JP5692999B2 - Heat sink mounting structure - Google Patents

Heat sink mounting structure Download PDF

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JP5692999B2
JP5692999B2 JP2009292935A JP2009292935A JP5692999B2 JP 5692999 B2 JP5692999 B2 JP 5692999B2 JP 2009292935 A JP2009292935 A JP 2009292935A JP 2009292935 A JP2009292935 A JP 2009292935A JP 5692999 B2 JP5692999 B2 JP 5692999B2
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heat sink
wiring board
printed wiring
heat
conductive sheet
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JP2011134892A (en
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鈴木　正志
正志 鈴木
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Yazaki Corp
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明は、配線基板に対するヒートシンクの取付構造に関する。   The present invention relates to a heat sink mounting structure for a wiring board.

表面実装タイプの半導体素子にヒートシンクを取り付ける場合には、半導体素子が実装されるプリント配線板とヒートシンクとの間に熱伝導シートを介在させて、熱の伝搬をし易くしている。一般的に、熱伝導シートは、ヒートシンクに貼着されてヒートシンクと一体化され、ヒートシンクがプリント配線板に搭載されると、ヒートシンクとプリント配線板との間に挟み込まれる。   When a heat sink is attached to a surface-mount type semiconductor element, a heat conduction sheet is interposed between the printed wiring board on which the semiconductor element is mounted and the heat sink to facilitate heat propagation. Generally, a heat conductive sheet is attached to a heat sink and integrated with the heat sink. When the heat sink is mounted on a printed wiring board, the heat conductive sheet is sandwiched between the heat sink and the printed wiring board.

ヒートシンクとプリント配線板との間に熱伝導シートが挟み込まれる際、プリント配線板と熱伝導シートとの間に空気溜まりが残ってしまうことがあるが、目視では確認できないことから、空気溜まりが残ったままヒートシンクの組み付けが完了してしまう虞がある。このため、下記の引用文献１〜４では、空気溜まりを解消する方法が提案されている。   When the thermal conductive sheet is sandwiched between the heat sink and the printed wiring board, an air pocket may remain between the printed wiring board and the thermal conductive sheet. There is a risk that the assembly of the heat sink will be completed. For this reason, the following citations 1-4 propose a method for eliminating the air pocket.

引用文献１では、電子部品とヒートシンクとの間に介在される熱伝導シートに、厚さ方向に気体を通すための通気部を設けている。引用文献２では、組み付け面に窪みが形成された半導体チップ搭載用の基板を中間熱伝導材を介在させて放熱板に組み合わせる際に、中間熱伝導材を未塗布溝を備える形状に塗布することで、窪みが形成する空間内に気泡が残るのを防止している。引用文献３では、ＢＧＡ型半導体装置と基板との間に介装される基板接続放熱シートに複数の溝部を設けることで、半導体装置のＢＧＡ及び基板に基板接続放熱シートが密着する際に、溝部より空気が押し出され、密着面に空気が溜まらないようにしている。引用文献４では、電子部品が搭載された基板を放熱用シートを介して覆う下蓋が、放熱シートに押し付けられる面に凹溝を備えている。   In Cited Document 1, a heat conduction sheet interposed between an electronic component and a heat sink is provided with a ventilation portion for passing gas in the thickness direction. In Cited Document 2, when a semiconductor chip mounting substrate having a depression formed on the assembly surface is combined with a heat sink with an intermediate heat conductive material interposed, the intermediate heat conductive material is applied in a shape having an uncoated groove. Thus, bubbles are prevented from remaining in the space formed by the depression. In the cited document 3, by providing a plurality of groove portions in the substrate connection heat dissipation sheet interposed between the BGA type semiconductor device and the substrate, the groove portions are brought into close contact with the BGA and the substrate of the semiconductor device. Air is pushed out more so that air does not collect on the contact surface. In the cited document 4, the lower lid that covers the substrate on which the electronic component is mounted via the heat dissipation sheet has a groove on the surface pressed against the heat dissipation sheet.

