JP2009125772A - Soldering iron, soldered article and manufacturing method of soldered article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering iron which allows a wire member such as a thermocouple to be easily and surely soldered at a target place for soldering of a base material, and also to provide a soldered article using the iron and a manufacturing method of the article. <P>SOLUTION: The bit 111 of a soldering iron 100 is composed separably from the soldering iron body. First, the tip end 21 of the thermocouple 20 is heated while pressurized with the bit 111 of the soldering iron 100 at the target place 11 for soldering of the base material 10, and the solder 30 is supplied and fused in a manner that the target place 11 for soldering, the tip end 21 of the thermocouple, and the bit 111 come in contact with the fused solder. Next, the supply of heat to the bit 111 is stopped and, thereafter, the solder is solidified while the tip end 21 is pressurized with the bit 111 at the target place 11 for soldering. After the solder is solidified, a soldered article remains in which the bit 111 separated from the soldering iron 100 is soldered together with the base material 10 and the thermocouple 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a soldering iron, a solder joint, and a method for manufacturing a solder joint. More specifically, the present invention relates to a soldering iron that performs soldering while pressing a linear member such as a thermocouple against a base material, a solder joint product using the soldering iron, and a method of manufacturing the solder joint product.

  Soldering is a technique in which solder is melted at a target location and then solidified, thereby joining the joining members together and electrically connecting them simultaneously. In this soldering process, the joining members are not yet fixed during a period from when the solder is melted to solidification. For this reason, when the joining members are not held by another means, the joining members may be displaced while the solder is melted, and suitable soldering may not be performed.

  In view of this, means for holding the joining members between the time when the solder melts and the time when it solidifies is taken. For example, Patent Document 1 discloses a soldering device that prevents a soldering failure by pressing an object to be soldered with a pressing pin attached to the soldering device.

JP-A-6-142908

  However, when a linear member such as a thermocouple is soldered to a base material, it is difficult to perform suitable soldering by the method disclosed in Patent Document 1. This is because the location pressed by the pressing pin is not the location to be soldered itself. For this reason, although the location pressed by the pressing pin as shown in FIG. 1 is retained, the location to be soldered of the linear member and the location to be soldered of the base material are not retained.

  For this reason, there exists a possibility that a linear member may float from a base material or may shift | deviate from the soldering target location of a base material by the elasticity of a linear member. Further, when the iron tip is separated from the soldering target location, the linear member may be separated from the soldering target location of the base material. Further, even if the linear member is not separated from the base material, there is a possibility that the bonding strength is lowered due to deviation from the soldering target portion. Further, before soldering, a separate work for positioning and holding the soldering target portion of the linear member and the soldering target portion of the base material is required.

  The present invention has been made to solve the above-described problems of the prior art. That is, the subject is to provide a soldering iron capable of easily and surely soldering a linear member such as a thermocouple to a soldering target portion of a base material, a solder joint product using the soldering iron, and a manufacturing method thereof. That is.

  The soldering iron of the present invention, which has been made for the purpose of solving this problem, is a soldering iron in which the iron tip is separable. A heating part for heating the tip, and a tip gripping operation unit for switching between a state in which the tip is gripped by the tip gripping part and a state in which the grip is released are provided.

  Such a soldering iron can continue to hold the target portion itself to be soldered until the solder is melted and solidified. As a result, accurate soldering can be performed on a soldering object in which it is difficult to hold the soldering target part. In addition, it is excellent in workability because it can be held and heated simultaneously.

  In the soldering iron described above, a soldering tip holding member that holds a plurality of spare soldering tips in a row inside the soldering iron, and the spare soldering tip that is held by the soldering tip holding member is the soldering iron. It is further preferable to further include a tip supply operation unit that sequentially supplies the tip holding unit.

  This is because continuous soldering can be performed by supplying a new iron tip to the gripping portion. In addition, it is still possible to perform accurate soldering by holding the soldering target part itself.

  The solder joint product of the present invention is a solder joint product obtained by soldering a base material and a linear member, and the solder joint product includes a sandwiching member that sandwiches the linear member together with the base material, The sandwiching member is soldered together with the base member and the linear member, and the melting point of the sandwiching member is higher than the melting point of the solder.

