JP2009122519A - Power source device and image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power source device capable of suppressing discharge and leak when a high voltage is applied, and to provide an image forming apparatus. <P>SOLUTION: A high-voltage power source 70 includes a substrate 71 having a mounting surface as one surface and a solder surface as the other, a connector 72 which is mounted on the mounting surface of the substrate 71 and can provide a connection to a power supply line for supplying external electric power, a high-voltage section 73 which is mounted on the mounting surface of the substrate 71 and generates a high voltage, a nonconductive external member 74 covering the high-voltage section 73, and a metal power feeding member 75 for contact power feeding forming a contact power feeding surface 75a. A power reception unit 80 includes an engagement projection portion 81 which engages the substrate 71 of the high-voltage power source 70, then, positions the substrate 71, a metal power receiving member 82 coming in contact with the contact power feeding surface 75a of the metal power feeding member 75 to receive electric power, and a nonconductive exterior member 83 covering the portion of the metal power receiving member 82 including the contact power receiving surface 82a except its distal end portion. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a power supply device and an image forming apparatus.

In an image forming apparatus such as an electrophotographic copying machine or a printer, a high voltage is required for each process, and various power supply apparatuses used in such an image forming apparatus have been conventionally proposed (for example, , See Patent Document 1).
Patent Document 1 discloses a power supply device that can stably supply power without depending on changes in environmental conditions and that has a reduced device configuration. That is, the power supply device disclosed in Patent Document 1 includes a high-voltage power source that is formed on a circuit board and generates a predetermined voltage, and a supply device that supplies the predetermined voltage to the image forming unit. . This supply device is arranged along a guide groove having a guide groove for guiding the circuit board to a predetermined position by sliding the circuit board in a predetermined direction with one side of the circuit board of the high-voltage power supply being sandwiched. A first terminal. The high-voltage power supply has a second terminal that is arranged along one side of the circuit board and that can contact the first terminal. The high-voltage power supply and the supply device have a conductor pattern for returning leakage current generated in the supply device to the high-voltage power supply.

JP 2005-121845 A

  Here, for example, when a high voltage required in the transfer process is applied, in the structure where the high voltage application unit is exposed, there is a risk of adverse effects such as malfunctions on other control functions due to discharge noise due to discharge or leakage. There is. Further, current may leak due to discharge or leakage, and a desired current may not be supplied.

  An object of the present invention is to provide a power supply device and an image forming apparatus capable of suppressing the occurrence of discharge and leakage when a high voltage is applied.

  The invention according to claim 1 is a high voltage unit that generates a high voltage, a power supply member that supplies the high voltage generated by the high voltage unit, a first surface on which the high voltage unit is located, and the first A non-conductive power supply covering member that has a substrate having a second surface opposite to the surface, and an opening that covers the high voltage portion and the power supply member and opens in the thickness direction of the substrate on the second surface side A power receiving member that receives the high voltage from the second surface side of the substrate through the opening of the power supply covering member and receives the high voltage; the second surface of the substrate; and the power receiving member; And a non-conductive power receiving covering member that is positioned between and covers the power receiving member.

  According to a second aspect of the present invention, in the substrate, a notch portion is formed by cutting out an edge portion of the substrate, or a through hole is formed in a portion other than the edge portion, and the power receiving covering member is the substrate. The power supply device according to claim 1, wherein positioning with the substrate is performed by engaging with the notch or the through hole. The invention according to claim 3 further includes a locking means disposed on the power supply coating member and configured to lock the power supply coating member to the substrate. It is a power supply device. According to a fourth aspect of the present invention, the first surface of the substrate is a mounting surface on which the high voltage portion is mounted, and the second surface of the substrate is soldered to the high voltage portion. The power supply device according to claim 1, wherein the power supply device is a solder surface to be performed.

  Invention of Claim 5 is a power supply device containing a high voltage power supply and the power receiving unit connected with the said high voltage power supply, Comprising: The said high voltage power supply is a high voltage part which produces | generates a high voltage, A first surface on which the high voltage portion is located and a second surface opposite to the first surface, and the second surface is connected to the power receiving unit when the high voltage power source and the power receiving unit are connected to each other. And a contact power feeding surface that feeds the high voltage generated by the high voltage unit, and the contact power feeding surface is connected to the power receiving unit when the high voltage power source and the power receiving unit are connected to each other. A power supply member facing in the direction of the unit, wherein the power reception unit includes a power reception member having a contact power reception surface that receives a high voltage in contact with the contact power supply surface of the power supply member, and the high voltage power source And / or disposed in the power receiving unit. A power supply device, characterized in that it comprises a non-conductive covering member covering the feed member and the receiver member in a state in which said contact power surface and the contact receiving surfaces are in contact with each other.

