JP2009105183A - Projection exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a projection exposure apparatus including a light shielding device for shielding the light to be radiated to an edge part of a substrate in order to remove negative resist on this edge part of substrate. <P>SOLUTION: The projection exposure apparatus exposes a substrate CB coated with a negative photoresist using the light having passed a mask via the projecting optical system by irradiating the mask with the light including the ultraviolet ray. The projection exposure apparatus includes a substrate table 60 having an attracting part 69 for attracting the substrate, a first light shielding part 30 for shielding the exposure light, a first light shielding part arranging portion 32 for arranging the first light shielding part to a part of the edge of substrate, and a moving part 31 placed on the substrate table to move the first light shielding part arranging portion to the desired position in the periphery of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a projection exposure apparatus having a light-shielding body that shields the edge of a substrate coated with a negative photoresist when a predetermined pattern is exposed on the surface of a substrate such as silicon.

  An exposure apparatus that irradiates ultraviolet rays of a predetermined wavelength to expose a predetermined pattern on a semiconductor substrate such as a silicon wafer, a glass substrate for liquid crystal or PDP, or various substrates for electronic circuits (hereinafter referred to as a substrate). Various proposals have been made. When a photoresist is applied to the substrate, the photoresist may be applied unevenly at the edge of the substrate. For this reason, the photoresist remains without being removed, and the photoresist may cause dust in a later process. Therefore, it is necessary to remove the photoresist on the edge of the substrate in advance.

  In particular, in the manufacture of MEMS and the like, there is a wafer having a step difference of more than several μm and several hundred μm. In such MEMS production, a negative photoresist is widely used due to a large wafer level difference. In order to remove the negative photoresist on the edge of the substrate, there has been proposed an exposure apparatus provided with a light shielding plate so that light does not strike the edge of the substrate. The negative photoresist not exposed to light is removed by development and etching.

  Patent Document 1 proposes an apparatus in which a ring-shaped light shield 130 is placed on a substrate and the edges of the substrate are collectively covered. The light shielding body 130 disclosed in Patent Document 1 has a shape that covers the entire edge of the substrate as shown in FIG. FIG. 8B is a cross-sectional view taken along the line A in FIG. For this reason, the substrate is exchanged by moving the substrate table to the standby position for removing the light shield 130 and removing the light shield 130, then moving the substrate table to the substrate exchange position, exchanging the substrate, The light shield 130 is moved to the removal standby position and the light shield 130 is placed on the substrate. Accordingly, since the moving distance of the substrate table becomes long, it takes time to replace the substrate. In addition, the movement of the extra substrate table increases, and the possibility of winding up the garbage becomes high. Furthermore, since the diameter of the light shielding body 130 disclosed in Patent Document 1 is considerably larger than the diameter of the substrate, it takes time to take out and install the light shielding body 130 itself.

Further, Patent Document 2 proposes an apparatus for inserting the light shielding body 130 by another method as shown in FIG. In Patent Document 2, a light shielding body 130 is inserted into the photomask FM10 so as to shield a lacking portion of the lacking shot exposure during exposure of the lacking shot, and the shielding body 130 is retracted in the case of an effective shot without any lacking. ing. Since the light shield 130 is inserted on the photomask FM10 side, the distance for inserting the light shield 130 at the time of the missing shot must be adjusted according to the size of the missing shot. That is, it is necessary to obtain the insertion distance and angle for all the missing shots in advance. In addition, although Patent Document 2 also prepares a rectangular light shielding body 131, the rectangular light shielding body 131 is also installed on the light source side from the photomask FM10 in the same manner as the light shielding body 130, and therefore the insertion distance and angle are obtained. There is a need.
Special table 2005-505147 JP 2005-045160 A

  A light shielding body that covers the entire surface of the substrate as in Patent Document 1 is large and difficult to handle, and it takes time to replace the substrate, reducing the processing capability of the projection exposure apparatus. In addition, the large light shield has a large air resistance and has a problem of winding up dust. Further, although the light shielding body in Patent Document 2 is small and easy to handle, since it is on the light source side with respect to the photomask, the insertion amount and angle of the light shielding body are calculated in advance for each missing shot to calculate the edge on the substrate. Adjust to form a light-shielding band on the part For this reason, there is a problem that the control unit of the light shielding body needs to obtain a plurality of insertion distances and angles in advance according to the pattern drawn on the photomask, and the processing becomes complicated.

