JP2009103911A - Method of manufacturing display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a display panel capable of effectively preventing intrusion of gas from an end part and a part close to a cutting part of a liquid crystal cell. <P>SOLUTION: The method of manufacturing the display panel having a first substrate, a second substrate disposed opposite to the first substrate and a sealing member disposed between the first and the second substrates includes: a step of forming a planarization layer composed of an organic material at the end part and part of upper and lower parts of the panel; and a step of forming a gas barrier layer composed of an inorganic material to cover the planarization layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display panel, and more particularly to a method for manufacturing a display panel having a gas barrier layer at an end portion.

  In a liquid crystal cell in which liquid crystal is sealed between film substrates, gas may enter a region where liquid crystal is sealed and bubbles may be generated. Here, the liquid crystal cell refers to a structure excluding the polarizing plate in the liquid crystal panel.

  As a method of suppressing the generation of bubbles, a method is known in which an epoxy adhesive is provided as a gas barrier layer at the end of a liquid crystal cell so that gas does not enter the liquid crystal cell from the end of the liquid crystal cell (for example, Patent Document 1). However, organic materials such as epoxy adhesives cannot completely prevent the ingress of gas, and bubbles may still be generated due to the ingress of gas into the liquid crystal cell.

  In addition, a thin film made of a light emitting material capable of obtaining electroluminescence (EL) is disposed between two substrates, and DLC (Diamond like Carbon) is used as a gas barrier layer on its end face to prevent water vapor from entering. It is known to form a film (for example, Patent Document 2).

Japanese Patent Laid-Open No. 2001-221998 (FIG. 2) Japanese Patent Laid-Open No. 2002-151253 (FIG. 1)

  FIG. 1 is a diagram for explaining a part of the manufacturing process of the liquid crystal cell.

  As shown in FIG. 1A, a first substrate 111, a first transparent electrode pattern 112, a first alignment layer 113, a liquid crystal layer 114, a second alignment layer 115, a second transparent electrode pattern 116, A plurality of liquid crystal cells 110 each including a second substrate 117, a plurality of sphere spacers 118, a sealant 119, and the like are formed at the same time, and gas is prevented from entering the outside of the first substrate 111 and the second substrate 117. Therefore, the second gas barrier layer 121 and the third gas barrier layer 122 are formed by a plasma coating method.

  Thereafter, in FIG. 1A, portions indicated by arrows a and b are cut by a cutter (not shown), and the liquid crystal cell 110 is cut out individually. Here, there are cases where the second gas barrier layer 121 indicated by dotted lines c and d, the third gas barrier layer 122 indicated by dotted lines e and f, and the like are cracked by being cut by the cutter. is there.

  FIG. 1B is a partially enlarged view of the end face of the liquid crystal cell 110 cut by a cutter. As shown in the drawing, a large number of fine grooves g having a depth of about 1 μm are formed on the cut face. There is a case. Microscopically, the groove g is considered to be generated in order to cut the flexible substrate so as to be torn with a round blade at the tip.

  Therefore, when the depth of the groove g is deep, even if the end portion of the liquid crystal cell 110 is coated with the inorganic gas barrier layer as it is, the portion up to the groove g cannot be coated, and the gas from the groove g portion cannot be coated. In some cases, it may be impossible to completely prevent the entry of the vehicle.

  Further, in the vicinity of the cut portion of the first substrate 111 and the second substrate 117 (dotted lines cf in FIG. 1), the second and third gas barrier layers 121 and 122 may be cracked. Even if the gas barrier layer is provided only at the end, there may be a problem that gas enters from the cracked portion. In addition, a polarizing plate is disposed on the second and third gas barrier layers 121 and 122 via an adhesive layer, respectively, but the gas generated from the adhesive layer is the second and third gas barriers described above. There is a possibility that a problem of entering the liquid crystal cell from the cracked portions of the layers 121 and 122 may occur.

  Accordingly, an object of the present invention is to provide a method for manufacturing a display panel that can effectively prevent gas from entering from the end of a liquid crystal cell and the vicinity of a cut portion.

