JP2009117495A - Package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package on which a different package is to be loaded, capable of surely withstanding impacts or loads that the package itself receives from the outside (including the other packages), when it drops off, or the like, in a state where a plurality of packages are stacked and mounted on a printed board, or the like. <P>SOLUTION: The package P1, on which a different package P2 is loaded includes, the package body 2 provided with a front surface 3 and a back surface 4 and constituted of ceramic (insulator); a cavity 5 opened to the front surface 3 of the package body 2; a plurality of metal layers 10 formed in the vicinity of every corner on the front surface 3 of the package body 2; and projection parts 12 and 14, provided between the mutually adjacent metal layers 10 among the plurality of metal layers 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is a package in which another package is mounted on the outside, and the package itself mounted on the printed circuit board with the other package mounted is received when the package itself is dropped (including another package). The present invention relates to a package that can withstand an impact or load from

The lower layer side and upper layer side ceramic packages having a box shape as a whole and having cavities inside are laminated, and the circuit element mounted on the lower layer ceramic package and the crystal resonator element mounted on the upper layer ceramic package are mutually connected. A crystal oscillator made conductive through electrode pads of both connected packages is used.
In such a crystal oscillator, in order to prevent a coupling phenomenon occurring between both packages when mounting an upper-layer crystal resonator (ceramic package) with a crystal resonator element mounted on a lower-layer ceramic package, When the position of the electrode pad is changed, the directionality is restricted when mounting the crystal resonator.

In order to prevent the coupling phenomenon and to eliminate the restriction of directionality when the crystal resonator (ceramic package) is mounted, two electrode pads and a dummy electrode that are electrically connected to the crystal resonator element on the outer bottom surface of the crystal resonator on the upper layer side There has been proposed a crystal oscillator in which a pad and a ground electrode pad are arranged, and two electrode pads corresponding to the electrode pad and a ground electrode pad are arranged on the upper surface of a lower ceramic package (see Patent Document 1). .
JP 2003-158441 A (pages 1 to 7, FIGS. 1 to 4)

  By the way, the upper layer side and the lower layer side ceramic packages are packaged such as in a two-stage stack in which the opposing metal layers provided near the corners of the bottom and top surfaces of both packages are laminated by soldering. Impact tests and load tests with weights are performed. When undergoing such a test, the lower package can resist an impact or a load near each corner where the metal layer is formed, but on the other hand, a crack occurs at an intermediate position except for each corner of the package. There was a risk that the strength would be insufficient.

  The present invention solves the problems described in the background art, and is a package in which another package is mounted on the upper side. A plurality of packages are stacked and mounted on a printed circuit board or the like, and the package itself drops. It is an object of the present invention to provide a package that can reliably withstand an impact or load received from the outside (including another package) from time to time.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problem, the present invention has been conceived by forming a convex portion between a plurality of metal layers on the surface (upper surface) of a package on which another package is mounted. It is.
That is, a package according to the present invention (Claim 1) is a package on which another package is mounted, and has a front surface and a back surface, and is opened on the front surface of the package main body made of an insulating material. It includes a cavity, a plurality of metal layers formed on the surface of the package body, and a protrusion provided between adjacent metal layers among the plurality of metal layers.

  According to this, since the convex portion is formed on the surface of the package body between the plurality of adjacent metal layers, it is mounted on a printed circuit board or the like in a state where another package is mounted above the package. When an impact test by dropping or a load test by weight is taken, the package itself can easily withstand an impact load or the like without causing cracks at positions between a plurality of metal layers in the package. Therefore, it is possible to improve the reliability of this package, another package, and a package stack in which these electronic components are stacked and the electronic components mounted in the cavities of each package are electrically connected.

