JP2009140842A - Planar light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a planar light-emitting device which can effectively radiating an LED which generates heat and also is excellent in wiring workability. <P>SOLUTION: The planar light-emitting device 10 comprises a plurality of LED modules 12 configured so as to arrange a plurality of LEDs 18 and resistors 22 in series via a conductive path 20 printed on a ceramic board 16; and a non-conductive cover member 14 such that input and output power circuits 30a and 30b are formed by print on the back face side, and a round hall 26 and a rectangular hole 28 are formed in a position respectively corresponding to each of the LED 18 and the resistor 22 disposed on the LED modules 12. The predetermined-size planar light-emitting device 10 is configured by superimposing and covering such the cover member 14 on the LED modules 12; and electrically connecting an input and output terminal of the LED modules 12, and a distribution terminal of the cover member 14. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a planar light emitting device using a light emitting diode, and more particularly to a structure of a planar light emitting device that can illuminate a wide area by combining a plurality of light emitting diode modules.

  Conventionally, various light-emitting devices for illumination using light-emitting diodes (LEDs) have been proposed. For example, in Japanese Patent Application Laid-Open No. 2004-310090 (Patent Document 1), printing is performed as an illumination signboard. A unit configured to arrange LEDs on the top surface of the circuit board and a transformer on the bottom surface of the printed circuit board is disposed inside the case in a form in which the case is filled with a synthetic resin material. In addition, the power supply voltage is supplied by wiring that is attached to the mounting surface via a bracket protruding from the case, while penetrating the side surface of the case and connected to the lower surface of the printed circuit board. A light emitting device (LED assembly) has been revealed. By mounting a plurality of such light-emitting devices on the mounting surface and connecting the plurality of light-emitting devices to each other by wiring, it becomes possible to supply a power supply voltage to the plurality of light-emitting devices, and the LEDs emit light. Therefore, the signboard can be made to emit light in a desired shape.

  However, in a printed circuit board used in such a conventional light emitting device, if a resin material such as glass epoxy, which is widely used, is used as the substrate material, heat dissipation of the LED that generates heat is effective. Therefore, there is an inherent problem that a large amount of power is supplied to brighten the LED main body so that the performance is significantly impaired. On the other hand, when a metal material such as aluminum or copper is used as the substrate material, the heat dissipation problem is avoided because the heat dissipation of the LED is performed due to the heat dissipation characteristics inherent to the metal material. However, a circuit pattern for supplying power to the LED cannot be printed directly on the substrate. For this purpose, an appropriate insulating layer is provided on the substrate, and a predetermined circuit pattern is printed thereon. In this case, however, it takes time and labor to provide an insulating layer on the substrate. In addition, if a thin insulating layer is used, effective electrical insulation is difficult to achieve, insulation may be insufficient, and if a hole is provided on the substrate, the circuit pattern may be damaged. There was even a danger of a short circuit.

  In such a light emitting device, a plurality of the light emitting devices are connected and used, and the light emitting devices are connected to each other via lead wires or the like. Therefore, the wiring work takes time, and there is a possibility that erroneous wiring may occur, and that such wiring may cause problems such as obstructing the mounting of the light emitting device on the mounting surface. there were.

JP 2004-310090 A

  Here, the present invention has been made in the background of such circumstances, and the problem to be solved is a sheet shape that improves heat dissipation from the LED that generates heat and has excellent wiring workability. The object is to provide a light emitting device.

  The present invention can be suitably implemented in various aspects as listed below in order to solve the problems described above or the problems grasped from the description of the entire specification and the drawings. Each aspect described below can be adopted in any combination. It should be noted that the aspects or technical features of the present invention are not limited to those described below, and can be recognized based on the description of the entire specification and the inventive concept disclosed in the drawings. Should be understood.

  (1) A plurality of light emitting diodes and resistors or constant current circuits are mounted on a ceramic substrate having a predetermined shape, connected in series via a conductive path printed on the ceramic substrate, and the ceramic substrate. A plurality of light emitting diode modules each having an input / output terminal of the conductive path formed in a planar shape, and the light emitting diode modules arranged in a matrix in the vertical and horizontal directions are superimposed on each other. In addition, an opening portion that penetrates in the thickness direction is provided at a portion corresponding to each of the light emitting diode placement locations in each light emitting diode module so that each light emitting diode is exposed to the surface side through the opening portion. One constructed non-conductive cover member, an input / output power circuit printed on the non-conductive cover member, and the non-conductive cover part A plurality of power distribution terminals connected to the input / output power circuit, and connecting means for connecting the plurality of power distribution terminals and the input / output terminals of the plurality of light emitting diode modules, respectively. A planar light emitting device comprising:

  (2) The planar light emitting device according to the aspect (1), wherein the input / output power circuit is printed on the back side of the non-conductive cover member.

