JP2009138183A5 - - Google Patents

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Publication number
JP2009138183A5
JP2009138183A5 JP2008273282A JP2008273282A JP2009138183A5 JP 2009138183 A5 JP2009138183 A5 JP 2009138183A5 JP 2008273282 A JP2008273282 A JP 2008273282A JP 2008273282 A JP2008273282 A JP 2008273282A JP 2009138183 A5 JP2009138183 A5 JP 2009138183A5
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JP
Japan
Prior art keywords
sensitive adhesive
pressure
adhesive sheet
polyol
energy
Prior art date
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Application number
JP2008273282A
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Japanese (ja)
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JP5069662B2 (en
JP2009138183A (en
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Priority to JP2008273282A priority Critical patent/JP5069662B2/en
Priority claimed from JP2008273282A external-priority patent/JP5069662B2/en
Priority to KR1020080111886A priority patent/KR101454183B1/en
Priority to US12/268,813 priority patent/US20090123746A1/en
Publication of JP2009138183A publication Critical patent/JP2009138183A/en
Publication of JP2009138183A5 publication Critical patent/JP2009138183A5/ja
Application granted granted Critical
Publication of JP5069662B2 publication Critical patent/JP5069662B2/en
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Claims (4)

基材上にエネルギー線硬化型粘着剤層が形成された粘着シートであって、前記エネルギー線硬化型粘着剤層が、側鎖に不飽和基を有するエネルギー線硬化型アクリル共重合体と、エネルギー線硬化型ウレタンアクリレートとを含み、
前記エネルギー線硬化型ウレタンアクリレートが、
イソシアナートユニットと、２種類以上のポリオールを含むポリオールユニットと、（メタ）アクリロイル基とを有する化合物であり、
前記ポリオールユニットが、ポリプロピレングリコールを含む分岐鎖があるポリオールと、ポリエチレングリコールを含む分岐鎖がないポリオールとを含むことを特徴とする粘着シート。 An adhesive sheet in which an energy beam curable pressure-sensitive adhesive layer is formed on a substrate, wherein the energy beam curable pressure-sensitive adhesive layer has an energy beam curable acrylic copolymer having an unsaturated group in a side chain, and energy Wire curable urethane acrylate,
The energy ray curable urethane acrylate is
And isocyanate units, a polyol unit comprising two or more polyols, Ri compound der having a (meth) acryloyl group,
The pressure-sensitive adhesive sheet , wherein the polyol unit contains a polyol having a branched chain containing polypropylene glycol and a polyol having no branched chain containing polyethylene glycol . 前記ポリプロピレングリコールと前記ポリエチレングリコールとのモル比が、９：１〜１：９の範囲内であることを特徴とする請求項１に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 1, wherein a molar ratio of the polypropylene glycol and the polyethylene glycol is in a range of 9: 1 to 1: 9 . 前記ポリプロピレングリコールと前記ポリエチレングリコールとのモル比が、９：１〜１：４であることを特徴とする請求項２に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 2, wherein a molar ratio of the polypropylene glycol to the polyethylene glycol is 9: 1 to 1: 4 . エネルギー線硬化後の状態における前記エネルギー線硬化型粘着剤層の破断応力が１０ＭＰａ以上であり、破断伸度が１５％以上であることを特徴とする請求項１〜３のいずれか一項に記載の粘着シート。 Breaking stress of the energy ray-curable pressure-sensitive adhesive layer in a state after the energy ray curing is at least 10 MPa, according to any one of claims 1 to 3 elongation at break is equal to or not less than 15% Adhesive sheet.
JP2008273282A 2007-11-12 2008-10-23 Adhesive sheet Active JP5069662B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008273282A JP5069662B2 (en) 2007-11-12 2008-10-23 Adhesive sheet
KR1020080111886A KR101454183B1 (en) 2007-11-12 2008-11-11 Adhesive sheet
US12/268,813 US20090123746A1 (en) 2007-11-12 2008-11-11 Adhesive sheet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007293329 2007-11-12
JP2007293329 2007-11-12
JP2008273282A JP5069662B2 (en) 2007-11-12 2008-10-23 Adhesive sheet

Publications (3)

Publication Number Publication Date
JP2009138183A JP2009138183A (en) 2009-06-25
JP2009138183A5 true JP2009138183A5 (en) 2012-04-05
JP5069662B2 JP5069662B2 (en) 2012-11-07

Family

ID=40869106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008273282A Active JP5069662B2 (en) 2007-11-12 2008-10-23 Adhesive sheet

Country Status (1)

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JP (1) JP5069662B2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5764518B2 (en) * 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
JP5651526B2 (en) * 2011-04-28 2015-01-14 藤森工業株式会社 Hard coat film and touch panel using the same
CN104271694B (en) 2012-05-14 2017-03-22 琳得科株式会社 Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
WO2014003056A1 (en) * 2012-06-29 2014-01-03 日立化成株式会社 Method for producing semiconductor device
CN105143388B (en) * 2013-04-22 2016-11-09 Dic株式会社 Ultraviolet-curing adhesive composition and binding agent
JP6497914B2 (en) * 2013-12-10 2019-04-10 日本合成化学工業株式会社 Pressure-sensitive adhesive composition, pressure-sensitive adhesive, pressure-sensitive adhesive sheet, surface-protective pressure-sensitive adhesive, surface-protective pressure-sensitive adhesive sheet
WO2015098307A1 (en) * 2013-12-25 2015-07-02 Dic株式会社 Ultraviolet curable adhesive composition, adhesive film and method for producing adhesive film
JP2017031353A (en) * 2015-08-04 2017-02-09 住友ベークライト株式会社 Tape for temporary fixing
CN108174616B (en) * 2015-10-05 2022-03-29 琳得科株式会社 Semiconductor processing sheet
CN108713241B (en) * 2016-03-10 2023-04-11 琳得科株式会社 Dicing die bonding sheet, method for manufacturing semiconductor chip, and method for manufacturing semiconductor device
JP6034522B1 (en) * 2016-03-17 2016-11-30 古河電気工業株式会社 Adhesive tape for semiconductor wafer processing and method for processing semiconductor wafer
JP6461892B2 (en) * 2016-12-06 2019-01-30 リンテック株式会社 Surface protection sheet
KR20220075341A (en) * 2019-10-04 2022-06-08 린텍 가부시키가이샤 Adhesive sheet and manufacturing method of adhesive sheet
JPWO2021215247A1 (en) * 2020-04-23 2021-10-28
KR20230008803A (en) * 2020-06-10 2023-01-16 미쓰이 가가쿠 토세로 가부시키가이샤 Methods of manufacturing electronic devices
KR20230007493A (en) * 2020-06-10 2023-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 Methods of manufacturing electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345131A (en) * 1999-06-03 2000-12-12 Nippon Synthetic Chem Ind Co Ltd:The Re-release type adhesive composition
JP2006124549A (en) * 2004-10-29 2006-05-18 Jsr Corp Photo-curable resin composition and adhesive for optical discs
JP5049612B2 (en) * 2007-02-28 2012-10-17 リンテック株式会社 Adhesive sheet
JP5049620B2 (en) * 2007-03-20 2012-10-17 リンテック株式会社 Adhesive sheet

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