  In order to achieve the above object, in a method of manufacturing a liquid crystal panel according to the present invention, a first substrate, a second substrate disposed to face the first substrate, the first substrate, the second substrate, A display panel having a sealing member disposed between the substrate, a step of forming a planarizing layer on an end of the panel, and a part of the upper part and the lower part, and covering the planarizing layer And a step of forming a gas barrier layer. Furthermore, in another method for manufacturing a liquid crystal panel according to the present invention, the first substrate, the second substrate disposed opposite to the first substrate, and the first substrate and the second substrate are disposed. A method of manufacturing a display panel having a sealed member, which includes a step of forming a gas barrier layer on an end portion of the panel and part of an upper portion and a lower portion.

  In the display panel manufactured according to the method for manufacturing a liquid crystal panel according to the present invention, it is possible to prevent gas from entering from the edge of the display panel and the vicinity of the cut portion, and bubbles are generated in the display area. It can be avoided.

  A display panel manufacturing method according to the present invention will be described below with reference to the drawings. In Example 1, a method for forming a planarization layer, an inorganic gas barrier layer, and an organic gas barrier layer on an end portion of a liquid crystal panel as an example of a display panel will be described. In Example 2, a planarization layer and an end portion of a liquid crystal panel A method for forming the inorganic gas barrier layer will be described. In Example 3, a method for forming only the inorganic gas barrier layer at the end of the liquid crystal panel will be described.

  FIG. 2 is a schematic cross-sectional view of the liquid crystal panel according to Embodiment 1 of the present invention.

  The liquid crystal panel 100 includes a liquid crystal cell 110, a first polarizing plate 130 disposed on the upper surface x of the liquid crystal cell 110, a first adhesive layer 132 for fixing the first polarizing plate 130, and a lower surface of the liquid crystal cell 110. the second polarizing plate 131 disposed on y, the second adhesive layer 133 for fixing the second polarizing plate 131, a part of the upper surface x of the liquid crystal cell 110 (near the cutting position), and the lower surface y. The first gas barrier layer 140 and the like are disposed so as to cover the portion (near the cut portion) and the end z (cut surface).

  The liquid crystal cell 110 includes a first substrate 111, a second substrate 117, a sealing material 119, a plurality of spherical spacers 118 arranged to maintain a distance between the first and second substrates 111 and 117, a first and a second. Liquid crystal layer 114 sealed between the substrates 111 and 117 and the sealant 119, the second gas barrier layer 121 disposed on the first substrate 111, and the second layer disposed on the second substrate 117. 3 gas barrier layers 122 and the like. In addition, a first transparent electrode pattern 112 and a first alignment film 113 are formed on the first substrate 111, and a second opposite to the first transparent electrode pattern 112 is formed on the second substrate 117. The transparent electrode pattern 116 and the second alignment film 115 are formed. For the sake of explanation, it should be noted that the scale in FIG. 2 may differ from the actual scale.

  As the liquid crystal 114, a commonly used TN (twisted nematic) liquid crystal or the like is used.

  The first and second substrates 111 and 117 are flexible and formed of a polycardnate resin having a thickness of 100 μm. However, the first and second substrates 111 and 117 are not limited to this, and are modified acrylic resin, polymethacrylic resin, polyethersulfone resin, polyethylene terephthalate resin, norboltene resin, glass, and the like. The thickness can be 50 to 250 μm.

  The first and second transparent electrode patterns 112 and 116 are formed by forming a transparent conductive film made of ITO having a thickness of about 0.03 μm on the first and second substrates 111 and 117, respectively, by sputtering. Then, it is patterned by removing unnecessary portions by etching. Predetermined wiring is applied to the first and second transparent electrode patterns, and a predetermined voltage is applied from a display drive control unit (not shown) of the liquid crystal panel 100. The display drive control unit of the liquid crystal panel 100 switches the liquid crystal layer 114 between the transmissive mode and the non-transmissive mode by applying a predetermined voltage between the first and second transparent electrode patterns 112 and 116. Configured to be able to do.

  The second and third gas barrier layers 121 and 122 are made of silicon dioxide, and are formed on the first and second substrates 111 and 117 by a sputtering method when the liquid crystal cell is manufactured.

  The first gas barrier layer 140 includes a planarization layer 141, an inorganic gas barrier layer 142 made of an inorganic material, and an organic protective layer 143. In FIG. 2, only a partial cross-sectional view of the liquid crystal panel 100 is shown, but the gas barrier layer 140 is assumed to be disposed almost all around the liquid crystal cell 110.

