JP2009103741A - Rfid tag label, and method for managing product using rfid tag label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID tag label for surely and easily managing distribution of products, and a method for managing products using an RFID tag label. <P>SOLUTION: The method of manufacturing the RFID label comprises the steps of: affixing an RFID loaded label 14 and at least one of RFID non-loaded recording labels 16 and 18 to a first release agent layer 12 formed on one side 10a of a label carrier 10 via a first adhesive layer 20; and affixing a releasing material 24 to the other side 10b of the label carrier 10 whereon a release agent layer is not formed via a second adhesive layer 22. Preferably, the second adhesive layer 22 has removability. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an RFID (abbreviation for radio frequency identification) tag label used for personal authentication, merchandise management, logistics management, and the like, and a product management method using the tag label.

  In recent years, non-contact RFID tag labels (hereinafter sometimes abbreviated as tag labels) that are attached to a person or product (adhered body) to be managed and manage the distribution of these adherends have become widespread. This tag label has an antenna unit for transmitting and receiving data and an information storage unit, and can store data in a built-in IC chip. Data to be managed can be exchanged with the reader / writer by communicating with the reader / writer using radio waves in a non-contact manner.

  Fields of use of RFID tag labels are various, such as commuter pass for various transportation facilities, entrance / exit management of people and goods in a company, etc., inventory management of goods, and logistics management. Various forms of RFID tag labels are used in accordance with these fields of use.

  For example, the disposable RFID tag label is attached to a product and arranged in a store, and when the product is sold, the data stored in the IC chip is read by the reader / writer, whereby the role of the RFID tag label is finished ( For example, Patent Document 1).

  RFID tag labels are used in the rental industry where a single product is used repeatedly, the food industry and the medical industry where traceability is required.

  For example, suppose management of one package in which ten rental products / materials are stored. This rental product / material packaging is affixed with an RFID tag label that records the product number, delivery date, etc., by the product / material distribution service provider, and is carried to the user's product / material rental company. . In order to manage the rental products and goods that have been brought in, the product / goods rental company reads the RFID tag label data by a reader / writer, fills in a management record in the ledger, and manages the rental products and goods.

However, it is necessary to manually enter the data to be read in the management ledger, which is a complicated operation and has a risk of erroneous entry.
Japanese Patent Laid-Open No. 11-134460 (Claim 1)

  While various studies have been made by the present inventors in order to solve the above problem, a tag label is formed by combining an RFID mounting label and at least one non-RFID recording label. Separation and separation from the mounting label makes it easy to manage the product to be managed by allowing it to be attached to different adherends (eg management data entry documents, subdivided products, etc.) As a result, it was possible to eliminate the risk of erroneous entry. Furthermore, it has been conceived that the entire RFID tag label can be easily peeled off from the product at the end of management by making the pressure-sensitive adhesive layer of the label into a two-layer structure. For example, in the case of a product that repeats distribution many times such as a rental product, the management is facilitated by attaching a new RFID tag label to the product again.

  The present invention has been completed on the basis of the above knowledge, and its object is to provide an RFID tag label capable of reliably and easily managing the distribution of products, and to use the RFID tag label To provide a product management method.

  The present invention which achieves the above object is described below.

  [1] At least one RFID mounting label and a non-RFID recording label are attached to the first release agent layer formed on one surface of the label carrier through the first adhesive layer, and the label carrier An RFID tag label formed by sticking a release material to the other surface on which the release agent layer is not formed via a second adhesive layer.

  [2] The RFID tag label according to [1], wherein the second pressure-sensitive adhesive layer has removability.

  [3] The RFID tag label according to [1] or [2], wherein the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer has a core material.

[4] Using the RFID tag label according to any one of [1] to [3], invisible information is recorded on an RFID mounted label, and visible information is recorded on a non-RFID mounted label, and the contents of the invisible information and visible information are recorded. , And label each label on the management target article and / or management record document of the article.

