JP2009141249A - Semiconductor substrate and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve adhesiveness between a single crystal semiconductor substrate and a supporting substrate even when there is a gap between them, in a process for laminating these substrates and forming a thin film single crystal semiconductor layer peeled from the single crystal semiconductor substrate on the supporting substrate. <P>SOLUTION: A frame-shaped first insulating layer and a second insulating layer provided like an island shape in a region surrounded by the first insulating layer are formed on the top surface of the supporting substrate. The supporting substrate and the single crystal semiconductor substrate in which a damaged layer is formed are overlaid, and a gap between the single crystal semiconductor substrate and the supporting substrate is made a decompressed condition in a vacuum chamber, and then the single crystal semiconductor substrate and the supporting substrate are released to air. A heat treatment is performed in a condition where the single crystal semiconductor substrate and the supporting substrate are overlaid, and the single crystal semiconductor substrate is peeled off with the damaged layer as a cleavage face, thereby the single crystal semiconductor layer peeled off from the single crystal semiconductor substrate is fixed onto the first and second insulating layers on the supporting substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a method for manufacturing an SOI substrate having a so-called SOI (Silicon on Insulator) structure in which a single crystal semiconductor layer is provided on an insulating surface and a method for manufacturing a semiconductor device having an SOI structure.

In recent years, attention has been paid to a technique for forming a thin film transistor (TFT) using a semiconductor thin film (having a thickness of about several to several hundred nm) formed on a substrate having an insulating surface such as glass. Thin film transistors are widely applied to electronic devices such as integrated circuits and electro-optical devices, and are particularly urgently developed as switching elements for image display devices.

A semiconductor substrate (SOI substrate) called a silicon-on-insulator (SOI) in which a thin single-crystal semiconductor layer is provided on an insulating layer instead of a silicon wafer manufactured by thinly cutting a single-crystal semiconductor ingot ) Have been developed and are becoming popular as substrates for manufacturing microprocessors and the like. An integrated circuit using an SOI substrate has been attracting attention as a means for reducing parasitic capacitance between the drain of the transistor and the substrate, improving the performance of the semiconductor integrated circuit, and reducing power consumption.

As a method for manufacturing an SOI substrate, a hydrogen ion implantation separation method is known (for example, see Patent Document 1). For example, by implanting ions such as hydrogen into a silicon wafer having a silicon oxide film formed on the surface, a microbubble layer is formed at a predetermined depth from the surface to form a cleavage plane, and a thin single crystal silicon layer (SOI) is formed on another wafer. Layer). Further, the SOI substrate is formed by peeling the SOI layer from the cleaved surface by performing a heat treatment.

On the other hand, attempts have been made to form an SOI layer on an insulating substrate such as glass. An example of an SOI substrate in which an SOI layer is formed on a glass substrate is known in which a thin single crystal silicon layer is formed on a glass substrate having a coating film using a hydrogen ion implantation separation method (for example, Patent Document 2). In this case as well, hydrogen ions are implanted into the silicon wafer to form a microbubble layer at a predetermined depth from the surface, and after bonding the glass substrate and the silicon wafer, the silicon wafer is peeled off using the microbubble layer as a cleavage plane. Thus, a thin single crystal silicon layer (SOI layer) is formed on the glass substrate.
JP 2000-294754 A JP 2004-134675 A

When a single crystal semiconductor layer formed on a support substrate by a hydrogen ion implantation separation method is used as a semiconductor element, the entire surface of the single crystal semiconductor substrate is bonded to a support substrate such as a glass substrate, and the single crystal semiconductor layer is formed on the support substrate. After pasting, a single crystal semiconductor layer in which elements are separated can be obtained by patterning in an island shape. Alternatively, a pre-patterned adhesive layer is provided on the supporting substrate or the single crystal semiconductor substrate, and the supporting substrate and the single crystal semiconductor substrate are bonded to each other through the adhesive layer, whereby the patterned island is formed on the supporting substrate. A method for forming a single crystal semiconductor layer may also be mentioned.

Of these, when the entire surface of a single crystal semiconductor substrate is bonded to a support substrate and a pattern is formed in an island shape after the single crystal semiconductor layer is bonded, the flat substrates are bonded to each other. Can be easily extruded. Therefore, the substrates can be easily brought into close contact with each other by atmospheric pressure.

On the other hand, in the case of a method of forming an island-shaped single crystal semiconductor layer on a support substrate by providing a patterned adhesive layer on the single crystal semiconductor substrate or the support substrate, the ground plane between the substrates to be bonded is narrow and discontinuous. It is. In addition, air exists in the gap between the single crystal semiconductor substrate and the supporting substrate, and the adhesion between the substrates is poor. Therefore, it is difficult to transpose a large area at a time.

In addition, even when the island-shaped pattern is formed after the single crystal semiconductor layer is attached to the supporting substrate, a gap is formed between the substrates if at least one of the substrates to be attached is distorted. May end up. Furthermore, if heating is performed with air remaining between the substrates, the air may expand during heating, and adhesion between the substrates may be hindered.

In view of the above-described problems, the present invention provides a single crystal semiconductor substrate and a support substrate in a step of bonding a single crystal semiconductor substrate and a support substrate to form a thin single crystal semiconductor layer separated from the single crystal semiconductor substrate on the support substrate. One of the problems is to improve the adhesion between the substrates even when there is a gap between them.

According to one method for manufacturing a semiconductor substrate of the present invention, ions are added to a single crystal semiconductor substrate to form a damaged layer in a region having a predetermined depth from the surface of the single crystal semiconductor substrate. The first insulating layer and the second insulating layer provided in an island shape in the region surrounded by the first insulating layer are formed, the supporting substrate is formed, and the first and second insulating layers are formed. The support substrate and the single crystal semiconductor substrate are carried into a vacuum chamber, the gap between the single crystal semiconductor substrate and the support substrate is reduced, and then the single crystal semiconductor substrate and the support substrate are mounted. On the first and second insulating layers on the support substrate, the heat treatment is performed in a state where the single crystal semiconductor substrate and the support substrate are overlapped, and the single crystal semiconductor substrate is separated using the damaged layer as a cleavage plane. The single crystal semiconductor layer separated from the single crystal semiconductor substrate A constant.

One embodiment of a method for manufacturing a semiconductor substrate of the present invention is to add ions to a single crystal semiconductor substrate to form a damaged layer in a region having a predetermined depth from the surface of the single crystal semiconductor substrate. A frame-shaped first insulating layer and a second insulating layer provided in an island shape in a region surrounded by the first insulating layer are formed on the top surface, and the single crystal semiconductor substrate is formed using the first crystalline semiconductor substrate. Then, the support substrate and the single crystal semiconductor substrate are overlapped with each other through the second insulating layer, and the support substrate and the single crystal semiconductor substrate are carried into a vacuum chamber, and the gap between the single crystal semiconductor substrate and the support substrate is reduced. The semiconductor substrate and the support substrate are opened to the atmosphere, heat treatment is performed in a state where the single crystal semiconductor substrate and the support substrate are overlapped, and the single crystal semiconductor substrate is peeled off using the damaged layer as a cleavage plane. 2 on a single crystal semiconductor substrate. To fix the crystal semiconductor layer.

In the step of transferring a thin single crystal semiconductor layer from a single crystal semiconductor substrate to another substrate by the method for manufacturing a semiconductor substrate of the present invention, even when a gap exists between the single crystal semiconductor substrate and the support substrate, The adhesion between the substrates can be improved.

Hereinafter, a method for manufacturing a semiconductor substrate in an embodiment of the present invention will be described with reference to the drawings. However, the present invention can be implemented in many different modes, and those skilled in the art can easily understand that the modes and details can be changed in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention is not construed as being limited to the description of this embodiment mode.

(Embodiment 1)
A semiconductor substrate according to the present invention is shown in FIG. FIG. 1A is a perspective view of a semiconductor substrate according to the present invention, and FIG. 1B is a cross-sectional view thereof.

The semiconductor substrate according to the present invention includes a frame-shaped first insulating layer 105, a plurality of second insulating layers 107 formed in an island shape in a region surrounded by the first insulating layer 105, A first single crystal semiconductor layer 114 formed over the insulating layer 105 and a second single crystal semiconductor layer 115 formed over the second insulating layer 107 are formed over the top surface of the support substrate 101. .

