JP2009132041A - Screen printing mask, substrate, and printing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a screen printing mask by which a squeeze is hardly damaged when printing resist using the squeeze, a substrate, and a printing method. <P>SOLUTION: In the printing mask 19 used when printing the resist, the printing mask 19 has an opening portion 29 for allowing the resist formed in a printed pattern pass through and a blocking portions 28 for not allowing the resist pass through in one sheet, a plurality of holes are arranged in the opening portion 29. In the opening portion 29, a second opening portion 29b closer to the blocking portions 28 is constituted such that the opening ration is smaller comparing to a first opening portion 29a spaced apart from the blocking portions 28. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a screen printing mask, a substrate, and a printing method, and more particularly to a printing mask in which a squeegee is hardly damaged.

  Screen printing is widely used when applying a resist to a substrate. For example, Patent Document 1 discloses a printing method. According to this, the printing mask on which the printing pattern is formed is overlapped with the substrate, and the ink is applied to the printing mask. Next, when the squeegee is slid on the printing mask, the ink is press-fitted and adhered to the substrate. At this time, the print pattern is transferred to the substrate.

  An example of a commonly used printing mask is disclosed in Patent Document 2. According to this, a polyvinyl photosensitive emulsion is applied to a mesh woven with plain stainless steel wires. Next, after exposure to the shape of the print pattern, development is performed to form a print mask.

JP 2006-69064 A Japanese Patent Laid-Open No. 6-219071

  When printing, since the squeegee is slid while being pressed against the printing mask, a material having elasticity is used for the squeegee. When the squeegee is slid on the mesh, the squeegee is rubbed while expanding and contracting due to the unevenness of the mesh, and thus is easily damaged. Then, a part of the damaged squeegee is broken and separated into pieces. The debris may pass through the mesh and adhere to the substrate along with the resist. Then, the squeegee fragments that entered the resist were judged as foreign matter adhesion in the appearance inspection process, as with other foreign matters, and caused the appearance failure of the substrate.

  Further, in the process of drying after uniformly applying the ink, the ink is dried around the ink. Then, since the ink is dried while flowing around, the surrounding film thickness becomes thicker than the center, and the film thickness may become non-uniform.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The screen printing mask according to this application example includes, in one sheet, an opening that is formed in a printed shape and allows a liquid to pass therethrough, and a shielding part that does not allow the liquid to pass through. The holes are arranged.

  According to this screen printing mask, the screen printing mask has an opening and a shielding part formed in the sheet. A plurality of holes are formed in the opening, and the liquid passes through the holes. Since this hole is formed in one sheet, the surface on the sheet has less unevenness. Therefore, when the liquid material is pushed into the hole using the squeegee, damage to the squeegee can be reduced.

[Application Example 2]
In the screen printing mask according to the application example described above, in the opening portion, at least a part of the opening ratio at a location close to the shielding portion is formed smaller than an opening ratio at a location away from the shielding portion. Features.

Here, the aperture ratio indicates a value obtained by dividing the area occupied by the holes by the area occupied by the openings.
According to this screen printing mask, since the opening portion has a smaller opening ratio near the shielding portion than the portion away from the shielding portion, the liquid material is applied thicker toward the place away from the shielding portion. . And when a liquid body dries, the place near a shielding part dries earlier than the place away from the shielding part. At this time, the liquid is dried while flowing to a place close to the shielding part. Since the place away from the shielding part is applied in a larger amount than the place near the shielding part, it can be made substantially the same thickness in the place away from the shielding part and the place near the shielding part after drying. .

[Application Example 3]
In the screen printing mask according to the application example, the hole is chamfered.

  According to this screen printing mask, since the hole is chamfered, it is difficult for the squeegee to be caught in the hole when the squeegee passes through the hole. Therefore, the squeegee can be hardly damaged.

[Application Example 4]
In the printing method according to this application example, the screen printing mask described above is overlaid on a substrate, the liquid material is applied onto the screen printing mask, and the liquid material is extruded from the hole using a squeegee, Printing on the substrate.

  According to this printing method, since the squeegee is hardly damaged, squeegee fragments are hardly generated. Therefore, squeegee fragments are less likely to mix with the applied liquid. As a result, the liquid material can be applied with high quality.