The insulating material forming the package body is a high-temperature fired ceramic such as alumina, a low-temperature fired ceramic such as glass-ceramic, or an epoxy resin.
The plurality of metal layers are electrode pads that are electrically connected to external electrodes located on the bottom surface of another package, and are formed in the vicinity of each corner on the surface of the package, and the insulating material of the package body is fired at a high temperature. In the case of ceramic, it is made of W or Mo, and in the case of low-temperature fired ceramic or resin, it is made of Cu or Ag.
Furthermore, the said convex part consists of a ceramic or a conductor, and in the case of a conductor, it consists of the same or the same kind of metal or alloy as the metal or alloy which forms the said metal layer.
The “adjacent” metal layers refer to a plurality of metal layers closest to each other on the surface of the package body.
Further, the other package is provided above the surface of the package body through the metal layers, solder disposed on the metal layers, and external electrodes formed on the back surface of the other package. Stacked and mounted so as to be conductive with the package. Such another package is not limited to a single package, and includes a plurality of packages that are conductively stacked.
In addition, electronic components such as an IC element, a crystal resonator, and a piezoelectric resonator are mounted and stored in the cavity.

The present invention also includes a package (Claim 2) in which the height of the convex portion is lower than the height of the metal layer.
According to this, when another solder is printed on the metal layer on the surface of the package in order to mount another package above the package, the height of the convex portion is higher than the height of the metal layer. Since it is low, the printing metal mask does not interfere with the convex portion, and the solder can be printed reliably. And since the height of a convex part is low, it also becomes possible to suppress the change of the shape of this package.
The height of the convex portion refers to the highest portion among the plurality of convex portions provided on the surface of the package body, and the height of the metal layer is the highest among the plurality of metal layers. Refers to the site.

Furthermore, the present invention includes a package (Claim 3) in which a gap is located between the convex portion and the metal layer.
According to this, when the adjacent convex part and metal layer overlap at the time of manufacture, it is possible to reliably prevent a situation in which an overlapping part having an excessive thickness is formed, and when another package is mounted on the upper side. In addition, the solder formed between the metal layer and the external electrode facing each other between the two packages can have a predetermined thickness. Therefore, it becomes easy to mount another package in a horizontal posture above the package.
And in the form which the said convex part consists of a conductor, the short circuit by the overlap or contact of this convex part and a metal layer can also be prevented.

In addition, the present invention includes a package (claim 4) in which at least a part of a surface of the package main body protrudes.
According to this, by firing together the ceramic material that will be the package body and the convex part, or by integrating the resin that will be the convex part on the surface of the resin layer that will be the package body, It can be a package body including a convex portion that can easily withstand the impact load. In addition, since the convex portion and the package main body are integrated, it is possible to prevent the convex portion from dropping from the package main body due to the stress caused by the difference in thermal expansion caused by different materials.

Furthermore, the present invention includes a package (Claim 5) in which the convex portion is formed of a ceramic having a firing temperature substantially the same as the ceramic forming the package body or a ceramic having a lower firing temperature. .
According to this, the ceramic material that becomes the package body and the convex part is formed by simultaneous firing, or the ceramic material that becomes the convex part is fired on the surface of the fired package body, thereby integrating with the package body. Can be provided.
Furthermore, since the convex part and the package main body are integrated, it is possible to prevent the convex part from falling off due to the stress caused by the thermal expansion difference. In addition, since the firing temperature of the convex portion is substantially the same as or lower than the firing temperature of the package body, the convex portion and the package body can be fired simultaneously, and the manufacturing method becomes easy.

In addition, according to the present invention, the cavity of the package is filled with sealing resin after an electronic component is mounted on the bottom surface, and the cavity formed in the other package has an opening portion. A package (Claim 6) is also included.
According to this, after mounting and storing the electronic components on the bottom surface of this package, the rest is filled with sealing resin, and the cavity of another package mounts and stores the electronic components on the bottom surface. After that, the opening is sealed with a cover plate. Therefore, since the plurality of electronic components mounted for each cavity of each package are reliably shielded from the outside, the required operations can be performed accurately.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a perspective view showing one form of a package P1 according to the present invention, another package P2 mounted thereon, and a cover plate L that seals an opening of a cavity 5 of the package P2. FIG. FIG. 3 is a plan view of the package P1.
As shown in FIGS. 1 and 2, the package P1 is made of ceramic (insulating material), and has an overall rectangular parallelepiped package body 2 having a front surface 3 and a rear surface 4 in plan view, and the surface of the package body 2. A plurality of (four) metal layers (electrode pads) 10 formed in the vicinity of each corner on the surface 3 having a rectangular frame shape in plan view, and the plurality of metal layers 10. Among these, a plurality of convex portions 12 and 14 provided on the surface 3 between the adjacent metal layers 10 and 10 are provided.