In FIG. 1, a substrate having an insulating surface is used as the support substrate 101. Examples thereof include various glass substrates, quartz substrates, ceramic substrates, and sapphire substrates used in the electronics industry such as aluminosilicate glass, aluminoborosilicate glass, and barium borosilicate glass. Preferably, a glass substrate is used as the supporting substrate 101. For example, a 3.5th generation (600 mm × 720 mm or 620 mm × 750 mm) or fourth generation (680 mm × 880 mm or 730 mm × 920 mm) liquid crystal mother glass is used. A substrate can be used. Furthermore, a large-area mother glass substrate referred to as a sixth generation (1500 mm × 1850 mm), a seventh generation (1870 mm × 2200 mm), or an eighth generation (2200 mm × 2400 mm) can also be used. By using a large-area mother glass substrate as the support substrate 101, the number of display panels (number of chamfers) that can be manufactured from one substrate can be increased, and productivity can be improved.

The surface of various glass substrates used in the electronics industry such as aluminosilicate glass, aluminoborosilicate glass, and barium borosilicate glass is preferably excellent in flatness if it has a polished surface. The glass substrate may be polished with, for example, cerium oxide.

Next, a method for producing the semiconductor substrate according to the present invention shown in FIG. 1 will be described with reference to FIG.

As shown in FIG. 2A, a single crystal semiconductor substrate 111 is prepared. As the material of the single crystal semiconductor substrate 111, single crystal silicon, polycrystalline silicon, or the like is used. As the single crystal semiconductor substrate 111, for example, a substrate cut from a 450 mm silicon wafer (18 inch silicon wafer) can be used. The planar shape of the single crystal semiconductor substrate 111 is a substantially quadrangular shape, and the one in which the distance between the opposing sides has an external number method such as 280 mm × 350 mm, 335 mm × 300 mm, or 350 mm × 270 mm may be applied. it can.

  Next, as illustrated in FIG. 2B, an ion beam 121 including ions accelerated by an electric field is implanted into the single crystal semiconductor substrate 111 to damage a region having a predetermined depth from one surface of the single crystal semiconductor substrate 111. Layer 113 is formed. The ion beam 121 is generated by exciting the source gas to generate a plasma of the source gas, and extracting ions contained in the plasma by the action of an electric field from the plasma.

  The depth of the region where the damaged layer 113 is formed can be adjusted by the acceleration energy of the ion beam 121 and the incident angle of the ion beam 121. The acceleration energy can be adjusted by the acceleration voltage, the dose amount, and the like. The damaged layer 113 is formed in a region having a depth substantially equal to the average ion penetration depth. The thickness of the single crystal semiconductor layer separated from the single crystal semiconductor substrate is determined by the depth of ion implantation. The depth at which the damaged layer 113 is formed is 50 nm or more and 500 nm or less, and the preferable depth range is 50 nm or more and 200 nm or less.

  In order to add ions to the single crystal semiconductor substrate 111, an ion implantation apparatus or an ion doping apparatus can be used. In an ion implantation apparatus, a source gas is excited to generate plasma, ion species are extracted from the plasma, ion species are mass-separated, and ion species having a predetermined mass are added to a workpiece. The ion doping apparatus excites a source gas to generate plasma, extracts ion species from the plasma, and adds the ion species to the object to be processed without mass separation. Note that in an ion doping apparatus provided with a mass separator, ions accompanying mass separation can be added similarly to the ion implantation apparatus.

  In order to add ions to the single crystal semiconductor substrate 111, an ion doping method without element amount separation is preferable to an ion implantation method with mass separation. Thereby, the tact time for forming the damaged layer 113 in the single crystal semiconductor substrate 111 can be shortened.

  In the case of using an ion doping apparatus, a source gas is excited to generate plasma, and ion species are extracted from the plasma and accelerated to generate an ion beam 121. By irradiating the single crystal semiconductor substrate 111 with the ion beam 121, ions are introduced at a high concentration to a predetermined depth, and a damaged layer 113 is formed.

When hydrogen (H ₂ ) is used for the source gas, the hydrogen gas can be excited to generate plasma containing H ⁺ , H ₂ ⁺ , and H ₃ ⁺ . The ratio of ion species generated from the source gas can be changed by adjusting the plasma excitation method, the pressure of the atmosphere in which the plasma is generated, the supply amount of the source gas, and the like. The ion beam ^{_{121, H +, H 2 +}} , it is preferable _{that H} ^{3 +} total _H ^{3 +} against is to be included above _{50%, H} ^{3 +} ratio of more preferably 80% or more. Thus, by increasing the ratio of H ₃ ⁺ , the damaged layer 113 can contain hydrogen of 1 × 10 ²⁰ atoms / cm ³ or more.

When the damaged layer 113 is formed with such a hydrogen concentration, the crystal structure is lost and minute voids are formed, resulting in a porous structure. Therefore, a volume change of a minute cavity formed in the damaged layer 113 occurs by heat treatment at a relatively low temperature (600 ° C. or lower), and the single crystal semiconductor layer can be cleaved along the damaged layer 113.

When ions are added by an ion doping method using hydrogen gas, an acceleration voltage of 10 kV to 200 kV and a dose of 1 × 10 ¹⁶ ions / cm ^{2 to} 6 × 10 ¹⁶ ions / cm ² can be set. By implanting hydrogen ions under these conditions, the damaged layer 113 can be formed in the region of the single crystal semiconductor substrate 111 at a depth of 50 nm to 500 nm, depending on the ion species contained in the ion beam 121 and the ratio thereof. it can.

Helium (He) can also be used for the source gas of the ion beam 121. Since most of the ion species generated by exciting helium are He ⁺ , the single crystal semiconductor substrate 111 can be implanted with He ⁺ as main ions even by an ion doping method without mass separation. Therefore, minute holes can be efficiently formed in the damaged layer 113 by an ion doping method. When ions are added by ion doping using helium, an acceleration voltage of 10 kV to 200 kV and a dose of 1 × 10 ¹⁶ ions / cm ^{2 to} 6 × 10 ¹⁶ ions / cm ² can be set.

One or more kinds of gases selected from a halogen gas such as chlorine gas (Cl ₂ gas) and fluorine gas (F ₂ gas) and a halogen compound gas such as fluorine compound gas (for example, BF ₃ ) are used as the source gas. Can do.

  Further, the damaged layer 113 can be formed by adding ions a plurality of times. In this case, the source gas may be different each time ions are implanted, or the same source gas may be used. For example, after ions are implanted using a rare gas as a source gas, ions can be implanted using a hydrogen gas as a source gas. Alternatively, ions can be added first using a halogen gas or a halogen compound gas, and then ions can be added using a hydrogen gas.

Alternatively, an insulating layer containing nitrogen may be formed over the top surface of the single crystal semiconductor substrate 111 before the ion beam is implanted. The insulating layer containing nitrogen can be formed using an insulating material such as silicon nitride oxide or silicon nitride. The insulating layer containing nitrogen may be provided for the purpose of preventing impurity contamination from the support substrate side when a part of the single crystal semiconductor substrate 111 is attached to the support substrate later to provide the single crystal semiconductor layer. preferable. That is, the insulating layer containing nitrogen functions as a barrier layer for preventing impurities such as mobile ions and moisture contained in the supporting substrate from diffusing into the single crystal semiconductor layer. Therefore, in the case where impurity contamination does not cause a problem, the insulating layer containing nitrogen can be omitted.

As the insulating layer containing nitrogen, a silicon nitride layer, a silicon nitride oxide layer, or a silicon oxynitride layer is formed with a single-layer structure or a stacked structure by a plasma CVD method, a sputtering method, or the like. The insulating layer containing nitrogen is preferably provided in the range of 50 nm to 200 nm. For example, a silicon oxynitride layer and a silicon nitride oxide layer can be stacked from the single crystal semiconductor substrate 111 side to form an insulating layer containing nitrogen.

Note that the silicon oxynitride film has a composition that contains more oxygen than nitrogen, and the concentration ranges of oxygen are 55 to 65 atomic%, nitrogen is 1 to 20 atomic%, and silicon is 25 to 25%. 35 atomic% and hydrogen are contained in the range of 0.1 to 10 atomic%. The silicon nitride oxide film has a composition containing more nitrogen than oxygen, and the concentration ranges of oxygen are 15 to 30 atomic%, nitrogen is 20 to 35 atomic%, and silicon is 25 to 25%. 35 atomic% and hydrogen are included in the range of 15 to 25 atomic%.

The insulating layer containing nitrogen may be formed by combining a plurality of layers made of insulating materials having different materials or properties as described above. For example, a silicon nitride layer and a silicon oxide layer may be stacked from the single crystal semiconductor substrate 111 side.

Next, as illustrated in FIG. 2C, the insulating film 103 is formed over the support substrate 101. The insulating film 103 functions as a bonding layer with the single crystal semiconductor substrate 111 and is provided on a surface where the support substrate 101 forms a bond with the single crystal semiconductor substrate 111. Although a single-layer structure or a stacked structure may be used, it is preferable to use an insulating film in which a surface bonded to the support substrate (hereinafter also referred to as a “bonded surface”) has a smooth surface and becomes a hydrophilic surface.

