a region to be left as the flow path regulating member on the surface of the resin film before or after the resin film is bonded to the rear surface of the head chip. A coating layer is formed in a pattern, and dry etching is performed on the resin film adhered to the rear surface of the head chip, thereby removing the region other than the region covered with the coating layer. It is a manufacturing method of the inkjet head of Claim 9.

  The invention according to claim 11 is the inkjet head according to claim 9 or 10, wherein the laminate is integrally formed at the time of forming the wiring electrode, using the same metal material as the wiring electrode. It is a manufacturing method.

  The invention according to claim 12 is the inkjet according to claim 9 or 10, wherein the laminated body is formed with a thickness equal to or greater than the thickness of the wiring electrode using an insulating material after the wiring electrode is formed. It is a manufacturing method of a head.

  A thirteenth aspect of the present invention is the method of manufacturing an ink jet head according to the twelfth aspect, wherein the laminate is formed independently for each opening of the channel.

  The invention according to a fourteenth aspect is the method of manufacturing an ink jet head according to the twelfth aspect, wherein the laminate is formed to have a size extending over a plurality of openings of the channel.

  According to a fifteenth aspect of the present invention, the channel is an ejection channel that ejects all ink, and the flow path regulating member is formed so as to reduce an opening area of the opening of the channel. It is a manufacturing method of the ink-jet head in any one of 9-14.

  According to a sixteenth aspect of the present invention, in the channel, an ejection channel that ejects ink and an air channel that does not eject ink are alternately arranged, and the flow path regulating member includes an opening of the air channel. It forms so that it may obstruct | occlude, It is a manufacturing method of the inkjet head in any one of Claims 9-15 characterized by the above-mentioned.

  The invention according to claim 17 is the method of manufacturing an ink-jet head according to claim 16, wherein the flow path regulating member is formed so as to restrict the opening area of the opening of the discharge channel.

  According to the present invention, the flow path regulating member that regulates the inflow of the ink into the channel is bonded to the predetermined position on the rear surface of the head chip in which the wiring electrode electrically connected to the drive electrode in each channel is laminated. It is possible to provide an ink jet head that is formed in close contact without clogging of a channel with an agent.

  In addition, according to the present invention, when the flow path regulating member for regulating the inflow of ink into the channel is provided on the rear surface of the head chip on which the wiring electrode electrically connected to the drive electrode in each channel is formed, adhesion is performed. The pressure applied at the time can be applied uniformly to the periphery of the opening of the channel, so that excess adhesive can be prevented from flowing into the channel and can be brought into close contact with the outer periphery of the opening. An ink jet head manufacturing method that can be easily formed at a predetermined location can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 is a view of a head chip portion of an ink jet head according to the present invention as viewed from the rear surface side, FIG. 2 is a cross-sectional view taken along line (ii)-(ii) of FIG. 1, and FIG. It is a perspective view of the opening part of one channel.

  In this specification, the surface on the side where ink is ejected from the head chip is referred to as “front surface”, and the surface on the opposite side is referred to as “rear surface”. In addition, the outer surfaces located above and below in the figure across the channels arranged in parallel in the head chip are referred to as “upper surface” and “lower surface”, respectively.

  In the head chip 1, channel rows in which drive walls 11 and channels 12 made of piezoelectric elements are alternately arranged in parallel are arranged in two rows vertically in the figure. Here, the channel row located on the upper side in the figure is A row, and the channel row located on the lower side is B row.

  The channels 12 of the head chip 1 in this aspect are all ejection channels that eject ink. The shape of each channel 12 is such that both side walls extend substantially perpendicular to the upper and lower surfaces of the head chip 1 and are parallel to each other.

  The front surface and the rear surface of the head chip 1 are opposed to the openings 12a and 12b of the respective channels 12 that are open in a rectangular shape. Each channel 12 is a straight type whose size and shape are substantially the same in the length direction from the rear opening 12b serving as an ink inlet to the front opening 12a serving as an ink outlet, and is a so-called harmonica type head chip. Structure.

  A drive electrode 13 made of a metal film such as Ni, Au, Cu, or Al is formed in close contact with the entire inner surface of each channel 12.

  A wiring electrode 14 that is electrically connected to the drive electrode 13 in each channel 12 is formed on the rear surface of the head chip 1. The wiring electrodes 14 led out from the respective channels 12 of the channel row A are stacked from the opening 12b of the channel 12 to the end portion 1a on the upper surface side of the rear surface of the head chip 1, and are arranged in parallel on the end portion 1a side. ing. In addition, the wiring electrodes 14 drawn out from the respective channels 12 of the B-row channel row are laminated from the opening 12b of the channel 12 to the end portion 1b on the lower surface side of the rear surface of the head chip 1, and on the end portion 1b side. In parallel. In the head chip 1, when a predetermined driving voltage is applied to the driving electrode 13 in each channel 12 using each wiring electrode 14, the driving wall 11 between the channels 12 is shear-deformed in a dogleg shape according to the driving voltage. In addition, it is a shear mode type head chip that applies pressure for ejection to the ink in the channel 12.