  As the planarizing layer 141, “MAXIVE” (registered trademark), which is a gas barrier resin mainly composed of an epoxy resin that is an organic substance, is applied so that the film thickness when dried is about 5 to 10 μm. As described above, in the vicinity of the cut portion of the upper surface x and the lower surface y of the liquid crystal cell 110, a crack generated at the time of cutting may occur, and there is a possibility that gas enters from the cracked portion as it is. Furthermore, even if an attempt is made to coat the cracked portion with an inorganic gas barrier by sputtering or the like, the cracked portion is not reliably covered with the inorganic gas barrier layer, and gas entry cannot be prevented. Similarly, a fine groove formed at the time of cutting is formed at the end z of the liquid crystal cell 110 (see FIG. 1B). Even if the inorganic gas barrier layer is coated as it is by sputtering or the like, the groove is formed in the inorganic gas barrier layer. It is not reliably covered with, and gas entry cannot be prevented. Therefore, in order to fill the cracks and grooves, the planarization layer 141 was first provided so as to cover the vicinity of the cut portion of the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z. In this embodiment, as the planarization layer 141, a resin mainly composed of an epoxy resin that also has gas barrier performance is used. Therefore, the gas barrier performance can be further improved.

  As the inorganic gas barrier layer 142, silicon dioxide is used and is formed by a sputtering method so that the film thickness becomes 100 nm. The inorganic gas barrier layer is not limited to silicon dioxide, and may be composed of, for example, silicon nitride, DLC, aluminum foil, copper foil, or the like. If the film thickness is 10 nm or more, it is possible to obtain desired gas barrier characteristics. Since the inorganic gas barrier layer 142 is formed on the surface smoothed by the planarization layer 141, the vicinity of the cut portion of the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z can be reliably covered.

  As the organic protective layer, “MAXIVE” (registered trademark), which is a gas barrier resin mainly composed of an epoxy resin, is used, and the organic protective layer 143 is applied so that the film thickness when dried is about 5 to 10 μm. Since the gas barrier function is sufficient by the planarization layer 141 and the inorganic gas barrier layer 142 having gas barrier properties, the organic protective layer 143 is not necessarily provided. However, since the inorganic gas barrier layer 142 is hard, scratches and cracks may occur in addition to the pin poles during film formation, and the organic protective layer 143 is a gas barrier caused by such pin poles, scratches, cracks, and the like. The purpose is to compensate for the lack of characteristics. Therefore, by providing the organic protective layer 143, the gas barrier characteristics of the vicinity of the cut portion of the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z can be firmly maintained.

  FIG. 3 is a diagram for explaining a manufacturing process of the liquid crystal panel.

  FIG. 3A shows a state in which a plurality of liquid crystal cells 110 formed simultaneously are cut by a cutter and one liquid crystal cell 110 is cut out (that is, a state after the step of FIG. 1).

  In the state shown in FIG. 3A, the liquid crystal cell 110 includes a first substrate 111, a first transparent electrode pattern 112, a first alignment film 113, a liquid crystal layer 114, a second alignment film 115, and a second transparent film. The electrode pattern 116, the second substrate 117, the sphere spacer 118, the sealing material 119, the second gas barrier layer 121, the third gas barrier layer 122, and the like are included. Further, as described above, in the vicinity of the cut portions c and e of the upper surface x and the lower surface y of the liquid crystal cell 110, there are cracks generated at the time of cutting, and fine grooves formed at the time of cutting are formed at the end z. (See FIG. 1B).

  FIG. 3B is a diagram showing a state in which the planarizing layer 141 is applied so as to cover the cut portions c and e on the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z.

  The planarization layer 141 is applied using a jig as shown in FIG. That is, the liquid crystal cell 110 shown in FIG. 3A is sandwiched between the metal plate 201 disposed on the base 200 and the magnet 202 and fixed so that the peripheral edge of the liquid crystal cell 110 is easily applied. Since the liquid crystal cell 110 is fixed by the magnetic force between the magnet 202 and the metal plate 201, the flattening layer 141 can be easily applied without damaging the liquid crystal cell 110 and without using a special adhesive or the like. It can be carried out.

