JP2009122081A - Semiconductor acceleration sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means of automatically releasing adhesion state, when adhesion between a plumb section and a stopper, due to excess acceleration imposed on a semiconductor acceleration sensor. <P>SOLUTION: The semiconductor acceleration sensor is a semiconductor acceleration sensor which is equipped with a based case, a lid attached to top surface of the case, a frame-shaped fixed part contained in a space formed with the case and the lid, a plumb section, supported at a center of the fixed part swingably by a flexible section, and a sensor chip with a stopper restricting upward displacement of the plumb section. The sensor has alid formed of a magnetic material, possesses a first coil which is wound on the perimeter of the lid by at least one round and deploys a second coil, with one or more winding numbers at the center part of the top surface of the plumb section facing the undersurface of the lid. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor acceleration sensor that is mounted on a device such as a transport device such as an automobile or an aircraft, or a portable device such as a mobile phone, and is used for measuring acceleration or collision.

  A conventional semiconductor acceleration sensor is formed at a rectangular frame-shaped fixed portion made of silicon, with a weight portion that is swingably supported by a flexible portion arranged in a cross shape, and four corners of the fixed portion. The sensor chip having a stopper for restricting the upward movement of the weight portion is housed in a space formed by a frame-shaped bottomed case and a flat lid attached to the upper surface thereof. Further, by causing the weight portion to collide with the stopper and restricting excessive displacement of the weight portion upward, damage to the sensor chip due to excessive acceleration is prevented (for example, see Patent Document 1).

In addition, when performing an acceleration detection test of the sensor chip, an electrode layer is formed on the lower surface of the control member that functions as a stopper for restricting the upward movement of the weight portion, and the flexible portion facing this is formed. An electrode layer is also formed on the upper surface, electrification of the same or different polarity is applied between the opposing electrode layers, and the flexible part is deformed by utilizing the repulsive force or attractive force caused by the Coulomb force, thereby the sensor chip. In some cases, a sensor chip is tested by using a signal output from (see, for example, Patent Document 2).
JP 2002-198243 A (mainly, page 5 paragraphs 0020-0025, page 7 paragraphs 0041 and 0044, FIGS. 1 and 2) Japanese Patent Laid-Open No. 3-200038 (mainly page 8 upper left column-page 9 upper right column, FIGS. 9 and 12)

  However, in the technique of the above-mentioned conventional patent document 1, since the weight portion collides with stoppers provided at the four corners of the fixed portion to prevent excessive displacement of the weight portion, the semiconductor When excessive acceleration is applied to the acceleration sensor and the weight part collides with the stopper, the weight part and the stopper may adhere to each other. However, there is no means for releasing the adhesion state, and there is a problem that the signal output from the sensor chip is fixed and the acceleration cannot be detected.

  The present invention has been made to solve the above-described problems, and when the semiconductor acceleration sensor is adhered to the weight portion and the stopper due to excessive acceleration, the adhesion state is automatically released. It aims at providing the means to do.

  In order to solve the above-mentioned problem, the present invention has a bottomed case, a lid attached to the upper surface of the case, a space formed by the case and the lid, a frame-shaped fixing portion, A semiconductor acceleration sensor comprising: a weight portion that is swingably supported by a flexible portion at the center of the fixed portion; and a sensor chip having a stopper that restricts the upward movement of the weight portion. The lid is made of a magnetic material, provided with a first coil that winds at least one turn around the lid, and has one or more turns at the center of the upper surface of the weight portion facing the lower surface of the lid. A second coil having the above is provided.

  Accordingly, in the present invention, when adhesion occurs between the weight portion and the stopper, a current is passed through the first and second coils to generate a repulsive force between the weight portion and the stopper. When the adhesion between the weight portion and the stopper due to excessive acceleration occurs in the semiconductor acceleration sensor, the effect of automatically releasing the adhesion state using the repulsive force is obtained. .

  Embodiments of a semiconductor acceleration sensor according to the present invention will be described below with reference to the drawings.