  On the rear surface of the head chip 1, a laminated body 15 for making the outer periphery of the opening 12b of the channel 12 flat is formed. The laminated body 15 is formed so as to surround both the left and right sides of the opening 12b (the direction in which the channels 12 are arranged) and the side opposite to the lead-out side of the wiring electrode 14, and is a portion 15a located on both the left and right sides of the opening 12b. However, it extends from the opening 12 to the upper end 1a side of the rear surface of the head chip 1 in the A row and toward the lower end 1b side in the B row, and both sides of the end portion 14a of the wiring electrode 14 on the opening 12b side. It is provided in contact with.

  The thickness (height) of the multilayer body 15 is the same thickness (height) as the wiring electrode 14, thereby including the end portion 14 a on the opening 12 b side of the channel 12 of the wiring electrode 14. The outer periphery of the opening 12b of each channel 12 is a flat surface that is flush with the stacked body 15 and the end 14a of the wiring electrode 14.

  Here, the same metal material as that of the wiring electrode 14 is used as the material of the laminated body 15, and it is formed integrally with the wiring electrode 14. In this aspect, the stacked body 15 is formed individually for each channel 12 and is separated from the stacked body 15 of the adjacent channel 12.

  A flow path regulating member 16 mainly formed of a resin film is bonded to the surface of each laminated body 15 with an adhesive so as to cover the entire surface of the opening 12b. Each flow path regulating member 16 is provided with an ink flow path hole 16a that communicates with the channel 12 and serves as an ink inflow port, and restricts the opening area to be restricted by the ink flow path hole 16a.

  As the resin film constituting the flow path regulating member 16, an organic film that can be patterned by general dry etching is preferably used, and examples thereof include resin films such as polyimide, liquid crystal polymer, aramid, and polyethylene terephthalate. Among these, a polyimide film having good etching properties is preferable. In order to facilitate dry etching, it is desirable to use a film that is as thin as possible, but it is also preferable to use an aramid film that has high strength and can maintain strength even when thin.

  The thickness of the resin film is preferably 3 to 30 μm from the viewpoint of securing strength and ease of dry etching.

  The size of each flow path regulating member 16 is set to a size that covers the entire surface of the opening 12b and stays within the surface of the laminate 15 provided around the opening 12b. That is, the widths W1, W2, and W3 of the laminated body 15 serve as adhesive margins for bonding the flow path regulating member 16. The widths W1, W2, and W3 are suitably 5 to 30 μm. However, the widths W1, W2, and W3 are not limited to the same width in this range, and the flow path regulating member 16 is bonded to the surface. As long as they are separated from the adjacent laminate 15, they can be formed in different widths.

  Each wiring electrode 14 is drawn out so as to protrude from the laminated body 15 toward the upper end 1a side and the lower end 1b side of the head chip 1, and in the width direction of the head chip 1 (the left-right direction along the channel row in FIG. 1). The wiring electrode 14 is exposed without the passage regulating member 16 being present, and has electrical connection regions A1 and B1 for electrically connecting each wiring electrode 14 and the external wiring. That is, the upper end 1a side (in the case of row A) or the lower end 1b side (in the case of row B) of each laminate 15 is formed with a width W3 that can adhere the flow path regulating member 16 and is electrically connected. It is formed so as not to reach the regions A1 and B1.

  Next, an example of a method for manufacturing the head chip 1 will be described with reference to FIGS.

  First, a piezoelectric element substrate 101 made of polarized PZT or the like is bonded onto one substrate 100 using an epoxy adhesive, and a dry film 102 is attached to the surface of the piezoelectric element substrate 101. (FIG. 4A).

  Next, a plurality of parallel grooves 103 are ground from the dry film 102 side using a dicing blade or the like. Each groove 103 is ground at a constant depth from one end of the piezoelectric element substrate 101 to the other end and almost to the substrate 100, so that the size and shape are not substantially changed in the length direction. It is formed in a straight shape (FIG. 4B).

  Next, an electrode forming metal such as Ni, Au, Cu, or Al is applied by sputtering, vapor deposition, or the like from the side on which the groove 103 is ground, and the remaining upper surface of the dry film 102 and the inner surface of each groove 103 are applied. A metal film 104 is formed (FIG. 4C).

  Thereafter, the dry film 102 is removed together with the metal film 104 formed on the surface thereof, whereby the substrate 105 having the metal film 104 formed only on the inner surface of each groove 103 is obtained. Then, two similarly formed substrates 105 are prepared, aligned so that the grooves 103 of each substrate 105 coincide with each other, and bonded using an epoxy-based adhesive or the like to form the head substrate 106. (FIG. 4 (d)).

  Alternatively, the head substrate 106 can be formed as follows.

  First, two piezoelectric element substrates 101a and 101b made of polarized PZT or the like are laminated on one substrate 100 using an epoxy adhesive so that the polarization directions indicated by arrows are opposite to each other. Further, the dry film 102 is attached to the surface of the piezoelectric element substrate 101a (FIG. 5A).

  Next, a plurality of parallel grooves 103 are ground from the dry film 102 side using a dicing blade or the like. Each groove 103 is ground at a certain depth from one end of the stacked piezoelectric element substrates 101a and 101b to the other end and almost to the substrate 100. It is formed in a straight shape whose shape does not change substantially (FIG. 5B).