  In such a solder joint product, the linear member is correctly joined to the target place, and there is no variation in the joint strength of the solder joint portion.

  The method for manufacturing a soldered product according to the present invention is a method for manufacturing a soldered product in which a base material and a linear member are soldered, while pressing the linear member to the base material with a soldering iron tip. , Heating the linear member and the base material, and supplying solder so that the soldering target portion of the base material, the soldering target portion of the linear member, and the soldering tip are in contact with the molten solder. Melting and solidifying the solder by stopping heating while the linear member is pressed against the base by the tip, separating the tip from the solder tip, and removing the tip from the base It remains in the solder joint part of a material and the said linear member.

  In such a method for manufacturing a solder joint, the linear member does not float during solder joint. For this reason, the efficiency of soldering work is improved. In addition, the linear member can be correctly joined to the target location, and soldering can be reliably performed. Furthermore, it is possible to suppress variations in the bonding strength of manufactured solder joints.

  In the method for manufacturing a solder joint as described above, the heating of the iron tip may be stopped by blocking a heat transfer path from a heat source to the iron tip.

  This is because the efficiency of the soldering work is improved. In addition, the linear member can be correctly joined to the target location, and soldering can be reliably performed. Furthermore, soldering can be performed continuously without turning off the power each time soldering is performed.

  In the method for manufacturing a solder joint as described above, the heating of the tip may be stopped by stopping the supply of power to the heat source.

  This is because the efficiency of the soldering work is improved. In addition, the linear member is correctly joined to the target location, and soldering can be reliably performed. Furthermore, it is possible to continue pressing the soldering target portion with a constant force until the solder is solidified.

  According to the present invention, there are provided a soldering iron capable of easily and surely soldering a linear member such as a thermocouple to a soldering target portion of a base material, a solder joint product using the soldering iron, and a manufacturing method thereof. .

[First embodiment]
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best mode for embodying the present invention will be described in detail with reference to the accompanying drawings. The present embodiment embodies the present invention regarding a soldering iron, a solder joint product, and a method for manufacturing a solder joint product.

  A soldering iron according to this embodiment will be described with reference to FIGS. The appearance of the soldering iron 100 is shown in FIG. The soldering iron 100 has a tip holding operation button 101 and a tip supply operation button 102. In addition, a tip 111 protrudes from the inside of the soldering iron 100 at the tip of the soldering iron 100.

  Next, the internal structure of the soldering iron 100 is shown in FIG. Inside the soldering iron 100, a soldering tip holding member 105, a soldering tip gripping part 103, a soldering tip supply part 104, and a heat generating part 120 are provided. Also, a plurality of spare iron tips 111 that do not appear in the appearance are accommodated.

  Here, the iron tip 111 is separate from the solder iron 100 and is separable. The soldering tip gripping part 103 is for gripping the leading soldering tip 111 exposed outside the soldering iron 100. In addition, a state in which the tip 111 is gripped and a state in which the grip is released can be taken. FIG. 3 shows a state in which the tip holding unit 103 holds the leading tip 111. At this time, the tip of the iron tip 111 protrudes from the solder iron 100. FIG. 4 shows a state where the tip gripping part 103 has released the grip.

  The heat generating unit 120 is a heat source for generating heat by supplying power from the power source and heating the leading iron tip 111 held by the iron tip holding unit 103 via the iron tip holding unit 103. The iron tip holding member 105 is installed inside the solder iron 100 and accommodates a spare iron tip 111 inside the solder iron 100. In addition, a plurality of spare iron tips 111 are arranged and held in a row.

  The tip gripping operation button 101 is a tip gripping operation for alternately switching between a state in which the tip gripper 103 grips the leading tip 111 (FIG. 3) and a state in which the grip is released (FIG. 4). Part. Each time the tip holding operation button 101 is pressed, one of these two states is switched to the other.