特開２００９−１７６２４号公報JP 2009-17624 A

上記従来のヒートシンクの取付構造では、プリント配線板に熱伝導シートを密着させる際に空気溜まりが生じるのは防止できるものの、空気を通すための通気部や溝内の空気の影響で、十分な放熱効率を得られない虞があった。   In the above conventional heat sink mounting structure, air accumulation can be prevented when the heat conductive sheet is brought into close contact with the printed wiring board. However, sufficient heat dissipation is possible due to the effect of air in the ventilation section and grooves. There was a possibility that efficiency could not be obtained.

本発明は斯かる課題に鑑みてなされたもので、上記課題を解決することのできるヒートシンク取付構造を提供することを目的とする。   This invention is made | formed in view of such a subject, and it aims at providing the heat sink attachment structure which can solve the said subject.

このような目的を達成するために、本発明のヒートシンク取付構造は、配線基板の第１の印刷層上に熱伝導シートを介してヒートシンクを取り付けるヒートシンク取付構造であって、前記第１の印刷層で覆われていない印刷抜き部と、前記印刷層上に形成されて前記印刷抜き部の両側に延びた一対の第２の印刷層とで構成された空気溝を、前記配線基板の前記熱伝導シートの搭載箇所に備え、前記熱伝導シートは、前記ヒートシンクと前記配線基板とで挟み込まれて変形し、前記空気溝に密着していることを特徴とする。 In order to achieve such an object, the heat sink mounting structure of the present invention is a heat sink mounting structure in which a heat sink is mounted on a first printed layer of a wiring board via a heat conductive sheet, the first printed layer being An air groove composed of a printed punched portion not covered with a pair of second printed layers formed on the printed layer and extending on both sides of the printed punched portion. The heat conductive sheet is sandwiched between the heat sink and the wiring board, is deformed, and is in close contact with the air groove .

本発明によれば、薄肉の印刷層で空気溝を構成することから、ヒートシンクとプリント配線板とで挟み込まれて変形した熱伝導シートを空気溝に密着させ、熱伝導シートの全面でプリント配線板からの放熱を行い、放熱効率を高めることができる。   According to the present invention, since the air groove is constituted by the thin printed layer, the heat conductive sheet deformed by being sandwiched between the heat sink and the printed wiring board is brought into close contact with the air groove, and the printed wiring board is formed on the entire surface of the heat conductive sheet. The heat radiation efficiency can be increased by increasing the heat radiation efficiency.

本発明の一実施形態の電子機器を示す図であり、（ａ）は平面図，（ｂ）は正面図である。It is a figure which shows the electronic device of one Embodiment of this invention, (a) is a top view, (b) is a front view. 電子機器が備えるプリント配線板を示す図であり、（ａ）は平面図，（ｂ）は（ａ）のＢ−Ｂ線断面図であるIt is a figure which shows the printed wiring board with which an electronic device is provided, (a) is a top view, (b) is the BB sectional drawing of (a). 電子機器を示す断面図であり、（ａ）は図１（ａ）のＡ−Ａ線断面を，（ｂ）は（ａ）を部分的に拡大した断面を示している。It is sectional drawing which shows an electronic device, (a) shows the AA line cross section of Fig.1 (a), (b) has shown the cross section which expanded (a) partially. 空気溝を備えない従来のプリント配線基板にヒートシンクを搭載した状態を示す断面図である。It is sectional drawing which shows the state which mounted the heat sink on the conventional printed wiring board which is not provided with an air groove.

以下、図面を参照して、本発明の一実施形態を説明する。
図１は、本実施形態の電子機器１を示す図である。図２は、電子機器１が備えるプリント配線板２を示す図である。なお、以下の説明で用いる上下，前後，左右の各方向は説明に用いる各図に示している。この上下，前後，左右は説明のために記載したもので、実際の配置と異なってよいことはもちろんである。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram illustrating an electronic apparatus 1 according to the present embodiment. FIG. 2 is a diagram illustrating the printed wiring board 2 provided in the electronic apparatus 1. In addition, each direction of the up-down, front-back, left-right used in the following description is shown in each figure used for description. The top, bottom, front, back, left and right are described for explanation, and of course may be different from the actual arrangement.