As the insulating film having a smooth surface and capable of forming a hydrophilic surface, silicon oxide containing hydrogen, silicon nitride containing hydrogen, silicon nitride containing oxygen and hydrogen, silicon oxynitride, silicon nitride oxide, or the like is used. be able to.

As the silicon oxide containing hydrogen, for example, silicon oxide produced by a chemical vapor deposition method using organosilane is preferable. This is because by using an insulating film 103 formed using organosilane, for example, a silicon oxide film, the bond between the supporting substrate and the single crystal semiconductor layer can be strengthened. As the organic silane, tetraethoxysilane (TEOS: chemical formula Si (OC ₂ H ₅ ) ₄ ), tetramethylsilane (TMS: chemical formula Si (CH ₃ ) ₄ ), tetramethylcyclotetrasiloxane (TMCTS), octamethylcyclotetra Using silicon-containing compounds such as siloxane (OMCTS), hexamethyldisilazane (HMDS), triethoxysilane (SiH (OC ₂ H ₅ ) ₃ ), trisdimethylaminosilane (SiH (N (CH ₃ ) ₂ ) ₃ ) Can do.

Silicon nitride containing hydrogen can be manufactured by a plasma CVD method using silane gas and ammonia gas. Hydrogen may be added to the gas. Silicon nitride containing oxygen and hydrogen can be manufactured by a plasma CVD method using silane gas, ammonia gas, and nitrous oxide gas. In any case, silicon oxide, silicon oxynitride, and silicon nitride oxide produced by using a silane gas or the like as a source gas by a chemical vapor deposition method such as a plasma CVD method, a low pressure CVD method, or an atmospheric pressure CVD method. Any material containing hydrogen can be used. In any case, the insulating film 103 may be any film having a smooth surface and a surface with a hydroxyl group.

The thickness of the insulating film 103 used for the bonding layer can be greater than or equal to 10 nm and less than or equal to 200 nm. The preferred thickness is 10 nm or more and 100 nm or less, and more preferably 20 nm or more and 50 nm or less.

Next, as illustrated in FIG. 2D, the insulating film 103 is patterned, and a plurality of frame-shaped first insulating layers 105 and a plurality of regions are provided in a region surrounded by the first insulating layers 105. An island-shaped second insulating layer 107 is formed. Note that the first insulating layer 105 is preferably formed with a width of 100 μm to 1 cm. In addition, the distance between the first insulating layer 105 and the second insulating layer 107 or the distance between the second insulating layers 107 can be several tens of μm to several hundreds of μm. In this embodiment, the supporting substrate 101 and the single crystal semiconductor substrate 111 have approximately the same area, and the first insulating layer 105 is formed to surround the outer periphery of the supporting substrate 101. When the supporting substrate 101 has the same area as the single crystal semiconductor substrate 111 or an area smaller than that of the single crystal semiconductor substrate 111, the first insulating layer 105 is formed so as to surround the outer periphery of the support substrate 101. Then, the area over which the second insulating layer 107 is formed in the supporting substrate 101 can be increased, which is preferable.

Various methods can be used to pattern the insulating film 103, but dry etching is preferably used. By using dry etching, the patterned sidewalls of the first insulating layer 105 and the second insulating layer 107 are sharpened so that a fine pattern can be formed.

Next, the single crystal semiconductor substrate 111 and the supporting substrate 101 are overlaid. After that, the single crystal semiconductor substrate 111 and the supporting substrate 101 are transferred to a vacuum chamber in a state where the single crystal semiconductor substrate 111 and the supporting substrate 101 are overlapped, and then the inside of the vacuum chamber is decompressed. The pressure in the vacuum chamber is preferably 1 × 10 ⁻⁵ Torr or less, and more preferably 1 × 10 ⁻⁶ Torr or less. By reducing the pressure in the vacuum chamber, the gap between the support substrate 101 and the single crystal semiconductor substrate 111 due to slight warping of the single crystal semiconductor substrate 111 or the support substrate 101 provided with the first and second insulating films. Air is discharged from the air and the gap can be in a reduced pressure state. Note that the single crystal semiconductor substrate 111 and the supporting substrate 101 may be previously carried into a vacuum chamber, and the two substrates may be overlapped in the vacuum chamber after the inside of the vacuum chamber is in a reduced pressure state.

After the gap between the supporting substrate 101 and the single crystal semiconductor substrate 111 is sufficiently reduced in pressure, the inside of the vacuum chamber is gently released to the atmosphere. The pressure difference between the inside and outside of the gap between the two substrates after release to the atmosphere is preferably 0.5 atm or more and 1 atm or less.

In the method for manufacturing a semiconductor substrate of the present invention, the first insulating layer 105 and the second insulating layer 107 which are formed over the supporting substrate and function as a bonding layer are formed with a pattern. Since the contact area with the crystalline semiconductor substrate 111 is small, and air exists in the gap between the pattern formed on the supporting substrate 101 and the single crystal semiconductor substrate 111, it is only necessary to overlap them at atmospheric pressure. A single substrate cannot be sufficiently adhered. However, when the gap between the support substrate 101 and the single crystal semiconductor substrate 111 is reduced, and then the two substrates are released to the atmosphere, atmospheric pressure is applied to the support substrate 101 and the single crystal semiconductor substrate 111. Since the frame-like first insulating layer 105 serves as a wall, air does not enter the gap in a reduced pressure state. Accordingly, adhesion between the support substrate 101 and the single crystal semiconductor substrate 111 can be improved without using a special jig (FIG. 2E). Further, since the gap between the substrates is in a reduced pressure state, separation of the substrates due to air expansion during the heat treatment can be prevented.

A bond is formed by bringing the surfaces of the first insulating layer 105 and the second insulating layer 107 formed over the supporting substrate 101 into close contact with the surface of the single crystal semiconductor substrate 111. Hydrogen bonding and van der Waals forces are acting on this junction. Hydrogen bonding means that the substrate surface is hydrophilic, hydroxyl groups and water molecules act as adhesives, water molecules diffuse by heat treatment, and residual components form silanol groups (Si-OH) to bond with hydrogen bonds. Form. Further, this bonding portion becomes a covalent bond by forming a siloxane bond (O—Si—O) by removal of hydrogen, so that the bonding between the single crystal semiconductor substrate 111 and the supporting substrate 101 becomes strong.

After the support substrate 101 and the single crystal semiconductor substrate 111 are released to the atmosphere, one or both of heat treatment and pressure treatment are preferably performed. By performing heat treatment or pressure treatment, the bonding strength between the support substrate 101 and the single crystal semiconductor substrate 111 can be improved. The temperature of the heat treatment is lower than the heat resistance temperature of the support substrate 101. The pressure treatment is performed so that pressure is applied in a direction perpendicular to the bonding surface, and the pressure resistance of the support substrate 101 and the single crystal semiconductor substrate 111 is taken into consideration.

FIG. 2F illustrates a stage in which part of the single crystal semiconductor substrate 111 is separated from the support substrate 101 by performing heat treatment on the support substrate 101 and the single crystal semiconductor substrate 111 after being released into the atmosphere, using the damaged layer 113 as a cleavage plane. Show. The temperature of the heat treatment is preferably performed below the heat resistant temperature of the support substrate 101. For example, when heat treatment is performed at 400 ° C. to 600 ° C., a change in deposition of minute cavities formed in the damaged layer 109 occurs, and cleavage occurs along the damaged layer 109. A first single crystal semiconductor layer 114 formed over the first insulating layer 105 and a second single crystal semiconductor layer 115 formed over the second insulating layer 107 are formed over the supporting substrate 101. Will remain. The first single crystal semiconductor layer 114 and the second single crystal semiconductor layer 115 have the same crystallinity as the single crystal semiconductor substrate 111. Various semiconductor elements can be manufactured using the second single crystal semiconductor layer 115 formed in a plurality of island shapes.

The separated single crystal semiconductor substrate 111 can be reused by planarizing the surface. That is, according to this embodiment, the single crystal semiconductor layer can be peeled from the surface of the single crystal semiconductor substrate 111 with a thickness of 1 μm or less, preferably 500 nm or less by adding hydrogen cluster ions. The number of times that the semiconductor substrate 111 can be recycled can be increased.

Through the above steps, a semiconductor substrate in which a plurality of island-shaped single crystal semiconductor layers are provided over a supporting substrate with an insulating layer interposed therebetween is obtained.

Note that although the case where the supporting substrate 101 and the single crystal semiconductor substrate 111 have substantially the same size is illustrated in this embodiment mode, the present invention is not limited to this, and the supporting substrate 101 and the single crystal semiconductor substrate 111 are used. This can also be applied to cases where the sizes of are different. For example, a large glass substrate can be used as the support substrate 101.

