JP2009142784A - Flow passage structure and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flow passage structure in the necessary place of which a catalyst can be deposited by an easy method and to provide a method for manufacturing the flow passage structure. <P>SOLUTION: In the flow passage structure 1, a flow passage 100 is formed by layering a flow passage substrate 2 having a flow passage groove 22 on the upper side of a base substrate 3. First and second metal patterns 4A and 4B, which are extended from the wall surface of the flow passage 100 to the outside of the flow passage 100 and to which voltages having first and second electrical potentials are applied, are formed on the base substrate 3. Catalyst-supporting parts 41A or 41B for supporting catalysts are formed on the surfaces of the first or second metal patterns. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a channel structure and a method for manufacturing the channel structure.

  Conventionally, a catalytic reactor having a minute reaction space that can be formed by a simple technique is known (for example, see Patent Document 1).

  This catalytic reactor is composed of a flow path plate having a flow path forming surface and a catalyst plate having a recess wide enough to cover the flow path plate, and the thin film catalyst is compressed and fixed in the recess of the catalyst plate. It has been

JP 2007-160227 A

  An object of the present invention is to provide a flow channel structure capable of supporting a catalyst at a required position in a flow channel by a simple method as compared with the case where the present configuration is not provided, and a method for manufacturing the flow channel structure Is to provide.

  In order to achieve the above object, one embodiment of the present invention provides the following channel structure and a method for manufacturing the channel structure.

[1] A member having a flow path, a first metal pattern that is drawn from the wall surface of the flow path to the outside of the flow path and to which a voltage of a first potential is applied, and the flow from the wall surface of the flow path A second metal pattern drawn out of the path and applied with a voltage of a second potential; and a porous catalyst support formed on at least one surface of the first and second metal patterns; A flow path structure comprising:

[2] The flow channel structure according to [1], further including a catalyst supported on the catalyst support.

[3] The member includes a first plate member in which a channel groove is formed on a first joint surface, and the first and second metal patterns formed on a second joint surface. The flow path structure according to [1], including a second plate member in which the second bonding surface is bonded to one bonding surface.

[4] The flow path structure according to [3], wherein the first and second metal patterns are alternately arranged in a direction intersecting with the flow path groove.

[5] The flow path structure according to [2], wherein the catalyst is supported on the catalyst support in a state where the catalyst can be removed by a reaction solution having a reaction substrate for the catalyst support.

[6] A member having a flow path and having first and second metal patterns formed from the wall surface of the flow path to the outside of the flow path is prepared, and an electrolyte is passed through the flow path. In addition, by applying a positive voltage to the first metal pattern with respect to the second metal pattern, the surface of the first metal pattern disposed on the wall surface of the flow path is made porous by anodic oxidation. Formed on the first metal pattern by forming a high-quality catalyst support, flowing a plating solution through the flow path, and applying a negative voltage to the first metal pattern with respect to the second metal pattern A method for manufacturing a flow channel structure in which a catalyst is supported on the catalyst support portion.

[7] Furthermore, by flowing an electrolyte through the flow path and applying a positive voltage to the second metal pattern with respect to the first metal pattern, A porous catalyst support is formed on the surface of the wall surface by anodizing, and a plating solution is allowed to flow through the flow path and a negative voltage is applied to the second metal pattern with respect to the first metal pattern. Thus, the flow path structure manufacturing method according to [6], in which the catalyst is supported on the catalyst supporting portion formed on the second metal pattern.

  According to the flow path structure according to the first aspect, the catalyst can be supported by a simple method at an important position in the flow path as compared with the case where the present configuration is not provided.

  According to the flow path structure according to the second aspect, a catalytic reaction can be caused to the fluid flowing through the flow path.

  According to the flow path structure according to the third aspect, the process of forming the flow path and the metal pattern can be simplified.

  According to the flow path structure according to the fourth aspect, the first and second metal patterns can be efficiently arranged as compared with the case where the present structure is not provided.

  According to the flow path structure according to the fifth aspect, the catalyst carried on the catalyst carrying part can be removed.

  According to the method for manufacturing a flow channel structure according to the sixth aspect of the present invention, the catalyst can be supported at a required position in the flow channel by a simple method as compared with the case where the present structure is not provided.

  According to the flow path structure manufacturing method of the seventh aspect, the area of the catalyst supporting portion can be increased as compared with the case where the present structure is not provided.

[First Embodiment]
FIG. 1 (a) is a perspective view showing a flow channel structure according to the first embodiment of the present invention, and FIG. 1 (b) is an exploded perspective view thereof. 2A is a bottom view of the flow path substrate, and FIG. 2B is a plan view of the base substrate.

