JP2009093777A - Head slider, method for manufacturing the same, and storage device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easy-to-manufacture head slider which highly accurately controls a flying height during the operation of a storage device, and a manufacturing method thereof. <P>SOLUTION: The head slider includes a slider substrate, an operation unit which includes a pair of electrodes constituted of first and second electrodes disposed in the end of the slider substrate, a piezoelectric component disposed between the pair of electrodes, and in which the product of Young's modulus and the thickness of the first electrode in the direction between the pair of electrodes is larger than the product of Young's modulus and the thickness of the second electrode in the direction between the pair of electrodes, and a magnetic head disposed on a side opposite to the slider substrate via the operation unit. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a head slider used in a storage device, a method for manufacturing the head slider, and a storage device including the head slider.

  In recent storage devices (storage medium driving devices) such as a hard disk drive (HDD), the distance between the head slider and the storage medium, that is, the flying height of the head slider becomes very small due to an increase in recording density. ing. In recent years, it has been required to increase the recording and reproducing speed of a storage device. For this reason, the rotational speed of the storage medium tends to increase.

  Various attempts have been made to control the flying height. As one method of controlling the flying height, for example, a method of mounting a heating element, a so-called thermal actuator on a head slider has been proposed (see, for example, Patent Document 1). In Patent Literature 1, a heating wire that is a thermal actuator is energized and thermally expanded during the operation of the storage device. By this thermal expansion, the magnetic disk facing surface of the head slider is deformed to control the flying height of the magnetic head. However, since this control method uses thermal expansion, there is a limit in response speed, and there is a problem that it cannot sufficiently follow changes in flying height.

  As another method for controlling the flying height, a method using a piezoelectric microactuator (piezoelectric element) has been proposed (see, for example, Patent Document 2). Patent Document 2 discloses a technique for controlling the flying height by providing a piezoelectric microactuator between a substrate and a magnetic head. Specifically, the piezoelectric microactuator is deformed by energization, and the flying height of the magnetic head is controlled by the deformation of the piezoelectric element. The control of the flying height by the piezoelectric actuator can be performed at a higher speed than when the thermal actuator is used.

However, the head slider disclosed in Patent Document 1 is manufactured by attaching a piezoelectric actuator to a slider substrate cut individually or in a row using an adhesive or the like. Therefore, alignment at the time of pasting is difficult, and downsizing is limited. This difficulty in alignment affects the yield at the time of assembly, and there is a problem that the cost cannot be reduced.
JP 2005-11413 A JP 2000-348321 A

  In view of the above problems, the present invention is capable of controlling the flying height at high speed and with high accuracy during the operation of the storage device, and further provides a head slider that is easy to manufacture and a method for manufacturing the head slider. Objective.

According to one aspect of the invention,
A slider substrate;
A pair of electrodes composed of a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes; and a Young's modulus of the first electrode An operating portion in which the product of the thickness in the direction between the pair of electrodes is larger than the product of the Young's modulus in the second electrode and the thickness in the direction between the pair of electrodes;
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween.

According to another aspect of the invention,
A slider substrate;
An operating unit comprising a pair of electrodes composed of first and second electrodes disposed at an end of the slider substrate, and a piezoelectric body disposed between the pair of electrodes;
A magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween,
The first electrode and the second electrode in the direction between the pair of electrodes are distorted perpendicularly to the direction of the electric field by the applied electric field, so that the magnetic head is in the direction of the electric field. A head slider is provided which is characterized in that it is made of a thickness and a material that can move along the head.

According to yet another aspect of the invention,
Forming a piezoelectric body on the slider substrate;
Processing the piezoelectric body into a convex portion;
Forming a first electrode having a first value of a product of Young's modulus and a thickness in a direction between the electrodes on one side surface of the convex portion;
Forming, on the other side surface of the convex portion, a second electrode in which the product of the Young's modulus and the thickness in the inter-electrode direction is a second value smaller than the first value;
And a step of forming a magnetic head on a slider substrate on which the convex portion, the first electrode, and the second electrode are formed.

According to yet another aspect of the invention,
Storage device comprising: a storage medium for recording and reproducing information; and a head slider arranged to face the storage medium for recording information on the storage medium or reproducing information on the storage medium In
In a storage device comprising a storage medium for recording and reproducing information, and a head slider arranged to face the storage medium,
The head slider is
A slider substrate;
A pair of electrodes including a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes, and a pair of Young's modulus in the first electrode. A product of the thickness in the inter-electrode direction is greater than the product of the Young's modulus in the second electrode and the thickness in the pair of electrodes,
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween.

  The head slider according to the present invention controls the flying height of the head slider with high speed and high accuracy during the operation of the storage device by providing an operation unit including a unimorph piezoelectric element between the slider substrate and the magnetic head. Is possible.

  Further, according to the method for manufacturing the head slider of the present invention, since there is no step of aligning and bonding the micro components, it can be easily manufactured with a high yield by a general semiconductor manufacturing process. It is.

  First, a magnetic disk device which is a usage mode of the head slider of the present invention will be briefly described with reference to FIGS. FIG. 1 is a schematic view showing a magnetic recording apparatus (hard disk drive: HDD) using the head slider of the present invention.

  The magnetic disk device 101 shown in FIG. 1 has a housing 102 as shown in the figure as an exterior. Inside the housing 102, a magnetic disk 104 mounted on the rotary shaft 103 and rotating in the direction of the arrow 120, a head slider 105 mounted with a magnetic head for recording information on and reproducing information from the magnetic disk 104, A suspension 106 that holds the head slider 105, a carriage arm 108 that is fixed and moves along the surface of the magnetic disk 104 about the arm shaft 107, and an electromagnetic actuator 109 that drives the carriage arm 108 are provided. ing. Note that a cover (not shown) is attached to the housing 102, and the above-described components are accommodated in an internal space formed by the housing 102 and the cover.