  The invention according to claim 6 further includes a locking portion that locks with the substrate and supports the force from the second surface of the substrate to the first surface with the covering member, The power supply device according to claim 5, wherein the power supply device is formed on the covering member disposed in the high-voltage power supply.

  According to a seventh aspect of the present invention, there is provided an image carrier, a charging unit for charging the image carrier, a developing unit for developing an electrostatic latent image formed on the image carrier with a developer, and the developing unit. Transfer means for transferring the toner image held on the image holding body to a recording medium by means of, a fixing means for fixing the toner image transferred by the transfer means to the recording medium, the charging means, the developing means, A power supply unit that supplies a high voltage to at least one of the transfer unit and the fixing unit, and the power supply unit includes a high voltage unit that generates a high voltage and a high voltage unit that is generated by the high voltage unit. A power supply member for supplying a voltage; a mounting surface on which the high voltage portion is mounted; a substrate having a solder surface on which the high voltage portion is soldered; and the high voltage portion and the power supply member. Thickness direction Solder side A non-conductive power supply covering member having an opening to be opened; a power receiving member that receives high voltage from the solder surface side of the substrate through the opening of the cover member and receives the high voltage; and An image forming apparatus comprising: a non-conductive power receiving covering member that is positioned between the solder surface of the substrate and the power receiving member and covers the power receiving member.

According to the first aspect, it is possible to suppress the occurrence of discharge and leakage in the power supply member and the power reception member to which a high voltage is applied compared to the case where the present invention is not applied.
According to the second aspect, a member for positioning the substrate and an engagement hole formed in the substrate can be omitted.
According to the third aspect, it is possible to reduce the load on the high voltage portion as compared with the case where the present invention is not applied.
According to the fourth aspect, it is possible to easily perform the mounting operation of the substrate as compared with the case where the present invention is not applied.
According to the fifth aspect, it is possible to suppress the occurrence of discharge and leakage at the power supply member and the power reception member to which a high voltage is applied, compared to the case where the present invention is not applied.
According to the sixth aspect, it is possible to reduce the load on the high voltage portion as compared with the case where the present invention is not applied.
According to the seventh aspect, it is possible to suppress the occurrence of discharge and leakage at the power supply member and the power reception member to which a high voltage is applied, as compared with the case where the present invention is not applied.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a diagram illustrating a configuration of an image forming apparatus 1 to which the exemplary embodiment is applied. An image forming apparatus 1 shown in FIG. 1 is configured by a so-called tandem method using an electrophotographic method, and an image forming process unit 10 as an example of an image forming unit that forms an image (toner image) made of toner on a recording material. And a control unit 50 for controlling the operation of the entire image forming apparatus 1. The image forming apparatus 1 also stores an image processing unit 51 that performs predetermined image processing on image data received from an image reading device 4 such as a personal computer (PC) 3 or a scanner, and a processing program, for example. And an external storage unit 52 realized by a hard disk drive.

The image forming process unit 10 forms four image forming units that respectively form yellow (Y), magenta (M), cyan (C), and black (K) toner images arranged in parallel at regular intervals. Units 11Y, 11M, 11C, and 11K (also collectively referred to as “image forming unit 11”) are provided.
The image forming unit 11 includes a photosensitive drum 12 on which an electrostatic latent image is formed while rotating in the direction of arrow A, a charging roll 13 that uniformly charges the surface of the photosensitive drum 12 with a predetermined potential, and a charging roll 13 And a print head 14 that exposes the photosensitive drum 12 charged in accordance with the image data based on the image data. Further, the image forming unit 11 includes a developing unit 15 that develops the electrostatic latent image formed on the photosensitive drum 12 and a drum cleaner 16 that cleans the surface of the photosensitive drum 12. Each of the four image forming units 11Y, 11M, 11C, and 11K is configured in substantially the same manner except for the toner stored in the developing unit 15, and each of the image forming units 11 is yellow (Y) and magenta (M). , Cyan (C) and black (K) toner images are formed.

