JP2009136119A - Actuator and image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an actuator for which a degree of freedom in designing can be ensured when designing a vibration section and a coil and which can achieve a high bonding strength and a high dimensional accuracy between the vibration section and the coil when the vibration section and the coil are bonded together, and also to provide an image forming apparatus provided with the actuator. <P>SOLUTION: The actuator 1 is equipped with the vibration section having a moving plate 21, the vibration section 20 with shaft members 22 and 23 for rotatably supporting the moving plate 21, and the coil 212 which is provided on the moving plate 21 and has an electric conductivity, wherein the moving plate 21 and the coil 212 are bonded together via a bonding film 5a. The bonding film 5a includes an Si skeleton containing a siloxane bond and having a random atomic structure and a leaving group which bonds with the Si skeleton. By giving energy to at least a portion of the bonding film 5a, the leaving group existing near the surface of the bonding film 5a is detached from the Si skeleton, and the moving plate 21 and the coil 212 are bonded by an adhesiveness developed on the surface of the bonding film 5a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an actuator and an image forming apparatus.

  For example, an optical scanner for performing drawing by optical scanning with a laser printer or the like is known that uses an actuator having a structure constituting a torsional vibrator (see, for example, Patent Document 1). In the actuator disclosed in Patent Document 1, a movable part having a reflection mirror is pivotally supported on a frame-like support part via a pair of torsion bars. A coil is provided (joined) on the movable part, and a thin-film magnet is provided on the support part. By energizing the coil disposed in the magnetic field of the magnet, the movable part is rotated with the torsional deformation of each torsion bar, and the light reflected by the reflection mirror is scanned.

By the way, in such an actuator, the movable part and the coil are assembled, for example, by bonding them with a photosensitive adhesive or an elastic adhesive.
However, it is extremely difficult to strictly control the supply amount of the adhesive when supplying the adhesive between the movable part and the coil. For this reason, the amount of the adhesive to be supplied cannot be made uniform, and there arises a problem that the distance between the movable part and the coil becomes nonuniform, that is, the dimensional accuracy deteriorates. Further, depending on the environment where the actuator is installed (used), the adhesive may be altered or deteriorated. For this reason, there also exists a problem that joint strength falls.
On the other hand, a method of joining members by a solid joining method is also known. This solid bonding is a method in which members are directly bonded without interposing an adhesive layer such as an adhesive. For example, methods such as a silicon direct bonding method and an anodic bonding method are known.

However, solid bonding has limitations (problems) when designing an actuator as described below.
・ Materials of members that can be joined are limited.
-Since a heat treatment at a high temperature (for example, about 700 to 800 ° C) is involved in the joining process, the member may be deformed depending on the material of the member.
-The atmosphere in the bonding process is limited to a reduced pressure atmosphere.
-Some areas cannot be partially joined.

Japanese Patent Laid-Open No. 2007-14130

  An object of the present invention is to provide an actuator that can secure a degree of design freedom when designing a vibration part and a coil, and has high joint strength and dimensional accuracy when the vibration part and the coil are joined. An image forming apparatus is provided.

Such an object is achieved by the present invention described below.
The actuator of the present invention includes a movable plate having a plate shape and opposed to each other via the movable plate, and is connected to the movable plate to support the movable plate so as to be rotatable about an axis parallel to the surface. A vibrating portion having a pair of connecting portions to
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a Si skeleton including a siloxane (Si-O) bond and a random atomic structure, and a leaving group bonded to the Si skeleton,
In the bonding film, energy is applied to at least a part of the region, so that the leaving group existing near the surface of the bonding film is detached from the Si skeleton and is expressed in the region on the surface of the bonding film. The vibrating portion and the coil are bonded to each other by the adhesive property.
Thereby, the design freedom at the time of designing a vibration part and a coil can be ensured, and an actuator having high joint strength and dimensional accuracy when the vibration part and the coil are joined can be obtained.

In the actuator of the present invention, it is preferable that the sum of the content ratio of Si atoms and the content ratio of O atoms is 10 to 90 atomic% among atoms obtained by removing H atoms from all atoms constituting the bonding film.
Thus, in the bonding film, Si atoms and O atoms form a strong network, and the bonding film itself becomes stronger. For this reason, the bonding film exhibits particularly high bonding strength with respect to the vibration part and the coil.

In the actuator of the present invention, it is preferable that the abundance ratio of Si atoms and O atoms in the bonding film is 3: 7 to 7: 3.
Thereby, the stability of the bonding film is increased, and the vibrating portion and the coil can be bonded more firmly.
In the actuator of the present invention, the crystallinity of the Si skeleton is preferably 45% or less.
As a result, the Si skeleton includes a sufficiently random atomic structure. For this reason, the characteristics of the Si skeleton become obvious, and the dimensional accuracy and adhesiveness of the bonding film become more excellent.

In the actuator of the present invention, the leaving group may be an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, a halogen atom, or each of these atoms bonded to the Si skeleton. It is preferably composed of at least one selected from the group consisting of arranged atomic groups.
These leaving groups are relatively excellent in binding / leaving selectivity by applying energy. For this reason, such a leaving group can make the adhesiveness of the bonding film higher.

In the actuator of the present invention, the leaving group is preferably an alkyl group.
Since an alkyl group has high chemical stability, a bonding film containing an alkyl group as a leaving group has excellent weather resistance (with respect to the environment in which it is used).
In the actuator of the present invention, it is preferable that the bonding film is formed by a plasma polymerization method.
Thereby, the bonding film becomes dense and homogeneous. And a vibration part and a coil can be joined especially firmly. Furthermore, the bonding film manufactured by the plasma polymerization method is maintained for a relatively long time in a state where energy is applied and activated. For this reason, the manufacturing process of the actuator can be simplified and improved in efficiency.

In the actuator of the present invention, it is preferable that the bonding film is composed of polyorganosiloxane as a main material.
As a result, the bonding film itself has excellent mechanical properties. In addition, a bonding film exhibiting particularly excellent adhesion to many materials can be obtained. Therefore, the vibration part and the coil can be more firmly bonded by this bonding film. Further, the bonding film can easily and reliably control the non-adhesiveness and the adhesiveness. Furthermore, since the bonding film exhibits excellent liquid repellency, a highly reliable actuator with excellent durability can be obtained.

In the actuator of the present invention, it is preferable that the polyorganosiloxane is mainly composed of a polymer of octamethyltrisiloxane.
Thereby, a bonding film having particularly excellent adhesiveness can be obtained.
In the actuator of the present invention, the average thickness of the bonding film is preferably 1 to 1000 nm.
Thereby, these can be joined more firmly, preventing that the dimensional accuracy between a vibration part and a coil falls remarkably.

In the actuator according to the aspect of the invention, it is preferable that the bonding film is a solid having no fluidity.
As a result, an actuator with significantly higher dimensional accuracy than the conventional one can be obtained. Further, since the time required for curing the adhesive is not required, strong bonding can be achieved in a short time.
In the actuator according to the aspect of the invention, it is preferable that a surface of the vibration unit that is in contact with the bonding film is previously subjected to a surface treatment that improves adhesion with the bonding film.
As a result, the bonding strength between the vibration part and the bonding film can be further increased, and as a result, the bonding strength between the vibration part and the coil can be increased.

In the actuator according to the aspect of the invention, it is preferable that a surface of the coil that is in contact with the bonding film is previously subjected to a surface treatment that improves adhesion with the bonding film.
As a result, the bonding strength between the coil and the bonding film can be further increased, and as a result, the bonding strength between the vibrating portion and the coil can be increased.
In the actuator of the present invention, it is preferable that the surface treatment is a plasma treatment.
Thereby, in order to form a joining film | membrane, the surface of a vibration part or a coil can be optimized especially.

In the actuator according to the aspect of the invention, it is preferable that an intermediate layer is provided between the vibrating portion and the bonding film.
As a result, the bonding strength between the vibration part and the bonding film is increased.
In the actuator of the present invention, it is preferable to have an intermediate layer between the coil and the bonding film.
As a result, the bonding strength between the coil and the bonding film is increased.

In the actuator according to the aspect of the invention, it is preferable that the intermediate layer is composed mainly of an oxide-based material.
As a result, the bonding strength can be increased between the vibrating portion and the bonding film and between the coil and the bonding film.
In the actuator of the present invention, the energy is applied by at least one of a method of irradiating the bonding film with energy rays, a method of heating the bonding film, and a method of applying a compressive force to the bonding film. Is preferably carried out.
Thereby, energy can be applied to the bonding film relatively easily and efficiently.

In the actuator according to the aspect of the invention, it is preferable that the energy ray is an ultraviolet ray having a wavelength of 150 to 300 nm.
As a result, the amount of energy applied is optimized, and the bond between the Si skeleton and the leaving group is selectively cut while preventing the Si skeleton in the bonding film from being destroyed more than necessary. can do. Thereby, adhesiveness can be expressed in the bonding film while preventing the characteristics (mechanical characteristics, chemical characteristics, etc.) of the bonding film from deteriorating.

In the actuator of the present invention, the heating temperature is preferably 25 to 100 ° C.
Thereby, it is possible to reliably activate the bonding film while reliably preventing the vibration part or the coil from being deteriorated or deteriorated by heat.
In the actuator of the present invention, the compressive force is preferably 0.2 to 10 MPa.
As a result, it is possible to allow the bonding film to exhibit sufficient adhesiveness by simply compressing it while avoiding damage to the vibrating part or the coil.

The actuator of the present invention includes a movable plate having a plate shape and opposed to each other via the movable plate, and is connected to the movable plate to support the movable plate so as to be rotatable about an axis parallel to the surface. A vibrating portion having a pair of connecting portions to
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom,
The bonding film imparts energy to at least a part of the bonding film, so that the leaving group existing near the surface of the bonding film is released from at least one of the metal atom and the oxygen atom, and the bonding film The vibration portion and the coil are bonded to each other by the adhesiveness developed in the region on the surface of the substrate.
Thereby, the design freedom at the time of designing a vibration part and a coil can be ensured, and an actuator having high joint strength and dimensional accuracy when the vibration part and the coil are joined can be obtained.

The actuator of the present invention includes a movable plate having a plate shape and opposed to each other via the movable plate, and is connected to the movable plate to support the movable plate so as to be rotatable about an axis parallel to the surface. A vibrating portion having a pair of connecting portions to
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a metal atom and a leaving group composed of an organic component,
In the bonding film, energy is applied to at least a part of the bonding film, so that the leaving group existing near the surface of the bonding film is released from the bonding film and is expressed in the region on the surface of the bonding film. The vibrating portion and the coil are bonded to each other by the adhesive property.
Thereby, the design freedom at the time of designing a vibration part and a coil can be ensured, and an actuator having high joint strength and dimensional accuracy when the vibration part and the coil are joined can be obtained.

In the actuator of the present invention, a Lorentz force is generated by energizing the coil disposed in the magnetic field generated by the magnetic field generating means, and the movable plate is rotated about the axis by the Lorentz force. It is preferable that
Thereby, a movable plate rotates reliably.
In the actuator according to the aspect of the invention, it is preferable that the vibration unit is configured using a silicon material as a main material.
Since this material is excellent in workability, a vibration part with high dimensional accuracy can be obtained. For this reason, a highly accurate actuator can be obtained.

In the actuator according to the aspect of the invention, it is preferable that the coil is configured using a metal material as a main material.
Since this material is excellent in workability, a coil with high dimensional accuracy can be obtained. For this reason, a highly accurate actuator can be obtained.
In the actuator according to the aspect of the invention, it is preferable that each of the connecting portions has a rod shape, and one end portion thereof is configured by a shaft member connected to an edge portion of the movable plate.
Thereby, a movable plate rotates with the torsional deformation of each shaft member.

In the actuator of the present invention, it is preferable that the coil is disposed on one side of the movable plate.
Thereby, the design freedom at the time of designing a coil is securable.
In the actuator of the present invention, it is preferable that the coil is wound in a plane along the surface of the movable plate.
This makes it possible to generate a larger magnetic force than a coil formed in an annular shape, and the structure is simpler and easier to manufacture than a coil formed three-dimensionally in the thickness direction of the movable plate. It can also be suppressed.

In the actuator of the present invention, the movable plate is a quadrangle in plan view,
It is preferable that the coil is wound along four sides of the square.
As a result, Lorentz force is reliably generated, and thus the movable plate is reliably rotated.
In the actuator of the present invention, each of the connecting portions has a rod shape, one end of which is connected to the edge of the movable plate, and a drive having a plate shape provided in the middle of the shaft member. It is preferable that it is comprised with the board.
Thereby, the movable plate rotates with the torsional deformation of each shaft member, and the rotation control with respect to the movable plate at that time becomes easy.

In the actuator according to the aspect of the invention, it is preferable that the coils are respectively disposed on one side or both sides of each drive plate.
Thereby, the design freedom at the time of designing a coil is securable.
In the actuator of the present invention, it is preferable that the coil is wound in a plane along the surface of the drive plate.
This makes it possible to generate a larger magnetic force than a coil formed in an annular shape, and the structure is simpler and easier to manufacture than a coil formed three-dimensionally in the thickness direction of the movable plate. It can also be suppressed.

In the actuator of the present invention, the drive plate has a quadrangular shape in plan view,
It is preferable that the coil is wound along four sides of the square.
As a result, Lorentz force is reliably generated, so that the movable plate is reliably rotated as the drive plate is rotated.
In the actuator according to the aspect of the invention, it is preferable that the bonding film is formed in a region including the coil in a plan view.
As a result, when the coil is bonded to the bonding film, the bonding strength becomes relatively high, and the coil can be easily positioned with respect to the bonding film in the bonding process, thereby improving the workability.

In the actuator according to the aspect of the invention, it is preferable that the bonding film is formed in a region including the coil in a plan view, and the bonding film and the coil are insulated.
As a result, when the coil is bonded to the bonding film, the bonding strength becomes relatively high, and the coil can be easily positioned with respect to the bonding film in the bonding process, thereby improving the workability. Further, it is possible to reliably prevent a short circuit (short circuit) between the bonding film and the coil.

In the actuator according to the aspect of the invention, it is preferable that the bonding film is formed along the shape of the coil in a plan view.
Thereby, when the movable plate rotates, the influence of inertia due to the bonding film can be suppressed.
In the actuator according to the aspect of the invention, it is preferable that a portion of the wire constituting the coil is joined to the joining film in a planar shape.
Thereby, the contact area which contacts a joining film becomes comparatively large, and the joint strength of a coil and a joining film also increases in connection with this.

In the actuator according to the aspect of the invention, it is preferable that the magnetic field generation unit is configured by a pair of magnets arranged to face each other so as to have different polarities via a rotation shaft of the movable plate.
Thereby, a magnetic field can be generated easily and reliably.
In the actuator according to the aspect of the invention, it is preferable that the actuator further includes a light reflecting portion that is provided on the movable plate and reflects light.
Thereby, the actuator can be applied to an optical device such as an optical scanner, an optical attenuator, or an optical switch.
The actuator of the present invention is preferably an optical scanner that scans the light reflected by the light reflecting portion.
Thereby, the actuator can be used as an optical scanner.

The image forming apparatus of the present invention includes the actuator of the present invention,
And a light source that irradiates light toward the movable plate of the actuator.
Thereby, it is possible to secure a degree of freedom in designing the vibration part and the coil, and an image forming apparatus having an actuator with high joint strength and dimensional accuracy when the vibration part and the coil are joined can be obtained.

Hereinafter, an actuator and an image forming apparatus according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<First Embodiment>
FIG. 1 is a perspective view showing a first embodiment of the actuator of the present invention, FIG. 2 is a plan view of the actuator shown in FIG. 1, FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2 is a cross-sectional view taken along the line BB in FIG. 2, FIG. 5 is a partially enlarged view showing a state before applying energy of the bonding film in the actuator shown in FIG. 1, and FIG. 6 is applying energy of the bonding film in the actuator shown in FIG. FIG. 7 to FIG. 9 are diagrams for explaining the manufacturing method (manufacturing process) of the actuator shown in FIG. 1, and FIG. 10 is a diagram of the bonding film in the actuator shown in FIG. It is a figure which shows typically the plasma polymerization apparatus used for preparation. In the following, for convenience of explanation, the upper side in FIGS. 1, 3, 4, 7 to 10 (the same applies to FIGS. 11 and 13) is “up” or “upper”, and the lower side is “lower”. Or “downward”.