[Application Example 5]
The substrate according to this application example is characterized in that a resist is applied on a substrate on which wiring is formed, using the printing method described above.

  According to this substrate, squeegee fragments are rarely mixed with the applied resist. As a result, the substrate can be a substrate coated with a liquid material with high quality.

Hereinafter, embodiments will be described with reference to the drawings.
In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.
(Embodiment)
In the present embodiment, a characteristic example of a screen printing apparatus, a printing mask used in the screen printing apparatus, and a printing method will be described with reference to FIGS.

  FIG. 1 is a plan view of a flexible printed circuit board. As shown in FIG. 1, a flexible printed circuit board 1 as a substrate includes a base film 2. The base film 2 is made of a polyimide sheet or the like and is formed in a rectangular shape. The longitudinal direction of the base film 2 is defined as the Y direction, and the direction orthogonal to the Y direction is defined as the X direction. On the base film 2, four rows of electrodes 4 as wirings arranged in a row with four semiconductors 3 are arranged. The semiconductor 3 and the semiconductor 3 and the semiconductor 3 and the electrode 4 are electrically connected by a wiring 5.

  And the resist 6 is apply | coated to places other than the place where the semiconductor 3 and the electrode 4 are arrange | positioned on the base film 2. FIG. The resist 6 prevents the wiring 5 from being disconnected when the semiconductor 3 is mounted, and prevents the wiring 5 from being short-circuited due to the adhesion of solder when the element component is soldered. Further, the resist 6 prevents the insulation between the wiring 5 and the wiring 5 from becoming dirty and lowering the insulation resistance.

  Next, a screen printing apparatus used when applying the resist 6 will be described. FIG. 2 is a schematic perspective view showing the configuration of the screen printing apparatus. As shown in FIG. 2, the screen printing apparatus 7 includes a base 8 formed in a rectangular parallelepiped shape. One direction on the plane of the base 8 is defined as a Y direction, and a direction orthogonal to the Y direction on the same plane is defined as an X direction. A direction orthogonal to the X direction and the Y direction is taken as a Z direction.

  On the upper surface 8a of the base 8, a pair of first guide rails 9 extending in the Y direction are provided so as to protrude in the Y direction. A first moving table 10 provided with a linear motion mechanism (not shown) corresponding to the pair of first guide rails 9 is attached to the upper side of the base 8. The linear movement mechanism of the first moving table 10 is, for example, a screw type linear movement mechanism including a screw shaft (drive shaft) extending in the Y direction along the first guide rail 9 and a ball nut screwed to the screw shaft. The drive shaft is connected to a Y-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in steps. Then, the Y-axis motor rotates forward or backward, and the first moving table 10 moves forward or backward along the Y-axis direction.

  A first lifting device 11 is disposed on the first moving table 10, and a mounting table 12 is disposed on the first lifting device 11. A hydraulic cylinder is disposed inside the first lifting device 11 and moves the mounting table 12 up and down by a predetermined distance. A mounting surface 13 is formed on the upper surface of the mounting table 12, and a suction-type substrate chuck mechanism (not shown) is provided on the mounting surface 13. When the substrate 14 is placed on the placement surface 13, the substrate 14 is positioned and fixed at a predetermined position on the placement surface 13 by the substrate chuck mechanism.

  A support base 15 formed in a rectangular parallelepiped shape is disposed at one end of the base 8 in the Y direction. A pair of second guide rails 16 extending in the Z direction are provided in a projecting manner at the approximate center of the opposite side surface 15 a in the Y direction of the support base 15. A second moving table 17 having a linear motion mechanism (not shown) corresponding to the second guide rail 16 is disposed on the opposite side to the Y direction of the second guide rail 16. This linear motion mechanism is, for example, a linear motion mechanism similar to the linear motion mechanism included in the first moving table 10.

  A mask support frame 18 formed in a rectangular frame shape is disposed on the opposite side of the second moving table 17 in the Y direction, and a print mask 19 serving as a screen print mask is disposed inside the mask support frame 18. Is arranged. The printing mask 19 is disposed substantially in parallel with the placement surface 13. The operator can adjust the distance between the print mask 19 and the substrate 14 by moving the print mask 19 in the Z direction.