  Therefore, the present invention provides a projection exposure apparatus having a simple light shield device that requires a short time for removing and re-installing the light shield accompanying the replacement of the substrate, and that does not require a calculation process of the insertion distance of the light shield.

A projection exposure apparatus according to a first aspect is a projection exposure apparatus that irradiates a mask with light rays including ultraviolet rays and exposes a light beam that has passed through the mask via a projection optical system onto a substrate coated with a negative photoresist. . The projection exposure apparatus includes a substrate table provided with an adsorption unit that adsorbs the substrate, a first light shielding body that shields exposure light, and a first light shielding body arrangement that arranges the first light shielding body at a part of the edge of the substrate. And a moving unit that is placed on the substrate table and moves the first light shielding member arrangement unit to an arbitrary position around the substrate.
With this configuration, the first light shield can be reduced in size because the first light shield is disposed at a part of the edge of the substrate. In addition, since the process of removing a large light shielding member as in the prior art is not required when replacing the substrate, the throughput of the entire exposure process can be improved.

The moving unit of the projection exposure apparatus according to the second aspect has a circular guide rail disposed around the suction unit.
With this configuration, the control system cables and the like of the rotating mechanism can be gathered in a compact manner, and the reliability of the device and the increased dust generation can be suppressed.

The first light shielding member arrangement unit of the projection exposure apparatus according to the third aspect rotates the first light shielding member on an axis parallel to the substrate surface.
With this configuration, the light shield is arranged on the substrate with a small movement, and the time required for retraction and the time required for installation can be shortened.

The first light shielding member placement unit of the projection exposure apparatus according to the fourth aspect moves the first light shielding body in a direction parallel to the substrate surface.
With this configuration, the light shield is arranged on the substrate with a small movement, and the time required for retraction and the time required for installation can be shortened.

The first light shield of the projection exposure apparatus according to the fifth aspect is formed of a low thermal expansion material.
With this configuration, even if the first light shielding body is heated by many exposures, the light shielding range can be made constant by using the low thermal expansion material for the first light shielding body.

The projection exposure apparatus according to the sixth aspect further includes a second light shielding body arrangement unit that arranges a second light shielding body having a shape different from that of the first light shielding body at a part of the edge of the substrate, and the moving unit includes the second light shielding body. The light-shielding body arrangement part is moved to an arbitrary position around the substrate.
With this configuration, since two light shielding bodies are provided, it is possible to use different light shielding bands for different substrates or different notches.

In the projection exposure apparatus of the seventh aspect, in the sixth aspect, the second light shield is different from the first light shield in the diameter direction of the substrate.
With this configuration, the first light shielding body or the second light shielding body can be used for substrates having different diameters.

  Since only a part of the edge of the substrate is shielded and the light shield moves along the periphery of the substrate, the light shield can be reduced in size, and a light shielding mechanism with less dust generation can be realized. Further, since the light shielding body can be easily retracted and inserted in a short time, the substrate can be replaced in a short time.

<Schematic Configuration of Reflective Exposure Apparatus 100>
FIG. 1 is a schematic side view of the reflective exposure apparatus 100.
The reflective exposure apparatus 100 is roughly divided into a light source 11 that irradiates a light beam in a wavelength region including ultraviolet rays, an illumination optical system 10 that collects the light beam from the light source 11, a mask stage 40 that holds a photomask FM, A reflective projection optical system 50 and a substrate table 60 are provided.

  The reflective exposure apparatus 100 includes an illumination optical system 10 for uniformly illuminating a photomask FM supported in parallel with the XY plane on the mask stage 40. The illumination optical system 10 includes a light source 11 made of, for example, a mercury short arc lamp close to a point light source. Since the light source 11 is disposed at the first focal position of the elliptical mirror, the illumination light beam emitted from the light source 11 forms a light source image at the second focal position of the elliptical mirror via the dichroic mirror 12. The dichroic mirror 12 removes the wavelength components including the g-line, h-line, i-line, and j-line, that is, the wavelength component of 300 nm or less and the wavelength component of 460 nm or more. The light source 11 has an optical path taken from the bottom to the top, but the light path may be taken from the top to the bottom.