As shown in FIG. 1, the actuator 1 is an actuator that employs an electromagnetic drive system (more specifically, a moving coil system), and includes a base body 2, a support body 3 that supports the base body 2 from below, And a pair of magnets (permanent magnets (magnetic field generating means)) 41 and 42. Hereinafter, the configuration of each unit will be described.
As shown in FIG. 1, the base 2 includes a plate-shaped movable plate 21, a support portion 24 disposed on the outer peripheral side of the movable portion 21, and a pair of connecting portions that connect the movable plate 21 and the support portion 24. And shaft members 22 and 23.

The support portion 24 is formed in a frame shape so as to surround the movable plate 21, that is, an opening portion 243 is formed inside, and the movable plate 21 is disposed in the opening portion 243. The support 24 is rectangular in plan view.
In this embodiment, the movable plate 21 has a rectangular (quadrangle) shape in plan view, and rotates about a rotation axis 215 that passes through the center of the movable plate 21 and is parallel to the short side (parallel to the surface of the movable plate 21). It is. Further, in the configuration shown in FIG. 2, the movable plate 21 is arranged so that the short side thereof is parallel to the long side of the support portion 24.

  A light reflecting portion (mirror) 211 that reflects light is provided on the upper surface of the movable plate 21. As a result, the actuator 1 can be applied to an optical scanner that scans the light reflected by the light reflecting portion 211. In addition to the optical scanner, the actuator 1 can be applied to an optical device such as an optical attenuator and an optical switch. In the present embodiment, a case where the actuator 1 is applied to an optical scanner will be described.

  As shown in FIGS. 1 and 2, the movable plate 21 has an edge portion connected to and supported by an inner edge portion of the support portion 24 via shaft members 22 and 23. The shaft member 22 and the shaft member 23 are each in the form of a rod, are opposed to each other via the movable plate 21, and are disposed coaxially with the rotation shaft 215 of the movable plate 21. That is, each of the shaft members 22 and 23 having a rod shape has an inner end portion (one end portion) connected to the central portion of the long side of the movable plate 21 and an outer end portion (the other end portion) of the support portion 24. It connects with the center part of the edge of the opening part 243 located in each short side.

In the actuator 1, the movable plate 21 is rotatable with respect to the support portion 24 with torsional deformation of the shaft members 22 and 23. Thus, in the actuator 1, it can be said that the movable plate 21 and the pair of shaft members 22 and 23 constitute a vibration system (vibration unit) 20 having one degree of freedom.
The material constituting the substrate 2 is not particularly limited, and examples thereof include silicon materials such as single crystal silicon, polycrystalline silicon, and amorphous silicon, and metal materials such as stainless steel, titanium, and aluminum. Among these, a silicon material is particularly preferable. Since such a material is excellent in workability, the base body 2 with high dimensional accuracy can be obtained. For this reason, the highly accurate actuator 1 is obtained. Moreover, since it is excellent in workability, for example, etching can be performed on the base material 2 ′ of the base 2, so that the movable plate 21, the pair of shaft members 22, 23, and the support portion 24 are integrated. Can be formed.

As shown in FIGS. 2 to 4, a conductive coil 212 is bonded to the lower surface (one surface) of the movable plate 21 (vibrating unit 20) via a bonding film 5a. The bonding film 5a will be described later in detail.
The coil 212 is formed in a spiral shape (wound) along the lower surface of the movable plate 21. Such a spiral coil 212 generates a large Lorentz force compared to a coil formed in an annular shape, and is simpler in structure and manufactured than a coil formed three-dimensionally in the thickness direction of the movable plate 21. And the size can be suppressed.

Furthermore, the coil 212 is wound along four sides of the movable plate 21 that is rectangular in plan view. In the magnetic field generated by the magnets 41 and 42, when an AC voltage is applied to the coil 212 and the coil 212 is energized, Lorentz force (magnetic field) is applied to each portion 212a located on the short side of the movable plate 21 of the coil 212. The force received from the At this time, the movable plate 21 rotates around the rotation shaft 215. In addition, since an AC voltage is applied to the coil 212, the direction of the current flowing through the coil 212 is switched alternately. As a result, the direction of the Lorentz force is alternately reversed in the vertical direction, and the movable plate 21 swings (vibrates) in the direction of the arrow in FIG.
Further, since the coil 212 is provided on the surface (lower surface) opposite to the light reflecting portion 211 of the movable plate 21, the limitation due to the presence of the light irradiating portion 211 is reduced in design. A reduction in the degree of freedom in design is suppressed or prevented.

As shown in FIG. 4, the strands (wires) constituting the coil 212 have a rectangular (quadrangle) cross-sectional shape. As a result, the portion of the coil 212 that is bonded to the bonding film 5a has a planar shape, so that the contact area that contacts the bonding film 5a becomes relatively large. Strength also increases.
In addition, one end of the wire constituting the coil 212 (end on the outer periphery side of the spiral) is located near the boundary portion between the movable plate 21 and the shaft member 23 and is electrically connected to the wiring 231. In addition, the other end (end on the center side of the spiral) of the wire constituting the coil 212 is located near the center of the plate surface of the movable plate 21, but via the wiring 214 configured by wire bonding, In the vicinity of the boundary between the movable plate 21 and the shaft member 22, it is electrically connected to the wiring 221. The connection between the other end of the wire constituting the coil 212 (the end on the center side of the spiral) and the wiring 221 is not limited to wire bonding. For example, a wiring pattern is formed on the vibration system 20 via an insulating film. The film may be formed, and the insulating film may be provided with a through electrode that conducts to the wiring pattern.
The wiring 221 is electrically connected to the terminal 241 exposed from the lower surface of the support portion 24, and the wiring 231 is electrically connected to the terminal 242 exposed from the lower surface of the support portion 24. As a result, the coil 212 can be energized via the wirings 221 and 231.

As shown in FIG. 4, the wiring 221 and the terminal 241 are bonded to the lower surface of the shaft member 22 via the bonding film 5 c. Further, the wiring 231 and the terminal 242 are bonded to the lower surface of the shaft member 23 via the bonding film 5d. The bonding films 5c and 5d will be described later together with the bonding film 5a.
In addition, if it has electroconductivity as a constituent material of the coil 212, the wiring 221,231, and the terminals 241,242, it will not specifically limit, For example, a metal material is mentioned, Of these, copper is preferable. Thereby, for example, a single copper plate (copper foil) can be processed, and the coil 212, the wirings 221, 231 and the terminals 241, 242 can be easily manufactured. Moreover, it is preferable that the coil 212, the wiring 231 and the terminal 241 are integrally formed, that is, are constituted by one strand. Moreover, it is preferable that the wiring 221 and the terminal 241 are integrally formed, that is, are configured by one strand. Further, since copper is a material having a relatively small electric resistance, it can be applied well to the coil 212 that is energized and used, and the Lorentz force is more reliably generated when energized.

The support 3 is bonded to the lower surface of the base 2 via a bonding film 5b. The support 3 is a laminated structure composed of a frame-shaped body 31 having a frame shape along the edge of the support section 24 and a substrate 32 bonded to the lower surface of the frame-shaped body 31 via a bonding film 6a. It is what makes. The bonding films 5b and 6a will be described in detail later together with the bonding film 5a.
The frame body 31 is formed with an opening 311 that communicates with the opening 243 of the support 24. As shown in FIG. 2, the opening 311 is formed so as to include the vibration system 20 in a plan view. The space inside the opening 311 serves as a relief for preventing the vibration of the vibration system 20 of the base body 2, that is, the movable plate 21 from rotating (vibrating) and coming into contact with the support 3 (substrate 32). Constitute. By providing such an escape portion, the deflection angle (amplitude) of the movable plate 21 can be set larger while preventing the actuator 1 from being enlarged.

The substrate 32 is formed so as to correspond to the shape of the frame body 31. The opening 311 is sealed from below by the substrate 32.
The constituent materials of the frame body 31 and the substrate 32 are not particularly limited. For example, the same material as that of the base 2 can be used.
Magnets 41 and 42 are arranged on the side surfaces of the frame-shaped body 31 in the short side direction via the rotation shaft 215 of the movable plate 21 (in contrast to the rotation shaft 215). The magnet 41 and the magnet 42 are opposed to each other so as to have different polarities, that is, the N pole and the S pole are located on the movable plate 21 side, respectively. Thereby, a magnetic field is generated in the vicinity of the coil 212 along the arrow direction in FIG.

As shown in FIG. 3, the magnet 41 is bonded to the substrate 32 via the bonding film 6b, and the magnet 42 is bonded to the substrate 32 via the bonding film 6c. The bonding films 6b and 6c will be described later together with the bonding film 5a.
The magnets 41 and 42 are not limited to those composed of permanent magnets, and may be composed of electromagnets, for example.

Next, the bonding films used in common for the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c will be described. In addition, since the structures (features) of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c are substantially the same, the bonding film 5a that bonds the movable plate 21 and the coil 212 will be representatively described below. explain.
As shown in FIG. 5, the state before applying the energy of the bonding film 5 a includes a Si skeleton 301 including a siloxane (Si—O) bond 302, a random atomic structure, and a debonding bonded to the Si skeleton 301. And a leaving group 303.

When energy is applied to the bonding film 5a, as shown in FIG. 6, a part of the leaving group 303 is detached from the Si skeleton 301, and an active hand 304 is generated instead. Thereby, adhesiveness develops on the surface of the bonding film 5a. The movable plate 21 and the coil 212 are bonded together by the bonding film 5a that exhibits adhesiveness in this way.
Such a bonding film 5 a is a strong film that is difficult to be deformed due to the influence of the Si skeleton 301 including the siloxane bond 302 and having a random atomic structure. For this reason, the distance between the movable plate 21 and the coil 212, that is, the thickness of the bonding film 5a can be kept constant with high dimensional accuracy, and the movable plate 21 can be stably rotated.

In addition, since the movable plate 21 and the coil 212 are bonded using the bonding film 5a, it is possible to prevent a problem that the adhesive protrudes when bonding is conventionally performed using an adhesive. Therefore, there is an advantage that the trouble of removing the protruding adhesive can be omitted.
Furthermore, the bonding film 5a is excellent in heat resistance due to the action of the chemically stable Si skeleton 301. For this reason, even if the actuator 1 is exposed to a high temperature, the bonding film 5a can be reliably prevented from being altered or deteriorated.

  Further, such a bonding film 5a is a solid having no fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 5a) hardly change compared to a conventional liquid or viscous adhesive having fluidity. For this reason, the dimensional accuracy of the actuator 1 manufactured using the bonding film 5a is remarkably higher than the conventional one. Furthermore, since the time required for curing of the adhesive is not required, strong bonding can be achieved in a short time.

  As such a bonding film 5a, in particular, among atoms obtained by removing H atoms from all atoms constituting the bonding film 5a, the total content of Si atoms and O atoms is about 10 to 90 atomic%. It is preferable and it is more preferable that it is about 20-80 atomic%. If Si atoms and O atoms are contained in the above-mentioned range, the bonding film 5a forms a strong network of Si atoms and O atoms, and the bonding film 5a itself becomes stronger. . Further, the bonding film 5 a exhibits a particularly high bonding strength with respect to the movable plate 21 and the coil 212.

Further, the abundance ratio of Si atoms and O atoms in the bonding film 5a is preferably about 3: 7 to 7: 3, and more preferably about 4: 6 to 6: 4. By setting the abundance ratio of Si atoms and O atoms to be in the above range, the stability of the bonding film 5a is increased, and the movable plate 21 and the coil 212 can be bonded more firmly.
Note that the crystallinity of the Si skeleton 301 in the bonding film 5a is preferably 45% or less, and more preferably 40% or less. As a result, the Si skeleton 301 includes a sufficiently random atomic structure. For this reason, the characteristics of the Si skeleton 301 described above become obvious, and the dimensional accuracy and adhesiveness of the bonding film 5a become more excellent.

  Further, as described above, the leaving group 303 bonded to the Si skeleton 301 behaves so as to generate an active hand 304 in the bonding film 5a by detaching from the Si skeleton 301. Therefore, although the leaving group 303 is relatively easily and uniformly desorbed by being given energy, it is securely bonded to the Si skeleton 301 so as not to be desorbed when no energy is given. It needs to be a thing.

  From this point of view, the leaving group 303 includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or each of these atoms. What consists of at least 1 sort (s) selected from the group which consists of an atomic group arrange | positioned so that it may couple | bond with frame | skeleton 301 is used preferably. Such a leaving group 303 is relatively excellent in binding / leaving selectivity by applying energy. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness of the bonding film 5a can be made higher.

  Examples of the atomic group (group) arranged so that each atom as described above is bonded to the Si skeleton 301 include, for example, an alkyl group such as a methyl group and an ethyl group, and an alkenyl group such as a vinyl group and an allyl group. Aldehyde group, ketone group, carboxyl group, amino group, amide group, nitro group, halogenated alkyl group, mercapto group, sulfonic acid group, cyano group, isocyanate group and the like.

Among these groups, the leaving group 303 is particularly preferably an alkyl group. Since the alkyl group has high chemical stability, the bonding film 5a containing the alkyl group has excellent weather resistance (with respect to the environment in which the actuator 1 is used).
Examples of the constituent material of the bonding film 5a having such characteristics include a polymer containing a siloxane bond such as polyorganosiloxane.

The bonding film 5a made of polyorganosiloxane itself has excellent mechanical properties. In addition, it exhibits particularly excellent adhesion to many materials. Therefore, the bonding film 5a made of polyorganosiloxane can bond the movable plate 21 and the coil 212 more firmly.
Polyorganosiloxane usually exhibits water repellency (non-adhesiveness), but when given energy, it can easily desorb organic groups, changes to hydrophilicity, and exhibits adhesiveness. However, there is an advantage that the non-adhesiveness and the adhesiveness can be controlled easily and reliably.

  This water repellency (non-adhesiveness) is mainly due to the action of alkyl groups contained in the polyorganosiloxane. Therefore, the bonding film 5a made of polyorganosiloxane exhibits adhesiveness in a region to which energy is applied, and has excellent liquid repellency due to the aforementioned alkyl group in a region to which energy is not applied. Has the advantage of being Therefore, by controlling the region to which energy is applied, excellent liquid repellency can be exhibited in the region of the bonding film 5a that does not contact the movable plate 21 and the coil 212. As a result, even when the actuator 1 is used in a place where the humidity is relatively high, for example, the actuator 1 (bonding film 5a) is highly reliable with excellent durability (water resistance).

  Further, among polyorganosiloxanes, those mainly composed of a polymer of octamethyltrisiloxane are preferred. The bonding film 5a mainly composed of a polymer of octamethyltrisiloxane is particularly excellent in adhesiveness, and thus can be particularly suitably applied to the actuator 1. Moreover, since the raw material which has octamethyltrisiloxane as a main component is liquid at normal temperature and has an appropriate viscosity, there is an advantage that it is easy to handle.

Further, the average thickness of the bonding film 5a is preferably about 1 to 1000 nm, and more preferably about 2 to 800 nm. By setting the average thickness of the bonding film 5a within the above range, the dimensional accuracy between the movable plate 21 and the coil 212 can be more strongly bonded while preventing the dimensional accuracy between the movable film 21 and the coil 212 from being significantly lowered.
That is, when the average thickness of the bonding film 5a is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 5a exceeds the upper limit, the dimensional accuracy of the actuator 1 may be significantly reduced.

  Furthermore, if the average thickness of the bonding film 5a is within the above range, a certain degree of shape followability is ensured for the bonding film 5a. For this reason, for example, even when unevenness exists on the bonding surface of the movable plate 21 (surface adjacent to the bonding film 5a), the bonding film follows the shape of the unevenness depending on the height of the unevenness. 5a can be deposited. As a result, the bonding film 5a can absorb the unevenness and reduce the height of the unevenness generated on the surface. When the coil 212 is bonded to the movable plate 21 on which the bonding film 5a is formed, the adhesion of the bonding film 5a to the coil 212 can be improved.