  On the side surface 15 a of the support base 15, a third guide rail 20 extending in the X direction is protruded at a location in the Z direction. A third moving table 21 having a linear motion mechanism (not shown) corresponding to the third guide rail 20 is attached to the opposite side of the support base 15 in the Y direction. This linear motion mechanism is, for example, a linear motion mechanism similar to the linear motion mechanism included in the first moving table 10.

  A second lifting device 22 is disposed on the opposite side of the third moving table 21 in the Y direction. The second lifting device 22 includes an air cylinder inside. And the squeegee 23 is arrange | positioned under the 2nd raising / lowering apparatus 22, The 2nd raising / lowering apparatus 22 can raise / lower this squeegee 23. FIG.

  A third lifting device 24 is arranged alongside the second lifting device 22 on the opposite side of the third moving table 21 in the Y direction. The third lifting device 24 includes an air cylinder inside. A scraper 25 is disposed below the third lifting device 24, and the third lifting device 24 can lift and lower the scraper 25.

  3 and 4 are diagrams showing a printing mask. FIG. 3A is a schematic plan view of the printing mask, and FIG. 3B is a schematic sectional view of the printing mask. FIG. 3B is a cross-sectional view taken along the line A-A ′ of FIG. FIG. 4A is a schematic plan view of a main part of the print mask, and FIG. 4B is a schematic cross-sectional view of a hole of the print mask. As shown in FIGS. 3A and 3B, a printing mask 19 is disposed inside the mask support frame 18. When tension is applied to the printing mask 19, the printing mask 19 is supported by the mask support frame 18 so that it does not bend more than necessary. The printing mask 19 may be a material that is corrosion resistant to the ink such as a resist to be applied, has strength against tension, and has low stretchability, and a resin or metal sheet reinforced with fibers or the like can be used. In the present embodiment, for example, a stainless sheet is used as the material of the printing mask 19.

  The printing mask 19 includes a shielding portion 28 that does not transmit the resist 6 applied to the substrate 14 and an opening 29 that transmits the resist 6. And the opening part 29 consists of the 1st opening part 29a and the 2nd opening part 29b, and the 1st opening part 29a is formed more largely than the 2nd opening part 29b. In the opening 29, a second opening 29 b is disposed at a location near the shielding portion 28, and a first opening 29 a is disposed at a location away from the shielding portion 28.

  As shown in FIG. 4A, a plurality of first holes 30 as holes are arranged in the first opening 29a, and a second hole 31 as a hole is formed in the second opening 29b. The number of the first holes 30 and the second holes 31 arranged per unit area is the same. The diameter of the first hole 30 is larger than the diameter of the second hole 31. Accordingly, the opening ratio of the first opening 29a is larger than that of the second opening 29b.

  As shown in FIG. 4B, the printing mask 19 has a first hole 30 and a second hole 31 formed in the sheet 19a. A surface of the printing mask 19 on which the squeegee 23 is disposed is referred to as a squeegee surface 19b. A chamfer 30a is formed on the squeegee surface 19b side of the first hole 30, and a chamfer 31a is formed on the squeegee surface 19b side of the second hole 31. When the squeegee 23 slides on the squeegee surface 19 b, the squeegee 23 slides on the chamfer 30 a and the chamfer 31 a, so that the squeegee 23 is not easily caught in the first hole 30 and the second hole 31.

  Next, a printing method for printing the resist 6 on the substrate 14 using the above-described screen printing apparatus 7 will be described with reference to FIGS. FIG. 5 is a flowchart showing a manufacturing process for printing a resist on a substrate. 6 and 7 are diagrams for explaining a printing method using a screen printing apparatus.

  Step S1 corresponds to a substrate installation step, and is a step of arranging a substrate on the printing apparatus. Next, the process proceeds to step S2. Step S2 corresponds to a mask placement process, which is a process of placing the substrate and the print mask in an overlapping manner. Next, the process proceeds to step S3. Step S3 corresponds to a transfer process, and is a process of transferring the resist to the substrate. Next, the process proceeds to step S4. Step S4 corresponds to a substrate removing process, and is a process of removing the substrate from the printing apparatus. Next, the process proceeds to step S5. Step S5 corresponds to a solidification step, and is a step of drying and solidifying the printed resist. This completes the manufacturing process of printing the resist on the substrate.