  The magnetic disk device 1 further includes a control unit 110 that controls the operation of the magnetic disk device 101 as shown in FIG. The control unit 110 is mounted on a control board (not shown) provided inside the housing 102, for example. As shown in FIG. 2, the control unit 110 stores a CPU (Central Processing Unit) 112, a RAM (Random Access Memory) 114 for temporarily storing data processed by the CPU 112, a control program, and the like. A ROM (Read Only Memory) 115, an input / output circuit 119 for inputting / outputting signals to / from the outside, a bus 117 for transmitting signals between these circuits, and the like.

As shown in FIG. 2, the head slider 105 has a magnetic head 105b formed on a slider substrate 105a. For example, the magnetic head 105b is connected to the input / output circuit 119 in the control circuit 110 by wirings 111a and 111b, and records information on the magnetic disk 104 (write operation) and reproduces information read from the magnetic disk 104 (read). Operation). When performing this read operation or write operation, the carriage arm 108 is driven by the electromagnetic actuator 109 to move the magnetic head 105 b to a desired track on the magnetic disk 104.
-Head slider-
Hereinafter, the head slider of the present invention will be described with reference to embodiments.

  FIG. 3 is a perspective view showing a schematic structure of a head slider which is an embodiment of the head slider of the present invention. As shown in FIG. 3, the head slider 105 includes a slider substrate (hereinafter sometimes simply referred to as a substrate) 105a, an actuator 105c, and a magnetic head 105b. The actuator 105c is disposed at the end of the slider substrate 105a. An insulating layer 7 and a magnetic head 105b are disposed on the opposite side of the slider substrate 105a with the actuator 105c interposed therebetween. The magnetic head 105 b includes an element 105 d and an insulating layer 8. That is, the element 105d is positioned on the opposite side of the slider substrate 105a with the actuator 105c interposed therebetween. The insulating layer 7 includes vias 14s and 17s electrically connected to electrode pads 14 and 17 provided on the actuator 105c. Further, the insulating layer 8 of the magnetic head 105b includes external terminals 14t and 17t electrically connected to the vias 14s and 17s, respectively, on the surface.

The slider substrate 105a is made of ceramic such as AlTiC (Al ₂ O ₃ —TiC) material. The Altic material is a fired product of alumina (Al ₂ O ₃ ) and titanium carbide (TiC), and is a kind of ceramic.

  FIG. 4 is a schematic cross-sectional view showing an embodiment of the head slider of the present invention and a magnetic head support including the magnetic head slider of the present invention. The magnetic head support is also referred to as HGA (Head Gimbal Assembly).

  As shown in FIG. 4, the magnetic head support 121 generally refers to a structure in which a head slider 105 and a base plate (not shown) are attached to the suspension 6, but a state before the head slider 105 is attached. That is, only the suspension 106 may be called a magnetic head support. Furthermore, a structure in which either the head slider 105 or the base plate (not shown) is attached to the suspension 106 may be referred to as a magnetic head support 121. Here, the suspension 106 is a plate-like member made of, for example, stainless steel having a thickness of 20 μm. The base plate (not shown) is a component for joining the suspension 106 to one end of the carriage arm 108 as shown in FIG. The head slider 105 is attached to the other end of the carriage arm 108. The head slider 105 is disposed at a position facing the magnetic disk surface 104c.

  As shown in FIG. 4, the magnetic disk rotates in the direction of the arrow 120, so that the airflow 40 flows into the lower side of the flying surface 105 f of the head slider 105. The head slider 105 generates buoyancy due to the flow of the air flow 40, and the head slider 105 floats from the surface 104 c of the magnetic disk 104. By driving the actuator 105c, the magnetic head 105b is displaced in the magnetic recording medium direction (arrow D direction).

  FIG. 5 is a schematic cross-sectional view in which a portion A of the head slider in FIG. 4 is enlarged. The actuator 105c has a function of controlling the distance between the storage medium 104 and the magnetic head 105b by operating inside the storage device. The actuator 105c is a piezoelectric body 6a, 6b, 6c, 6d (hereinafter sometimes referred to as a piezoelectric body 6), a first electrode 9a, 9b, 9c, 9d (hereinafter referred to as a first electrode 9). Second electrodes 10a, 10b, 10c, and 10d (hereinafter sometimes collectively referred to as second electrode 10), resins 11a, 11b, 11c, 11d, and 11e (hereinafter referred to as resin 11). May be collectively referred to). The piezoelectric body 6 is sandwiched between a pair of electrodes including a first electrode 9 and a second electrode 10 having elasticity. The portions 18a, 18b, 18c, and 18d composed of the pair of electrodes 9 and 10 and the piezoelectric body 6 correspond to the operating portion in the head slider of the present invention. Hereinafter, the portions 18a, 18b, 18c, and 18d may be collectively referred to as the operating portion 18.

  In the present embodiment, a plurality of operating portions are arranged in an array, but the head slider of the present invention only needs to include at least one operating portion. A head slider in which a plurality of actuators 105c are provided is preferable because the force acting on the magnetic head 105b is large and contributes to high-speed control of the flying height.

  The first electrode 9 is less likely to be deformed by an external force than the second electrode 10. In other words, the first electrode 9 is less likely to be crushed than the second electrode 10. This difficulty of deformation can be quantitatively expressed by the product of the Young's modulus (elongation elastic modulus) of the electrode and the thickness. For example, when the first electrode 9 and the second electrode 10 are made of the same material, the first electrode 9 is thicker than the second electrode 10 as shown in FIG. 9 can be made more difficult to deform than the second electrode 10. As another embodiment, for example, even if the first electrode 9 and the second electrode 10 have the same thickness, the Young's modulus of the first electrode 9 is greater than the Young's modulus of the second electrode 10. Higher head slider. Also in this embodiment, the first electrode 9 is less likely to deform than the second electrode 10.

  Examples of materials that can be used for the first electrode 9 and the second electrode 10 include conductive materials. Examples include metals such as nickel (Ni), platinum (Pt), iridium (Ir), chromium (Cr), and copper (Cu), and nitrides such as titanium nitride (TiN) and tungsten carbide (WC). Such carbides or oxides such as indium tin oxide (ITO) can also be used.