図１に示すように、電子機器１は、プリント配線板２の上面にヒートシンク４を搭載して構成されている。プリント配線板２の上面には、プリント配線板２上の回路を外部に接続するための出力コネクタ３が取り付けられている。出力コネクタ３は、相手側のコネクタが被着される被着部３１と、被着部３１から延びた接続端子３２とを備えており、プリント配線板２上の配線パターンに接続端子３２が接続されている。   As shown in FIG. 1, the electronic device 1 is configured by mounting a heat sink 4 on the upper surface of a printed wiring board 2. An output connector 3 for connecting the circuit on the printed wiring board 2 to the outside is attached to the upper surface of the printed wiring board 2. The output connector 3 includes an attachment portion 31 to which the mating connector is attached and a connection terminal 32 extending from the attachment portion 31, and the connection terminal 32 is connected to the wiring pattern on the printed wiring board 2. Has been.

ヒートシンク４は、平板状を呈した本体４１の上面に複数の放熱板４２を備えており、本体４１の下面に貼着された熱伝導シート５（図３（ｂ）参照）を介して本体４１をプリント配線板２に密着させ、本体４１をネジ４３でプリント配線板２にネジ止めされている。   The heat sink 4 includes a plurality of heat radiating plates 42 on the upper surface of a main body 41 having a flat plate shape, and the main body 41 via a heat conductive sheet 5 (see FIG. 3B) attached to the lower surface of the main body 41. Is closely attached to the printed wiring board 2, and the main body 41 is screwed to the printed wiring board 2 with screws 43.

図２に示すように、プリント配線板２の上面のヒートシンク４の搭載位置には、空気溝２０が複数（図２では５つ）形成されている。各空気溝２０は、ヒートシンク４の短手方向（前後方向）に沿って延びており、ヒートシンク４の長手方向（左右方向）に沿って等間隔で配列されている。   As shown in FIG. 2, a plurality of air grooves 20 (five in FIG. 2) are formed at the mounting position of the heat sink 4 on the upper surface of the printed wiring board 2. The air grooves 20 extend along the short direction (front-rear direction) of the heat sink 4 and are arranged at equal intervals along the longitudinal direction (left-right direction) of the heat sink 4.

図２（ｂ）に示すように、プリント配線板２は、基板２Ａの上面に銅箔部２Ｂを形成し、銅箔部２Ｂを覆うようにして基板２Ａの上面にレジスト層２Ｃを設けて構成されている。空気溝２０は、プリント配線板２の銅箔部２Ｂにレジスト層２Ｃを形成しないレジスト抜き部２Ｂ１を設け、レジスト抜き部２Ｂ１の左右の両側に位置するレジスト層２Ｃ上にレジスト抜き部２Ｂ１の両側に沿って前後方向に延びるシルク部２Ｄを設けて構成されている。空気溝２０は、ヒートシンク４の短手方向の長さよりも前後方向の長さがやや長く形成されており、プリント配線板２の上面に搭載されたヒートシンク４の前後の縁部からその前後の端部が外部に露出するように配置されている。   As shown in FIG. 2B, the printed wiring board 2 is configured by forming a copper foil portion 2B on the upper surface of the substrate 2A and providing a resist layer 2C on the upper surface of the substrate 2A so as to cover the copper foil portion 2B. Has been. The air groove 20 is provided with a resist removal portion 2B1 in which the resist layer 2C is not formed on the copper foil portion 2B of the printed wiring board 2, and both sides of the resist removal portion 2B1 on the resist layer 2C located on both the left and right sides of the resist removal portion 2B1. A silk part 2D extending in the front-rear direction is provided. The air groove 20 has a length in the front-rear direction that is slightly longer than the length in the short direction of the heat sink 4, and the front and rear edges of the heat sink 4 mounted on the upper surface of the printed wiring board 2 It arrange | positions so that a part may be exposed outside.