  The flow path structure 1 is configured by stacking a flow path substrate 2 on the upper side of a base substrate 3.

(Channel substrate)
The flow path substrate 2 includes surfaces 2a to 2f, and includes an introduction port 20 for introducing a fluid and a discharge port 21 for discharging the fluid. The introduction port 20 and the discharge port 21 are through holes from the surface 2a to the surface 2f.

  The flow path substrate 2 includes a flow path groove 22 that connects the introduction port 20 and the discharge port 21 to the surface 2f. The width of the groove 22 is, for example, 50 μm to 2000 μm, and the depth is, for example, 10 μm to 100 μm.

  In addition, the path | route which connects the inlet port 20 to the discharge port 21 by the groove | channel 22 is not restricted to S shape illustrated to Fig.2 (a), I shape may be sufficient and another shape may be sufficient. Further, a plurality of inlets for introducing different types of fluids may be provided, and the groove 22 may be formed so as to connect the plurality of inlets.

  The flow path substrate 2 is formed of, for example, glass, quartz, silicon, a thermosetting resin, a thermoplastic resin, or the like as an insulating substrate. Examples of the thermosetting resin include silicone resins such as polydimethylsiloxane (hereinafter referred to as PDMS resin), and examples of the thermoplastic resin include acrylic resins.

(Base substrate)
The base substrate 3 includes surfaces 3a to 3f, and the first and second metal patterns 4A and 4B are formed on the surface 3a.

  3A is a cross-sectional view taken along the line AA in FIG. 1A, FIG. 3B is a cross-sectional view taken along the line BB in FIG. 3A, and FIG. FIG. 4 is an enlarged view of a catalyst carrier 41A in FIG. That is, the surface 3 a as the second bonding surface of the base substrate 3 is bonded to the surface 2 f as the first bonding surface of the flow path substrate 2, and the base substrate 3 functions as a lid that closes the opening of the groove 22. Thus, the flow path 100 is formed. The flow path substrate 2 corresponds to the first member and the base substrate 3 corresponds to the second member, and the flow path substrate 2 and the base substrate 3 constitute a member having the flow path 100.

  The base substrate 3 is an insulating substrate and is made of, for example, glass, quartz, silicon, or the like. The first and second metal patterns 4A and 4B are made of a metal such as aluminum, titanium, or tantalum. In this embodiment mode, aluminum is used.

  As illustrated in FIG. 2B, the first and second metal patterns 4 </ b> A and 4 </ b> B are drawn out in an insulated state from the inside of the flow channel 100 to the outside of the flow channel 100. The first and second metal patterns 4 </ b> A and 4 </ b> B have, for example, a comb shape and are alternately arranged in a direction intersecting the groove 22.

  Further, the first metal pattern 4A has a first voltage application unit 40A to which the voltage of the first potential is applied. Similarly, the second metal pattern 4B is applied with the voltage of the second potential. The second voltage application unit 40B is provided.

  The catalyst support portions 41A and 41B are respectively formed in portions corresponding to the grooves 22 provided in the flow path substrate 2 in the first and second metal patterns 4A and 4B. Since the purpose is to support the catalyst, a larger surface area is advantageous in that the amount of catalyst supported increases. Therefore, the catalyst support portions 41A and 41B are porous. The catalyst carrier may be formed on one of the first and second metal patterns 4A and 4B.

  Further, the catalyst support portions 41A and 41B are formed with an anodic oxide film by an anodic oxidation method, and are composed of porous alumina 410 and non-porous alumina 411 as illustrated in FIG. A plurality of pores 42 are formed in the thickness direction of the base substrate 3 on the surface of the porous alumina 411.

  The pores 42 have a diameter of 10 to 100 nm, for example, and the catalyst 101 is supported therein.

  The catalyst 101 is supported in a removable state by a reaction solution having a reaction substrate for the catalyst support portions 41A and 41B. The catalyst 101 can use, for example, platinum, palladium, or the like as a metal having a catalytic action. Note that platinum is used as the catalyst 101 in this embodiment.

(Production method)
Next, an example of the manufacturing method of the flow path structure according to the present embodiment will be described.

(1) Manufacture of flow path substrate When the flow path substrate 2 is manufactured from a glass substrate, the shape of the groove 22 is formed on the surface 2f of the flow path substrate 2 by, for example, lithography using a semiconductor manufacturing method. The groove 22 is formed by patterning and edging. In addition, the glass substrate is subjected to laser processing or the like to form the inlet 20 and the outlet 21.