The ceramic forming the package body 2 is a high-temperature fired ceramic such as alumina, or a low-temperature fired ceramic such as glass-ceramic.
The cavity 5 includes a bottom surface 6 that is rectangular in plan view and four side surfaces 7 that surround the bottom surface 6. Electrodes 8 are formed at the four corners of the bottom surface 6 of the cavity 5 for electrical connection with electronic components to be mounted later.
Further, the plurality of (four) metal layers 10 formed in the vicinity of each corner on the surface 3 of the package body 2 are substantially L-shaped in plan view, and are electrically connected to any of the electrodes 8 as will be described later. It is possible.
In addition, external electrodes 9 that can be electrically connected to any one of the electrodes 8 are formed in the vicinity of each corner on the back surface 4 of the package body 2.

As shown in FIGS. 1 and 2, the pair of convex portions 12 and 14 provided on the surface 3 of the package body 2 between the metal layers 10 and 10 adjacent to each other have an elongated oval shape in plan view, Along the longitudinal direction of each side of the surface 3 having a rectangular frame shape, a part of the surface 3 protrudes upward. That is, the protrusions 12 and 14 are made of ceramic having substantially the same composition as the ceramic forming the package body 2, ceramic having substantially the same firing temperature, or ceramic having a firing temperature lower than the firing temperature.
Therefore, after the convex portions 12 and 14 are screen-printed with an insulating paste containing ceramic powder having the same composition and firing temperature of the green sheet on the surface of the frame-shaped green sheet serving as the side wall of the package body 2, It can arrange | position easily by baking simultaneously.
Alternatively, the protrusions 12 and 14 can be easily arranged by printing an insulating paste containing ceramic powder having a different composition and lower than the firing temperature on the surface 3 of the fired package body 2 and firing again. Can be set.

On the surface 3 of the package body 2, the height of the protrusions 12 and 14 (thickness in the stacking direction: t) is lower than the height of each metal layer 10, and the height between the protrusions 12 and 14 and each metal layer 10. Between the gaps 11 and 15, the surface 3 of the package body 2 is exposed.
The electrode 8, the external electrode 9, the metal layer 10, and a via conductor described later are made of W or Mo when the ceramic of the package body 2 is a high-temperature fired ceramic, and the ceramic of the package body 2 is a low-temperature fired ceramic. In this case, it is made of Cu or Ag.
As shown in FIG. 1, another package P2 mounted above the package P1 also has the same package body 2, cavity 5, electrode 8, and external electrode 9. On the surface 3 of the package body 2 of another package P2, a metal strip 16 for sealing having a rectangular frame shape in plan view is formed along each side. After the electronic component is mounted in the cavity 5, the sealing metal strip 16 is bonded to the metal lid plate L via solder described later, and seals the opening of the cavity 5.

The lid plate L is made of 42 alloy (Fe-42 wt% Ni), Kovar (Fe-29 wt% Ni-17 wt% Co), 196 alloy (Cu-2.3 wt% Fe-0.03 wt% P), or the like. The plan view is a substantially rectangular flat plate.
As shown in the vertical sectional view of FIG. 3, in the package P <b> 1, the gap between the external electrode 9 near each corner of the back surface 4 of the package body 2 and the electrodes 8 at the four corners of the bottom surface 6 of the cavity 5 is Each can be conducted through via conductors v penetrating the bottom surface 6. In addition, each metal layer 10 near each corner of the surface 3 of the package body 2 and each of the electrodes 8 can be electrically connected to each other through via conductors v penetrating the side wall of the package body 2 vertically. ing.