  Further, the image forming process unit 10 intermediates the intermediate transfer belt 20 onto which the respective color toner images formed on the respective photosensitive drums 12 of the respective image forming units 11 are transferred, and the respective color toner images of the respective image forming units 11. Primary transfer rolls 21Y, 21M, 21C, and 21K (also collectively referred to as “primary transfer roll 21”) that sequentially transfer (primary transfer) to the transfer belt 20 are provided. In addition, the image forming process unit 10 performs secondary transfer (secondary transfer) of the superimposed toner image transferred onto the intermediate transfer belt 20 onto the paper P as a recording material (recording paper) at the secondary transfer unit T. A transfer roll 26 and a fixing device 30 that fixes the second-transferred image on the paper P are provided.

The intermediate transfer belt 20 includes a drive roll 24 that rotationally drives the intermediate transfer belt 20, a backup roll 25 provided at a position opposite to the secondary transfer roll 26, a tension roll 27 that applies tension to the intermediate transfer belt 20, and a stretching roll. 28 and primary transfer rolls 21Y, 21M, 21C, 21K and the like, and circulates and moves in the direction of arrow B.
The fixing device 30 includes a fixing roll 31 having a heating source therein, and a pressure roll 32 arranged in pressure contact with the fixing roll 31. The fixing device 30 fixes the toner image on the paper P by passing the paper P holding the unfixed toner image between the fixing roll 31 and the pressure roll 32 and heating and pressing the paper P. To do.

In the image forming apparatus 1 according to the present embodiment, the image forming process unit 10 performs an image forming operation under the control of the control unit 50. That is, when a color image is formed, print job data or the like input from the PC 3 or the image reading device 4 is subjected to predetermined image processing by the image processing unit 51 and sent to the print head 14 for each color. For example, in the black (K) color image forming unit 11K, the surface of the photosensitive drum 12 uniformly charged at a predetermined potential by the charging roll 13 is transferred to the K color image data from the image processing unit 51 by the print head 14. And an electrostatic latent image is formed on the photosensitive drum 12. The formed electrostatic latent image is developed by the developing device 15, and a black (K) toner image is formed on the photosensitive drum 12. Similarly, in the image forming units 11Y, 11M, and 11C, yellow (Y), magenta (M), and cyan (C) toner images are formed.
When a monochrome image is formed, a black (K) toner image is formed only in the black (K) image forming unit 11K.

  Each color toner image formed by each image forming unit 11 is applied with a predetermined primary transfer bias voltage from a power supply device 61 as a high-voltage primary transfer power source to be described later on the intermediate transfer belt 20 that circulates and moves in the direction of arrow B. Then, the toner images are sequentially electrostatically transferred by the respective primary transfer rolls 21, and a superimposed toner image is formed on the intermediate transfer belt 20. As the intermediate transfer belt 20 moves, the superimposed toner image is conveyed toward the secondary transfer portion T where the secondary transfer roll 26 and the backup roll 25 are arranged.

On the other hand, in the image forming apparatus 1, a plurality of sheets P1 and P2 (collectively referred to as “sheets P”) of different sizes or types are stored in the sheet storage trays 40A and 40B, respectively. For example, when the paper P1 is designated by the control unit 50, the paper P1 is taken out from the paper storage tray 40A by the pickup roll 41, and is conveyed one by one to the position of the registration roll 43 by the conveyance roll 42 along the conveyance path R1. Is done. The same applies when the paper P2 is designated by the control unit 50. In this embodiment, the paper storage trays 40A and 40B are provided. However, it is also conceivable to provide a paper storage tray having a larger number.
Then, the paper P is fed out from the registration roll 43 in accordance with the timing at which each color toner image on the intermediate transfer belt 20 is conveyed to the secondary transfer portion T. A voltage is applied to the secondary transfer portion T from a power supply device 61 as a high-voltage secondary transfer power source described later. Each color toner image is electrostatically transferred (secondary transfer) collectively onto the paper P by the action of the transfer electric field formed by the secondary transfer roll 26 and the backup roll 25.
Note that the sheet P is also conveyed to the secondary transfer portion T from the duplex conveyance path R2 and the conveyance path R3 from the manual sheet storage tray 56.