  Since the RFID tag label of the present invention has an RFID mounted label and one or more non-RFID recording labels, the product can be managed using radio waves, and the barcode is used like a conventionally used barcode. There is no complication in searching for the display surface and reading data.

  Further, in the RFID tag label of the present invention, the RFID mounting label and the non-RFID recording label are integrated as a set of labels, so a printing printer equipped with a reader / writer is used. Thus, when data is written on an RFID-equipped label using electromagnetic waves, management data can be printed on a non-RFID-equipped recording label at the same time, and no new device is required.

  Furthermore, even when multiple distributors are used, the necessary number of RFID mounted labels and non-RFID mounted labels are prepared as an integrated RFID tag label, which can be used for internal management of multiple distributors and managers. It can easily handle management between vendors.

  Furthermore, the RFID tag label of the present invention can be easily removed by removing the RFID tag label from the product after the management of the product when the second adhesive layer is configured to have re-peelability. There is no peeling residue of the agent layer.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing an example of an RFID tag label of the present invention. FIG. 1 shows a part of RFID tag label sheets 100 (three RFID tag labels 100a, 100b, and 100c in this figure) that are continuously mass-produced.

  These RFID tag labels 100a, 100b, and 100c can be divided into individual RFID tag label sheets by using so-called perforated broken lines 2, 4, 6, and 8 formed so as to penetrate the RFID tag label sheet 100. The RFID tag labels 100a, 100b, and 100c are formed with punching lines 17a, 17b, and 17c along the outer periphery thereof. The punching lines 17 a, 17 b, and 17 c are completely cut up to the upper surface of the release material 24 described later, and the release material 24 may not be cut or may be cut halfway through the release material 24. When the release material 24 is cut halfway, the cutting depth of the release material 24 is preferably 0 to 95%, particularly preferably 5 to 80%, based on the thickness of the release material 24.

  Further, since the portions outside the punching lines 17a, 17b, and 17c after punching the punching lines 17a, 17b, and 17c are unnecessary, these portions may be peeled off from the release material 24 and removed.

  FIG. 2 is a schematic side cross-sectional view seen from the direction of arrow A, showing the layer structure of the RFID tag label 100a shown in FIG.

  Hereinafter, the present invention will be described by taking one RFID tag label 100a as an example. In FIG. 2, 10 is a label carrier. A first release agent layer 12 is formed on one surface 10a (the upper surface in FIG. 2) of the label carrier 10. An RFID mounting label 14 and at least one (two in FIG. 1) recording labels 16 and 18 not mounted with RFID are attached to the first release agent layer 12 via the first adhesive layer 20. Has been. The label carrier 10 functions as a support for holding the RFID mounting label 14 and the non-RFID recording labels 16 and 18.

  Punching lines 14a, 16a, and 18a are formed along the outer periphery of the RFID mounting label 14 and the non-RFID recordings 16 and 18, respectively. The punching lines 14a, 16a, 18a are completely cut up to the upper surface of the first release agent layer 12 described later, and the first release agent layer 12 and the label carrier 10 are not cut, or their It may be cut halfway. The cutting depth of the layer composed of the first release agent layer 12 and the label carrier 10 is 0 to 95% based on the total thickness of the first release agent layer 12 and the label carrier 10. Is preferable, and 5 to 80% is particularly preferable.

  Further, since the portions outside the punching lines 14a, 16a, 18a after punching the punching lines 14a, 16a, 18a are unnecessary, these portions may be peeled off from the label carrier 10 and removed.

  Examples of the label carrier 10 include films made of various resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyarylate, polyethylene laminated paper, polypropylene laminated paper, clay coated paper, resin coated paper, glassine paper, and the like. The various paper materials are preferable.

  The first release agent layer 12 formed on the one surface 10a of the label carrier 10 is formed by a method known to those skilled in the art. Examples of the release agent that forms the release agent layer 12 include a silicone release agent, a polybutadiene rubber release agent, a styrene-butadiene copolymer release agent, and an alkyd-silicone copolymer release agent.