  As the patterning, an electron beam direct writing method or the like can be used in addition to the lithography method. Note that the lithography method is preferable in that high planar shape accuracy is obtained and mass productivity is high. Etching can be performed by wet etching in which a workpiece is melted using a chemical, dry etching that uses ions to vaporize and remove the workpiece, or the like.

  When the flow path substrate 2 is manufactured with PDMS resin, for example, a photoresist (for example, SU-8) is applied on a silicon wafer, and a convex mold in which the groove 22 is inverted by a lithography method is manufactured. Then, the flow path substrate 2 can be manufactured by pouring PDMS resin into the mold and heating to mold. Similarly, when the flow path substrate 2 is manufactured from an acrylic resin, the flow path substrate 2 can be manufactured using a metal convex mold.

(2) Production of base substrate An aluminum thin film is deposited on the surface 3a of the base substrate 3 by, for example, sputtering. In addition to the sputtering method, a vacuum evaporation method such as an electron beam heating evaporation method, a resistance heating evaporation method, a sputtering method, a chemical evaporation method, or the like can be used.

  Then, the first and second metal patterns 4A and 4B are formed by patterning the aluminum thin film deposited on the base substrate 3 by using, for example, a lithography method.

(3) Channel formation (bonding)
As shown in FIG. 2B, the flow path substrate 2 and the base substrate 3 manufactured as described above have a predetermined arrangement in which the first and second metal patterns 4A and 4B are arranged inside the flow path 100. Paste in position. At this time, when the flow path substrate 2 is made of a glass substrate or an acrylic resin, the flow path substrate 2 is fused by being heated to about the glass transition temperature while being pressurized. For example, in the case of a glass substrate, it is heated to about 450 ° C., and in the case of an acrylic resin, it is heated to about 100 ° C.

  Further, when PDMS resin is used as the material of the flow path substrate 2, the flow path substrate 2 and the base substrate 3 need only be opposed to each other due to the self-adhesive property of the PDMS resin.

  As another bonding method, room temperature bonding may be used, or anodic bonding that is performed by applying heat and voltage may be used, but the method is not limited thereto. Here, normal temperature bonding means that the bonded surfaces cleaned by accelerating an inert gas such as argon at a high voltage and irradiating the bonded surfaces are directly brought into contact with each other in a normal temperature (for example, 15 to 25 ° C.) atmosphere. This refers to a bonding method in which atoms are directly bonded to each other.

(4) Formation of catalyst carrier part Fig.4 (a) is a figure explaining the method of forming a catalyst carrier part in a metal pattern. For example, a sulfuric acid solution is introduced as an electrolyte from the inlet 20 of the formed channel substrate 2 into the channel structure in which the channel substrate 2 and the base substrate 3 are joined. The oxidation voltage V _O (for example, 12V) is applied between the first and second metal patterns 4A and 4B so that a positive voltage is applied to the first voltage application unit 40A with respect to the second voltage application unit 40B. ) Is applied. In addition to the sulfuric acid solution, oxalic acid, phosphoric acid, or the like may be used as the electrolytic solution.

  As a result, the portion of the first metal pattern 4A to which a positive voltage is applied is disposed on the wall surface of the flow channel 100, and as illustrated in FIG. 4B, porous alumina 410 and non-porous alumina. A catalyst carrier 41A made of 411 and having a plurality of pores 42 is formed.

Further, the second voltage application portion 40B relative to the first voltage applying unit 40A by changing the polarity of the oxidation voltage V _O such that a positive voltage is applied, the catalyst carrying part 41B for the second metal pattern 4B Form. A voltage (for example, 12V) is applied to the first or second metal pattern 4A, 4B of the base substrate 3, and a ground electrode (0V) is applied to the electrolyte solution on the inlet 20 side or the outlet 21 side of the flow channel 100. May be provided.

(5) Loading of catalyst FIG. 5A is a diagram illustrating a method of loading the catalyst 101 in the pores 42. For example, a chloroplatinic acid solution is introduced as a plating solution from the introduction port 20 into the above-described flow channel structure in which the plurality of pores 42 are formed in the catalyst support portions 41A and 41B. Then, a plating voltage V _E (for example, 5V) is applied between the first and second metal patterns 4A and 4B so that a negative voltage is applied to the first voltage application unit 40A with respect to the second voltage application unit 40B. ) Is applied.

  As a result, platinum as the catalyst 101 is electrolytically deposited on the catalyst carrier 41A formed on the first metal pattern 4A, and as illustrated in FIG. 5B, the pores 42 of the catalyst carrier 41A. The catalyst 101 is supported on the catalyst.