Thereafter, the sheet P on which the superimposed toner image is electrostatically transferred is peeled off from the intermediate transfer belt 20 and conveyed to the fixing device 30. The unfixed toner image on the paper P conveyed to the fixing device 30 is fixed on the paper P by being subjected to a fixing process by heating and pressing by the fixing device 30. The sheet P on which the image is formed is discharged from the sheet discharge portion Q of the image forming apparatus 1 by the post-fixing transport roll 44 and the unloading roll 45, and is connected to the image forming apparatus 1 (not shown). ).
On the other hand, the toner (transfer residual toner) adhering to the intermediate transfer belt 20 after the secondary transfer is removed by a belt cleaner 23 disposed in contact with the intermediate transfer belt 20 to prepare for the next image forming cycle.
In this manner, image formation in the image forming apparatus 1 is repeatedly executed for the designated number of sheets.

FIG. 2 is an exploded view for explaining a schematic configuration of the power supply device 61 according to the first embodiment mounted in the image forming apparatus 1 of FIG.
2 is attached to a primary transfer unit including the primary transfer roll 21 (see FIG. 1) or a secondary transfer unit T (see FIG. 1) having a higher voltage than the primary transfer unit. It is what The power supply device 61 is, for example, a charging device provided with the charging roll 13 (see FIG. 1), the developing device 15 or the fixing device 30 (see FIG. 1) other than the primary transfer portion and the secondary transfer portion T. It is possible to apply to.

  The power supply device 61 includes a high voltage power supply 70 and a power receiving unit (device main body) 80 that receives a high voltage from the high voltage power supply 70. As a configuration for attaching the high voltage power supply 70 to the power receiving unit 80, for example, a screw fastening means (not shown) may be applied. As another configuration, it is also possible to apply fastener means. That is, it is sufficient to adopt a well-known and commonly used technique for detachably attaching the high voltage power supply 70 to the power receiving unit 80. When the high voltage power supply 70 is attached to the power receiving unit 80, the high voltage power supply 70 is positioned with respect to the power receiving unit 80. Details thereof will be described later.

  The high-voltage power supply 70 has a predetermined conductor pattern arrayed, a substrate (high-voltage substrate) 71 having one surface (first surface) as a mounting surface and the other surface (second surface) as a solder surface, and a mounting surface of the substrate 71. A connector 72 that is mounted and enables connection to a voltage supply line (wire material) that supplies an external voltage, and a high voltage section (high voltage block) that is mounted on the mounting surface of the substrate 71 and generates a high voltage of, for example, 8 kV or more. 73). The high voltage unit 73 has a plurality of terminal pins (not shown), and the terminal pins are soldered and attached to the board 71 in a state of being inserted into lands (not shown) of the board 71. Further, other electronic components (not shown) are mounted on the mounting surface of the substrate 71.

  The high voltage portion 73 is disposed on a non-conductive outer member (output power supply cover, power supply covering member, covering member) 74 as a member covering the high voltage portion 73 and on the inner surface side of the outer member 74, and is predetermined. A step-up transformer (not shown) that raises the voltage up to a voltage of 2 and a secondary-side rectifier circuit (not shown) that is disposed in the outer member 74 and converts the output to direct current. In addition, the high voltage portion 73 includes a metal power supply member (output terminal) 75 for contact power supply that forms a contact power supply surface 75a with a metal plate, for example, and an insulating resin (not shown) that is filled and insulated on the inner surface side of the outer member 74. And having.

The metal power supply member 75 is located not on the solder surface side of the substrate 71 but on the mounting surface side. Further, as will be described later, the contact power supply surface 75 a of the metal power supply member 75 can be accessed from the solder surface side of the substrate 71. That is, it is possible to supply power by contacting the contact power supply surface 75a from the solder surface side.
In other words, the metal power supply member 75 is arranged such that the contact power supply surface 75a of the metal power supply member 75 faces the power reception unit 80 in a state where the high voltage power supply 70 is attached to the power reception unit 80. For this reason, when the high voltage power supply 70 is attached to the power receiving unit 80, the contact power feeding surface 75 a of the metal power feeding member 75 comes into contact with a contact power receiving surface 82 a of a metal power receiving member 82 described later provided in the power receiving unit 80. The power receiving unit 80 receives a high voltage from the high voltage power supply 70 via the metal power supply member 75 and the metal power receiving member 82.

