JP2009129487A5 - - Google Patents

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Publication number
JP2009129487A5
JP2009129487A5 JP2007301370A JP2007301370A JP2009129487A5 JP 2009129487 A5 JP2009129487 A5 JP 2009129487A5 JP 2007301370 A JP2007301370 A JP 2007301370A JP 2007301370 A JP2007301370 A JP 2007301370A JP 2009129487 A5 JP2009129487 A5 JP 2009129487A5
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JP
Japan
Prior art keywords
side storage
true
storage transistor
transistor
bar
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Application number
JP2007301370A
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Japanese (ja)
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JP5313487B2 (en
JP2009129487A (en
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Publication date
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Priority to JP2007301370A priority Critical patent/JP5313487B2/en
Priority claimed from JP2007301370A external-priority patent/JP5313487B2/en
Priority to US12/246,193 priority patent/US8106443B2/en
Publication of JP2009129487A publication Critical patent/JP2009129487A/en
Priority to US12/782,378 priority patent/US8492826B2/en
Publication of JP2009129487A5 publication Critical patent/JP2009129487A5/ja
Priority to US13/350,703 priority patent/US20120112265A1/en
Application granted granted Critical
Publication of JP5313487B2 publication Critical patent/JP5313487B2/en
Expired - Fee Related legal-status Critical Current
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Claims (8)

子注入によりしきい値電圧を制御可能なMOSトランジスタであるTRUE側記憶トランジスタおよびBAR側記憶トランジスタと、
前記2つの記憶トランジスタのソースが共通に接続されたソース線と、
前記TRUE側記憶トランジスタのドレインとTRUE側ビット線との間に接続されたMOSトランジスタであるTRUE側選択トランジスタと、
前記BAR側記憶トランジスタのドレインとBAR側ビット線との間に接続されたMOSトランジスタであるBAR側選択トランジスタと、
前記2つの選択トランジスタのゲートに接続されたワード線とを含み
前記TRUE側記憶トランジスタのドレイン電圧、前記BAR側記憶トランジスタのドレインの電圧、前記TRUE側記憶トランジスタのゲート電圧および前記BAR側記憶トランジスタゲート電圧に対して正の電圧を前記ソース線に印加して前記TRUE側記憶トランジスタおよび前記BAR側記憶トランジスタに正電荷を注入することにより前記TRUE側記憶トランジスタおよび前記BAR側記憶トランジスタに記憶書き込まれた情報を消去する
ことを特徴する不揮発性半導体記憶素子。
A TRUE-side storage transistors and BAR-side storage transistor a controllable MOS transistors the threshold voltage by electron injection,
A source line to which the sources of the two storage transistors are connected in common ;
A TRUE side select transistor that is a MOS transistor connected between the drain of the TRUE side storage transistor and the TRUE side bit line;
A BAR side select transistor that is a MOS transistor connected between the drain of the BAR side storage transistor and a BAR side bit line;
And a word line connected to gates of the two select transistors,
A positive voltage is applied to the source line with respect to the drain voltage of the TRUE side storage transistor, the drain voltage of the BAR side storage transistor, the gate voltage of the TRUE side storage transistor, and the BAR side storage transistor gate voltage. By injecting positive charges into the TRUE side storage transistor and the BAR side storage transistor, the information written and stored in the TRUE side storage transistor and the BAR side storage transistor is erased.
A non-volatile semiconductor memory element.
前記TRUE側記憶トランジスタのドレインおよび前記BAR側記憶トランジスタのドレインにそれぞれ電気的に接続されるセンスアンプ回路と、
前記センスアンプ回路に接続されるフリップフロップとを
さらに含むことを特徴する請求項1に記載の不揮発性半導体記憶素子。
A sense amplifier circuit electrically connected to the drain of the TRUE storage transistor and the drain of the BAR storage transistor;
A flip-flop connected to the sense amplifier circuit;
The nonvolatile semiconductor memory element according to claim 1, further comprising:
前記TRUE側記憶トランジスタの前記ゲート電圧およびBAR側記憶トランジスタの前記ゲート電圧をそれぞれVccに設定し、
前記ワード線に印加される電圧をVccに設定し、
前記TRUE側ビット線および前記BAR側ビット線にそれぞれ現れた電圧の電位差を前記センスアンプ回路で読みだす
ことを特徴する請求項2に記載の不揮発性半導体記憶素子。
The gate voltage of the TRUE storage transistor and the gate voltage of the BAR storage transistor are each set to Vcc;
Setting the voltage applied to the word line to Vcc;
The potential difference between the voltages appearing on the TRUE side bit line and the BAR side bit line is read by the sense amplifier circuit.
The nonvolatile semiconductor memory element according to claim 2 .
前記センスアンプ回路で読みだされた前記電位差をフリップフロップに転送することを特徴する請求項3に記載の不揮発性半導体記憶素子。 4. The nonvolatile semiconductor memory element according to claim 3, wherein the potential difference read by the sense amplifier circuit is transferred to a flip-flop . 前記電位差をフリップフロップに転送された後は前記TRUE側記憶トランジスタの前記ゲート電圧およびBAR側記憶トランジスタの前記ゲート電圧をそれぞれ0Vにすることを特徴する請求項4に記載の不揮発性半導体記憶素子。 The nonvolatile semiconductor memory element according to claim 4, wherein after the potential difference is transferred to the flip-flop, the gate voltage of the TRUE side storage transistor and the gate voltage of the BAR side storage transistor are each set to 0V . 前記TRUE側記憶トランジスタの前記ゲート電圧および前記BAR側記憶トランジスタの前記ゲート電圧がそれぞれ独立して制御される請求項1乃至請求項5のいずれかに記載の不揮発性半導体記憶素子。 The nonvolatile semiconductor memory device according to any one of claims 1 to 5 wherein the gate voltage and the gate voltage of the BAR side storage transistors of the TRUE side storage transistors are controlled independently. 前記TRUE側記憶トランジスタの前記ゲート電圧および前記BAR側記憶トランジスタの前記ゲート電圧が共通に制御される請求項1乃至請求項5のいずれかに記載の不揮発性半導体記憶素子。 The nonvolatile semiconductor memory device according to any one of claims 1 to 5 wherein the gate voltage and the gate voltage of the BAR side storage transistors of the TRUE side storage transistors are commonly controlled. 請求項1乃至請求項7のいずれかに記載の不揮発性半導体記憶素子が複数行、複数列のマトリクス状に配列されたメモリアレイを有する不揮発性半導体記憶装置。 A non-volatile semiconductor memory device having a memory array in which the non-volatile semiconductor memory elements according to claim 1 are arranged in a matrix of a plurality of rows and a plurality of columns.
JP2007301370A 2007-10-09 2007-11-21 Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device Expired - Fee Related JP5313487B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007301370A JP5313487B2 (en) 2007-11-21 2007-11-21 Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device
US12/246,193 US8106443B2 (en) 2007-10-09 2008-10-06 Non-volatile semiconductor memory device
US12/782,378 US8492826B2 (en) 2007-10-09 2010-05-18 Non-volatile semiconductor memory device and manufacturing method thereof
US13/350,703 US20120112265A1 (en) 2007-10-09 2012-01-13 Non-volatile semiconductor memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007301370A JP5313487B2 (en) 2007-11-21 2007-11-21 Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device