In addition, the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 5a increases. Therefore, in order to ensure sufficient shape followability, the thickness of the bonding film 5a should be as large as possible.
Such a bonding film 5a may be produced by any method, such as a film produced by various vapor deposition methods such as plasma polymerization, CVD, PVD, or various liquid deposition methods. Although it can produce by giving energy, among these, it is preferable to use the film | membrane produced by the plasma polymerization method as a film | membrane before energy provision. According to the plasma polymerization method, finally, a dense and homogeneous bonding film 5a can be efficiently produced. Thereby, the bonding film 5a produced by the plasma polymerization method can bond the movable plate 21 and the coil 212 particularly firmly. Further, the bonding film 5a that has been manufactured by the plasma polymerization method and has not been applied with energy can be maintained in a state in which energy is applied and activated for a relatively long time. For this reason, the manufacturing process of the actuator 1 can be simplified and improved in efficiency.

  The bonding film 5a is preferably formed in a region including the coil 212 in plan view, that is, the bonding film 5a is formed to have a larger area in plan view than the area of the coil 212. Thereby, when the coil 212 is bonded to the bonding film 5a, the bonding strength becomes relatively high, and the coil 212 can be easily positioned with respect to the bonding film 5a in the bonding process, thereby improving the workability.

  Next, as an example, a method of manufacturing the bonding film 5a on the base material 2 ′ of the substrate 2 by plasma polymerization, and bonding the base material 2 ′ (movable plate 21) and the coil 212, and this method A method for manufacturing the actuator 1 including the above will be described. In the plasma polymerization method, for example, by supplying a mixed gas of a source gas and a carrier gas in a strong electric field, molecules in the source gas are polymerized, a polymer is deposited on the base material 2 ′, and a film is formed. How to get.

Hereinafter, a method of forming the bonding film 5a by the plasma polymerization method will be described in detail. First, prior to explaining the method of forming the bonding film 5a, the bonding film 5a is formed on the base material 2 ′ by the plasma polymerization method. A plasma polymerization apparatus used for manufacturing will be described, and then a method for forming the bonding film 5a will be described.
The plasma polymerization apparatus 900 shown in FIG. 10 applies a high-frequency voltage between the chamber 901, the first electrode 930 that supports the base material 2 ′ (base 2), the second electrode 940, and the electrodes 930 and 940. A power supply circuit 980, a gas supply unit 990 for supplying gas into the chamber 901, and an exhaust pump 970 for exhausting the gas in the chamber 901. Among these parts, the first electrode 930 and the second electrode 940 are provided in the chamber 901. Hereinafter, each part will be described in detail.
The chamber 901 is a container that can maintain the airtightness of the inside, and is used with the inside being in a reduced pressure (vacuum) state. Therefore, the chamber 901 has pressure resistance that can withstand a pressure difference between the inside and the outside.

A chamber 901 shown in FIG. 10 has a substantially cylindrical chamber body whose axis is arranged along the horizontal direction, a circular side wall that seals the left opening of the chamber body, and a circle that seals the right opening. And side walls.
A supply port 903 is provided above the chamber 901 in FIG. 10, and an exhaust port 904 is provided below the chamber 901. A gas supply unit 990 is connected to the supply port 903, and an exhaust pump 970 is connected to the exhaust port 904.

In the present embodiment, the chamber 901 is made of a highly conductive metal material and is electrically grounded via the ground wire 902.
The first electrode 930 has a plate shape and supports the base material 2 ′.
The first electrode 930 is provided on the inner wall surface of the side wall of the chamber 901 along the horizontal direction. Further, the first electrode 930 is electrically grounded through the chamber 901.

An electrostatic chuck (adsorption mechanism) 939 is provided on the surface of the first electrode 930 that supports the base material 2 ′.
The electrostatic chuck 939 can hold the base material 2 ′ as shown in FIG. Further, even if the base material 2 ′ has a slight warp, the base material 2 ′ can be subjected to a plasma treatment in a state in which the warp is corrected by being attracted to the electrostatic chuck 939.

The second electrode 940 is provided to face the first electrode 930 via the base material 2 ′. Note that the second electrode 940 is provided in a state of being separated (insulated) from the inner wall surface of the side wall of the chamber 901.
A high frequency power source 982 is connected to the second electrode 940 via a wiring 984. A matching box (matching unit) 983 is provided in the middle of the wiring 984. The wiring 984, the high frequency power supply 982, and the matching box 983 constitute a power supply circuit 980.

According to such a power supply circuit 980, since the first electrode 930 is grounded, a high frequency voltage is applied between the first electrode 930 and the second electrode 940. As a result, an electric field whose direction is reversed at a high frequency is induced in the gap between the first electrode 930 and the second electrode 940.
The gas supply unit 990 supplies a predetermined gas into the chamber 901.

  A gas supply unit 990 illustrated in FIG. 10 stores a liquid storage unit 991 that stores a liquid film material (raw material liquid), a vaporizer 992 that vaporizes the liquid film material to change it into a gaseous state, and stores a carrier gas. And a gas cylinder 993. These parts and the supply port 903 of the chamber 901 are connected to each other by a pipe 994, and a mixed gas of a gaseous film material (raw material gas) and a carrier gas is supplied from the supply port 903 into the chamber 901. It is configured to supply.

The liquid film material stored in the liquid storage unit 991 is a raw material that is polymerized by the plasma polymerization apparatus 900 to form a polymer film on the surface of the base material 2 ′.
Such a liquid film material is vaporized by the vaporizer 992 and is supplied into the chamber 901 as a gaseous film material (raw material gas). The source gas will be described in detail later.

The carrier gas stored in the gas cylinder 993 is a gas that is discharged in order to maintain discharge by discharging due to the action of an electric field. Examples of such a carrier gas include Ar gas and He gas.
A diffusion plate 995 is provided in the vicinity of the supply port 903 in the chamber 901.

The diffusion plate 995 has a function of promoting the diffusion of the mixed gas supplied into the chamber 901. Thereby, the mixed gas can be dispersed in the chamber 901 at a substantially uniform concentration.
The exhaust pump 970 exhausts the inside of the chamber 901, and includes, for example, an oil rotary pump, a turbo molecular pump, or the like. By exhausting the chamber 901 and reducing the pressure in this manner, the gas can be easily converted into plasma. In addition, contamination and oxidation of the base material 2 ′ due to contact with the air atmosphere can be prevented, and reaction products resulting from the plasma treatment can be effectively removed from the chamber 901.
The exhaust port 904 is provided with a pressure control mechanism 971 that adjusts the pressure in the chamber 901. Thereby, the pressure in the chamber 901 is appropriately set according to the operation status of the gas supply unit 160.

Next, a method for forming the bonding film 5a on the base material 2 ′ will be described.
[1]
First, a base material 2 ′ is prepared as a base material for manufacturing the base 2. The base material 2 ′ can be the base body 2 by processing in a process described later. After this base material 2 ′ is housed in the chamber 901 of the plasma polymerization apparatus 900 and sealed, the chamber 901 is decompressed by the operation of the exhaust pump 970.

Next, the gas supply unit 990 is operated to supply a mixed gas of the source gas and the carrier gas into the chamber 901. The supplied mixed gas is filled in the chamber 901.
Here, the ratio (mixing ratio) of the source gas in the mixed gas is slightly different depending on the type of the source gas and the carrier gas, the target film forming speed, and the like. For example, the ratio of the source gas in the mixed gas is 20 It is preferable to set to about -70%, and it is more preferable to set to about 30-60%. As a result, it is possible to optimize the conditions for formation (film formation) of the polymer film.
Further, the flow rate of the gas to be supplied is appropriately determined depending on the type of gas, the target film formation rate, the film thickness, etc., and is not particularly limited, but usually the flow rates of the source gas and the carrier gas are respectively , Preferably about 1 to 100 ccm, more preferably about 10 to 60 ccm.

  Next, the power supply circuit 980 is activated, and a high-frequency voltage is applied between the pair of electrodes 930 and 940. As a result, gas molecules existing between the pair of electrodes 930 and 940 are ionized to generate plasma. Molecules in the raw material gas are polymerized by the plasma energy, and the polymer adheres to and deposits on the base material 2 '. As a result, as shown in FIG. 7A, a bonding film 5 'made of a plasma polymerized film is formed on the base material 2'. The bonding film 5 ′ can be formed into bonding films 5 a, 5 b, 5 c, and 5 d by processing in a process described later.

Examples of the source gas include organosiloxanes such as methylsiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane, and methylphenylsiloxane.
The plasma polymerized film obtained by using such a raw material gas, that is, the bonding film 5 ′ is constituted by a polymer obtained by polymerizing these raw materials, that is, a polyorganosiloxane.

In the plasma polymerization, the frequency of the high frequency applied between the pair of electrodes 930 and 940 is not particularly limited, but is preferably about 1 kHz to 100 MHz, and more preferably about 10 to 60 MHz.
Further, the power density of the high frequency is not particularly limited, and is preferably about 0.01 to 10 / cm ^2, more preferably about 0.1 to 1 W / cm ^2.

The pressure in the chamber 901 at the time of film formation is preferably about 133.3 × 10 ^{−5 to} 1333 Pa (1 × 10 ^{−5 to} 10 Torr), preferably 133.3 × 10 ^{−4 to} 133.3 Pa ( More preferably, it is about 1 × 10 ^{−4 to} 1 Torr).
The raw material gas flow rate is preferably about 0.5 to 200 sccm, and more preferably about 1 to 100 sccm. On the other hand, the carrier gas flow rate is preferably about 5 to 750 sccm, and more preferably about 10 to 500 sccm.

The treatment time is preferably about 1 to 10 minutes, more preferably about 4 to 7 minutes. Note that the thickness of the deposited bonding film 5 ′ (bonding film 5a) is mainly proportional to the processing time. Therefore, the thickness of the bonding film 5 ′ can be easily adjusted only by adjusting the processing time. For this reason, conventionally, when the movable plate 21 and the coil 212 are bonded using an adhesive, the thickness of the adhesive cannot be strictly controlled. However, according to the bonding film 5 ′, the bonding Since the thickness of the film 5 ′ can be strictly controlled, the distance between the movable plate 21 and the coil 212 can be strictly controlled.
Further, the temperature of the base material 2 ′ is preferably 25 ° C. or higher, more preferably about 25 to 100 ° C.
As described above, the bonding film 5 ′ can be obtained.

[2]
Next, the base material 2 ′ on which the bonding film 5 ′ is formed is once taken out from the chamber 901. Then, as shown in FIG. 7B, an opening 243 is formed in the base material 2 ′. By forming the opening 243, the base material 2 ′ becomes the base 2 having the vibration system 20. The opening 243 is formed by combining one or more of physical etching methods such as dry etching, reactive ion etching, beam etching, and light-assisted etching, and chemical etching methods such as wet etching. Can be used.

[3]
Next, the base material 2 ′ in which the opening 243 is formed is placed in the chamber 901 again. Then, energy is applied to the bonding film 5 ′.
When energy is applied, the leaving group 303 is detached from the Si skeleton 301 in the bonding film 5 ′ as shown in FIG. Then, after the leaving group 303 is removed, active hands 304 are generated on the surface 51 and inside of the bonding film 5a, as shown in FIG. Thereby, adhesiveness with the coil 212 is expressed on the surface 51 of the bonding film 5 ′.

Here, the energy applied to the bonding film 5 ′ may be applied by any method. For example, (I) a method of irradiating the bonding film 5 ′ with energy rays, and (II) a method of heating the bonding film 5 ′. (III) A method of applying compressive force (applying physical energy) to the bonding film 5 ′ is representatively mentioned. In addition, a method of exposing to plasma (applying plasma energy), exposure to ozone gas (chemical) And the like).
Among these, as a method for applying energy to the bonding film 5 ′, it is particularly preferable to use at least one of the methods (I), (II), and (III). Since these methods can apply energy to the bonding film 5 ′ relatively easily and efficiently, they are suitable as energy application methods.

Hereinafter, the methods (I), (II), and (III) will be described in detail.
(I) When irradiating the bonding film 5 ′ with energy rays, examples of the energy rays include light such as ultraviolet rays and laser light, particle rays such as X-rays, γ rays, electron beams, and ion beams, or the like, or What combined these energy rays is mentioned.
Among these energy rays, it is particularly preferable to use ultraviolet rays having a wavelength of about 150 to 300 nm (see FIG. 7C). According to such ultraviolet rays, the amount of energy applied is optimized, so that the Si skeleton 301 and the leaving group 303 are prevented from being destroyed more than necessary while the Si skeleton 301 in the bonding film 5 ′ is prevented from being destroyed more than necessary. The bond between can be selectively broken. Thereby, adhesiveness can be expressed in the bonding film 5 ′ while preventing the characteristics (mechanical characteristics, chemical characteristics, etc.) of the bonding film 5 ′ from deteriorating.

In addition, since ultraviolet rays can be processed in a short time without unevenness, the leaving group 303 can be efficiently eliminated. Furthermore, ultraviolet rays also have the advantage that they can be generated with simple equipment such as UV lamps.
The wavelength of ultraviolet light is more preferably about 160 to 200 nm.
In the case of using the UV lamp, the output may vary depending on the area of the bonding film 5 'is preferably from ^1mW / cm ^{2 ~1W} / cm 2 ^{approximately, 5mW / cm 2 ~50mW / cm} 2 of about It is more preferable that In this case, the separation distance between the UV lamp and the bonding film 5 ′ is preferably about 3 to 3000 mm, and more preferably about 10 to 1000 mm.

In addition, the time of irradiation with ultraviolet rays is such a time that the leaving group 303 near the surface of the bonding film 5 ′ can be removed, that is, a large amount of the leaving group 303 inside the bonding film 5 ′ is not released. Time is preferred. Specifically, although it varies slightly depending on the amount of ultraviolet light, the constituent material of the bonding film 5 ′, etc., it is preferably about 0.5 to 30 minutes, more preferably about 1 to 10 minutes.
Moreover, although an ultraviolet-ray may be irradiated continuously in time, you may irradiate intermittently (pulse form).
On the other hand, examples of the laser light include an excimer laser (femtosecond laser), an Nd—YAG laser, an Ar laser, a CO ₂ laser, and a He—Ne laser.

The irradiation of the energy beam to the bonding film 5 ′ may be performed in any atmosphere, and specifically, the atmosphere, an oxidizing gas atmosphere such as oxygen, a reducing gas atmosphere such as hydrogen, nitrogen, and the like. In addition, an inert gas atmosphere such as argon, or a reduced pressure (vacuum) atmosphere obtained by reducing these atmospheres is preferable, and it is particularly preferably performed in an air atmosphere. Thereby, it is not necessary to take time and cost to control the atmosphere, and energy beam irradiation can be performed more easily.
Thus, according to the method of irradiating energy rays, it is possible to easily apply energy selectively to the bonding film 5 ′, and therefore, for example, alteration / deterioration of the substrate 2 due to application of energy is prevented. be able to.

Moreover, according to the method of irradiating energy rays, the magnitude of energy to be applied can be easily adjusted with high accuracy. For this reason, it is possible to adjust the desorption amount of the leaving group 303 desorbed from the bonding film 5 ′. By adjusting the amount of elimination of the leaving group 303 in this way, the bonding strength between the bonding film 5a and the coil 212 can be easily controlled.
That is, by increasing the amount of elimination of the leaving group 303, more active hands are generated on the surface and inside of the bonding film 5 ′, so that the adhesiveness expressed in the bonding film 5 ′ can be further enhanced. . On the other hand, by reducing the amount of elimination of the leaving group 303, it is possible to reduce the number of active hands generated on the surface and inside of the bonding film 5 ′, and to suppress the adhesiveness developed in the bonding film 5 ′.
In addition, in order to adjust the magnitude | size of the energy to provide, what is necessary is just to adjust conditions, such as the kind of energy beam, the output of an energy beam, the irradiation time of an energy beam.
Furthermore, according to the method of irradiating energy rays, a large amount of energy can be applied in a short time, so that energy can be applied more efficiently.

(II) When heating the bonding film 5 ′ (not shown), the heating temperature is preferably set to about 25 to 100 ° C., more preferably about 50 to 100 ° C. By heating at such a temperature, it is possible to reliably activate the bonding film 5 ′ while reliably preventing the base body 2 and the like from being altered or deteriorated by heat.
Further, the heating time may be a time that can break the molecular bond of the bonding film 5 ′, and specifically, it is preferably about 1 to 30 minutes if the heating temperature is within the above range. .