Note that in the case where the supporting substrate 101 is larger than the single crystal semiconductor substrate 111, as illustrated in FIG. 3A, the first shape is formed on the supporting substrate 101 so as to surround the outer periphery of the bonding surface of the single crystal semiconductor substrate 111. The insulating layer 105 is formed, and a plurality of island-shaped second insulating layers 107 are preferably formed in a region surrounded by the first insulating layer 105. By forming the first insulating layer 105 so as to surround the outer periphery of the bonding surface of the single crystal semiconductor substrate 111, the area of the second insulating layer 107 in the single crystal semiconductor substrate 111 can be increased. Further, by forming the first insulating layer 105 into a frame shape, as illustrated in FIG. 3B, when the supporting substrate 101 and the single crystal semiconductor substrate 111 are overlapped and the gap is in a reduced pressure state, Since one insulating layer 105 becomes a wall, the gap remains in a reduced pressure state and air does not enter. Thus, the supporting substrate 101 and the single crystal semiconductor substrate 111 can be bonded to each other under atmospheric pressure. Note that FIG. 3 illustrates an example in which one first insulating layer 105 is provided over the supporting substrate 101; however, a plurality of the first insulating layers 105 may be provided over the supporting substrate 101. It is not to be over.

In the present embodiment, the first insulating layer and the second insulating layer have the same film thickness, but the first insulating layer is thicker than the second insulating layer by halftone exposure or the like. You may form with thickness. Further, as shown in FIG. 4, an insulating film 103 is formed over the supporting substrate 101 (FIG. 4A), and the insulating film 103 is etched to form a frame-shaped insulating layer 104 with a width of 100 μm to 1 cm. After that (FIG. 4B), an insulating film 106 is formed over the insulating layer 104 and the supporting substrate 101 (FIG. 4C), and the insulating film 106 is etched to form the frame-shaped first insulating layer 105 and Alternatively, a plurality of island-shaped second insulating layers 107 formed in a region surrounded by the first insulating layer 105 may be formed (FIG. 4D). Note that the first insulating layer 105 preferably has a shape surrounding the outer periphery of the support substrate 101. In FIG. 4, the first insulating layer 105 is formed on the previously formed insulating layer 104 and has a thickness greater than that of the second insulating layer 107. Note that either wet etching or dry etching may be employed for the etching of the insulating film 103 or the insulating film 106, but dry etching is preferable because fine etching is suitable for fine processing. The insulating film 106 is preferably formed using the same material as the insulating film 103 and is preferably formed to a thickness of 10 nm to 200 nm, preferably 10 nm to 100 nm, more preferably 20 nm to 50 nm. .

By making the thickness of the first insulating layer 105 thicker than that of the second insulating layer 107, when the supporting substrate 101 and the single crystal semiconductor substrate 111 are overlapped, the second insulating layer 107 becomes a single crystal semiconductor substrate. Since it is possible to avoid contact with the substrate 111, the gap between the support substrate 101 and the single crystal semiconductor substrate 111 can be easily reduced. In order to maintain the reduced pressure after the gap between the two substrates is reduced, it is desirable to increase the thickness of the first insulating layer 105. However, if the level difference between the outermost surface of the first insulating layer 105 and the outermost surface of the second insulating layer 107 is too large, the adhesion at the end portion of the support substrate 101 is deteriorated. When the film thickness is d ₂ , the film thickness d ₁ of the first insulating layer 105 is preferably d ₂ ≦ d ₁ ≦ 2d ₂ .

Note that the method for manufacturing a semiconductor substrate described in this embodiment can be combined as appropriate with any of the other embodiments in this specification.

(Embodiment 2)
In this embodiment mode, a method for manufacturing a semiconductor substrate of the present invention, which is different from the above embodiment mode, will be described with reference to FIGS. Specifically, a method for manufacturing a semiconductor substrate of the present invention in the case where a patterned insulating layer functioning as a bonding layer is provided on the single crystal semiconductor substrate side is shown. Note that the description of the same structure as that of the first embodiment is simplified and partly omitted.

As shown in FIG. 5A, an ion beam 121 is implanted into the single crystal semiconductor substrate 111 to form a damaged layer 113. Since the steps until the damaged layer 113 is formed over the single crystal semiconductor substrate 111 are the same as those in Embodiment 1 described above, description thereof is omitted.

Next, as illustrated in FIG. 5B, an insulating film 117 is formed over the top surface of the single crystal semiconductor substrate 111. The insulating film 117 functions as a bonding layer with the supporting substrate and is provided on a surface where the single crystal semiconductor substrate 111 is bonded to the supporting substrate. Although a single-layer structure or a stacked structure may be used, it is preferable to use an insulating film having a smooth joint surface and a hydrophilic surface.

As the insulating film 117 which has a smooth surface and can form a hydrophilic surface, a material similar to the material of the insulating film 103 described in Embodiment 1 can be used.

The thickness of the insulating film 117 used for the bonding layer can be greater than or equal to 10 nm and less than or equal to 200 nm. The preferred thickness is 10 nm or more and 100 nm or less, and more preferably 20 nm or more and 50 nm or less.

In the case where the insulating film 117 is formed by a chemical vapor deposition method, a temperature at which degassing does not occur from the damaged layer 113 formed over the single crystal semiconductor substrate 111 is applied. For example, the film formation temperature is preferably 350 ° C. or lower. Note that in the heat treatment for separating the single crystal semiconductor layer from the single crystal semiconductor substrate 111, a heating temperature higher than a deposition temperature by a chemical vapor deposition method is applied.

Next, as illustrated in FIG. 5C, the insulating film 117 is patterned to form a frame-shaped first insulating layer 118 and a plurality of islands provided in a region surrounded by the first insulating layer 118. And a second insulating layer 119 having a shape. Note that the first insulating layer 118 is preferably formed with a width of 100 μm to 1 cm. In this embodiment, the supporting substrate 101 and the single crystal semiconductor substrate 111 have approximately the same area, and the first insulating layer 118 is formed in a shape surrounding the outer periphery of the single crystal semiconductor substrate 111. Yes. When the single crystal semiconductor substrate 111 has the same area as the support substrate 101 or a smaller area than the support substrate 101, the first insulating layer 118 is formed so as to surround the outer periphery of the single crystal semiconductor substrate 111. Then, the area over which the second insulating layer 119 is formed in the single crystal semiconductor substrate 111 can be increased, which is preferable.

Various methods can be used to pattern the insulating film 117, but dry etching is preferably used. By using dry etching, the patterned sidewalls of the first insulating layer 118 and the second insulating layer 119 are sharpened so that a fine pattern can be formed.

Next, the single crystal semiconductor substrate 111 having a patterned insulating layer is overlapped with the supporting substrate 101 illustrated in FIG. In a state where the single crystal semiconductor substrate 111 and the supporting substrate 101 are overlapped, they are transferred to a vacuum chamber. By reducing the pressure in the vacuum chamber, the gap between the support substrate 101 and the single crystal semiconductor substrate 111 can be reduced.

After the gap between the supporting substrate 101 and the single crystal semiconductor substrate 111 is sufficiently reduced in pressure, the inside of the vacuum chamber is gently released to the atmosphere. The pressure difference between the inside and outside of the gap between the two substrates after release to the atmosphere is preferably 0.5 atm or more and 1 atm or less. When the gap between the support substrate 101 and the single crystal semiconductor substrate 111 is reduced in pressure and then the two substrates are released to the atmosphere, the support substrate 101 and the single crystal semiconductor substrate 111 are pressed by atmospheric pressure. In this case, since the frame-shaped first insulating layer 118 becomes a wall, air does not enter in a reduced pressure state. Accordingly, adhesion between the support substrate 101 and the single crystal semiconductor substrate 111 can be improved without using a special jig (FIG. 5E).

After the support substrate 101 and the single crystal semiconductor substrate 111 are released to the atmosphere, as shown in Embodiment Mode 1, treatment for increasing bonding strength is performed by heat treatment, pressure treatment, or the like. Next, as illustrated in FIG. 5F, the single crystal semiconductor substrate 111 is subjected to heat treatment, and part of the single crystal semiconductor substrate 111 is separated from the supporting substrate 101 with the damaged layer 113 serving as a cleavage plane. The temperature at which the single crystal semiconductor substrate 111 is heated is preferably equal to or higher than the deposition temperature of the insulating film 117 and equal to or lower than the heat resistance temperature of the supporting substrate 101. A first single crystal semiconductor layer 114 formed over the first insulating layer 118 and a second single crystal semiconductor layer 115 formed over the second insulating layer 107 are formed over the supporting substrate 101. Will remain. The first single crystal semiconductor layer 114 and the second single crystal semiconductor layer 115 have the same crystallinity as the single crystal semiconductor substrate 111.