  When the first pressure-sensitive adhesive layer 20 in contact with the first release agent layer 12 is formed of an acrylic pressure-sensitive adhesive or a rubber pressure-sensitive adhesive, the silicone-based release agent is used, and the first pressure-sensitive adhesive layer 20 is a silicone-based pressure-sensitive adhesive. When formed with an agent, a polybutadiene rubber release agent, a styrene-butadiene copolymer release agent, or an alkyd-silicone copolymer release agent is preferably used.

  The thickness of the 1st release agent layer 12 is 0.01-5 micrometers normally, Preferably it is 0.05-2 micrometers.

  The 1st adhesive layer 20 is formed with a well-known adhesive. Specific examples of the pressure-sensitive adhesive used for the first pressure-sensitive adhesive layer 20 include acrylic pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, natural rubber and synthetic rubber-based pressure-sensitive adhesives, silicone resin-based pressure-sensitive adhesives, polyolefin-based pressure-sensitive adhesives, and polyesters. Examples thereof include an ethylene-based adhesive and an ethylene-vinyl acetate-based adhesive.

  As thickness of the 1st adhesive layer 20, 5-100 micrometers is preferable and 5-50 micrometers is more preferable. The first pressure-sensitive adhesive layer 20 may have removability. The pressure-sensitive adhesive having re-peelability is completely peeled without damaging the adherend when peeled and without leaving the pressure-sensitive adhesive on the adherend.

  0.1-50 N / 25mm is preferable and, as for the adhesive force of the 1st adhesive layer 20, 1-30 N / 25mm is more preferable. In the present specification, unless otherwise specified with respect to the method for measuring the adhesive strength of the adhesive layer, the adhesive strength is obtained by applying a pressure-sensitive adhesive sheet obtained by applying a corresponding thickness of an adhesive layer to a polyethylene terephthalate film having a thickness of 50 μm. The value obtained by measuring according to JIS Z0237 is shown.

  The manufacturing method of these 1st releasing agent layers 12 and the 1st adhesive layer 20 can be manufactured with a well-known manufacturing method.

  As described above, the RFID mounting label 14 and the non-RFID mounting recording labels 16 and 18 are attached to the label carrier 10 via the first adhesive layer 20.

  The RFID-equipped label 14 is a label having an IC circuit including an antenna unit that transmits and receives data in a non-contact manner and an information storage unit that stores information, and is well known.

  The RFID label 14 and the recording labels 16, 18 may or may not use the same label base material.

  Since the RFID-mounted label 14 has the IC inlet 600 as shown in FIG. 6, a material constituting the circuit board is used as the label base material. As such a material, paper such as synthetic resin film, high-quality paper, and coated paper is preferable. The resin material constituting the synthetic resin film is not particularly limited. Polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylic acid ester, polymethacrylic acid ester Polyacrylonitrile, polyimide, polycarbonate, polyamide, ethylene-vinyl acetate copolymer, polyvinyl acetal, polyarylate, acrylonitrile-butadiene-styrene copolymer, and the like are used. The IC inlet 600 includes an external extraction electrode 504, a planar coil circuit portion 506, an internal extraction electrode 508, an insulating layer 510, a jumper 512, lead portions 514 and 520, counter electrodes 516 and 518, and an IC chip 522.

  The non-RFID mounted recording labels 16 and 18 do not have the IC inlet 600, but the label base material may be common to the RFID mounted label 14. In this case, the label base material is a material such as the above-described synthetic resin film, high-quality paper, or coated paper on which no circuit is formed. Further, the label base material of the recording labels 16 and 18 may not be common with the RFID mounted label 14. Examples of the material used in that case include the above-mentioned synthetic resin film, high-quality paper, and coated paper.