  Next, an electrode forming metal such as Ni, Au, Cu, or Al is applied by sputtering, vapor deposition, or the like from the side on which the groove 103 is ground, and the remaining upper surface of the dry film 102 and the inner surface of each groove 103 are applied. A metal film 104 is formed (FIG. 5C).

  Thereafter, the dry film 102 is removed together with the metal film 104 formed on the surface thereof, whereby the substrate 105 having the metal film 104 formed only on the inner surface of each groove 103 is obtained. The metal film 104 is formed on both wall surfaces formed by the piezoelectric element substrates 101 a and 101 b in each groove 103 and the inner surface of the substrate 100 facing the groove 103. Then, the thin plate 107 is bonded from the upper surface of the substrate 105 by using an epoxy-based adhesive or the like so as to close the upper surface of each groove 103 (FIG. 5D).

  Then, two head substrates 106 prepared by these methods are prepared, overlapped and bonded, and cut along a direction orthogonal to the length direction of the groove 103 to thereby provide a plurality of channel arrays having two channel arrays. One harmonica type head chip 1 is formed at a time. Each groove 103 becomes a channel 12, the metal film 104 in each groove 103 becomes a driving electrode 13, and a partition between adjacent grooves 103 becomes a driving wall 11. The width between the cut lines C, C... Determines the drive length (L length) of the channels 12 of the head chips 1, 1... Produced thereby, and is appropriately determined according to this drive length ( FIG. 6).

  When the head substrate 106 is produced by the method shown in FIG. 5, the drive electrode 13 is not formed on the inner surface of the thin plate 107 in the channel 12, and therefore when the two head substrates 106 are overlapped, the drive electrode is formed from the channel 12. The thin plates 107 are arranged so that the drive electrodes 13 formed on the inner surface of the substrate 100 are located on the outer side, considering that the wiring electrodes 14 electrically connected to the electrodes 13 can be easily drawn out. It is preferable to superimpose.

  Next, a dry film 200 as a mask member is attached to the rear surface of the obtained head chip 1, and an opening 201 is formed at a position corresponding to each channel 12 by exposure and development. This opening 201 is an opening for integrally forming the wiring electrode 14 and the laminate 15 and is opened in a rectangular shape by a predetermined width W1, W2, W3 (see FIG. 3) larger than the opening 12b of the channel 12. It has an opening part 201a and an opening part 201b which is continuous from one side of the opening part 201a and extends toward the upper end 1a and the lower end 1b of the head chip 1 with substantially the same width as the channel 12 (FIG. 7).

  Then, from the dry film 200 side, an electrode forming metal is applied by vacuum deposition, and a metal film is selectively formed in each opening 201. With this metal film, the wiring electrode 14 and the laminate 15 are integrally and closely formed on the rear surface of the head chip 1 with the same thickness. The thickness is preferably 1 to 10 μm.

  In order to ensure the connection between each wiring electrode 14 and the drive electrode 13 in each channel 12, it is desirable to perform the vapor deposition twice by changing the direction. Specifically, it is desirable to perform vapor deposition from a direction perpendicular to the drawing surface in directions of 30 degrees up and down and 30 degrees in the right and left directions.

  Further, the method for forming the metal film is not limited to vapor deposition, and a general thin film forming method can be employed. Moreover, the method of apply | coating an electrically conductive paste with an inkjet can also be used. In particular, the sputtering method is preferable because the direction of the flying metal particles is random, so that the metal film can be formed up to the inside of the channel 12 without changing the direction, and a reliable electrical connection can be achieved. After the metal film is formed, the dry film 200 is dissolved and peeled off with a solvent to remove the metal film formed on the dry film 200, and the wiring electrode 14 and the laminate 15 are integrated on the rear surface of the head chip 1. Only things remain (FIG. 8).

  In this aspect, since the wiring electrode 14 and the laminated body 15 can be integrally formed with the same metal material, there is an advantage that the forming operation of the laminated body 15 can be simplified. Moreover, since the laminated body 15 is formed so as to surround the opening 12b of the channel 12, electrical connection to the drive electrode 13 on the inner surface of the channel 12 can be achieved even in the laminated body 15 portion. Therefore, the electrical connection between the drive electrode 13 and the wiring electrode 14 is also performed through the stacked body 15, and the risk of disconnection can be reduced and the reliability can be further improved.

  Thus, the resin film 160 for forming the flow path regulating member 16 is bonded to the rear surface of the head chip 1 on which the wiring electrodes 14 and the laminate 15 are formed using an epoxy adhesive or the like. The resin film 160 can have substantially the same outer shape as the rear surface of the head chip 1, preferably larger than the rear surface, thereby facilitating the sticking operation. After an adhesive is uniformly applied to the adhesive surface side of the resin film 160, it is adhered to the rear surface of the head chip 1 (FIG. 9).