  The electrode may have a laminated structure of two or more layers. In this case, the conductive material is used for the layer in contact with the piezoelectric body 6. The material of other layers may be an insulator and is not particularly limited. The difficulty of deformation of an electrode having a laminated structure of two or more layers can be quantitatively expressed by the sum of products of Young's modulus and thickness of each layer constituting the laminated structure.

The piezoelectric body 6 is made of a piezoelectric material. Examples of the piezoelectric material that can be used for the piezoelectric body 6 include lead zirconate titanate (Pb (Zr, Ti) O ₃ PZT) or lead lanthanum zirconate titanate ((Pb, La) (Zr, Ti). O ₃ PZT), Nb added PZT, more _{PNN-PZT {Pb (Ni,} Nb) O 3 -PbTiO 3 -PbZrO 3}, PMN-PZT {Pb (Mg, Nb) O 3 -PbTiO 3 -PbZrO 3} And perovskite oxides. In addition to these materials, potassium niobate (KNbO ₃ ), aluminum nitride (AlN), or the like can be used.

  A portion composed of the piezoelectric body 6, the first electrode 9, and the second electrode 10 is called a unimorph type piezoelectric element. FIG. 6 is a conceptual diagram showing the operation of the unimorph type piezoelectric element.

  The unimorph type piezoelectric element 13 is an actuator having a structure that causes a bending displacement by utilizing a displacement in the d31 direction of the piezoelectric body 6 (so-called piezoelectric lateral effect or d31 effect). As shown in FIG. 6A, the piezoelectric body 6 has a contracting force in a direction perpendicular to the electric field E by the electric field E applied to the piezoelectric body 6 by the first electrode 9 and the second electrode 10. However, the electrode 9 and the electrode 10 try to constrain the deformation of the piezoelectric body. Since the electrode 9 and the electrode 10 are more rigid because of the higher rigidity, the electrode 9 is deformed into a convex shape with the first electrode 9 facing upward as shown in (b).

  FIG. 6C is a conceptual diagram showing a unimorph type piezoelectric element sandwiched between a substrate and a magnetic head. A substrate 105a is disposed at one end of the unimorph piezoelectric element (actuating unit) 13, and a magnetic head 105b is disposed at the other end. As described above, the substrate 105a is made of hard Altic. Moreover, the thickness is about 1 mm. On the other hand, the magnetic head 105b is made of various metal oxides and metals, but mainly contains a material softer than AlTiC. Further, the thickness is usually about several tens of μm, which is much thinner than the substrate 105a. Therefore, as shown in FIG. 6D, when the piezoelectric element 13 is deformed, the shape of the substrate 105a side is fixed to the substrate 105a so that the shape hardly changes. On the other hand, the magnetic head 105b side is parallel to the electric field E. Displaces greatly in any direction. Therefore, the magnetic head 105b is also greatly displaced in the direction parallel to the electric field E. In other words, in the storage device, the magnetic head 105b is largely displaced in the direction between the recording / reproducing element and the magnetic disk medium (spacing direction: arrow S direction in FIG. 6). Therefore, the distance between the element 105d of the magnetic head 105b and the storage medium 104 (that is, the flying height F of the head slider) is the direction of the arrow S of the portion B on the flying surface 105f side of the unimorph piezoelectric element 13 and on the magnetic head 105b side. It can be controlled by controlling the amount of displacement.

  For example, in a conventional piezoelectric element (piezoelectric actuator) using displacement in the d15 direction, the polarization direction of the piezoelectric body is different from the direction in which the drive voltage is applied. For this reason, at the time of manufacturing, it is necessary to first polarize the piezoelectric body, then slice the polarized piezoelectric body to make it smaller, and then bond the small piezoelectric body to the slider substrate using an adhesive. For example, it is difficult to adhere a piezoelectric body processed to a small size of about 20 μm to the slider substrate in consideration of cost and yield. In order to bond the piezoelectric body using an adhesive, the thickness of the piezoelectric body needs to be at least about 100 μm. Nevertheless, since the assembly is performed by high-precision bonding of minute parts, a significant increase in manufacturing cost is inevitable.

  On the other hand, since a piezoelectric actuator using a unimorph type piezoelectric element can carry out the entire manufacturing process of the actuator on a substrate wafer, the actuator and the magnetic head can be formed continuously. The actuator manufacturing process will be described in detail in “Head slider manufacturing method” described later. In such a process, the actuator can be formed smaller than the conventional process in which the actuator is individually attached to the slider using an adhesive. For example, the thickness H of the actuator in FIG. 5 can be formed as small as several μm to several tens of μm.

  When the resonance frequency of the part moved by the actuator, that is, the magnetic head and the part of the actuator is close to the driving frequency for driving the actuator, the resonance of the part moved by the actuator may hinder the normal driving of the actuator. . Therefore, in order to be able to perform control without being affected by such influence, it is required to drive the actuator at a frequency lower than the resonance frequency of the portion moved by the actuator. In the head slider of the present embodiment, since the actuator is disposed between the slider substrate and the magnetic head, the shape of the portion moved by the actuator is small and the resonance frequency of the portion is high. Therefore, the drive frequency of this actuator, that is, the piezoelectric element can be set high. Thus, if the drive frequency of the piezoelectric element can be set high, the flying height of the magnetic head can be controlled at high speed and with high accuracy. More specifically, the air bearing surface of the slider (105f in FIG. 4) and the storage medium (104 in FIG. 4) due to various factors such as changes in atmospheric pressure, thermal expansion, impact due to head crashes, and vibrations by the motor of the storage device. It is possible to easily correct the flying height according to the change in the distance between the two. Furthermore, the flying height can be stabilized in response to high-speed fluctuations in the flying height that occur during one rotation of the disk due to the undulation of the magnetic disk, local unevenness, and rotational axis blurring.