  The iron tip supply button 102 is a iron tip supply operation unit for sending a spare iron tip 111 to the iron tip gripping portion 103. When the iron tip supply button 102 is pressed once when the iron tip gripper 103 is not holding the iron tip 111, the iron tip supply unit 104 causes the tip of the spare iron tip 111 to grip the iron tip. The unit 103 is supplied.

  Here, a method for manufacturing a solder joint according to this embodiment will be described with reference to FIGS. The solder joint product manufactured here is obtained by soldering the tip portion 21 of the thermocouple 20 to the soldering target portion 11 of the base material 10. First, as shown in FIG. 5, the tip 21 of the thermocouple 20 that is a linear member is placed on the soldering target portion 11 of the substrate 10. By this alone, the tip portion 21 of the thermocouple 20 and the soldering target portion 11 of the base material 10 are not held and can move with each other.

  Next, as shown in FIG. 6, the tip 21 of the thermocouple 20 is pressed against the soldering target portion 11 of the substrate 10 with the tip 111 of the soldering iron 100. Thereby, the front-end | tip part 21 of the thermocouple 20 is hold | maintained so that it may not move from the soldering object location 11. FIG. At this time, the iron tip 111 is held by the iron tip holding portion 103 as shown in FIG. Further, the iron tip 111 is heated via the iron tip gripping portion 103 by the heat generated by the heat generating portion 120. That is, the tip gripping portion 103 is a heat transfer path from the heat generating portion 120 to the leading tip 111. Thereby, the iron tip 111 heats the tip 21 of the thermocouple 20 and the soldering target portion 11 of the substrate 10.

  Next, as shown in FIG. 7, the solder 30 is supplied to the leading tip 111, the tip 21 of the thermocouple 20, and the soldering target portion 11 of the substrate 10. Since the iron tip 111, the tip 21 and the soldering target portion 11 are heated to a temperature higher than the melting point of the solder 30, the solder 30 is melted. While the solder 30 is melted, the tip portion 21 and the soldering target portion 11 remain held by the pressing of the tip 111.

  The solder 30 is supplied until the melted solder sufficiently covers the soldering target portion 11 of the substrate 10, the tip portion 21 of the thermocouple 20, and the leading iron tip 111. The supply of the solder 30 is stopped when the melted solder sufficiently covers the soldering target portion 11 of the base material 10, the tip portion 21 of the thermocouple 20, and the tip 111. Even at this time, the tip 111 remains pressing the tip 21 against the soldering target portion 11.

  After the supply of the solder 30 is stopped, the tip gripping operation button 101 is pressed once. As a result, the tip holding unit 103 releases the holding of the leading tip 111. At this time, the tip holding part 103 is switched from the state of FIG. 3 to the state of FIG.

  Even after the gripping of the leading iron tip 111 by the iron tip gripping portion 103 is stopped, force is applied to the soldering iron 100 so that the iron tip 111 presses the tip 21 of the thermocouple 20 against the soldering target portion 11 of the substrate 10. Continue adding. For this reason, the tip 21 does not leave the soldering target portion 11 even after the gripping is stopped.

  When the holding of the leading iron tip 111 by the soldering tip grasping portion 103 is stopped, the heat transfer path of the leading iron tip 111 is cut off. This is because the iron tip gripping portion 103 is a heat transfer path from the heat generating portion 120 to the iron tip. As a result, the temperature of the soldering tip 111, the thermocouple 20, the base material 10, and the molten solder 30 starts to decrease.

  Thereafter, the temperature of the solder 30 becomes lower than the freezing point, and the solder 30 is solidified. As a result, the soldering target portion 11 of the base material 10, the tip portion 21 of the thermocouple 20, and the leading iron tip 111 are soldered. Until this stage, the iron tip 111 continues to apply a force to the solder iron 100 so as to press the tip 21 of the thermocouple 20 against the soldering target portion 11 of the substrate 10.

  After the solder 30 is solidified, the soldering iron 100 is lifted. At this point, since the solder 30 is solidified, the tip 21 of the thermocouple 20 does not rise or shift. As a result, the leading iron tip 111 is soldered together with the tip 21 of the thermocouple 20 to the soldering target portion 11 of the substrate 10 and is left as it is. This is shown in FIG.