  Further, the RFID mounting label 14 and the recording labels 16 and 18 may be provided with a surface printing layer in order to provide printing and printability on the outermost layer. Polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylic ester, polymethacrylic ester, polyacrylonitrile, polyimide, polycarbonate, polyamide, ethylene -Films such as vinyl acetate copolymer, polyvinyl acetal, polyarylate, acrylonitrile-butadiene-styrene copolymer, fine paper, coated paper, etc., or those coated with a coating agent on the surface of the film and paper It can be used by laminating it on a label substrate as an adhesive sheet. Further, a surface printable coating agent may be directly applied on the label substrate.

  The surface printing layer may be provided in common for both the RFID mounting label 14 and the recording labels 16 and 18, or may be provided only for a necessary one.

  The thickness of the label carrier 10 is preferably 10 to 200 μm, particularly preferably 25 to 125 μm.

  A second pressure-sensitive adhesive layer 22 is formed on the other surface 10 b of the label carrier 10, and a release material 24 is attached to the label carrier 10 via the second pressure-sensitive adhesive layer 22.

  The pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 22 can be selected from the pressure-sensitive adhesives exemplified in the first pressure-sensitive adhesive layer 20. The thickness of the second pressure-sensitive adhesive layer 22 is also in the same range as the first pressure-sensitive adhesive layer 20. 0.1-50 N / 25mm is preferable and, as for the adhesive force of the 2nd adhesive layer 22, 1-30 N / 25mm is more preferable. The 2nd adhesive layer 22 can be manufactured with a well-known manufacturing method.

  As an adhesive used for the 2nd adhesive layer 22, what has removability is more preferable. The pressure-sensitive adhesive layer itself having removability is known.

  Any material may be used as the release material 24. For example, films made of various resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyarylate, polyethylene laminated paper, polypropylene laminated paper, clay coat Various paper materials such as paper, resin-coated paper, glassine paper and the like are used as a base material, and the surface of the base material to which a bonding treatment with the adhesive portion is peeled off as necessary can be used. In this case, examples of the release agent for the release treatment include formation of a release agent layer made of a release agent such as a silicone resin, a long-chain alkyl resin, or a fluorine resin. The thickness of the release agent layer is not particularly limited, and may be appropriately selected according to known examples.

  The RFID tag label 100a is provided with two recording labels (recording labels 16 and 18). However, the present invention is not limited to this, and the RFID tag label may be composed of one RFID mounting label and one non-RFID recording label, and further one RFID mounting label and non-RFID recording label 2 You may comprise by more than 1, Preferably it is 2-10 pieces. Furthermore, a plurality of RFID mounting labels may be provided.

  FIG. 3 is a side view showing another example of the RFID tag label of the present invention as seen from the direction of arrow A in FIG. In this example, the 1st adhesive layer 20 has the 1st core material 30 in the middle of the thickness direction. Further, the second pressure-sensitive adhesive layer 22 also has a second core member 32 in the middle in the thickness direction.

  The reason for providing the core material is to reduce the thickness difference in the same plane caused by mounting the IC chip by increasing the thickness of the entire layer.

  As the first core member 30 and the second core member 32, a sheet made of the material exemplified in the label carrier 10 can be used. The thickness range is the same. The same parts as those in FIG. 2 are denoted by the same reference numerals and the description thereof is omitted.

  In the example of FIG. 3 described above, the first adhesive layer 20 and the second adhesive layer 22 are configured to have the core material. However, the present invention is not limited to this, and the adhesive layer having the core material in either one of them. May be formed.

  Next, the case of managing the distribution of rental DVDs as managed items using the RFID tag label of FIG. 1 will be described in detail with reference to FIG.

  As an example, the DVD distribution service provider 50 rents 10 DVDs to the DVD rental service provider 60, and the DVD rental service provider 60 returns the rental DVD to the DVD distribution service service 50 after the rental DVD lending period ends. To do.