  A shutter (not shown) is disposed at the second focal position of the elliptical mirror. The exposure light reaching the substrate CB is cut by the shutter. The divergent light from the light source image is converted into a parallel light beam by the collimator lens 14 and enters the wavelength selection unit 15. The wavelength selection unit 15 is configured to be inserted into and removed from the optical path between the light source 11 and the photomask FM.

The light beam that has passed through the wavelength selector 15 passes through the fly-eye lens 17 and the condenser lens 18 in order.
As shown in FIG. 1, the light beam that has passed through the wavelength selector 15 enters the fly-eye lens 17. The fly-eye lens 17 has a large number of positive lens elements arranged vertically and horizontally and densely so that the central axis extends along the optical axis. Accordingly, the light beam incident on the fly-eye lens 17 is wavefront-divided by a large number of lens elements, and forms a secondary light source composed of the same number of light sources as the number of lens elements on the rear focal plane (ie, in the vicinity of the exit surface). . That is, a substantial surface light source is formed on the rear focal plane of the fly-eye lens 17.

  Light beams from a number of secondary light sources formed on the rear focal plane of the fly-eye lens 17 are incident on the condenser lens 18. The light flux through the condenser lens 18 illuminates the photomask FM on which the pattern is formed in a superimposed manner. The light beam illuminated by the exposure light and transmitted through the photomask FM is directed to the Offner reflection projection optical system 50. The light source 11 included in the illumination optical system 10 may be an ultraviolet radiation type LED or LD.

  The light beam that has passed through the photomask FM is guided into the lens barrel by the reflecting mirror M1, and reflected by the concave mirror M2. The light beam reflected by the concave mirror M2 is reflected by the convex mirror M3 and returns to the concave mirror M2 again. Then, the light beam reflected by the concave mirror M2 is reflected by the reflection mirror M4 and irradiated onto the substrate CB that is an exposure target.

<Schematic Configuration of Mask Stage 40, Reflective Projection Optical System 50, and Substrate Table 60>
FIG. 2 is a schematic perspective view of the reflective exposure apparatus 100 excluding the illumination optical system 10, and is an exploded view of the mask stage 40, the reflective projection optical system 50, and the substrate table 60.
The mask stage 40 has a Y stage 41 for moving the photomask FM along the Y-axis direction that is the scanning direction. The Y stage 41 has a long stroke, and a step-and-scan exposure method is possible. The Y stage 41 is driven at high speed and with high accuracy by linear motors 42 arranged on both sides thereof. The Y stage 41 has an Xθ stage 45 that moves in the θ rotation direction with respect to the X axis direction and the Z axis. The Xθ stage 45 is driven by a ball screw and a drive motor. The Xθ stage 45 has a movable mirror 48, and the position coordinates of the photomask FM are measured by a laser interferometer using the movable mirror 48, and the position is controlled. Further, the Xθ stage 45 is configured such that the position in the Z-axis direction is variable.

  The reflective projection optical system 50 is an optical system called an Offner type. In addition to the reflection mirror, the reflection projection optical system 50 is mounted with a fixed mirror for measurement by a laser interferometer, and is not directly connected to a member that generates vibration.

  The substrate table 60 mounts a substrate. The substrate table 60 has a Y stage 61 having a long stroke for moving along the Y-axis direction that is the scanning direction, and an X stage when the Y stage 61 is moved along the X-axis direction that is the scanning orthogonal direction. 65. Then, the position coordinates of the substrate table 60 are measured and controlled by a laser interferometer (not shown) using a movable mirror 67. The substrate table 60 is also configured to be movable in the Z-axis direction like the mask stage 40. The Y stage 61 and the X stage 65 are respectively driven at high speed and with high accuracy by the linear motor 62 and the linear motor 66 arranged on both sides thereof.