  In addition, if the tip 111 has sufficient weight to press and hold the tip portion 21 of the thermocouple 20 against the soldering target portion 11 of the substrate 10, it can be used as a weight. Until the solder 30 is solidified, the tip 21 can be prevented from being lifted or displaced by the dead weight of the tip 111. In this case, after releasing the holding of the leading iron tip 111 by the iron tip holding portion 103, it is not necessary to apply a force to the soldering iron 100 and press the tip portion 21 against the soldering target portion 11. For this reason, the soldering iron 100 may be lifted after the holding of the iron tip 111 by the iron tip gripping portion 103 is stopped.

  When there are a plurality of locations to be soldered on the base material 10, the soldering is performed in the same manner. Since the soldering iron 100 accommodates a plurality of iron tips 111, it can be continuously soldered. When the iron tip supply button 102 is pressed once, the iron tip supply unit 104 supplies a new iron tip 111 to the iron tip gripper 103. By gripping the supplied tip 111, soldering can be performed continuously. Here, the heat generating part 120 remains heated, and the tip gripping part 103 remains heated. For this reason, there is no problem in continuous soldering. This completes the manufacture of solder joints.

  The solder joint product manufactured by the above manufacturing method is a solder joint product in which a linear member such as a thermocouple is sandwiched and soldered between a soldering tip that is a sandwiching member and a base material. The tip that is the sandwiching member does not melt at the melting point of the solder. Further, the soldering tip is used at the time of soldering, and does not have any function in the solder joint product after the soldering is completed.

  As described above in detail, the soldering iron according to the present embodiment is such that the tip of the solder is separated and left at the solder joint, so that the soldering is not performed until the solder solidifies after the melting. You can continue to hold the target part itself. As a result, a soldering iron capable of performing accurate soldering on a soldering target that is difficult to hold a soldering target location is realized.

  Such a soldering iron can hold the portion itself where the joining members are to be heated. For this reason, soldering defects can be avoided and variations in bonding strength can be suppressed. In addition, it is excellent in workability because it can be held and heated simultaneously.

  In the method of manufacturing a solder joint according to the present embodiment, not only when the soldering target part and the solder are heated, but also during the period from when the solder is melted to solidification, the part to be heated itself is kept. . That is, the manufacturing method is a series of processes in which the process of holding for soldering is incorporated in the solder bonding process. For this reason, there is no possibility that the linear member floats or deviates from the location to be soldered before and after the solder bonding process. Thereby, a linear member can be correctly joined to a target place. Therefore, it is possible to suppress variations in the bonding strength of the solder joints.

  Further, since the holding of the joining members and the solder joining can be performed at the same time by a common operation, workability is improved. As described above, the method for manufacturing a solder joint according to this embodiment achieves both improvement in soldering workability and accuracy. Note that the continuity of the soldering operation is not impaired.

  In the solder joint product according to the present embodiment, since the linear member is correctly joined to the target place and soldered securely, there is no variation in the joint strength. The tip of the iron is better if it has good thermal conductivity and good solder wettability.

[Second form]
Below, the 2nd form of this invention is demonstrated. First, a soldering iron according to this embodiment will be described with reference to FIG. The soldering iron 150 of this embodiment is substantially the same as the soldering iron 100 of the first embodiment. The difference is that the soldering iron 150 has a power switch 130. The power switch 130 switches whether to supply power to the heat generating unit 120 each time it is pressed. In FIG. 9, the leading iron tip 111 is held by the iron tip holding portion 103, but the holding of the iron tip 111 may be canceled as shown in FIG.

  Next, a method for manufacturing a solder joint according to this embodiment will be described. The manufacturing method of the solder joint product of this embodiment is almost the same as that of the first embodiment. In other words, throughout the soldering process of the solder joint product, the tip of the thermocouple is continuously pressed against the soldering target portion of the substrate by the tip. For this reason, it demonstrates below with the figure (FIGS. 5-8) similar to a 1st form. Note that the soldering iron 100 in the figure is regarded as the soldering iron 150 of this embodiment.