Through the above steps, a semiconductor substrate in which a plurality of island-shaped single crystal semiconductor layers are provided over a supporting substrate with an insulating layer interposed therebetween is obtained.

In the present embodiment, the first insulating layer and the second insulating layer have the same film thickness, but the first insulating layer is thicker than the second insulating layer by halftone exposure or the like. You may form with thickness. By making the thickness of the first insulating layer 118 thicker than that of the second insulating layer 119, the second insulating layer 119 becomes a single crystal semiconductor substrate when the supporting substrate 101 and the single crystal semiconductor substrate 111 are overlapped with each other. Since it is possible to avoid contact with the substrate 111, the gap between the support substrate 101 and the single crystal semiconductor substrate 111 can be easily reduced. In order to maintain the reduced pressure after the gap between the two substrates is reduced, it is desirable to increase the thickness of the first insulating layer 118. However, if the level difference between the outermost surface of the first insulating layer 118 and the outermost surface of the second insulating layer 119 is too large, the adhesion at the end portion of the support substrate 101 is deteriorated. When the film thickness is d ₂ , the film thickness d ₁ of the first insulating layer 118 is preferably d ₂ ≦ d ₁ ≦ 2d ₂ .

Note that the method for manufacturing a semiconductor substrate described in this embodiment can be combined as appropriate with any of the other embodiments in this specification.

(Embodiment 3)
In this embodiment mode, a method for manufacturing a semiconductor substrate of the present invention, which is different from the above embodiment mode, will be described with reference to FIGS. Note that the description of the same configuration as that in the above embodiment is simplified and partly omitted.

As shown in FIG. 6A, an ion beam 121 is implanted into the single crystal semiconductor substrate 111 to form a damaged layer 113. Since the steps until the damaged layer 113 is formed over the single crystal semiconductor substrate 111 are the same as those in Embodiment 1 described above, description thereof is omitted.

As shown in FIG. 6B, the support substrate 101 is etched to form a recess 123. Either wet etching or dry etching may be employed to form the recess 123, but dry etching is preferable because microetching is suitable. In addition, the recess 123 is preferably formed in a quadrangular shape connecting four sides on the inner side of 100 μm to 1 cm from the four sides of the upper surface of the support substrate 101.

Next, as illustrated in FIG. 6C, an insulating film 103 is formed over the top surface of the support substrate 101. The insulating film 103 functions as a bonding layer with the single crystal semiconductor substrate 111 and is provided on a surface where the single crystal semiconductor substrate 111 is bonded to the support substrate 101. Although a single-layer structure or a stacked structure may be used, it is preferable to use an insulating film having a smooth joint surface and a hydrophilic surface.

As the insulating film having a smooth surface and capable of forming a hydrophilic surface, a material similar to the material of the insulating film 103 described in Embodiment 1 can be used.

Next, as illustrated in FIG. 6D, the insulating film 103 is patterned to form a frame-shaped first insulating layer 105 and a plurality of islands provided in a region surrounded by the first insulating layer 105. The second insulating layer 107 is formed. Note that at least a part of the first insulating layer 105 is formed on the upper surface of the support substrate 101 so as to overlap with a region other than the region where the concave portion 123 is formed. In addition, the first insulating layer is preferably formed with a width of 100 μm to 1 cm. The second insulating layer 107 is formed on the recess 123.

Various methods can be used to pattern the insulating film 103, but dry etching is preferably used. By using dry etching, a fine pattern can be formed.

Next, the single crystal semiconductor substrate 111 and the supporting substrate 101 are overlaid. After that, the single crystal semiconductor substrate 111 and the supporting substrate 101 are transferred to the vacuum chamber in a state where they are overlapped. By reducing the pressure in the vacuum chamber, the gap between the support substrate 101 and the single crystal semiconductor substrate 111 due to slight warping of the single crystal semiconductor substrate 111 or the support substrate 101 provided with the first and second insulating films. Air is discharged from the air and the gap can be in a reduced pressure state.

After the gap between the supporting substrate 101 and the single crystal semiconductor substrate 111 is sufficiently reduced in pressure, the inside of the vacuum chamber is gently released to the atmosphere. The pressure difference between the inside and outside of the gap between the two substrates after release to the atmosphere is preferably 0.5 atm or more and 1 atm or less.

When the gap between the support substrate 101 and the single crystal semiconductor substrate 111 is reduced in pressure and then the two substrates are released to the atmosphere, the support substrate 101 and the single crystal semiconductor substrate 111 are pressed by atmospheric pressure. In this case, since the frame-like first insulating layer 105 becomes a wall, air does not enter in a reduced pressure state. Accordingly, adhesion between the supporting substrate 101 and the single crystal semiconductor substrate 111 can be improved without using a special jig (FIG. 6E).

After the support substrate 101 and the single crystal semiconductor substrate 111 are opened to the atmosphere, as shown in Embodiment Mode 1, treatment for increasing bonding strength is performed by heat treatment, pressure treatment, or the like. Next, as illustrated in FIG. 6F, the single crystal semiconductor substrate 111 is subjected to heat treatment, and part of the single crystal semiconductor substrate 111 is separated from the supporting substrate 101 with the damaged layer 113 serving as a cleavage plane. The temperature for heating the single crystal semiconductor substrate 111 is preferably equal to or lower than the heat resistant temperature of the support substrate 101. A first single crystal semiconductor layer 114 formed over the first insulating layer 118 and a second single crystal semiconductor layer 115 formed over the second insulating layer 107 are formed over the supporting substrate 101. Will remain. The first single crystal semiconductor layer 114 and the second single crystal semiconductor layer 115 have the same crystallinity as the single crystal semiconductor substrate 111.

Through the above steps, a semiconductor substrate in which a plurality of island-shaped single crystal semiconductor layers are provided over a supporting substrate with an insulating layer interposed therebetween is obtained.

By using the method for manufacturing a semiconductor substrate described in this embodiment, the second insulating layer 107 is in contact with the single crystal semiconductor substrate 111 when the supporting substrate 101 and the single crystal semiconductor substrate 111 are overlapped with each other. Since this can be avoided, the gap between the supporting substrate 101 and the single crystal semiconductor substrate 111 can be easily reduced. However, if the level difference between the outermost surface of the first insulating layer 105 and the outermost surface of the second insulating layer 107 is too large, the adhesiveness at the end portion of the support substrate 101 is deteriorated. The recess 123 is preferably formed so that the distance between the outermost surface and the outermost surface of the second insulating layer 107 is equal to or less than the thickness of the first insulating layer 105 or the second insulating layer 107.

Note that although the depression 123 is formed over the supporting substrate 101 in this embodiment mode, the depression may be formed by etching the single crystal semiconductor substrate 111. In this case, the first insulating layer and the second insulating layer are formed on the single crystal semiconductor substrate 111 side by forming an insulating film over the single crystal semiconductor substrate 111 so as to cover the concave portion and patterning the insulating film. Can be formed.

Note that the method for manufacturing a semiconductor substrate described in this embodiment can be combined as appropriate with any of the other embodiments in this specification.

(Embodiment 4)
In this embodiment, a method for manufacturing a semiconductor device using the semiconductor substrate manufactured in the above embodiment will be described.

First, a method for manufacturing an n-channel transistor and a p-channel transistor will be described with reference to FIGS. Various semiconductor devices can be formed by combining a plurality of transistors.

As shown in FIG. 7A, single crystal semiconductor layers 151 and 152 obtained by etching the second single crystal semiconductor layer 115 formed by the method described in the above embodiment are formed on the top surface of the semiconductor substrate. ing. Note that depending on the pattern size of the second single crystal semiconductor layer 115, the second single crystal semiconductor layer 115 formed in an island shape may be used as the single crystal semiconductor layers 151 and 152 without being etched. it can. The single crystal semiconductor layer 151 forms an n-channel transistor, and the single crystal semiconductor layer 152 forms a p-channel transistor.

As shown in FIG. 7B, an insulating layer 154 is formed over the single crystal semiconductor layers 151 and 152. Next, the gate electrode 155 is formed over the single crystal semiconductor layer 151 with the insulating layer 154 provided therebetween, and the gate electrode 156 is formed over the single crystal semiconductor layer 152.

Note that before the insulating layer 154 is formed, an impurity element serving as an acceptor such as boron, aluminum, or gallium or an impurity element serving as a donor such as phosphorus or arsenic is formed in a single crystal in order to control the threshold voltage of the transistor. It is preferable to add to the semiconductor layers 151 and 152. For example, an acceptor is added to a region where an n-channel transistor is formed, and a donor is added to a region where a p-channel transistor is formed.

