JP2009105303A5 - - Google Patents
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- Publication number
- JP2009105303A5 JP2009105303A5 JP2007277331A JP2007277331A JP2009105303A5 JP 2009105303 A5 JP2009105303 A5 JP 2009105303A5 JP 2007277331 A JP2007277331 A JP 2007277331A JP 2007277331 A JP2007277331 A JP 2007277331A JP 2009105303 A5 JP2009105303 A5 JP 2009105303A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- groove
- circuit board
- phone device
- mobile phone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001413 cellular Effects 0.000 claims 1
Claims (4)
回路基板と、 A circuit board;
前記電池と前記回路基板の間に設けられ、前記回路基板に貼り付けられたシールと、 A seal provided between the battery and the circuit board, and affixed to the circuit board;
前記回路基板に設けられた複数の配線で構成されたパターンと、 A pattern composed of a plurality of wirings provided on the circuit board;
前記パターンの一部を覆うレジストと、を有し、 A resist covering a part of the pattern,
前記回路基板の前記シールが貼り付けられた領域は、前記パターンで形成された第一の溝部と、前記レジストで形成された第二の溝部とを備え、 The area where the seal of the circuit board is affixed includes a first groove formed with the pattern and a second groove formed with the resist.
前記第一の溝部と前記第二の溝部とが連通し、前記第二の溝部のみが前記シールが貼り付けられた領域からはみ出るように構成された携帯電話装置。 A cellular phone device configured such that the first groove and the second groove communicate with each other, and only the second groove protrudes from an area where the seal is attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007277331A JP4685077B2 (en) | 2007-10-25 | 2007-10-25 | Mobile phone equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007277331A JP4685077B2 (en) | 2007-10-25 | 2007-10-25 | Mobile phone equipment |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009254678A Division JP4631988B2 (en) | 2009-11-06 | 2009-11-06 | Circuit board |
JP2009255771A Division JP2010034587A (en) | 2009-11-09 | 2009-11-09 | Circuit board, and electronic apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009105303A JP2009105303A (en) | 2009-05-14 |
JP2009105303A5 true JP2009105303A5 (en) | 2009-08-06 |
JP4685077B2 JP4685077B2 (en) | 2011-05-18 |
Family
ID=40706686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007277331A Active JP4685077B2 (en) | 2007-10-25 | 2007-10-25 | Mobile phone equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4685077B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4631988B2 (en) * | 2009-11-06 | 2011-02-16 | パナソニック株式会社 | Circuit board |
JP5692999B2 (en) * | 2009-12-24 | 2015-04-01 | 矢崎総業株式会社 | Heat sink mounting structure |
CN113038698B (en) * | 2021-03-08 | 2022-09-09 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel, preparation method and display device |
CN114554725B (en) * | 2022-04-25 | 2022-07-05 | 绵阳新能智造科技有限公司 | Pasting device and method for composite PCB |
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2007
- 2007-10-25 JP JP2007277331A patent/JP4685077B2/en active Active
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