The bonding film 5 ′ may be heated by any method, but can be heated by various heating methods such as a method using a heater, a method of irradiating infrared rays, and a method of contacting with a flame.
When the base 2 (movable plate 21) and the coil 212 have substantially the same coefficient of thermal expansion, the bonding film 5 ′ may be heated under the above conditions. However, the base 2 and the coil 212 have a thermal expansion. When the rates are different from each other, it will be described in detail later, but it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.

  (III) In the present embodiment, the case where energy is applied to the bonding film 5 ′ before the movable plate 21 and the coil 212 are bonded to each other has been described. It may be performed after the coil 212 is overlapped. That is, after the bonding film 5 ′ is formed on the base material 2 ′ and the opening 243 is further formed, the bonding film 5 ′ (bonding film 5 a) and the coil 212 are brought into close contact with each other before energy is applied. In addition, the movable plate 21 and the coil 212 are overlapped to form a temporary joined body. Then, by applying energy to the bonding film 5a in the temporary bonded body, the bonding film 5a exhibits adhesiveness, and the movable plate 21 and the coil 212 are bonded (adhered) via the bonding film 5a. The

In this case, energy may be applied to the bonding film 5a in the temporary bonded body by the methods (I) and (II) described above, or a method of applying a compressive force to the bonding film 5a may be used.
In this case, the movable plate 21 and the coil 212 are preferably compressed at a pressure of about 0.2 to 10 MPa and more preferably compressed at a pressure of about 1 to 5 MPa in a direction in which the movable plate 21 and the coil 212 approach each other. As a result, it is possible to easily apply appropriate energy to the bonding film 5a simply by compressing, and sufficient adhesiveness is exhibited in the bonding film 5a. The pressure may exceed the upper limit, but depending on the constituent materials of the movable plate 21 (base 2) and the coil 212, these members may be damaged.

The time for applying the compressive force is not particularly limited, but is preferably about 10 seconds to 30 minutes. In addition, what is necessary is just to change suitably the time which provides compression force according to the magnitude | size of compression force. Specifically, the time for applying the compressive force can be shortened as the compressive force increases.
Since the movable plate 21 and the coil 212 are not joined in the temporarily joined state, their relative positions can be easily adjusted (shifted). Therefore, once the temporary joined body is obtained, the assembly accuracy (dimensional accuracy) of the finally obtained actuator 1 can be reliably increased by finely adjusting the relative position between the movable plate 21 and the coil 212. .
Energy can be applied to the bonding film 5 ′ by the methods (I), (II), and (III) as described above.

  Note that energy may be applied to the entire surface of the bonding film 5 ′, but it may be applied to only a part of the region. In this way, it is possible to control the region where the adhesiveness of the bonding film 5 ′ is expressed. By appropriately adjusting the area, shape, etc. of this region, local concentration of stress generated at the bonding interface is alleviated. be able to. Thereby, for example, even when the difference in thermal expansion coefficient between the base 2 and the coil 212 is large, these can be reliably bonded.

  Here, as described above, the bonding film 5 ′ in the state before energy is applied has the Si skeleton 301 and the leaving group 303 as shown in FIG. 5. When energy is applied to the bonding film 5 ′, the leaving group 303 (in this embodiment, a methyl group) is detached from the Si skeleton 301. As a result, as shown in FIG. 6, active hands 304 are generated on the surface 51 of the bonding film 5a and activated. As a result, adhesiveness is developed on the surface 51 of the bonding film 5 ′.

  Here, “activating” the bonding film 5 a means that the surface 51 of the bonding film 5 ′ and the leaving group 303 inside the bonding film 5 ′ are released, and a bond that is not terminated in the Si skeleton 301 (hereinafter, “not yet”). It is also referred to as a “bond” or “dangling bond”), a state in which this unbonded hand is terminated by a hydroxyl group (OH group), or a state in which these states are mixed.

Therefore, the active hand 304 means a dangling bond (dangling bond) or a dangling bond terminated with a hydroxyl group. According to such an active hand 304, a particularly strong bond can be made to the coil 212.
The latter state (state in which the dangling bond is terminated by a hydroxyl group) is, for example, that the moisture in the atmosphere terminates the dangling bond by irradiating the bonding film 5a with energy rays in the atmospheric air. Can be easily generated.

[4]
Next, an integrated coil 212, wiring 231 and terminal 242 and integrated wiring 221 and terminal 241 are prepared. And as shown in FIG.7 (d), each member is bonded together so that these may closely_contact | adhere with bonding film | membrane 5 'which expresses the said adhesiveness. At this time, in the bonding film 5 ′, the portion bonded to the coil 212 becomes the bonding film 5a, the portion bonded to the wiring 221 and the terminal 241 becomes 5c, and the portion bonded to the wiring 231 and the terminal 242 becomes 5d. By such joining, as shown in FIG. 7D, the movable plate 21 and the coil 212 are joined (adhered) via the joining film 5a. Thereafter, the wiring 214 is installed.

  Here, it is preferable that the thermal expansion coefficients of the base 2 (movable plate 21) and the coils 212 (wirings 221, 231 and terminals 241, 242) to be joined as described above are substantially equal. If the coefficients of thermal expansion of the base 2 and the coil 212 are approximately equal, when they are bonded together, it is difficult for stress associated with thermal expansion to occur at the bonding interface. As a result, it is possible to reliably prevent problems such as peeling in the finally obtained actuator 1.

Even when the thermal expansion coefficients of the base 2 and the coil 212 are different from each other, the base 2 and the coil 212 are made to have high dimensions by optimizing the conditions for bonding the base 2 and the coil 212 as follows. It can be firmly joined with accuracy.
That is, when the coefficients of thermal expansion of the base 2 and the coil 212 are different from each other, it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.

  Specifically, the base 2 and the coil 212 are bonded together in a state where the temperature of the base 2 and the coil 212 is about 25 to 50 ° C., depending on the difference in thermal expansion coefficient between the base 2 and the coil 212. Is preferable, and it is more preferable to bond together in the state which is about 25-40 degreeC. Within such a temperature range, even if the difference in thermal expansion coefficient between the base 2 and the coil 212 is large to some extent, the thermal stress generated at the bonding interface can be sufficiently reduced. As a result, it is possible to reliably prevent the actuator 1 from warping or peeling.

Further, in this case, when the difference in thermal expansion coefficient between the base 2 and the coil 212 is 5 × 10 ⁻⁵ / K or more, the bonding is performed at the lowest possible temperature as described above. Is particularly recommended. In addition, by using the bonding film 5a (bonding film 5 ′), the movable plate 21 and the coil 212 can be firmly bonded even at a low temperature as described above.
Moreover, it is preferable that the base body 2 and the coil 212 have different rigidity from each other. Thereby, the base | substrate 2 and the coil 212 can be joined more firmly.

In addition, it is preferable to perform the surface treatment which raises the adhesiveness with the bonding film 5a beforehand to the area | region which forms the bonding film 5a (5b-5d) of the base | substrate 2 into a film. Thereby, the bonding strength between the base 2 and the bonding film 5 a can be further increased, and finally the bonding strength between the base 2 and the coil 212 can be increased.
Examples of the surface treatment include physical surface treatment such as sputtering treatment and blast treatment, plasma treatment using oxygen plasma, nitrogen plasma, etc., corona discharge treatment, etching treatment, electron beam irradiation treatment, ultraviolet irradiation treatment, ozone Examples include chemical surface treatment such as exposure treatment, or a combination of these. By performing such treatment, the region where the bonding film 5a of the base 2 is formed can be cleaned and the region can be activated.

Further, by using plasma treatment among these surface treatments, the surface of the substrate 2 can be particularly optimized in order to form the bonding film 5a.
In addition, when the base | substrate 2 which performs surface treatment is comprised with the resin material (polymer material), especially a corona discharge process, a nitrogen plasma process, etc. are used suitably.
Further, depending on the constituent material of the substrate 2, there is a material in which the bonding strength of the bonding film 5a is sufficiently high without performing the surface treatment as described above. Examples of the constituent material of the base 2 that can obtain such an effect include those mainly containing various metal-based materials and various silicon-based materials as described above.

The surface of the substrate 2 made of such a material is covered with an oxide film, and a relatively active hydroxyl group is bonded to the surface of the oxide film. Therefore, when the substrate 2 made of such a material is used, the substrate 2 and the bonding film 5a can be firmly adhered to each other without performing the surface treatment as described above.
In this case, the entire substrate 2 may not be made of the material as described above, and at least the vicinity of the surface of the region where the bonding film 5a is formed needs to be made of the material as described above.

Furthermore, when the following group or substance is included in the region where the bonding film 5a of the substrate 2 is formed, the bonding strength between the substrate 2 and the bonding film 5a is sufficient even without performing the above surface treatment. Can be high.
Examples of such groups and substances include functional groups such as hydroxyl groups, thiol groups, carboxyl groups, amino groups, nitro groups, and imidazole groups, radicals, ring-opened molecules, double bonds, and triple bonds. And at least one group or substance selected from the group consisting of a saturated bond, a halogen such as F, Cl, Br, and I, and a peroxide.

Further, it is preferable to appropriately select and perform various surface treatments as described above so that a surface having such a material can be obtained.
Further, instead of the surface treatment, it is preferable to form an intermediate layer in advance in at least the region of the substrate 2 where the bonding film 5a is formed.
This intermediate layer may have any function. For example, a layer having a function of improving adhesion to the bonding film 5a, a cushioning function (buffer function), a function of reducing stress concentration, and the like are preferable. By forming the bonding film 5a on the substrate 2 through such an intermediate layer, the bonding strength between the substrate 2 and the bonding film 5a can be increased, and a highly reliable bonded body, that is, the actuator 1 can be obtained. .

  Examples of the constituent material of the intermediate layer include metal materials such as aluminum and titanium, metal oxides, oxide materials such as silicon oxide, metal nitrides, and nitride materials such as silicon nitride. , Carbon-based materials such as graphite and diamond-like carbon, silane coupling agents, thiol-based compounds, metal alkoxides, self-assembled film materials such as metal-halogen compounds, etc., one or two of these A combination of more than one species can be used.

Further, among the intermediate layers formed of these materials, the intermediate layer formed of the oxide-based material can particularly increase the bonding strength between the base 2 and the bonding film 5a.
On the other hand, it is preferable that a region of the coil 212 that is in contact with the bonding film 5a is preliminarily subjected to a surface treatment that improves the adhesion with the bonding film 5a. As a result, the bonding strength between the coil 212 and the bonding film 5a can be further increased.

For this surface treatment, the same treatment as that described above for the substrate 2 can be applied.
Further, instead of the surface treatment, it is preferable to previously form an intermediate layer having a function of improving the adhesion with the bonding film 5a in a region of the coil 212 that contacts the bonding film 5a. As a result, the bonding strength between the coil 212 and the bonding film 5a can be further increased.
As the constituent material of the intermediate layer, the same constituent material as that of the intermediate layer formed on the substrate 2 can be used.

Here, a mechanism in which the base 2 and the coil 212 are bonded through the bonding film 5a in this step will be described.
For example, a case where a hydroxyl group is exposed in a region of the coil 212 that is joined to the base 2 will be described as an example. In this step, the base 2 When the coil 212 is bonded together, the hydroxyl group present on the surface 51 of the bonding film 5a and the hydroxyl group present in the region of the coil 212 are attracted to each other by hydrogen bonding, and an attractive force is generated between the hydroxyl groups. It is assumed that the base body 2 and the coil 212 are bonded to each other through the bonding film 5a by this attractive force.

Further, the hydroxyl groups attracting each other by the hydrogen bond are cleaved from the surface with dehydration condensation depending on the temperature condition or the like. As a result, at the contact interface between the bonding film 5 a and the coil 212, the bonds in which the hydroxyl groups are bonded are bonded. Accordingly, it is assumed that the base 2 and the coil 212 are more firmly bonded via the bonding film 5a.
Note that the active state of the surface of the bonding film 5a activated in the step [3] relaxes with time. For this reason, it is preferable to perform this process [4] as soon as possible after completion of the process [3]. Specifically, after the completion of the step [3], the step [4] is preferably performed within 60 minutes, and more preferably within 5 minutes. If within this time, the surface of the bonding film 5a is maintained in a sufficiently active state. Therefore, when the movable plate 21 including the bonding film 5a and the coil 212 are bonded together in this step, the bonding film 5a has a sufficient space between them. Can obtain a high bonding strength.
The bonding strength between the substrate 2 and the coil 212 bonded in this manner is preferably 5 MPa (50 kgf / cm ² ) or more, and more preferably 10 MPa (100 kgf / cm ² ) or more. With such a bonding strength, peeling of the bonding interface can be sufficiently prevented. And the highly reliable actuator 1 is obtained.

[5]
On the other hand, as shown in FIG. 8E, a substrate 32 is prepared, and a bonding film 6 ′ is formed on the substrate 32. The bonding film 6 ′ can be formed into bonding films 6a, 6b, and 6c by processing in a process described later. The method for forming the bonding film 6 ′ is the same as the method for forming the bonding film 5 ′ described above.

[6]
Next, energy is applied to the bonding film 6 ′. Thereby, adhesiveness with base material 31 'of the frame-shaped body 31 expresses in joining film | membrane 6'. Then, the base material 31 ′ and the substrate 32 are bonded together so that the bonding film 6 ′ exhibiting adhesiveness and the base material 31 ′ are in close contact with each other. Accordingly, as shown in FIG. 8F, the base material 31 ′ and the substrate 32 are bonded (adhered) via the bonding film 6 ′. The application of energy to the bonding film 6 ′ can be performed by a method similar to the method of applying energy to the bonding film 5 ′ described above.

[7]
Next, as shown in FIG. 8G, an opening 311 is formed in the base material 31 ′. The opening 311 is formed by using one or a combination of two or more of physical etching methods such as dry etching, reactive ion etching, beam etching, and optically assisted etching, and chemical etching methods such as wet etching. be able to.
By this step, the frame body 31 is formed from the base material 31 ′. Further, a portion of the bonding film 6 ′ bonded to the frame body 31 becomes the bonding film 6a.

[8]
Next, as shown in FIG. 9H, the substrate 2 (structure) obtained in the step [4] (in the state shown in FIG. 7D) is inverted and obtained in the step [7]. It is made to oppose to the support body 3 (state shown in FIG.8 (g)). From this state, the base 2 is brought close to the support 3 and bonded together. At this time, a portion of the bonding film 5 ′ bonded to the frame body 31 becomes the bonding film 5b. The substrate 2 and the support 3 are bonded through the bonding film 5b (see FIG. 9 (i)).

[9]
Next, as shown in FIG. 9 (j), a magnet 41 (same for the magnet 42) is prepared, and this magnet 41 is joined to a predetermined portion of the support 3 (joining film 6 ′). At this time, portions of the bonding film 6 ′ bonded to the magnets 41 and 42 become bonding films 6b and 6c. Magnets 41 and 42 are bonded to support 3 through bonding films 6b and 6c.
The actuator 1 is manufactured through the steps as described above.
Such an optical scanner (actuator 1) can be suitably applied to an image forming apparatus such as a laser printer, an imaging display, a barcode reader, or a scanning confocal microscope.

Hereinafter, a specific example of an image forming apparatus provided with the actuator of the present invention will be described.
First, an example in which the image forming apparatus of the present invention is applied to a printer that employs an electrophotographic system will be described.
FIG. 19 is a schematic cross-sectional view of the overall configuration showing an example of the image forming apparatus (printer) of the present invention, and FIG. 20 is a diagram showing the schematic configuration of the exposure unit provided in the image forming apparatus shown in FIG. .

An image forming apparatus 110 (printer) shown in FIG. 19 records an image made of toner on a recording medium P such as paper or an OHP sheet by a series of image forming processes including exposure, development, transfer, and fixing. As shown in FIG. 19, such an image forming apparatus 110 has a photoconductor 111 that rotates in the direction of the arrow shown in the drawing, and sequentially, along the rotation direction, a charging unit 112, an exposure unit 113, a developing unit 114, and a transfer unit. A unit 115 and a cleaning unit 116 are provided. Further, the image forming apparatus 110 is provided with a paper feed tray 117 that accommodates a recording medium P such as paper at the lower part in FIG. 19, and a fixing device 118 at the upper part.
In such an image forming apparatus 110, first, in response to a command from a host computer (not shown), the photosensitive member 111, a developing roller (not shown) provided in the developing unit 114, and the intermediate transfer belt 151 start to rotate. The photosensitive member 111 is sequentially charged by the charging unit 112 while rotating.