1 is an explanatory view showing a cross section of the semiconductor acceleration sensor of the embodiment, FIG. 2 is an explanatory view showing an assembled state of the semiconductor acceleration sensor of the embodiment, FIG. 3 is an explanatory view showing an upper surface of the sensor chip of the embodiment, and FIG. These are explanatory drawings which show the control system of the semiconductor acceleration sensor of an Example.
The cross section of the sensor chip shown in FIG. 1 is shown as a cross section taken along the line AA shown in FIG.

1 and 2, reference numeral 1 denotes a semiconductor acceleration sensor.
Reference numeral 2 denotes a case, which is a bottomed frame-like member having a bottom plate 3 made of a ceramic material or the like, and a side wall 4 formed in a frame shape surrounding the rectangular bottom plate 3 is provided on the opening side thereof. A conductive plug 6 embedded in a through hole reaching the internal terminal 5 formed on the side of the bottom plate 3 from the upper surface 4a is formed, and the inner space surrounded by the bottom plate 3 and the side wall 4 is the sensor chip 10 or It functions as a chip storage space for storing the control chip 20.

  Reference numeral 7 denotes a lid, which is a plate-like member formed of a thin plate of magnetic material, and is joined to the upper surface 4a of the side wall 4 of the case 2 by a joining member such as an adhesive, A covered conductor such as a wire is wound to form a first coil 8 of one turn, and both end portions of the conductive plug 6 are exposed at the upper surface 4a of the side wall 4 of the case 2 (see FIG. 2). Is electrically connected.

The lid 7 and the first coil 8 form a centered first electromagnet 9a.
The sensor chip 10 utilizes a change in the equilibrium state of the bridge circuit 12 (see FIG. 4) formed by the piezoresistive element 11 with the three-axis acceleration component composed of the X axis, the Y axis, and the Z axis orthogonal to each other. Sensor.
In FIG. 3, reference numeral 13 denotes a fixing portion of the sensor chip 10, which is a substantially square bottomed frame-shaped member made of silicon (Si) that forms the peripheral portion of the sensor chip 10. A weight portion 15 suspended from a flexible portion 14 made of thin silicon is accommodated in a swingable manner.

  The weight portion 15 of the present embodiment is configured by forming four weight portions 15b at each corner of a substantially square weight support portion 15a disposed at the center portion inside the fixed portion 13, and supporting the weight. The portion 15a is connected to the flexible portion 14, and the upper surface thereof is flush with the upper surface of the fixed portion 13 and the upper surface of the flexible portion 14, and the upper surface of the weight portion 15b is from the upper surface of the weight support portion 15a. It is formed one step lower (see FIG. 1).

In addition, a piezoresistive element 11 (not shown in FIG. 2) for forming the bridge circuit 12 is formed in each of the flexible portions 14 fixed to the centers of the four sides of the fixed portion 13.
Reference numeral 16 denotes a core, which is a rectangular thin plate made of a magnetic material attached to the central portion of the upper surface of the weight support portion 15a of the weight portion 15 by adhesion or the like, and has a conductive material such as aluminum (Al) around it. The second coil 17 having one or more turns (2.5 turns in the present embodiment) made of the metal wiring formed in the above is formed, and both end portions thereof are connected to the connection wiring 18 formed on the flexible portion 14, respectively. Connected.

The core 16 and the second coil 17 form a centric second electromagnet 9b.
The second coil 17 of this embodiment is formed on a part or all of the upper surface of the weight support portion 15a according to the magnetic field to be generated.
Reference numeral 19 denotes a stopper, which is formed at four corners on the inner side of the fixed portion 13 in a right-angled triangle shape having the corners as apexes. It faces the upper surface of the weight portion 15b through a predetermined gap C (2 to 5 μm in this embodiment), and the weight portion 15 moves upward due to excessive acceleration applied to the sensor chip 10. Occasionally, the 1 to 4 weight portions 15b collide to prevent the flexible portion 14 from being excessively deformed.

1 and 4, reference numeral 20 denotes a control chip such as an LSI (Large Scale Integrated Circuit), which is bonded to the bottom plate 3 of the case 2 by an adhesive layer 21 formed of an adhesive or the like, and a sensor chip is bonded to the upper surface thereof. The lower surface of 10 is joined by an adhesive layer 22 formed of an adhesive or the like.
In FIG. 4, reference numeral 23 denotes a control unit of the control chip 20, which controls each unit in the control chip 20 and executes an adhesion release process and the like.