  Next, a printing method for printing the resist 6 on the substrate 14 in correspondence with the steps shown in FIG. 5 will be described in detail with reference to FIGS. FIG. 6A is a diagram corresponding to step S1. As shown in FIG. 6A, the substrate 14 is positioned and placed on the placement surface 13. Then, the substrate 14 is fixed to the placement surface 13 by a suction-type substrate chuck mechanism provided on the placement surface 13.

  FIG. 6B is a diagram corresponding to step S2. The first moving table 10 is moved, and the substrate 14 is moved to a location facing the printing mask 19. Then, as shown in FIG. 6B, the mounting table 12 is raised by the first elevating device 11, and the substrate 14 is moved to a place close to the printing mask 19. At this time, the vertical position of the printing mask 19 is adjusted in advance by moving the second moving table 17 up and down. A lump of resist material 32 as a liquid material is disposed on the squeegee surface 19b where the squeegee 23 is disposed in the printing mask 19.

  FIG. 6C to FIG. 6E are diagrams corresponding to step S3. As shown in FIG. 6C, the scraper 25 is lowered by driving the third lifting device 24. Then, the third elevating device 24 moves the scraper 25 by moving the third moving table 21 while providing the scraper 25 with a predetermined distance from the print mask 19. Then, the scraper 25 is moved from one end of the substrate 14 to the other end. At this time, a part of the resist material 32 is applied onto the print mask 19. Next, as shown in FIG. 6D, the squeegee 23 is lowered by driving the second lifting device 22. Then, while the second lifting device 22 presses the squeegee 23 against the print mask 19, the third moving table 21 moves, thereby causing the squeegee 23 to slide on the print mask 19. At this time, a part of the resist material 32 passes through the printing mask 19 and is transferred to the substrate 14. Then, as shown in FIG. 6E, the squeegee 23 is slid from one end of the substrate 14 to the other end. Then, the resist material 32 is brought to one side on the print mask 19.

  FIG. 6F is a diagram corresponding to step S4. By driving the first elevating device 11, the substrate 14 and the mounting table 12 are lowered, and then the first moving table 10 is driven to move the substrate 14 from a location facing the printing mask 19. Then, the substrate 14 is removed from the placement surface 13 as shown in FIG.

  Fig.7 (a)-FIG.7 (d) are figures corresponding to step S5. As shown in FIG. 7A, immediately after being transferred to the substrate 14, the resist material 32 is formed in a cylindrical shape that is the same shape as the first hole 30 and the second hole 31 of the printing mask 19. At this time, a larger amount of resist material 32 is applied at a location corresponding to the first opening 29a than at a location corresponding to the second opening 29b. As shown in FIG. 7B, after being transferred to the substrate 14, after a while, the shape of the columnar resist material 32 collapses and the columns of the adjacent resist material 32 become flat. At this time, in the place corresponding to the first opening 29a, the resist material 32 is applied thicker than the place corresponding to the second opening 29b.

  The substrate 14 coated with the resist material 32 is placed in a thermostatic bath to accelerate drying. The temperature of the constant temperature bath may be a temperature at which the solvent of the resist material 32 evaporates and the substrate 14 is not damaged by oxidation or heat. In this embodiment, for example, 70 degrees Celsius is adopted. As shown in FIG. 7C, the vapor partial pressure of the resist peripheral portion 32a is smaller on the substrate 14 than on the location corresponding to the first opening 29a. Therefore, the drying speed of the resist peripheral portion 32a is higher than that of the location corresponding to the first opening 29a. Since the resist peripheral portion 32a has a high viscosity, it hardly flows. On the other hand, since it is difficult to dry at the place corresponding to the second opening 29b, the resist material 32 flows to the place corresponding to the second opening 29b. Then, as shown in FIG. 7D, the resist 6 is formed by solidifying the resist material 32 in a state corresponding to the first opening 29a and the second opening 29b so that the resist material 32 has substantially the same thickness. Is done.