The charged region of the photoconductor 111 reaches an exposure position as the photoconductor 111 rotates, and a latent image corresponding to image information of the first color, for example, yellow Y, is formed in the region by the exposure unit 113. .
The latent image formed on the photoconductor 111 reaches the development position as the photoconductor 111 rotates, and is developed with yellow toner by the developing device 144 for yellow development. As a result, a yellow toner image is formed on the photoreceptor 111. At this time, in the developing unit 114, the developing device 144 selectively faces the photoconductor 111 at the developing position. This selection is performed by changing the positions of the developing devices 141, 142, 143, and 144 while maintaining the relative positional relationship by the rotation of the holding body 145 about the axis 146.

  The yellow toner image formed on the photoconductor 111 reaches the primary transfer position (that is, the portion where the photoconductor 111 and the primary transfer roller 152 face each other) as the photoconductor 111 rotates, and is intermediated by the primary transfer roller 152. Transfer (primary transfer) is performed on the transfer belt 151. At this time, a primary transfer voltage (primary transfer bias) having a polarity opposite to the charging polarity of the toner is applied to the primary transfer roller 152. During this time, the secondary transfer roller 155 is separated from the intermediate transfer belt 151.

The same processing as described above is repeatedly executed for the second color, the third color, and the fourth color, so that the toner images of the respective colors corresponding to the respective image signals are transferred onto the intermediate transfer belt 151 in an overlapping manner. The As a result, a full color toner image is formed on the intermediate transfer belt 151.
On the other hand, the recording medium P is conveyed from the paper feed tray 117 to the secondary transfer position (that is, the portion where the secondary transfer roller 155 and the driving roller 154 face each other) by the paper feed roller 171 and the registration roller 172.

  The full color toner image formed on the intermediate transfer belt 151 reaches the secondary transfer position as the intermediate transfer belt 151 rotates, and is transferred (secondary transfer) to the recording medium P by the secondary transfer roller 155. At this time, the secondary transfer roller 155 is pressed against the intermediate transfer belt 151 and a secondary transfer voltage (secondary transfer bias) is applied. Further, the intermediate transfer belt 151 rotates while the driving roller 154 is rotated and the primary transfer roller 152 and the driven roller 153 are driven to rotate.

The full-color toner image transferred to the recording medium P is heated and pressurized by the fixing device 118 and fused to the recording medium P. Thereafter, in the case of single-sided printing, the recording medium P is discharged to the outside of the image forming apparatus 110 by the discharge roller pair 173.
On the other hand, after the primary transfer position has elapsed, the toner adhering to the surface of the photoconductor 111 is scraped off by the cleaning blade 161 of the cleaning unit 116 to prepare for charging to form the next latent image. The toner scraped off is collected by a residual toner collecting unit in the cleaning unit 116.

In the case of double-sided printing, after the recording medium P fixed on one surface by the fixing device 118 is once sandwiched by the paper discharge roller pair 173, the paper discharge roller pair 173 is driven in reverse and the conveyance roller pair 174, 176 is driven, the recording medium P is turned upside down through the transport path 175 and returned to the secondary transfer position, and an image is formed on the other surface of the recording medium P by the same operation as described above.
The exposure unit 113 provided in such an image forming apparatus receives image information from a host computer such as a personal computer (not shown), and selectively applies a laser on the uniformly charged photoreceptor 111 in accordance with the image information. It is an apparatus that forms an electrostatic latent image by irradiation.
More specifically, as shown in FIG. 20, the exposure unit 113 includes an actuator 1 that is an optical scanner, and a laser light source (light source) 131 that irradiates laser light L toward the light reflecting portion 211 of the actuator 1. A collimator lens 132 and an fθ lens 133.

In the exposure unit 113, the laser light L is irradiated from the laser light source 131 to the actuator 1 (light reflecting portion 211) via the collimator lens 132. Then, the laser beam L reflected by the light reflecting portion 211 is irradiated onto the photoconductor 111 through the fθ lens 133.
At that time, the light (laser L) reflected by the light reflecting portion 211 by the drive of the actuator 1 (rotation of the movable plate 21 around the rotation axis 215) is scanned (main scan) in the axial direction of the photosensitive member 111. The On the other hand, the light (laser L) reflected by the light reflecting portion 211 due to the rotation of the photosensitive member 111 is scanned (sub-scanned) in the circumferential direction of the photosensitive member 111. Further, the intensity of the laser light L output from the laser light source 131 changes according to image information received from a host computer (not shown).
In this way, the exposure unit 113 selectively exposes the surface of the photoconductor 111 to form an image (drawing).

Next, an example in which the image forming apparatus of the present invention is applied to an imaging display (display device) will be described.
FIG. 21 is a schematic view showing an example of an image forming apparatus (imaging display) of the present invention.
An image forming apparatus 119 shown in FIG. 21 includes an actuator 1 that is an optical scanner, light sources 191, 192, and 193 that emit light of three colors R (red), G (green), and B (blue), and a cross dichroic. A prism (X prism) 194, a galvano mirror 195, a fixed mirror 196, and a screen 197 are provided.

In such an image forming apparatus 119, light of each color is irradiated from the light sources 191, 192, 193 to the actuator 1 (light reflection unit 211) via the cross dichroic prism 194. At this time, the red light from the light source 191, the green light from the light source 192, and the blue light from the light source 193 are combined by the cross dichroic prism 194.
The light (three colors of combined light) reflected by the light reflecting portion 211 of the movable portion 21 is reflected by the galvanometer mirror 195, then reflected by the fixed mirror 196, and irradiated on the screen 197.

At that time, the light reflected by the light reflecting portion 211 by the drive of the actuator 1 (the rotation of the movable plate 21 around the rotation axis 215) is scanned (main scan) in the horizontal direction of the screen 197. On the other hand, the light reflected by the light reflecting portion 211 is scanned (sub-scanned) in the vertical direction of the screen 197 due to the rotation of the galvano mirror 195 around the axis Y perpendicular to the rotation axis 215. Further, the intensity of light output from each of the light sources 191, 192, 193 varies according to image information received from a host computer (not shown).
In this way, the image forming apparatus 119 performs image formation (drawing) on the screen 197.

Second Embodiment
FIG. 11 is a cross-sectional view showing a second embodiment of the actuator of the present invention.
Hereinafter, a second embodiment of the actuator of the present invention will be described with reference to this figure, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the formation state (shape) of the bonding film is different.

In the actuator 1A shown in FIG. 11, the bonding film 5e for bonding the movable plate 21 and the coil 212 is formed so as to follow the shape of the coil 212 in a plan view, that is, in a planar spiral shape. . Since the bonding film 5e is smaller in size, mass, etc. than the bonding film 5a of the first embodiment, the influence of inertia by the bonding film 5e can be suppressed when the movable plate 21 rotates.
The method for forming the bonding film 5e is not particularly limited. For example, a method of forming the bonding film 5e on the mask using a mask having a window having a shape corresponding to the coil 212 may be used.

<Third Embodiment>
FIG. 12 is a plan view showing a third embodiment of the actuator of the present invention, and FIG. 13 is a sectional view taken along the line CC in FIG.
Hereinafter, the third embodiment of the actuator of the present invention will be described with reference to these drawings, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.
The present embodiment is the same as the first embodiment except that the configuration of the connecting portion that connects the movable plate and the support portion is different from the installation location of the coil.

In the actuator 1 </ b> B shown in FIG. 12, one of the two connecting portions (left side in FIG. 12) that connects the movable plate 21 and the support portion 24 is provided in the middle of the shaft member 22 and the shaft member 22. The other (right side in FIG. 12) connecting portion is composed of a shaft member 23 and a drive plate 25 b provided in the middle of the shaft member 22.
Since the shaft members 22 and 23 are the same as the shaft members 22 and 23 described in the first embodiment, the description thereof is omitted in this embodiment.

  Each of the drive plates 25a and 25b is a portion having a rectangular (quadrangle) plate shape in plan view. The drive plate 25 a is formed integrally with the shaft member 22. A coil 212 is bonded to the upper surface (one surface) of the drive plate 25a via a bonding film 5f (see FIG. 13). The drive plate 25b is formed integrally with the shaft member 23. A coil 212 is bonded to the upper surface of the drive plate 25b via a bonding film 5f (see FIG. 13). The bonding film 5h is a film having substantially the same configuration as the bonding film 5a described in the first embodiment. Thereby, in the actuator 1B, the drive plate 25a (the same applies to the drive plate 25b) and the coil 212 are firmly joined.

  As shown in FIG. 12, each coil 212 is electrically connected to the terminal 241 through the wiring 221 and electrically connected to the terminal 242 through the wiring 231. In the present embodiment, the terminals 241 and 242 are disposed on the same side (right or left side in FIG. 12) with respect to the movable plate 21. Further, the wirings 221, 231 and the terminals 241, 242 are bonded to the base 2 (supporting portion 24) via the bonding film 5h (see FIG. 13). The bonding film 5h is a film having substantially the same configuration as the bonding films 5c and 5d described in the first embodiment. Thereby, in the actuator 1B, the wirings 221, 231 and the terminals 241, 242 and the base 2 are firmly joined.

  In the actuator 1B having such a configuration, when an AC voltage is applied to each coil 212 and the coil 212 is energized in a magnetic field generated by the magnets 41 and 42, a Lorentz force is generated in the coil 212. At this time, the drive plates 25a and 25b rotate around the rotation shaft 215. Such rotation of the drive plates 25 a and 25 b is transmitted to the movable plate 21 via the shaft members 22 and 23, and the movable plate 21 rotates about the rotation shaft 215. Each of the drive plates 25 a and 25 b is smaller in size than the movable plate 21. Thereby, each drive plate 25a, 25b can be easily rotated, respectively, and therefore the movable plate 21 can be rotated efficiently and with high accuracy. When the two coils 212 are energized, the energization directions of these coils 212 are the same, that is, the Lorentz forces acting on the coils 212 are not canceled out.

  Each coil 212 is formed in a spiral shape (wound) along the upper surface of the drive plate 25a (the same applies to the drive plate 25b). Such a spiral coil 212 generates a large Lorentz force compared to a coil formed in an annular shape, and is simpler in structure and manufactured than a coil formed three-dimensionally in the thickness direction of the movable plate 21. And the size can be suppressed.

Further, each coil 212 is wound along four sides of the movable plate 21 that is rectangular in plan view. Accordingly, when an AC voltage is applied to the coil 212 and the coil 212 is energized in the magnetic field generated by the magnets 41 and 42, Lorentz force (force received from the magnetic field) is surely generated in each coil 212.
In addition, although the coil 212 is arrange | positioned at the upper surface of the drive plate 25a (the drive plate 25b is also the same), it is not limited to this, For example, you may arrange | position on both surfaces.

<Fourth embodiment>
FIG. 14 is a partially enlarged view showing a state before applying energy of the bonding film in the actuator of the present invention (fourth embodiment), and FIG. 15 shows the state after applying energy of the bonding film in the actuator of the present invention (fourth embodiment). It is the elements on larger scale which show the state of. In the following description, the upper side in FIGS. 14 and 15 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the fourth embodiment of the actuator of the present invention will be described with reference to these drawings, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the structure of each bonding film is different.
That is, in the actuator according to the present embodiment, each of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c is in a state before energy application, and a metal atom, an oxygen atom bonded to the metal atom, and these And a leaving group 303 bonded to at least one of a metal atom and an oxygen atom. In other words, each of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c before energy application is a film obtained by introducing a leaving group 303 into a metal oxide film made of a metal oxide. Can be said.
When each of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c is provided with energy, the leaving group 303 is detached from at least one of a metal atom and an oxygen atom, and each bonding film 5a, Active hands 304 are generated at least near the surface of 5b, 5c, 5d, 6a, 6b, and 6c. As a result, the same adhesiveness as in the first embodiment is expressed on the surfaces of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c.

Hereinafter, the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c according to the present embodiment will be described. Since these configurations are common, the bonding film 5a will be described as a representative.
The bonding film 5a is composed of a metal atom and an oxygen atom bonded to the metal atom, that is, the bonding film 5a is formed by bonding the leaving group 303 to the metal oxide, so that the bonding film 5a is a strong film that is not easily deformed. . For this reason, the bonding film 5a itself has high dimensional accuracy, and the actuator 1 finally obtained also has high dimensional accuracy.

  Further, the bonding film 5a is a solid having no fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 5a) are hardly changed compared to a liquid or viscous liquid (semi-solid) adhesive having fluidity. Therefore, the dimensional accuracy of the actuator 1 obtained by using the bonding film 5a is remarkably higher than the conventional one. Furthermore, since the time required for curing the adhesive is not required, strong bonding can be achieved in a short time.

  In the present invention, the bonding film 5a is preferably conductive. Thereby, in the actuator 1, unintended charging can be suppressed or prevented. When the bonding film 5a has conductivity, the bonding film 5a and the coil 212 are insulated by interposing an insulating film therebetween. Thereby, it is possible to prevent a short circuit from occurring when the coil 212 is energized. The insulating film is formed on the outer periphery of the wire constituting the coil 212. The constituent material of the insulating film is not particularly limited as long as it has insulating properties, and examples thereof include resins.

Also, if the bonding film 5a has conductivity, the resistivity of the bonding film 5a, although slightly different depending on the composition of the material, but preferably not more than ^{1 × 10 -3 Ω · cm,} 1 × 10 - More preferably, it is ⁴ Ω · cm or less.
The leaving group 303 only needs to be present at least near the surface 51 of the bonding film 5a, may be present almost throughout the bonding film 5a, or is unevenly distributed near the surface 51 of the bonding film 5a. May be. In addition, by setting the leaving group 303 to be unevenly distributed in the vicinity of the surface 51, the function as a metal oxide film can be suitably exhibited in the bonding film 5a. In other words, the bonding film 5a can be advantageously provided with a function as a metal oxide film having excellent characteristics such as conductivity in addition to the function responsible for bonding. In other words, it is possible to reliably prevent the leaving group 303 from impairing the properties of the bonding film 5a such as conductivity and translucency.
The metal atoms are selected so that the function as the bonding film 5a as described above is suitably exhibited.

Specifically, the metal atom is not particularly limited. For example, Li, Be, B, Na, Mg, Al, K, Ca, Sc, V, Cr, Mn, Fe, Co, Ni, Cu, Zn Ga, Rb, Sr, Y, Zr, Nb, Mo, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Ti, Pb, and the like. Among these, it is preferable to use one or more of In (indium), Sn (tin), Zn (zinc), Ti (titanium), and Sb (antimony) in combination. When the bonding film 5a contains these metal atoms, that is, a metal oxide containing these metal atoms introduces a leaving group 303, the bonding film 5a exhibits excellent conductivity. It becomes.
More specifically, examples of the metal oxide include indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), fluorine-containing indium tin oxide (FTO), and zinc oxide. (ZnO) and titanium dioxide (TiO _2), and the like.

When indium tin oxide (ITO) is used as the metal oxide, the atomic ratio of indium to tin (indium / tin ratio) is preferably 99/1 to 80/20, and 97/3 More preferably, it is -85/15. Thereby, the effects as described above can be more remarkably exhibited.
The abundance ratio of metal atoms to oxygen atoms in the bonding film 5a is preferably about 3: 7 to 7: 3, more preferably about 4: 6 to 6: 4. By setting the abundance ratio of metal atoms and oxygen atoms to be within the above range, the stability of the bonding film 5a increases, and the movable plate 21 and the coil 212 can be bonded more firmly.

  Further, as described above, the leaving group 303 behaves so as to generate an active hand in the bonding film 5a by leaving from at least one of a metal atom and an oxygen atom. Accordingly, the energy is applied to the leaving group 303 relatively easily and uniformly, but when the energy is not applied, the leaving group 303 is securely bonded to the bonding film 5a so as not to be detached. Those are preferably selected.