  Further, by using an actuator using a unimorph type piezoelectric element, a displacement amount sufficient for controlling the flying height can be obtained. For example, as shown in FIG. 7, for a slider composed of a magnetic head 105b, an actuator 105c, and an AlTiC substrate 105a, the amount of displacement in the spacing direction (arrow S direction) at point B when an electric field of 30 V is applied between the electrodes. Obtained by simulation. The actuator 105 includes a piezoelectric body made of PZT having a width (W2 in FIG. 7) of 15 μm, a first electrode made of Ni having a width (W3 in FIG. 7) of 5 μm, and a first electrode having a width (W4 in FIG. 7) of 0.1 μm. It is assumed that four operating portions each having two electrodes and having a thickness (H in FIG. 7) of 20 μm are arranged in a row with a resin having a width (W1 in FIG. 7) of 5 μm interposed therebetween. However, the thickness W1 'of the resin disposed at the lower portion of the operating portion 18a and the upper portion of 18d was 5 μm. As a result of performing a simulation of applying an electric field of 30 V between the electrodes with respect to this slider, it was found that a displacement amount of 14.9 nm was obtained at the point B in the spacing direction (arrow S direction). The head flying height is currently about 10 nm, and this displacement is sufficient for flying height control.

  FIG. 9 is a conceptual perspective view showing only the arrangement of the first electrode, the second electrode, and electrode lines and electrode pads electrically connected to the actuator 105c of the head slider in FIGS. FIG.

  The first electrode 9 is electrically connected to the electrode line 15 and the electrode pad 17. The electrode pad 17 is located on the suspension 106 side of the head slider 105, and a potential is supplied from a wiring formed on the suspension. Then, the potential from the control circuit 10 is supplied to the electrode line 15 and the electrode pad 17 through the electrode pad 17. The electrode line 15 is a wiring pattern connected from the electrode pad 17 to each electrode 9 through a via. The electrode 9 is a plate-like wiring pattern branched from a plurality of locations of the electrode wire 15.

  The second electrode 10 is electrically connected to the electrode line 16 and the electrode pad 14. The electrode pad 14 is located on the suspension 106 side of the head slider 105, and is supplied with a potential from the control circuit 10 via a wiring (not shown). The electrode line 16 is a wiring pattern connected from the electrode pad 14 to each electrode 10 via a via. The second electrode 10 is a plate-like wiring pattern branched from a plurality of locations of the electrode wire 16.

  One of the first electrode 9 and the second electrode 10 is an electrode that applies a negative potential to the piezoelectric body 6, and the other is an electrode that applies a positive potential to the piezoelectric body 6. Usually, a negative potential is supplied to the first electrode, and a positive potential is supplied to the second electrode. In this case, the negative potential is, for example, the ground potential (ground potential) of the magnetic disk device 101.

The head slider of this embodiment will be described again with reference to FIG. The resin 11 is disposed between the adjacent operating portions 18. (For example, the resin 11b is disposed between the operating portions 18a and 18b.) The resin 11 has electrical insulation, is made of a material other than the piezoelectric material, and includes the first electrode 9, Any material that is more easily deformable (higher flexibility) than the second electrode 10 and the piezoelectric body 6 may be used. Examples of materials that can be used for the resin 11 include urethane, polyimide, epoxy, and aramid resin, and a polyimide resin is preferably used from the viewpoint of heat resistance. In addition, materials other than resin can be used as long as the insulating material has a Young's modulus lower than that of the piezoelectric body. For example, ceramics containing a lot of fine bubbles such as foam glass may be used. An insulating layer 6 ′ is provided between the actuator 105c and the slider substrate 105a. The insulating layer 6 ′ has a function of preventing an electrical short circuit between the slider substrate 105 a made of a conductive material such as Altic and the first electrode 9 or the second electrode 10. The material that can be used for the insulating layer 6 ′ is not particularly limited as long as it has insulating properties. For example, in addition to the piezoelectric material used for the piezoelectric body 6, alumina (Al ₂ O ₃ ) or oxidation is used. titanium (TiO _2), and the like. In particular, as shown in a head slider manufacturing method described later, an insulating layer can be provided without increasing the number of manufacturing steps, so that the piezoelectric material used for the piezoelectric body 6 is provided integrally with the piezoelectric body 6. It is preferable.

  The magnetic head 105b is provided in the storage device for recording information on the storage medium or reproducing information on the recording medium. The magnetic head 105 b includes an element 105 d and an insulating layer 8. The thickness of the magnetic head 105b is, for example, about 30 μm.

  The element 105d is an element provided for recording or reproducing information on a storage medium in the storage device. For example, examples of the element used in the magnetic disk device include a recording element having a function of writing information on a recording medium and a reproducing element having a function of taking out magnetic information recorded on the recording medium as an electric signal. The recording element includes, for example, a write coil, a main magnetic pole layer, and an auxiliary magnetic pole layer. The write coil has a function of generating magnetic flux. The main magnetic pole layer has a function of accommodating magnetic flux generated in the write coil and emitting the magnetic flux toward the magnetic disk. The auxiliary magnetic pole layer has a function of circulating the magnetic flux emitted from the main magnetic pole layer via the magnetic disk. Examples of the reproducing element include an MR element (magnetoresistance effect element). The element 105d only needs to have at least one of the recording element and the reproducing element, and may have both of them.

The insulating layer 8 is provided to electrically and magnetically insulate between the actuator 105c and the magnetic head 105b and between a plurality of elements. The insulating layer 8 is made of an insulating material, for example, a film having a thickness of about 1 to 50 μm. Examples of materials that can be used for the insulating layer 8 include nonmagnetic and nonconductive materials such as metal oxides such as alumina (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), and titanium oxide (TiO ₂ ). It is done.

  The layer configuration of the magnetic head 105b is not particularly limited, and a magnetic head used in a magnetic storage device can be provided according to the application. The details of the layer structure and manufacturing method of the flying head are omitted in this specification.

An insulating layer 7 is provided between the actuator 105c and the magnetic head 105b for magnetically and electrically insulating the actuator 105c and the magnetic head 105b. The insulating layer 7 is made of an insulating material, for example, a film having a thickness of about 0.1 to 50 μm. Examples of materials that can be used for the insulating layer 7 include nonmagnetic and nonconductive materials such as alumina (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), and titanium oxide (TiO ₂ ).

