JP2009134195A - Optical device and image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device which gives an optical scanning suitable for an optical scanner for an image forming apparatus such as a projector in which the freedom of design is enhanced while reducing size, and to provide an image forming apparatus. <P>SOLUTION: The optical device 1 turns a movable plate 25 around a first axis line X by turning a driving member 22 around the first axis line X accompanied by a torsional deformation of respective first axis members 23 and 24, and at the same time, turns the movable plate 25 around a second axis line Y accompanied by a torsional deformation of respective second axis members 26 and 27, wherein the respective first axis members 23 and 24 have composing material different from that of the driving member 22, are composed of a material having smaller rigidity than that of the respective second axis members 26 and 27, and bonded to the driving member 22 via a bonding film, which includes a Si skeleton having a random atomic structure including siloxane (Si-O) bonding and a free radical bonded to the Si skeleton. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical device and an image forming apparatus.

For example, an optical scanner that performs drawing by scanning light two-dimensionally is known as an optical device used in an image forming apparatus such as a projector (see, for example, Patent Document 1).
The optical scanner of Patent Document 1 includes a frame-shaped outer movable plate, a pair of first torsion bars that pivotally support the outer movable plate around the X axis (rotation), and an outer movable plate. A scanner body in which an inner movable plate provided on the inner side and a pair of second torsion bars that pivotally support the inner movable plate about a Y axis orthogonal to the X axis are integrally formed of silicon. And a pair of drive coils provided on each of the outer movable plate and the inner movable plate, and a pair of permanent magnets provided so as to face each other via the scanner body. With such a configuration, the inner movable plate can be rotated around the X axis and Y axis, and the light reflected by the inner movable plate can be scanned two-dimensionally.

However, in the optical scanner according to Patent Document 1, since the scanner body is integrally formed of silicon, the oscillation frequency of the inner movable plate and the oscillation frequency of the outer movable plate are set to desired values. In doing so, the shape, size, and the like of the scanner body are limited, and the degree of freedom in design is low.
In particular, when such an optical scanner is incorporated into a projector, the rotation of the inner movable plate about the X axis is used for vertical scanning, and the rotation about the Y axis is used for horizontal scanning, and the vertical scanning frequency is significantly higher than the horizontal scanning frequency. When it is desired to increase the size, the drive member is increased in size, the length of each first torsion bar is increased, and consequently the size of the optical scanner is increased.

JP-A-8-322227

  An object of the present invention is to provide an optical device and an image forming apparatus capable of realizing optical scanning suitable for an optical scanner for an image forming apparatus such as a projector while reducing the size and improving design flexibility. It is in.

Such an object is achieved by the present invention described below.
The optical device of the present invention is provided inside the drive member, a frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, A movable plate having a light reflecting portion having reflectivity, and a pair of second shafts that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the driving member. A structure comprising a member;
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a Si skeleton including a siloxane (Si-O) bond and a random atomic structure, and a leaving group bonded to the Si skeleton,
In the bonding film, energy is applied to at least a part of the region, whereby the leaving group existing in the vicinity of the surface of the bonding film is detached from the Si skeleton and is expressed in the region on the surface of the bonding film. The first member and the second member are bonded to each other by the adhesive property.
As a result, it is possible to realize optical scanning suitable for an optical scanner for an image forming apparatus such as a projector while reducing the size and improving the degree of design freedom.

In the optical device of the present invention, it is preferable that the total of the Si atom content and the O atom content is 10 to 90 atom% among atoms obtained by removing H atoms from all atoms constituting the bonding film. .
Thus, in the bonding film, Si atoms and O atoms form a strong network, and the bonding film itself becomes stronger. For this reason, the bonding film exhibits particularly high bonding strength with respect to each of the driving member and each of the first shaft members.

In the optical device of the present invention, the abundance ratio of Si atoms and O atoms in the bonding film is preferably 3: 7 to 7: 3.
Thereby, the stability of the bonding film is increased, and the driving member and each first shaft member can be bonded more firmly.
In the optical device of the present invention, the crystallinity of the Si skeleton is preferably 45% or less.
As a result, the Si skeleton includes a sufficiently random atomic structure. For this reason, the characteristics of the Si skeleton become obvious, and the dimensional accuracy and adhesiveness of the bonding film become more excellent.

In the optical device of the present invention, the leaving group includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or each of these atoms bonded to the Si skeleton. It is preferably composed of at least one selected from the group consisting of atomic groups arranged in such a manner.
These leaving groups are relatively excellent in binding / leaving selectivity by applying energy. For this reason, such a leaving group can make the adhesiveness of the bonding film higher.
In the optical device of the present invention, the leaving group is preferably an alkyl group.
Since the alkyl group has high chemical stability, the bonding film containing the alkyl group as a leaving group is excellent in weather resistance and chemical resistance.

In the optical device of the present invention, the bonding film is preferably formed by a plasma polymerization method.
Thereby, the bonding film becomes dense and homogeneous. And a drive member and each 1st shaft member can be joined especially firmly. Furthermore, the bonding film manufactured by the plasma polymerization method is maintained for a relatively long time in a state where energy is applied and activated. For this reason, the manufacturing process of the optical device can be simplified and improved in efficiency.

In the optical device of the present invention, the bonding film is preferably composed of polyorganosiloxane as a main material.
As a result, the bonding film itself has excellent mechanical properties. In addition, a bonding film exhibiting particularly excellent adhesion to many materials can be obtained. Therefore, the driving member and each first shaft member can be bonded more firmly by this bonding film. Further, the bonding film can easily and reliably control the non-adhesiveness and the adhesiveness. Furthermore, the bonding film exhibits excellent liquid repellency.
In the optical device according to the aspect of the invention, it is preferable that the polyorganosiloxane is mainly composed of a polymer of octamethyltrisiloxane.
Thereby, a bonding film having particularly excellent adhesiveness can be obtained.

In the optical device of the present invention, the average thickness of the bonding film is preferably 1 to 1000 nm.
Thereby, these can be joined more firmly, preventing that the dimensional accuracy between a drive member and each 1st shaft member falls remarkably.
In the optical device according to the aspect of the invention, it is preferable that the bonding film is a solid having no fluidity.
As a result, an optical device with significantly higher dimensional accuracy than the conventional one can be obtained. Further, since the time required for curing the adhesive is not required, strong bonding can be achieved in a short time.

In the optical device according to the aspect of the invention, it is preferable that a surface of the first member that is in contact with the bonding film is subjected in advance to a surface treatment that improves adhesion with the bonding film.
As a result, the bonding strength between each first shaft member and the bonding film can be further increased, and as a result, the bonding strength between the drive member and each first shaft member can be increased.
In the optical device according to the aspect of the invention, it is preferable that a surface of the second member that is in contact with the bonding film is subjected in advance to a surface treatment that improves adhesion with the bonding film.
As a result, the bonding strength between the driving member and the bonding film can be further increased, and as a result, the bonding strength between the driving member and each first shaft member can be increased.
In the optical device according to the aspect of the invention, it is preferable that the surface treatment is a plasma treatment.
Thereby, in order to form a joining film | membrane, the surface of a drive member or each 1st shaft member can be optimized especially.

In the optical device according to the aspect of the invention, it is preferable that an intermediate layer is provided between the first member and the bonding film.
Thereby, the joining strength between each first shaft member and the joining film can be increased, and the durability of the optical device can be improved.
In the optical device according to the aspect of the invention, it is preferable that an intermediate layer is provided between the second member and the bonding film.
As a result, the bonding strength between the driving member and the bonding film can be increased, and the durability of the optical device can be improved.
In the optical device according to the aspect of the invention, it is preferable that the intermediate layer is formed using an oxide-based material as a main material.
Thus, the bonding strength can be increased between the driving member and the bonding film and between each first shaft member and the bonding film.

In the optical device according to the aspect of the invention, the energy may be applied by at least one of a method of irradiating the bonding film with energy rays, a method of heating the bonding film, and a method of applying a compressive force to the bonding film. It is preferable to be carried out by a method.
Thereby, energy can be imparted to the bonding film relatively easily and efficiently.

In the optical device of the present invention, the energy beam is preferably ultraviolet light having a wavelength of 150 to 300 nm.
As a result, the amount of energy applied is optimized, and the bond between the Si skeleton and the leaving group is selectively cut while preventing the Si skeleton in the bonding film from being destroyed more than necessary. can do. Thereby, adhesiveness can be expressed in the bonding film while preventing the characteristics (mechanical characteristics, chemical characteristics, etc.) of the bonding film from deteriorating.

In the optical device of the present invention, the heating temperature is preferably 25 to 100 ° C.
Thereby, it is possible to reliably activate the bonding film while reliably preventing the drive member, each first shaft member, and the like from being deteriorated or deteriorated by heat.
In the optical device of the present invention, the compressive force is preferably 0.2 to 10 MPa.
As a result, it is possible to develop sufficient adhesiveness in the bonding film simply by compressing it while avoiding damage to the driving member or each first shaft member.

The optical device of the present invention is provided inside the drive member, a frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, A movable plate having a light reflecting portion having reflectivity, and a pair of second shafts that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the driving member. A structure comprising a member;
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom,
In the bonding film, energy is applied to at least a part of the bonding film, so that the leaving group existing near the surface of the bonding film is released from at least one of the metal atom and the oxygen atom, and the bonding film The first member and the second member are bonded to each other by the adhesiveness developed in the region of the surface.
As a result, the bonding film is a metal film in which a leaving group is bonded to the metal oxide, and becomes a strong film that is difficult to deform. An optical device using such a bonding film can also be made suitable for an optical scanner for an image forming apparatus such as a projector while reducing the size and improving the design freedom.

The optical device of the present invention is provided inside the drive member, a frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, A movable plate having a light reflecting portion having reflectivity, and a pair of second shafts that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the driving member. A structure comprising a member;
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a metal atom and a leaving group composed of an organic component,
In the bonding film, energy is applied to at least a part of the bonding film, whereby the leaving group existing near the surface of the bonding film is released from the bonding film and is expressed in the region on the surface of the bonding film. The first member and the second member are bonded to each other by the adhesive property.
Accordingly, the bonding film includes a metal atom and a leaving group composed of an organic component, and becomes a strong film that is difficult to be deformed. An optical device using such a bonding film can also be made suitable for an optical scanner for an image forming apparatus such as a projector while reducing the size and improving the design freedom.

In the optical device of the present invention, it is preferable that the first member is made of metal as a main material.
The metal material has a relatively large specific gravity. Therefore, it is possible to make the vibration system composed of the driving member and the pair of first shaft members suitable for low-speed driving (vertical scanning) while effectively preventing an increase in size of the driving member.

In the optical device of the present invention, it is preferable that the second member is made of silicon as a main material.
Thereby, a movable plate and / or each 2nd shaft member can be comprised by using silicon as a main material. In this case, the dimensional accuracy of the movable plate and / or each second shaft member can be made excellent, and fatigue of the movable plate and each second shaft member can be suppressed. Therefore, the optical device can exhibit desired rotation characteristics (vibration characteristics) over a long period of time.

In the optical device of the present invention, the boundary portion is disposed in the vicinity of an end portion of the second shaft member on the movable plate side, and the pair of second shaft members and the driving member are It is preferable that the first member is formed integrally.
Thereby, the constituent material of a movable plate and the constituent material of each 2nd shaft member can be varied. As a result, the degree of freedom in designing the optical device can be improved.

In the optical device of the present invention, the boundary portion is disposed in the vicinity of the end portion on the driving member side of each of the second shaft members, and the pair of second shaft members and the movable plate include: It is preferable that the second member is formed integrally.
Thereby, a movable plate and each 2nd shaft member can be formed integrally. For this reason, the dimensional accuracy of the movable plate and the pair of second shaft members can be made relatively simple, and the vibration characteristics of the vibration system composed of these can be made good.
An image forming apparatus of the present invention includes the optical device of the present invention, and is configured to form an image by scanning the light reflected by the light reflecting section.
Thereby, an image forming apparatus having excellent drawing characteristics can be provided.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of an optical device and an image forming apparatus of the invention will be described with reference to the accompanying drawings.
<First Embodiment>
First, a first embodiment of the optical device of the present invention will be described.
1 is a perspective view showing a first embodiment of the optical device of the present invention, FIG. 2 is a plan view of the optical device shown in FIG. 1, FIG. 3 is a cross-sectional view taken along line AA in FIG. 2 is a cross-sectional view taken along the line BB in FIG. 2, FIG. 5 is a block diagram showing the configuration of the control system of the optical device shown in FIG. 1, and FIG. 6 shows the first voltage generator and the second voltage generator shown in FIG. FIG. 7 is a schematic diagram illustrating an example of an image forming apparatus (imaging display) according to the present invention.
In the following, for convenience of explanation, the front side of the paper in FIG. 2 is referred to as “up”, the back side of the paper is referred to as “down”, the right side is referred to as “right”, the left side is referred to as “left”, and the upper side in FIG. The upper side in FIG. 4 is called “upper”, the lower side is “lower”, the right side is “right”, and the left side is “right”. “Left”.

The optical device 1 shown in FIGS. 1 to 4 includes a base 2 provided with a vibration system that generates vibrations around a first axis X and a second axis Y that are orthogonal to each other, and a support that supports the base 2. 3 and a pair of magnets 41 and 42.
In FIG. 1, the direction parallel to the first axis X is referred to as “x direction”, the direction parallel to the second axis Y is referred to as “y direction”, and directions perpendicular to the x direction and the y direction are respectively defined. These are illustrated as “z direction”.

Hereinafter, each part which comprises the optical device 1 is demonstrated sequentially.
As shown in FIGS. 1 and 2, the base body 2 (structure) rotates the support member 21 around the first axis X with respect to the support portion 21, the frame-shaped drive member 22, and the support portion 21. A pair of second shaft members 23 and 24 that can be supported, a movable plate 25 provided inside the drive member 22, and the movable plate 25 can be rotated around the second axis Y with respect to the drive member 22. And a pair of second shaft members 26 and 27 to be supported.

  Here, the base body 2 serving as a structure has a boundary near the end on the driving member 22 side of each of the second shaft members 26 and 27, and the first member provided on the driving member 22 side and the movable plate 25. It is divided into a second member provided on the side. In the present embodiment, the first member is constituted by the drive member 22, and the second member is constituted by the movable plate 25 and the pair of second shaft members 26 and 27. As will be described in detail later, the first member is made of a material having a specific gravity greater than that of the constituent material of the movable plate 25 and is different from the constituent material of the second member. The two members are bonded via a bonding film as will be described in detail later.

The support portion 21 is composed of a pair of support members 211 and 212 that are spaced apart from each other and face each other. Each of the support members 211 and 212 is supported by a support 3 described later. A pair of terminals 213 and 214 for energizing a coil 221 to be described later are provided on the upper surface of the support member 211.
The constituent material of the support portion 21 (the support members 211 and 212) is not particularly limited as long as it has a relatively high rigidity. For example, a silicon material such as single crystal silicon, polycrystalline silicon, or amorphous silicon is used. Of metal materials such as stainless steel, titanium, aluminum, quartz glass, silicate glass (quartz glass), alkali silicate glass, soda lime glass, potash lime glass, lead (alkali) glass, barium glass, borosilicate glass Glass materials such as alumina, zirconia, ferrite, silicon nitride, aluminum nitride, boron nitride, titanium nitride, silicon carbide, boron carbide, titanium carbide, ceramic materials such as tungsten carbide, carbon materials such as graphite, polyethylene, polypropylene , Ethylene-propylene copolymer , Polyolefin such as ethylene-vinyl acetate copolymer (EVA), cyclic polyolefin, modified polyolefin, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylpentene-1) , Ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyoxymethylene, polyvinyl alcohol (PVA) ), Ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), polycyclohexane tele Polyester such as tarate (PCT), polyether, polyetherketone (PEK), polyetheretherketone (PEEK), polyetherimide, polyacetal (POM), polyphenylene oxide, modified polyphenylene oxide, modified polyphenylene ether resin (PBO), Polysulfone, polyethersulfone, polyphenylene sulfide (PPS), polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, styrene, polyolefin, polyvinyl chloride, polyurethane , Polyester, polyamide, polybutadiene, trans polyisoprene, fluoro rubber, chlorinated polyethylene, etc. Resin materials such as xy resin, phenol resin, urea resin, melamine resin, aramid resin, unsaturated polyester, silicone resin, polyurethane, etc., or copolymers, blends, polymer alloys, etc. mainly comprising these, or each of these The composite material etc. which combined the 1 type (s) or 2 or more types of material are mentioned.

The drive member 22 is provided between the pair of support members 211 and 212 in a state of being separated from the support members 211 and 212.
The drive member 22 has a frame shape (more specifically, a quadrangular ring shape).
The shape of the drive member 22 is determined according to the design of the optical device 1 and the like, and is not limited to the square ring as described above as long as it has a frame shape. An elliptical ring or the like may be used.
A coil 221 is joined to the upper surface of the drive member 22 via an insulating film (not shown). Note that the insulating film between the drive member 22 and the coil 221 may be omitted depending on the constituent material of the drive member 22 and the configuration of the coil 221.