  The substrate table 60 includes a vacuum chuck 69 for sucking the substrate CB, sucking and holding the substrate CB by vacuum suction, and X-axis direction, Y-axis direction, Z-axis direction, and θ-direction by a substrate table drive circuit (not shown). Can be moved to. In addition, the substrate table 60 mounts a guide rail 31 for placing a light shielding body. Further, the focus detection device (not shown) detects the in-focus position of the substrate CB, and the substrate table 60 also moves in the Z-axis direction. In this way, the light beam reflected by the Offner reflection projection optical system 50 enters the substrate CB and forms an image on the substrate CB. That is, a pattern image of the photomask FM is formed on the substrate CB, and this image is transferred onto the substrate CB by the photoresist applied on the substrate CB.

  In the reflection type exposure apparatus 100, all members are mounted on the vibration isolation mount 71 in order to improve exposure accuracy. First, on the four anti-vibration mounts 71, a base 72 made of a stone surface plate, alumina ceramic or metal is mounted. A substrate table 60 is mounted on the base 72. Further, a lens barrel support base 73 is mounted on the base 72 while avoiding the movement range of the substrate table 60. A reflective projection optical system 50 is mounted on the lens barrel support base 73. A mask stage support 75 is mounted on the lens barrel support 73. A mask stage 40 is mounted on the mask stage support 75.

  The reflective projection optical system 50 and the mask stage support 75 are joined by a flange. The member of the mask stage support 75 joined by the flange has a structure in which the load in the Z direction and the vibration in the XY direction are not transmitted to the reflective projection optical system 50 as much as possible. For this reason, vibration generated by the movement of the coarse movement stage 41 or the fine movement stage 45 of the mask stage 40 is hardly transmitted to the reflective projection optical system 50. Further, since the lens barrel support base 73 exists between the reflective projection optical system 50 and the substrate table 60, vibration due to the movement of the substrate table 60 is not directly transmitted.

<< Example 1 >>
In the reflective exposure apparatus 100 of the present invention, the first light-shielding body arrangement portion 32 to which the fan-shaped first light-shielding body 30 is fixed has an outer periphery of the substrate CB so that the edge of the substrate coated with the negative photoresist is unexposed. Is moved to form a light-shielding band 39 that does not form a pattern image of the photomask FM on the edge of the substrate.

  The fan-shaped first light shield 30 has heat when irradiated with light from a light source. Since the generation of ultraviolet rays or heat may cause the first light shield 30 to be deformed, the exposure area EA may be shielded more than necessary. For this reason, the material of the first light shield 30 is a titanium alloy with a heat-resistant coating, an Invar alloy made of Fe-36Ni having a low thermal expansion coefficient, a Kovar alloy made of Fe29Ni-17Co, or a ceramic. That is, the first light shield 30 is made of a material that hardly changes in composition or shape due to heat from the light source or ultraviolet rays.

  By forming the light shielding band 39 in the negative photoresist, it is possible to eliminate the cause of particles such as a residue of the photoresist. Hereinafter, the structure or operation of the first light shielding member 32 and the first light shielding member for forming the light shielding band 39 will be described.

<Falling shades>
FIG. 3A is an enlarged view of the substrate table 60 portion of FIG. 2 as seen from above. As shown in FIG. 3A, the substrate CB is vacuum-sucked on the substrate table 60, and a ring-shaped guide rail 31 is placed so as to surround the substrate CB. A first light shield arrangement portion 32 is placed on the guide rail 31 and can freely move on the outer periphery of the substrate CB. In other words, the first light shield arrangement part 32 can move on the guide rail 31 in the 360 ° direction. For this reason, as the exposure position approaches the edge of the substrate CB, the arrangement position of the first light shield can be obtained from the coordinate position information of the substrate table 60, and it is possible to wait in advance at a predetermined position.

  The position of the substrate table 60 is controlled by mounting movable mirrors 67 in the X and Y directions of the substrate table 60 and using a laser interferometer to control the precise position. Laser light 68 of the laser interferometer is irradiated from the X direction and the Y direction. The position of the rotation direction of the substrate table 60 around the Z axis is also controlled by irradiating two laser beams in the Y direction.

  FIG. 3B is a view further enlarging the vicinity of the first light shielding member arrangement portion 32. The first light shield arrangement portion 32 includes a first light shield 30, a rotary cylinder 33, a linear motor 35, and a support column that supports them.