In addition, as a negative voltage to the second voltage applying unit 40B relative to the first voltage applying unit 40A is applied, by changing the polarity of the plating voltage V _E, formed on the second metal pattern 4B catalyst The catalyst 101 is also supported on the support 41B.

  As described above, the flow path structure 1 in which the catalyst 101 is supported on the catalyst support portions 41A and 41B can be manufactured.

(Operation of the first embodiment)
Next, the operation of the flow path structure 1 according to the present embodiment will be described. When the raw material liquid is introduced from the inlet 20 of the flow path substrate 2, it flows through the flow path 100 and passes through the catalyst support portions 41 </ b> A and 41 </ b> B. At this time, the catalyst 101 supported on the catalyst supporting portions 41A and 41B promotes the catalytic reaction with respect to the raw material liquid. Then, the reaction liquid obtained by the catalytic reaction is discharged from the discharge port 21.

(Regeneration of catalytic action)
In the flow channel structure 1, when the catalytic reaction is repeatedly performed as described above and the catalytic action of the catalyst 101 is lost (deactivation), as illustrated in FIG. For example, a sodium hydroxide solution is introduced from 20 as a reaction solution.

  As a result, the surfaces of the catalyst support portions 41A and 41B are etched, and the deactivated catalyst 101 is removed as illustrated in FIG. 6B. Then, similarly to the method described in the manufacturing method (5), the catalyst action of the flow path structure 1 is regenerated by supporting a new catalyst 101 on the catalyst support portions 41A and 41B.

[Second Embodiment]
FIG. 7A is a plan view of a base substrate according to the second embodiment of the present invention, and FIG. 7B is a cross-sectional view corresponding to the line BB in FIG. .

  As in the first embodiment, the base substrate 3 is formed by forming the first and second metal patterns 4A and 4B on the surface 3a, but the first and second metal patterns 4A and 4B. Are different in shape. The flow path substrate 2 is configured in the same manner as in the first embodiment.

  That is, the first and second metal patterns 4A and 4B are formed such that the catalyst support portions 41A and 41B are arranged on the left and right in the cross section of the flow path 100, respectively. And the catalyst 101 is carry | supported by the pore 42 formed in the catalyst carrying | support parts 41A and 41B similarly to FIG.3 (c).

  The manufacturing method and operation of the flow channel structure according to the present embodiment are the same as those in the first embodiment except that the shapes when forming the first and second metal patterns 4A and 4B are different by patterning. Since it is the same as that of a form, those description is abbreviate | omitted.

[Third Embodiment]
FIG. 8 is a perspective view of a flow channel structure according to the third embodiment of the present invention. FIG. 9A is a bottom view of the flow path substrate, and FIG. 9B is a plan view of the base substrate.

  The flow path structure 1 is common in that the flow path substrate 2 is laminated on the upper side of the base substrate 3 as compared with the first embodiment. The difference is that the metal pattern 4 </ b> A is formed and the second metal pattern 4 </ b> B is formed on the flow path substrate 2.

  The flow path substrate 2 is provided with the second metal pattern 4B formed on the surface 2f and the surface 2a in addition to the introduction port 20, the discharge port 21 and the groove 22 similar to those of the first embodiment. And a second voltage application unit 40B connected to the second metal pattern 4B through the through hole 23.

  The second metal pattern 4B is formed by forming a groove 22 on the flow path substrate 2 by the same manufacturing method as in the first embodiment, and then applying a photoresist to the surface 2f, so that the shape of the second metal pattern 4B is changed. Pattern and edge. And it can form by forming the thin film used as material and removing a photoresist.

  As illustrated in FIG. 9A, the catalyst support 41 </ b> B is formed in a portion of the second metal pattern 4 </ b> B that intersects the groove 22.

  As in the first embodiment, the base substrate 3 has the first metal pattern 4A formed on the surface 3a, and the catalyst support 41A corresponds to the groove 22 as illustrated in FIG. 9B. It is formed in the part.

  10A is a cross-sectional view taken along the line CC in FIG. 8A, and FIG. 10B is a cross-sectional view taken along the line DD in FIG. 10A. The catalyst support portions 41A and 41B are arranged in a staggered manner on the opposing wall surfaces of the flow channel 100 in an insulated state, for example.

  As illustrated in FIG. 10B, the catalyst carrier 41 </ b> B is formed on the bottom surface and the side surface of the groove 22. Further, the catalyst 101 is supported in the pores 42 formed in the catalyst supporting portions 41A and 41B, as in FIG.

  The manufacturing method and operation of the flow channel structure according to the present embodiment are the same as those of the first embodiment except that the method of forming the second metal pattern 4B on the flow channel substrate 2 is different. Therefore, the description thereof is omitted.