  This coil 221 is formed of a strip-like wire (conductor) made of a metal such as Al or Cu along the circumferential direction of the drive member 22, and one end portion 222 of the wire is the above-described terminal 213, The other end is electrically connected to the terminal 214 via a wiring composed of, for example, a bonding wire. The pair of terminals 213 and 214 are joined to a power supply circuit 7 to be described later. By energization from the power supply circuit 7, the coil 221 generates a magnetic field having magnetic lines penetrating in the z direction inside the driving member 22.

  The drive member 22 is supported by the support member 211 via the first shaft member 23 and is supported by the support member 212 via the first shaft member 24. Here, the first shaft member 23 is bonded to the support member 211 via the bonding film 51, and is bonded to the driving member 22 via the bonding film 52. Similarly, the first shaft member 24 is bonded to the support member 212 via the bonding film 53 and is bonded to the driving member 22 via the bonding film 54. Thereby, as a constituent material of each 1st shaft members 23 and 24, the material different from the constituent material of the drive member 22 or each 2nd shaft members 26 and 27 can be used. The bonding films 51 to 54 will be described later in detail.

  Such a drive member 22 is made of a material having a specific gravity different from that of the constituent material of the movable plate 25, unlike the constituent materials of the first shaft members 23, 24 and the second shaft members. . That is, as described above, the first member constituted by the drive member 22 is different from the constituent material of the second member constituted by the movable plate 25 and the pair of second shaft members 26 and 27, and The movable plate 25 is made of a material having a specific gravity greater than that of the constituent material.

  The constituent material of the drive member 22 is relatively high in rigidity, is different from the constituent materials of the first shaft members 23 and 24 and the second shaft members, and has a specific gravity higher than that of the constituent material of the movable plate 25. The material is not particularly limited as long as it is made of a large material. For example, as with the material of the support portion 21 described above, a silicon material, a metal material, a glass material, a ceramic material, a carbon material, a resin material, or each of these materials The composite material etc. which combined the 1 type (s) or 2 or more types of material are mentioned.

Moreover, the material which gave each process, such as an oxidation process (oxide film formation), a plating process, a passivation process, a nitriding process, to the above materials may be used.
Among these, it is preferable to use a metal material as a constituent material of the drive member 22. The metal material has a relatively large specific gravity. Therefore, by configuring the drive member 22 using metal as a main material, the vibration formed by the drive member 22 and the pair of first shaft members 23 and 24 while effectively preventing the drive member 22 from being enlarged. The system can be suitable for low speed driving (vertical scanning).

  In particular, the metal material constituting the driving member 22 includes Ni—Ti alloy, Cu—Zn alloy, Ni—Al alloy, Cu—Cd alloy, Au—Cd alloy, Au—Cd—Ag alloy, Ti—Al—V. It is preferable to use a superelastic alloy such as an alloy, a shape memory alloy, or a material having relatively high elasticity. Thereby, the optical device 1 can maintain (exhibit) desired rotation characteristics over a long period of time.

The pair of first shaft members 23 and 24 are provided coaxially along the first axis X, and are configured to be elastically deformable.
The pair of first shaft members 23 and 24 support the drive member 22 so as to be rotatable around the first axis X with respect to the support members 211 and 212 (support portion 21).
Each of the first shaft members 23 and 24 is different from the constituent material of the drive member 22 and the first shaft members 23 and 24, and more than the constituent material of the first shaft members 23 and 24. It is composed of a material with low rigidity.

  As the constituent material of each first shaft member 23, 24, the drive member 22 can be supported, different from the constituent material of the drive member 22 and each first shaft member 23, 24, and each first shaft member The material is not particularly limited as long as it is made of a material having rigidity lower than that of the constituent materials 23 and 24. For example, a silicon material, a metal material, a glass material, a ceramic material, Examples thereof include a carbon material, a resin material, or a composite material obtained by combining one or more of these materials.

  Among these, it is preferable to use a resin material as a constituent material of each of the first shaft members 23 and 24. The resin material has a relatively low rigidity. Therefore, by constituting the first shaft members 23 and 24 using resin as a main material, it is possible to effectively prevent the first shaft members 23 and 24 from being elongated and The vibration system composed of the first shaft members 23 and 24 can be made suitable for low speed driving (vertical scanning).

  In particular, it is preferable to use a thermosetting resin as the resin material constituting each of the first shaft members 23 and 24. Thermosetting resins are excellent in heat resistance and have the property of being hardly altered or denatured. Therefore, by using a thermosetting resin as a constituent material of each of the first shaft members 23 and 24, the optical device 1 can maintain (exhibit) desired rotation characteristics over a long period of time. Such a thermosetting resin is not particularly limited, and for example, polyimide resin, phenol resin, epoxy resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin and the like can be suitably used.

A movable plate 25 is provided inside the frame-shaped drive member 22 that rotates about the first axis X in this manner, while being separated from the drive member 22.
The movable plate 25 has a plate shape, and a light reflecting portion 251 having light reflectivity is provided on one plate surface (upper surface) thereof. Thereby, the optical device 1 can be applied to optical devices such as an optical scanner, an optical attenuator, and an optical switch.

  In this embodiment, the planar view shape of the movable plate 25 is a circle. That is, the movable plate 25 has a disc shape. Therefore, the area available for light reflection of the light reflecting portion 251 can be increased while suppressing the moment of inertia of the movable plate 25. In addition, the planar view shape of the movable plate 25 is determined according to the design of the optical device 1 and the like, and is not limited to the disk shape as described above, for example, a polygonal shape such as a quadrangular shape and a pentagonal shape. Alternatively, it may be oval or oval.

Such a movable plate 25 is supported by the drive member 22 via a pair of second shaft members 26 and 27. Here, the second shaft member 26 is joined to the drive member 22 via the joining film 55 at the boundary as described above. Similarly, the second shaft member 27 is joined to the drive member 22 via the joining film 56 at the boundary as described above. Thereby, a material different from the constituent material of the movable plate 25 can be used as the constituent material of the drive member 22. The bonding films 55 and 56 will be described later in detail.
The constituent material of the movable plate 25 is not particularly limited, but silicon is preferably used.

The pair of second shaft members 26 and 27 are provided coaxially along the second axis Y, and are configured to be elastically deformable.
The pair of second shaft members 26 and 27 support the movable plate 25 so as to be rotatable about the second axis Y with respect to the drive member 22.
In the present embodiment, the second shaft members 26 and 27 are formed integrally with the movable plate 25. Such a movable plate 25 and each of the second shaft members 26 and 27 can be collectively formed by processing one substrate by etching or the like, for example. Therefore, the movable plate 25 and the pair of second shaft members 26 and 27 can be made relatively excellent in dimensional accuracy, and the vibration characteristics of the vibration system composed of them can be made good. .

  In the present embodiment, the constituent material of each of the second shaft members 26 and 27 is the same as the constituent material of the movable plate 25 described above. Therefore, when the movable plate 25 is made of silicon as a main material, the second shaft members 26 and 27 are also made of silicon as a main material. If the movable plate 25 and each of the second shaft members 26 and 27 are made of silicon as a main material, each of the movable plate 25 and each of the second shaft members 26 and 27 has excellent dimensional accuracy and is movable. The fatigue of the plate 25 and the second shaft members 26 and 27 can be suppressed. Therefore, the optical device 1 can exhibit desired rotation characteristics (vibration characteristics) over a long period of time.

  In particular, as described above, the base body 2 includes the first member provided on the drive member 22 side and the movable plate, with the vicinity of the end portion on the drive member 22 side of each of the second shaft members 26 and 27 as a boundary portion. It divides | segments into the 2nd member provided in 25 side, and is joined to the 2nd member via the joining film | membrane in the said boundary part. Therefore, the first member (driving member 22) can be made of a material different from that of the second member (movable plate 25 and each of the second shaft members 26 and 27). Improving the degree of freedom of design of the vibration system composed of the pair of first shaft members 23 and 24 and the vibration system composed of the movable plate 25 and the pair of second shaft members 26 and 27. Can do.

In particular, since the first member (drive member 22) is made of a material having a specific gravity greater than that of the constituent material of the movable plate 25, the first member (drive member 22) is made up of the drive member 22 and a pair of first shaft members 23 and 24. The vibration system can be suitable for low-speed driving, and the vibration system composed of the movable plate 25 and the pair of second shaft members 26 and 27 can be suitable for high-speed driving.
The support 3 is bonded to the lower surface of the support portion 21 of the base 2 as described above via the bonding film 57. The bonding film 57 will be described in detail later.

The support 3 includes a substrate 31 and a pair of spacers 32 bonded to the upper surface of the substrate 31.
The constituent material of the substrate 31 is not particularly limited, but for example, glass or silicon is preferably used.
In the pair of spacers 32 bonded to the upper surface of the substrate 31, one spacer 32 is bonded to the lower surface of the support member 211, and the other is bonded to the lower surface of the support member 212. When the motor vibrates, that is, when the driving member 22 and the movable plate 25 rotate (vibrates), an escape portion (space) that prevents contact with the substrate 31 is formed.
The constituent material of each spacer 32 is not particularly limited. For example, glass, silicon, or the like is preferably used.

A pair of magnets 41 and 42 are provided on the side surface of the support 3 so as to face each other through the above-described drive member 22 (coil 221) in plan view.
The pair of magnets 41, 42 are provided on the opposite sides via the first axis X and on the opposite sides via the second axis Y. The magnet 42 is provided so that the drive member 22 side is an N pole, and the opposite side is an S pole, and the magnet 41 is an S pole on the drive member 22 side and the opposite side is an N pole. Is provided.

The pair of magnets 41 and 42 is parallel to a plane including the first axis X and the second axis Y, and is inclined with respect to each of the first axis X and the second axis Y ( A magnetic field having magnetic lines of force penetrating the drive member 22 in a direction of about 30 to 60 ° is generated.
That is, the pair of magnets 41 and 42 generate magnetic fields having x-direction component lines and y-direction component lines in the vicinity of the drive member 22.

Each of the magnets 41 and 42 may be a permanent magnet or an electromagnet, but it is preferable to use a permanent magnet from the viewpoint of simplification of the structure and size reduction.
The permanent magnet used for each of the magnets 41 and 42 is not particularly limited. For example, a permanent magnet magnetized with a hard magnetic material such as a neodymium magnet, a ferrite magnet, a samarium cobalt magnet, an alnico magnet, or a bonded magnet is preferably used. it can.

Here, based on FIG. 5 and FIG. 6, the control system of the optical device 1 will be described.
As shown in FIG. 5, the optical device 1 includes a power supply circuit 7 that energizes the coil 221 and a control unit 8 that controls driving of the power supply circuit 7.
The power supply circuit 7 includes a first voltage generator 71 that generates a first voltage V1 for rotating the movable plate 25 around the first axis X, and a movable plate 25 that rotates around the second axis Y. A second voltage generator 72 for generating a second voltage V2 to be moved, and a voltage superimposing unit for superimposing the first voltage V1 and the second voltage V2 and applying the superimposed voltage to the coil 221. 73.

The first voltage generator 71 generates a first voltage V1 (vertical scanning voltage) that periodically changes in a cycle T1.
For example, the first voltage V1 has a sawtooth waveform as shown in FIG. By using the first voltage V1 having such a waveform, the rotation of the movable plate 25 about the first axis X can be made suitable for vertical scanning (sub scanning). Note that the waveform of the first voltage V1 is not limited to this.

The frequency (1 / T1) of the first voltage V1 is not particularly limited as long as it is a frequency suitable for vertical scanning, but is preferably 30 to 80 Hz (about 60 Hz).
In the present embodiment, the frequency of the first voltage V1 is different from the torsional resonance frequency f ₁ [Hz] of the vibration system configured by the drive member 22 and the pair of first shaft members 23 and 24. Have been adjusted so that.

On the other hand, the second voltage generator 72 generates a second voltage V2 (horizontal scanning voltage) that periodically changes at a period T2 different from the period T1 described above.
For example, as shown in FIG. 6B, the second voltage V2 has a waveform like a sine wave. By using the second voltage V2 having such a waveform, the rotation of the movable plate 25 around the second axis Y can be made suitable for horizontal scanning (main scanning). Note that the waveform of the second voltage V2 is not limited to this.

The frequency of the second voltage V2 is preferably higher than the frequency of the first voltage V1. That is, the period T2 is preferably shorter than the period T1. As a result, the movable plate 25 is rotated around the first axis X at the frequency of the first voltage V1 and rotated around the second axis Y at the frequency of the second voltage V2 more reliably and smoothly. Can be moved.
The frequency of the second voltage V2 is not particularly limited as long as it is different from the frequency of the first voltage V1 and is suitable for horizontal scanning, but is preferably 10 to 40 kHz. In this way, the frequency of the second voltage V2 is set to 10 to 40 kHz, and the frequency of the first voltage V1 is set to about 60 Hz as described above, so that the movable plate 25 can be moved at a frequency suitable for drawing on the display. The first axis line X and the second axis line Y can be rotated around the respective axis lines.

In the present embodiment, the frequency of the second voltage V2 is equal to the torsional resonance frequency f ₂ [Hz] of the vibration system configured by the movable plate 25 and the pair of second shaft members 26 and 27. It has been adjusted.
The resonance frequency f ₁ [Hz] and the resonance frequency f ₂ [Hz] preferably satisfy the relationship f ₂ > f ₁ , and more preferably satisfy the relationship f ₂ ≧ 10f ₁ . As a result, the movable plate 25 is rotated more smoothly around the first axis X at the frequency of the first voltage V1, while the movable plate 25 is rotated around the second axis Y at the frequency of the second voltage V2. Can do.

The first voltage generating unit 71 and the second voltage generating unit 72 are electrically connected to the voltage superimposing unit 73, respectively.
The voltage superimposing unit 73 includes an adder that is electrically connected to the coil 221. Such a voltage superimposing unit 73 receives the first voltage V1 from the first voltage generating unit 71 and the second voltage V2 from the second voltage generating unit 72, and superimposes these voltages to superimpose the coil 221. Apply to.
The control unit 8 that controls the driving of the power supply circuit 7 configured as described above is based on the behavior information (for example, frequency) of the movable plate 25 detected by the behavior detection unit (not shown). The driving of the 71 and the second voltage generator 72 is controlled.

The optical device 1 configured as described above is driven as follows, for example.
The power supply circuit 7 applies, for example, a voltage obtained by superimposing a first voltage V1 as shown in FIG. 6A and a second voltage V2 as shown in FIG.
Then, the direction of the current flowing through the coil 221 is switched alternately between the direction indicated by the solid line arrow and the direction indicated by the broken line arrow in FIG.

  As a result, the coil 221 generates a magnetic field in the thickness direction (z direction) of the drive member 22. On the other hand, in the vicinity of the drive member 22, the pair of magnets 41 and 42 generate magnetic fields in directions inclined with respect to the first axis X and the second axis Y as described above. Therefore, the driving member 22 has a suction force (attraction force) and a repulsive force (repulsive force) that rotate around the first axis X, and a suction force (attraction force) that rotates around the second axis Y. And repulsive force (repulsive force) are generated.

The drive member 22 is rotated with torsional deformation of the first shaft members 23 and 24 by a suction force (attractive force) and a repulsive force (repulsive force) that rotate the drive member 22 around the first axis X. To do.
At that time, since the mass of the drive member 22 is relatively large, the drive member 22 is rotated with the torsional deformation of the first shaft members 23 and 24 mainly at the frequency of the first voltage V1 which is a low frequency. To do. With this rotation, the movable plate 25 rotates around the first axis X along with the torsional deformation of the second shaft members 26 and 27.

On the other hand, the drive member 22 is accompanied by bending deformation of the first shaft members 23 and 24 by the attractive force (attractive force) and the repulsive force (repulsive force) that rotate the drive member 22 around the second axis Y. Turn slightly.
At that time, the driving member 22 is slightly rotated around the second axis Y with the bending deformation of the first shaft members 23 and 24 at the frequency of the second voltage V2. With this rotation, the movable plate 25 rotates around the second axis Y with the torsional deformation of the second shaft members 26 and 27. Here, the rotational angle of the movable plate 25 is increased by matching the resonance frequency of the vibration system constituted by the movable plate 25 and each of the second shaft members 26 and 27 with the frequency of the second voltage V2. be able to.
By such driving, the movable plate 25 is rotated (vibrated) around the first axis X at the frequency of the first voltage V1, and rotated around the second axis Y at the frequency of the second voltage V2. Move (vibrate). That is, the movable plate 25 can be rotated around two axes orthogonal to each other.

(Bonding film)
Here, each of the bonding films 51 to 57 described above will be described in detail. In the following description, the bonding film 52 is representatively described, and the bonding films 51 and 53 to 57 are the same as the bonding film 52, and thus description thereof is omitted. For example, regarding the bonding film 55, in the following description of the bonding film 52, “the bonding film 52” is “bonding film 55”, “the driving member 22” is “driving member 22 (first member)”, “first The shaft members 23 and 24 ”may be appropriately read as“ second shaft members 26 and 27 (second member) ”.