  Upon receiving a DVD rental request from the DVD rental agent 60, the DVD distribution service agent 50 first records data (invisible information) necessary for distribution management on the RFID tag label 200a and prints it on the surface as necessary. Data necessary for management includes, for example, a rental DVD name, a rental date, a rental number, a scheduled return date, a rental DVD rental company name, and the like. These data are recorded by an electromagnetic means in an information storage section of the RFID mounted label 14 by a reader / writer (not shown) and, if necessary, printed as visible information on the surface of the RFID mounted label.

  At the same time, the necessary data (visible information) is printed by the reader / writer on the surface of the recording labels 16 and 18 not equipped with RFID (process (1)).

  Next, the DVD distribution service provider 50 affixes the RFID tag label on which the above data is recorded to a box 58 containing ten rental DVDs, transports them to the DVD rental dealer 60, and delivers them (process (2)).

  When the box 58 containing ten rental DVDs delivered is opened and it is time to lend one DVD at a time to a general user, the person in charge of the DVD rental vendor 60 removes the record label 16 filled with management data. Then, this is pasted to a corresponding part of a management record document 62 provided in the DVD rental company, for example, a rental DVD management register. Furthermore, necessary data can be written on the surface of the recording label 16 if necessary. As a result, the DVD rental agent 60 can manage the DVD return deadline, inventory management, and the like. In addition, during the lending period, the distribution of DVDs can be managed using RFID data. (Process (3)).

  When the rental period of the DVD 58 is expired, the DVD rental company 60 peels off the RFID tag label 200a from the box 58 containing ten rental DVDs. In this case, when the second pressure-sensitive adhesive layer 22 (FIG. 2) of the RFID tag label 200a is a pressure-sensitive adhesive layer having a removability, it can be peeled without leaving the pressure-sensitive adhesive in the box 58 containing ten rental DVDs. Thereafter, the product handling company 50 takes out the box 58 containing ten rental DVDs (process (4)).

  After that, a new RFID tag label in which necessary data similar to the above is recorded is attached again and re-rented to another DVD rental company or the like.

  When the product is purchased rather than rented, the RFID tag label 200a from which the recording label 16 has been peeled off is peeled off or not peeled off from the product when the DVD rental by a DVD rental company or the like is finished. The used product will be sold or discarded while being affixed to.

Example 1
An RFID tag label having a plan view in FIG. 1 and a side view in FIG. 3 was manufactured by the method described below.

Manufacturing of Antenna Circuit An integrated wiring pattern 500 shown in FIG. 5 was manufactured, and an IC inlet 600 shown in FIG. 6 was manufactured using the integrated wiring pattern 500 by the method described below.

  First, a product name Nikaflex (Cu / PET = 35 μm / 50 μm, manufactured by Nikkan Kogyo Co., Ltd.) obtained by bonding a copper foil and a polyethylene terephthalate film (PET) 502 to an external extraction electrode 504, a planar coil circuit unit 506, A resist pattern for forming the internal extraction electrode 508, the counter electrodes 516 and 518, and the lead portions 514 and 520 was printed. By etching this, unnecessary copper foil portions were removed to produce an integrated wiring pattern 500 shown in FIG.

  Since the polyethylene terephthalate 502 used as a circuit base material has the RFID mounting label 14 and the recording labels 16 and 18 in common, the size of the integrated wiring pattern 500 is made according to the size of the RFID mounting label 14 and further recorded. A blank space without the integrated wiring pattern 500 was provided on the polyethylene terephthalate film 502 so that the labels 16 and 18 could be formed.

  The line width of the circuit was 0.2 mm.

  Next, as shown in FIG. 6, an insulating layer 510 was formed between the extraction electrode 504 and the internal extraction electrode 508 using an insulating resist ink (ML25089 manufactured by Nippon Atson Co., Ltd.) so as to cover the planar coil circuit portion 506. . Further, the extraction electrode 504 and the internal extraction electrode 508 were connected with a jumper 512 using a silver paste (DW250L-1 manufactured by Toyobo Co., Ltd.) to manufacture an antenna circuit. The insulating layer 510 and the jumper 512 were formed using a screen printing method.