  Next, a mask manufacturing method for manufacturing the above-described printing mask 19 will be described with reference to FIGS. FIG. 8 is a schematic perspective view showing a press working apparatus for punching a mask. FIG. 9 is a diagram illustrating a hole forming method, and FIG. 10 is a diagram illustrating a chamfer forming method.

  First, a press working apparatus that forms a plurality of first holes 30 in the sheet 19a will be described. As shown in FIG. 8, the press machine 35 includes a base 36 formed in a rectangular parallelepiped shape. One direction on the plane of the base 36 is defined as a Y direction, and a direction orthogonal to the Y direction on the same plane is defined as an X direction. A direction orthogonal to the X direction and the Y direction is taken as a Z direction. A rectangular parallelepiped lower mold base 37 is disposed in the center of the base 36 opposite to the Y direction, and a lower mold 38 is disposed on the lower mold base 37.

  An XY table 39 is disposed on the base 36 on the X direction side of the lower mold base 37, and the XY table 39 includes a linear motion mechanism (not shown) similar to the first moving table 10 shown in FIG. A mask support unit 40 is disposed on the XY table 39. The mask support portion 40 is formed so as to extend to a place facing the lower mold 38, and holds a sheet 19 a that is a material of the printing mask 19 at a place facing the lower mold 38.

  A mold driving unit 41 is disposed on the Y direction side on the base 36. The mold drive unit 41 includes a motor, a rotary inertia body, a clutch mechanism, a power transmission shaft, and the like. The motor rotates the rotary inertia body, and the torque of the rotary inertia body is transmitted to the power transmission shaft via the clutch mechanism. And the power conversion part 42 is arrange | positioned on the reverse side of the Y direction in the upper part of the metal mold | die drive part 41. FIG. The power conversion unit 42 includes a slider crank mechanism including a crank, a connecting rod, a piston 43, and the like. Then, the crank rotates in conjunction with the power transmission shaft, and the connecting rod moves in conjunction with the crank to move the piston 43 up and down in the Z direction. That is, the rotational movement of the motor is converted into a vertical linear movement.

  A mold support portion 44 is disposed on the side opposite to the Z direction of the power conversion portion 42. And the upper metal mold | die 45 is arrange | positioned from the inside of the metal mold | die support part 44 toward the reverse direction of a Z direction. The upper mold 45 is connected to the piston 43 and moves up and down in conjunction with the piston 43. The upper mold 45 is formed in a substantially cylindrical shape, and a punch 46 for drilling is disposed at the center of the upper mold 45. The punch 46 is formed in a cylindrical shape, and the planar shape of the punch 46 is the shape of the first hole 30 shown in FIG. A restraining ring 47 is disposed around the punch 46. A coil spring is disposed above the restraining ring 47, and the restraining ring 47 is biased downward.

  When the upper mold 45 moves up and down and approaches the lower mold 38, the punch 46 enters the hole formed in the lower mold 38. At this time, the printing mask 19 sandwiched between the punch 46 and the lower die 38 is formed with a hole in the shape of the punch 46. Since the sheet 19a is supported by the XY table 39 via the mask support portion 40, by controlling the XY table 39, it is possible to form a hole at a desired position of the sheet 19a.

  Next, the drilling process for forming the first holes 30 in the print mask 19 will be described. As shown in FIG. 9A, a punch 46 is formed at the center of the upper mold 45, and a hole 48 is formed in the lower mold 38 at a location facing the punch 46. Then, the sheet 19 a disposed on the mask support unit 40 is disposed on the lower mold 38. Next, the XY table 39 is driven so that the place where the first hole 30 is opened is the place facing the hole 48.

  Next, as shown in FIG. 9B, the upper mold 45 is lowered. Then, the holding ring 47 comes into contact with the sheet 19a, and the holding ring 47 biases the sheet 19a. Subsequently, as shown in FIG. 9C, the upper mold 45 is further lowered. Then, the sheet 19 a is sheared by the punch 46 and the lower mold 38. Next, as shown in FIG. 9D, the upper mold 45 is raised. And the 1st hole 30 is formed in the sheet | seat 19a. When the second hole 31 is formed in the sheet 19 a, the diameter of the punch 46 and the diameter of the hole portion 48 are formed to be the same as the diameter of the second hole 31. And the 2nd hole 31 is formed by manufacturing in the same procedure.