The bonding film 52 includes a Si skeleton including a siloxane (Si—O) bond and a random atomic structure, and a leaving group bonded to the Si skeleton.
Then, the bonding film 52 bonds the first shaft member 23 and the drive member 22 by the adhesiveness developed on the surface of the bonding film 52 due to the leaving group being released from the Si skeleton by applying energy. ing.
More specifically, before the energy is applied, the bonding film 52 includes a Si skeleton 301 including a siloxane (Si—O) bond 302 and having a random atomic structure, as shown in FIG. And a leaving group 303 bonded to the Si skeleton 301.

  When energy is applied to the bonding film 52, as shown in FIG. 8, a part of the leaving group 303 is detached from the Si skeleton 301, and an active hand 304 is generated. Thereby, adhesiveness is expressed on the surface 521 of the bonding film 52 on the first shaft member 23 side. The first shaft member 23 and the drive member 22 are bonded together by the bonding film 52 that exhibits adhesiveness in this manner. In addition, the bonding film 52 is formed on the first shaft member 23, and the active hand 304 is generated by applying energy to the surface of the bonding film 52 on the driving member 22 side, so that the first shaft member 23 and the driving member 22 are You may join.

By using such a bonding film 52, the constituent material of the first shaft member 23 and the constituent material of the drive member 22 can be made different.
Moreover, such a bonding film 52 becomes a strong film that is difficult to be deformed due to the influence of the Si skeleton 301 including the siloxane bond 302 and having a random atomic structure. For this reason, the distance between the first shaft member 23 and the drive member 22 can be kept constant with high dimensional accuracy. As a result, the overall dimensional accuracy of the optical device 1 can be improved.
Further, since the thickness of the bonding film 52 is extremely thin and uniform, a bonded body obtained by bonding the first shaft member 23 and the drive member 22 via the bonding film 52 is the first shaft member 23. It is possible to exhibit mechanical characteristics close to those obtained by integrally forming the drive member 22 and the drive member 22.

In addition, when the bonding film 52 as described above is used, the materials of the first shaft member 23 and the drive member 22 are limited unlike the case of using a solid bonding method such as direct bonding or anodic bonding. There is no. For example, the constituent materials of the first shaft member 23 and the drive member 22 can be optimized according to the required mechanical characteristics. Furthermore, only a part of the contact portion between the first shaft member 23 and the drive member 22 can be partially joined. Therefore, the design freedom of the optical device 1 can be increased.
In addition, since the first shaft member 23 and the drive member 22 can be joined at a relatively low temperature, there is no possibility of adversely affecting each part of the optical device 1.
Further, since the atmosphere in the bonding process is not limited to the reduced pressure atmosphere, the cost of the optical device 1 can be reduced.

  In addition, since the first first shaft member 23 and the drive member 22 are bonded using the bonding film 52, a problem such as an adhesive such as an epoxy-based adhesive that the adhesive protrudes does not occur. . Therefore, the protruding adhesive does not hinder the vibration of the vibration system, and the yield can be improved in the manufacture of the optical device 1. Further, since it is not necessary to remove the protruding adhesive, the production efficiency of the optical device 1 can be improved.

  Furthermore, the bonding film 52 has excellent heat resistance due to the action of the chemically stable Si skeleton 301. For this reason, even if the optical device 1 is exposed to high temperatures, the bonding film 52 can be reliably prevented from being altered or deteriorated. Further, the bonding film 52 is excellent in heat dissipation as compared with the adhesive. Therefore, even if a part of the light incident on the movable plate 25 becomes heat, the heat can be quickly dissipated to prevent a change in characteristics due to thermal expansion, and stable driving can be performed.

  Further, such a bonding film 52 is a solid having no fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 52) hardly change compared to a liquid or viscous liquid adhesive. For this reason, the dimensional accuracy of the optical device 1 manufactured using the bonding film 52 is remarkably higher than the conventional one. Furthermore, since the time required for the curing of the adhesive is not required, strong bonding can be achieved in a short time.

  As such a bonding film 52, among the atoms obtained by removing H atoms from all the atoms constituting the bonding film 52, the total content of Si atoms and O atoms is about 10 to 90 atomic%. It is preferable and it is more preferable that it is about 20-80 atomic%. If Si atoms and O atoms are contained in the above-mentioned range, the bonding film 52 forms a strong network of Si atoms and O atoms, and the bonding film 52 itself becomes stronger. . Further, the bonding film 52 exhibits a particularly high bonding strength with respect to the first shaft member 23 and the driving member 22.

The abundance ratio of Si atoms to O atoms in the bonding film 52 is preferably about 3: 7 to 7: 3, and more preferably about 4: 6 to 6: 4. By setting the abundance ratio of Si atoms and O atoms to be within the above range, the stability of the bonding film 52 is increased, and the first shaft member 23 and the drive member 22 can be bonded more firmly. It becomes like this.
Note that the crystallinity of the Si skeleton 301 in the bonding film 52 is preferably 45% or less, and more preferably 40% or less. As a result, the Si skeleton 301 includes a sufficiently random atomic structure. For this reason, the above-described characteristics of the Si skeleton 301 become obvious, and the dimensional accuracy and adhesiveness of the bonding film 52 become more excellent.

  Further, as described above, the leaving group 303 bonded to the Si skeleton 301 acts to generate an active hand 304 in the bonding film 52 by detaching from the Si skeleton 301. Therefore, although the leaving group 303 is relatively easily and uniformly desorbed by applying energy, it must be securely bonded to the Si skeleton 301 so as not to desorb when no energy is applied. There is.

  From this point of view, the leaving group 303 includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or each of these atoms. What consists of at least 1 sort (s) selected from the group which consists of an atomic group arrange | positioned so that it may couple | bond with frame | skeleton 301 is used preferably. Such a leaving group 303 is relatively excellent in bond / elimination selectivity by energy application. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness of the bonding film 52 can be further enhanced.

Examples of the atomic group (group) arranged so that each atom as described above is bonded to the Si skeleton 301 include, for example, an alkyl group such as a methyl group and an ethyl group, and an alkenyl group such as a vinyl group and an allyl group. Aldehyde group, ketone group, carboxyl group, amino group, amide group, nitro group, halogenated alkyl group, mercapto group, sulfonic acid group, cyano group, isocyanate group and the like.
Among these groups, the leaving group 303 is particularly preferably an alkyl group. Since the alkyl group has high chemical stability, the bonding film 52 including the alkyl group has excellent weather resistance and chemical resistance.

Examples of the constituent material of the bonding film 52 having such characteristics include a polymer containing a siloxane bond such as polyorganosiloxane.
The bonding film 52 made of polyorganosiloxane itself has excellent mechanical properties. In addition, it exhibits particularly excellent adhesion to many materials. Therefore, the bonding film 52 made of polyorganosiloxane can bond the first shaft member 23 and the drive member 22 more firmly.

Polyorganosiloxane usually exhibits water repellency (non-adhesiveness), but when given energy, it can easily desorb organic groups, changes to hydrophilicity, and exhibits adhesiveness. However, there is an advantage that the non-adhesiveness and the adhesiveness can be controlled easily and reliably.
This water repellency (non-adhesiveness) is mainly due to the action of alkyl groups contained in the polyorganosiloxane. Therefore, the bonding film 52 made of polyorganosiloxane exhibits adhesiveness in a region to which energy is applied, and has excellent liquid repellency due to the alkyl group described above in a region to which energy is not applied. Has the advantage of being

  Further, among polyorganosiloxanes, those mainly composed of a polymer of octamethyltrisiloxane are preferred. The bonding film 52 mainly composed of a polymer of octamethyltrisiloxane is particularly suitable for the optical device 1 of the present invention because it is particularly excellent in adhesiveness. Moreover, since the raw material which has octamethyltrisiloxane as a main component is liquid at normal temperature and has an appropriate viscosity, there is an advantage that it is easy to handle.

The average thickness of the bonding film 52 is preferably about 1 to 1000 nm, and more preferably about 2 to 800 nm. By making the average thickness of the bonding film 52 within the above range, the dimensional accuracy between the first shaft member 23 and the drive member 22 is prevented from being significantly lowered, and these are bonded more firmly. Can do.
That is, when the average thickness of the bonding film 52 is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 52 exceeds the upper limit, the dimensional accuracy of the optical device 1 may be significantly reduced.

Furthermore, if the average thickness of the bonding film 52 is within the above range, a certain degree of shape followability is ensured for the bonding film 52. For this reason, for example, even when unevenness exists on the bonding surface of the drive member 22 (surface adjacent to the bonding film 52), the bonding film follows the shape of the unevenness depending on the height of the unevenness. 52 can be deposited. As a result, the bonding film 52 can absorb the unevenness and reduce the height of the unevenness generated on the surface. When the bonding film 52 formed on the drive member 22 is bonded to the first shaft member 23, the adhesion of the bonding film 52 to the first shaft member 23 can be improved.
Note that the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 52 increases. Therefore, in order to sufficiently ensure the shape following property, the thickness of the bonding film 52 may be as large as possible.

  Such a bonding film 52 may be produced by any method, and may be a film produced by various vapor phase film formation methods such as plasma polymerization, CVD, PVD, or various liquid phase film formation methods. Although it can produce by giving energy, among these, it is preferable to use the film | membrane produced by the plasma polymerization method mentioned later as a film | membrane before energy provision. According to the plasma polymerization method, finally, a dense and homogeneous bonding film 52 can be efficiently produced. As a result, the bonding film 52 produced by the plasma polymerization method can bond the first shaft member 23 and the drive member 22 particularly firmly. Further, the bonding film 52 that has been manufactured by the plasma polymerization method and has not been applied with energy can be maintained in a state where energy is applied and activated for a relatively long time. For this reason, the manufacturing process of the optical device 1 can be simplified and efficient.

(Optical device manufacturing method)
Next, an example of the manufacturing method of the optical device 1 will be described with reference to FIGS.
FIG. 9 is a diagram for explaining a manufacturing process of the optical device shown in FIGS. 1 and 2, and FIG. 10 is a longitudinal cross-sectional view schematically showing a plasma polymerization apparatus used for producing the bonding film shown in FIG. 9B. FIG. FIG. 9 shows a cross section corresponding to the cross section taken along the line AA of FIG. In the following description, for convenience of explanation, the upper side in FIG. 9 is referred to as “upper” and the lower side is referred to as “lower”.
In the method of manufacturing the optical device 1 according to this embodiment, [A] the step of forming the base 2 and [B] the base 2 and the support 3 are joined, and the support 3 and the magnets 41 and 42 are joined. Process.

[A]
-A1-
First, as shown in FIG. 9A, a pair of support members 211 and 212 and a drive member 22 are prepared.
Each of the pair of support members 211 and 212 and the drive member 22 can be formed by processing a substrate.
As such a substrate, a substrate having a uniform thickness and free from bending and scratches is preferably used. As the constituent material of the substrate, those described in the description of the pair of support members 211 and 212 and the drive member 22 can be used.

-A2-
Next, as illustrated in FIG. 9B, the bonding film 52 is formed on the bonding surface of the driving member 22 (the surface facing the first shaft member 23). At the same time, the bonding film 51 is formed on the surface of the support member 211, the bonding film 53 is formed on the surface of the support member 212, and the bonding films 54 to 56 are formed on the surface of the driving member 22.
In this step, the pair of support members 211 and 212 and the drive member 22 are preferably held in a desired positional relationship. Thereby, the bonding films 51 to 56 can be formed collectively. In addition, in the processes A3 and A4 described later, simultaneous processing can be realized and handling of each member can be improved. The holding method is not particularly limited, and examples thereof include a method of temporarily bonding to a substrate on which alignment marks and engaging portions are formed, and a method of fixing using various jigs.

Hereinafter, the bonding film 52 will be described as a representative, but the bonding films 51 and 53 to 56 are the same as the bonding film 52.
As a method for forming the bonding film 52 (the bonding film 52 before energy application), for example, a plasma polymerization method can be used. In the plasma polymerization method, for example, by supplying a mixed gas of a source gas and a carrier gas in a strong electric field, molecules in the source gas are polymerized, and a polymer is deposited on the driving member 22 to obtain a film. Is the method.

Hereinafter, a method for forming the bonding film 52 by the plasma polymerization method will be described in detail.
For the plasma polymerization method, for example, a plasma polymerization apparatus 1100 as shown in FIG. 10 is used.
A plasma polymerization apparatus 1100 shown in FIG. 10 includes a chamber 1101, a first electrode 1130 that supports the drive member 22, a second electrode 1140, and a power supply circuit 1180 that applies a high-frequency voltage between the electrodes 1130 and 1140. A gas supply unit 1190 for supplying gas into the chamber 1101 and an exhaust pump 1170 for exhausting the gas in the chamber 1101. Among these parts, the first electrode 1130 and the second electrode 1140 are provided in the chamber 1101. Hereinafter, each part will be described in detail.
The chamber 1101 is a container that can maintain the airtightness inside, and is used in a reduced pressure (vacuum) state, and thus has a pressure resistance that can withstand a pressure difference between the inside and the outside.

A chamber 1101 shown in FIG. 10 has a substantially cylindrical chamber body whose axis is arranged along the horizontal direction, a circular side wall that seals the left opening of the chamber body, and a circle that seals the right opening. And side walls.
A supply port 1103 is provided above the chamber 1101, and an exhaust port 1104 is provided below the chamber 1101. A gas supply unit 1190 is connected to the supply port 1103, and an exhaust pump 1170 is connected to the exhaust port 1104.
In the present embodiment, the chamber 1101 is made of a highly conductive metal material and is electrically grounded via the ground wire 1102.

The first electrode 1130 has a plate shape and supports the driving member 22. Here, the drive member 22 will be described as a representative. However, the drive member 22 and the pair of support members 211 and 212 are both supported by the first electrode 1130 and arranged in the chamber 1101 at the same time. Alternatively, one of them may be supported by the first electrode 1130 in a separate process and disposed in the chamber 1101.
The first electrode 1130 is provided on the inner wall surface of the side wall of the chamber 1101 along the vertical direction, whereby the first electrode 1130 is electrically grounded via the chamber 1101. Note that the first electrode 1130 is provided concentrically with the chamber body as shown in FIG.

An electrostatic chuck (suction mechanism) 1139 is provided on the surface of the first electrode 1130 that supports the driving member 22.
The electrostatic chuck 1139 can support the drive member 22 along the vertical direction as shown in FIG. Further, even if the drive member 22 has a slight warp, the drive member 22 can be subjected to plasma processing in a state where the warp is corrected by being attracted to the electrostatic chuck 1139.

The second electrode 1140 is provided to face the first electrode 1130 with the driving member 22 interposed therebetween. Note that the second electrode 1140 is provided in a state of being separated (insulated) from the inner wall surface of the side wall of the chamber 1101.
A high frequency power source 1182 is connected to the second electrode 1140 through a wiring 1184. A matching box (matching unit) 1183 is provided in the middle of the wiring 1184. The wiring 1184, the high frequency power supply 1182 and the matching box 1183 constitute a power supply circuit 1180.
According to such a power supply circuit 1180, since the first electrode 1130 is grounded, a high-frequency voltage is applied between the first electrode 1130 and the second electrode 1140. As a result, an electric field whose direction is reversed at a high frequency is induced in the gap between the first electrode 1130 and the second electrode 1140.

The gas supply unit 1190 supplies a predetermined gas into the chamber 1101.
A gas supply unit 1190 shown in FIG. 10 stores a liquid storage unit 1191 that stores a liquid film material (raw material liquid), a vaporizer 1192 that vaporizes the liquid film material to change it into a gaseous state, and stores a carrier gas. A gas cylinder 1193. These parts and the supply port 1103 of the chamber 1101 are connected to each other by a pipe 1194, and a mixed gas of a gaseous film material (raw material gas) and a carrier gas is supplied from the supply port 1103 into the chamber 1101. It is configured to supply.

The liquid film material stored in the liquid storage unit 1191 is a raw material that is polymerized by the plasma polymerization apparatus 1100 to form a polymer film on the surface of the drive member 22.
Such a liquid film material is vaporized by the vaporizer 1192 and is supplied into the chamber 1101 as a gaseous film material (raw material gas). The source gas will be described in detail later.

The carrier gas stored in the gas cylinder 1193 is a gas that is discharged in order to discharge due to the action of an electric field and to maintain this discharge. Examples of such a carrier gas include Ar gas and He gas.
A diffusion plate 1195 is provided near the supply port 1103 in the chamber 1101.
The diffusion plate 1195 has a function of promoting the diffusion of the mixed gas supplied into the chamber 1101. Thereby, the mixed gas can be dispersed in the chamber 1101 at a substantially uniform concentration.