  After fixing the liquid crystal cell 110, a solution 212 in which “Maxive” (registered trademark), which is a gas barrier resin mainly composed of an epoxy resin, and a solvent is attached to the tip of the melamine resin sponge 210, and a predetermined liquid crystal cell 110 is fixed. Work to apply to the area. In addition to the melamine resin sponge 210, a high-density sponge, a high-definition fiber cloth, or the like can be used for applying the planarization layer 141. After the application of the solution 212, the liquid crystal cell 110 is baked at 60 to 80 ° C. for about 1 hour, the solvent is removed, and the application of the planarization layer 141 is completed. Note that the planarization layer 141 may be formed by repeating the application of the solution in a plurality of times.

  FIG. 3C is a diagram showing a state in which the inorganic gas barrier layer 142 is formed on the planarization layer 141.

The inorganic gas barrier layer 142 is formed by a sputtering method. While the liquid crystal cell 100 is rotated, a film is formed by reacting silicon and oxygen that have jumped out of the target 221 in a mixed atmosphere of argon and oxygen. As shown in FIG. 5A, a stacked body 230 in which a large number of liquid crystal cells 100 are stacked is placed on a small turntable 223. The laminated body 230 is fixed to the small turntable by a support portion (not shown) provided in a part of the spacer. The small turntable 223 is arranged on a large turntable 222 that rotates in the k direction and revolves in the j direction within the container 220. FIG. 5B is a cross-sectional view of a portion that passes through the opening of the liquid crystal panel laminate 230 provided with an opening at the end of the substrate. As shown in FIG. 5B, the stacked body 230 is formed by alternately stacking about 30 liquid crystal cells 100 and spacers 231 that are slightly smaller than the liquid crystal cells 110. It is arranged to be exposed. The spacer can be formed using, for example, aluminum. Since the silicon dioxide molecules 241 collide with the argon molecules 240 and move randomly, the inorganic gas barrier layer 142 having a predetermined thickness (for example, 100 nm) can be uniformly formed near the end of the liquid crystal cell 110. Become. Here, the distance from the liquid crystal panel end to the spacer end is preferably about 2 to 5 mm.
Since the vicinity of the end of the liquid crystal cell 110 is exposed, for example, even when the liquid crystal cell 110 has the opening 150 shown in FIG. An inorganic gas barrier layer can be formed satisfactorily.

  FIG. 3D is a view showing a state where the organic protective layer 143 is applied on the inorganic gas barrier layer 142.

  The organic protective layer 143 is applied in the same manner as the flattening layer 141 by using a jig as shown in FIG. 4 and a gas barrier resin mainly composed of an epoxy resin at the tip of the melamine resin sponge 210. A solution 212 in which a certain “MAXIVE” (registered trademark) and a solvent are mixed is attached, and the liquid 212 is applied to a predetermined region of the liquid crystal cell 110. After application of the solution 212, the liquid crystal cell 110 is baked at 60 to 80 ° C. for about 1 hour, the solvent is removed, and the application of the organic protective layer 143 is completed.

  As described above, the first gas barrier layer 140 is formed at the end of the liquid crystal cell 110 and in the vicinity thereof by the manufacturing process shown in FIGS. As shown in FIG. 3D, it is desirable that the first gas barrier layer 140 covers the end portion of the liquid crystal cell 110 from the cut portion of the liquid crystal cell 110 to the range of the distance w. In this embodiment, the distance w is 0.5 mm.

  After the formation of the first gas barrier layer 140, the first adhesive layer 132 and the first polarizing plate are disposed on the upper surface x of the liquid crystal cell 110 so as to avoid the first gas barrier layer 140. The second adhesive layer 132 and the first polarizing plate are disposed on the lower surface y to complete the liquid crystal panel 100.

  By the way, when an aluminum foil is used as the inorganic gas barrier layer 142, after applying the flattening layer 141, the aluminum foil is adhered so as to cover the application surface, and the bubbles are eliminated by applying pressure with an autoclave pressurizing device. Then, an adhesive is applied to the end of the aluminum foil to complete the arrangement of the aluminum foil. Note that the resin used for the planarization layer 141 is preferably used for bonding the aluminum foil.

