JP2009117507A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device where an antenna is arranged on a semiconductor chip. <P>SOLUTION: The semiconductor device includes a loop antenna 30 and a second insulating layer 15; the loop antenna 30 includes a semiconductor chip 100, including a power circuit section 120 and a transmission/reception circuit section 110, a first insulating layer 10 formed on the semiconductor chip 100, loop-like wiring of which one end is connected to a first terminal T1 and the other end is connected to a second terminal T2, and a capacitor C1 connected between the first terminal T1 and the second terminal T2; the second insulating layer 15 is formed in a shape including a region occupied by the loop antenna between the first insulating layer 10 and the loop antenna 30; and in the semiconductor device 1, the first terminal T1 and the second terminal T2 are connected to the power circuit section 120 and the transmission/reception circuit section 110. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a power supply voltage supply and data transmission / reception by electromagnetic induction.

  For example, various memory cards are known as storage devices capable of recording / saving various data. This type of storage device includes a contact type microcomputer card with a built-in CPU and a non-contact type wireless card that transmits and receives information by radio waves. Therefore, it is widely used in a form corresponding to the above characteristics and advantages. In the case of a contactless wireless card, it is necessary to install a semiconductor chip and an antenna in the card and receive both power and data.

  For example, Patent Documents 1 to 3 describe a method of configuring a semiconductor chip and an antenna separately. However, in these conventional methods, it is necessary to provide a wiring layer for connecting the antenna and the semiconductor chip, which increases the number of parts, increases the number of assembly steps, and increases the cost.

  In order to solve this problem, for example, Patent Document 4 describes a method of disposing an antenna on a semiconductor chip via an insulating layer.

JP-A-7-176646 Japanese Patent No. 3549104 Japanese Patent No. 3800884 Japanese Patent No. 3377786

  However, in the conventional method, since the antenna coil is wound in multiple layers, there is a problem in that transmission efficiency is poor because a large amount of capacitor capacity is attached to the semiconductor chip.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
A semiconductor chip including a power supply circuit portion and a transmission / reception circuit portion, a first insulating layer formed on the semiconductor chip, and a loop shape having one end connected to the first terminal and the other end connected to the second terminal A loop antenna including wiring, a capacitor connected between the first terminal and the second terminal, and a region occupied by the loop antenna between the first insulating layer and the loop antenna. A semiconductor device, wherein the first terminal and the second terminal are connected to the power supply circuit portion and the transmission / reception circuit portion.

  According to this configuration, since power can be supplied and transmitted / received by a loop antenna with one semiconductor device, the number of assembling steps and the cost can be reduced. In addition, since the distance between the semiconductor chip and the loop antenna can be increased by the second insulating layer, the capacitance of the capacitor can be reduced and transmission / reception efficiency can be increased. Furthermore, since the second insulating layer is formed in the minimum necessary area under the loop antenna, the semiconductor chip is prevented from warping compared to the case where two insulating layers are applied to the entire surface of the semiconductor chip. Can do.

  Hereinafter, embodiments of a semiconductor device will be described with reference to the drawings.

(First embodiment)
<Configuration of semiconductor device>
First, the configuration of the semiconductor device according to the first embodiment will be described with reference to FIG. FIG. 1A is a perspective view showing the configuration of the semiconductor device according to the first embodiment, and FIG. 1B is a cross-sectional view taken along the line AA ′ showing the configuration of the semiconductor device.

  As shown in FIGS. 1A and 1B, in the semiconductor device 1, a first insulating layer 10 such as a stress relaxation resin is applied on a semiconductor chip 100 including a power supply circuit unit 120 and a transmission / reception circuit unit 110. A loop antenna 30 composed of a loop-shaped wiring having one end connected to the first terminal T1 and the other end connected to the second terminal T2, and a capacitor C1 of the first terminal T1 and the second terminal T2, A second insulating layer 15 formed in a shape including a region occupied by the loop antenna 30 between the first insulating layer 10 and the loop antenna 30; a first insulating layer 10; a second insulating layer 15; A protective resin 20 is applied on the loop antenna 30.

  The loop antenna 30 and the capacitor C1 operate as an LC parallel oscillation circuit connected in parallel to the first terminal T1 and the second terminal T2.

  FIG. 2 is a circuit diagram of the semiconductor device. As shown in FIG. 2, the first terminal T <b> 1 and the second terminal T <b> 2 of the loop antenna 30 are connected to the amplifier 121 that constitutes the power supply circuit unit 120, amplifies the power received by the loop antenna 30, and outputs it to the power supply circuit 122. To do.

  The first terminal T1 and the second terminal T2 of the loop antenna 30 are also connected to the amplifier 111 constituting the transmission / reception circuit unit 110, and amplify the data received by the loop antenna 30 and output the amplified data to the transmission / reception circuit 112.

  According to the present embodiment described above, the following effects can be obtained.

  In the present embodiment, since power can be supplied and data can be transmitted and received by the loop antenna in one semiconductor device 1, assembly man-hours and costs can be reduced. In addition, since the distance between the semiconductor chip and the loop antenna can be increased by the second insulating layer, the capacitance of the capacitor can be reduced and transmission / reception efficiency can be increased. Furthermore, since the second insulating layer is formed in the minimum necessary area under the loop antenna, the semiconductor chip is prevented from warping compared to the case where two insulating layers are applied to the entire surface of the semiconductor chip. Can do.

  As mentioned above, although embodiment of the semiconductor device was described, it is not limited to such embodiment at all, It can implement in various forms within the range which does not deviate from the meaning. Hereinafter, a modification will be described.

  (Modification 1) Modification 1 of the semiconductor device will be described. In the first embodiment, the loop antenna 30 has been described as a square shape in accordance with the chip shape, but it may be circular or elliptical.

1A is a perspective view illustrating a configuration of a semiconductor device according to a first embodiment, and FIG. 3B is a cross-sectional view illustrating a configuration of the semiconductor device. 1 is a circuit diagram of a semiconductor device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 10 ... 1st insulating layer, 15 ... 2nd insulating layer, 20 ... Protection resin, 30 ... Loop antenna, 100 ... Semiconductor chip, 110 ... Transmission / reception circuit part, 111 ... Amplifier, 112 ... Transmission / reception Reference numeral 120 denotes a power supply circuit unit, 121 denotes an amplifier, and 122 denotes a power supply circuit.

Claims (1)

A semiconductor chip including a power supply circuit section and a transmission / reception circuit section;
A first insulating layer formed on the semiconductor chip;
A loop antenna including a loop-shaped wiring having one end connected to the first terminal and the other end connected to the second terminal; and a capacitor connected between the first terminal and the second terminal;
A second insulating layer formed in a shape including a region occupied by the loop antenna between the first insulating layer and the loop antenna;
Including
The first terminal and the second terminal are connected to the power supply circuit unit and the transmission / reception circuit unit,
A semiconductor device.

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