  In this embodiment, the process is the same as that in the first embodiment until the solder 30 is melted (FIG. 7) while the tip 111 of the thermocouple 20 is pressed against the soldering target portion 11 of the substrate 10 with the tip 111. Therefore, the subsequent procedure will be described below.

  The supply of the solder 30 is stopped when the melted solder sufficiently covers the soldering target portion 11 of the base material 10, the tip portion 21 of the thermocouple 20, and the leading iron tip 111. Even at this time, the tip 111 remains pressing the tip 21 against the soldering target portion 11.

  After the supply of the solder 30 is stopped, the power switch 130 is pressed once. Thereby, the power supply to the heat generating part 120 is stopped. For this reason, the heat generation by the heat generating unit 120 stops. As a result, the supply of heat to the leading iron tip 111 is cut off. Thereafter, the temperature of the soldering tip 111, the soldering target portion 11 of the substrate 10, the tip portion 21 of the thermocouple 20, and the solder 30 are lowered. Even after the heat generation of the heat generating portion 120 is stopped, the tip portion 21 of the thermocouple 20 is continuously pressed against the soldering target portion 11 of the base material 10 while the iron tip gripping portion 103 is holding the iron tip 111.

  Thereafter, the tip portion 21 of the thermocouple 20 by the leading iron tip 111 is continuously pressed against the soldering target portion 11 of the substrate 10 until the molten solder is solidified. After the solder 30 is solidified, the tip gripping operation button 101 is pressed once. As a result, the tip holding unit 103 releases the holding of the leading tip 111.

  At this time, the leading iron tip 111 is soldered together with the solidified solder together with the soldered portion 11 of the base material 10 and the tip portion 21 of the thermocouple 20. Thereafter, the soldering iron 100 is lifted. As a result, the iron tip 111 is left soldered together with the soldering target portion 11 of the substrate 10 and the tip portion 21 of the thermocouple 20 (FIG. 8). When there are a plurality of locations where soldering is performed on the base material 10, it is continuously performed as in the first embodiment. This completes the manufacture of solder joints.

  As in the first embodiment, the solder joint product manufactured by the above manufacturing method is a solder joint product in which a linear member such as a thermocouple is sandwiched and soldered between a tip that is a sandwich member and a base material. is there. The tip that is the sandwiching member does not melt at the melting point of the solder. Further, the soldering tip is used at the time of soldering, and does not have any function in the solder joint product after the soldering is completed.

  As described above in detail, the soldering iron according to the present embodiment, like the first embodiment, separates the iron tip and leaves it at the solder joint, so that the solder solidifies after melting. In the meantime, it is possible to keep the target part itself to be soldered. As a result, a soldering iron capable of performing accurate soldering on a soldering target that is difficult to hold a soldering target location is realized.

  Such a soldering iron can hold the portion itself where the joining members are to be heated. For this reason, soldering defects can be avoided and variations in bonding strength can be suppressed. In addition, it is excellent in workability because it can be held and heated simultaneously. Further, in the soldering iron of this embodiment, the linear member can be held by the iron tip 111 through the iron tip gripping portion 103 consistently. For this reason, it is possible to continue to hold the joining members with a constant force from the beginning to the end of the soldering process.

  As in the first embodiment, the method for manufacturing a solder joint according to the present embodiment attempts to heat not only when the soldering target portion and the solder are heated, but also between the time when the solder is melted and solidified. Continue to hold the exact location. That is, the manufacturing method is a series of processes in which the process of holding for soldering is incorporated in the solder bonding process. For this reason, there is no possibility that the linear member floats or deviates from the location to be soldered before and after the solder bonding process. Thereby, a linear member can be correctly joined to a target place. Therefore, it is possible to suppress variations in the bonding strength of the solder joints.

  Further, since the holding of the joining members and the solder joining can be performed at the same time by a common operation, workability is improved. As described above, the method for manufacturing a solder joint according to this embodiment achieves both improvement in soldering workability and accuracy. Note that the continuity of the soldering operation is not impaired. Further, in the method of manufacturing a solder joint product according to the present embodiment, the linear member is held by the iron tip 111 through the iron tip gripping portion 103 consistently. For this reason, it is possible to continue to hold the joining members with a constant force from the beginning to the end of the soldering process.