  From this viewpoint, the leaving group 303 is preferably a hydrogen atom, a carbon atom, a nitrogen atom, a phosphorus atom, a sulfur atom, a halogen atom, or at least one of atomic groups composed of these atoms. It is done. Such a leaving group 303 is relatively excellent in binding / leaving selectivity by applying energy. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness between the movable plate 21 and the coil 212 can be enhanced.

Examples of the atomic group (group) composed of the above atoms include, for example, an alkyl group such as a methyl group and an ethyl group, an alkoxy group such as a methoxy group and an ethoxy group, a carboxyl group, an amino group, and a sulfonic acid. Groups and the like.
Among the atoms and atomic groups as described above, the leaving group 303 is particularly preferably a hydrogen atom. Since the leaving group 303 composed of hydrogen atoms has high chemical stability, the bonding film 5a having a hydrogen atom as the leaving group 303 has excellent weather resistance.

Considering the above, as the bonding film 5a, indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), fluorine-containing indium tin oxide (FTO), zinc oxide ( A material in which a hydrogen atom is introduced as a leaving group 303 into a metal oxide of ZnO) or titanium dioxide (TiO ₂ ) is preferably selected.
The bonding film 5a having such a configuration itself has excellent mechanical characteristics. In addition, it exhibits particularly excellent adhesion to many materials. Therefore, such a bonding film 5a adheres particularly firmly to the movable plate 21, and also exhibits a particularly strong adhesion to the coil 212. As a result, the movable plate 21 and the coil 212 are firmly bonded. Can be joined.

Further, the average thickness of the bonding film 5a is preferably about 1 to 1000 nm, and more preferably about 2 to 800 nm. By setting the average thickness of the bonding film 5a within the above range, it is possible to bond the movable plate 21 and the coil 212 more firmly while preventing the dimensional accuracy of the actuator 1 from being significantly lowered.
That is, when the average thickness of the bonding film 5a is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 5a exceeds the upper limit, the dimensional accuracy of the actuator 1 may be significantly reduced.

Furthermore, if the average thickness of the bonding film 5a is within the above range, a certain degree of shape followability is ensured for the bonding film 5a. For this reason, for example, even when unevenness exists on the bonding surface of the movable plate 21 (the surface on which the bonding film 5a is formed), the bonding is performed so as to follow the shape of the unevenness depending on the height of the unevenness. The film 5a can be deposited. As a result, the bonding film 5a can absorb the unevenness and reduce the height of the unevenness generated on the surface. Then, when the movable plate 21 and the coil 212 are bonded together, the adhesion of the bonding film 5a to the coil 212 can be enhanced.
In addition, the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 5a increases. Therefore, in order to ensure sufficient shape followability, the thickness of the bonding film 5a should be as large as possible.

  In the bonding film 5a as described above, when the leaving group 303 is present in almost the entire bonding film 5a, for example, A: physical atmosphere in an atmosphere containing an atomic component constituting the leaving group 303 is used. It can be formed by depositing a metal oxide material containing metal atoms and oxygen atoms by a phase film formation method. Further, when the leaving group 303 is unevenly distributed in the vicinity of the surface 51 of the bonding film 5a, for example, after forming a metal oxide film containing B: a metal atom and the oxygen atom, It can be formed by introducing a leaving group 303 into at least one of a metal atom and an oxygen atom contained in the vicinity of the surface.

Hereinafter, the case where the bonding film 5a (bonding film 5 ′) is formed on the movable plate 21 (base material 2 ′) using the methods A and B will be described in detail.
<A> In the method A, as described above, the bonding film 5a is formed of a metal atom and an oxygen by a physical vapor deposition method (PVD method) in an atmosphere containing an atomic component constituting the leaving group 303. It is formed by depositing a metal oxide material containing atoms. When the PVD method is used in this way, the leaving group 303 can be introduced into at least one of the metal atom and the oxygen atom relatively easily when the metal oxide material is made to fly toward the movable plate 21. it can. For this reason, the leaving group 303 can be introduced over almost the entire bonding film 5a.

  Furthermore, according to the PVD method, a dense and homogeneous bonding film 5a can be efficiently formed. Thereby, the bonding film 5a formed by the PVD method can be particularly strongly bonded to the coil 212. Furthermore, the bonding film 5a formed by the PVD method is maintained for a relatively long time in a state where energy is applied and activated. For this reason, the manufacturing process of the actuator 1 can be simplified and improved in efficiency.

  Further, examples of the PVD method include a vacuum deposition method, a sputtering method, an ion plating method, a laser ablation method, and the like. Among these, the sputtering method is preferably used. According to the sputtering method, metal oxide particles can be knocked out into an atmosphere containing an atomic component constituting the leaving group 303 without breaking a bond between a metal atom and an oxygen atom. Since the metal oxide particles can be brought into contact with a gas containing an atomic component constituting the leaving group 303, the leaving group to the metal oxide (metal atom or oxygen atom) can be contacted. 303 can be introduced more smoothly.

Hereinafter, as a method for forming the bonding film 5a by the PVD method, a case where the bonding film 5a is formed by a sputtering method (ion beam sputtering method) will be described as a representative.
First, prior to describing the method for forming the bonding film 5a, the bonding film 5a (bonding film 5 ') is used for forming the bonding film 5a (bonding film 5') on the movable plate 21 (base material 2 ') by ion beam sputtering. The film forming apparatus 800 will be described.

FIG. 16 is a longitudinal sectional view schematically showing a film forming apparatus used for manufacturing a bonding film according to this embodiment, and FIG. 17 is a schematic view showing a configuration of an ion source included in the film forming apparatus shown in FIG. is there. In the following description, the upper side in FIG. 16 is referred to as “upper” and the lower side is referred to as “lower”.
A film forming apparatus 800 shown in FIG. 16 is configured so that the bonding film 5a can be formed in a chamber (apparatus) by an ion beam sputtering method.

  Specifically, the film forming apparatus 800 includes a chamber (vacuum chamber) 811 and a substrate holder (film forming object holding unit) 812 that is installed in the chamber 811 and holds the movable plate 21 (film forming object). An ion source (ion supply unit) 815 that is installed in the chamber 811 and irradiates the ion beam B toward the chamber 811; and a metal oxide that includes metal atoms and oxygen atoms by irradiation with the ion beam B ( For example, it has a target holder (target holding portion) 817 for holding a target (metal oxide material) 816 for generating ITO.

In the chamber 811, gas supply means 860 for supplying a gas containing an atomic component constituting the leaving group 303 (for example, hydrogen gas) into the chamber 811 and the pressure in the chamber 811 are exhausted. And an exhaust means 830 for performing the operation.
In the present embodiment, the substrate holder 812 is attached to the ceiling of the chamber 811. The substrate holder 812 is rotatable. Thus, the bonding film 5a can be formed on the movable plate 21 with a uniform and uniform thickness.

As shown in FIG. 17, an ion source (ion gun) 815 includes an ion generation chamber 856 in which an opening (irradiation port) 850 is formed, a filament 857 provided in the ion generation chamber 856, grids 853 and 854, , And a magnet 855 installed outside the ion generation chamber 856.
Further, as shown in FIG. 16, the ion generation chamber 856 is connected to a gas supply source 819 for supplying a gas (sputtering gas) therein.

In the ion source 815, when the filament 857 is energized and heated in a state where gas is supplied from the gas supply source 819 into the ion generation chamber 856, electrons are emitted from the filament 857, and the emitted electrons are generated by the magnetic field of the magnet 855. It moves and collides with gas molecules supplied into the ion generation chamber 856. Thereby, gas molecules are ionized. The ions I ⁺ of the gas are extracted from the ion generation chamber 856 and accelerated by the voltage gradient between the grid 853 and the grid 854, and are emitted (irradiated) from the ion source 815 as an ion beam B through the opening 850. Is done.

The ion beam B irradiated from the ion source 815 collides with the surface of the target 816, and particles (sputtered particles) are knocked out from the target 816. This target 816 is made of a metal oxide material as described above.
In the film forming apparatus 800, the ion source 815 is fixed (installed) on the side wall of the chamber 811 so that the opening 850 is located in the chamber 811. Note that the ion source 815 can be arranged at a position separated from the chamber 811 and connected to the chamber 811 via a connection portion. 800 can be reduced in size.

Further, the ion source 815 is installed such that the opening 850 faces a direction different from that of the substrate holder 812, in this embodiment, the bottom side of the chamber 811.
Note that the number of ion sources 815 installed is not limited to one, and may be plural. By installing a plurality of ion sources 815, the deposition rate of the bonding film 5a can be increased.

In addition, a first shutter 820 and a second shutter 821 that can cover the target holder 817 and the substrate holder 812 are disposed, respectively.
These shutters 820 and 221 are for preventing the target 816, the movable plate 21, and the bonding film 5a from being exposed to an unnecessary atmosphere or the like, respectively.

The exhaust means 830 includes a pump 832, an exhaust line 831 that communicates the pump 832 and the chamber 811, and a valve 833 provided in the middle of the exhaust line 831. The pressure can be reduced.
Further, the gas supply means 860 includes a gas cylinder 864 that stores a gas (for example, hydrogen gas) containing an atomic component constituting the leaving group 303, a gas supply line 861 that guides the gas from the gas cylinder 864 to the chamber 811, and a gas The pump 862 and the valve 863 provided in the supply line 861 are configured so that a gas containing an atomic component constituting the leaving group 303 can be supplied into the chamber 811.
Using the film forming apparatus 800 having the above-described configuration, the bonding film 5a is formed as follows.

Here, a method of forming the bonding film 5a on the movable plate 21 will be described.
First, the movable plate 21 is prepared, and this movable plate 21 is carried into the chamber 811 of the film forming apparatus 800 and mounted (set) on the substrate holder 812.
Next, the exhaust unit 830 is operated, that is, the valve 833 is opened while the pump 832 is operated, whereby the inside of the chamber 811 is decompressed. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.

Further, the gas supply means 860 is operated, that is, the valve 863 is opened while the pump 862 is operated, so that the gas containing the atomic components constituting the leaving group 303 is supplied into the chamber 811. Thereby, the inside of a chamber can be made into the atmosphere containing this gas (hydrogen gas atmosphere).
The flow rate of the gas containing the atomic component constituting the leaving group 303 is preferably about 1 to 100 ccm, and more preferably about 10 to 60 ccm. Thereby, the leaving group 303 can be reliably introduced into at least one of the metal atom and the oxygen atom.
The temperature in the chamber 811 may be 25 ° C. or higher, but is preferably about 25 to 100 ° C. By setting within this range, the reaction between the metal atom or oxygen atom and the gas containing the atomic component is efficiently performed, and the gas containing the atomic component is reliably introduced into the metal atom and the oxygen atom. Can do.

Next, the second shutter 821 is opened, and the first shutter 820 is opened.
In this state, a gas is introduced into the ion generation chamber 856 of the ion source 815 and the filament 857 is energized and heated. Thereby, electrons are emitted from the filament 857, and the emitted electrons collide with gas molecules, whereby the gas molecules are ionized.

The gas ions I ⁺ are accelerated by the grid 853 and the grid 854, emitted from the ion source 815, and collide with a target 816 made of a cathode material. Thereby, particles of metal oxide (for example, ITO) are knocked out from the target 816. At this time, since the inside of the chamber 811 is in an atmosphere containing a gas containing an atomic component constituting the leaving group 303 (for example, in a hydrogen gas atmosphere), the metal atoms contained in the particles knocked out in the chamber 811 And a leaving group 303 is introduced into the oxygen atom. Then, the metal oxide introduced with the leaving group 303 is deposited on the movable plate 21 to form the bonding film 5a.

In the ion beam sputtering method described in this embodiment, in the ion generation chamber 856 of the ion source 815, a discharge is performed, the electron e ^- is occurs, the electron e ^- is shielded by the grid 853, Release into the chamber 811 is prevented.
Further, since the irradiation direction of the ion beam B (the opening 850 of the ion source 815) is directed to the target 816 (a direction different from the bottom side of the chamber 811), the ultraviolet rays generated in the ion generation chamber 856 are formed. Irradiation to the bonding film 5a is more reliably prevented, and it is possible to reliably prevent the leaving group 303 introduced during the formation of the bonding film 5a from being detached.
As described above, the bonding film 5a in which the leaving group 303 exists almost entirely can be formed.

  <B> On the other hand, in the method B, as described above, the bonding film 5a is formed of a metal oxide film containing metal atoms and oxygen atoms, and then the metal contained in the vicinity of the surface of the metal oxide film. It is formed by introducing a leaving group 303 into at least one of an atom and an oxygen atom. According to such a method, it is possible to introduce the leaving group 303 in an unevenly distributed state near the surface of the metal oxide film in a relatively simple process, and to achieve both characteristics as a bonding film and a metal oxide film. An excellent bonding film 5a can be formed.

  Here, the metal oxide film may be formed by any method, for example, PVD method (physical vapor deposition method), CVD method (chemical vapor deposition method), plasma polymerization method, etc. The film can be formed by various vapor phase film forming methods, various liquid phase film forming methods, and the like, and it is particularly preferable to form the film by the PVD method. According to the PVD method, a dense and homogeneous metal oxide film can be efficiently formed.

  Moreover, examples of the PVD method include a vacuum deposition method, a sputtering method, an ion plating method, a laser ablation method, and the like. Among these, it is preferable to use a sputtering method. According to the sputtering method, the metal oxide particles can be struck out into the atmosphere and supplied onto the movable plate 21 without breaking the bond between the metal atom and the oxygen atom. An oxide film can be formed.

  Furthermore, as a method for introducing the leaving group 303 near the surface of the metal oxide film, various methods are used. For example, the metal oxide film is formed in an atmosphere containing an atomic component constituting the B1: leaving group 303. Examples of the method include heat treatment (annealing), B2: ion implantation, and the like. In particular, it is preferable to use the method B1. According to the method B1, the leaving group 303 can be selectively introduced near the surface of the metal oxide film relatively easily. Further, by appropriately setting the processing conditions such as the atmospheric temperature and the processing time when performing the heat treatment, the amount of the leaving group 303 to be introduced, and further the thickness of the metal oxide film into which the leaving group 303 is introduced. Can be accurately controlled.

Hereinafter, a metal oxide film is formed by a sputtering method (ion beam sputtering method), and then the obtained metal oxide film is subjected to heat treatment (annealing) in an atmosphere containing an atomic component constituting the leaving group 303. Thus, the case where the bonding film 5a is obtained will be described as a representative.
Even when the bonding film 5a is formed using the method B, a film forming apparatus similar to the film forming apparatus 800 used when forming the bonding film 5a using the method A is used. A description of the film forming apparatus is omitted.

[I] First, the movable plate 21 is prepared. Then, the movable plate 21 is carried into the chamber 811 of the film forming apparatus 800 and mounted (set) on the substrate holder 812.
[Ii] Next, the inside of the chamber 811 is decompressed by opening the valve 833 while the exhaust means 830 is operated, that is, the pump 832 is operated. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.
At this time, the heating means is operated to heat the inside of the chamber 811. Although the temperature in the chamber 811 should just be 25 degreeC or more, it is preferable that it is about 25-100 degreeC. By setting within this range, a metal oxide film having a high film density can be formed.

[Iii] Next, the second shutter 821 is opened, and the first shutter 820 is further opened.
In this state, a gas is introduced into the ion generation chamber 856 of the ion source 815 and the filament 857 is energized and heated. Thereby, electrons are emitted from the filament 857, and the emitted electrons collide with gas molecules, whereby the gas molecules are ionized.
The gas ions I ⁺ are accelerated by the grid 853 and the grid 854, emitted from the ion source 815, and collide with a target 816 made of a cathode material. As a result, metal oxide (for example, ITO) particles are knocked out of the target 816 and deposited on the movable plate 21 to form a metal oxide film containing metal atoms and oxygen atoms bonded to the metal atoms. It is formed.

In the ion beam sputtering method described in this embodiment, in the ion generation chamber 856 of the ion source 815, a discharge is performed, the electron e ^- is occurs, the electron e ^- is shielded by the grid 853, Release into the chamber 811 is prevented.
Further, since the irradiation direction of the ion beam B (the opening 850 of the ion source 815) is directed to the target 816 (a direction different from the bottom side of the chamber 811), the ultraviolet rays generated in the ion generation chamber 856 are formed. Irradiation to the bonding film 5a is more reliably prevented, and it is possible to reliably prevent the leaving group 303 introduced during the formation of the bonding film 5a from being detached.