  Next, the chamfering process for forming the chamfer 30a in the first hole 30 of the printing mask 19 will be described. As shown in FIG. 10A, a chamfering punch 50 is disposed at the center of the upper mold 49, and a hole 48 is formed in the lower mold 38 at a location facing the chamfering punch 50. Then, the sheet 19 a disposed on the mask support unit 40 is disposed on the lower mold 38. Next, the XY table 39 is driven so that the place where the first hole 30 is opened is the place facing the hole 48.

  Next, as shown in FIG. 10B, the upper mold 49 is lowered. Then, the holding ring 47 comes into contact with the sheet 19a, and the holding ring 47 biases the sheet 19a. Subsequently, as shown in FIG. 10C, the upper mold 49 is further lowered. Then, the sheet 19 a is compressed by the chamfering punch 50 and the lower mold 38. Next, as shown in FIG. 9D, the upper mold 49 is raised. A chamfer 30a is formed in the first hole 30 of the sheet 19a. When the chamfer 31 a is formed in the second hole 31 of the printing mask 19, the diameter of the chamfer punch 50 is formed to be larger than the diameter of the chamfer 31 a of the second hole 31. A chamfer 31 a is formed in the second hole 31 by manufacturing in the same procedure.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the printing mask 19 has the opening 29 and the shielding part 28 formed therein. A plurality of first holes 30 and second holes 31 are formed in the opening 29, and the resist material 32 passes through the first holes 30 and the second holes 31. Since the first hole 30 and the second hole 31 are formed in the flat sheet 19a, the surface on the sheet 19a has less unevenness. Therefore, when the resist material 32 is pushed into the first hole 30 and the second hole 31 using the squeegee 23, damage to the squeegee 23 can be reduced.

  (2) According to the present embodiment, since the opening 29 has a smaller opening ratio of the second opening 29b than the first opening 29a, the resist material is directed to the first opening 29a from the second opening 29b. 32 is applied thickly. When the resist material 32 dries, the second opening 29b dries faster than the first opening 29a. At this time, since the resist material 32 is dried while flowing into the second opening 29b, the thickness of the resist 6 at the place facing the first opening 29a and the place facing the second opening 29b after drying. Can be made substantially the same thickness.

  (3) According to the present embodiment, the chamfer 30 a is formed in the first hole 30, and the chamfer 31 a is formed in the second hole 31. Therefore, when the squeegee 23 passes through the first hole 30 and the second hole 31, the squeegee 23 is not easily caught by the first hole 30 and the second hole 31. As a result, the squeegee 23 can be hardly damaged.

  (4) According to this embodiment, since the squeegee 23 is not easily damaged, fragments of the squeegee 23 are hardly generated. Therefore, fragments of the squeegee 23 are not mixed with the applied resist material 32. As a result, the resist material 32 can be applied with high quality.

  (5) According to the present embodiment, the squeegee 23 is not mixed with the applied resist 6. As a result, the flexible printed circuit board 1 can be the flexible printed circuit board 1 coated with the resist 6 with high quality.

In addition, this embodiment is not limited to embodiment mentioned above, A various change and improvement can also be added. A modification will be described below.
(Modification 1)
In the embodiment, the press machine 35 is used for processing the first hole 30 and the second hole 31, but the present invention is not limited to this, and other methods may be used. For example, a method of etching after applying a printed pattern resist on a sheet, a method of opening a hole by irradiating a laser beam, a method of opening a hole by spraying a high-pressure water stream, a method of opening a hole using a drill, etc. Among these possible methods, it is desirable to select a method for processing the first hole 30 and the second hole 31 with high productivity.

(Modification 2)
In the said embodiment, although the shape of the 1st hole 30 and the 2nd hole 31 was made circular, another shape may be sufficient. For example, an ellipse or a polygon such as a square or a triangle can be used. By changing the shape of the hole, the aperture ratio can be easily adjusted.

(Modification 3)
In the embodiment, the opening 29 has two levels of the first opening 29a and the second opening 29b. However, the opening 29 may be divided into places having an opening ratio of three levels or more. . The thickness of the resist material 32 to be applied can be gradually changed when the level of the aperture ratio is larger. And the thickness of the resist 6 after drying can be made more uniform.