  Thereafter, the entire surface of the resin film 160 is pressurized with a predetermined pressure. The opening 12b on the rear surface side of the channel 12 has a flat outer periphery including the end 14a of the wiring electrode 14 by the laminated body 15, so that the outer periphery of the opening 12b is uniformly pressed. Thereby, the outflow control of an adhesive agent becomes easy, and the adhesiveness of this site | part can fully be ensured.

  The resin film 160 should just be provided so that the opening part 12b may be covered, and since the other site | part becomes an unnecessary site | part, it is removed in the following process. Therefore, it is not necessary to consider the adhesion state of this unnecessary portion, and it is not necessary to apply excessive pressure to the resin film 160 other than the laminate 15 at the time of adhesion. For this reason, the outflow of excess adhesive can be suppressed.

  Next, in order to form the flow path regulating member 16 by the resin film 160, unnecessary portions of the resin film 160 are removed by patterning, for example, by the method shown in FIG.

  First, the flow path regulating member 16 is formed in a region to be left as a flow path regulating member 16 later on the surface of the resin film 160 bonded to the rear surface of the head chip 1 so as to correspond to the position of each channel 12. The mask member 300 in which the opening 301 having a size is formed is covered (FIG. 10A).

  Thereafter, a coating layer 161 that functions as a mask for the next dry etching is selectively formed in the opening 301 from the surface of the mask member 300 (FIG. 10B). The material of the coating layer 161 is not particularly limited as long as it functions as a mask during dry etching, but a method of forming a metal material by sputtering is simple and preferable. Examples of the metal material include Al, Cu, Ni, W, Ti, and Au. Among them, Al is preferable because it is inexpensive and easy to pattern. The thickness of the covering layer 161 is preferably 0.1 to 50 μm from the viewpoint of dry etching resistance and ease of patterning.

  Next, dry etching is performed on the rear surface of the head chip 1 to remove the unnecessary resin film 160 other than the region where the coating layer 161 is formed. Specific dry etching means can be appropriately selected according to the resin used for the resin film 160. For example, when a polyimide film is used, dry etching can be performed using oxygen plasma. Since the coating layer 161 on the surface is not decomposed by oxygen plasma, the coating layer 161 serves as a mask, and the lower resin film 160 remains without being etched (FIG. 10C).

  Although wet etching can be used for etching, generally, wet etching liquid is acidic or alkaline, and there is a possibility of damaging the drive electrode 13 or the wiring electrode 14, and therefore dry etching is preferable. Moreover, even if the adhesive oozes out when the resin film 160 is adhered, unnecessary adhesive can be decomposed and removed simultaneously with dry etching.

  Further, since the resin film 160 other than the region masked by the covering layer 161 is completely removed by dry etching, the outer shape of the resin film 160 is larger than that of the rear surface of the head chip 1 at the stage of bonding to the rear surface of the head chip 1. There is an advantage that workability is remarkably excellent.

  The dry etching method is not limited to the above method, and can be appropriately selected. Moreover, the coating layer 161 can also be formed in advance on the resin film 160 before bonding. However, in this case, it is necessary to align the resin film 160 so that the covering layer 161 corresponds to each channel 12.

  Furthermore, as a patterning method of the resin film 160 shown in FIG. 9, the method shown in FIG. 11 can be adopted.

  First, the dry film 400 is stuck over the entire surface of the resin film 160 bonded to the rear surface of the head chip 1 (FIG. 11A).

  Thereafter, a coating layer 401 made of a dry film 400 that functions as a mask for etching in the next step is selectively left from the surface of the dry film 400 by exposure and development (FIG. 11B).

  Next, the rear surface of the head chip 1 is etched to remove the unnecessary resin film 160 other than the region where the coating layer 401 is formed (FIG. 11C).

  Thereafter, when the dry film 401 on the resin film 160 is removed, only the resin film 160 partially remains on the rear surface of the head chip 1 (FIG. 11D).

  The ink flow path hole 16a is formed by laser processing, for example, on the laminate (FIG. 10) or the resin film 160 (FIG. 11) of the resin film 160 and the covering layer 161 patterned by these. Alternatively, in FIGS. 10 and 11, openings that become the ink flow path holes 16 a are patterned in the covering layers 161 and 401 so that the ink flow path holes 16 a are formed simultaneously with the etching of the resin film 160. Good. Thereby, the flow path regulating member 16 is independently formed for each channel 12 as shown in FIG.

  The shape of the flow path regulating member 16 provided in the channel 12 serving as the ejection channel is not limited to the shape in which the ink flow path hole 16a is opened after being formed so as to cover the entire surface of the opening 12b, as shown in FIG. It is also preferable that the ink flow path hole need not be opened by forming the opening 12b so as to cover a part of the opening 12b.

The flow path regulating member 16 shown in FIG. 12 is slightly larger in the width direction along the channel row direction than the width of the channel 12, and is bonded to the surface of the laminate 15 at both ends thereof. The vertical direction perpendicular to the width direction is smaller than the height of the channel 12. Therefore, flow path regulating member 16 is squeezed the opening area by blocking the central portion of the opening 12b of the channel 12, the opening 12b is in a state in which only the upper end 12b ₁ and the lower end 12b ₂ is open Yes. The flow path regulating member 16 can also be formed by patterning as described above.