The power reception unit 80 includes an engagement projection (boss) 81 for positioning the substrate 71 by engagement with the substrate 71 of the high voltage power supply 70 during the mounting operation of the high voltage power supply 70, and contact power supply of the metal power supply member 75. A metal power receiving member (metal member) 82 that receives power in contact with the surface 75a, and a non-conductive exterior member that covers a portion other than the front end portion (end portion on the substrate side) of the metal power receiving member 82 including the contact power receiving surface 82a. Power receiving unit support member, power receiving covering member, covering member) 83. As the metal power receiving member 82, it is conceivable to use a member such as a coil spring (plate spring) or a leaf spring that applies an urging force, and thereby, a necessary contact between the metal power feeding member 75 and the metal power receiving member 82 can be considered. It becomes possible to ensure pressure. Further, as the exterior member 83, for example, a hollow member having a cylindrical shape or a polygonal shape can be used.
More specifically, the metal power receiving member 82 is located in the hollow exterior member 83, and the metal power reception member 82 slightly protrudes from the exterior member 83. That is, the contact power receiving surface 82 a of the metal power receiving member 82 is located on the substrate 71 side (left side in FIG. 2) of the high voltage power supply 70 with respect to the front end surface of the exterior member 83.

  Thus, the voltage supplied through the connector 72 of the high voltage power supply 70 is converted into a high voltage direct current by the high voltage unit 73, and the metal power supply member 75 and the metal power receiving member 82 are brought into contact with each other to directly supply power. The high voltage is applied from the metal power supply member 75 of the high voltage power supply 70 to the metal power reception member 82 of the power reception unit 80.

  More specifically, the high voltage power supply 70 is attached to the power receiving unit 80 such that the solder surface of the substrate 71 is located on the power receiving unit 80 side. In other words, when attaching the high voltage power supply 70 to the power receiving unit 80, the operator performs the attachment with the mounting surface of the substrate 71 facing forward. Since the connector 72 is attached not to the solder surface of the substrate 71 but to the mounting surface of the substrate 71, the operator visually attaches the position of the connector 72 after attaching the high voltage power supply 70 to the power receiving unit 80. Connect the voltage supply line while checking directly.

  As a configuration in which the high voltage power source 70 and the power receiving unit 80 are attached by the above-described screw fastening means, a screw hole (not shown) is formed in the power receiving unit 80, and the mounting hole corresponding to the screw hole is formed as a high voltage power source. The form formed in 70 can be considered. Then, the high voltage power supply 70 is attached to the power receiving unit 80 by inserting and screwing a male screw (see FIG. 3) into a screw hole (not shown) of the power receiving unit 80 from the mounting surface of the substrate 71.

  Thus, the operator can perform the work of attaching the high voltage power supply 70 to the power receiving unit 80 (including screw fastening) and the work of connecting the voltage supply line, all on the mounting surface side of the substrate 71. It has a configuration that takes workability into consideration.

3 and 4 are diagrams showing a state in which the high voltage power supply 70 is attached to the power receiving unit 80. FIG. 3A is a perspective view seen from the high voltage power supply 70 side (the mounting surface side of the substrate 71), FIG. 3B is a perspective view seen from the power receiving unit 80 side, and FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view of a state in which a part of the outer member 74 is broken, as viewed from above.
As shown in FIG. 3 or 4, the substrate 71 has a notch 76 formed by notching a part of the edge. The notch 76 is formed corresponding to the positions of the metal power receiving member 82 and the exterior member 83 of the power receiving unit 80. That is, when the high voltage power supply 70 is attached to the power receiving unit 80, the metal power supply member 75 of the high voltage portion 73 is located in the notch portion 76 of the substrate 71.

More specifically, when the worker attaches the high voltage power supply 70 to the power receiving unit 80, the metal power receiving member 82 passes through the notch 76 from the solder surface side of the substrate 71 as shown in FIG. Then, proceeding to the mounting surface side of the substrate 71, the contact power receiving surface 82 a of the metal power receiving member 82 contacts the contact power feeding surface 75 a of the metal power feeding member 75. That is, the contact position between the contact power feeding surface 75 a of the metal power feeding member 75 and the contact power receiving surface 82 a of the metal power receiving member 82 is not the solder surface side of the substrate 71 but the mounting surface side.
In addition, as shown in FIG. 3A or FIG. 4A, the engaging convex portion 81 of the power receiving unit 80 is engaged with the positioning hole 78 of the substrate 71, whereby the high voltage power source 70 is Then, the power receiving unit 80 is positioned. In this state, the worker attaches and fixes the high-voltage power supply 70 to the power receiving unit 80 with a male screw.