The exhaust pump 1170 exhausts the inside of the chamber 1101 and is configured by, for example, an oil rotary pump, a turbo molecular pump, or the like. By exhausting the chamber 1101 and reducing the pressure in this manner, the gas can be easily converted into plasma. In addition, it is possible to prevent the drive member 22 from being contaminated or oxidized due to contact with the air atmosphere, and to effectively remove reaction products from the plasma processing from the chamber 1101.
The exhaust port 1104 is provided with a pressure control mechanism 1171 for adjusting the pressure in the chamber 1101. Thereby, the pressure in the chamber 1101 is appropriately set according to the operation state of the gas supply unit 1190.
When the bonding film 52 is formed on the drive member 22 using the plasma polymerization apparatus 1100 configured as described above, the drive member 22 is first housed in the chamber 1101 of the plasma polymerization apparatus 1100 and sealed. After setting the state, the inside of the chamber 1101 is depressurized by the operation of the exhaust pump 1170.

Next, the gas supply unit 1190 is operated to supply a mixed gas of the source gas and the carrier gas into the chamber 1101. The supplied mixed gas is filled in the chamber 1101.
Here, the ratio (mixing ratio) of the source gas in the mixed gas is slightly different depending on the type of the source gas and the carrier gas, the target film forming speed, and the like. For example, the ratio of the source gas in the mixed gas is 20 It is preferable to set to about -70%, and it is more preferable to set to about 30-60%. As a result, it is possible to optimize the conditions for formation (film formation) of the polymer film.
Further, the flow rate of the gas to be supplied is appropriately determined depending on the type of gas, the target film formation rate, the film thickness, etc., and is not particularly limited, but usually the flow rates of the source gas and the carrier gas are respectively , Preferably about 1 to 100 ccm, more preferably about 10 to 60 ccm.

  Next, the power supply circuit 1180 is operated, and a high-frequency voltage is applied between the pair of electrodes 1130 and 1140. Thereby, gas molecules existing between the pair of electrodes 1130 and 1140 are ionized, and plasma is generated. Molecules in the raw material gas are polymerized by the energy of the plasma, and the polymer is adhered and deposited on the driving member 22. As a result, as shown in FIG. 9B, a bonding film 52 made of a plasma polymerized film is formed on the drive member 22.

Examples of the source gas include organosiloxanes such as methylsiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane, and methylphenylsiloxane.
The plasma polymerized film obtained by using such a raw material gas, that is, the bonding film 52 is composed of a polymer obtained by polymerizing these raw materials, that is, a polyorganosiloxane.
In the plasma polymerization, the frequency of the high frequency applied between the pair of electrodes 1130 and 1140 is not particularly limited, but is preferably about 1 kHz to 100 MHz, and more preferably about 10 to 60 MHz.

Further, the power density of the high frequency is not particularly limited, and is preferably about 0.01 to 10 / cm ^2, more preferably about 0.1 to 1 W / cm ^2.
The pressure in the chamber 1101 at the time of film formation is preferably about 133.3 × 10 ^{−5 to} 1333 Pa (1 × 10 ^{−5 to} 10 Torr), preferably 133.3 × 10 ^{−4 to} 133.3 Pa ( More preferably, it is about 1 × 10 ^{−4 to} 1 Torr).

The raw material gas flow rate is preferably about 0.5 to 200 sccm, and more preferably about 1 to 100 sccm. On the other hand, the carrier gas flow rate is preferably about 5 to 750 sccm, and more preferably about 10 to 500 sccm.
The treatment time is preferably about 1 to 10 minutes, more preferably about 4 to 7 minutes. Note that the thickness of the bonding film 52 formed is mainly proportional to the processing time. Therefore, the thickness of the bonding film 52 can be easily adjusted only by adjusting the processing time. For this reason, when the first shaft member 23 and the drive member 22 are bonded using an adhesive, the thickness of the adhesive cannot be strictly controlled. However, in the present invention using the bonding film 52, bonding is not possible. Since the thickness of the film 52 can be strictly controlled, the distance between the first shaft member 23 and the drive member 22 can be strictly controlled.
Moreover, it is preferable that the temperature of the drive member 22 is 25 degreeC or more, and it is more preferable that it is about 25-100 degreeC.
As described above, the bonding film 52 can be obtained.
In the case where the bonding film 52 is partially formed only in the region where the first shaft member 23 is bonded on the upper surface of the driving member 22, for example, a mask having a window portion having a shape corresponding to this region is used. The bonding film 52 may be formed on the mask.

-A3-
Next, as shown in FIG. 9C, energy E is applied to the bonding film 52 formed on the driving member 22. Similarly, energy E is applied to the bonding films 51 and 53 to 56.
When energy is applied, the leaving group 303 is detached from the Si skeleton 301 in the bonding film 52 as shown in FIG. Then, after the leaving group 303 is removed, active hands 304 are generated on the surface and inside of the bonding film 52. Thereby, the adhesiveness with the first shaft member 23 appears on the surface of the bonding film 52.

Here, the energy applied to the bonding film 52 may be applied by any method. For example, (I) a method of irradiating the bonding film 52 with energy rays, (II) a method of heating the bonding film 52, (III ) Typical examples include a method of applying a compressive force (applying physical energy) to the bonding film 52, a method of exposing to plasma (applying plasma energy), and a method of exposing to ozone gas (applying chemical energy). Method).
Among these, as a method for applying energy to the bonding film 52, it is particularly preferable to use at least one of the methods (I), (II), and (III). Since these methods can apply energy to the bonding film 52 relatively easily and efficiently, they are suitable as energy application methods.

Hereinafter, the methods (I), (II), and (III) will be described in detail.
(I) When irradiating the bonding film 52 with energy rays, examples of the energy rays include light such as ultraviolet rays and laser light, particle rays such as X-rays, γ rays, electron beams, and ion beams, and the like. A combination of these energy rays.
Among these energy rays, it is particularly preferable to use ultraviolet rays having a wavelength of about 150 to 300 nm (see FIG. 9C). According to such ultraviolet rays, the amount of energy applied is optimized, so that the Si skeleton 301 in the bonding film 52 is prevented from being destroyed more than necessary, and between the Si skeleton 301 and the leaving group 303. Can be selectively cleaved. Thereby, adhesiveness can be expressed in the bonding film 52 while preventing the characteristics (mechanical characteristics, chemical characteristics, etc.) of the bonding film 52 from deteriorating.
In addition, since ultraviolet rays can be processed in a short time without unevenness, the leaving group 303 can be efficiently eliminated. Furthermore, ultraviolet rays also have the advantage that they can be generated with simple equipment such as UV lamps.
The wavelength of ultraviolet light is more preferably about 160 to 200 nm.

In the case of using the UV lamp, the output may vary depending on the area of the bonding film 52 is preferably from ^1mW / cm ^{2 ~1W} / cm 2 or ^so, at 5mW / cm ² ~50mW / cm 2 of about More preferably. In this case, the distance between the UV lamp and the bonding film 52 is preferably about 3 to 3000 mm, and more preferably about 10 to 1000 mm.

In addition, the time for irradiating the ultraviolet rays is such a time that the leaving group 303 in the vicinity of the surface 521 of the bonding film 52 can be released, that is, a time that does not allow a large amount of the leaving group 303 in the bonding film 52 to be released. Is preferable. Specifically, although it varies slightly depending on the amount of ultraviolet light, the constituent material of the bonding film 52, etc., it is preferably about 0.5 to 30 minutes, more preferably about 1 to 10 minutes.
Moreover, although an ultraviolet-ray may be irradiated continuously in time, you may irradiate intermittently (pulse form).
On the other hand, examples of the laser light include an excimer laser (femtosecond laser), an Nd-YAG laser, an Ar laser, a CO ₂ laser, and a He—Ne laser.

The irradiation of the energy beam to the bonding film 52 may be performed in any atmosphere. Specifically, the atmosphere is an atmosphere of an oxidizing gas such as air, oxygen, a reducing gas atmosphere such as hydrogen, nitrogen, An inert gas atmosphere such as argon, a reduced pressure (vacuum) atmosphere obtained by reducing these atmospheres, and the like can be given, and it is particularly preferable to perform in an air atmosphere. Thereby, it is not necessary to spend time and cost to control the atmosphere, and irradiation of energy rays can be performed more easily.
As described above, according to the method of irradiating the energy beam, energy can be easily selectively applied to the bonding film 52, and thus, for example, alteration / deterioration of the driving member 22 due to energy application is prevented. be able to.

Moreover, according to the method of irradiating energy rays, the magnitude of energy to be applied can be easily adjusted with high accuracy. For this reason, it is possible to adjust the desorption amount of the leaving group 303 desorbed from the bonding film 52. By adjusting the amount of elimination of the leaving group 303 in this way, the bonding strength between the bonding film 52 and the first shaft member 23 can be easily controlled.
That is, by increasing the amount of elimination of the leaving group 303, more active hands are generated on the surface and inside of the bonding film 52, so that the adhesiveness expressed in the bonding film 52 can be further enhanced. On the other hand, by reducing the amount of elimination of the leaving group 303, the number of active hands generated on the surface and inside of the bonding film 52 can be reduced, and the adhesiveness developed in the bonding film 52 can be suppressed.
In addition, in order to adjust the magnitude | size of the energy to provide, what is necessary is just to adjust conditions, such as the kind of energy beam, the output of an energy beam, the irradiation time of an energy beam.
Furthermore, according to the method of irradiating energy rays, a large amount of energy can be applied in a short time, so that the energy can be applied more efficiently.

(II) When the bonding film 52 is heated (not shown), the heating temperature is preferably set to about 25 to 100 ° C, more preferably about 50 to 100 ° C. By heating at a temperature in such a range, it is possible to reliably activate the bonding film 52 while reliably preventing the drive member 22 and the like from being altered or deteriorated by heat.
The heating time may be a time that can break the molecular bond of the bonding film 52. Specifically, if the heating temperature is within the above range, it is preferably about 1 to 30 minutes.
The bonding film 52 may be heated by any method, but can be heated by various heating methods such as a method using a heater, a method of irradiating infrared rays, and a method of contacting with a flame.

  Note that when the first shaft member 23 and the drive member 22 have substantially the same coefficient of thermal expansion, the bonding film 52 may be heated under the above conditions, but the first shaft member 23 and the drive member 22 are driven. When the thermal expansion coefficients of the members 22 are different from each other, it will be described in detail later, but it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.

  (III) In the present embodiment, the case where energy is applied to the bonding film 52 before the first shaft member 23 and the drive member 22 are bonded is described. The first shaft member 23 and the driving member 22 may be overlapped (contacted). That is, after forming the bonding film 52 on the driving member 22 and before applying energy, the first shaft member 23 and the driving member 22 are arranged so that the bonding film 52 and the first shaft member 23 are in close contact with each other. Are superposed to form a temporary joined body. Then, by applying energy to the bonding film 52 in the temporary bonded body, the bonding film 52 exhibits adhesiveness, and the first shaft member 23 and the drive member 22 are bonded via the bonding film 52. (Glued).

In this case, the application of energy to the bonding film 52 in the temporary bonded body may be the methods (I) and (II) described above, but the method of applying a compressive force to the bonding film 52 may also be used.
In this case, the first shaft member 23 and the drive member 22 are preferably compressed at a pressure of about 0.2 to 10 MPa and more preferably compressed at a pressure of about 1 to 5 MPa in a direction in which the first shaft member 23 and the drive member 22 approach each other. As a result, it is possible to easily apply appropriate energy to the bonding film 52 by simply compressing, and sufficient adhesiveness is exhibited in the bonding film 52. Although this pressure may exceed the upper limit, depending on the constituent materials of the first shaft member 23 and the drive member 22, the first shaft member 23 and the drive member 22 may be damaged. is there.
The time for applying the compressive force is not particularly limited, but is preferably about 10 seconds to 30 minutes. In addition, what is necessary is just to change suitably the time which provides compression force according to the magnitude | size of compression force. Specifically, the time for applying the compressive force can be shortened as the compressive force increases.

In the state of the temporary joined body, the first shaft member 23 and the drive member 22 are not joined, so that their relative positions can be easily adjusted (shifted). Therefore, once the temporarily joined body is obtained, the relative position between the first shaft member 23 and the drive member 22 is finely adjusted, thereby assuring the assembly accuracy (dimensional accuracy) of the finally obtained optical device 1. Can be increased.
Energy can be imparted to the bonding film 52 by the methods (I), (II), and (III) as described above.

  Note that energy may be applied to the entire surface of the bonding film 52, but may be applied to only a part of the region. In this way, it is possible to control the region where the adhesiveness of the bonding film 52 is expressed, and to reduce local concentration of stress generated at the bonding interface by appropriately adjusting the area, shape, etc. of this region. Can do. Thereby, for example, even when the difference in coefficient of thermal expansion between the first shaft member 23 and the drive member 22 is large, these can be reliably joined.

  Here, as described above, the bonding film 52 in a state before energy is applied has the Si skeleton 301 and the leaving group 303 as shown in FIG. When energy is applied to the bonding film 52, the leaving group 303 (in this embodiment, a methyl group) is detached from the Si skeleton 301. As a result, as shown in FIG. 8, the active hand 304 is generated on the surface 521 of the bonding film 52 on the first shaft member 23 side and activated. As a result, adhesiveness is developed on the surface of the bonding film 52.

  Here, “activating” the bonding film 52 means that the surface 521 on the side of the first shaft member 23 of the bonding film 52 and the internal leaving group 303 are released and are not terminated in the Si skeleton 301. A state in which a bond (hereinafter also referred to as “unbonded hand” or “dangling bond”) is generated, a state in which this unbonded hand is terminated by a hydroxyl group (OH group), or a combination of these states Say the state.

Therefore, the active hand 304 means a dangling bond (dangling bond) or a dangling bond terminated with a hydroxyl group. According to such an active hand 304, particularly strong bonding is possible with respect to the first shaft member 23.
The latter state (state in which dangling bonds are terminated by a hydroxyl group) is obtained by, for example, irradiating the bonding film 52 with energy rays in the atmospheric air, so that moisture in the atmosphere terminates dangling bonds. Can be easily generated.

-A4-
Next, the first shaft member 23 is prepared. As shown in FIG. 9D, the first shaft member 23 is brought into close contact with the bonding film 52 that exhibits adhesiveness and the first shaft member 23. The shaft member 23 and the drive member 22 are bonded together. As a result, the first shaft member 23 and the drive member 22 are bonded (adhered) via the bonding film 52.

  Similarly, the support member 211 and the first shaft member 23 are bonded via the bonding film 51. Further, the support member 212 and the first shaft member 24 are bonded via the bonding film 53. Further, the first shaft member 24 and the drive member 22 are bonded via the bonding film 54. Further, the drive member 22 and the second shaft member 26 are joined via the joining film 55. Further, the driving member 22 and the second shaft member 27 are joined via the joining film 56.

The base 2 (two-dimensional vibration system) is formed by these joining.
Here, the method for forming the first shaft members 23 and 24 is not particularly limited. For example, when the first shaft members 23 and 24 are made of resin, it is preferable to use press molding. Thereby, the dimensional accuracy of each 1st shaft member 23 and 24 can be made excellent.
The movable plate 25 and the pair of second shaft members 26 and 27 are not particularly limited, but can be formed by processing the substrate by etching or the like.

  Here, it is preferable that the thermal expansion coefficients of the first shaft member 23 and the drive member 22 joined as described above are substantially equal. If the thermal expansion coefficients of the first shaft member 23 and the drive member 22 are substantially equal, when they are bonded, stress associated with thermal expansion is unlikely to occur at the bonding interface. As a result, in the finally obtained optical device 1, it is possible to reliably prevent the occurrence of defects such as peeling.

Further, even when the thermal expansion coefficients of the first shaft member 23 and the drive member 22 are different from each other, by optimizing the conditions for bonding the first shaft member 23 and the drive member 22 as follows: The first shaft member 23 and the drive member 22 can be firmly joined with high dimensional accuracy.
That is, when the first shaft member 23 and the drive member 22 have different coefficients of thermal expansion, it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.

  Specifically, although depending on the difference in thermal expansion coefficient between the first shaft member 23 and the drive member 22, the temperature of the first shaft member 23 and the drive member 22 is about 25 to 50 ° C. The first shaft member 23 and the drive member 22 are preferably bonded together, and more preferably bonded at a temperature of about 25 to 40 ° C. Within such a temperature range, even if the difference in coefficient of thermal expansion between the first shaft member 23 and the drive member 22 is large to some extent, the thermal stress generated at the joint interface can be sufficiently reduced. As a result, it is possible to reliably prevent the occurrence of warpage or peeling in the optical device 1.

In this case, when the difference in thermal expansion coefficient between the first shaft member 23 and the drive member 22 is 5 × 10 ⁻⁵ / K or more, as described above, the temperature is lowered as low as possible. It is particularly recommended to join with By using the bonding film 52, the first shaft member 23 and the driving member 22 can be firmly bonded even at a low temperature as described above.
Moreover, it is preferable that the first shaft member 23 and the drive member 22 have different rigidity. Thereby, the 1st shaft member 23 and each drive member 22 can be joined more firmly.