According to such a flow path regulating member 16, it is not necessary to form the ink flow path holes in a separate process by laser processing or the like, and can be formed at the time of patterning. Further, as shown in FIG. 13, the upper end 12b ₁ and the lower end 12b ₂ of the opening 12b of the channel 12 opens, is inclined jet head as the ink discharge direction is oblique to the direction of gravity For example, when the upper end 12b ₁ that is not blocked by the flow path regulating member 16 is positioned at the uppermost part of the channel 12, the bubbles a generated in the channel 12 gather at the uppermost part, and the upper end 12b of the opening 12b ₁ easily goes out to the ink common chamber (not shown) outside the head chip 1. Therefore, it is possible to obtain a head having excellent bubble removal properties and high injection reliability. Even if the bubble a exists in the ink common chamber, the ejection is no longer affected, so that a problem caused by the bubble a does not occur.

The opening area of the upper end 12b ₁ and the lower end 12b ₂ of the opening 12b is preferably from 1 to 10 times the aperture area of the discharge side of the nozzle, more preferably to 2 to 5 times.

Incidentally, the flow path regulating member 16 shown in FIG. 12, the upper end 12b ₁ and the lower end 12b ₂ of the opening 12b of the channel 12 are both open. According to this, since either the upper surface or the lower surface of the head chip 1 is positioned upward, the bubbles a can be extracted, which is preferable because there is no restriction when the ink jet head is installed obliquely. However, only one of the upper end 12b ₁ and the lower end 12b ₂ of the openings 12b may be formed flow path regulating member 16 so as to be opened.

The laminated body 15 can also be formed of an insulating material. As an insulating material, it is preferable that a pattern can be selectively formed by a vapor deposition method or a sputtering method using a mask member as in the case of a metal material. Examples thereof include AlN, SiN, SiO ₂ , TiO ₂ , and Al ₂ O _3. It is done.

  When the stacked body 15 is formed of an insulating material, the work is performed in a separate process after the wiring electrode 14 is formed. For example, only the periphery of the channel 12 except for the wiring electrode 14 on the rear surface of the head chip 1 is exposed by dry film exposure / development, and an insulating material is used until the wiring electrode 14 has the same thickness by vapor deposition or sputtering. Therefore, it is necessary to deposit the laminate 15.

  However, in this case, it is difficult to deposit the laminate 15 with an insulating material so as to have the same thickness as the wiring electrode 14 that has already been formed, and a flat surface is not formed over the outer periphery of the opening 12b. There may be a step between the electrode 14 and the laminate 15. In such a case, as shown in FIG. 14, the thickness (height) h1 of the laminated body 15 is made thicker (higher) than the thickness (height) h2 of the wiring electrode 14, and the laminated body 15 is wired. It is preferable that the outer periphery of the opening 12b is formed to be a flat surface by forming over the entire circumference of the opening 12b across the upper surface of the end 14a of the electrode 14. This is because only the periphery of the channel 12 except for the wiring electrode 14 on the rear surface of the head chip 1 is exposed by exposure / development of a dry film, and an insulating material is applied until the thickness becomes the same as that of the wiring electrode 14 by vapor deposition or sputtering. Once deposited, the dry film is removed, and this time, the entire outer periphery of the opening 12b of the channel 12 including the end 14a of the wiring electrode 14 is exposed by exposure / development of the dry film. Thus, the laminated body 15 may be formed by further depositing an insulating material on the outer periphery of the opening 12b of the channel 12.

  Also, regardless of the vapor deposition method or the sputtering method, a method in which an insulating material can be laminated at an arbitrary place without using a patterning technique such as an ink jet method is used until the thickness of the wiring electrode 14 is first reached. Then, an insulating material is applied and deposited on the outer periphery of the opening portion 12b of the channel 12 not including the end portion 14a of the wiring electrode 14, and then, the entire outer periphery of the opening portion 12b of the channel 12 including the end portion 14a of the wiring electrode 14 is applied. The laminated body 15 may be formed by applying and depositing an insulating material.

  The laminated body 15 made of an insulating material has no fear of causing an electrical short circuit with the adjacent laminated body 15. Therefore, the laminated body 15 made of an insulating material can be formed in a size extending over the plurality of openings 12b so as to be integrated with the periphery of the adjacent channel 12.

  FIGS. 15-17 has shown the various aspects of the laminated body 15 which consists of such an insulating material.

  FIG. 15 is a mode in which one laminated body 15 is formed on the rear surface of the head chip 1. The laminated body 15 is formed in a size including the openings 12b of all the channels 12 except for the electrical connection regions A1 and B1. As shown in FIG. 1, the surface of the laminated body 15 is not limited to the case where the flow path regulating member 16 is provided individually for each channel 12 as shown in FIG. It is also possible to form the flow path regulating member 16.

  FIG. 16 shows an aspect in which the laminated body 15 is formed separately for each channel row of the A row and the B row on the rear surface of the head chip 1. Each stacked body 15 is formed in a size including the openings 12b of all the channels 12 in each channel row except for the electrical connection regions A1 and B1. The surface of the laminate 15 is not limited to the individual flow path regulating member 16 provided independently for each channel 12, and as illustrated, the flow path has a size that spans a plurality of channels 12 for each channel row. It is also possible to form the regulating member 16.