Next, as illustrated in FIG. 7C, an n-type low concentration impurity region 157 is formed in the single crystal semiconductor layer 151, and a p-type high concentration impurity region 159 is formed in the single crystal semiconductor layer 152. First, an n-type low concentration impurity region 157 is formed in the single crystal semiconductor layer 151. Therefore, the single crystal semiconductor layer 152 to be a p-channel transistor is masked with a resist, and a donor is added to the single crystal semiconductor layer 151. Phosphorus or arsenic may be added as a donor. By adding a donor by an ion doping method or an ion implantation method, the gate electrode 155 serves as a mask, and an n-type low-concentration impurity region 157 is formed in the single crystal semiconductor layer 151 in a self-aligning manner. A region overlapping with the gate electrode 155 of the single crystal semiconductor layer 151 is a channel formation region 158.

Next, after the mask covering the single crystal semiconductor layer 152 is removed, the single crystal semiconductor layer 151 to be an n-channel transistor is covered with a resist mask. Next, an acceptor is added to the single crystal semiconductor layer 152 by an ion doping method or an ion implantation method. Boron can be added as an acceptor. In the acceptor addition step, the gate electrode 155 functions as a mask, and a p-type high concentration impurity region 159 is formed in the single crystal semiconductor layer 152 in a self-aligned manner. The high concentration impurity region 159 functions as a source region or a drain region. A region overlapping with the gate electrode 156 of the single crystal semiconductor layer 152 is a channel formation region 160. Although the method of forming the p-type high-concentration impurity region 159 after forming the n-type low-concentration impurity region 157 has been described here, the p-type high-concentration impurity region 159 can be formed first.

Next, after removing the resist covering the single crystal semiconductor layer 151, an insulating film having a single layer structure or a stacked structure formed using a nitrogen compound such as silicon nitride or an oxide such as silicon oxide is formed by a plasma CVD method or the like. By performing anisotropic etching of this insulating layer in the vertical direction, sidewall insulating layers 161 and 162 in contact with the side surfaces of the gate electrodes 155 and 156 are formed as shown in FIG. By this anisotropic etching, the insulating layer 154 is also etched.

Next, as illustrated in FIG. 8B, the single crystal semiconductor layer 152 is covered with a resist 165. In order to form a high-concentration impurity region functioning as a source region or a drain region in the single crystal semiconductor layer 151, a donor is added to the single crystal semiconductor layer 151 with a high dose by an ion implantation method or an ion doping method. Using the gate electrode 155 and the sidewall insulating layer 161 as a mask, an n-type high concentration impurity region 167 is formed. Next, heat treatment for activating donors and acceptors is performed.

After the heat treatment for activation, an insulating layer 168 containing hydrogen is formed as shown in FIG. After the insulating layer 168 is formed, heat treatment is performed at a temperature of 350 ° C to 450 ° C, so that hydrogen contained in the insulating layer 168 is diffused into the single crystal semiconductor layers 151 and 152. The insulating layer 168 can be formed by depositing silicon nitride or silicon nitride oxide by a plasma CVD method with a process temperature of 350 ° C. or lower. By supplying hydrogen to the single crystal semiconductor layers 151 and 152, defects that become trapping centers in the single crystal semiconductor layers 151 and 152 and at the interface with the insulating layer 154 can be effectively compensated.

Thereafter, an interlayer insulating layer 169 is formed. The interlayer insulating layer 169 is an insulating film made of an inorganic material such as a silicon oxide film or a BPSG (Boron Phosphorus Silicon Glass) film, or a single-layer film or a laminated structure selected from organic resin films such as polyimide and acrylic. It can be formed of a film. After a contact hole is formed in the interlayer insulating layer 169, a wiring 170 is formed as shown in FIG. For example, the wiring 170 can be formed of a conductive film having a three-layer structure in which a low-resistance metal film such as an aluminum film or an aluminum alloy film is sandwiched between barrier metal films. The barrier metal film can be formed of a metal film such as molybdenum, chromium, or titanium.

Through the above steps, a semiconductor device including an n-channel transistor and a p-channel transistor can be manufactured. Since the concentration of the metal element in the single crystal semiconductor layer included in the channel formation region is reduced in the manufacturing process of the SOI substrate, a transistor in which off current is small and variation in threshold voltage is suppressed can be manufactured. it can.

Although the method for manufacturing a transistor has been described with reference to FIGS. 7A and 7B, a high-value-added semiconductor device can be manufactured by forming various semiconductor elements such as a transistor and a transistor in addition to a transistor. it can. Hereinafter, specific embodiments of the semiconductor device will be described with reference to the drawings.

First, a microprocessor will be described as an example of a semiconductor device. FIG. 9 is a block diagram illustrating a configuration example of the microprocessor 500.

The microprocessor 500 includes an arithmetic circuit 501 (also referred to as Arithmetic logic unit. ALU), an arithmetic circuit controller 502 (ALU Controller), an instruction analyzer 503 (Instruction Decoder), an interrupt controller 504 (Interrupt Controller), and a timing controller. 505 (Timing Controller), a register 506 (Register), a register controller 507 (Register Controller), a bus interface 508 (Bus I / F), a read-only memory 509, and a memory interface 510.

An instruction input to the microprocessor 500 via the bus interface 508 is input to the instruction analysis unit 503 and decoded, and then to the arithmetic circuit control unit 502, the interrupt control unit 504, the register control unit 507, and the timing control unit 505. Entered. The arithmetic circuit control unit 502, the interrupt control unit 504, the register control unit 507, and the timing control unit 505 perform various controls based on the decoded instruction.

The arithmetic circuit control unit 502 generates a signal for controlling the operation of the arithmetic circuit 501. The interrupt control unit 504 is a circuit that processes an interrupt request from an external input / output device or a peripheral circuit while the microprocessor 500 is executing a program. And processing an interrupt request. The register control unit 507 generates an address of the register 506 and reads and writes the register 506 in accordance with the state of the microprocessor 500. The timing control unit 505 generates a signal that controls the operation timing of the arithmetic circuit 501, the arithmetic circuit control unit 502, the instruction analysis unit 503, the interrupt control unit 504, and the register control unit 507. For example, the timing control unit 505 includes an internal clock generation unit that generates an internal clock signal CLK2 based on the reference clock signal CLK1. As shown in FIG. 9, the internal clock signal CLK2 is input to another circuit.

Next, an example of a semiconductor device having a function of performing transmission / reception of data without contact and an arithmetic function will be described. FIG. 10 is a block diagram illustrating a configuration example of such a semiconductor device. The semiconductor device illustrated in FIG. 10 can be referred to as a computer that operates by transmitting and receiving signals to and from an external device by wireless communication (hereinafter referred to as “RFCPU”).

As illustrated in FIG. 10, the RFCPU 511 includes an analog circuit unit 512 and a digital circuit unit 513. The analog circuit portion 512 includes a resonance circuit 514 having a resonance capacity, a rectifier circuit 515, a constant voltage circuit 516, a reset circuit 517, an oscillation circuit 518, a demodulation circuit 519, and a modulation circuit 520. The digital circuit unit 513 includes an RF interface 521, a control register 522, a clock controller 523, an interface 524, a central processing unit 525, a random access memory 526, and a read only memory 527.

The outline of the operation of the RFCPU 511 is as follows. A signal received by the antenna 528 generates an induced electromotive force by the resonance circuit 514. The induced electromotive force is charged in the capacitor unit 529 through the rectifier circuit 515. Capacitance portion 529 is preferably formed of a capacitor such as a ceramic capacitor or an electric double layer capacitor. The capacitor portion 529 does not need to be integrated on the substrate constituting the RFCPU 511, and can be incorporated into the RFCPU 511 as another component.

The reset circuit 517 generates a signal that resets and initializes the digital circuit portion 513. For example, a signal that rises after a rise in the power supply voltage is generated as a reset signal. The oscillation circuit 518 changes the frequency and duty ratio of the clock signal in accordance with the control signal generated by the constant voltage circuit 516. The demodulation circuit 519 is a circuit that demodulates the received signal, and the modulation circuit 520 is a circuit that modulates data to be transmitted.

For example, the demodulation circuit 519 is formed of a low-pass filter, and binarizes an amplitude modulation (ASK) reception signal based on the amplitude fluctuation. In addition, in order to transmit transmission data by changing the amplitude of an amplitude modulation (ASK) transmission signal, the modulation circuit 520 changes the amplitude of the communication signal by changing the resonance point of the resonance circuit 514.

The clock controller 523 generates a control signal for changing the frequency and duty ratio of the clock signal in accordance with the power supply voltage or the current consumption in the central processing unit 525. The power supply management circuit 530 monitors the power supply voltage.

A signal input from the antenna 528 to the RFCPU 511 is demodulated by the demodulation circuit 519 and then decomposed into a control command and data by the RF interface 521. The control command is stored in the control register 522. The control command includes reading of data stored in the read-only memory 527, writing of data to the random access memory 526, an arithmetic instruction to the central processing unit 525, and the like.