[Iv] Next, with the second shutter 821 opened, the first shutter 820 is closed.
In this state, the heating means is operated to further heat the chamber 811. The temperature in the chamber 811 is set to a temperature at which the leaving group 303 is efficiently introduced onto the surface of the metal oxide film, and is preferably about 100 to 600 ° C., more preferably about 150 to 300 ° C. preferable. By setting within this range, in the next step [v], the leaving group 303 can be efficiently introduced onto the surface of the metal oxide film without deteriorating / degrading the movable plate 21 and the metal oxide film. it can.

[V] Next, the gas supply means 860 is operated, that is, the valve 863 is opened in a state where the pump 862 is operated, whereby the gas containing the atomic components constituting the leaving group 303 is supplied into the chamber 811. Thereby, the inside of the chamber 811 can be made into an atmosphere containing such a gas (under a hydrogen gas atmosphere).
As described above, in the state where the inside of the chamber 811 is heated in the step [iv], the inside of the chamber 811 includes an atmosphere containing a gas containing an atomic component constituting the leaving group 303 (for example, under a hydrogen gas atmosphere). Then, the leaving group 303 is introduced into at least one of metal atoms and oxygen atoms existing near the surface of the metal oxide film, and the bonding film 5a is formed.
The flow rate of the gas containing the atomic component constituting the leaving group 303 is preferably about 1 to 100 ccm, and more preferably about 10 to 60 ccm. Thereby, the leaving group 303 can be reliably introduced into at least one of the metal atom and the oxygen atom.

  Note that it is preferable that the inside of the chamber 811 maintain a reduced pressure state adjusted by operating the exhaust means 830 in the step [ii]. Thereby, the leaving group 303 can be introduced more smoothly into the vicinity of the surface of the metal oxide film. In addition, by reducing the pressure in the chamber 811 in this step while maintaining the reduced pressure state in the step [ii], it is possible to save the time for reducing the pressure again. There is also an advantage that it can be achieved.

The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.
Moreover, it is preferable that the time which heat-processes is about 15 to 120 minutes, and it is more preferable that it is about 30 to 60 minutes.

Although depending on the type of leaving group 303 to be introduced, etc., the metal oxide film can be obtained by setting the conditions for the heat treatment (temperature in the chamber 811, degree of vacuum, gas flow rate, treatment time) within the above ranges. A leaving group 303 can be selectively introduced in the vicinity of the surface.
As described above, the bonding film 5a in which the leaving group 303 is unevenly distributed near the surface 51 can be formed.
In the actuator according to the present embodiment as described above, the same operations and effects as in the first embodiment can be obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the actuator of the present invention will be described. The description will focus on the differences from the above-described embodiment, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the structure of each bonding film is different.
That is, in the actuator according to the present embodiment, each of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c has a leaving group 303 composed of a metal atom and an organic component in a state before energy is applied. Is included.

  When each of such bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c is energized, the leaving group 303 is transferred from each bonding film 5a, 5b, 5c, 5d, 6a, 6b, and 6c. The active hand 304 is generated at least near the surface of each bonding film 5a, 5b, 5c, 5d, 6a, 6b, 6c. As a result, the same adhesiveness as in the second embodiment is expressed on the surfaces of the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c.

Hereinafter, the bonding films 5a, 5b, 5c, 5d, 6a, 6b, and 6c according to the present embodiment will be described. Since these configurations are common, the bonding film 5a will be described as a representative.
The bonding film 5 a is provided on the movable plate 21 and includes a leaving group 303 composed of metal atoms and organic components.
When energy is applied to such a bonding film 5a, the bond of the leaving group 303 is cut and desorbed from at least the vicinity of the surface 51 of the bonding film 5a, and as shown in FIG. 15, at least the surface of the bonding film 5a. In the vicinity of 51, an active hand 304 is generated. Thereby, adhesiveness is developed on the surface 51 of the bonding film 5a. When such adhesiveness develops, the movable plate 21 provided with the bonding film 5a can be firmly and efficiently bonded to the coil 212 with high dimensional accuracy.

Further, since the bonding film 5a is a film including a metal atom and a leaving group 303 composed of an organic component, that is, an organic metal film, the bonding film 5a is a strong film that is hardly deformed. For this reason, the bonding film 5a itself has high dimensional accuracy, and the actuator 1 finally obtained also has high dimensional accuracy.
Such a bonding film 5a is a solid having no fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 5a) are hardly changed compared to a liquid or viscous liquid (semi-solid) adhesive having fluidity. Therefore, the dimensional accuracy of the actuator 1 obtained using such a bonding film 5a is remarkably higher than the conventional one. Furthermore, since the time required for the curing of the adhesive is not required, strong bonding can be achieved in a short time.

  In the present invention, the bonding film 5a is preferably conductive. Thereby, in the actuator 1, unintended charging can be suppressed or prevented. When the bonding film 5a has conductivity, the bonding film 5a and the coil 212 are insulated by interposing an insulating film therebetween. Thereby, it is possible to prevent a short circuit from occurring when the coil 212 is energized. The insulating film is formed on the outer periphery of the wire constituting the coil 212. The constituent material of the insulating film is not particularly limited as long as it has insulating properties, and examples thereof include resins.

The metal atom and the leaving group 303 are selected so that the function as the bonding film 5a as described above is suitably exhibited.
Specifically, examples of the metal atom include Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Hf, Transition metal elements such as Ta, W, Re, Os, Ir, Pt, Au, various lanthanoid elements, various actinoid elements, Li, Be, Na, Mg, Al, K, Ca, Zn, Ga, Rb, Sr, Typical metal elements such as Cd, In, Sn, Sb, Cs, Ba, Tl, Pd, Bi, and Po are listed.

  Here, since the transition metal element is the only difference in the number of outermost electrons between the transition metal elements, the physical properties are similar. Transition metals generally have high hardness and melting point, and high electrical conductivity and thermal conductivity. For this reason, when a transition metal element is used as a metal atom, the adhesiveness expressed to the joining film 5a can be improved more. In addition, the conductivity of the bonding film 5a can be further increased.

  Further, when one or more of Cu, Al, Zn and Fe are used as metal atoms in combination, the bonding film 5a exhibits excellent conductivity. Further, when the bonding film 5a is formed by using a metal organic chemical vapor deposition method described later, a bonding film having a relatively easy and uniform film thickness using a metal complex containing these metals as a raw material. 5a can be formed.

  Further, as described above, the leaving group 303 behaves so as to generate an active hand in the bonding film 5a by detaching from the bonding film 5a. Accordingly, the energy is applied to the leaving group 303 relatively easily and uniformly, but when the energy is not applied, the leaving group 303 is securely bonded to the bonding film 5a so as not to be detached. Those are preferably selected.

Specifically, as the leaving group 303, an atomic group containing a carbon atom as an essential component and containing at least one of a hydrogen atom, a nitrogen atom, a phosphorus atom, a sulfur atom and a halogen atom is suitably selected. Such a leaving group 303 is relatively excellent in binding / leaving selectivity by applying energy. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness of the bonding film 5a can be made higher.
More specifically, examples of the atomic group (group) include an alkyl group such as a methyl group and an ethyl group, an alkoxy group such as a methoxy group and an ethoxy group, and a carboxyl group, and the end of the alkyl group is an isocyanate group. And those terminated with a group, an amino group, a sulfonic acid group, and the like.

Among the atomic groups as described above, the leaving group 303 is particularly preferably an alkyl group. Since the leaving group 303 composed of an alkyl group has high chemical stability, the bonding film 5a having an alkyl group as the leaving group 303 has excellent weather resistance.
In the bonding film 5a having such a configuration, the abundance ratio of metal atoms to oxygen atoms is preferably about 3: 7 to 7: 3, and more preferably about 4: 6 to 6: 4. By setting the abundance ratio of metal atoms and carbon atoms to be within the above range, the stability of the bonding film 5a increases, and the movable plate 21 and the coil 212 can be bonded more firmly. Further, the bonding film 5a can exhibit excellent conductivity.

The average thickness of the bonding film 5a is preferably about 1 to 1000 nm, and more preferably about 50 to 800 nm. By setting the average thickness of the bonding film 5a within the above range, it is possible to bond the movable plate 21 and the coil 212 more firmly while preventing the dimensional accuracy of the actuator 1 from being significantly lowered.
That is, when the average thickness of the bonding film 5a is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 5a exceeds the upper limit, the dimensional accuracy of the actuator 1 may be significantly reduced.

Furthermore, if the average thickness of the bonding film 5a is within the above range, a certain degree of shape followability is ensured for the bonding film 5a. For this reason, for example, even when unevenness exists on the bonding surface of the movable plate 21 (the surface on which the bonding film 5a is formed), the bonding is performed so as to follow the shape of the unevenness depending on the height of the unevenness. The film 5a can be deposited. As a result, the bonding film 5a can absorb the unevenness and reduce the height of the unevenness generated on the surface. Then, when the movable plate 21 and the coil 212 are bonded together, the adhesion of the bonding film 5a to the coil 212 can be enhanced.
In addition, the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 5a increases. Therefore, in order to ensure sufficient shape followability, the thickness of the bonding film 5a should be as large as possible.

  The bonding film 5a as described above may be formed by any method. For example, IIa: an organic substance containing a leaving group (organic component) 303 on a metal film composed of metal atoms is used as a metal film. A method of forming the bonding film 5a by selectively applying (chemical modification) almost to the entire surface or in the vicinity of the surface, IIb: an organic metal material having a metal atom and an organic substance containing a leaving group (organic component) 303 as a raw material As a method of forming the bonding film 5a using a metal organic chemical vapor deposition method (a method of laminating or forming a bonding layer formed of a monoatomic layer), IIc: an organic substance containing a metal atom and a leaving group 303 Examples thereof include a method in which an organic metal material is dissolved in an appropriate solvent as a raw material and a bonding film is formed using a spin coating method or the like. Among these, it is preferable to form the bonding film 5a by the method IIb. According to such a method, the bonding film 5a having a uniform film thickness can be formed by a relatively simple process.

Hereinafter, by the method of IIb, that is, the method of forming the bonding film 5a using a metal organic chemical vapor deposition method using a metal atom and an organic metal material having an organic substance containing a leaving group (organic component) 303 as a raw material, A case where the bonding film 5a is obtained will be described representatively.
First, prior to describing the method of forming the bonding film 5a, the film forming apparatus 400 used when forming the bonding film 5a will be described.

FIG. 18 is a vertical cross-sectional view schematically showing a film forming apparatus used for manufacturing a bonding film in the present embodiment. In the following description, the upper side in FIG. 18 is referred to as “upper” and the lower side is referred to as “lower”.
18 is a bonding film 5a (bonding film) formed on the movable plate 21 (base material 2 ′) by a metal organic chemical vapor deposition method (hereinafter sometimes abbreviated as “MOCVD method”). 5 ′) can be formed in the chamber 411.

  Specifically, the film forming apparatus 400 includes a chamber (vacuum chamber) 411 and a substrate holder (film forming object holding unit) 412 that is installed in the chamber 411 and holds the movable plate 21 (film forming object). An organic metal material supply means 460 for supplying a vaporized or atomized organic metal material into the chamber 411, a gas supply means 470 for supplying a gas for making the inside of the chamber 411 under a low reducing atmosphere, and a chamber Evacuation means 430 for evacuating the inside of 411 to control the pressure, and heating means (not shown) for heating the substrate holder 412.

The substrate holder 412 is attached to the bottom of the chamber 411 in this embodiment. The substrate holder 412 can be rotated by the operation of a motor. Thus, the bonding film 5a can be formed on the movable plate 21 with a uniform and uniform thickness.
Further, in the vicinity of the substrate holder 412, a shutter 421 that can cover them is provided. The shutter 421 is for preventing the movable plate 21 and the bonding film 5a from being exposed to an unnecessary atmosphere or the like.

The organometallic material supply unit 460 is connected to the chamber 411. The organometallic material supply means 460 includes a storage tank 462 that stores a solid organometallic material, a gas cylinder 465 that stores a carrier gas that feeds the vaporized or atomized organometallic material into the chamber 411, and a carrier gas. And a gas supply line 461 for introducing the vaporized or atomized organometallic material into the chamber 411, and a pump 464 and a valve 463 provided in the middle of the gas supply line 461. In the organometallic material supply unit 460 having such a configuration, the storage tank 462 has a heating unit, and the operation of the heating unit can heat and vaporize the solid organometallic material. Therefore, when the pump 464 is operated with the valve 463 opened and the carrier gas is supplied from the gas cylinder 465 to the storage tank 462, the organometallic material vaporized or atomized together with the carrier gas passes through the supply line 461. Then, it is supplied into the chamber 411.
In addition, it does not specifically limit as carrier gas, For example, nitrogen gas, argon gas, helium gas, etc. are used suitably.

  In this embodiment, the gas supply unit 470 is connected to the chamber 411. The gas supply means 470 includes a gas cylinder 475 for storing a gas for making the inside of the chamber 411 under a low reducing atmosphere, a gas supply line 471 for introducing the gas for making the low reducing atmosphere into the chamber 411, A pump 474 and a valve 473 provided in the middle of the gas supply line 471 are configured. In the gas supply means 470 having such a configuration, when the pump 474 is operated with the valve 473 opened, the gas for making the low reducing atmosphere is supplied from the gas cylinder 475 through the supply line 471 to the chamber 411. It is designed to be supplied inside. When the gas supply unit 470 is configured as described above, the inside of the chamber 411 can be surely set in a low reducing atmosphere with respect to the organometallic material. As a result, when forming the bonding film 5a by using the MOCVD method using the organometallic material as a raw material, at least a part of the organic component contained in the organometallic material is left as the leaving group 303 in the bonding film 5a. Is deposited.

The gas for bringing the inside of the chamber 411 into a low reducing atmosphere is not particularly limited, and examples thereof include nitrogen gas and rare gases such as helium, argon, and xenon, nitrogen monoxide, and dinitrogen monoxide. These can be used alone or in combination of two or more.
In the case of using an organic metal material containing an oxygen atom in the molecular structure, such as 2,4-pentadionate-copper (II) or [Cu (hfac) (VTMS)] described later. In addition, it is preferable to add hydrogen gas to the gas for achieving a low reducing atmosphere. Thereby, the reducibility with respect to oxygen atoms can be improved, and the bonding film 5a can be formed without excessive oxygen atoms remaining in the bonding film 5a. As a result, the bonding film 5a has a low abundance of the metal oxide in the film and exhibits excellent conductivity.

In addition, when at least one of the nitrogen gas, argon gas and helium gas described above is used as the carrier gas, the carrier gas can also exhibit a function as a gas for providing a low reducing atmosphere. it can.
The exhaust means 430 includes a pump 432, an exhaust line 431 that communicates the pump 432 and the chamber 411, and a valve 433 provided in the middle of the exhaust line 431. The pressure can be reduced.

The bonding film 5a is formed on the movable plate 21 by the MOCVD method using the film forming apparatus 400 configured as described above.
[I] First, the movable plate 21 (base material 2 ′) is prepared. Then, the movable plate 21 is carried into the chamber 411 of the film forming apparatus 400 and mounted (set) on the substrate holder 412.
[Ii] Next, the exhaust unit 430 is operated, that is, the valve 433 is opened while the pump 432 is operated, so that the inside of the chamber 411 is decompressed. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.

  In addition, by operating the gas supply means 470, that is, by opening the valve 473 while the pump 474 is operated, the gas for making the low reducing atmosphere is supplied into the chamber 411, and the inside of the chamber 411 is supplied. Under a low reducing atmosphere. The flow rate of the gas by the gas supply means 470 is not particularly limited, but is preferably about 0.1 to 10 sccm, and more preferably about 0.5 to 5 sccm.

  Further, at this time, the heating means is operated to heat the substrate holder 412. The temperature of the substrate holder 412 varies slightly depending on the type of the bonding film 5a to be formed, that is, the type of raw material used when forming the bonding film 5a, but is preferably about 80 to 600 ° C, and preferably 100 to 450 ° C. More preferably, it is about 200-300 degreeC. By setting within this range, it is possible to form the bonding film 5a having excellent adhesiveness using an organometallic material described later.