  As in the first embodiment, the solder joint product according to the present embodiment has the linear members correctly joined to the target location and is securely soldered, so there is no variation in the joint strength. The tip of the iron is better if it has good thermal conductivity and good solder wettability.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, what is soldered to the substrate is not limited to a thermocouple. This is because an elastic linear member such as other wiring has the same effect.

  The spare iron tip 111 is housed inside the solder iron, but it may be provided separately from the solder iron and used during use. The effect is the same. In this case, the soldering iron holding member 105, the ironing tip supply operation button 102, and the ironing tip supply unit 104 are not necessary for the soldering iron.

  Further, the material used as the iron tip in this embodiment does not need to be made of the same material as the iron tip conventionally used. Any material that does not melt at the melting point of the solder is sufficient. However, heat conduction and solder wettability are preferable. Also, the soldering tip is consumed every time soldering is performed and is disposable. For this reason, it is not necessary to consider durability. For example, you don't have to worry about the galling of the tip of the iron. The tip of the iron is preferably copper, but it doesn't have to be.

It is a figure explaining the case where the linear member is soldered to a base material conventionally. It is a figure explaining the external appearance of the soldering iron concerning a 1st form. It is sectional drawing (the 1) explaining the internal structure of the soldering iron which concerns on a 1st form. It is sectional drawing (the 2) explaining the internal structure of the soldering iron which concerns on a 1st form. It is FIG. (1) explaining the procedure of soldering which concerns on this invention. It is FIG. (2) explaining the procedure of soldering which concerns on this invention. It is FIG. (3) explaining the procedure of soldering which concerns on this invention. It is FIG. (4) explaining the procedure of soldering which concerns on this invention. It is sectional drawing explaining the internal structure of the soldering iron which concerns on a 2nd form.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base material 11 ... Solder object location 20 ... Thermocouple 21 ... Tip part 30 ... Solder 100 ... Soldering iron 101 ... Iron tip holding operation button 102 ... Iron tip supply operation button 103 ... Iron tip holding part 105 ... Iron tip holding Member 111 ... Iron tip 120 ... Heat generating part 130 ... Power switch 150 ... Solder iron

Claims (6)

A soldering iron whose tip is separable,
A tip gripping part for gripping the tip,
A heating part that heats the tip through the tip gripping part;
A soldering iron characterized by having a soldering tip gripping operation section for switching between a state in which the soldering tip is gripped by the soldering tip gripping portion and a state in which the gripping is released. The soldering iron according to claim 1,
A soldering tip holding member for holding a plurality of spare soldering tips in a row inside the soldering iron;
A soldering iron comprising: a soldering tip supply operation unit that sequentially supplies the spare tip held by the tip holding member to the tip holding unit. A solder joint product obtained by soldering a base material and a linear member,
The solder joint product has a sandwiching member that sandwiches the linear member together with the base material,
The sandwiching member is soldered together with the base material and the linear member,
A solder joint product, wherein the sandwiching member has a melting point higher than that of solder. A method for manufacturing a solder joint product in which a base material and a linear member are solder-joined,
While pressing the linear member against the base with a soldering iron tip, the linear member and the base are heated,
Supplying and melting the solder so that the soldering target portion of the base material and the soldering target portion of the linear member and the iron tip are in contact with the molten solder;
Solder is solidified by stopping heating while the linear member is pressed against the substrate by the tip of the iron,
Separating the iron tip from the solder iron;
A method for producing a solder joint, wherein the iron tip is left in a solder joint between the base material and the linear member. A method for producing a soldered article according to claim 4,
The method of manufacturing a solder joint product, wherein the heating of the iron tip is stopped by blocking a heat transfer path from a heat source to the iron tip. A method for producing a soldered article according to claim 4,
A method for manufacturing a solder joint, wherein heating of the iron tip is stopped by stopping power supply to a heat source.

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