The packages P1 and P2 as described above are stacked as follows.
As shown in FIG. 3, for example, after an electronic component C1 such as an IC is soldered to each electrode 8 and mounted in the cavity 5 of the package P1, an epoxy-based sealing resin R is placed in the cavity 5 Fill and solidify to seal the electronic component C1 from the outside. On the other hand, for example, an electronic component C2 such as a crystal resonator is mounted in the cavity 5 of another package P2 in the same manner as described above.
Next, as shown in FIG. 3, after placing the solder 17 on each metal layer 10 of the package P1 having the cavity 5 on which the electronic component C1 is mounted and sealed with the sealing resin R, The other package P2 having the cavity 5 on which the electronic component C2 is mounted is mounted. Further, the solder 18 is placed on the sealing metal strip 16 of another package P2, and the lid plate F is placed thereon.
Next, the solders 17 and 18 are melted at a predetermined temperature and then solidified.

As a result, as shown in FIG. 3, another package P2 is mounted on the package P1, and a package stack U in which the electronic components C1 and C2 individually mounted in the cavities 5 are sealed from the outside is obtained. Produced.
In the package stack U, the electronic components C1 and C2 are mounted on the stack U via the electrodes 8, the via conductors v, the metal layer 10, and the external electrodes 9 of the packages P1 and P2. Conduction with a printed circuit board that does not work is possible.
Moreover, the surface 3 of the package body 2 of the lower package P1 has a height (t) higher than the height of the metal layer 10 between the metal layers 10 and 10 near the corners and via the gaps 11 and 15. Low protrusions 12 and 14 protrude as part of the surface 3.

Therefore, when the package stack U is subjected to an impact test for dropping from a certain height, as indicated by an arrow along the vertical direction in FIG. The convex portions 12 and 14 can sufficiently counter the load P and the impact load at a position away from each metal layer 10 in the lower package P1, so that conventional cracks, etc. It is possible to reliably prevent the occurrence of.
Therefore, according to the packages P1 and P2 and the package stack U including these, the operations of the electronic components C1 and C2 can be accurately performed, so that the reliability can be improved.

FIG. 4 is a plan view showing the same package P1 as described above, and on the pair of long side surfaces 3 of the package body 2, between the metal layers 10 and 10 in the vicinity of the corners, as well as between the gaps 11 and 15, respectively. A form in which a part of the surface 3 protrudes with a gap 11a and a pair of convex portions 12a lower than the height of each metal layer 10 is provided along the longitudinal direction of each long side is shown.
Further, FIG. 5 is a plan view similar to the above, in which a pair of inner and outer elongated protrusions are provided on each side of the surface 3 of the package body 2 with gaps 11 and 15 between the adjacent metal layers 10. The package P1 in a form in which 12b, 12c, 14a, and 14b are provided along the longitudinal direction of the side is shown.
The height of the convex portions 12b, 12c, 14a, 14b is also lower than the height of the metal layer 10 with a part of the surface 3 protruding. Further, out of each side of the surface 3 of the package body 2, the outer protrusions 12 b and 14 a that are separated from the cavity 5 may be longer or higher than the inner protrusions 12 c and 14 b near the cavity 5. good.
The package P1 of the form shown in FIGS. 1 to 3 is also obtained by the package P1 shown in FIGS. 4 and 5 in which the convex portions 12a to 12c, 14a and 14b as described above are provided on the surface 3 of the package body 2. It is possible to achieve the same effect as.

On the other hand, FIG. 6 is a plan view showing the same package P1 as described above, with gaps 11 and 15 being placed between the adjacent metal layers 10 on each side of the surface 3 of the package body 2, and the like. The form which provided the elongate convex part 13a, 13b consisting of a conductor along the longitudinal direction of each edge | side is shown. The protrusions 13a and 13b are made of W, Mo, Cu, Ag, or the like, and are formed of the same metal or the same kind of metal material as the adjacent metal layer 10 with the gaps 11 and 15 therebetween. Lower than height.
The convex portions 13a and 13b made of the conductor are formed at a predetermined position on the surface of the frame-shaped green sheet serving as the side wall of the package body 2 with a conductive paste containing W powder or the like simultaneously with each metal layer 10 or separately. After the screen printing, it is formed by firing together with a plurality of layers of green sheets to be the package body 2.
The convex portions 13a and 13b formed by screen printing simultaneously with the metal layers 10 are fired after being compressed in advance along the height direction.