  FIG. 8 is a schematic diagram showing a head slider including a magnetic head 105b, a resin layer 131, an actuator 105c, and an Altic substrate 105a. As shown in FIG. 8, a resin layer 131 may be formed between the actuator 105 c and the insulating layer 7. The resin layer 131 may be any material that has electrical insulating properties, has a Young's modulus lower than that of the piezoelectric body 6, and is easily deformed (highly flexible). Examples of materials that can be used for the resin layer 131 include urethane, polyimide, epoxy, and aramid resin, and polyimide resin is preferably used from the viewpoint of heat resistance. Further, instead of the resin layer 131, for example, a layer made of an insulating material having a Young's modulus lower than that of a piezoelectric body such as ceramics containing many fine bubbles such as foam glass may be provided.

  The portion of the actuator 105c that is in contact with the resin layer 131 is made of a material that is not easily deformed, such as the piezoelectric body 6, the first electrode 9, the second electrode 10, and the resin 11. Therefore, when the operating portion 18 is deformed by applying a voltage to the piezoelectric body 6, the portion in contact with the resin layer 131 of the flat actuator 105c is not flat before the voltage is applied. Since the resin layer 131 is made of a highly flexible material, it is easy to follow the deformation of the adjacent actuator 105c. Therefore, the deformation amount of the actuator 105c in the spacing direction per unit applied voltage becomes larger.

  On the other hand, as shown in FIG. 7, the head slider in which the resin layer 131 is not provided between the actuator 105 c and the magnetic head 105 b has the same configuration as that in FIG. 7 except that the resin layer 131 is provided. Compared to the head slider, deformation of the portion of the actuator 105c that contacts the magnetic head 105b is suppressed.

  For the head slider having the configuration shown in FIG. 8, the amount of displacement in the spacing direction (arrow S direction) at point B when a 30 V electric field was applied between the electrodes was obtained by simulation. Like the head slider shown in FIG. 7, the actuator 105 includes a piezoelectric body made of PZT having a width (W2 in FIG. 8) of 15 μm, a first electrode made of Ni having a width (W3 in FIG. 8) of 5 μm, and a width. (W4 in FIG. 8) is composed of a second electrode having a thickness of 0.1 μm, and an operating part having a thickness (H in FIG. 8) of 20 μm is sandwiched between a resin having a width (W1 in FIG. 8) of 5 μm. Two rows were arranged. The thickness W1 'of the resin disposed at the lower part of the operating part 18a and the upper part of 18d was 5 μm. A simulation was performed on four types of sliders in which the thickness H ′ of the resin layer 131 was 0.1, 1, 10, and 100 μm. Table 1 is a table showing the relationship between the thickness of the resin layer 131 and the amount of displacement in the spacing direction (arrow S direction) at the point B of the magnetic head, obtained as a result of simulation.

The slider in which the resin layer having a low Young's modulus was formed between the actuator and the magnetic head had a larger displacement than the slider without the resin layer 131.

  From the above, a slider in which a resin layer with a low Young's modulus is formed between the actuator and the magnetic head is necessary to control the slider so that it has a desired displacement compared to a slider that does not have a resin layer with a low Young's modulus. The applied voltage is low and the power consumption is considered low.

  The head slider of this embodiment will be described again with reference to FIG. The vias 14s and 17s and the external terminals 14t and 17t can be formed using a conductive material. Examples of the conductive material include metals such as platinum (Pt), iridium (Ir), nickel (Ni), chromium (Cr), copper (Cu), and further, titanium nitride (TiN) and the like. Examples thereof include nitrides, carbides such as tungsten carbide (WC), and indium tin oxide (ITO). Such a head slider is provided with an external terminal for applying a voltage to the electrode of the operating portion on the surface, and thus it is easy to make an electrical connection after being mounted on the suspension. Therefore, the head slider of this embodiment contributes to the improvement of the manufacturing efficiency and yield of the storage device using the head slider of this embodiment.

  FIG. 10 is a schematic diagram showing the positional relationship between the element 105d and the operating portion 18 as viewed from the tip of the head slider. In the head slider of the present embodiment, the operating portion 18 is sandwiched between the substrate 105a (not shown) and the element 105d. The head slider in which the operation unit 18, the substrate 105a, and the element 105d have such a positional relationship has a large displacement amount of the element 105d with respect to the displacement amount of the operation unit 18, and has high operation efficiency. It is preferable from the point of contribution. In the head slider of the present invention, the substrate 105a and the element 105d do not necessarily need to sandwich the operating portion 18.

  In the head slider of this embodiment, the size of the piezoelectric element can be reduced by providing a unimorph type piezoelectric element between the substrate and the magnetic head. Since the size of the piezoelectric element is small, the resonance frequency in the spacing direction of the magnetic head can be increased. Since this resonance frequency is high, the drive frequency of the piezoelectric element can be set high when the head slider is arranged in a position facing the storage medium inside the storage device. If the drive frequency of the piezoelectric element can be set high, the distance between the flying surface of the slider (105f in FIG. 4) and the storage medium (104 in FIG. 4) due to changes in atmospheric pressure, thermal expansion, etc. when the storage device is used. The correction of the flying height change caused by the change in the height and the correction of the flying height change due to the acceleration, such as the impact or the vibration of the storage device, can be performed accurately and at high speed. Furthermore, the storage device using the head slider of this embodiment can also prevent the head from coming into contact with the storage medium and damaging the storage medium (so-called head crash) due to a strong impact applied when the storage device is dropped. . Furthermore, the flying height can be stabilized accurately and at high speed in response to fluctuations in the flying height that occur during one rotation of the disk due to the undulation of the magnetic disk, local unevenness, and rotational shaft blurring.

Further, the head slider of the present embodiment has an advantage that the difference between the protruding amount of the read portion and the write portion does not occur unlike the thermal actuator because the entire magnetic head provided in the unimorph type piezoelectric element moves in parallel.
-Head slider manufacturing method-
In the method for manufacturing a head slider of the present invention, each layer constituting a piezoelectric actuator including a piezoelectric element including a piezoelectric body, a first electrode, and a second electrode on a substrate wafer is subjected to a film forming process and a fine process. Each is formed directly using a thin film forming process consisting of a processing process. Therefore, the actuator and the magnetic head can be formed continuously.