Note that it is preferable that a surface treatment for improving adhesion with the bonding film 52 is performed in advance on a region where the bonding film 52 of the driving member 22 is formed. Thereby, the bonding strength between the driving member 22 and the bonding film 52 can be further increased, and in the optical device 1 finally obtained, the bonding strength between the first shaft member 23 and the driving member 22 is increased. Can do.
Examples of the surface treatment include physical surface treatment such as sputtering treatment and blast treatment, plasma treatment using oxygen plasma, nitrogen plasma, etc., corona discharge treatment, etching treatment, electron beam irradiation treatment, ultraviolet irradiation treatment, ozone Examples include chemical surface treatment such as exposure treatment, or a combination of these. By performing such processing, it is possible to clean the region of the driving member 22 where the bonding film 52 is formed and to activate the region.
Further, by using plasma treatment among these surface treatments, the surface of the driving member 22 can be particularly optimized in order to form the bonding film 52.

In addition, when the drive member 22 which performs surface treatment is comprised with the resin material (polymer material), especially a corona discharge process, a nitrogen plasma process, etc. are used suitably.
Further, depending on the constituent material of the driving member 22, there is a material in which the bonding strength of the bonding film 52 is sufficiently high without performing the above-described surface treatment. Examples of the constituent material of the driving member 22 that can obtain such an effect include materials mainly composed of various metal materials, various silicon materials, various glass materials and the like as described above.

The surface of the driving member 22 made of such a material is covered with an oxide film, and a relatively active hydroxyl group is bonded to the surface of the oxide film. Therefore, when the driving member 22 made of such a material is used, the driving member 22 and the bonding film 52 can be firmly adhered without performing the surface treatment as described above.
In this case, the entire drive member 22 may not be made of the material as described above, and at least the vicinity of the surface of the region where the bonding film 52 is formed needs to be made of the material as described above. .

Furthermore, in the case where the region where the bonding film 52 of the driving member 22 is formed includes the following groups and substances, the driving member 22 and the bonding film 52 are not subjected to the surface treatment as described above. The bonding strength can be sufficiently increased.
Examples of such groups and substances include functional groups such as hydroxyl groups, thiol groups, carboxyl groups, amino groups, nitro groups, and imidazole groups, radicals, ring-opened molecules, double bonds, and triple bonds. And at least one group or substance selected from the group consisting of a saturated bond, a halogen such as F, Cl, Br, and I, and a peroxide.
Further, it is preferable to appropriately select and perform various surface treatments as described above so that a surface having such a material can be obtained.

In place of the surface treatment, it is preferable to form an intermediate layer in advance in at least the region of the drive member 22 where the bonding film 52 is formed.
The intermediate layer may have any function, and for example, a layer having a function of improving adhesion to the bonding film 52, a cushioning function (buffer function), a function of reducing stress concentration, or the like is preferable. By forming the bonding film 52 on the driving member 22 through such an intermediate layer, the bonding strength between the driving member 22 and the bonding film 52 is increased, and a highly reliable bonded body, that is, the optical device 1 is obtained. be able to.

Examples of the constituent material of the intermediate layer include metal materials such as aluminum and titanium, metal oxides, oxide materials such as silicon oxide, metal nitrides, and nitride materials such as silicon nitride. , Carbon-based materials such as graphite and diamond-like carbon, silane coupling agents, thiol-based compounds, metal alkoxides, and self-assembled film materials such as metal-halogen compounds. A combination of more than one species can be used.
Further, among the intermediate layers formed of these materials, the intermediate layer formed of the oxide-based material can particularly increase the bonding strength between the drive member 22 and the bonding film 52.

On the other hand, it is preferable that a region of the first shaft member 23 that is in contact with the bonding film 52 is preliminarily subjected to a surface treatment that improves adhesion with the bonding film 52. As a result, the bonding strength between the first shaft member 23 and the bonding film 52 can be further increased.
For this surface treatment, the same treatment as the above-described surface treatment performed on the drive member 22 can be applied.

Further, instead of the surface treatment, it is preferable to previously form an intermediate layer having a function of improving adhesion to the bonding film 52 in a region of the first shaft member 23 that is in contact with the bonding film 52. . As a result, the bonding strength between the first shaft member 23 and the bonding film 52 can be further increased.
As the constituent material of the intermediate layer, the same constituent material as that of the intermediate layer formed on the driving member 22 described above can be used.

Here, a mechanism in which the bonding film 52 provided on the driving member 22 is bonded to the first shaft member 23 in this step will be described.
For example, the case where a hydroxyl group is exposed in a region of the first shaft member 23 that is used for bonding with the driving member 22 will be described as an example. In this step, the bonding film 52 and the first shaft member are used. When the first shaft member 23 and the drive member 22 are bonded together so that the first shaft member 23 contacts the hydroxyl group present on the surface 521 of the bonding film 52 on the first shaft member 23 side, and the first shaft member The hydroxyl groups existing in the 23 regions attract each other by hydrogen bonding, and an attractive force is generated between the hydroxyl groups. It is assumed that the driving member 22 including the bonding film 52 and the first shaft member 23 are bonded by this attractive force.
Further, the hydroxyl groups attracting each other by the hydrogen bond are cleaved from the surface with dehydration condensation depending on the temperature condition or the like. As a result, at the contact interface between the bonding film 52 and the first shaft member 23, the bonding hands to which the hydroxyl groups are bonded are bonded. As a result, it is assumed that the first shaft member 23 and the drive member 22 are more firmly bonded via the bonding film 52.

Note that the active state of the surface of the bonding film 52 activated in the above-described step A3 (energy applying step) is gradually reduced. For this reason, it is preferable to transfer to this process A4 (bonding process) as soon as possible after completion of process A3. Specifically, the step A4 is preferably performed within 60 minutes after the completion of the step A3, and more preferably within 5 minutes. If it is within this time, the surface of the bonding film 52 is maintained in a sufficiently active state, and therefore the first shaft member 23 and the drive member 22 (the surface 521 of the bonding film 52) are bonded together in this step A4. In this case, a sufficient bonding strength can be obtained between them.
The bonding strength between the first shaft member 23 and the drive member 22 thus bonded is preferably 5 MPa (50 kgf / cm ² ) or more, and preferably 10 MPa (100 kgf / cm ² ) or more. Is more preferable. With such a bonding strength, peeling of the bonding interface can be sufficiently prevented. And the optical device 1 with high reliability is obtained.

[B]
-B1-
Next, the support body 3 obtained by processing the substrate is prepared, and as shown in FIG. 9E, the base body 2 and the support body 3 are bonded through the bonding film 57 and a pair of magnets. 41 and 42 are joined to the support 3. In addition, the coil 221 is formed on the upper surface of the driving member 22, and terminals 213 and 214, wirings, and the like are formed.

As the substrate for forming the support 3, a substrate having a uniform thickness and free from bending and scratches is preferably used. As the constituent material of the substrate, those described in the description of the support 3 can be used.
The bonding film 57 can be formed by the same method as the bonding film 52 described above. That is, the bonding film 57 is formed by plasma polymerization as in the above-described step A2, and then energy is applied in the same manner as in the above-described step A3.

The optical device 1 can be manufactured by the steps [A] and [B] as described above.
In the manufacturing method described above, the first shaft member 23 and the drive member 22 are bonded together so that the bonding film 52 formed on the drive member 22 and the first shaft member 23 are in close contact with each other. Although described, the first shaft member 23 and the drive member 22 may be bonded together so that the bonding film 52 formed on the first shaft member 23 and the drive member 22 are in close contact with each other. .

Further, the bonding film 52 may be formed on both the first shaft member 23 and the driving member 22. In this case, the interface of each part can be joined more firmly. Further, since the material of the adherend (specifically, the first shaft member 23 and the drive member 22) hardly affects the bonding strength, the respective parts are firmly joined regardless of the material of the adherend. A highly reliable optical device 1 is obtained. In this case, for example, energy is applied to the bonding film 52 with respect to each of the bonding film 52 formed on the first shaft member 23 and the bonding film 52 formed on the driving member 22. You can do it.
Further, after the above-described step A5, the substrate 2 or the optical device 1 is subjected to at least one of the following two steps B2 and B3 (step of increasing the bonding strength of the optical device 1) as necessary. You may make it perform. Thereby, the further improvement of the joint strength of the 1st shaft member 23 and the drive member 22 can be aimed at.

-C6-
The optical device 1 (or the substrate 2; the same applies hereinafter) is compressed in the thickness direction (vertical direction in FIGS. 2 and 9), that is, the first shaft member 23 and the drive member 22 approach each other. Pressurize.
Thereby, the joining strength of the 1st shaft member 23 and the drive member 22 can be raised more.

In addition, by pressurizing the optical device 1, the gap remaining at the bonding interface in the optical device 1 can be crushed and the bonding area can be further expanded. Thereby, the joint strength in the optical device 1 can be further increased.
At this time, the pressure when pressurizing the optical device 1 is a pressure that does not damage the optical device 1 and is preferably as high as possible. Thereby, the joint strength in the optical device 1 can be increased in proportion to the pressure.

In addition, what is necessary is just to adjust this pressure suitably according to conditions, such as a constituent material and shape of each part of the optical device 1, and a joining apparatus. Specifically, although it varies slightly depending on the above conditions, it is preferably about 0.2 to 10 MPa, and more preferably about 1 to 5 MPa. Thereby, the joining strength of the optical device 1 can be reliably increased. In addition, although this pressure may exceed the said upper limit, depending on the constituent material of each part of the optical device 1, there exists a possibility that the optical device 1 may be damaged.
The time for pressurization is not particularly limited, but is preferably about 10 seconds to 30 minutes. In addition, what is necessary is just to change suitably the time to pressurize according to the pressure at the time of pressurizing. Specifically, the higher the pressure at which the optical device 1 is pressed, the more the bonding strength can be improved even if the pressing time is shortened.

-C7-
The obtained optical device 1 is heated.
Thereby, the joint strength in the optical device 1 can be further increased.
At this time, the temperature at the time of heating the optical device 1 is not particularly limited as long as it is higher than room temperature and lower than the heat resistance temperature of the optical device 1, but is preferably about 25 to 100 ° C, more preferably 50 to 100. About ℃. By heating at a temperature in such a range, it is possible to reliably increase the bonding strength while reliably preventing the optical device 1 from being altered or deteriorated by heat.
The heating time is not particularly limited, but is preferably about 1 to 30 minutes.

In addition, when performing both process B2 and B3 which were demonstrated above, it is preferable to perform these simultaneously. That is, it is preferable to heat the optical device 1 while applying pressure. Thereby, the effect by pressurization and the effect by heating are exhibited synergistically, and the joint strength of the optical device 1 can be particularly increased.
By performing the steps as described above, it is possible to easily further improve the bonding strength in the optical device 1.

Second Embodiment
Next, a second embodiment of the optical device of the present invention will be described.
FIG. 11 is a perspective view showing a second embodiment of the optical device of the present invention, and FIG. 12 is a plan view of the optical device shown in FIG. In the following, for convenience of explanation, the front side of the sheet in FIG. 12 is referred to as “upper”, the rear side of the sheet is referred to as “lower”, the right side is referred to as “right”, and the left side is referred to as “left”.

Hereinafter, the optical device of the second embodiment will be described focusing on the differences from the optical device of the first embodiment described above, and the description of the same matters will be omitted.
As shown in FIGS. 11 and 12, the optical device 1 </ b> A of the second embodiment is substantially the same as the optical device 1 of the first embodiment except that the configuration of the drive member, the movable plate, and each second shaft member is different. It is the same.

In the optical device 1A, the drive member 22 and the second shaft members 26 and 27 are integrally formed. The second shaft member 26 is bonded to the movable plate 25 via the bonding film 55A, and the second shaft member 27 is bonded to the movable plate 25 via the bonding film 56A.
That is, in the second embodiment, the base body 2 includes a first member provided on the drive member 22 side, with the vicinity of the end portion on the movable plate 25 side of each of the second shaft members 26 and 27 as a boundary portion, It divides | segments into the 2nd member provided in the movable plate 25 side, and is joined to the 2nd member via the joining film | membrane in the said boundary part.

Here, the first member includes a drive member 22 and a pair of second shaft members 26 and 27, and the second member includes a movable plate 25.
Therefore, in this embodiment, the drive member 22 and the pair of second shaft members 26 and 27 can be collectively formed by processing the substrate. Further, the constituent material of the driving member 22 and the constituent material of each of the second shaft members 26 and 27 can be made the same. For example, by using the superelastic alloy as described above as these constituent materials, The vibration characteristics of the vibration system including the movable plate 25 and the pair of second shaft members 26 and 27 can be made excellent.
Further, the constituent material of the movable plate 25 and the constituent materials of the second shaft members 26 and 27 can be made different, and the vibration system comprising the movable plate 25 and the pair of second shaft members 26 and 27. The design freedom of the optical device 1A can be improved.

<Third Embodiment>
Next, a third embodiment of the present invention will be described.
FIG. 13 is a partially enlarged view showing a state before applying energy of the bonding film in the third embodiment of the present invention, and FIG. 14 is a partially enlarged view showing a state after applying energy of the bonding film in the third embodiment of the present invention. FIG. In the following description, the upper side in FIGS. 13 and 14 is referred to as “upper” and the lower side is referred to as “lower”.
In the following description, differences from the first embodiment described above will be mainly described, and description of similar matters will be omitted.
The optical device according to the present embodiment is the same as the first embodiment described above except that the configuration of the bonding film is different.

That is, in the optical device according to the present embodiment, the bonding film 52 is in a state before energy application, and a metal atom, an oxygen atom bonded to the metal atom, and a desorption bonded to at least one of the metal atom and the oxygen atom. And a group 303. In other words, each of the bonding films 52 before energy application is a film in which a leaving group 303 is introduced into a metal oxide film made of a metal oxide.
In such a bonding film 52, when energy is applied, the leaving group 303 is released from at least one of a metal atom and an oxygen atom, and an active hand 304 is generated at least near the surface of the bonding film 52. As a result, the same adhesiveness as in the first embodiment described above is expressed on the surface of the bonding film 52.

In the third embodiment, the bonding film 52 is composed of a metal atom and an oxygen atom bonded to the metal atom, that is, the bonding group 52 is deformed because the leaving group 303 is bonded to the metal oxide. It becomes a difficult and hard film. For this reason, the bonding film 52 itself has high dimensional accuracy, and the optical device 1 finally obtained also has high dimensional accuracy.
Further, the bonding film 52 is a solid that does not have fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 52) hardly change as compared with a liquid or viscous liquid (semi-solid) adhesive having fluidity that has been conventionally used. Therefore, the dimensional accuracy of the optical device 1 obtained by using the bonding film 52 is remarkably higher than the conventional one. Furthermore, since the time required for the curing of the adhesive is not required, strong bonding can be achieved in a short time.

Further, the bonding film 52 can have conductivity as needed. Thereby, the freedom degree of design, such as routing of the wiring of the optical device 1, can be improved. In this case, the resistivity of the bonding film 52 is preferably 1 × 10 ⁻³ Ω · cm or less, although it varies slightly depending on the composition of the constituent material of the bonding film 52, and is preferably 1 × 10 ⁻⁴ Ω · cm or less. It is more preferable that

  The leaving group 303 only needs to exist at least near the surface 521 of the bonding film 52 on the first shaft member 23 side, or may exist in almost the entire bonding film 52, or the bonding film 52. The first shaft member 23 side surface 521 may be unevenly distributed. In addition, when the leaving group 303 is configured to be unevenly distributed in the vicinity of the surface 521 on the first shaft member 23 side, the function as a metal oxide film can be preferably exhibited in the bonding film 52. That is, the bonding film 52 can be advantageously provided with a function as a metal oxide film excellent in characteristics such as conductivity and translucency in addition to the function responsible for bonding. In other words, it is possible to reliably prevent the leaving group 303 from impairing the properties of the bonding film 52 such as conductivity and translucency.

A metal atom is selected so that the function as the bonding film 52 as described above is suitably exhibited.
Specifically, the metal atom is not particularly limited. For example, Li, Be, B, Na, Mg, Al, K, Ca, Sc, V, Cr, Mn, Fe, Co, Ni, Cu, Zn Ga, Rb, Sr, Y, Zr, Nb, Mo, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Ti, Pb, and the like. Among these, it is preferable to use one or more of In (indium), Sn (tin), Zn (zinc), Ti (titanium), and Sb (antimony) in combination. By using the bonding film 52 that includes these metal atoms, that is, a metal oxide that includes these metal atoms and a leaving group 303 introduced therein, the bonding film 52 has excellent conductivity and transparency. Will be demonstrated.

More specifically, examples of the metal oxide include indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), fluorine-containing indium tin oxide (FTO), and zinc oxide. (ZnO) and titanium dioxide (TiO _2), and the like.
When indium tin oxide (ITO) is used as the metal oxide, the atomic ratio of indium to tin (indium / tin ratio) is preferably 99/1 to 80/20, and 97/3 More preferably, it is -85/15. Thereby, the effects as described above can be more remarkably exhibited.
Further, the abundance ratio of metal atoms and oxygen atoms in the bonding film 52 is preferably about 3: 7 to 7: 3, and more preferably about 4: 6 to 6: 4. By setting the abundance ratio of metal atoms and oxygen atoms to be in the above range, the stability of the bonding film 52 is increased, and the first shaft member 23 and the drive member 22 can be bonded more firmly. It becomes like this.