図４に示すように、空気溝を備えない従来のプリント配線板２では、プリント配線板２にヒートシンク４が載置されると、ヒートシンク４の裏面に貼着された熱伝導シート５とプリント配線板２との間に空気溜まりが生じる。これに対し、空気溝２０を備えた電子機器１のプリント配線板２では、ヒートシンク４の裏面に貼着された熱伝導シート５とプリント配線板２との間の空気が空気溝２０を通してヒートシンク４の前後の縁部から排気され、図３（ｂ）に示すように、熱伝導シート５とプリント配線板２との間に空気溜まりが生じることなく、熱伝導シート５の下面とプリント配線板２のレジスト層２Ｃの上面とが密着する。その後、ヒートシンク４の本体４１がプリント配線板２にネジ止めされて、本体４１がプリント配線板２に押し付けられると、熱伝導シート５が変形して空気溝２０の内面と熱伝導シート５の下面とが密着する。この際、空気溝２０内の空気は、空気溝２０の前後の端部から外部に排気される。このようにしてプリント配線板２にヒートシンク４が搭載されると、熱伝導シート５の全面がプリント配線板２の上面に密着する。   As shown in FIG. 4, in the conventional printed wiring board 2 that does not have an air groove, when the heat sink 4 is placed on the printed wiring board 2, the heat conductive sheet 5 and the printed wiring adhered to the back surface of the heat sink 4. An air pocket is generated between the plate 2 and the plate 2. On the other hand, in the printed wiring board 2 of the electronic device 1 including the air groove 20, the air between the heat conductive sheet 5 attached to the back surface of the heat sink 4 and the printed wiring board 2 passes through the air groove 20. As shown in FIG. 3 (b), the bottom surface of the heat conductive sheet 5 and the printed wiring board 2 are not formed between the heat conductive sheet 5 and the printed wiring board 2. The resist layer 2C is in close contact with the upper surface. After that, when the main body 41 of the heat sink 4 is screwed to the printed wiring board 2 and the main body 41 is pressed against the printed wiring board 2, the heat conductive sheet 5 is deformed and the inner surface of the air groove 20 and the lower surface of the heat conductive sheet 5. And adhere closely. At this time, the air in the air groove 20 is exhausted to the outside from the front and rear ends of the air groove 20. When the heat sink 4 is mounted on the printed wiring board 2 in this way, the entire surface of the heat conductive sheet 5 adheres to the upper surface of the printed wiring board 2.

以上説明したように、本実施形態によれば、銅箔部２Ｂ上にレジストを塗布して形成された薄肉のレジスト層２Ｃにレジスト抜き部２Ｂ１を設けることで空気溝２０を構成していることから、熱伝導シート５とプリント配線板２との間の空気を排気した空気溝２０に、ヒートシンク４とプリント配線板２とで挟み込まれて変形した熱伝導シート５を密着させることができる。従って、熱伝導シート５の全面でプリント配線板２からの放熱を行い、放熱効率を高めることが可能となる。   As described above, according to the present embodiment, the air groove 20 is configured by providing the resist removal portion 2B1 in the thin resist layer 2C formed by applying the resist on the copper foil portion 2B. Therefore, the deformed heat conductive sheet 5 sandwiched between the heat sink 4 and the printed wiring board 2 can be brought into close contact with the air groove 20 in which the air between the heat conductive sheet 5 and the printed wiring board 2 is exhausted. Therefore, it is possible to radiate heat from the printed wiring board 2 over the entire surface of the heat conductive sheet 5 and increase the heat radiation efficiency.