[Other embodiments]
In addition, this invention is not limited to said each embodiment, A various deformation | transformation implementation is possible within the range which does not change the summary of this invention. For example, in each of the embodiments described above, the cross-sectional shape of the flow channel 100 formed by the flow channel structure 1 is a quadrangle, but may be a circle or another polygon, but is not limited thereto.

  Further, in each of the above embodiments, the flow path substrate 2 having the groove 22 is stacked on the upper side of the base substrate 3, but on the contrary, the base substrate 3 may be stacked on the upper side of the flow path substrate 2.

Fig.1 (a) is a perspective view which shows an example of the flow-path structure based on the 1st Embodiment of this invention, FIG.1 (b) is a disassembled perspective view. 2A is a bottom view of the flow path substrate, and FIG. 2B is a plan view of the base substrate. 3 (a) is a cross-sectional view taken along line AA in FIG. 1 (a), FIG. 3 (b) is a cross-sectional view taken along line BB in FIG. 3 (a), and FIG. It is an enlarged view of the catalyst support part in b). FIG. 4A is a view for explaining a method of forming a catalyst carrier on a metal pattern. FIG. 4B is an enlarged view of the catalyst carrying portion. FIG. 5A is a diagram for explaining a method of loading a catalyst in the pores. FIG. 5B is an enlarged view of the catalyst carrying portion. FIG. 6A is a diagram illustrating an example of an operation for removing the catalyst. FIG. 6B is an enlarged view of the catalyst carrying portion. FIG. 7A is a plan view of a base substrate according to the second embodiment of the present invention, and FIG. 7B is a cross-sectional view corresponding to the line BB in FIG. . FIG. 8 is a perspective view of a flow channel structure according to the third embodiment of the present invention. FIG. 9A is a bottom view of the flow path substrate, and FIG. 9B is a plan view of the base substrate. 10A is a cross-sectional view taken along the line CC in FIG. 8A, and FIG. 10B is a cross-sectional view taken along the line DD in FIG. 10A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Channel structure, 2 ... Channel board, 2a-2f ... surface, 3 ... Base substrate, 3a-3f ... surface, 4A, 4B ... Metal pattern, 20 ... Introduction port, 21 ... Discharge port, 22 ... Groove , 23 through-holes, 40A, 40B ... voltage application unit, 41A, 41B ... catalyst support, 42 ... pore, 100 ... flow path, 101 ... catalyst, 410 ... porous alumina, 411 ... non-porous alumina

Claims (7)

A member having a flow path;
A first metal pattern that is drawn from the wall surface of the flow channel to the outside of the flow channel and to which a voltage of a first potential is applied;
A second metal pattern that is drawn from the wall surface of the flow path to the outside of the flow path and to which a voltage of a second potential is applied;
A flow path structure including a porous catalyst support formed on at least one surface of the first and second metal patterns.   Furthermore, the flow-path structure of Claim 1 provided with the catalyst carry | supported by the said catalyst support part.   The member includes a first plate member in which a channel groove is formed on a first joint surface, and the first and second metal patterns are formed on a second joint surface, and the first joint is formed. The flow path structure according to claim 1, comprising a second plate member having a surface joined to the second joining surface.   The flow path structure according to claim 3, wherein the first and second metal patterns are alternately arranged in a direction intersecting with the flow path groove.   The flow path structure according to claim 2, wherein the catalyst is supported on the catalyst supporting part in a state where it can be removed by a reaction solution having a reaction substrate for the catalyst supporting part. Preparing a member having a flow path and formed with first and second metal patterns drawn from the wall surface of the flow path to the outside of the flow path;
By flowing an electrolyte through the flow path and applying a positive voltage to the first metal pattern with respect to the second metal pattern, the first metal pattern is disposed on the wall surface of the flow path. A porous catalyst support is formed on the surface by anodizing,
By flowing a plating solution through the flow path and applying a negative voltage to the first metal pattern with respect to the second metal pattern, a catalyst is applied to the catalyst carrier formed on the first metal pattern. A manufacturing method of a channel structure to be supported. Furthermore, the electrolyte solution is allowed to flow through the flow path and a positive voltage is applied to the second metal pattern with respect to the first metal pattern, thereby arranging the second metal pattern on the wall surface of the flow path. A porous catalyst support is formed on the formed surface by an anodic oxidation method,
By flowing a plating solution through the flow path and applying a negative voltage to the second metal pattern with respect to the first metal pattern, a catalyst is applied to the catalyst carrier formed on the second metal pattern. The flow path structure manufacturing method according to claim 6, wherein the flow path structure is supported.

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