  (3) The input / output power circuit is configured to include a first circuit and a second circuit provided in parallel to each other in one direction of the non-conductive cover member, and the first and second circuits. According to the aspect (1) or the aspect (2), the distribution terminals are respectively formed at predetermined intervals in the first and second branch circuits extending from the circuit at predetermined intervals. Planar light emitting device.

  (4) The distribution terminal connects the two land portions to the planar back surface side and the front surface side land portion respectively provided on the back surface portion and the front surface portion corresponding to each other of the non-conductive cover member. Therefore, the planar light emitting device according to any one of the above aspects (1) to (3), including a cylindrical portion disposed so as to penetrate the non-conductive cover member.

  (5) The connecting means is a conductive metal solid disposed in the cylindrical portion of the distribution terminal arranged to penetrate the non-conductive cover member, and between the solid and the cylindrical portion. It is comprised from the solidified material of the electroconductive metal melt accommodated and filled, The planar shape as described in said aspect (4) by which the said electricity distribution terminal and the said input / output terminal are connected by these solid and solidified material Light emitting device.

  (6) The light emitting diode module according to any one of the above aspects (1) to (5), wherein the light emitting diode modules are arranged in a matrix so that the light emitting diodes are arranged at equal intervals in the vertical direction and the horizontal direction. Planar light emitting device.

  As described above, in the LED module in the planar light emitting device according to the present invention, the LED and the resistor or the constant current circuit are mounted on the ceramic substrate, and further, via the conductive path printed on the ceramic substrate. Therefore, even if the LED generates heat, the heat generated by the LED is advantageously transmitted to the ceramic substrate due to the good heat dissipation characteristics of the ceramic substrate even if the LED generates heat. This is because heat can be effectively dissipated. For this reason, even if a large amount of power is supplied to the LED module, it is possible to effectively suppress or prevent the LED from becoming high temperature, so that each LED can emit light even more brightly. Thus, a planar light emitting device capable of bright illumination can be advantageously provided.

  In addition, in the planar light emitting device according to the present invention, a non-conductive cover member is superimposed on a plurality of LED modules to cover the LED modules, and each LED is provided on the non-conductive cover member. The LED is configured to be exposed to the surface side through the opening, while the power distribution terminal connected to the input / output power circuit printed on the non-conductive cover member, the input / output terminal of the LED module, Since each LED module is connected via an input / output power circuit printed on a non-conductive cover member, the electrical connection is extremely simple. In addition, since the connection work is extremely simple, the work time is remarkably shortened. In addition, since wiring by lead wires or the like is not required, problems such as incorrect wiring between LED modules can be avoided.

  Hereinafter, in order to clarify the present invention more specifically, representative embodiments of a planar light emitting device according to the present invention will be described in detail with reference to the drawings.

  First, FIG. 1 shows an example of a planar light emitting device according to the present invention partially in a perspective view (in a portion substantially corresponding to one LED module), and FIG. The form before the combination of the LED module and the non-conductive cover member is shown in a perspective view, and FIG. 3 shows the form of the back surface of the non-conductive cover member in the bottom view. Yes. As shown in FIGS. 1 and 2, the planar light emitting device 10 according to the present invention has the LED module 12 and the non-conductive cover member 14 overlapped so that the LED module 12 is on the lower side. And connected and integrated in an integrated form.