  Examples of film formation processes include plating methods such as electroplating and electroless plating, PVD (Physical Vapor Deposition) such as sputtering and vapor deposition, and CVD (Chemical Vapor) such as MO-CVD (Metal Organic Chemical Vapor Deposition). (Deposition) method, spin method, dip method, spray method and other coating methods, thick film printing methods, and the like, which are appropriately selected according to the purpose. The microfabrication process includes, for example, milling such as ion milling, processing by a dicing saw, and polishing such as CMP (Chemical Mechanical Polishing) method.

  As a method of forming an actuator, a manufacturing method in which a substrate is directly formed on a substrate wafer has a higher yield than a conventional process in which an individual actuator is attached to an individual slider using an adhesive and an individual magnetic head is further attached. It is preferable from the viewpoint that the cost can be reduced. In addition, the obtained head slider has the same effects as those described in the embodiment of the head slider of the present invention.

Hereinafter, a method for manufacturing a head slider of the present invention will be described with reference to embodiments. FIG. 11 is a schematic cross-sectional view for each process showing an embodiment of the method of manufacturing the head slider of the present invention. Hereinafter, it demonstrates for every process.
(1) Piezoelectric Forming Step First, a piezoelectric 72 is provided on a slider substrate 71 as shown in FIG. As materials usable for the slider substrate 71 and the piezoelectric body 72, the same materials as those described in the description of the head slider can be used.

For example, a wafer-like AlTiC (Al ₂ O ₃ .TiC) substrate is used as the slider substrate. This Altic substrate 71 constitutes the substrate 105a of the head slider 105 in FIG. 5 after all the manufacturing steps are completed.

  The piezoelectric body 72 constitutes the piezoelectric body 6 constituting the head slider 105 in FIG. 5 after the entire manufacturing process is completed. Further, the piezoelectric body 72 may constitute the insulating layer 6 ′ of the head slider 105 in FIG. 5 after the entire manufacturing process is completed.

A method for forming the piezoelectric body 72 is not particularly limited, but a sputtering method, a sol-gel method, a pulse laser deposition method, an MOCVD method, a thick film printing method, a green sheet lamination method, an aerosol deposition method, or the like can be used. is there. Examples of piezoelectric materials that can be used for the piezoelectric body 72 include lead zirconate titanate (Pb (Zr, Ti) O ₃ PZT), Nb-added PZT, and PNN-PZT {Pb (Ni, Nb) O ₃ − Examples thereof include perovskite oxides such as PbTiO ₃ —PbZrO ₃ } and PMN—PZT {Pb (Mg, Nb) O ₃ —PbTiO ₃ —PbZrO ₃ }. In addition to these materials, potassium niobate (KNbO ₃ ), aluminum nitride (AlN), or the like can be used. The thickness H ′ of the piezoelectric body 72 is, for example, about 25 μm.
(2) Piezoelectric Body Processing Step Next, the formed piezoelectric body 72 is processed to form a convex piezoelectric body 73 as shown in FIG. The processing method is not particularly limited, but for example, dicing saw, milling, reactive ion etching, or the like can be used. The protrusion 73a has, for example, a width W2 of about 10 μm and a depth H of about 20 μm. The pitch P between the convex shapes is about 15 μm.
(3) First Electrode Formation Step Next, in order to form the first electrode on the formed convex piezoelectric body 73, a first conductor layer 74 is formed as shown in FIG. To do. In the present embodiment, the first electrode is less likely to be crushed than the second electrode described later. That is, the product of the Young's modulus and the thickness of the first electrode is larger than the product of the Young's modulus and the thickness of the second electrode described later.

  The first conductor layer 74 is made of a conductive material constituting the first electrode 9 of the head slider 105 in FIG. 5 after the entire manufacturing process is completed. That is, examples of materials that can be used for the first conductor layer 74 include metals such as nickel (Ni), platinum (Pt), iridium (Ir), chromium (Cr), and copper (Cu). Furthermore, examples of materials that can be used for the first conductor layer 74 include nitrides such as titanium nitride (TiN), carbides such as tungsten carbide (WC), and indium tin oxide (ITO). It is done. Although these formation methods are not particularly limited, for example, plating methods such as electroplating and electroless nickel plating, PVD (Physical Vapor Deposition) such as sputtering, MO-CVD (Metal Organic Chemical Vapor), and the like. Examples thereof include a CVD (Chemical Vapor Deposition) method such as a Deposition method. In particular, it is preferable in terms of cost to form the first conductor layer 74 using an electroless nickel plating method.

  Next, the first conductor layer 74 is processed, and a groove 75b is formed so that the first conductor layer 75 has a desired thickness as shown in FIG. At this time, processing is performed so that the first conductor layer remains only on one side of the side surface of the convex portion 73a of the piezoelectric body. The processing method is not particularly limited, and examples thereof include a dicing saw and milling. The thickness of the first conductor layer 75 is, for example, about 5 μm.

The first electrode is obtained through a second electrode formation process, a resin formation process, and a polishing process, which will be described later. The first conductor layer 75 in this step is a main layer constituting the first electrode 91. Further, the width W2 ′ may be adjusted by processing the convex portion 73a simultaneously with the processing of the first conductor layer 74.
(4) Second Electrode Formation Step Next, as shown in FIG. 11E, the second conductor layer 76 is formed so as to cover the first conductor layer 75 and the convex portion 73. In this embodiment, the second electrode is less likely to be crushed than the first electrode. That is, the product of Young's modulus and thickness of the second electrode is smaller than the product of Young's modulus and thickness of the first electrode.