  Further, as described above, the leaving group 303 behaves so as to generate an active hand in the bonding film 52 by leaving from at least one of a metal atom and an oxygen atom. Therefore, although the leaving group 303 is relatively easily and uniformly desorbed by being given energy, it is securely bonded to the bonding film 52 so as not to be desorbed when no energy is given. Those are preferably selected.

From this viewpoint, the leaving group 303 is preferably a hydrogen atom, a carbon atom, a nitrogen atom, a phosphorus atom, a sulfur atom and a halogen atom, or at least one of atomic groups composed of these atoms. It is done. Such a leaving group 303 is relatively excellent in bond / elimination selectivity by applying energy. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness between the first shaft member 23 and the drive member 22 can be further enhanced. it can.
Examples of the atomic group (group) composed of the above atoms include, for example, an alkyl group such as a methyl group and an ethyl group, an alkoxy group such as a methoxy group and an ethoxy group, a carboxyl group, an amino group, and a sulfonic acid. Groups and the like.

Among the atoms and atomic groups as described above, the leaving group 303 is particularly preferably a hydrogen atom. Since the leaving group 303 composed of hydrogen atoms has high chemical stability, the bonding film 52 including a hydrogen atom as the leaving group 303 has excellent weather resistance and chemical resistance.
Considering the above, as the bonding film 52, indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), fluorine-containing indium tin oxide (FTO), zinc oxide ( A material in which a hydrogen atom is introduced as a leaving group 303 into a metal oxide of ZnO) or titanium dioxide (TiO ₂ ) is preferably selected.

  The bonding film 52 having such a configuration itself has excellent mechanical characteristics. In addition, it exhibits particularly excellent adhesion to many materials. Therefore, such a bonding film 52 adheres particularly firmly to the driving member 22 and also exhibits a particularly strong adhesion force to the first shaft member 23, and as a result, the first shaft member 23. And the drive member 22 can be firmly joined.

The average thickness of the bonding film 52 is preferably about 1 to 1000 nm, and more preferably about 2 to 800 nm. By making the average thickness of the bonding film 52 within the above range, the first shaft member 23 and the driving member 22 are bonded more firmly while preventing the dimensional accuracy of the optical device 1 from being significantly reduced. Can do.
That is, when the average thickness of the bonding film 52 is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 52 exceeds the upper limit, the dimensional accuracy of the optical device 1 may be significantly reduced.

Furthermore, if the average thickness of the bonding film 52 is within the above range, a certain degree of shape followability is ensured for the bonding film 52. For this reason, for example, even when unevenness exists on the bonding surface of the drive member 22 (the surface on which the bonding film 52 is formed), depending on the height of the unevenness, it follows the shape of the unevenness. The bonding film 52 can be deposited on the substrate. As a result, the bonding film 52 can absorb the unevenness and reduce the height of the unevenness generated on the surface. And when the 1st shaft member 23 and the drive member 22 are bonded together, the adhesiveness of the bonding film 52 with respect to the 1st shaft member 23 can be improved.
Note that the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 52 increases. Therefore, in order to sufficiently ensure the shape following property, the thickness of the bonding film 52 may be as large as possible.

  In the bonding film 52 according to the third embodiment as described above, in the case where the leaving group 303 is present in almost the entire bonding film 52, for example, A: atmosphere containing an atomic component constituting the leaving group 303 A metal oxide material containing metal atoms and oxygen atoms can be formed by a physical vapor deposition method. Further, when the leaving group 303 is unevenly distributed in the vicinity of the surface 521 of the bonding film 52 on the first shaft member 23 side, for example, a metal oxide film containing B: metal atoms and the oxygen atoms is formed. Thereafter, the metal oxide film can be formed by introducing a leaving group 303 into at least one of a metal atom and an oxygen atom contained in the vicinity of the surface of the metal oxide film.

Hereinafter, the case where the bonding film 52 is formed on the drive member 22 using the methods A and B will be described in detail.
<A> In the method A, as described above, the bonding film 52 is formed of a metal atom and an oxygen by a physical vapor deposition method (PVD method) in an atmosphere containing an atomic component constituting the leaving group 303. It is formed by depositing a metal oxide material containing atoms. When the PVD method is used in this way, the leaving group 303 can be introduced into at least one of the metal atom and the oxygen atom relatively easily when the metal oxide material is made to fly toward the driving member 22. For this reason, the leaving group 303 can be introduced over almost the entire bonding film 52.

  Further, when the PVD method is used, a dense and homogeneous bonding film 52 can be efficiently formed. Thereby, the bonding film 52 formed by the PVD method can be particularly strongly bonded to the driving member 22. Furthermore, the bonding film 52 formed by the PVD method is maintained for a relatively long time in a state where energy is applied and activated. For this reason, the manufacturing process of the optical device 1 can be simplified and efficient.

  Further, examples of the PVD method include a vacuum deposition method, a sputtering method, an ion plating method, a laser ablation method, and the like. Among these, the sputtering method is preferably used. According to the sputtering method, metal oxide particles can be knocked out into an atmosphere containing an atomic component constituting the leaving group 303 without breaking a bond between a metal atom and an oxygen atom. Since the metal oxide particles can be brought into contact with a gas containing an atomic component constituting the leaving group 303, the leaving group to the metal oxide (metal atom or oxygen atom) can be contacted. 303 can be introduced more smoothly.

Hereinafter, as a method for forming the bonding film 52 by the PVD method, a case where the bonding film 52 is formed by a sputtering method (ion beam sputtering method) will be described as a representative.
First, prior to describing the method for forming the bonding film 52, the film forming apparatus 1200 used when forming the bonding film 52 on the driving member 22 by the ion beam sputtering method will be described.

FIG. 15 is a longitudinal sectional view schematically showing a film forming apparatus used for manufacturing a bonding film according to this embodiment, and FIG. 16 is a schematic view showing a configuration of an ion source included in the film forming apparatus shown in FIG. is there. In the following description, the upper side in FIG. 15 is referred to as “upper” and the lower side is referred to as “lower”.
A film forming apparatus 1200 shown in FIG. 15 is configured so that the bonding film 52 can be formed in a chamber (apparatus) by an ion beam sputtering method.

  Specifically, the film forming apparatus 1200 includes a chamber (vacuum chamber) 1211 and a substrate holder (film forming object holding unit) 1212 that is installed in the chamber 1211 and holds the driving member 22 (film forming object). And an ion source (ion supply unit) 1215 that is installed in the chamber 1211 and irradiates the ion beam B toward the chamber 1211, and a metal oxide that includes metal atoms and oxygen atoms by irradiation with the ion beam B ( For example, it has a target holder (target holding part) 1217 for holding a target (metal oxide material) 1216 for generating ITO.

In the chamber 1211, gas supply means 1260 for supplying a gas containing an atomic component constituting the leaving group 303 (for example, hydrogen gas) into the chamber 1211 and the pressure in the chamber 1211 are exhausted. And an evacuation unit 1230.
In the present embodiment, the substrate holder 1212 is attached to the ceiling of the chamber 1211. The substrate holder 1212 is rotatable. Accordingly, the bonding film 52 can be formed on the driving member 22 with a uniform and uniform thickness.

As shown in FIG. 16, the ion source (ion gun) 1215 includes an ion generation chamber 1256 in which an opening (irradiation port) 1250 is formed, a filament 1257 provided in the ion generation chamber 1256, grids 1253 and 1254, And a magnet 1255 installed outside the ion generation chamber 1256.
Further, as shown in FIG. 15, a gas supply source 1219 for supplying a gas (sputtering gas) is connected to the ion generation chamber 1256.

In the ion source 1215, when the filament 1257 is energized and heated in the state where the gas is supplied from the gas supply source 1219 into the ion generation chamber 1256, electrons are emitted from the filament 1257, and the emitted electrons are generated by the magnetic field of the magnet 1255. It moves and collides with gas molecules supplied into the ion generation chamber 1256. Thereby, gas molecules are ionized. The ions I ⁺ of the gas are extracted from the ion generation chamber 1256 and accelerated by a voltage gradient between the grid 1253 and the grid 1254, and are emitted (irradiated) from the ion source 1215 as an ion beam B through the opening 1250. Is done.
The ion beam B irradiated from the ion source 1215 collides with the surface of the target 1216, and particles (sputtered particles) are knocked out from the target 1216. This target 1216 is made of a metal oxide material as described above.

  In the film forming apparatus 1200, the ion source 1215 is fixed (installed) on the side wall of the chamber 1211 so that the opening 1250 is located in the chamber 1211. Note that the ion source 1215 can be arranged at a position separated from the chamber 1211 and connected to the chamber 1211 through a connection portion. Miniaturization of 1200 can be achieved.

Further, the ion source 1215 is installed such that the opening 1250 faces in a direction different from that of the substrate holder 1212, in this embodiment, the bottom side of the chamber 1211.
Note that the number of ion sources 1215 is not limited to one, and may be plural. By installing a plurality of ion sources 1215, the deposition rate of the bonding film 52 can be increased.

In addition, a first shutter 1220 and a second shutter 1221 that can cover the target holder 1217 and the substrate holder 1212 are disposed, respectively.
These shutters 1220 and 1221 are for preventing the target 1216, the drive member 22, and the bonding film 52 from being exposed to an unnecessary atmosphere or the like, respectively.
The exhaust unit 1230 includes a pump 1232, an exhaust line 1231 that communicates the pump 1232 and the chamber 1211, and a valve 1233 provided in the middle of the exhaust line 1231. The pressure can be reduced.

  Further, the gas supply means 1260 includes a gas cylinder 1264 that stores a gas (for example, hydrogen gas) that includes an atomic component constituting the leaving group 303, a gas supply line 1261 that guides the gas from the gas cylinder 1264 to the chamber 1211, and a gas A pump 1262 and a valve 1263 provided in the middle of the supply line 1261 are configured so that a gas containing an atomic component constituting the leaving group 303 can be supplied into the chamber 1211.

Using the film forming apparatus 1200 configured as described above, the bonding film 52 is formed as follows.
Here, a method of forming the bonding film 52 on the driving member 22 will be described.
First, the drive member 22 is prepared, and the drive member 22 is carried into the chamber 1211 of the film forming apparatus 1200 and mounted (set) on the substrate holder 1212.

Next, the exhaust means 1230 is operated, that is, the valve 1233 is opened while the pump 1232 is operated, thereby reducing the pressure inside the chamber 1211. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.
Further, the gas supply means 1260 is operated, that is, the valve 1263 is opened while the pump 1262 is operated, whereby the gas containing the atomic components constituting the leaving group 303 is supplied into the chamber 1211. Thereby, the inside of a chamber can be made into the atmosphere containing this gas (hydrogen gas atmosphere).

The flow rate of the gas containing the atomic component constituting the leaving group 303 is preferably about 1 to 100 ccm, and more preferably about 10 to 60 ccm. Thereby, the leaving group 303 can be reliably introduced into at least one of the metal atom and the oxygen atom.
The temperature in the chamber 1211 may be 25 ° C. or higher, but is preferably about 25 to 100 ° C. By setting within this range, the reaction between the metal atom or oxygen atom and the gas containing the atomic component is efficiently performed, and the gas containing the atomic component is reliably introduced into the metal atom and the oxygen atom. Can do.

Next, the second shutter 1221 is opened, and the first shutter 1220 is opened.
In this state, gas is introduced into the ion generation chamber 1256 of the ion source 1215 and the filament 1257 is energized and heated. Thereby, electrons are emitted from the filament 1257, and the emitted electrons collide with gas molecules, whereby the gas molecules are ionized.

The gas ions I ⁺ are accelerated by the grid 1253 and the grid 1254, emitted from the ion source 1215, and collide with a target 1216 made of a cathode material. Thereby, particles of metal oxide (for example, ITO) are knocked out of the target 1216. At this time, since the inside of the chamber 1211 is in an atmosphere containing a gas containing an atomic component constituting the leaving group 303 (for example, in a hydrogen gas atmosphere), the metal atoms contained in the particles knocked out into the chamber 1211 And a leaving group 303 is introduced into the oxygen atom. Then, the metal oxide introduced with the leaving group 303 is deposited on the first shaft member 23, whereby the bonding film 52 is formed.
In the ion beam sputtering method described in this embodiment, discharge is performed in the ion generation chamber 1256 of the ion source 1215, and electrons e ⁻ are generated. The electrons e ⁻ are shielded by the grid 1253, Release into the chamber 1211 is prevented.

Further, since the irradiation direction of the ion beam B (the opening 1250 of the ion source 1215) is directed to the target 1216 (a direction different from the bottom side of the chamber 1211), ultraviolet rays generated in the ion generation chamber 1256 are formed. Irradiation to the bonding film 52 is more reliably prevented, and it is possible to reliably prevent the leaving group 303 introduced during the formation of the bonding film 52 from being detached.
As described above, the bonding film 52 in which the leaving group 303 exists almost entirely can be formed.

  <B> On the other hand, in the method B, the bonding film 52 is formed of a metal oxide film containing metal atoms and oxygen atoms as described above, and then the metal contained in the vicinity of the surface of the metal oxide film. It is formed by introducing a leaving group 303 into at least one of an atom and an oxygen atom. By using such a method, it is possible to introduce the leaving group 303 in a state of being unevenly distributed in the vicinity of the surface of the metal oxide film in a relatively simple process, and both characteristics as a bonding film and a metal oxide film are obtained. It is possible to form the bonding film 52 excellent in the above.

  Here, the metal oxide film may be formed by any method, for example, PVD method (physical vapor deposition method), CVD method (chemical vapor deposition method), plasma polymerization method, etc. The film can be formed by various vapor phase film forming methods, various liquid phase film forming methods, and the like, and it is particularly preferable to form the film by the PVD method. According to the PVD method, a dense and homogeneous metal oxide film can be efficiently formed.

  Moreover, examples of the PVD method include a vacuum deposition method, a sputtering method, an ion plating method, a laser ablation method, and the like. Among these, it is preferable to use a sputtering method. According to the sputtering method, the metal oxide particles can be struck out into the atmosphere and supplied onto the driving member 22 without breaking the bond between the metal atom and the oxygen atom. An oxide film can be formed.

  Furthermore, as a method for introducing the leaving group 303 near the surface of the metal oxide film, various methods are used. For example, the metal oxide film is formed in an atmosphere containing an atomic component constituting the B1: leaving group 303. Examples of the method include heat treatment (annealing), B2: ion implantation, and the like. In particular, it is preferable to use the method B1. By using the method B1, the leaving group 303 can be selectively introduced near the surface of the metal oxide film relatively easily. Further, by appropriately setting the processing conditions such as the atmospheric temperature and the processing time when performing the heat treatment, the amount of the leaving group 303 to be introduced, and further the thickness of the metal oxide film into which the leaving group 303 is introduced. Can be accurately controlled.

Hereinafter, a metal oxide film is formed by a sputtering method (ion beam sputtering method), and then the obtained metal oxide film is subjected to heat treatment (annealing) in an atmosphere containing an atomic component constituting the leaving group 303. Thus, the case where the bonding film 52 is obtained will be described as a representative.
Even when the bonding film 52 is formed using the method B, a film forming apparatus similar to the film forming apparatus 1200 used when forming the bonding film 52 using the method A is used. A description of the film forming apparatus is omitted.

[I] First, the drive member 22 is prepared. Then, the driving member 22 is carried into the chamber 1211 of the film forming apparatus 1200 and mounted (set) on the substrate holder 1212.
[Ii] Next, the inside of the chamber 1211 is decompressed by opening the valve 1233 while operating the exhaust means 1230, that is, with the pump 1232 operating. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.
At this time, the heating means is operated to heat the inside of the chamber 1211. Although the temperature in the chamber 1211 should just be 25 degreeC or more, it is preferable that it is about 25-100 degreeC. By setting within this range, a metal oxide film having a high film density can be formed.

[Iii] Next, the second shutter 1221 is opened, and the first shutter 1220 is further opened.
In this state, gas is introduced into the ion generation chamber 1256 of the ion source 1215 and the filament 1257 is energized and heated. Thereby, electrons are emitted from the filament 1257, and the emitted electrons collide with gas molecules, whereby the gas molecules are ionized.

The gas ions I ⁺ are accelerated by the grid 1253 and the grid 1254, emitted from the ion source 1215, and collide with a target 1216 made of a cathode material. As a result, metal oxide (for example, ITO) particles are knocked out of the target 1216 and deposited on the drive member 22 to form a metal oxide film containing metal atoms and oxygen atoms bonded to the metal atoms. It is formed.

In the ion beam sputtering method described in this embodiment, discharge is performed in the ion generation chamber 1256 of the ion source 1215, and electrons e ⁻ are generated. The electrons e ⁻ are shielded by the grid 1253, Release into the chamber 1211 is prevented.
Further, since the irradiation direction of the ion beam B (the opening 1250 of the ion source 1215) is directed to the target 1216 (a direction different from the bottom side of the chamber 1211), ultraviolet rays generated in the ion generation chamber 1256 are formed. Irradiation to the bonding film 52 is more reliably prevented, and it is possible to reliably prevent the leaving group 303 introduced during the formation of the bonding film 52 from being detached.