  As shown in FIG. 2, one LED module 12 includes a rectangular ceramic substrate 16 made of a ceramic material such as alumina and having a predetermined thickness. On the ceramic substrate 16, six LED modules 12 are provided. LEDs 18 are arranged at predetermined intervals in the vertical direction and the horizontal direction, and a conductive path 20 connecting the LEDs 18 in series is formed on the ceramic substrate 16 according to a known printing technique. Has been. In addition, the resistor 22 is disposed on the conductive path 20 in a substantially central portion of the ceramic substrate 16, and is connected in series with the LED 18 through the conductive path 20. The electric power supplied to each LED 18 through the conductive path 20 is controlled by the resistor 22. Here, the LED 18 and the resistor 22 are mounted on the ceramic substrate 16 by surface mounting. Further, at both ends of the conductive path 20, a plus terminal 24 a and a minus terminal 24 b as input / output terminals are both planar terminals having a predetermined area. Here, in the same manner as the conductive path 20, printing is performed. Are integrally provided on the ceramic substrate 16.

  Further, the non-conductive cover member 14 is shown in a partial size corresponding to the size of one LED module 12 in FIGS. 1 and 2, but a plurality of LED modules arranged. 12 is used in one plate-like body that is large enough to cover 12. That is, FIG. 4 shows a form viewed from the upper surface side of the cover member 14 in a state where the cover member 14 is overlaid on the six LED modules 12 arranged and covered. However, as shown there, the cover member 14 as a whole has a length in the vertical direction (length in the vertical direction in FIG. 4) longer than the length of the two LED modules 12 by a predetermined length. The length in the lateral direction (the length in the left-right direction in FIG. 4) is formed in a substantially rectangular shape having a predetermined length longer than the length of three LED modules 12. In order to advantageously obtain the cover member 14 having such a size, a resin material made of a material such as glass epoxy is used here as the material. Also, as shown in FIGS. 1 and 2, such a cover member 14 has a thickness at a corresponding portion of the LED 18 and the resistor 22 disposed on each LED module 12 superimposed thereon. Six round holes 26 and one rectangular hole 28 penetrating in the direction are provided as openings, and the six LEDs 18 of each LED module 12 can be exposed to the surface side through the six round holes, respectively. In the rectangular hole 28, the resistor 22 can be exposed to the surface side.

  Further, on the back side of the cover member 14, as shown in FIG. 3, an input / output power circuit composed of the first circuit 30 a and the second circuit 30 b is connected to a common line for each LED module 12. In this way, on both sides in the longitudinal direction of the cover member 14, they are formed by printing so as to extend in parallel to each other and in the lateral direction of the cover member 14. The first and second circuits 30a and 30b are provided so as to be close to one side at both ends thereof, and a positive terminal and a negative terminal are formed at the close ends. The terminals can be connected to an external power source or another planar light emitting device according to the present invention by connection using a lead wire or the like. Further, a plurality of first branch circuits 33a (three in the present embodiment) are formed extending from the first circuit 30a in the horizontal direction at a predetermined interval and extending in the vertical direction toward the second circuit 30b. And a plurality of second branch circuits 33b (three in this embodiment) extending from the second circuit 30b in the vertical direction toward the first circuit 30a at predetermined intervals in the horizontal direction. Has been. Here, the first and second branch circuits 33a and 33b are provided alternately in the horizontal direction.

  In the first and second branch circuits 33a and 33b, the portion located at the end of the side circuit formed so as to extend in the horizontal direction from the first and second branch circuits 33a and 33b has an annular plane plus-side back surface land of a predetermined size. A portion 32a and a negative side rear surface land portion 32b are provided. Further, as shown in FIG. 2, as shown in FIG. 2, an annular surface-shaped plus-side surface land portion 34 a and a minus-side surface land portion 34 b are also provided on the surface side portion of the cover member 14 corresponding to the two back surface land portions 32 a and 32 b. , Respectively, so as to be electrically connected to each other. Along with the cover member 14, a plus side through hole forming cylinder part 36 a and a minus side through hole forming cylinder part 36 b are provided so as to penetrate the two front surface land parts 34 a and 34 b and the back surface land parts 32 a and 32 b, respectively. The front surface land portions 34a and 34b and the rear surface land portions 32a and 32b are connected to each other through the through-hole forming cylinder portions 36a and 36b. Note that, here, the front surface land portions 34a and 34b, the rear surface land portions 32a and 32b, and the through-hole forming cylinder portions 36a and 36b are each specifically a cover member as shown in FIG. 14 is constituted by a cylindrical electrode fitting 46 which is disposed so as to pass through 14 and has flange portions at both ends. Therefore, here, the distribution terminal is configured to include the two front surface land portions 34a and 34b and the back surface land portions 32a and 32b. In each of the second branch circuits 33a and 33b, two are provided at predetermined intervals in the vertical direction.