  FIG. 3C is a cross-sectional view of the vicinity of the first light-shielding body arrangement portion 32 as viewed from the side surface direction (YZ plane) of FIG. The rotary cylinder 33 rotates 180 ° in the vertical direction around the rotation axis 34 to shield the light by covering the substrate CB on the substrate table 60 with the first light shield 30. Further, when replacing the substrate CB, the first light shield 30 can be moved to the retracted position indicated by the dotted line, and the replacement operation can be performed quickly and safely.

FIG. 4 shows a first flowchart of the exposure process in the substrate table 60.
In step S11, the first light shield 30 attached to the first light shield arrangement portion 32 is rotated by the rotary cylinder 33 and brought to the initial state which is the retracted position. In the present embodiment, the rotary cylinder 33 is used as the moving means of the first light shielding body 30, but it may be rotated by other methods.

In step S <b> 12, the substrate table 60 moves to the substrate CB replacement position, and a loader (not shown) places the substrate CB in the center of the substrate table 60. Then, the vacuum chuck 69 vacuum-sucks the substrate CB.
In step S13, the substrate table 60 is moved to the exposure position by the Y stage 61 and the X stage 65. The exact position of the substrate table 60 is controlled using a laser interferometer.

In step S <b> 14, the first light shielding member placement unit 32 is moved on the guide rail 31 in conjunction with the exposure position. The attached first light shield 30 stands by at a retracted position near the exposure position.
In step S15, the first light shield 30 is rotated by the rotary cylinder 33 so as to cover a part of the substrate CB which has been vacuum-adsorbed.

In step S16, the pattern of the photomask FM is exposed to the photoresist coated on the substrate CB. The first light shielding body 30 forms a part of the light shielding band 39 that is not exposed.
In step S17, since the exposure of one exposure area EA has been completed, the first light shield 30 is retracted to the retracted position so that it can be moved to another exposure area EA again.

  In step S18, it is determined whether the pattern of the photomask FM has been transferred to the entire surface of the substrate CB. If not transferred to the entire surface, the process returns to step S13 and the exposure process is repeated. When the entire surface of the substrate CB is exposed, the process proceeds to an end process in step S18. In a state where all the exposure areas EA have been completed, the first light shielding body 30 forms a light shielding band 39 in which the edge portion of the substrate coated with the negative photoresist is unexposed.

  Since the first light shield 30 can be repeatedly retracted and installed in a short time, the substrate CB can be removed safely and in a short time. The reflective exposure apparatus 100 is ready to place a new substrate CB on the substrate table 60. The exposure process can be quickly processed by moving to step S12 again.

  FIG. 5 shows a second flowchart of the exposure process in the substrate table 60. In this second flowchart, after the substrate CB is placed, all the exposure areas EA are exposed while the first light shield 30 is placed on the edge of the substrate CB, and the first light shield 30 is removed before the substrate CB is replaced. Evacuate.

In step S31, the first light shield 30 attached to the first light shield arrangement portion 32 is rotated by the rotary cylinder 33 and brought to the retreat position.
In step S32, the substrate CB is placed on the suction portion 69 of the substrate table 60 and fixed by vacuum suction.
In step S33, the first light shield 30 is rotated and installed by the rotary cylinder 33 so as to cover a part of the edge of the substrate CB vacuum-adsorbed.

In step S <b> 34, the substrate table 60 is arranged so that the exposure area EA is below the reflective projection optical system 50. The exact position of the exposure position is controlled using a laser interferometer.
In step S35, the first light shield 30 is moved to a predetermined position by moving the first light shield arrangement portion 32 in conjunction with the movement of the substrate table 60. The first light shield 30 forms a part of the light shielding band 39 that is not exposed.

In step S36, the pattern of the photomask FM is exposed and transferred to the photoresist applied on the substrate CB.
In step S37, it is determined whether the pattern of the photomask FM has been transferred to the entire surface of the substrate CB. If it has not been transferred to the entire surface, the process returns to step S34 to repeat the exposure process. When the entire surface of the substrate CB is exposed, the process proceeds to an end process in step S38.

In step S38, the first light shield 30 is retracted. Then, the substrate CB on which all the exposure areas EA are exposed is replaced.
Since the first light shield 30 can be retracted in a short time, the reflective exposure apparatus 100 is ready to place a new substrate on the substrate table 60. Therefore, the exposure process can be quickly performed by moving again to step S32.