  FIG. 17 is a mode in which the laminated bodies 15 are arranged in parallel on the rear surface of the head chip 1 so as to straddle two adjacent channels 12 across the A row and the B row. Each laminated body 15 is formed so as to surround the outer periphery of the opening 12b of the two channels 12 adjacent to each other across the A and B rows, leaving the electrical connection regions A1 and B1. The surface of the laminate 15 is not limited to the individual flow path regulating member 16 provided independently for each channel 12, but as shown in the figure, the flow path regulating member 16 having a size straddling the two channels 12 is provided. It is also possible to form.

In each embodiment of FIGS. 15 to 17, the flow path regulating member 16, as shown in FIG. 12 may be provided so that the opening _12b 1, 12b ₂ are formed. In this case, the flow path regulating member 16 in FIG. 15 and FIG. 16 is not limited to being provided independently for each channel 12, but the flow path regulating member 16 is provided along the channel row, and a plurality of channels 12 are provided. It may be formed across the opening 12b.

  Each aspect described above is a case where the channels 12 are all ejection channels that eject ink, but in the case of a head chip in which ejection channels that eject ink and air channels that do not eject ink are alternately arranged. Since it is not necessary to supply ink into the air channel, as shown in FIG. 18, the opening 12b of the channel 12 corresponding to the air channel is completely blocked by the flow path regulating member 17 having no ink flow path. It is preferable to do. The flow path regulating member 17 can also be formed in the same manner as the flow path regulating member 16. Since the flow path regulating member 17 is adhered and adhered to the surface of the laminated body 15, the air channel can be completely closed, and there is no fear of ink inflow.

  When the discharge channels and the air channels are alternately arranged in this manner and the air channel is closed by the flow path regulating member 17, the flow path regulating member 16 of the discharge channel has an opening portion as shown in FIG. The aspect which adhere | attaches over two sides which oppose on both sides of 12b may be sufficient. Further, the flow path regulating member 16 is not necessarily provided in the discharge channel.

  Furthermore, even when the discharge channels and the air channels are alternately arranged, the stacked body 15 can also take the modes shown in FIGS.

  In order to configure an ink jet head using the head chip 1 described above, as shown in FIG. 19, a nozzle plate 2 having nozzles 21 formed on the front surface of the head chip 1 is bonded with an epoxy adhesive, The wiring board 3 is bonded to the rear surface.

  The wiring substrate 3 is formed of a plate-like substrate made of a ceramic material such as non-polarized PZT, AlN-BN, or AlN. In addition, low thermal expansion plastic or glass can be used. Furthermore, it is preferable to depolarize and use the same substrate material as the piezoelectric element substrate used in the head chip 1. Further, in order to suppress the occurrence of distortion or the like of the head chip 1 due to the difference in thermal expansion coefficient, it is further preferable to select the material so that the difference in thermal expansion coefficient with the head chip 1 is within ± 1 ppm. The material constituting the wiring substrate 3 is not limited to a single plate, and a plurality of thin plate-like substrate materials may be stacked to form a desired thickness.

  The wiring substrate 3 extends in a direction orthogonal to the channel row direction of the head chip 1 (up and down direction in FIG. 19), and has projecting portions 31 and 31 that project from the upper surface and the lower surface of the head chip 1 respectively. In addition, one concave portion 32 extending in the width direction (channel row direction) is formed on one surface of the wiring substrate 3 bonded to the rear surface of the head chip 1. The recess 32 is grooved to a size that can cover the openings 12b on the rear surface side of all the channels 12 along both the channel rows of the A row and the B row of the head chip 1. An ink common chamber for supplying ink in common is configured. That is, the height of the concave portion 32 in the vertical direction in the figure is larger than the height across the rows A and B on the rear surface of the head chip 1 and smaller than the thickness of the head chip 1 in the direction perpendicular to the channel row direction. Thus, when the wiring board 3 is bonded to the rear surface of the head chip 1, all the channels 12 in the A row and the B row are accommodated in the recess 32.

  In addition, all the wiring electrodes 14 and each flow path regulating member 16 formed on the rear surface of the head chip 1 are also housed in the recess 32. That is, the wiring board 3 is bonded to the electrical connection regions A1 and B1 where the wiring electrodes 14 at both the upper and lower ends on the rear surface of the head chip 1 are exposed. According to the present invention, since the wiring electrode 14 and the flow path regulating member 16 can be formed with high positional accuracy by using the patterning technique, the electrical connection regions A1 and B1 can be easily secured.

  Wirings 33 are formed on each projecting portion 31 of the wiring board 3 at the same number and pitch as the wiring electrodes 14 arranged in parallel on the rear surface of the head chip 1. The wiring substrate 3 is bonded to the rear surface of the head chip 1 with an anisotropic conductive paste or the like so that one end of each wiring 33 and the wiring electrode 14 are electrically connected. The drive circuit and the drive electrode 13 of each channel 12 can be formed by electrically connecting the FPC 4 or the like to the other end of the wiring 33 in the overhang portion 31.