The central processing unit 525 accesses the read-only memory 527, the random access memory 526, and the control register 522 via the interface 524. The interface 524 has a function of generating an access signal for any of the read-only memory 527, the random access memory 526, and the control register 522 from the address requested by the central processing unit 525.

As a calculation method of the central processing unit 525, a method in which an OS (operating system) is stored in the read-only memory 527 and a program is read and executed together with activation can be employed. Further, it is also possible to adopt a method in which an arithmetic circuit is configured by a dedicated circuit and arithmetic processing is processed in hardware. In the system using both hardware and software, a system in which a part of arithmetic processing is performed by a dedicated arithmetic circuit and the remaining arithmetic operations are processed by the central processing unit 525 using a program can be applied.

Next, a display device as a semiconductor device will be described with reference to FIGS.

In the manufacturing process of the semiconductor substrate described in the above embodiment mode, a glass substrate can be used as a supporting substrate. Therefore, by using a glass substrate as a supporting substrate and bonding a plurality of single crystal semiconductor layers, a large-sized semiconductor substrate having a side exceeding 1 meter can be manufactured.

A large-area glass substrate called mother glass for manufacturing a display panel can be used as a supporting substrate for a semiconductor substrate. FIG. 11 is a front view of a semiconductor substrate using mother glass for the support substrate 101. A liquid crystal display device and an electroluminescence display device can be manufactured by forming a plurality of semiconductor elements over such a large-area semiconductor substrate. In addition to such a display device, various semiconductor devices such as a solar cell, a photo IC, and a semiconductor memory device can be manufactured using a semiconductor substrate.

As illustrated in FIG. 11, a single crystal semiconductor layer 302 which is separated from a plurality of single crystal semiconductor substrates is attached to one mother glass 301. In order to cut out a plurality of display panels from the mother glass 301, it is preferable that the display region 310 of the display panel be included in the single crystal semiconductor layer 302. The display panel includes a scan line driver circuit, a signal line driver circuit, and a pixel portion. Therefore, the display panel formation region 310 includes regions in which these are formed (a scanning line driver circuit formation region 311, a signal line driver circuit formation region 312, and a pixel formation region 313).

FIG. 12 is a diagram for explaining a liquid crystal display device. 12A is a plan view of a pixel of the liquid crystal display device, and FIG. 12B is a cross-sectional view of FIG. 12A taken along the line JK.

As shown in FIG. 12A, the pixel includes a single crystal semiconductor layer 320, a scan line 322 intersecting with the single crystal semiconductor layer 320, a signal line 323 intersecting with the scan line 322, a pixel electrode 324, and a pixel. An electrode 328 that electrically connects the electrode 324 and the single crystal semiconductor layer 320 is provided. The single crystal semiconductor layer 320 is a layer formed from the single crystal semiconductor layer 302 attached to a supporting substrate, and constitutes a pixel TFT 325.

As the semiconductor substrate, a semiconductor substrate manufactured by the method described in the above embodiment is used. As illustrated in FIG. 12B, the insulating layer 315 and the single crystal semiconductor layer 320 are stacked over the supporting substrate 101. The support substrate 101 is a divided mother glass 301. In the single crystal semiconductor layer 320, a channel formation region 341 and an n-type high concentration impurity region 342 to which a donor is added are formed. The gate electrode of the TFT 325 is included in the scanning line 322, and one of the source electrode and the drain electrode is included in the signal line 323.

A signal line 323, a pixel electrode 324, and an electrode 328 are provided over the interlayer insulating film 327. A columnar spacer 329 is formed on the interlayer insulating film 327. An alignment film 330 is formed to cover the signal line 323, the pixel electrode 324, the electrode 328, and the columnar spacer 329. The counter substrate 332 is provided with a counter electrode 333 and an alignment film 334 that covers the counter electrode. The columnar spacer 329 is formed to maintain a gap between the support substrate 101 and the counter substrate 332. A liquid crystal layer 335 is formed in a gap formed by the columnar spacers 329. A connection portion between the signal line 323 and the electrode 328 and the high-concentration impurity region 342 has a step in the interlayer insulating film 327 due to the formation of the contact hole. Therefore, the alignment of the liquid crystal in the liquid crystal layer 335 is easily disturbed in the connection portion. For this reason, columnar spacers 329 are formed at the step portions to prevent disorder of the alignment of the liquid crystal.

Next, an electroluminescent display device (hereinafter referred to as an EL display device) will be described with reference to FIG. 13A is a plan view of a pixel of the EL display device, and FIG. 13B is a cross-sectional view of FIG. 13A taken along the line JK.

As shown in FIG. 13A, the pixel includes a selection transistor 401 made of TFT, a display control transistor 402, a scanning line 405, a signal line 406, a current supply line 407, and a pixel electrode 408. Each pixel is provided with a light-emitting element having a structure in which a layer (EL layer) formed including an electroluminescent material is sandwiched between a pair of electrodes. One electrode of the light emitting element is a pixel electrode 408. In the single crystal semiconductor layer 403, a channel formation region, a source region, and a drain region of the selection transistor 401 are formed. In the single crystal semiconductor layer 404, a channel formation region, a source region, and a drain region of the display control transistor 402 are formed. The single crystal semiconductor layers 403 and 404 are layers separated from the single crystal semiconductor substrate by the manufacturing method according to the present invention.

In the selection transistor 401, the gate electrode is included in the scanning line 405, one of the source electrode and the drain electrode is included in the signal line 406, and the other is formed as the electrode 410. In the display control transistor 402, the gate electrode 412 is electrically connected to the electrode 411, one of the source electrode and the drain electrode is formed as an electrode 413 electrically connected to the pixel electrode 408, and the other is supplied with current. Included in line 407.

The display control transistor 402 is a p-channel TFT. As shown in FIG. 13B, a single crystal semiconductor layer 404 is provided over the insulating layer 400, and a channel formation region 451 and a p-type high concentration impurity region 452 are formed in the single crystal semiconductor layer 404. Has been. Note that as the semiconductor substrate, a semiconductor substrate manufactured by the method described in any of the above embodiments is used.

An interlayer insulating film 427 is formed to cover the gate electrode 412 of the display control transistor 402. Over the interlayer insulating film 427, a signal line 406, a current supply line 407, electrodes 411, 413, and the like are formed. Further, a pixel electrode 408 that is electrically connected to the electrode 413 is formed over the interlayer insulating film 427. The peripheral portion of the pixel electrode 408 is surrounded by an insulating partition layer 428. An EL layer 429 is formed over the pixel electrode 408, and a counter electrode 430 is formed over the EL layer 429. A counter substrate 431 is provided as a reinforcing plate, and the counter substrate 431 is fixed to the support substrate 101 by a resin layer 432.

There are two methods for controlling the gradation of an EL display device: a current driving method in which the luminance of a light emitting element is controlled by current, and a voltage driving method in which the basis is controlled by voltage. The current driving method has characteristics of transistors for each pixel. When the difference in values is large, it is difficult to adopt, and for this purpose, a correction circuit for correcting variation in characteristics is required. Since an EL display is manufactured by a manufacturing method including an SOI substrate manufacturing process and a gettering process, characteristics of the selection transistor 401 and the display control transistor 402 are eliminated from pixel to pixel, so that a current driving method is employed. be able to.

Various electrical devices can be manufactured by using a semiconductor substrate. Electrical equipment includes video cameras, digital cameras, navigation systems, sound playback devices (car audio, audio components, etc.), computers, game machines, personal digital assistants (mobile computers, mobile phones, portable game machines, electronic books, etc.) An image reproduction apparatus provided with a recording medium (specifically, an apparatus provided with a display device capable of reproducing audio data stored in a recording medium such as a DVD (digital versatile disc) and displaying the stored image data) Etc. are included.

A specific mode of the electric device will be described with reference to FIG. FIG. 14A is an external view illustrating an example of a mobile phone 901. The cellular phone 901 includes a display unit 902, operation switches 903, and the like. By applying the liquid crystal display device described in FIG. 12 or the EL display device described in FIG. 13 to the display portion 902, the display portion 902 with less display unevenness and excellent image quality can be obtained.

FIG. 14B is an external view illustrating a configuration example of the digital player 911. The digital player 911 includes a display unit 912, an operation unit 913, an earphone 914, and the like. A headphone or a wireless earphone can be used instead of the earphone 914. Even when the screen size is about 0.3 inch to 2 inches by applying the liquid crystal display device described in FIG. 12 or the EL display device described in FIG. 13 to the display portion 912. A high-definition image and a large amount of character information can be displayed.