Here, the outer member 74 of the high voltage portion 73 has an extending portion (flange portion) 77 extending from the metal power feeding member 75 in the direction of the substrate 71. The extending portion 77 is formed so as to cover the periphery of the metal power supply member 75. By this extending portion 77, the outer member 74 is formed with an opening S that opens only in the thickness direction of the substrate 71 and on the solder surface side. The opening S is for contact power feeding and is at the same position as the notch 76 of the substrate 71.
The contact power supply surface 75 a of the metal power supply member 75 is separated from the mounting surface of the substrate 71, and the extending portion 77 is formed so as to hide between the metal power supply member 75 and the substrate 71. As described above, the metal power supply member 75 is covered with the outer member 74 and the extending portion 77 except for the direction in which the power receiving unit 80 is located (the solder surface direction of the substrate 71). In other words, since the extending portion 77 is formed in the outer member 74, the metal power supply member 75 is located behind.

In addition, many portions of the metal power receiving member 82 are surrounded by the exterior member 83. The exterior member 83 is located between the solder surface of the substrate 71 and the metal power receiving member 82. The contact power receiving surface 82a of the metal power receiving member 82 slightly protrudes from the exterior member 83, and the contact power receiving surface 82a is brought into contact with the metal power supply member 75 on the high voltage power source 70 side to receive the power receiving unit from the high voltage power source 70. 80 is fed (contact feeding).
More specifically, as shown in FIGS. 4A and 4B, the contact power receiving surface 82 a of the metal power receiving member 82 protruding from the exterior member 83 is covered with the extending portion 77 of the outer member 74. . That is, the contact power receiving surface 82a of the metal power receiving member 82 is not directly exposed.

  As described above, in the present embodiment, the metal power supply member 75 is located behind the extending portion 77, and the metal power supply member 82 is in contact with the contact power supply surface 75a of the metal power supply member 75. The outer member 74 is covered with the extending portion 77. Therefore, current leakage due to discharge or leakage accompanying contact power feeding from the metal power supply member 75 to the metal power receiving member 82 is prevented, and generation of discharge noise due to discharge or leakage is suppressed, and malfunction of other control functions is prevented. It becomes possible to prevent.

Although the present embodiment has been described, various modifications can be considered.
For example, in the present embodiment, the metal power supply member 75 is located on the mounting surface side of the substrate 71, but is disposed so that the contact power supply surface 75a of the metal power supply member 75 faces the power receiving unit 80 side, and As long as a structure in which the contact power receiving surface 82a of the metal power receiving member 82 is not directly exposed is employed, the metal power receiving member 82 may be positioned on the solder surface side of the substrate 71.

  In the present embodiment, an outer member 74 is disposed as a covering member in the high voltage power source 70, an exterior member 83 is disposed as the covering member in the power receiving unit 80, and a metal power feeding member 75 to which a high voltage is applied and Although the metal power receiving member 82 is configured not to be exposed, it is also conceivable that the covering member is disposed only in either the high voltage power supply 70 or the power receiving unit 80.

  Further, in the present embodiment, the plate-shaped metal power supply member 75 is disposed in the high voltage power supply 70 and the rod-shaped metal power reception member 82 is disposed in the power reception unit 80. It is conceivable that the metal power receiving member 82 is composed of a plate-shaped member. It is also conceivable that the metal power supply member 75 and the metal power receiving member 82 are composed of rod-shaped members. Even in such a modification, it is a condition that the metal power supply member 75 and the metal power receiving member 82 are covered (not exposed) by the outer member 74 or the exterior member 83 when contact power is supplied. .

  In the present embodiment, the notch 76 is formed in the substrate 71, but such a notch 76 is not formed in the substrate 71, and the metal feeding member 75 is formed from the peripheral edge of the rectangular substrate 71. A configuration in which it protrudes is also conceivable.

[Second Embodiment]
FIG. 5 is a diagram for explaining a positioning function of the high-voltage power supply 70 with respect to the power receiving unit 80 in the power supply device 62 according to the second embodiment, and each of (a) to (d) is one configuration thereof. An example is shown. The basic configuration of the power supply device 62 according to the present embodiment is the same as that of the power supply device 61 according to the first embodiment.
In the present embodiment, unlike the first embodiment in which the high-voltage power supply 70 is positioned with respect to the power receiving unit 80 by the engagement between the positioning hole 78 of the substrate 71 and the engaging projection 81, the notch of the substrate 71 is cut. A configuration is employed in which the high voltage power supply 70 is positioned with respect to the power receiving unit 80 by engagement of a portion or a through hole (hereinafter abbreviated as a notch) 76 and an exterior member 83. Therefore, in this embodiment, it is not necessary to form the positioning hole 78 in the substrate 71, and it is not necessary to provide the engaging convex portion 81 in the power receiving unit 80, so that a simple configuration can be achieved. Become. Needless to say, it is conceivable that the positioning function according to the present embodiment and the positioning function by the engagement between the positioning hole 78 and the engaging convex portion 81 in the first embodiment are combined.