  The supply of ink to the recess 32 serving as the ink common chamber can be performed from either or both ends of the recess 32 when the wiring substrate 3 is bonded to the rear surface of the head chip 1. In addition, as shown in FIG. 19, an opening 34 is formed at the bottom of the recess 32, and the ink manifold 5 that can store a larger volume of ink than the recess 32 can be further joined. Here, the head chip 1 of the aspect shown in FIG. 1 is illustrated, but the head chip 1 of another aspect can be similarly configured.

  By the way, in the head chip 1, the drive electrode 13 in the ejection channel for ejecting ink is in direct contact with the ink. Therefore, when water-based ink is used, a protective film is required on the surface of the drive electrode 13. In addition, since the wiring electrode 14, the laminate 15, and the flow path regulating members 16 and 17 are also in direct contact with the ink, when solvent-based ink is used, a protective film is required to protect them from the solvent. Become. Therefore, after forming the wiring electrode 14, the laminated body 15, and the flow path regulating members 16, 17 on the rear surface of the head chip 1, the entire surface of the head chip 1, that is, the surface of each driving electrode 13 and the wiring electrode 14, the laminated body 15. It is preferable to form a protective film on the surfaces of the flow path regulating members 16 and 17.

  As the protective film, it is preferable to coat using a film made of paraxylylene and its derivatives (hereinafter referred to as a parylene film). The parylene film is a resin film made of polyparaxylylene resin and / or a derivative resin thereof, and is formed by a vapor phase synthesis method (Chemical Vaper Deposition: CVD method) using a solid diparaxylylene dimer or a derivative thereof as an evaporation source. Form. That is, paraxylylene radicals generated by vaporization and thermal decomposition of diparaxylylene dimer are adsorbed on the surface of the head chip 1 and undergo a polymerization reaction to form a film.

  There are various types of parylene films. Depending on the required performance, etc., various types of parylene films and multi-layered parylene films in which a plurality of these types of parylene films are laminated are applied as desired parylene films. You can also.

  The thickness of such a parylene film is preferably 1 μm to 10 μm.

  Since the parylene film penetrates into a minute region and can form a coating, the driving electrode 13, the wiring electrode 14 and the laminate are formed by coating the head chip 1 before the nozzle plate 2 is joined. Of course, both the inner surface facing the channel 12 and the outer surface exposed on the rear surface of the head chip 1 are also covered with the parylene film to protect the ink from the ink.

  By forming the parylene film, the surfaces of the wiring electrode 14 and the laminate 15 and the flow path regulating members 16 and 17 are protected from both surfaces, and the durability can be greatly improved.

  Also, even if a pinhole occurs in the parylene film that covers the flow path regulating members 16 and 17 and the solvent-based ink penetrates, the parylene film itself does not dissolve, and the flow path regulating members 16 and 17 Since it continues to exist on both sides, the function of covering the channel 12 is not easily lost, and reliability can be maintained over a long period of time.

  In addition, when the flow path regulating members 16 and 17 are provided independently for each channel 12, the influence when a pinhole or the like is generated in the parylene film is limited to the channel 12, and the other channels 12 are not affected. Since it does not reach, there is an advantage that damage can be minimized.

  When the parylene film is formed in this way, the nozzle plate 2 is bonded thereafter.

  Further, as shown in FIG. 19, when the wiring substrate 3 is bonded to the rear surface of the head chip 1, before the nozzle plate 2 is bonded to the head chip 1 and after the wiring substrate 3 is bonded to the head chip 1, The parylene film described above is formed. Thereby, while being able to ensure electrical connection of each electrode, the adhesive layer of the wiring board 3 and the head chip 1 can be protected.

  In the present invention, the head chip 1 is not limited to one having two channel rows.

The figure which looked at the part of the head chip of the ink jet head concerning the present invention from the back side. Sectional view along line (ii)-(ii) in FIG. Perspective view of the opening of one channel on the rear surface of the head chip (A)-(d) is a figure explaining the manufacture example of the head substrate for manufacturing a head chip. (A)-(d) is a figure explaining other manufacture examples of a head substrate in order to manufacture a head chip. The figure explaining the manufacture example of a head chip The figure explaining the manufacture example of a head chip The figure explaining the manufacture example of a head chip The figure explaining the manufacture example of a head chip (A)-(c) is a figure explaining the manufacture example of the flow-path control member in a head chip. (A)-(c) is a figure explaining the other manufacture example of the flow-path control member in a head chip. The perspective view which shows the other aspect of a flow-path control member and a laminated body. The fragmentary sectional view which shows the state which installed the head chip which has the flow-path control member shown in FIG. 12 diagonally The perspective view which shows the other aspect of a laminated body The figure which looked at the portion of the head chip which has the layered product of other modes from the back side. The figure which looked at the portion of the head chip which has the layered product of other modes from the back side. The figure which looked at the portion of the head chip which has the layered product of other modes from the back side. View of head chip portion with discharge channel and air channel viewed from the rear side Sectional drawing which shows an example of the inkjet head which joined the wiring board to the back surface of the head chip