<< Example 2 >>
<Horizontal moving shade>
In the first embodiment, the first light shield 30 is installed and retracted by rotating the first light shield 30 of the first light shield arrangement portion 32 in the vertical direction. In the second embodiment, the first light shield 30 is moved and moved in the horizontal direction so that the first light shield 30 is installed and retracted.

  FIG. 6A is a cross-sectional view of the vicinity of the first light shielding member arranging portion 32-2 in which the first light shielding member 30 moves horizontally on the XY plane. FIG. 6B is a view of the vicinity of the first light shield placement unit 32-2 as viewed from above (Z direction).

  The first light blocking body 30 that moves in the horizontal direction is moved horizontally from the retracted position (shown by a dotted line) to the installation position (shown by a solid line) around the rotary shaft 34-2 using a rotary cylinder 33-2 or the like. The substrate CB is shielded from light. By changing the size of the first light shielding body 30, the width of the light shielding band 39 can be adjusted, and the exposure area EA can be adjusted to a position where it can be used effectively. Further, when moving in the horizontal direction, since the air resistance is lower than when the first light shield 30 rotates in the vertical direction, there is less risk of winding up the dust.

  The first light shield 30 that rotates horizontally as shown in FIG. 6B is rotated 90 ° and moved to the retracted position by using the rotary cylinder 33-2, but the first light shield 30 is moved to the substrate CB. Therefore, it may be rotated by 180 °. The moving means may be a stepping motor other than the rotary cylinder 33-2.

  Note that the exposure process of the second embodiment can be performed in the same manner as the flowchart described with reference to FIG.

<< Example 3 >>
In Example 1 or Example 2, one light-shielding body placement unit is installed, but two or more light-shielding body placement units can be installed. The specific example is illustrated below. The same members as those in the first embodiment or the second embodiment are denoted by the same reference numerals.

  For example, FIG. 7 shows a substrate table 60 on which two light shielding member placement portions are placed. Since the 1st light-shielding body arrangement | positioning part 32 and the 2nd light-shielding body arrangement | positioning part 37 can move freely on the guide rail 31, it is necessary to arrange | position in the position which does not collide with each other. Although FIG. 7 shows the case where the second light shielding element arrangement part is installed at the symmetrical position of the first light shielding element arrangement part, adjacent positions may be used.

  The two light shielding body arrangement portions fix light shielding bodies of different sizes. For example, the first light-shielding body placement unit 32 installs the first light-shielding body 30 for the substrate size A, and the second light-shielding body placement unit 32 installs the second light shielding body 36 for the substrate size B having a small diameter. Further, the first light shield 30 forms a light shielding band 39 optimum for the substrate size A, and the second light shielding body 36 has a fan shape suitable for the substrate size B, and forms the light shielding band 39 optimum for the substrate size B. To do.

  FIG. 7 shows a light-shielding band 39 when the substrate size B is shielded by the second light-shielding body 36. At this time, since the first light shield 30 is not necessary, the first light shield 30 is disposed at the retracted position as shown in FIG. In addition, when the substrate is replaced, the first light shield 30 and the second light shield 36 move to the retracted position.

  The mechanism for retracting the light shielding body may be the tilting method of the first embodiment or the horizontal movement method of the second embodiment. The exposure process can be performed in the same manner as the flowchart shown in FIG. The material of the second light shield 36 is also a titanium alloy with a heat-resistant coating, an invar alloy made of Fe-36Ni having a low thermal expansion coefficient, or a kovar alloy or ceramic made of Fe29Ni-17Co.

  By installing a plurality of light shield arrangement portions as described above, it is possible to form a light shielding band 39 suitable for a plurality of sizes of substrates, and to provide a versatile reflective exposure apparatus 100.