  FIG. 7 is a plan view similar to the above, and a pair of convex portions 13c made of the same conductor are provided along the longitudinal direction of the side on the lower long side of the surface 3 of the package body 2 in the drawing. The gap 11 is formed between the metal layer 10 and the gap 11a. The pair of long and short convex portions 13d and 13e made of the same conductor are formed inside and outside on the upper long side in FIG. The package P1 of the form formed in parallel is shown.

Further, as shown in FIG. 7, an oval convex portion 13f made of the same conductor as shown in FIG. 7 is formed on the right side of the surface 3 of the package body 2 on the right side, and on the left side, the same as described above. The package P1 in a form in which an elliptical convex portion 13g made of a conductor is formed along the longitudinal direction of the short side with the metal layer 10 and the gap 15 therebetween is shown.
Even with the package P1 shown in FIGS. 6 and 7 in which the convex portions 13a to 13g as described above are provided on the surface 3 of the package body 2, it is possible to achieve the same effect as the package P1 of the above-described form.
In the package P1 shown in FIG. 7, convex portions having the same shape may be formed on each side of the surface 3 of the package body 2.

The present invention is not limited to the embodiments described above.
For example, the metal layer formed on the surface 3 of the package body 2 is not limited to the vicinity of the corners of the surface 3, but is almost rectangular (square or rectangular), circular, You may form as an ellipse or an elliptical form.
Further, the package body of the present invention and the package body of another package are made of an epoxy-based resin, a metal layer formed on the surface thereof is formed of Cu, Ag, or the like, and the resin is interposed between the metal layers. The same effect as described above can also be obtained by providing a convex portion made of the same resin as the above or a convex portion made of the same metal as the metal layer.
Furthermore, the package main body of the package according to the present invention and another package may have a substantially square shape in plan view, and the cavity opened on the surface thereof may have a shape similar to the square.

The perspective view which shows one form of package by this invention, another package, etc. FIG. The top view which shows the said package. The vertical sectional view which shows the laminated body which mounted another package on the said package. The top view which shows the package which provided the convex part of a different form. Furthermore, the top view which shows the package which provided the convex part of a different form. The top view which shows the package which provided the convex part of another form. The top view which shows the package which provided the convex part of another form.

Explanation of symbols

2 ………………………… Package body 3 ………………………… Front side 4 ………………………… Back side 5 ………………………… Cavity 6 ………………………… Bottom 10 ……………………… Metal layer 11, 15 ……………… Crevice 12, 12a-12c… Protrusions 13a-13g ………… Convex 14, 14 a, 14 b ... convex part P1 ........................... package P2 .................. another package t .......................................... height C1, C2 …… ………… Electronic components R ………………………… Sealing resin L ………………………… Cover plate

Claims (6)

A package with another package on top,
A package body having a front surface and a back surface and made of an insulating material;
A cavity opening on the surface of the package body,
A plurality of metal layers formed on the surface of the package body;
A convex portion provided between adjacent metal layers among the plurality of metal layers,
Package characterized by that. The height of the convex portion is lower than the height of the metal layer,
The package according to claim 1. A gap is located between the convex portion and the metal layer.
The package according to claim 1 or 2, wherein The convex portion is a projection of at least a part of the surface of the package body.
The package according to claim 1, wherein the package is a package. The convex portion is formed of a ceramic having substantially the same firing temperature as the ceramic forming the package body, or a ceramic lower than the firing temperature.
The package according to claim 4. The cavity of the package is filled with sealing resin after an electronic component is mounted on the bottom surface, and the opening formed in the cavity formed in the other package is sealed with a cover plate. ,
The package according to any one of claims 1 to 5, wherein:

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