Explanation of symbols

1: Head chip 1a: Upper end 1b: Lower end 11: Drive wall 12: Channel 12a: Front side opening 12b: Rear side opening 12b ₁ : Upper end opening 12b ₂ : Lower end opening 13: Drive electrode 14 : Wiring electrode 14a: End portion on the opening side of the channel 15: Laminate 15a: Parts located on both right and left sides of the opening 16: Flow path regulating member 16a: Ink flow path hole 160: Resin film 161: Cover layer 2 : Nozzle plate 21: Nozzle 3: Wiring substrate 31: Overhang 32: Recess 33: Wiring 34: Opening 4: FPC
5: Ink manifold

Claims (17)

Drive walls made of channels and piezoelectric elements are alternately arranged side by side, opening portions of the channels are arranged on the front surface and the rear surface, respectively, and drive electrodes are formed on the wall surfaces of the drive walls facing the channels. A head chip that shears and deforms the driving wall by applying a driving voltage to the electrode to generate a pressure for discharging the ink in the channel, and is electrically connected to the driving electrode on the rear surface of the head chip. In the inkjet head, the wiring electrode connected to is laminated from the opening of the channel to the upper end and / or the lower end of the rear surface, and the upper end side and / or the lower end side is an electrical connection region with external wiring.
On the rear surface of the head chip, a laminate including an end portion of the wiring electrode on the side of the opening of the channel and a flat outer surface of the opening of the channel excluding the electrical connection region is formed,
An ink jet head comprising: a flow path regulating member that regulates the inflow of ink into the channel so as to cover the opening of the channel within the range of the surface of the laminate.   The inkjet head according to claim 1, wherein the multilayer body is integrally formed with the wiring electrode using the same metal material as the wiring electrode.   The inkjet head according to claim 1, wherein the laminate is formed of an insulating material with a thickness equal to or greater than the thickness of the wiring electrode.   The inkjet head according to claim 3, wherein the laminate is formed independently for each opening of the channel.   The inkjet head according to claim 3, wherein the stacked body is formed to have a size over a plurality of openings of the channel.   6. The channel according to claim 1, wherein the channel is an ejection channel that ejects all ink, and the flow path regulating member is formed so as to restrict an opening area of the opening of the channel. The inkjet head described in 1.   The channel is configured such that an ejection channel that ejects ink and an air channel that does not eject ink are alternately arranged, and the flow path regulating member is formed to close an opening of the air channel. The inkjet head according to any one of claims 1 to 5, wherein   8. The ink jet head according to claim 7, wherein the flow path regulating member is formed so as to reduce an opening area of the opening of the discharge channel. Drive walls made of channels and piezoelectric elements are alternately arranged side by side, opening portions of the channels are arranged on the front surface and the rear surface, respectively, and drive electrodes are formed on the wall surfaces of the drive walls facing the channels. A head chip that shears and deforms the driving wall by applying a driving voltage to the electrode to generate a pressure for discharging the ink in the channel, and is electrically connected to the driving electrode on the rear surface of the head chip. A wiring electrode to be connected to the substrate is laminated from the opening of the channel to the upper end and / or lower end of the rear surface, and the upper end side and / or the lower end side is an electrical connection region with an external wiring. In the method
After patterning a laminated body that includes an end portion of the wiring electrode on the opening side of the channel on the rear surface of the head chip and makes the outer periphery of the opening of the channel excluding the electrical connection region flat.
Pressure-bonding a resin film to the rear surface of the head chip using an adhesive,
Thereafter, by patterning the resin film to remove unnecessary portions, the resin film is left in the range of the surface of the laminate, and the inflow of ink into the channel is regulated by the remaining resin film. A method of manufacturing an ink-jet head, comprising forming a flow path regulating member.   Patterning of the resin film is performed by patterning a coating layer in an area to be left as the flow path regulating member on the surface of the resin film before or after bonding the resin film to the rear surface of the head chip. The inkjet head according to claim 9, wherein the resin film adhered to the rear surface of the head chip is dry-etched to remove a region other than the region covered with the coating layer. Production method.   11. The method of manufacturing an ink jet head according to claim 9, wherein the laminated body is integrally formed when the wiring electrode is formed using the same metal material as the wiring electrode.   11. The method of manufacturing an ink jet head according to claim 9, wherein, after forming the wiring electrode, the laminate is formed with a thickness equal to or greater than the thickness of the wiring electrode using an insulating material.   The method of manufacturing an inkjet head according to claim 12, wherein the laminate is formed independently for each opening of the channel.   The method of manufacturing an ink jet head according to claim 12, wherein the stacked body is formed to have a size over a plurality of openings of the channel.   15. The channel according to claim 9, wherein the channel is an ejection channel that ejects all ink, and the flow path regulating member is formed so as to reduce an opening area of an opening of the channel. Manufacturing method of the inkjet head.   The channel is formed by alternately disposing an ejection channel that ejects ink and an air channel that does not eject ink, and the flow path regulating member is formed so as to close an opening of the air channel. 16. The method for manufacturing an ink jet head according to claim 9,   The method of manufacturing an ink jet head according to claim 16, wherein the flow path regulating member is formed so as to reduce an opening area of the opening of the discharge channel.

Images