  The second embodiment is different from the first embodiment in that an organic gas barrier layer is not formed on the inorganic gas barrier layer 142. A cross-sectional structure of the liquid crystal panel of Example 2 is shown in FIG.

  The structure of the liquid crystal panel 100 is the same as that of the first embodiment. In the present embodiment, the first gas barrier layer 140 includes a planarization layer 141 and an inorganic gas barrier layer 142. In FIG. 6, only a partial cross-sectional view of the liquid crystal panel 100 is shown, but the gas barrier layer 140 is assumed to be disposed almost all around the liquid crystal cell 110.

  The formation method of the planarization layer 141 and the formation method of the inorganic gas barrier layer 142 are the same as those in the first embodiment. In the case where the gas barrier function is sufficient by the planarization layer 141 and the inorganic gas barrier layer 142 having gas barrier properties, it is not necessary to provide an organic protective layer on the inorganic gas barrier layer 142.

  FIG. 7 is a diagram for explaining a manufacturing process of the liquid crystal panel in the second embodiment.

  FIG. 7A shows a state in which a plurality of liquid crystal cells 110 formed simultaneously are cut by a cutter and one liquid crystal cell 110 is cut out (that is, a state after the step of FIG. 1).

  In the state shown in FIG. 7A, the liquid crystal cell 110 includes a first substrate 111, a first transparent electrode pattern 112, a first alignment film 113, a liquid crystal layer 114, a second alignment film 115, and a second transparent film. The electrode pattern 116, the second substrate 117, the sphere spacer 118, the sealing material 119, the second gas barrier layer 121, the third gas barrier layer 122, and the like are included. Further, as described above, in the vicinity of the cut portions c and e of the upper surface x and the lower surface y of the liquid crystal cell 110, there are cracks generated at the time of cutting, and fine grooves formed at the time of cutting are formed at the end z. (See FIG. 1B).

  FIG. 7B is a view showing a state in which the planarization layer 141 is applied so as to cover the cut portions c and e on the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z.

  The method for applying the planarizing layer 141 is the same as that in the first embodiment.

  FIG. 7C is a view showing a state in which the inorganic gas barrier layer 142 is formed on the planarization layer 141.

The inorganic gas barrier layer 142 is formed by a sputtering method. The film is formed by reacting silicon and oxygen that have jumped out of the target 221 in a mixed atmosphere of argon and oxygen while rotating the liquid crystal cell 100. As shown in FIG. 5A, the stacked body 230 in which a large number of liquid crystal cells 100 are stacked rotates on the large turntable 222 disposed in the container 220 and revolves in the j direction. It is placed on a small turntable 223. The laminated body 230 is fixed to the small turntable by a support portion (not shown) provided in a part of the spacer. FIG. 5B is a cross-sectional view of a portion that passes through the opening of the liquid crystal panel laminate 230 provided with an opening at the end of the substrate. As shown in FIG. 5B, the stacked body 230 is formed by alternately stacking about 30 liquid crystal cells 100 and spacers 231 that are slightly smaller than the liquid crystal cells 110. It is arranged to be exposed. The spacer can be formed using, for example, aluminum. Since the silicon dioxide molecules 241 collide with the argon molecules 240 and move randomly, the inorganic gas barrier layer 142 having a predetermined thickness (for example, 100 nm) can be uniformly formed near the end of the liquid crystal cell 110. Become. Here, the distance from the liquid crystal panel end to the spacer end is preferably about 2 to 5 mm.
In addition, since it arrange | positions so that the edge part vicinity of the liquid crystal cell 110 may be exposed, even if the liquid crystal cell 110 has the opening part 150 shown in FIG.5 (b), for example, the opening part 150 is shown. An inorganic gas barrier layer can be formed well on this part.

  As described above, the first gas barrier layer 140 is formed at the end of the liquid crystal cell 110 and in the vicinity thereof by the manufacturing steps shown in FIGS. As shown in FIG. 7C, it is desirable that the first gas barrier layer 140 covers the end portion of the liquid crystal cell 110 from the cut position of the liquid crystal cell 110 to the range of the distance w. In this embodiment, the distance w is 0.5 mm.