  In the present invention, a plurality of the LED modules 12 as described above are used, and those arranged in a matrix in the vertical direction and the horizontal direction, and the predetermined cover member 14, as shown in FIG. 14 are placed on top of each other, and if necessary, they are integrated by bonding, and a positive terminal 24a and a negative terminal 24b, which are input / output terminals provided at both ends of the conductive path 20 of the LED module 12, are provided. As shown in FIG. 1, each of the cover members 14 is electrically connected to the plus-side back surface, the front surface land portions 32a and 34a and the negative-side back surface and the front surface land portions 32b and 34b, which constitute the power distribution terminals. It is set as the structure which shows an assembly | attachment state. At that time, each LED 18 in the LED module 12 is inserted and accommodated in each round hole 26 of the cover member 14, and in the resistor 22, the LED 18 is positioned in the rectangular hole 28. Since the LED 18 and the resistor 22 are exposed on the surface side of the cover member 14 because they are housed, the planar illumination by each LED 18 is not hindered.

  Incidentally, as shown in FIG. 4, even if the LED modules 12 are arranged in a matrix, the input / output terminals (24 a, 24 b) provided in the conductive paths 20 of the LED modules 12 are one cover member 14. By connecting to the input / output power circuit (30a, 30b) provided on the back surface of the LED module, the LED modules 12 are connected in parallel, and thus the LEDs 18 of the LED modules 12 are connected. On the other hand, it is configured such that predetermined power is supplied and light can be emitted.

  Also, a distribution terminal configuration land portion formed at a predetermined interval between the input / output terminals (24a, 24b) provided in the conductive path 20 of the LED module 12 and the branch circuits (33a, 33b) provided in the cover member 14. The electrical connection with (32a, 34a; 32b, 34b) can be realized by using various known connection forms, but here, as shown in FIG. A conductive metal solid is accommodated and disposed in through-hole forming cylinder portions 36a and 36b provided so as to penetrate the land portion arrangement site, and the inner periphery of the solid and the through-hole forming cylinder portions 36a and 36b. It can be realized by using a solidified product of a conductive metal melt filled between the surfaces.

  More specifically, as shown in FIG. 5 (a), the round terminal electrode 40 is accommodated in the through hole forming cylinder portion 36b of the electrode fitting 46, which is in the through hole, and these round terminals By filling the gap between the mold terminal electrode 40 and the inner wall surface of the electrode fitting 46 (through-hole forming cylinder portion 36b) with a molten solder 42 as a conductive metal melt and solidifying it, FIG. As shown in FIGS. b) and (c), a connecting portion 44b constituted integrally by the round terminal electrode 40 accommodated in the electrode fitting 46 (through-hole forming cylinder portion 36b) and the solidified solder 42. Thus, the connection between the target input terminal 24b and the land portions (32b, 34b) of the distribution terminal can be effectively and firmly realized. In FIG. 5, only the connection between the distribution terminal constituting land portions (32b, 34b) of the cover member 14 and the negative terminal 24b side of the LED module 12 is shown, but the positive terminal 24a side of the LED module 12 is shown. Similarly, the distribution terminal constituting land portions (32a, 34a) of the cover member 14 and the plus terminal 24a of the LED module 12 are connected by the round terminal electrode 40 and the solidified solder 42 to form the connection portion 44a. It has come to be.

  Thus, in the LED module 12 of the exemplary planar light emitting device 10, the LED 18 and the resistor 22 are mounted on the conductive path 20 printed on the ceramic substrate 16 made of a ceramic material such as alumina. Therefore, even if the LED 18 is supplied with a large amount of power and generates heat, the heat dissipation of the generated LED 18 is effective due to the excellent heat dissipation characteristics of the ceramic substrate 16. It can be done. Therefore, when a large amount of electric power is supplied, the LED 18 can emit light effectively and brightly according to the electric power. Therefore, the planar light emitting device 10 capable of bright illumination can be advantageously used. It can be provided.