  The second conductor layer 76 is made of a conductive material constituting the second electrode 10 of the head slider 105 after the entire manufacturing process is completed. That is, examples of materials that can be used for the first conductor layer 74 include metals such as nickel (Ni), platinum (Pt), and iridium (Ir). Further, examples of a material that can be used for the first conductor layer 74 include nitrides such as titanium nitride (TiN), indium tin oxide (ITO), and the like. Although these formation methods are not particularly limited, for example, plating methods such as electroplating and electroless nickel plating, PVD (Physical Vapor Deposition) such as sputtering, MO-CVD (Metal Organic Chemical Vapor), and the like. Examples thereof include a CVD (Chemical Vapor Deposition) method such as a Deposition method. Among them, it is preferable to form the second conductor layer 76 made of a nickel thin film by sputtering because it is easy to form the second electrode that is less likely to be crushed than the first electrode. The thickness of the second conductor layer is usually the same as that of the second electrode, for example, about 0.1 μm.

Next, the bottom surface of the groove 76b in the second conductor layer 76 of FIG. 11E is processed to form the second conductor layer 77 as shown in FIG. 11F. The processing method is not particularly limited, and examples thereof include milling such as ion milling and a dicing saw.
(5) Resin Formation and Polishing Step Next, the resin 78 is buried in the groove 77b in FIG. As the resin 78, the resin 78 has an electrical insulating property, is made of a material other than a piezoelectric material, and is more easily deformed than the first electrode 75, the second electrode 77, and the piezoelectric body 73 (flexibility). Is high). The method for filling the resin is not particularly limited, and examples thereof include a spin method, a dip method, and a spray method. The thickness W1 of the resin 78 is, for example, about 5 μm.

Thereafter, the upper surface of the convex portion 73a on which the first conductive layer 75 and the second conductive layer 77 are formed is polished until the convex portion 73a is exposed, and as shown in FIG. A laminate in which a thick electrode 91 composed of one conductor layer 75 and a second conductor layer 77 and a thin electrode 92 composed of the second conductor layer 77 are formed and an actuator 95 is formed on a slider substrate 71 is formed. Obtained. Although the polishing method is not particularly limited, for example, a CMP (chemical mechanical polishing) method can be used.
(6) Magnetic Head Formation Step Next, as shown in FIG. 11 (h), after forming an insulating film 79 such as alumina on the laminate, a magnetic head 80 is formed by a normal head creation process. The layer configuration of the magnetic head 80 is not particularly limited, and a magnetic head used in a magnetic storage device can be provided according to the application. The details of the layer structure and manufacturing method of the magnetic head are omitted in this specification.

  Before forming the insulating film 79, a layer (not shown) having a Young's modulus lower than that of the piezoelectric body 73 may be formed on the laminate. As described in the explanation of the resin layer 131 in the head slider, this layer has electrical insulation, has a lower Young's modulus than the piezoelectric body 73, and is easily deformed (highly flexible). Good. The layer having a low Young's modulus can be formed by means appropriately selected according to a material used from spin coating, dip, gas phase polymerization, and the like.

Further, known processing for forming the flying surface of the slider is performed, and the head slider of this embodiment is completed.
-Storage device-
The storage device of the present invention can reduce the size of the piezoelectric element by including a head slider provided with a unimorph piezoelectric element between the substrate and the magnetic head. In addition, the storage device of the present invention has the same effects as those described in the embodiment of the head slider of the present invention.

  Since the outline of the magnetic recording apparatus according to the embodiment of the storage apparatus of the present invention has been described with reference to FIGS. 1, 2, and 4, detailed description thereof will be omitted. Note that a known technique may be referred to for a manufacturing method of the storage device.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

Example 1
A method of forming the head slider according to the first embodiment will be described with reference to FIG.

  First, as shown in FIG. 11A, a PZT film (Young's modulus: 65 GPa) having a thickness H ′ of 25 μm was formed as a piezoelectric body 72 by a CVD method on a slider substrate 71 made of Altic. Next, the formed piezoelectric body 72 is processed by a dicing saw, and as shown in FIG. 11B, a convex portion 73a having a width W2 of 10 μm and a height H of 20 μm, a width W5 of 20 μm, and a depth H of A concavo-convex pattern 73 having a pitch P of 30 μm and formed by 20 μm grooves 73b was formed. Next, an electroless Ni plating process is performed on the processed piezoelectric body 73, and as shown in FIG. 11C, the groove 73b is formed by Ni plating (Young's modulus: 220 GPa) as the first conductor layer 74. Buried. Next, the first conductor layer 74 is grooved with a dicing saw so that the width W6 is 15 μm, and as shown in FIG. 11D, the first conductor layer having a thickness W3 of 5 μm is formed. 75 was formed. Next, as shown in FIG. 11E, the thickness W4 is 0.1 μm as the second conductor layer 76 by using DC sputtering so as to cover the first conductor layer 75 and the piezoelectric layer 73. A Ni thin film (Young's modulus: 50 GPa) was formed. Next, by removing the groove bottom surface of the second conductor layer 76 using ion milling, a second conductor layer 77 was formed as shown in FIG. Next, the groove 77b was filled with a polyimide resin (Young's modulus: 0.5 GPa) 78 as shown in FIG. 11G, and the surface was further polished by CMP. By this polishing process, the thick electrode (first electrode) 91 composed of the first conductor layer 75 and the second conductor layer 77 and the second conductor layer 77 sandwiching the convex portion 73a of the piezoelectric body. A thin electrode (second electrode) 91 was formed. Next, as shown in FIG. 11 (h), after an alumina film was formed by RF magnetron sputtering, a magnetic head element was produced by a normal head production process. Further, normal processing for forming the air bearing surface of the slider at a predetermined location on the Altic substrate was performed. With respect to the obtained head slider, the resonance frequency in the spacing direction of the magnetic head portion was measured by a laser Doppler method and found to be about 5 MHz.

Using the head slider having the flying height control mechanism by the head slider thus created and the conventional thermal actuator, the power consumption per unit displacement and the flying height can be controlled using the flying height evaluation device. The maximum value (drive limit frequency) of the frequency of the alternating electric field applied to the first electrode and the second electrode was evaluated. When the driving frequency was 1 kHz, the head slider of Example 1 was able to be driven with a power consumption of 1/1000 or less of the thermal ejection head to obtain the same amount of displacement. Further, the drive limit frequency of the head slider of Example 1 was 100 times higher than the drive limit frequency of the thermal ejection head.
(Example 2)
A method of forming the head slider according to the second embodiment will be described with reference to FIG.