  After the formation of the first gas barrier layer 140, the first adhesive layer 132 and the first polarizing plate are disposed on the upper surface x of the liquid crystal cell 110 so as to avoid the first gas barrier layer 140. The second adhesive layer 132 and the first polarizing plate are disposed on the lower surface y to complete the liquid crystal panel 100.

  By the way, when an aluminum foil is used as the inorganic gas barrier layer 142, after applying the flattening layer 141, the aluminum foil is adhered so as to cover the application surface, and the bubbles are eliminated by applying pressure with an autoclave pressurizing device. Then, an adhesive is applied to the end of the aluminum foil to complete the arrangement of the aluminum foil. Note that the resin used for the planarization layer 141 is preferably used for bonding the aluminum foil.

  The third embodiment is characterized in that the inorganic gas barrier layer 142 is formed directly on the edge of the liquid crystal panel without forming a planarizing layer. The cross-sectional structure of the liquid crystal panel of Example 3 is shown in FIG.

  The structure of the liquid crystal panel 100 is the same as that of the first embodiment. In the present embodiment, the first gas barrier layer 140 is composed only of the inorganic gas barrier layer 142. In FIG. 8, only a partial cross-sectional view of the liquid crystal panel 100 is shown, but the gas barrier layer 140 is assumed to be disposed almost all around the liquid crystal cell 110.

  In this example, the gas barrier layer is formed only by the inorganic gas barrier layer 142. However, when the crack depth when cutting the substrate is shallow and the generation of bubbles can be sufficiently suppressed only by the inorganic barrier layer, the gas barrier layer is planarized. No layer is required.

  FIG. 9 is a diagram for explaining a manufacturing process of the liquid crystal panel in the third embodiment.

  FIG. 9A shows a state in which a plurality of liquid crystal cells 110 formed simultaneously are cut by a cutter and one liquid crystal cell 110 is cut out (that is, a state after the step of FIG. 1).

  In the state shown in FIG. 9A, the liquid crystal cell 110 includes a first substrate 111, a first transparent electrode pattern 112, a first alignment film 113, a liquid crystal layer 114, a second alignment film 115, and a second transparent film. The electrode pattern 116, the second substrate 117, the sphere spacer 118, the sealing material 119, the second gas barrier layer 121, the third gas barrier layer 122, and the like are included. Here, in the vicinity of the cut portions c and e of the upper surface x and the lower surface y of the liquid crystal cell 110, this embodiment is effective when no cracks are generated at the time of cutting and the groove formed in the end z is shallow.

  FIG. 9B is a diagram showing a state in which the inorganic gas barrier layer 142 is formed so as to cover the cutting portions c and e on the upper surface x and the lower surface y of the liquid crystal cell 110 and the end z.

The inorganic gas barrier layer 142 is formed by a sputtering method. While the liquid crystal cell 100 is rotated, a film is formed by reacting silicon and oxygen that have jumped out of the target 221 in a mixed atmosphere of argon and oxygen. As shown in FIG. 10A, the stacked body 230 in which a large number of liquid crystal cells 100 are stacked rotates in the k direction and is disposed on the large turntable 222 that is disposed in the container 220 and revolves in the j direction. It is placed on a small turntable 223. The laminated body 230 is fixed to the small turntable by a support portion (not shown) provided in a part of the spacer. FIG. 10B is a cross-sectional view of a portion that passes through the opening of the liquid crystal panel laminate 230 provided with an opening at the end of the substrate. As shown in FIG. 10B, the stacked body 230 is formed by alternately stacking about 30 liquid crystal cells 100 and spacers 231 that are slightly smaller than the liquid crystal cells 110. It is arranged to be exposed. The spacer can be formed using, for example, aluminum. Since the silicon dioxide molecules 241 collide with the argon molecules 240 and move randomly, the inorganic gas barrier layer 142 having a predetermined thickness (for example, 100 nm) can be uniformly formed near the end of the liquid crystal cell 110. Become. Here, the distance from the liquid crystal panel end to the spacer end is preferably about 2 to 5 mm.
Since the vicinity of the end portion of the liquid crystal cell 110 is exposed, for example, even when the liquid crystal cell 110 has the opening 150 shown in FIG. An inorganic gas barrier layer can be formed satisfactorily.