Publications (3)

Publication Number Publication Date
JP2009129487A JP2009129487A (en) 2009-06-11
JP2009129487A5 true JP2009129487A5 (en) 2011-01-27
JP5313487B2 JP5313487B2 (en) 2013-10-09

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JP2007301370A Expired - Fee Related JP5313487B2 (en) 2007-10-09 2007-11-21 Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5522296B2 (en) * 2013-06-03 2014-06-18 凸版印刷株式会社 Nonvolatile semiconductor memory device
JP6220041B2 (en) * 2016-12-15 2017-10-25 ローム株式会社 Semiconductor nonvolatile memory circuit and test method thereof
US20220254799A1 (en) * 2021-02-05 2022-08-11 Macronix International Co., Ltd. Semiconductor device and operation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60257561A (en) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp Semiconductor device
US5029131A (en) * 1988-06-29 1991-07-02 Seeq Technology, Incorporated Fault tolerant differential memory cell and sensing
JPH0482093A (en) * 1990-07-23 1992-03-16 Mitsubishi Electric Corp Nonvolatile semiconductor memory
JPH05101683A (en) * 1991-10-08 1993-04-23 Nec Corp Non-volatile semiconductor memory
JP4601287B2 (en) * 2002-12-26 2010-12-22 ルネサスエレクトロニクス株式会社 Nonvolatile semiconductor memory device
JP4601316B2 (en) * 2004-03-31 2010-12-22 ルネサスエレクトロニクス株式会社 Nonvolatile semiconductor memory device
JP2007004911A (en) * 2005-06-24 2007-01-11 Sharp Corp Semiconductor memory apparatus

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