  Moreover, in such a planar light emitting device 10, the LED module 12 and the cover member 14 are overlapped with the cover member 14 facing up to cover the LED module 12, and the conductive path 20 of the LED module 12. The input / output terminals (24a, 24b) formed at the end portions of the cover member 14 are electrically connected to the distribution terminal constituting land portions (32a, 34a; 32b, 34b) in the cover member 14 by the round terminal electrode 40 and the solder 42. Each LED module 12 is connected in parallel by the first and second circuits 30a, 30b formed on the back surface of the cover member 14. -ing Therefore, the troublesome and time-consuming work of wiring work such as lead wires can be omitted, and the LED module 12 can be quickly and extremely easily connected to the cover member 14. The working time will be significantly shortened. Further, since wiring work such as lead wires is not necessary, problems such as incorrect wiring between the LED modules 12 can be effectively avoided.

  Even when the planar light emitting device 10 is configured by stacking a single cover member 14 so as to cover the LED modules 12 arranged, the cover members 14 each have A round hole 26 and a rectangular hole 28 are provided corresponding to each LED 18 and resistor 22 in the LED module 12, so that each LED 18 and resistor 22 is exposed to the surface side from these holes 26 and 28. Therefore, even if it is covered with the cover member 14, there is no obstacle to the illumination of each target LED 18, and the intended illumination can be performed effectively.

  By the way, it should be understood that the present invention can be carried out in various modes according to the technical idea of the present invention in addition to the above-described embodiments.

  For example, the input / output power circuits 30a and 30b and the branch circuits 33a and 33b are formed on the back side of the cover member 14 in the above-described embodiment. Thus, the LED module 12 may be configured so that power can be supplied. For this reason, even if each circuit is formed on the surface side of the cover member 14, there is no problem.

  Further, the number of LEDs 18 mounted on the ceramic substrate 16 of the LED module 12 is not limited to six as illustrated, and an appropriate number is selected according to the size of the ceramic substrate 16. Furthermore, even if the arrangement intervals are not limited, the arrangement intervals may be changed according to the application of the planar light emitting device 10 as well as the equal intervals as illustrated. The ceramic substrate 16 is desirably made of an alumina material as illustrated, but of course, other known various ceramic materials can also be used. And such a ceramic substrate (16) is used in the practical size which can be provided with each ceramic material, and LED obtained using the ceramic substrate (16) of such a practical size is used. A plurality of modules (12) are arranged to form a planar light emitting device 10 having a target size.

  Furthermore, in the above-described embodiment, the cover member 14 has a length in the vertical direction that is a predetermined length longer than the length of the two LED modules 12 and a length in the horizontal direction of the three LED modules 12. It is formed as a substantially rectangular plate-like body having a predetermined length longer than the length of the minute, but is not limited to such an exemplary size, Depending on the use of the light-emitting device 10, the cover member 14 is formed in a practical size that can be provided. In addition, the cover member 14 can be formed by using various known materials that are non-conductive. In particular, it is desirable to use a known material such as glass epoxy, and thereby, a planar shape. One non-conductive cover member of a necessary size constituting the light emitting device 10 can be advantageously obtained. As the opening provided on the cover member 14 for exposing the LED 18 and the like to the surface side, various shapes other than the shapes such as the round hole 26 and the rectangular hole 28 as illustrated are appropriately employed. And provided as a hole penetrating the cover member 14.

  Furthermore, the conductive path 20 in the LED module 12 and the input / output power circuits (30a, 30b) and branch circuits (33a, 33b) formed on the back surface of the cover member 14 on the opposite side of the LED module 12 are the same as in the conventional case. In addition, although it can be easily formed by printing, there are also input / output terminals (24a, 24b) in the LED module 12 and land portions (32a, 34a; 32b, 34b) of the distribution terminals in the cover member 14. However, it is also possible to form them by a normal printing method, and furthermore, the distribution terminals and input / output terminals are formed using electrode fittings (46) of well-known materials and forms. Is also possible.

  In the illustrated embodiment, the LED module 12 and the cover member 14 are connected by the solder 42 via the round terminal electrode 40 between the input / output terminals and the distribution terminals, In addition, the LED module 12 and the cover member 14 can be bonded together by using an appropriate adhesive so as to be firmly integrated.

  In addition, as shown in FIG. 1 and the like, the planar light emitting device 10 having a structure in which the LED module 12 and the cover member 14 are combined and coupled is generally accommodated in an appropriate accommodation case or an appropriate accommodation case. While being held at the periphery by a frame, it can be applied in a form in which a transparent resin is molded in each round hole 26 or rectangular hole 28.