With respect to the first and second embodiments, one light shield arrangement portion 32 moves on one ring-shaped guide rail 31. However, the ring shape is divided into two or three, and each guide is arranged. You may make it arrange | position a light-shielding body arrangement | positioning part on a rail. When the next exposure area EA becomes the opposite edge of the substrate CB, the other light-shielding body arrangement part can quickly move to the next exposure area EA.
In addition, the substrate CB forms a notch portion in which a part of the edge portion of the substrate CB is called a notch or orientation flat. In the third embodiment, the second light-shielding body 36 having a size different from that of the first light-shielding body 30 in the radial direction of the substrate CB is arranged. However, even if the second light-shielding body 36 has a shape corresponding to the cutout portion. Good.

1 is a schematic side view of a reflective exposure apparatus 100. FIG. 1 is a schematic perspective view of a reflection type exposure apparatus 100 excluding an illumination optical system 10, and is an exploded view of a mask stage 40, a reflection projection optical system 50, and a substrate table 60. FIG. (A) is the figure which looked at the substrate table 60 from the upper part. (B) is the figure which expanded the 1st light-shielding body arrangement | positioning part 32 further. (C) is sectional drawing which looked at the 1st light-shielding body arrangement | positioning part 32 vicinity from the side surface direction. 5 is a first flowchart of an exposure process in the substrate table 60. 12 is a second flowchart of an exposure process in the substrate table 60. It is sectional drawing of the 2nd light-shielding body arrangement | positioning part 32-2 vicinity which moves to a horizontal direction. The board | substrate table 60 which mounted two light-shielding body arrangement | positioning parts is shown. (A) is a figure which shows the light-shielding body which covers the whole surface of the conventional board | substrate. (B) is A sectional drawing of (a). (C) is a figure which shows arrangement | positioning of the conventional movable light-shielding body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Illumination optical system 11 ... Light source 12 ... Dichroic mirror 14 ... Collimating lens 15 ... Wavelength selection part 17 ... Fly eye lens 18 ... Condenser lens 30 ... 1st light shield 31 ... Ring-shaped rail 32 ... 1st light shield arrangement part 33 ... Rotary cylinder 34 ... Rotating shaft 35 ... Linear motor 36 ... Second light shield 37 ... Second light shield arrangement part 39 ... Light shield 40 ... Mask stage (41 ... Y stage, 45 ... Xθ stage)
42 ... Linear motor 48 ... Moving mirror 50 ... Reflective projection optical system 60 ... Substrate table (61 ... Y stage, 65 ... X stage)
62, 66 ... Linear motor 67 ... Moving mirror 68 ... Laser beam 69 ... Vacuum chuck 71 ... Anti-vibration mount 72 ... Base 73 ... Lens barrel support base 75 ... Mask stage support base 100 ... Reflective exposure apparatus FM ... Photomask M1 , M4 ... Reflection mirror M2 ... Concave mirror M3 ... Convex mirror CB ... Substrate EA ... Exposure area

Claims (7)

In a projection exposure apparatus that irradiates a light beam including ultraviolet rays onto a mask and exposes a light beam that has passed through the mask through a projection optical system onto a substrate coated with a negative photoresist,
A substrate table having a suction section for sucking the substrate;
A first light-blocking body that blocks the exposure light;
A first light-shielding body placement portion for placing the first light-shielding body at a part of an edge of the substrate;
A moving unit that is placed on the substrate table and moves the first light shielding member arrangement unit to an arbitrary position around the substrate;
A projection exposure apparatus comprising: The projection exposure apparatus according to claim 1, wherein the moving unit includes a circular guide rail disposed around the suction unit. 3. The projection exposure apparatus according to claim 1, wherein the first light-shielding body arrangement unit rotates the first light-shielding body about an axis parallel to the substrate surface. 3. The projection exposure apparatus according to claim 1, wherein the first light-shielding body arrangement unit moves the first light-shielding body in a direction parallel to the substrate surface. 5. The projection exposure apparatus according to claim 1, wherein the first light shielding body is formed of a material that hardly changes in composition or shape due to heat or ultraviolet rays due to the light rays. 6. . Furthermore, a second light-shielding body arrangement part that arranges a second light-shielding body having a shape different from that of the first light-shielding body at a part of an edge of the substrate,
5. The projection exposure apparatus according to claim 1, wherein the moving unit moves the second light-shielding body arranging unit to an arbitrary position around the substrate. 6. The projection exposure apparatus according to claim 6, wherein the second light shield has a diameter direction length of the substrate different from that of the first light shield.