FIG. 14C is an external view of the electronic book 921. This electronic book 921 includes a display portion 922 and operation switches 923. The electronic book 921 may have a built-in modem, or may have a configuration in which the RFCPU in FIG. By applying the liquid crystal display device described in FIG. 12 or the EL display device described in FIG. 13 to the display portion 922, high-quality display can be performed.

  15 is another example of the structure of the mobile phone 8500 to which the present invention is applied. FIG. 15A is a front view, FIG. 15B is a rear view, and FIG. 15C is a development view. . The cellular phone 8500 is a so-called smartphone that has both functions of a telephone and a portable information terminal, has a built-in computer, and can perform various data processing in addition to voice calls.

  A cellular phone 8500 includes two housings 8501 and 1002. The housing 8501 includes a display portion 8511, a speaker 8512, a microphone 8513, operation keys 8514, a pointing device 8515, a camera lens 8516, an external connection terminal 8517, an earphone terminal 8518, and the like. The housing 8502 includes a keyboard 8521, An external memory slot 8522, a camera lens 8523, a light 8524, and the like are provided. An antenna is incorporated in the housing 8501. By applying the liquid crystal display device described in FIG. 12 or the EL display device described in FIG. 13 to the display portion 8511, a display portion with less display unevenness and high image quality can be obtained.

  In addition to the above structure, a non-contact IC chip, a small recording device, or the like may be incorporated.

  The display direction of the display portion 8511 changes as appropriate in accordance with the usage pattern. Since the camera lens 8516 is provided on the same surface as the display portion 8511, a videophone can be used. Further, a still image and a moving image can be taken with the camera lens 8523 and the light 8524 using the display portion 8511 as a viewfinder. The speaker 8512 and the microphone 8513 can be used for videophone calls, recording and playing sound, and the like as well as voice calls. With the operation keys 8514, incoming / outgoing calls, simple information input such as e-mail, screen scrolling, cursor movement, and the like can be performed. Further, the housing 8501 and the housing 8502 (FIG. 15A) which overlap with each other are slid and developed as shown in FIG. 15C, and can be used as a portable information terminal. In this case, smooth operation can be performed using the keyboard 8521 and the pointing device 8515. The external connection terminal 8517 can be connected to an AC adapter and various types of cables such as a USB cable, and charging and data communication with a personal computer or the like are possible. Further, a recording medium can be inserted into the external memory slot 8522 so that a larger amount of data can be stored and moved.

  In addition to the above functions, an infrared communication function, a television reception function, or the like may be provided.

  As described above, an electronic device or a lighting fixture can be obtained by using the light-emitting device according to the present invention. The applicable range of the light-emitting device according to the present invention is so wide that the light-emitting device can be applied to electronic devices in various fields.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

The figure which shows an example of the semiconductor substrate which concerns on this invention. Sectional drawing which shows the manufacturing process of the semiconductor substrate which concerns on this invention. 4A and 4B illustrate an example of a method for manufacturing a semiconductor substrate according to the present invention. Sectional drawing which shows the manufacturing process of the semiconductor substrate which concerns on this invention. Sectional drawing which shows the manufacturing process of the semiconductor substrate which concerns on this invention. Sectional drawing which shows the manufacturing process of the semiconductor substrate which concerns on this invention. 4A and 4B illustrate an example of a method for manufacturing a semiconductor device using a semiconductor substrate according to the present invention. 4A and 4B illustrate an example of a method for manufacturing a semiconductor device using a semiconductor substrate according to the present invention. FIG. 11 illustrates an example of a semiconductor device using a semiconductor substrate according to the present invention. FIG. 11 illustrates an example of a semiconductor device using a semiconductor substrate according to the present invention. FIG. 11 illustrates an example of a display device using a semiconductor substrate according to the present invention. FIG. 11 illustrates an example of a display device using a semiconductor substrate according to the present invention. FIG. 11 illustrates an example of a display device using a semiconductor substrate according to the present invention. FIG. 11 shows an electronic device using a semiconductor substrate according to the present invention. FIG. 11 shows an electronic device using a semiconductor substrate according to the present invention.

Explanation of symbols

101 support substrate 103 insulating film 104 insulating layer 105 first insulating layer 106 insulating film 107 second insulating layer 109 damaged layer 111 single crystal semiconductor substrate 113 damaged layer 114 single crystal semiconductor layer 115 single crystal semiconductor layer 117 insulating film 118 first First insulating layer 119 Second insulating layer 121 Ion beam

Claims (6)

A method for manufacturing a semiconductor substrate, wherein a single crystal semiconductor layer separated from a single crystal semiconductor substrate is formed over a supporting substrate having an insulating surface,
Ions are added to the single crystal semiconductor substrate to form a damaged layer in a predetermined depth region from the surface of the single crystal semiconductor substrate,
Forming a frame-shaped first insulating layer and a second insulating layer provided in an island shape in a region surrounded by the first insulating layer on the upper surface of the support substrate;
The support substrate is overlapped with the single crystal semiconductor substrate via the first and second insulating layers,
Carrying the support substrate and the single crystal semiconductor substrate into a vacuum chamber;
Depressurizing the inside of the vacuum chamber to reduce the gap between the single crystal semiconductor substrate and the support substrate, and then releasing the single crystal semiconductor substrate and the support substrate to the atmosphere.
Heat treatment is performed in a state where the single crystal semiconductor substrate and the support substrate are overlapped, and the single crystal semiconductor substrate is peeled off using the damaged layer as a cleavage plane, whereby the first and second insulations on the support substrate are separated. A method for manufacturing a semiconductor substrate, wherein a single crystal semiconductor layer separated from the single crystal semiconductor substrate is fixed over the layer. A method for manufacturing a semiconductor substrate, wherein a single crystal semiconductor layer separated from a single crystal semiconductor substrate is formed over a supporting substrate having an insulating surface,
Ions are added to the single crystal semiconductor substrate to form a damaged layer in a predetermined depth region from the surface of the single crystal semiconductor substrate,
Forming a frame-shaped first insulating layer and a second insulating layer provided in an island shape in a region surrounded by the first insulating layer on an upper surface of the single crystal semiconductor substrate;
The single crystal semiconductor substrate is overlapped with the support substrate via the first and second insulating layers,
Carrying the support substrate and the single crystal semiconductor substrate into a vacuum chamber;
Depressurizing the inside of the vacuum chamber to reduce the gap between the single crystal semiconductor substrate and the support substrate, and then releasing the single crystal semiconductor substrate and the support substrate to the atmosphere.
Heat treatment is performed with the single crystal semiconductor substrate and the support substrate overlapped, and the single crystal semiconductor substrate is peeled off using the damaged layer as a cleavage plane, whereby the first and second insulating layers of the support substrate A method for manufacturing a semiconductor substrate, in which the single crystal semiconductor layer separated from the single crystal semiconductor substrate is fixed. A method for manufacturing a semiconductor substrate, wherein a single crystal semiconductor layer separated from a single crystal semiconductor substrate is formed over a supporting substrate having an insulating surface,
Ions are added to the single crystal semiconductor substrate to form a damaged layer in a predetermined depth region from the surface of the single crystal semiconductor substrate,
Forming a recess in the support substrate;
Forming an insulating film covering the support substrate and the recess;
Patterning the insulating film, a frame-shaped first insulating layer, and a second insulating layer provided in an island shape in a region on the recess and surrounded by the first insulating layer; Forming,
The support substrate is overlapped with the single crystal semiconductor substrate via the first and second insulating layers,
Carrying the support substrate and the single crystal semiconductor substrate into a vacuum chamber;
Depressurizing the inside of the vacuum chamber to reduce the gap between the single crystal semiconductor substrate and the support substrate, and then releasing the single crystal semiconductor substrate and the support substrate to the atmosphere.
Heat treatment is performed in a state where the single crystal semiconductor substrate and the support substrate are overlapped, and the single crystal semiconductor substrate is peeled using the damaged layer as a cleavage plane, whereby the first and second insulations on the support substrate are separated. A method for manufacturing a semiconductor substrate, wherein a single crystal semiconductor layer separated from the single crystal semiconductor substrate is fixed over the layer. In any one of Claim 1 thru | or 3,
The method for manufacturing a semiconductor substrate, wherein the first insulating layer is formed with a width of 100 μm to 1 cm. In any one of Claims 1 thru | or 4,
A method for manufacturing a semiconductor substrate, wherein a gap between the single crystal semiconductor substrate and the support substrate after being released into the atmosphere is reduced to 0.5 atm or more and 1 atm or less from atmospheric pressure. A method for manufacturing a semiconductor device using the semiconductor substrate manufactured by the manufacturing method according to claim 1.
A method for manufacturing a semiconductor device, in which a semiconductor element including the single crystal semiconductor layer over the supporting substrate is manufactured.

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