  In the illustrated specific example, in the conductive path 20 printed on the LED module 12, a resistor 22 for controlling the current flowing through each LED 18 is arranged. Of course, a well-known constant current circuit may be provided in place of the resistor 22 to control the current flowing through each LED 18.

  In addition, although not enumerated one by one, the present invention can be carried out in a mode with various changes, modifications, improvements, etc. based on the knowledge of those skilled in the art. It goes without saying that any one of them falls within the scope of the present invention without departing from the spirit of the present invention.

It is a perspective partial explanatory view showing an example of a planar light emitting device according to the present invention. It is a perspective partial explanatory view which shows the form before superposition | stacking of the LED module and cover member which are overlaid in order to obtain the planar light-emitting device shown by FIG. It is a bottom view which shows the form of the back surface side of the cover member shown by FIG. FIG. 2 is an explanatory plan view showing an electrical connection form between a cover member and an LED module in the planar light emitting device shown in FIG. 1. It is explanatory drawing which shows an example of the connection form of the input / output terminal of an LED module, and the electricity distribution terminal of a cover member, Comprising: (a) is the state before arrange | positioning a round terminal electrode in the through hole provided in the cover member (B) is a perspective partial explanatory view showing a form formed by soldering in such a state that such a round terminal electrode is inserted and arranged, and forming a connection portion, (C) is CC sectional expanded explanatory drawing in (b).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light-emitting device 12 LED module 14 Nonelectroconductive cover member 16 Ceramic substrate 18 LED 20 Conductive path 22 Resistor 24a Positive terminal 24b Negative terminal 26 Round hole 28 Rectangular hole 30a First circuit 30b Second circuit 32a Positive side back surface land Portion 32b Negative side rear surface land portion 34a Positive side surface land portion 34b Negative side surface land portion 36a Positive side through hole forming cylinder portion 36b Negative side through hole forming cylinder portion 40 Round terminal electrode 42 Solder 44a, 44b Connection portion 46 Electrode fitting

Claims (6)

  A plurality of light-emitting diodes and resistors or constant current circuits are mounted on a ceramic substrate having a predetermined shape, connected in series via a conductive path printed on the ceramic substrate, and on the ceramic substrate A plurality of light emitting diode modules each having an input / output terminal of a conductive path formed into a planar shape, and the light emitting diode modules arranged in a matrix form in the vertical and horizontal directions are overlaid to cover them. In addition, an opening that penetrates in the thickness direction is provided at a portion corresponding to each of the light emitting diode placement locations in each light emitting diode module, and each light emitting diode is exposed to the surface side through the opening. A sheet of non-conductive cover member, an input / output power circuit printed on the non-conductive cover member, and the non-conductive cover member A plurality of power distribution terminals connected to the input / output power circuit, and connecting means for connecting the plurality of power distribution terminals and the input / output terminals of the plurality of light emitting diode modules, respectively. A planar light emitting device comprising:   The planar light-emitting device according to claim 1, wherein the input / output power circuit is printed on the back side of the non-conductive cover member.   The input / output power circuit is configured to include a first circuit and a second circuit provided in parallel to each other in one direction of the non-conductive cover member, and from the first and second circuits, 3. The planar light emitting device according to claim 1, wherein the distribution terminals are formed at predetermined intervals in first and second branch circuits extending at predetermined intervals, respectively.   For connecting the two land portions, the distribution terminal is a planar back surface side and a front surface side land portion respectively provided on the back surface portion and the surface portion corresponding to each other of the non-conductive cover member, The planar light-emitting device according to any one of claims 1 to 3, further comprising a cylindrical portion disposed so as to penetrate the non-conductive cover member.   The connecting means is accommodated and filled between the solid of the conductive metal disposed in the cylindrical portion of the distribution terminal arranged so as to penetrate the non-conductive cover member, and the solid and the cylindrical portion. The planar light emitting device according to claim 4, wherein the distribution terminal and the input / output terminal are connected to each other by the solidified and solidified material. The planar light emitting device according to any one of claims 1 to 5, wherein the light emitting diode modules are arranged in a matrix so that the light emitting diodes are arranged at equal intervals in a vertical direction and a horizontal direction.

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