[Iv] Next, with the second shutter 1221 open, the first shutter 1220 is closed.
In this state, the heating means is operated to further heat the chamber 1211. The temperature in the chamber 1211 is set to a temperature at which the leaving group 303 is efficiently introduced onto the surface of the metal oxide film, and is preferably about 100 to 600 ° C., more preferably about 150 to 300 ° C. preferable. By setting within this range, in the next step [v], the leaving group 303 can be efficiently introduced onto the surface of the metal oxide film without deteriorating / deteriorating the driving member 22 and the metal oxide film. it can.

[V] Next, by operating the gas supply means 1260, that is, by opening the valve 1263 with the pump 1262 activated, a gas containing atomic components constituting the leaving group 303 is supplied into the chamber 1211. Thereby, the inside of the chamber 1211 can be set to an atmosphere containing such a gas (under a hydrogen gas atmosphere).
As described above, in the state where the inside of the chamber 1211 is heated in the step [iv], the inside of the chamber 1211 includes an atmosphere containing a gas containing an atomic component constituting the leaving group 303 (for example, under a hydrogen gas atmosphere). Then, the leaving group 303 is introduced into at least one of a metal atom and an oxygen atom existing near the surface of the metal oxide film, and the bonding film 52 is formed.
The flow rate of the gas containing the atomic component constituting the leaving group 303 is preferably about 1 to 100 ccm, and more preferably about 10 to 60 ccm. Thereby, the leaving group 303 can be reliably introduced into at least one of the metal atom and the oxygen atom.

  Note that, in the chamber [1211], it is preferable that the reduced pressure state adjusted by operating the exhaust unit 1230 is maintained in the chamber 1211. Thereby, the leaving group 303 can be introduced more smoothly into the vicinity of the surface of the metal oxide film. In addition, by reducing the pressure in the chamber 1211 in this step while maintaining the reduced pressure state in the step [ii], it is possible to save the time for reducing the pressure again. There is also an advantage that it can be achieved.

The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.
Moreover, it is preferable that the time which heat-processes is about 15 to 120 minutes, and it is more preferable that it is about 30 to 60 minutes.
Although depending on the type of leaving group 303 to be introduced, etc., the metal oxide film can be obtained by setting the conditions for the heat treatment (temperature in the chamber 1211, degree of vacuum, gas flow rate, treatment time) within the above ranges. A leaving group 303 can be selectively introduced in the vicinity of the surface.
As described above, the bonding film 52 in which the leaving group 303 is unevenly distributed can be formed in the vicinity of the surface 521 on the first shaft member 23 side.
In the optical device 1 according to the second embodiment as described above, the same operations and effects as those of the first embodiment described above can be obtained.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described.
In the following description, differences from the above-described first to third embodiments will be mainly described, and description of similar matters will be omitted.
The optical device according to the present embodiment is the same as the first embodiment described above except that the configuration of the bonding film is different.
That is, the optical device according to the present embodiment includes a leaving group 303 composed of a metal atom and an organic component in a state where the bonding film 52 is before energy application.

In such a bonding film 52, when energy is applied, the leaving group 303 is detached from the bonding film 52, and an active hand 304 is generated at least near the surface of the bonding film 52. As a result, the same adhesiveness as in the third embodiment described above is expressed on the surface of the bonding film 52.
The bonding film 52 is provided on the driving member 22 and includes a leaving group 303 composed of metal atoms and organic components.

When energy is applied to such a bonding film 52, the bond of the leaving group 303 is cut and the bonding film 52 is desorbed from at least the vicinity of the surface 521 on the first shaft member 23 side, as shown in FIG. In addition, the active hand 304 is generated at least near the surface 521 on the first shaft member 23 side of the bonding film 52. Thereby, adhesiveness is expressed on the surface 521 of the bonding film 52 on the first shaft member 23 side. When such adhesiveness develops, the driving member 22 provided with the bonding film 52 can be firmly and efficiently bonded to the first shaft member 23 with high dimensional accuracy.
Further, since the bonding film 52 includes a metal atom and a leaving group 303 formed of an organic component, that is, an organic metal film, the bonding film 52 is a strong film that is difficult to be deformed. For this reason, the bonding film 52 itself has high dimensional accuracy, and the optical device 1 finally obtained also has high dimensional accuracy.

Such a bonding film 52 is a solid having no fluidity. For this reason, the thickness and shape of the adhesive layer (bonding film 52) hardly change as compared with a liquid or viscous liquid (semi-solid) adhesive having fluidity that has been conventionally used. Therefore, the dimensional accuracy of the optical device 1 obtained by using such a bonding film 52 is remarkably higher than the conventional one. Furthermore, since the time required for the curing of the adhesive is not required, strong bonding can be achieved in a short time.
Further, the bonding film 52 can have conductivity as needed. Thereby, the freedom degree of design, such as routing of the wiring of the optical device 1, can be improved.

The metal atom and the leaving group 303 are selected so that the function as the bonding film 52 as described above is suitably exhibited.
Specifically, examples of the metal atom include Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Hf, Transition metal elements such as Ta, W, Re, Os, Ir, Pt, Au, various lanthanoid elements, various actinoid elements, Li, Be, Na, Mg, Al, K, Ca, Zn, Ga, Rb, Sr, Typical metal elements such as Cd, In, Sn, Sb, Cs, Ba, Tl, Pd, Bi, and Po are listed.

  Here, since the transition metal element is the only difference in the number of outermost electrons between the transition metal elements, the physical properties are similar. Transition metals generally have high hardness and melting point, and high electrical conductivity and thermal conductivity. For this reason, when a transition metal element is used as a metal atom, the adhesiveness expressed in the bonding film 52 can be further improved. In addition, the conductivity of the bonding film 52 can be further increased.

  Further, when one or more of Cu, Al, Zn, and Fe are used as metal atoms in combination, the bonding film 52 exhibits excellent conductivity. Further, when the bonding film 52 is formed by using a metal organic chemical vapor deposition method, which will be described later, a bonding film having a relatively easy and uniform film thickness using a metal complex containing these metals as a raw material. 52 can be formed.

  Further, as described above, the leaving group 303 behaves so as to generate an active hand in the bonding film 52 by detaching from the bonding film 52. Therefore, although the leaving group 303 is relatively easily and uniformly desorbed by being given energy, it is securely bonded to the bonding film 52 so as not to be desorbed when no energy is given. Those are preferably selected.

Specifically, as the leaving group 303, an atomic group containing a carbon atom as an essential component and containing at least one of a hydrogen atom, a nitrogen atom, a phosphorus atom, a sulfur atom and a halogen atom is suitably selected. Such a leaving group 303 is relatively excellent in bond / elimination selectivity by applying energy. For this reason, such a leaving group 303 can sufficiently satisfy the above-described necessity, and the adhesiveness of the bonding film 52 can be further enhanced.
More specifically, examples of the atomic group (group) include an alkyl group such as a methyl group and an ethyl group, an alkoxy group such as a methoxy group and an ethoxy group, and a carboxyl group, and the end of the alkyl group is an isocyanate group. And those terminated with a group, an amino group, a sulfonic acid group, and the like.

Among the atomic groups as described above, the leaving group 303 is particularly preferably an alkyl group. Since the leaving group 303 composed of an alkyl group has high chemical stability, the bonding film 52 having an alkyl group as the leaving group 303 has excellent weather resistance and chemical resistance.
In the bonding film 52 having such a configuration, the abundance ratio of metal atoms to oxygen atoms is preferably about 3: 7 to 7: 3, and more preferably about 4: 6 to 6: 4. By setting the abundance ratio of metal atoms and carbon atoms to be within the above range, the stability of the bonding film 52 is increased, and the first shaft member 23 and the drive member 22 can be bonded more firmly. It becomes like this. Further, the bonding film 52 can exhibit excellent conductivity.

The average thickness of the bonding film 52 is preferably about 1 to 1000 nm, and more preferably about 50 to 800 nm. By making the average thickness of the bonding film 52 within the above range, the first shaft member 23 and the driving member 22 are bonded more firmly while preventing the dimensional accuracy of the optical device 1 from being significantly reduced. Can do.
That is, when the average thickness of the bonding film 52 is less than the lower limit value, there is a possibility that sufficient bonding strength cannot be obtained. On the other hand, when the average thickness of the bonding film 52 exceeds the upper limit, the dimensional accuracy of the optical device 1 may be significantly reduced.

Furthermore, if the average thickness of the bonding film 52 is within the above range, a certain degree of shape followability is ensured for the bonding film 52. For this reason, for example, even when unevenness exists on the bonding surface of the driving member 22 (surface on which the bonding film 52 is formed), the bonding is performed so as to follow the shape of the unevenness depending on the height of the unevenness. A film 52 can be deposited. As a result, the bonding film 52 can absorb the unevenness and reduce the height of the unevenness generated on the surface. And when the 1st shaft member 23 and the drive member 22 are bonded together, the adhesiveness of the bonding film 52 with respect to the 1st shaft member 23 can be improved.
Note that the degree of the shape followability as described above becomes more prominent as the thickness of the bonding film 52 increases. Therefore, in order to sufficiently ensure the shape following property, the thickness of the bonding film 52 may be as large as possible.

  The bonding film 52 as described above may be formed by any method. For example, IIa: an organic substance containing a leaving group (organic component) 303 on a metal film composed of a metal atom is replaced with a metal film. A method of forming the bonding film 52 by selectively imparting (chemically modifying) almost the entire surface or in the vicinity of the surface, IIb: an organic metal material having a metal atom and an organic substance containing a leaving group (organic component) 303 as a raw material As a method of forming the bonding film 52 using a metalorganic chemical vapor deposition method (a method of laminating or forming a bonding layer made of a monoatomic layer), IIc: an organic substance containing a metal atom and a leaving group 303 Examples thereof include a method in which an organic metal material is dissolved in an appropriate solvent as a raw material and a bonding film is formed using a spin coating method or the like. Among these, it is preferable to form the bonding film 52 by the method IIb. By using this method, the bonding film 52 having a uniform thickness can be formed in a relatively simple process.

Hereinafter, by the method of IIb, that is, the method of forming the bonding film 52 using a metal organic chemical vapor deposition method using an organic metal material having a metal atom and an organic substance containing a leaving group (organic component) 303 as a raw material, A case where the bonding film 52 is obtained will be described as a representative.
First, before describing the method for forming the bonding film 52, a film forming apparatus 1400 used when forming the bonding film 52 will be described.

FIG. 17 is a longitudinal sectional view schematically showing a film forming apparatus used for manufacturing the bonding film according to the fourth embodiment of the present invention. In the following description, the upper side in FIG. 17 is referred to as “upper” and the lower side is referred to as “lower”.
A film formation apparatus 1400 shown in FIG. 17 is configured so that the bonding film 52 can be formed in the chamber 1411 by a metal organic chemical vapor deposition method (hereinafter may be abbreviated as “MOCVD method”). .

  Specifically, the film forming apparatus 1400 is provided with a chamber (vacuum chamber) 1411 and a substrate holder (film forming object holding unit) 1412 that is installed in the chamber 1411 and holds the driving member 22 (film forming object). An organic metal material supply means 1460 for supplying a vaporized or atomized organic metal material into the chamber 1411; a gas supply means 1470 for supplying a gas for making the inside of the chamber 1411 in a low reducing atmosphere; An exhaust unit 1430 that controls the pressure by exhausting the inside of the gas generator 1411 and a heating unit (not shown) that heats the substrate holder 1412 are provided.

The substrate holder 1412 is attached to the bottom of the chamber 1411 in this embodiment. The substrate holder 1412 can be rotated by the operation of a motor. Accordingly, the bonding film 52 can be formed on the driving member 22 with a uniform and uniform thickness.
Further, in the vicinity of the substrate holder 1412, a shutter 1421 that can cover them is provided. The shutter 1421 is for preventing the drive member 22 and the bonding film 52 from being exposed to an unnecessary atmosphere or the like.

The organometallic material supply unit 1460 is connected to the chamber 1411. The organometallic material supply means 1460 includes a storage tank 1462 that stores solid organometallic material, a gas cylinder 1465 that stores a carrier gas that feeds the vaporized or atomized organometallic material into the chamber 1411, and a carrier gas. And a gas supply line 1461 for introducing the vaporized or atomized organometallic material into the chamber 1411, and a pump 1464 and a valve 1463 provided in the middle of the gas supply line 1461. In the organometallic material supply means 1460 having such a configuration, the storage tank 1462 has a heating means, and the operation of the heating means can heat and vaporize the solid organometallic material. Therefore, when the pump 1464 is operated with the valve 1463 opened and the carrier gas is supplied from the gas cylinder 1465 to the storage tank 1462, the organometallic material vaporized or atomized together with the carrier gas passes through the supply line 1461. Then, it is supplied into the chamber 1411.
In addition, it does not specifically limit as carrier gas, For example, nitrogen gas, argon gas, helium gas, etc. are used suitably.

  In this embodiment, a gas supply unit 1470 is connected to the chamber 1411. The gas supply means 1470 includes a gas cylinder 1475 for storing a gas for making the inside of the chamber 1411 in a low reducing atmosphere, a gas supply line 1471 for introducing the gas for making the low reducing atmosphere into the chamber 1411, A pump 1474 and a valve 1473 provided in the middle of the gas supply line 1471 are configured. In the gas supply means 1470 having such a configuration, when the pump 1474 is operated with the valve 1473 opened, the gas for making the low reducing atmosphere is supplied from the gas cylinder 1475 through the supply line 1471 to the chamber 1411. It is designed to be supplied inside. With the gas supply unit 1470 configured as described above, the inside of the chamber 1411 can be surely set in a low reduction atmosphere with respect to the organometallic material. As a result, when the bonding film 52 is formed using the MOCVD method using the organometallic material as a raw material, at least a part of the organic component contained in the organometallic material is left as the leaving group 303 so that the bonding film 52 is left. Is deposited.

The gas for bringing the inside of the chamber 1411 into a low reducing atmosphere is not particularly limited, and examples thereof include nitrogen gas and rare gases such as helium, argon, and xenon, nitrogen monoxide, and dinitrogen monoxide. These can be used alone or in combination of two or more.
In the case of using an organic metal material containing an oxygen atom in the molecular structure, such as 2,4-pentadionate-copper (II) or [Cu (hfac) (VTMS)] described later. In addition, it is preferable to add hydrogen gas to the gas for achieving a low reducing atmosphere. Thereby, the reducibility with respect to oxygen atoms can be improved, and the bonding film 52 can be formed without excessive oxygen atoms remaining in the bonding film 52. As a result, the bonding film 52 has a low abundance of metal oxide in the film, and exhibits excellent conductivity.

In addition, when at least one of the nitrogen gas, argon gas and helium gas described above is used as the carrier gas, the carrier gas can also exhibit a function as a gas for providing a low reducing atmosphere. it can.
The exhaust unit 1430 includes a pump 1432, an exhaust line 1431 that communicates the pump 1432 and the chamber 1411, and a valve 1433 provided in the middle of the exhaust line 1431. The pressure can be reduced.

The bonding film 52 is formed on the driving member 22 by the MOCVD method using the film forming apparatus 1400 having the above-described configuration.
[I] First, the drive member 22 is prepared. Then, the driving member 22 is carried into the chamber 1411 of the film forming apparatus 1400 and mounted (set) on the substrate holder 1412.

[Ii] Next, the inside of the chamber 1411 is decompressed by opening the valve 1433 while operating the exhaust unit 1430, that is, with the pump 1432 operating. The degree of vacuum (degree of vacuum) is not particularly limited, but is preferably about 1 × 10 ⁻⁷ to 1 × 10 ⁻⁴ Torr, preferably about 1 × 10 ⁻⁶ to 1 × 10 ⁻⁵ Torr. Is more preferable.

  Further, by operating the gas supply means 1470, that is, by opening the valve 1473 with the pump 1474 activated, a gas for making a low reducing atmosphere is supplied into the chamber 1411, and the inside of the chamber 1411 is supplied. Under a low reducing atmosphere. The flow rate of the gas by the gas supply unit 1470 is not particularly limited, but is preferably about 0.1 to 10 sccm, and more preferably about 0.5 to 5 sccm.

  Further, at this time, the heating means is operated to heat the substrate holder 1412. The temperature of the substrate holder 1412 varies slightly depending on the type of the bonding film 52 to be formed, that is, the type of raw material used when forming the bonding film 52, but is preferably about 80 to 600 ° C, and preferably 100 to 450 ° C. More preferably, it is about 200-300 degreeC. By setting within this range, the bonding film 52 having excellent adhesiveness can be formed using an organometallic material described later.

[Iii] Next, the shutter 1421 is opened.
Then, by operating the heating means provided in the storage tank 1462 in which the solid organic metal material is stored, the pump 1464 is operated in a state where the organic metal material is vaporized, and the valve 1463 is opened to vaporize. Alternatively, the atomized organometallic material is introduced into the chamber together with the carrier gas.
As described above, when the vaporized or atomized organometallic material is supplied into the chamber 1411 in a state where the substrate holder 1412 is heated in the above-described step [ii], the organometallic material is heated on the driving member 22. Thus, the bonding film 52 can be formed on the driving member 22 in a state where a part of the organic substance contained in the organometallic material remains.