上記実施形態では、レジスト層２Ｃで覆われていないレジスト抜き部２Ｂ１と、レジスト層２Ｃ上に形成されてレジスト抜き部２Ｂ１の両側に延びた一対のシルク部２Ｄとをプリント配線板２に設けて空気溝２０を構成した場合について説明した。しかしながら、レジスト層（印刷層）２Ｃ上にシルク部２Ｄを設けずに、レジスト抜き部（印刷抜き部）２Ｂ１のみで空気溝２０を構成してもよい。   In the above embodiment, the printed wiring board 2 is provided with the resist removal portion 2B1 not covered with the resist layer 2C and the pair of silk portions 2D formed on the resist layer 2C and extending on both sides of the resist removal portion 2B1. The case where the air groove 20 was comprised was demonstrated. However, the air groove 20 may be configured by only the resist removal part (printing part) 2B1 without providing the silk part 2D on the resist layer (printing layer) 2C.

また、銅箔部２Ｂ上にレジスト層を設けずに、熱伝導シート５を銅箔部２Ｂ上に直接搭載する場合には、銅箔部２Ｂ上にシルクスクリーン印刷で形成された一対のシルク層（印刷層）で空気溝を構成してもよい。   When the heat conductive sheet 5 is directly mounted on the copper foil portion 2B without providing a resist layer on the copper foil portion 2B, a pair of silk layers formed by silk screen printing on the copper foil portion 2B. You may comprise an air groove with (printing layer).

１ 電子機器
２ プリント配線板
２０ 空気溝
２Ａ 基板
２Ｂ 銅箔部
２Ｂ１ レジスト抜き部（印刷抜き部）
２Ｃ レジスト層（第１の印刷層）
２Ｄ シルク部（第２の印刷層）
３ 出力コネクタ
３１ 被着部
３２ 接続端子
４ ヒートシンク
４１ 本体
４２ 放熱板
４３ ネジ
５ 熱伝導シート DESCRIPTION OF SYMBOLS 1 Electronic device 2 Printed wiring board 20 Air groove 2A Board | substrate 2B Copper foil part 2B1 Resist extraction part (print extraction part)
2C resist layer (first printed layer)
2D silk part (second printed layer)
3 Output connector 31 Attachment part 32 Connection terminal 4 Heat sink 41 Main body 42 Heat sink 43 Screw 5 Thermal conduction sheet

Claims (1)

配線基板の第１の印刷層上に熱伝導シートを介してヒートシンクを取り付けるヒートシンク取付構造であって、
前記第１の印刷層で覆われていない印刷抜き部と、
前記第１の印刷層上に形成されて前記印刷抜き部の両側に延びた一対の第２の印刷層とで構成された空気溝を、前記配線基板の前記熱伝導シートの搭載箇所に備え、
前記熱伝導シートは、前記ヒートシンクと前記配線基板とで挟み込まれて変形し、前記空気溝に密着していることを特徴とするヒートシンク取付構造。 A heat sink mounting structure for mounting a heat sink on a first printed layer of a wiring board via a heat conductive sheet,
A printed portion not covered with the first printed layer;
An air groove formed with a pair of second print layers formed on the first print layer and extending on both sides of the printing punched portion is provided at the mounting position of the heat conductive sheet on the wiring board,
A heat sink mounting structure, wherein the heat conductive sheet is sandwiched between the heat sink and the wiring board and deformed, and is in close contact with the air groove.
JP2009292935A 2009-12-24 2009-12-24 Heat sink mounting structure Active JP5692999B2 (en)

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JP2009292935A JP5692999B2 (en) 2009-12-24 2009-12-24 Heat sink mounting structure

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JPH09102567A (en) * 1995-10-09 1997-04-15 Mitsubishi Electric Corp Semiconductor device
JP2001284803A (en) * 2000-03-30 2001-10-12 Nec Corp Mounting method of printed wiring board for high frequency, printed wiring board mounting member for high frequency and its manufacturing method
KR20030029118A (en) * 2000-08-03 2003-04-11 해밀턴 선드스트랜드 코포레이션 Adhesive bonding of printed circuit boards to heat sinks
JP3854131B2 (en) * 2001-11-26 2006-12-06 京セラ株式会社 Wiring board with heat sink
JP2006351927A (en) * 2005-06-17 2006-12-28 Auto Network Gijutsu Kenkyusho:Kk Semiconductor device, circuit board, and electric connection box
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