A storage unit 24 stores a program executed by the control unit 23, various data used for the program, processing results by the control unit 23, and the like.
A clock unit 25 includes a frequency generator having a crystal oscillator and the like, and has a function of counting time based on the generated frequency and outputting it to the control unit 23.
Reference numeral 26 denotes an amplifier, which is internally connected to a bridge circuit 12 formed for detecting accelerations in the X-axis direction, Y-axis direction, and Z-axis direction, and has a function of amplifying these signal outputs. It is connected to the control unit 23 via a converter 27 and an AD converter 28.

Further, the controller 23 supplies current to the interface circuit 31 for transmitting / receiving signals to / from the outside and the first coil 8 and the second coil 17 through the external terminal 29 (see FIG. 2). For this purpose, a current generating circuit 32 is connected.
Further, the control unit 23 is communicably connected to a main control unit of a device (not shown) as a host device equipped with the semiconductor acceleration sensor 1 of the present embodiment.

  When assembling the semiconductor acceleration sensor 1 having the above-described configuration, as shown in FIGS. 1 and 2, the lower surface of the control chip 20 is joined to the central portion of the bottom plate 3 of the case 2 by the adhesive layer 21, and the control chip 20 The sensor chip 10 is bonded and laminated to the upper surface of the control chip 20 by an adhesive layer 22, and pads (not shown) of the control chip 20 and internal terminals (not shown) connected to the internal terminals 5 and the external terminals 29 are gold (Au) by wire bonding. The control chip 20 in which the sensor chip 10 is laminated in the chip housing space of the case 2 is installed by connecting the wires 34 made of a conductive material such as the conductive material, and the upper surface 4a of the side wall 4 of the case 2 The lower surface of the lid 7 on which the first coil 8 is formed is attached by bonding with a bonding member, and both end portions of the first coil 8 are respectively connected to the end surfaces of the conductive plug 6 on the upper surface 4a of the side wall 4 of the case 2. Electrically connected by solder or the like.

Thereby, the semiconductor acceleration sensor 1 shown in FIG. 1 is opposed to the lower surface of the lid 7 and the upper surface of the weight support portion 15a of the weight portion 15 with a predetermined distance K (30 to 200 μm in this embodiment). Is assembled and the control system shown in FIG. 4 is connected.
The storage unit 24 of the control chip 20 detects the signal output of the bridge circuit 12 for the X-axis, Y-axis, and Z-axis from the sensor chip 10 and determines whether the signal output is a positive or negative approach. When the signal output is out of the range, the maintenance time during which the signal output is out of the range is measured, and when the measured maintenance time is equal to or greater than the abnormality determination time, the weight 15 and the stopper 19 are not fixed. An adhesion release processing program having a function of supplying a current for forming a magnetic field in a direction in which the first and second coils 8 and 17 repel each other is determined in advance, and is stored in the control unit 23. Each function means as hardware of the semiconductor acceleration sensor 1 of the present embodiment is formed by the steps of the adhesion release processing program executed by.

The storage unit 24 also includes an approach determination value for detecting the approach of the weight 15 to the stopper 19 and an abnormality determination for determining that the upper surface of the weight 15 and the lower surface of the stopper are adhered. The time and the non-release determination time for determining that the adhesion is not released are preset and stored.
In this embodiment, as an approach determination value, a positive or negative signal output of acceleration in the range of 70 to 90% of the maximum signal output when the upper surface of the weight portion 15 and the lower surface of the stopper abut (in this embodiment, approximately ± 2.5G corresponding to ± 80%) is set, 1 second is set as the abnormality determination time, and 1 second is set as the non-cancellation determination time.

The operation of the adhesion release process in the semiconductor acceleration sensor of this embodiment will be described below according to the step indicated by S in FIG.
When power is turned on to the control chip 20, the adhesion release processing program stored in the storage unit 24 of the control chip 20 is automatically activated.
S1, When the adhesion release processing program is activated, the control unit 23 reads the approach determination value stored in the storage unit 24, detects the signal output from the sensor chip 10, and detects the detected signal output and the positive / negative Compared to the approach judgment value, the signal output is outside the range of the approach judgment value exceeding either the positive or negative approach judgment value (refers to an area that is greater than or equal to the positive approach judgment value and less than or equal to the negative approach judgment value). After waiting, the process proceeds to step S2 when the signal output falls outside the range of the approach determination value.