That is, according to the MOCVD method, if a film containing metal atoms is formed so that a part of the organic substance contained in the organometallic material remains, a part of the organic substance exhibits a function as the leaving group 303. A film 52 can be formed on the drive member 22.
The organometallic material used in such MOCVD method is not particularly limited. For example, 2,4-pentadionate-copper (II), tris (8-quinolinolato) aluminum (Alq ₃ ), tris (4 - methyl-8-quinolinolato) aluminum (III) (Almq _3), (8- hydroxyquinoline) zinc _(Znq 2), copper phthalocyanine, Cu (hexafluoroacetylacetonate) (vinyltrimethylsilane) [Cu (hfac) (VTMS )], Cu (hexafluoroacetylacetonate) (2-methyl-1-hexen-3-ene) [Cu (hfac) (MHY)], Cu (perfluoroacetylacetonate) (vinyltrimethylsilane) [Cu ( pfac) (VTMS)], Cu (perfluoroacetylacetonate) 2-methyl-1-hexen-3-ene) [Cu (pfac) (MHY)] and other amides, acetylacetonates, alkoxys, silicon-containing silyls, and carboxyl groups containing various transition metal elements. Examples include carbonyl-based metal complexes, alkyl metals such as trimethylgallium, trimethylaluminum, and diethylzinc, and derivatives thereof. Among these, the organometallic material is preferably a metal complex. By using the metal complex, the bonding film 52 can be reliably formed in a state where a part of the organic substance contained in the metal complex remains.

Further, in this embodiment, the gas supply means 1470 is operated so that the inside of the chamber 1411 is in a low reducing atmosphere. By setting such an atmosphere, pure metal is formed on the driving member 22. Without forming a film, it is possible to form a film in a state where a part of the organic substance contained in the organometallic material remains. That is, the bonding film 52 having excellent characteristics as both the bonding film and the metal film can be formed.
The flow rate of the vaporized or atomized organometallic material is preferably about 0.1 to 100 ccm, and more preferably about 0.5 to 60 ccm. Thus, the bonding film 52 can be formed with a uniform film thickness and with a part of the organic substance contained in the organometallic material remaining.

As described above, when the bonding film 52 is formed, the residue remaining in the film is used as the leaving group 303, so that it is not necessary to introduce the leaving group into the formed metal film or the like. The bonding film 52 can be formed by a relatively simple process.
Note that part of the organic substance remaining in the bonding film 52 formed using an organometallic material may function as the leaving group 303, or part of the organic substance may be the leaving group 303. It may function as.
As described above, the bonding film 52 can be formed.

In the optical device 1 according to the fourth embodiment as described above, the same operations and effects as those of the first embodiment and the third embodiment described above can be obtained.
The optical devices 1 and 1A as described above can be suitably applied to an optical scanner provided in an image forming apparatus such as a laser printer, a barcode reader, a scanning confocal laser microscope, or an imaging display.

Here, based on FIG. 18, a case where the optical device 1 is used as an optical scanner of an imaging display will be described as an example of an image forming apparatus.
FIG. 18 is a schematic view showing an example of an image forming apparatus (imaging display) of the present invention.
As shown in FIG. 18, the image forming apparatus 10 includes an optical device 1 that is an optical scanner, and a light irradiation device 9 that irradiates the optical device 1 with light. Thus, an image is formed (drawn) on the screen S by performing main scanning and sub-scanning.
The screen S may be provided in the main body of the image forming apparatus 10 or may be a separate body. Further, the surface of the screen S (viewing side surface) may be irradiated with light from the light irradiation device 9 and displayed, or the back side of the screen S (surface opposite to the viewing side surface) may be displayed. The light from 9 may be irradiated and transmitted through the surface for display.

The light irradiation device 9 includes light sources 91, 92, and 93 of three colors R (red), G (green), and B (blue), three cross dichroic prisms (X prisms) 94, and a lens 96. Yes.
The light source 91 emits red light. The light source 92 emits green light. The light source 93 emits blue light. These light sources 91, 92 and 93 are connected to the control unit 8 and operate based on signals from the control unit 8. Here, the control unit 8 receives image information (image signal) from a host computer (not shown), and activates the light sources 91, 92, and 93 in accordance with the image information. The control unit 8 controls driving of the power supply circuit 7 based on behavior information of the optical device 1 (movable plate 25) detected by a detection unit (not shown).

  In such an image forming apparatus 10, light of each color is irradiated from the light sources 91, 92, 93 to the optical device 1 (light reflection unit 251) via the cross dichroic prism 94 and the lens 96. At this time, the red light from the light source 91, the green light from the light source 92, and the blue light from the light source 93 are combined by the cross dichroic prism 94. Further, the intensity of light output from the light sources 91, 92, 93 of each color changes according to image information received from a host computer (not shown).

Then, the light reflected by the light reflecting portion 251 (three colors of combined light) is irradiated onto the screen S.
At that time, the light reflected by the light reflecting portion 251 is scanned in the horizontal direction of the screen S (main scanning) by the rotation of the movable plate 25 of the optical device 1 around the second axis Y. On the other hand, the light reflected by the light reflecting portion 251 is scanned (sub-scanned) in the vertical direction of the screen S by the rotation of the movable plate 25 of the optical device 1 around the first axis X.
In this way, the image forming apparatus 10 performs image formation (drawing) on the screen S. In such an image forming apparatus 10, by providing only one optical device 1, two-dimensional scanning, that is, main scanning (horizontal scanning) and sub-scanning (vertical scanning) can be performed. Can be achieved.

Although the optical device and the image forming apparatus of the present invention have been described based on the illustrated embodiment, the present invention is not limited to this.
For example, in the optical device of the present invention, the configuration of each part can be replaced with an arbitrary configuration that exhibits the same function, and an arbitrary configuration can be added.
Further, in the present invention, the structure (for example, the base body 2) including the driving member, the pair of first shaft members, the movable plate, and the pair of second shaft members is near the end of each second shaft member. Is divided into a first member provided on the drive member side and a second member provided on the movable plate side, and the first member is different from the constituent material of the second member, In addition, the material is not limited to the above-described embodiment as long as it is made of a material having a specific gravity larger than that of the constituent material of the movable plate and is joined to the second member via the joining film at the boundary.

For example, the drive member 22 and the pair of first shaft members 23 and 24 may be integrally formed (the same material) without using a bonding film.
Further, for example, the support member 211 and the first shaft member 23 may be integrally formed without using a bonding film. Similarly, the support member 212 and the first shaft member 24 may be integrally formed without using a bonding film.

In the above-described embodiment, the first shaft members 23 and 24 are joined to the drive member 22 and the support portion 21 at the side surfaces, but the first shaft members 23 and 24 are joined to the drive member 22 at the end surfaces. Or may be joined to the support portion 21.
Further, the number, shape, size, arrangement, and the like of each first shaft member 23 and each second shaft member are not limited to those of the above-described embodiment. For example, in the above-described embodiment, each cross-sectional shape of each first shaft member 23 and each second shaft member forms a quadrangle, but each first shaft member 23 and each second shaft. The cross-sectional shape of each member may be circular, elliptical, triangular, pentagonal or the like. Further, the ratio of the thickness and width of each cross section of each first shaft member 23 and each second shaft member is also arbitrary.

In the above-described embodiments, the optical device adopting the moving coil method has been described. However, the driving method of the optical device of the present invention may be a moving magnet method or a piezoelectric drive method, An electrostatic drive method may be used.
In the above-described embodiment, the first driving unit that rotates the driving member 22 around the first axis X also serves as the second driving unit that rotates the movable plate 25 around the second axis Y. Although the configuration has been described, the first driving means and the second driving means may be provided separately (independently). In that case, the driving method of the first driving means and the driving method of the second driving means may be the same or different.

It is a perspective view which shows 1st Embodiment of the optical device of this invention. It is a top view of the optical device shown in FIG. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is a block diagram which shows the structure of the control system of the optical device shown in FIG. It is a figure which shows an example of the voltage generated in the 1st voltage generation part shown in FIG. 5, and a 2nd voltage generation part. It is the elements on larger scale which show the state before energy provision of the joining film with which the optical device shown in FIG. 1 was provided. It is the elements on larger scale which show the state after the energy provision of the joining film with which the optical device shown in FIG. 1 was provided. It is a figure for demonstrating the manufacturing method of the optical device shown in FIG. It is a longitudinal cross-sectional view which shows typically the plasma polymerization apparatus used for preparation of the joining film | membrane shown in FIG.9 (b). It is a perspective view which shows 2nd Embodiment of the optical device of this invention. It is a top view of the optical device shown in FIG. It is the elements on larger scale which show the state before the energy provision of the bonding film in 3rd Embodiment of this invention. It is the elements on larger scale which show the state after the energy provision of the bonding film in 3rd Embodiment of this invention. It is a longitudinal cross-sectional view which shows typically the film-forming apparatus used for preparation of the joining film | membrane concerning this embodiment. It is a schematic diagram which shows the structure of the ion source with which the film-forming apparatus shown in FIG. 15 is provided. It is a longitudinal cross-sectional view which shows typically the film-forming apparatus used for preparation of the joining film concerning 4th Embodiment of this invention. It is the schematic which shows an example of the image forming apparatus (imaging display) of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 1A ... Optical device (optical scanner) 2 ... Base | substrate 21 ... Support part 211, 212 ... Support member 213, 214 ... Terminal 22 ... Driving member 221 ... Coil 222, 223 ... End part 23 , 24 …… first shaft member 25 …… movable plate 251 …… light reflecting portion 26, 27 …… second shaft member 3 …… support 31… substrate 32 …… spacer 41, 42 …… magnet 51 , 52, 53, 54, 55, 55 A, 56, 56 A, 57... Bonding film 521... Surface 7 .. Power supply circuit 71... First voltage generating unit 72. Voltage superposition unit 8 …… Control unit 9 …… Light irradiation device 91, 92, 93 …… Light source 94 …… Cross dichroic prism 96 …… Lens S …… Screen 10 …… Image forming device X …… First axis Y ...... No. Axis 301 ... Si skeleton 302 ... siloxane bond 303 ... leaving group 304 ... active hand 1100 ... plasma polymerization apparatus 1101 ... chamber 1102 ... ground wire 1103 ... supply port 1104 ... exhaust port 1130 ... ... 1st electrode 1139 ... Electrostatic chuck 1140 ... 2nd electrode 1170 ... Pump 1171 ... Pressure control mechanism 1180 ... Power supply circuit 1182 ... High frequency power supply 1183 ... Matching box 1184 ... Wiring 1190 ... Gas supply unit 1191 ... Liquid storage unit 1192 ... Vaporizer 1193 ... Gas cylinder 1194 ... Pipe 1195 ... Diffusion plate 1200 ... Deposition device 1211 ... Chamber 1212 ... Substrate holder 1215 ... Ion source 1216 ... Target 1217 ... Target Holder 1219 ... gas supply source 1220 ... first shutter 1221 ... second shutter 1230 ... exhaust means 1231 ... exhaust line 1232 ... pump 1233 ... valve 1250 ... opening 1253 ... grid 1254 ... ... Grid 1255 ... Magnet 1256 ... Ion generation chamber 1257 ... Filament 1260 ... Gas supply means 1261 ... Gas supply line 1262 ... Pump 1263 ... Valve 1264 ... Gas cylinder 1400 ... Deposition apparatus 1411 ... Chamber 1412 …… Substrate holder 1421 …… Shutter 1430 …… Exhaust means 1431 …… Exhaust line 1432 …… Pump 1433 …… Valve 1460 …… Organic metal material supply means 1461 …… Gas supply line 1462 ... storage tank 1463 ...... valve 1464 ...... pump 1465 ...... gas cylinder 1470 ...... gas supply means 1471 ...... gas supply line 1473 ...... valve 1474 ...... pump 1475 ...... gas cylinder

Claims (28)

A frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, and a light reflecting portion that is provided inside the drive member and has light reflectivity And a pair of second shaft members that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the drive member; ,
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a Si skeleton including a siloxane (Si-O) bond and a random atomic structure, and a leaving group bonded to the Si skeleton,
In the bonding film, energy is applied to at least a part of the region, whereby the leaving group existing near the surface of the bonding film is detached from the Si skeleton and is expressed in the region on the surface of the bonding film. The optical device is characterized in that the first member and the second member are bonded together by the adhesiveness.   2. The optical device according to claim 1, wherein a sum of a content ratio of Si atoms and a content ratio of O atoms among atoms obtained by removing H atoms from all atoms constituting the bonding film is 10 to 90 atomic%.   The optical device according to claim 1, wherein the abundance ratio of Si atoms and O atoms in the bonding film is 3: 7 to 7: 3.   The optical device according to any one of claims 1 to 3, wherein the crystallinity of the Si skeleton is 45% or less.   The leaving group includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or an atomic group arranged so that each of these atoms is bonded to the Si skeleton. The optical device according to any one of claims 1 to 4, wherein the optical device comprises at least one selected from the group consisting of:   The optical device according to claim 5, wherein the leaving group is an alkyl group.   The optical device according to claim 1, wherein the bonding film is formed by a plasma polymerization method.   The optical device according to claim 7, wherein the bonding film is made of polyorganosiloxane as a main material.   The optical device according to claim 8, wherein the polyorganosiloxane is mainly composed of a polymer of octamethyltrisiloxane.   The optical device according to claim 1, wherein an average thickness of the bonding film is 1-1000 nm.   The optical device according to claim 1, wherein the bonding film is a solid that does not have fluidity.   The optical device according to claim 1, wherein a surface of the first member that is in contact with the bonding film is previously subjected to a surface treatment that improves adhesion with the bonding film.   The optical device according to claim 1, wherein a surface of the second member that is in contact with the bonding film is previously subjected to a surface treatment that improves adhesion with the bonding film.   The optical device according to claim 12 or 13, wherein the surface treatment is a plasma treatment.   The optical device according to claim 1, further comprising an intermediate layer between the first member and the bonding film.   The optical device according to claim 1, further comprising an intermediate layer between the second member and the bonding film.   The optical device according to claim 15 or 16, wherein the intermediate layer is composed mainly of an oxide-based material.   The energy is applied by at least one of a method of irradiating the bonding film with energy rays, a method of heating the bonding film, and a method of applying a compressive force to the bonding film. 18. An optical device according to any one of items 17 to 17.   The optical device according to claim 18, wherein the energy beam is an ultraviolet ray having a wavelength of 150 to 300 nm.   The optical device according to claim 18 or 19, wherein the heating temperature is 25 to 100C.   21. The optical device according to claim 18, wherein the compressive force is 0.2 to 10 MPa. A frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, and a light reflecting portion that is provided inside the drive member and has light reflectivity And a pair of second shaft members that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the drive member; ,
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom,
The bonding film imparts energy to at least a part of the bonding film, so that the leaving group existing near the surface of the bonding film is released from at least one of the metal atom and the oxygen atom, and the bonding film An optical device characterized in that the first member and the second member are bonded together by adhesiveness developed in the region on the surface of the optical device. A frame-shaped drive member, a pair of first shaft members that rotatably support the drive member around a first axis, and a light reflecting portion that is provided inside the drive member and has light reflectivity And a pair of second shaft members that rotatably support the movable plate about a second axis perpendicular to the first axis with respect to the drive member; ,
First driving means for rotating the movable plate about the first axis by rotating the driving member about the first axis along with torsional deformation of each first shaft member; ,
Second driving means for rotating the movable plate around the second axis along with torsional deformation of each second shaft member;
The structure is divided into a first member provided on the drive member side and a second member provided on the movable plate side, with the vicinity of the end of each second shaft member as a boundary portion. The first member is made of a material different from the constituent material of the second member and has a specific gravity larger than that of the constituent material of the movable plate, and the second member is formed at the boundary portion. Is bonded via a bonding film,
The bonding film includes a metal atom and a leaving group composed of an organic component,
In the bonding film, energy is applied to at least a part of the bonding film, whereby the leaving group existing near the surface of the bonding film is released from the bonding film and is expressed in the region on the surface of the bonding film. The optical device is characterized in that the first member and the second member are bonded together by the adhesiveness.   The optical device according to any one of claims 1 to 23, wherein the first member is made of metal as a main material.   The optical device according to any one of claims 1 to 24, wherein the second member is made of silicon as a main material.   The boundary portion is disposed in the vicinity of an end portion of the second shaft member on the movable plate side, and the pair of second shaft members and the driving member are integrally formed, The optical device according to claim 1, constituting the first member.   The boundary portion is disposed in the vicinity of the end of the second shaft member on the drive member side, and the pair of second shaft members and the movable plate are integrally formed, The optical device according to claim 1, constituting a second member.   An image forming apparatus comprising the optical device according to claim 1, wherein the image forming apparatus is configured to form an image by scanning the light reflected by the light reflecting portion.

Images