Production of IC Inlet As shown in FIG. 6, an RFID-IC chip 522 (manufactured by Philips, ICode) was mounted on the produced antenna circuit. For the mounting, a flip chip mounting machine (manufactured by Kyushu Matsushita, FB30T-M) was used. An anisotropic conductive adhesive (manufactured by Kyocera Chemical Co., TAP0402E) was used as the adhesive material, and thermocompression bonded under the conditions of 220 ° C., 1.96 N (200 gf), 7 seconds, and an IC inlet 600 was produced.

An acrylic double-sided pressure-sensitive adhesive material (first double-sided pressure-sensitive adhesive material) in which a release material was adhered to both surfaces of the first pressure-sensitive adhesive layer 20 was prepared. This double-sided pressure-sensitive adhesive is manufactured by Lintec Co., Ltd., in which a 25 μm thick PET (polyethylene terephthalate) film is coated with an acrylic pressure-sensitive adhesive with a thickness of 25 μm, and a release material made of glassine paper coated with a silicone resin is laminated on both sides. Product name PET25W PA-T1 8KX 8EC). The two release materials that were laminated had different peel forces.

  Of the two adhesive layers of this double-sided adhesive material, peel off the release paper with the smaller release force required when peeling the release material, and bond the resulting adhesive layer to the entire circuit forming surface of the manufactured IC inlet. It was. In addition, the peeling material with the larger peeling force required when peeling a peeling material is not yet peeled.

Formation of surface print layer and first punching process Next, in order to give printability to the surface of the RFID mounted label and the recording label not mounted with RFID, a printing label manufactured by Lintec (trade name FR4415-50) is used. The release paper protecting the print label was peeled off, and the adhesive layer 13b that appeared was bonded to the entire surface of the polyethylene terephthalate film 502 of the laminate produced above.

  The bonding process and the first punching process were performed in a continuous process. The first punching process was performed so that the RFID mounting portion and the RFID non-mounting portion were separated on a plane, thereby forming one RFID mounting label and two recording labels not mounting RFID in one step. The punching depth was from the printing surface 13 a of the printing label 13 to the middle of the label carrier 10. The depth was 10% of the thickness of the label carrier 10. Of the punched portions, portions outside 14a, 16a, and 18a are unnecessary and are removed.

  The dimensions of the RFID mounted label were 20 × 55 mm, and the dimensions of the RFID non-mounted label were 10 × 25 mm.

  One set of RFID loaded labels and two recording labels not loaded with RFID were used as a set, and 500 sets of 20 m rolls were continuously produced.

Formation of the second pressure-sensitive adhesive layer 22 Next, a double-sided pressure-sensitive adhesive material (second double-sided pressure-sensitive adhesive material) having an acrylic strong pressure-sensitive adhesive layer and a re-peelable acrylic pressure-sensitive adhesive layer was prepared. This double-sided adhesive is applied to one surface of high-quality paper with a basis weight of 64 g / m ^{2 so that} the strong adhesive acrylic adhesive PW made by Lintec has a mass of 16 g / m ^2, and the other surface is made by Lintec. The re-peelable acrylic pressure-sensitive adhesive MHR is applied so as to have a mass of 18 g / m ² .

  The adhesive layer on the strong adhesive side of the second double-sided pressure-sensitive adhesive material was bonded to the first release paper 12 of the first double-sided pressure-sensitive adhesive material of the laminate after the first punching process. As a result, an RFID tag label having a two-layer adhesive layer structure was obtained.

  In addition, the process of forming the said two-layer adhesive layer structure was also performed in the continuous process.