When the signal output is within the range of the approach determination value, the standby is continued.
S2, the control unit 23 that has recognized that the signal output has exceeded either the positive or negative approach determination value, reads the abnormality determination time stored in the storage unit 24, and the clock unit 25 determines whether the signal output is approaching. The measurement of the maintenance time T from when the value is out of the range starts, and the process proceeds to step S3.

  In S3, the control unit 23 that has started measuring the maintenance time T uses the clock unit 25 to measure the maintenance time T in which the signal output is outside the range of the approach determination value, while the measured maintenance time T is read out. Waiting for the determination time to be exceeded, and waiting, and when the maintenance time T is equal to or greater than the abnormality determination time, it is determined that adhesion has occurred between the weight portion 15 and the stopper 19 and the process proceeds to step S4. Transition.

If the signal output passes through the positive or negative approach judgment value that was exceeded when the maintenance time T reaches the abnormality judgment time and is within the approach judgment value range, it is normal. It determines with an action | operation and returns to step S1, and said process is continued.
This state will be described with reference to the graph of the change in signal output with the lapse of time shown in FIG. Since the maintenance time T2 when the approach determination value is exceeded is both less than the abnormality determination time, the maintenance time when the positive approach determination value is exceeded again after measuring the maintenance time T2 after determining the normal operation. Since T is longer than the abnormality determination time, it is determined that adhesion has occurred.

For example, as shown in FIG. 7, an excessive acceleration is applied in the X-axis direction or the Y-axis direction, and the corner of the weight portion 15b on the fixed portion 13 side of the weight portion 15b It occurs when it hits the lower surface of 19.
S <b> 4, the control unit 23 that has determined that adhesion has occurred, the first coil 8 formed around the lid 7 and the core 16 on the upper surface of the weight support unit 15 a of the weight unit 15 by the current generation circuit 32. For example, the first coil 8 shown in FIG. 2 has a first coil 8 in the clockwise direction as viewed from above. A current is supplied to the second coil 17 so as to flow counterclockwise as viewed from above.

Thereby, the adhesion between the weight portion 15 and the stopper 19 can be released by using the repulsive force generated between the first and second coils 8 and 17.
In this case, it is preferable to stop the operation of arithmetic circuits or the like that are not used for the adhesion release processing of the control chip 20. In this way, it is possible to suppress the influence of current due to electromagnetic induction generated by the magnetic field generated by the first and second coils 8 and 17.

  Then, the control unit 23 reads the non-cancellation determination time stored in the storage unit 24 and measures the elapsed time from the time when the clock unit 25 has measured the elapsed time since the adhesion is determined. Waiting for the release determination time or more to wait, and when the elapsed time exceeds the non-release determination time, it is determined that the adhesion between the weight portion 15 and the stopper 19 cannot be released, and the process proceeds to step S6. .

Before the elapsed time reaches the non-cancellation judgment time, the signal output passed the positive or negative approach judgment value that was exceeded when it was out of the approach judgment value range, and was within the approach judgment value range. In this case, it is determined that the adhesion has been released, the supply of current to the first and second coils 8 and 17 is stopped, the process returns to step S1 and the above processing is continued.
S6, the control unit 23 that has determined that the adhesion cannot be released stops the supply of current to the first and second coils 8 and 17, and does not show an adhesion occurrence notification indicating the occurrence of adhesion. It transmits to the main control part of a high-order apparatus, and complete | finishes an adhesion cancellation | release process.

In this way, the adhesion release process of the present embodiment is executed.
As described above, in this embodiment, the first coil is provided around the lid made of a magnetic material attached to the upper surface of the case, and the sensor is housed in the chip housing space formed by the case and the lid. When the second coil is provided at the center of the upper surface of the weight portion facing the lower surface of the lid of the chip, when adhesion occurs between the weight portion and the stopper, the first and second A repulsive force can be generated between the weight part and the stopper by passing a current through the coil, and when the semiconductor accelerometer adheres to the weight part and the stopper due to excessive acceleration, the repulsion occurs. The adhesive state can be automatically released using force.