  More specifically, in the configuration example shown in FIG. 5A, the notch 76 of the substrate 71 is formed by cutting it into a square shape from the edge, and crosses the exterior member 83 of the power receiving unit 80. It is formed in a planar circular cylindrical shape. For this reason, positioning of the high voltage power supply 70 with respect to the power receiving unit 80 is performed by the outer peripheral surface of the exterior member 83 being in contact with the peripheral portion of the notch 76.

  Further, in the configuration example shown in FIG. 5B, the notch portion 76 of the substrate 71 is formed by cutting the edge portion into a square shape, and the exterior member 83 of the power receiving unit 80 has a rectangular cross section. It is formed in a prismatic shape. The outer dimension of the exterior member 83 is slightly smaller than that of the cutout portion 76. For this reason, when the outer peripheral surface of the exterior member 83 comes into contact with the peripheral portion of the cutout portion 76, the power receiving of the high voltage power supply 70 is performed. Positioning with respect to the unit 80 is performed.

  In the configuration example shown in FIG. 5C, a part of the substrate 71 is cut out into a round shape to form a round cut-out portion 76, and the exterior member 83 of the power receiving unit 80 has a circular cross section. It is formed in a cylindrical shape. The outer diameter of the exterior member 83 is slightly smaller than that of the notch 76. For this reason, the outer peripheral surface of the exterior member 83 is in contact with the peripheral edge of the notch 76. Positioning with respect to the power receiving unit 80 is performed.

  In the configuration example shown in FIG. 5D, a part of the substrate 71 is cut into a rectangular shape to form a rectangular cutout portion 76, and the exterior member 83 of the power receiving unit 80 has a rectangular cross section. It is formed in a prismatic shape. The diagonal dimension of the exterior member 83 is slightly smaller than the notch 76, and therefore, the corner of the exterior member 83 comes into contact with the peripheral edge of the notch 76, thereby Positioning with respect to the power receiving unit 80 is performed.

[Third Embodiment]
FIG. 6 is a perspective view for explaining the configuration of the high voltage unit 73 in the power supply device 63 according to the third embodiment. The basic configuration of the power supply device 63 according to the present embodiment is the same as that of the power supply device 61 according to the first embodiment, and therefore, the same reference numerals are used and the description thereof is omitted.
As shown in FIG. 6, the outer member 74 of the high voltage portion 73 has a pair of claw portions (locking means, locking portions) 79 that engage with the peripheral edge portion of the notch portion 76 of the substrate 71. The pair of claw portions 79 are formed so as to extend further from the extending portion 77, and the outer member 74 is engaged with the substrate 71 by engaging with the solder surface of the substrate 71.

  The pair of claw portions 79 will be further described. As described above, in the high voltage unit 73, the metal power feeding member 75 (see FIG. 4B) of the high voltage power source 70 and the metal power receiving member 82 of the power receiving unit 80 (see FIG. 4B) are predetermined. It is comprised so that it may contact with the pressure of. Therefore, stress is applied to terminal pins (not shown) soldered to the high voltage portion 73 and solder land portions. That is, the high voltage portion 73 is in a so-called cantilever state by soldering a terminal pin (not shown), and the metal power feeding member 75 is located on the non-soldered side of the outer member 74. For this reason, stress in the direction away from the substrate 71 (direction of the mounting surface) is generated in the soldered portion of the high voltage portion 73. Therefore, in this embodiment, in order to reduce the stress, a pair of claw portions 79 is formed on the outer member 74 of the high voltage portion 73 and the extended portion 77 of the high voltage portion 73 is hooked on the substrate 71. A structure that can be supported is adopted.

  In the present embodiment, by adopting such a hook structure, it is possible to reduce an unnecessary load on the high voltage unit 73 that is not a structural member, and the product life of the power supply device 63 is shortened. It becomes possible to prevent.