  As described above, the first gas barrier layer 140 is formed at the end portion of the liquid crystal cell 110 and in the vicinity thereof by the manufacturing process shown in FIGS. As shown in FIG. 9B, it is desirable that the first gas barrier layer 140 covers the end portion of the liquid crystal cell 110 from the cut portion of the liquid crystal cell 110 to the range of the distance w. In this embodiment, the distance w is 0.5 mm.

  After the formation of the first gas barrier layer 140, the first adhesive layer 132 and the first polarizing plate are disposed on the upper surface x of the liquid crystal cell 110 so as to avoid the first gas barrier layer 140. The second adhesive layer 132 and the first polarizing plate are disposed on the lower surface y to complete the liquid crystal panel 100.

By the way, when an aluminum foil is used as the inorganic gas barrier layer 142, after applying the flattening layer 141, the aluminum foil is adhered so as to cover the application surface, and the bubbles are eliminated by applying pressure with an autoclave pressurizing device. Then, an adhesive is applied to the end of the aluminum foil to complete the arrangement of the aluminum foil. Note that the resin used for the planarization layer 141 is preferably used for bonding the aluminum foil.
Further, it is better to form a resin gas barrier layer outside the inorganic gas barrier layer.

  In this embodiment, the liquid crystal panel has been described as an example. However, in other types of display panels such as an organic electroluminescence display and an electrophoretic display panel, a gas barrier layer that similarly prevents entry of water vapor or the like. Can be formed.

It is a figure for demonstrating a part of manufacturing process of a liquid crystal cell. It is a schematic sectional drawing of the liquid crystal panel which concerns on Example 1 of this invention. It is a figure for demonstrating the manufacturing process of the liquid crystal panel which concerns on Example 1 of this invention. It is a figure which shows the jig | tool for application | coating of a planarization layer. It is a figure for demonstrating the film-forming method of the inorganic gas barrier layer which concerns on Example 1 of this invention. It is a schematic sectional drawing of the liquid crystal panel which concerns on Example 2 of this invention. It is a figure for demonstrating the manufacturing process of the liquid crystal panel which concerns on Example 2 of this invention. It is a schematic sectional drawing of the liquid crystal panel which concerns on Example 3 of this invention. It is a figure for demonstrating the manufacturing process of the liquid crystal panel which concerns on Example 3 of this invention. It is a figure for demonstrating the film-forming method of the inorganic gas barrier layer which concerns on Example 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Liquid crystal panel 110 Liquid crystal cell 111 1st board | substrate 114 Liquid crystal layer 117 2nd board | substrate 119 Seal member 140 1st gas barrier layer 141 Planarization layer 142 Inorganic gas barrier layer 143 Organic protective layer

Claims (10)

A first substrate;
A second substrate disposed opposite the first substrate;
A manufacturing method of a display panel having a sealing member disposed between the first substrate and the second substrate,
Forming a planarization layer on the edge of the panel and part of the upper and lower parts;
Forming a gas barrier layer so as to cover the planarizing layer. A first substrate;
A second substrate disposed opposite the first substrate;
A manufacturing method of a display panel having a sealing member disposed between the first substrate and the second substrate,
A method for manufacturing a display panel, comprising: an end portion of the panel; and a step of forming a gas barrier layer on a part of an upper portion and a lower portion. In the step of forming the gas barrier layer,
The method of manufacturing a display panel according to claim 1, further comprising a step of stacking a plurality of display panels via spacers to form the gas barrier layer.   The method of manufacturing a display panel according to claim 3, wherein an outer shape of the spacer is smaller than an outer shape of the panel.   The method for manufacturing a display panel according to claim 4, wherein the spacer is disposed 2 to 5 mm inside from an end of the panel.   6. The method of manufacturing a display panel according to claim 1, wherein the gas barrier layer is formed by a sputtering method.   The method of manufacturing a display panel according to claim 6, wherein the substrate is rotated during sputter deposition.   The method for manufacturing a display panel according to claim 1, further comprising a step of forming a second planarization layer so as to cover the gas barrier layer.   The method for manufacturing a display panel according to claim 1, wherein the display panel is a liquid crystal display panel.   The method for manufacturing a display panel according to claim 1, wherein the display panel is an organic electroluminescence panel.

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