Further, when the signal output from the sensor chip is out of the range of the approach determination value, the maintenance time T that is outside the range of the approach determination value is measured, and the maintenance time T becomes equal to or longer than the abnormality determination time. In this case, since it is determined that adhesion has occurred between the weight portion and the stopper, it is possible to easily and reliably determine the adhesion state by eliminating the instantaneous abnormal state.
In the above embodiment, the core made of the magnetic material is provided in the region surrounded by the second coil on the upper surface of the weight portion. However, the installation of the core may be omitted.

Moreover, in the said Example, although the 1st coil demonstrated as 1 turn, 2 or more turns may be sufficient.
Further, the control chip has been described as being disposed inside the case. However, the control chip is disposed outside the case to detect signal output and supply current to the first and second coils via the external terminals. May be performed.

Explanatory drawing which shows the cross section of the semiconductor acceleration sensor of an Example Explanatory drawing which shows the assembly state of the semiconductor acceleration sensor of an Example. Explanatory drawing which shows the upper surface of the sensor chip of an Example Explanatory drawing which shows the control system of the semiconductor acceleration sensor of an Example The flowchart which shows the adhesion cancellation process of an Example The graph which shows the change of the signal output of the sensor chip of an Example Explanatory drawing which shows the adhesion state of the sensor chip of an Example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor acceleration sensor 2 Case 3 Bottom plate 4 Side wall 4a Upper surface 5 Internal terminal 6 Conductive plug 7 Cover 8 1st coil 9a 1st electromagnet 9b 2nd electromagnet 10 Sensor chip 11 Piezoresistive element 12 Bridge circuit 13 Fixed part 14 Possible Flexible part 15 Weight part 15a Weight support part 15b Weight part 16 Core 17 Second coil 18 Connection wiring 19 Stopper 20 Control chip 21, 22 Adhesive layer 23 Control part 24 Storage part 25 Clock part 26 Amplifier 27 DA converter 28 AD converter 29 External Terminal 31 Interface Circuit 32 Current Generation Circuit 34 Wire

Claims (4)

A bottomed case,
A lid attached to the upper surface of the case;
Housed in a space formed by the case and the lid, a frame-shaped fixed part, a weight part supported by a flexible part in a swingable manner at the center of the fixed part, and above the weight part A semiconductor acceleration sensor comprising: a sensor chip having a stopper that restricts movement of
The lid is formed of a magnetic material, and a first coil that winds around the lid at least once is provided,
A semiconductor acceleration sensor, wherein a second coil having one or more turns is provided at the center of the upper surface of the weight portion facing the lower surface of the lid. In claim 1,
A semiconductor acceleration sensor, wherein a control chip for controlling a current supplied to the first and second coils is disposed between a bottom surface of the case and the sensor chip. A bottomed case,
A lid made of a magnetic material attached to the upper surface of the case;
A first coil that winds around the lid at least once;
Housed in a space formed by the case and the lid, a frame-shaped fixed part, a weight part supported by a flexible part in a swingable manner at the center of the fixed part, and above the weight part A sensor chip having a stopper for restricting movement of the second coil, and a second coil having one or more turns at the center of the upper surface of the weight portion facing the lower surface of the lid;
A semiconductor acceleration sensor comprising: a control chip that is disposed between the bottom surface of the case and the sensor chip and controls a current supplied to the first and second coils;
The control chip is
Means for storing an abnormality determination time for determining adhesion between the weight part and the stopper, and a positive / negative approach determination value for detecting the approach of the weight part to the stopper;
Means for detecting a signal output from the sensor chip;
Means for measuring a maintenance time that is outside the range of the approach determination value when the signal output is outside the range of the approach determination value;
Means for supplying a current for forming a magnetic field in a direction to repel each other to the first and second coils when the maintenance time is equal to or longer than the abnormality determination time. Semiconductor acceleration sensor. In any one of Claims 1 to 3,
A semiconductor acceleration sensor, wherein a core made of a magnetic material is provided in a region surrounded by a second coil on an upper surface of the weight portion.