1 is a diagram illustrating a configuration of an image forming apparatus to which the exemplary embodiment is applied. FIG. 2 is an exploded view for explaining a schematic configuration of a power supply device according to a first embodiment mounted in the image forming apparatus of FIG. 1. (A) And (b) is a figure which shows the state which attached the high voltage power supply to the receiving unit. (A) And (b) is a figure which shows the state which attached the high voltage power supply to the receiving unit. It is a figure for demonstrating the positioning function with respect to the receiving unit of the high voltage power supply in the power supply device which concerns on 2nd Embodiment, and each of (a)-(d) has shown the example of 1 structure. It is a perspective view for demonstrating the structure of the high voltage part in the power supply device which concerns on 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Image forming apparatus 61, 62, 63 ... Power supply device, 70 ... High voltage power supply, 71 ... Board | substrate, 72 ... Connector, 73 ... High voltage part, 74 ... Outer member, 75 ... Metal feeding member, 75a ... Contact feeding Surface, 76 ... Notch, 77 ... Extension part, 78 ... Positioning hole, 79 ... Claw part, 80 ... Power receiving unit, 81 ... Engaging convex part, 82 ... Metal power receiving member, 82a ... Contact power receiving surface, 83 ... Exterior member, S ... opening, T ... secondary transfer part

Claims (7)

A high voltage section for generating a high voltage;
A power feeding member that feeds the high voltage generated in the high voltage section;
A substrate having a first surface on which the high-voltage portion is located and a second surface opposite to the first surface;
A non-conductive power supply covering member that covers the high-voltage part and the power supply member and has an opening that opens on the second surface side in the thickness direction of the substrate;
A power receiving member that receives a high voltage from the second surface side of the substrate through the opening of the power supply covering member in contact with the power feeding member;
A non-conductive power receiving covering member that is positioned between the second surface of the substrate and the power receiving member and covers the power receiving member;
Including power supply. The substrate has a notch formed by cutting out the edge of the substrate, or a through hole is formed in a portion other than the edge,
The power supply device according to claim 1, wherein the power receiving coating member is positioned with respect to the substrate by being engaged with the notch portion or the through hole of the substrate.   The power supply apparatus according to claim 1, further comprising a locking unit that is disposed on the power supply covering member and locks the power supply covering member to the substrate. The first surface of the substrate is a mounting surface on which the high voltage part is mounted,
The power supply device according to claim 1, wherein the second surface of the substrate is a solder surface on which the high voltage portion is soldered. A power supply device including a high voltage power supply and a power receiving unit connected to the high voltage power supply,
The high voltage power supply is
A high voltage section for generating a high voltage;
A first surface on which the high voltage portion is located and a second surface opposite to the first surface, and the second surface is connected to the power receiving unit when the high voltage power source and the power receiving unit are connected to each other. A substrate located on the side of the
A power feeding surface having a contact power feeding surface for feeding a high voltage generated by the high voltage unit, and the contact power feeding surface faces the direction of the power receiving unit when the high voltage power source and the power receiving unit are connected to each other. Members,
With
The power receiving unit includes a power receiving member having a contact power receiving surface that receives a high voltage in contact with the contact power feeding surface of the power feeding member,
A non-conductive covering member that covers the power feeding member and the power receiving member disposed in the high voltage power source and / or the power receiving unit and in which the contact power feeding surface and the contact power receiving surface are in contact with each other; A power supply device characterized by that. And further including a locking portion that locks the substrate, supporting the force from the second surface of the substrate to the first surface with the covering member,
The power supply apparatus according to claim 5, wherein the locking portion is formed on the covering member disposed in the high voltage power source. An image carrier,
Charging means for charging the image carrier;
Developing means for developing the electrostatic latent image formed by the image carrier with a developer;
Transfer means for transferring the toner image held on the image carrier by the developing means to a recording medium;
Fixing means for fixing the toner image transferred by the transfer means to a recording medium;
A power supply device for supplying a high voltage to at least one of the charging unit, the developing unit, the transfer unit, and the fixing unit;
Including
The power supply device
A high voltage section for generating a high voltage;
A power feeding member that feeds the high voltage generated in the high voltage section;
A substrate having a mounting surface on which the high voltage portion is mounted and a solder surface on which the high voltage portion is soldered;
A non-conductive power supply covering member that covers the high voltage portion and the power supply member and has an opening that opens on the solder surface side in the thickness direction of the substrate;
A power receiving member that receives a high voltage in contact with the power feeding member from the solder surface side of the substrate through the opening of the cover member;
A non-conductive power receiving covering member that is located between the solder surface of the substrate and the power receiving member and covers the power receiving member;
An image forming apparatus comprising:

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