(Modification 4)
In the embodiment, the chamfers 30a and 31a are formed using the chamfering punch 50, but other methods may be used. For example, the corners of the first hole 30 and the second hole 31 may be rounded by making the diameter of the hole 48 of the lower mold 38 larger than the diameter of the punch 46. Further, the chamfers 30a and 31a may be formed by rotating and contacting a cutting tool such as a drill. Among these methods, it is desirable to select a method for processing the chamfer 30a and the chamfer 31a with high productivity.

(Modification 5)
In the embodiment, the printing mask 19 is used by forming the first hole 30 and the second hole 31 in the sheet 19a. However, the printing mask 19 may be subjected to a liquid repellent treatment for the resist 6. Thereby, since the resistance when the squeegee 23 slides on the printing mask 19 is reduced, the squeegee 23 can be further prevented from being damaged. Since the flow resistance when the resist 6 flows through the first hole 30 and the second hole 31 is reduced, the resist 6 can be easily removed from the first hole 30 and the second hole 31. Furthermore, it is possible to prevent the resist 6 from adhering to the surface of the print mask 19 on the substrate 14 side.

(Modification 6)
In the said embodiment, although the flexible printed circuit board 1 was formed in the rectangle, the board | substrate currently formed in the elongate tape shape may be sufficient. When a plurality of circuits and elements are arranged and formed on a substrate, the flexible substrate can be easily handled by winding the flexible substrate around a reel and supplying the material.

(Modification 7)
In the embodiment, the semiconductor 3 is disposed on the flexible printed board 1 and electrically connected to the wiring 5. Various methods can be used for this connection method. For example, a mounting method such as soldering, TAB (Tape Automated Bonding), wire bonding, or flip chip can be used. In any case, the damage of the squeegee 23 can be reduced by printing the resist 6 on the flexible printed circuit board 1 using the above method.

(Modification 8)
In the embodiment, the resist 6 is applied to the flexible printed circuit board 1, but a substrate other than the flexible printed circuit board 1 may be used. For example, a rigid substrate such as an epoxy substrate containing glass fiber or a paper phenol substrate can also be used. Furthermore, a rigid flexible substrate in which a rigid substrate and a flexible substrate are integrated can also be used. Furthermore, the above-described method can be used when printing on a substrate made of various materials such as glass, silicon, and resin, and mixed materials thereof.

The top view of a flexible printed circuit board. The schematic perspective view which shows the structure of a screen printing apparatus. (A) is a schematic plan view of a printing mask, (b) is a schematic cross section of a printing mask. (A) is a principal part schematic plan view of a printing mask, (b) is a hole schematic sectional drawing of a printing mask. The flowchart which shows the manufacturing process which prints a resist on a board | substrate. The figure explaining the printing method using a screen printing apparatus. The figure explaining the printing method using a screen printing apparatus. The schematic perspective view which shows the press work apparatus which drills a hole in a mask. The figure explaining the formation method of a hole. The figure explaining the formation method of chamfering.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Flexible printed circuit board as a board | substrate, 4 ... Electrode as wiring, 6 ... Resist, 19 ... Print mask as a screen printing mask, 19a ... Sheet, 23 ... Squeegee, 28 ... Shielding part, 29 ... Opening part, 30 ... 1st hole as a hole, 30a, 31a ... chamfering, 31 ... 2nd hole as a hole, 32 ... resist material as a liquid.

Claims (5)

In one sheet, an opening that is formed in a printed shape and allows liquid to pass through,
A shielding part that does not allow the liquid to pass through,
A screen printing mask, wherein a plurality of holes are arranged in the opening. The screen printing mask according to claim 1,
The screen printing mask according to claim 1, wherein an opening ratio of at least a part of a location near the shielding portion is smaller than an opening ratio of the opening portion away from the shielding portion. The screen printing mask according to claim 1,
A screen printing mask, wherein the hole is chamfered. The screen printing mask according to any one of claims 1 to 3 is overlaid on a substrate,
Applying the liquid material on the screen printing mask;
Extrude the liquid from the hole using a squeegee,
A printing method comprising printing on the substrate.   A substrate, wherein a resist is applied on a substrate on which wiring is formed by using the printing method according to claim 4.

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