Second punching process Further, a second punching process was performed. In the second punching process, an RFID tag label consisting of one RFID mounting label 14 and two recording labels 16 and 18 is separated into individual RFID tag labels and arranged on the same carrier 10. Thereby, RFID tag labels 200a, 200b, 200 were formed. The depth of punching is from the first release agent layer 12 to the middle of the release material 24. The depth was 10% of the thickness of the release material 24. Of the punched portions, the portions outside 17a, 17b, and 17c are unnecessary and removed.

  Thus, a roll having 500 sets of RFID tag labels in which the size of the one set of labels was 35 × 65 mm was obtained.

Perforated punching process Finally, a perforated punching process was performed between each RFID tag label through the roll. 1, 2, 6, and 8 in FIG. 1 indicate the formed punched broken lines.

  In the RFID tag label, the release paper from which the first double-sided adhesive material has not been peeled corresponds to the label carrier 10 in FIG. The PET film of the first double-sided adhesive material corresponds to the core material 30, and the high-quality paper of the second double-sided adhesive material corresponds to the core material 32.

Management of products using RFID tag labels The RFID tag label created has one RFID mounted label and two non-RFID recording labels, so the managed product can be managed using radio waves, and the barcode Thus, there was no trouble of reading the data by searching the barcode display surface.

  In addition, the RFID tag label created has a structure in which an RFID mounted label and a non-RFID mounted recording label are integrated as a set of labels. Use a reader / writer to use electromagnetic waves in the RFID mounted label. At the same time, the data for management could be printed on the record label without RFID.

  Moreover, the RFID tag label produced was easily peeled off when the RFID tag label was peeled off from the product after the product management was completed, and there was no residue left after the adhesive layer was peeled off.

It is a top view which shows an example of the some RFID tag label of this invention. FIG. 2 is a schematic side cross-sectional view seen from the direction of arrow A showing the layer structure of the RFID tag label shown in FIG. 1. It is the schematic side sectional view seen from the direction of arrow A which shows other examples of layer composition of a RFID tag label. It is a distribution conceptual diagram which shows the usage method of the RFID tag label of this invention. In Example 1, it is a schematic plan view which shows the manufactured antenna circuit. 1 is a schematic plan view showing an IC inlet manufactured in Example 1. FIG.

Explanation of symbols

100a, 100b, 100c RFID tag label with release material 200a, 200b, 200c RFID tag label 2, 4, 6, 8 Punched broken line 14a, 16a, 18a, 17a, 17b, 17c Punched line 10 Label carrier 10a One side 10b Other side 12 First DESCRIPTION OF SYMBOLS 1 Release agent layer 13 Print label 13a Print surface 13b Adhesive material layer 14 RFID mounting label 16, 18 Recording label 20 1st adhesive layer 22 2nd adhesive layer 24 Release material 26 2nd release agent layer 28 Base material for release material 30, 32 core material 50 product dealer 58 box
60 DVD rental contractor 62 Management record document 500 Integrated wiring pattern 502 Polyethylene terephthalate film 504 External lead electrode 506 Planar coil circuit part 508 Internal lead electrode 510 Insulating layer 512 Jumper 514, 520 Lead part 516, 518 Counter electrode 522 IC chip 600 IC inlet

Claims (4)

At least one RFID label and a non-RFID recording label are attached to the first release agent layer formed on one side of the label carrier through the first adhesive layer, and the label carrier release agent An RFID tag label formed by attaching a release material to the other surface where a layer is not formed via a second adhesive layer. The RFID tag label according to claim 1, wherein the second pressure-sensitive adhesive layer has removability. The RFID tag label according to claim 1 or 2, wherein the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer has a core material. Using the RFID tag label according to any one of claims 1 to 3, invisible information is recorded on an RFID mounted label, visible information is recorded on a non-RFID mounted label, and the contents of the invisible information and the visible information are associated with each other. An article management method, wherein each label is attached to an article to be managed and / or a management record document of the article.

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