[Iii] Next, the shutter 421 is opened.
Then, by operating the heating means provided in the storage tank 462 in which the solid organic metal material is stored, the pump 464 is operated in a state where the organic metal material is vaporized, and the valve 463 is opened to vaporize. Alternatively, the atomized organometallic material is introduced into the chamber together with the carrier gas.

As described above, when the vaporized or atomized organometallic material is supplied into the chamber 411 in a state where the substrate holder 412 is heated in the step [ii], the organometallic material is heated on the movable plate 21. Thus, the bonding film 5a can be formed on the movable plate 21 in a state where a part of the organic matter contained in the organometallic material remains.
That is, according to the MOCVD method, if a film containing metal atoms is formed so that a part of the organic substance contained in the organometallic material remains, a part of the organic substance exhibits a function as the leaving group 303. The film 5a can be formed on the movable plate 21.

The organometallic material used in such MOCVD method is not particularly limited. For example, 2,4-pentadionate-copper (II), tris (8-quinolinolato) aluminum (Alq ₃ ), tris (4 - methyl-8-quinolinolato) aluminum (III) (Almq _3), (8- hydroxyquinoline) zinc _(Znq 2), copper phthalocyanine, Cu (hexafluoroacetylacetonate) (vinyltrimethylsilane) [Cu (hfac) (VTMS )], Cu (hexafluoroacetylacetonate) (2-methyl-1-hexen-3-ene) [Cu (hfac) (MHY)], Cu (perfluoroacetylacetonate) (vinyltrimethylsilane) [Cu ( pfac) (VTMS)], Cu (perfluoroacetylacetonate) 2-methyl-1-hexen-3-ene) [Cu (pfac) (MHY)] and other amides, acetylacetonates, alkoxys, silicon-containing silyls, and carboxyl groups containing various transition metal elements. Examples include carbonyl-based metal complexes, alkyl metals such as trimethylgallium, trimethylaluminum, and diethylzinc, and derivatives thereof. Among these, the organometallic material is preferably a metal complex. By using the metal complex, the bonding film 5a can be reliably formed in a state where a part of the organic substance contained in the metal complex remains.

  In this embodiment, the gas supply means 470 is operated to create a low reducing atmosphere in the chamber 411. By using such an atmosphere, pure metal is formed on the movable plate 21. Without forming a film, it is possible to form a film in a state where a part of the organic substance contained in the organometallic material remains. That is, it is possible to form the bonding film 5a having excellent characteristics as both the bonding film and the metal film.

The flow rate of the vaporized or atomized organometallic material is preferably about 0.1 to 100 ccm, and more preferably about 0.5 to 60 ccm. Accordingly, the bonding film 5a can be formed with a uniform film thickness and with a part of the organic substance contained in the organometallic material remaining.
As described above, when the bonding film 5a is formed, the residue remaining in the film is used as the leaving group 303, so there is no need to introduce a leaving group into the formed metal film or the like. The bonding film 5a can be formed by a relatively simple process.

Note that part of the organic substance remaining in the bonding film 5a formed using the organometallic material may function as the leaving group 303, or part of the organic substance may be the leaving group 303. It may function as.
As described above, the bonding film 5a can be formed.
In the actuator 1 according to the present embodiment as described above, the same operations and effects as in the first embodiment can be obtained.
The actuator and the image forming apparatus of the present invention have been described above with respect to the illustrated embodiment. However, the present invention is not limited to this, and each part constituting the actuator and the image forming apparatus exhibits the same function. It can be replaced with any configuration obtained. Moreover, arbitrary components may be added.

Further, the actuator and the image forming apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.
Further, the bonding film is formed on the movable plate of the movable plate and the coil when it is formed. However, the present invention is not limited to this. For example, the bonding film may be formed on both the movable plate and the coil. The film may be formed on the coil.

In the first embodiment and the second embodiment, the coil is disposed on the lower surface of the movable plate. However, the present invention is not limited to this, and the coil may be disposed on the upper surface side of the movable plate.
Moreover, in the said 3rd Embodiment, although each coil is each arrange | positioned at the upper surface of a drive plate, it is not limited to this, For example, you may arrange | position at the lower surface of a drive plate.
In the third embodiment, the bonding film for bonding the drive plate and the coil is formed so as to include the coil in plan view as in the first embodiment, but is not limited thereto. For example, it may be formed so as to follow the shape of the coil in plan view as in the second embodiment.

In the third embodiment, the coil may also be disposed on the movable plate.
Further, the coil is not limited to the one wound in a plane, and may be one wound three-dimensionally (around the axis in the thickness direction of the substrate), for example.
The coil is not limited to a single layer, and may be a layered body, for example.

It is a perspective view which shows 1st Embodiment of the actuator of this invention. It is a top view of the actuator shown in FIG. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is the elements on larger scale which show the state before energy provision of the joining film in the actuator shown in FIG. It is the elements on larger scale which show the state after the energy provision of the bonding film in the actuator shown in FIG. It is a figure for demonstrating the manufacturing method (manufacturing process) of the actuator shown in FIG. It is a figure for demonstrating the manufacturing method (manufacturing process) of the actuator shown in FIG. It is a figure for demonstrating the manufacturing method (manufacturing process) of the actuator shown in FIG. It is a figure which shows typically the plasma polymerization apparatus used for preparation of the joining film | membrane in the actuator shown in FIG. It is a cross-sectional view showing a second embodiment of the actuator of the present invention. It is a top view which shows 3rd Embodiment of the actuator of this invention. It is CC sectional view taken on the line in FIG. It is the elements on larger scale which show the state before the energy provision of the joining film | membrane in the actuator (4th Embodiment) of this invention. It is the elements on larger scale which show the state after the energy provision of the joining film | membrane in the actuator (4th Embodiment) of this invention. It is a longitudinal cross-sectional view which shows typically the film-forming apparatus used for preparation of a joining film. It is a schematic diagram which shows the structure of the ion source with which the film-forming apparatus shown in FIG. It is a longitudinal cross-sectional view which shows typically the film-forming apparatus used for preparation of a joining film. 1 is a schematic cross-sectional view of an overall configuration showing an example of an image forming apparatus (printer) of the present invention. It is a figure which shows schematic structure of the exposure unit with which the image forming apparatus shown in FIG. 19 was equipped. It is the schematic which shows an example of the image forming apparatus (imaging display) of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Actuator 2 ... Base | substrate 2 '... Base material 20 ... Vibration system (vibration part) 21 ... Movable plate 211 ... Light reflection part (mirror) 212 ... Coil 212a ... Part 214 ... Wiring 215 ... Rotating shaft 22 , 23 ... shaft members 221, 231 ... wiring 24 ... support parts 241, 242 ... terminals 243 ... openings 25a and 25b ... drive plates 3 ... support bodies 31 ... frame-like bodies 31 '... base material 311 ... openings 32 ... substrates 41, 42 ... Magnets 5a, 5b, 5c, 5d, 5e, 5f, 5h, 5 ', 6a, 6b, 6c, 6' ... Bonding film 51 ... Surface 110, 119 ... Image forming apparatus 111 ... Photoconductor 112 ... Charging Unit 113 ... Exposure unit 114 ... Development unit 115 ... Transfer unit 116 ... Cleaning unit 117 ... Paper feed tray 118 ... Fixing device 131 ... -The light source 132 ... collimator lens 133 ... f-theta lens 141, 142, 143, 144 ... developing device 145 ... holding body 146 ... shaft 151 ... intermediate transfer belt 152 ... primary transfer roller 153 ... driven roller 154 ... drive roller 155 ... secondary roller Transfer roller 161 ... Cleaning blade 171 ... Paper feed roller 172 ... Registration roller 173 ... Paper discharge roller pair 174, 176 ... Conveyance roller pair 175 ... Conveyance path 191, 192, 193 ... Light source 194 ... Cross dichroic prism 195 ... Galvano mirror 196 ... Fixed Mirror 197 ... Screen 301 ... Si skeleton 302 ... Siloxane (Si-O) bond 303 ... Leaving group 304 ... Active hand 400 ... Film forming apparatus 411 ... Chamber 412 ... Substrate holder 421 ... Shutter 430 ... Exhaust Means 431 ... Exhaust line 432 ... Pump 433 ... Valve 460 ... Organometallic material supply means 461 ... Gas supply line 462 ... Storage tank 463 ... Valve 464 ... Pump 465 ... Gas cylinder 470 ... Gas supply means 471 ... Gas supply line 473 ... Valve 474 DESCRIPTION OF SYMBOLS Pump 475 ... Gas cylinder 800 ... Film forming apparatus 811 ... Chamber 812 ... Substrate holder 815 ... Ion source 816 ... Target 817 ... Target holder 819 ... Gas supply source 820 ... First shutter 821 ... Second shutter 830 ... Exhaust means 831 ... exhaust line 832 ... pump 833 ... valve 850 ... opening 853, 854 ... grid 855 ... magnet 856 ... ion generation chamber 857 ... filament 860 ... gas supply means 861 ... gas supply line 862 ... Pump 863 ... Valve 864 ... Gas cylinder 900 ... Plasma polymerization apparatus 901 ... Chamber 902 ... Ground line 903 ... Supply port 904 ... Exhaust port 930 ... First electrode 939 ... Electrostatic chuck 940 ... Second electrode 970 ... Exhaust pump 971 ... Pressure control mechanism 980 ... Power supply circuit 982 ... High frequency power supply 983 ... Matching box 984 ... Wiring 990 ... Gas supply part 991 ... Liquid storage part 992 ... Vaporizer 993 ... Gas cylinder 994 ... Piping 995 ... Diffuser B ... Ion beam L ... Laser beam P ... Recording medium Y ... Axis

Claims (42)

A movable plate having a plate shape, and a pair of connecting portions that are arranged to face each other via the movable plate, are coupled to the movable plate, and rotatably support the movable plate about an axis parallel to the surface thereof. A vibrating part having
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a Si skeleton including a siloxane (Si-O) bond and a random atomic structure, and a leaving group bonded to the Si skeleton,
In the bonding film, energy is applied to at least a part of the region, so that the leaving group existing near the surface of the bonding film is detached from the Si skeleton and is expressed in the region on the surface of the bonding film. The actuator is characterized in that the vibrating portion and the coil are joined by the adhesive property.   2. The actuator according to claim 1, wherein a sum of a content ratio of Si atoms and a content ratio of O atoms among atoms obtained by removing H atoms from all atoms constituting the bonding film is 10 to 90 atomic%.   The actuator according to claim 1 or 2, wherein the abundance ratio of Si atoms and O atoms in the bonding film is 3: 7 to 7: 3.   The actuator according to any one of claims 1 to 3, wherein the crystallinity of the Si skeleton is 45% or less.   The leaving group includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or an atomic group arranged so that each of these atoms is bonded to the Si skeleton. The actuator according to any one of claims 1 to 4, wherein the actuator is composed of at least one selected from the group consisting of:   The actuator according to claim 5, wherein the leaving group is an alkyl group.   The actuator according to claim 1, wherein the bonding film is formed by a plasma polymerization method.   The actuator according to claim 7, wherein the bonding film is composed of polyorganosiloxane as a main material.   The actuator according to claim 8, wherein the polyorganosiloxane is mainly composed of a polymer of octamethyltrisiloxane.   The actuator according to claim 1, wherein an average thickness of the bonding film is 1 to 1000 nm.   The actuator according to claim 1, wherein the bonding film is a solid that does not have fluidity.   The actuator according to any one of claims 1 to 11, wherein a surface of the vibration portion that is in contact with the bonding film is previously subjected to a surface treatment that improves adhesion with the bonding film.   The actuator according to any one of claims 1 to 12, wherein a surface of the coil that is in contact with the bonding film is previously subjected to a surface treatment for improving adhesion to the bonding film.   The actuator according to claim 12 or 13, wherein the surface treatment is a plasma treatment.   The actuator according to claim 1, further comprising an intermediate layer between the vibrating portion and the bonding film.   The actuator according to claim 1, further comprising an intermediate layer between the coil and the bonding film.   The actuator according to claim 15 or 16, wherein the intermediate layer is composed mainly of an oxide-based material.   The energy is applied by at least one of a method of irradiating the bonding film with energy rays, a method of heating the bonding film, and a method of applying a compressive force to the bonding film. The actuator in any one of thru | or 17.   The actuator according to claim 18, wherein the energy beam is an ultraviolet ray having a wavelength of 150 to 300 nm.   The actuator according to claim 18 or 19, wherein the heating temperature is 25 to 100 ° C.   The actuator according to any one of claims 18 to 20, wherein the compressive force is 0.2 to 10 MPa. A movable plate having a plate shape, and a pair of connecting portions that are arranged to face each other via the movable plate, are coupled to the movable plate, and rotatably support the movable plate about an axis parallel to the surface thereof. A vibrating part having
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom,
In the bonding film, energy is applied to at least a part of the bonding film, whereby the leaving group existing near the surface of the bonding film is released from at least one of the metal atom and the oxygen atom, and the bonding film The vibration part and the coil are joined by the adhesiveness expressed in the region on the surface of the actuator. A movable plate having a plate shape, and a pair of connecting portions that are arranged to face each other via the movable plate, are coupled to the movable plate, and rotatably support the movable plate about an axis parallel to the surface thereof. A vibrating part having
A coil provided in the vibrating portion and having conductivity;
Magnetic field generating means for generating a magnetic field in the vicinity of the coil,
The vibrating portion and the coil are bonded via a bonding film,
The bonding film includes a metal atom and a leaving group composed of an organic component,
In the bonding film, energy is applied to at least a part of the bonding film, so that the leaving group existing near the surface of the bonding film is released from the bonding film and is expressed in the region on the surface of the bonding film. The actuator is characterized in that the vibrating portion and the coil are joined by the adhesive property.   The Lorentz force is generated by energizing the coil disposed in the magnetic field generated by the magnetic field generating means, and the movable plate is rotated about the axis by the Lorentz force. 24. The actuator according to any one of 23 to 23.   The actuator according to any one of claims 1 to 24, wherein the vibration unit is configured using a silicon material as a main material.   The actuator according to any one of claims 1 to 25, wherein the coil is made of a metal material as a main material.   27. The actuator according to any one of claims 1 to 26, wherein each of the connecting portions has a rod shape, and one end portion thereof is configured by a shaft member connected to an edge portion of the movable plate.   28. The actuator according to claim 27, wherein the coil is disposed on one side of the movable plate.   The actuator according to claim 28, wherein the coil is wound in a plane along the surface of the movable plate. The movable plate is a quadrangle in plan view,
30. The actuator according to claim 28 or 29, wherein the coil is wound along four sides of the square.   Each of the connecting portions has a rod shape, one end portion of which is connected to the edge of the movable plate, and a driving plate that is provided in the middle of the shaft member and has a plate shape. The actuator according to any one of claims 1 to 26.   32. The actuator according to claim 31, wherein each of the coils is disposed on one side or both sides of each drive plate.   The actuator according to claim 32, wherein the coil is wound in a plane along the surface of the drive plate. The drive plate is a quadrangle in plan view,
The actuator according to claim 32 or 33, wherein the coil is wound along four sides of the square.   The actuator according to any one of claims 1 to 21, and 24 to 34, wherein the bonding film is formed in a region including the coil in a plan view.   The actuator according to claim 22 or 23, wherein the bonding film is formed in a region including the coil in plan view, and the bonding film and the coil are insulated.   The actuator according to any one of claims 1 to 34, wherein the bonding film is formed along the shape of the coil in a plan view.   38. The actuator according to any one of claims 1 to 37, wherein the wire constituting the coil has a planar portion joined to the bonding film.   The actuator according to any one of claims 1 to 38, wherein the magnetic field generating means is configured by a pair of magnets arranged to face each other with different polarities via a rotation shaft of the movable plate.   The actuator according to any one of claims 1 to 39, further comprising a light reflecting portion that is provided on the movable plate and reflects light.   41. The actuator according to claim 40, wherein the actuator is an optical scanner that scans light reflected by the light reflecting portion. An actuator according to any of claims 1 to 41;
An image forming apparatus comprising: a light source that emits light toward the movable plate of the actuator.

Images