  First, as shown in FIG. 11A, a PNN-PZT piezoelectric ceramic powder paste is printed as a piezoelectric body 72 on a slider substrate 71 made of Altic by a printing method, fired at 1100 ° C., and then HIP ( A high-temperature isostatic pressing process was performed to form a dense PNN-PZT piezoelectric ceramic layer (Young's modulus: 55 GPa) without voids. The thickness H ′ of the piezoelectric body 72 was 25 μm. The following steps were performed in the same manner as in Example 1, and the head slider of Example 2 was obtained. The resonance frequency in the spacing direction of the obtained head slider was about 5 MHz.

The power slider per unit displacement and the drive limit frequency of the head slider thus prepared and the head slider having a flying height control mechanism using a conventional thermal actuator were evaluated using a flying height evaluation apparatus. When the driving frequency was 1 kHz, the head slider of Example 2 was able to be driven with a power consumption of 1/1000 or less that of the thermal ejection head to obtain the same amount of displacement. Further, the drive limit frequency of the head slider of Example 1 was 100 times higher than the drive limit frequency of the thermal ejection head.
(Example 3)
A method of forming the head slider according to the third embodiment will be described with reference to FIG.

  First, as shown in FIG. 11A, a PZT film (Young's modulus: 65 GPa) having a thickness of 10 μm was formed as a piezoelectric body 72 on a slider substrate 71 made of Altic by an RF magnetron sputtering method. Next, the formed piezoelectric body 72 is processed with a dicing saw, and as shown in FIG. 11B, a convex portion 73a having a width W2 of 10 μm and a height H of 10 μm, a width W5 of 10 μm, and a depth H of A piezoelectric body 73 formed with a concavo-convex pattern having a pitch P of 20 μm, which is constituted by a 10 μm groove 73b, was obtained. Next, an electroless Ni plating process was performed on the piezoelectric body 73, and as shown in FIG. 11C, the groove 73b was filled with Ni (Young's modulus: 220 GPa). Next, using a dicing saw, a groove having a width of 5 μm is formed on the first conductor layer 74 and a width of 5 μm is formed on the convex portion 73a. As shown in FIG. A Ni plating layer having a thickness W3 of 5 μm was formed as the layer 75, and a PZT film having a thickness W2 ′ of 5 μm was formed as the piezoelectric film 73a. The following steps were performed in the same manner as in Example 1, and the head slider of Example 3 was obtained. The resonance frequency in the spacing direction of the obtained head slider was about 5 MHz.

The power slider per unit displacement and the drive limit frequency of the head slider thus prepared and the head slider having a flying height control mechanism using a conventional thermal actuator were evaluated using a flying height evaluation apparatus. When the driving frequency was 1 kHz, the head slider of Example 3 was able to be driven with a power consumption of 1/1000 or less that of the heat-projecting head to obtain the same amount of displacement. Further, the drive limit frequency of the head slider of Example 3 was 100 times higher than the drive limit frequency of the thermal ejection head.
Example 4
A laminate as shown in FIG. 11G was formed in the same manner as in Example 1. Thereafter, a polyimide film having a thickness of about 2 μm was applied by spin coating and heated and cured (not shown). Thereafter, as shown in FIG. 11 (h), an alumina film was formed on the polyimide film by RF magnetron sputtering, and then a magnetic head element was formed by a normal head forming process. The following steps were performed in the same manner as in Example 1, and the head slider of Example 4 was obtained. The resonance frequency in the spacing direction of the obtained head slider was about 5 MHz. The applied voltage required for the head slider of Example 4 to obtain the same amount of displacement as the head slider of Example 1 was about 60% of the applied voltage required for the head slider of Example 1.

  The power slider per unit displacement and the drive limit frequency of the head slider thus prepared and the head slider having a flying height control mechanism using a conventional thermal actuator were evaluated using a flying height evaluation apparatus. When the driving frequency is 1 kHz, the power consumption of the head slider of Example 4 required to obtain the same displacement amount is 1/1000 or less that of the head with thermal protrusion and less than half that of the head slider of Example 1. . Further, the drive limit frequency of the head slider of Example 4 was 100 times higher than the drive limit frequency of the thermal ejection head.

Here, the detailed features of the present invention will be described again.
(Appendix 1)
A slider substrate;
A pair of electrodes composed of a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes; and a Young's modulus of the first electrode An operating portion in which the product of the thickness in the direction between the pair of electrodes is larger than the product of the Young's modulus in the second electrode and the thickness in the direction between the pair of electrodes;
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween.
(Appendix 2)
2. The head slider according to claim 1, wherein the longitudinal direction of the electrodes extends along a direction connecting the slider substrate and the magnetic head.
(Appendix 3)
The head slider according to appendix 1, wherein a thickness of the first electrode in the inter-electrode direction is larger than a thickness of the second electrode in the inter-electrode direction.
(Appendix 4)
2. The head slider according to claim 1, wherein when an electric field is applied between the pair of electrodes, the piezoelectric body is distorted in a direction perpendicular to the electric field, whereby the magnetic head moves in the electric field direction.
(Appendix 5)
2. The head slider according to appendix 1, wherein an insulating layer is provided between the pair of electrodes and the slider substrate.
(Appendix 6)
An electrical insulating layer between the magnetic head and the operating portion;
The insulating layer has first and second vias each having conductivity,
The actuating portion has a first terminal electrically connected to the first electrode, and a second terminal electrically connected to the second electrode;
The magnetic head has a third terminal electrically connected to the surface of the magnetic head through the first via, the second terminal, and the second via. The head slider according to claim 1, further comprising a fourth terminal connected to the head.
(Appendix 7)
2. The head slider according to appendix 1, wherein two or more of the operating parts are disposed between the magnetic head and the slider substrate.
(Appendix 8)
2. The head slider according to appendix 1, wherein a layer having a Young's modulus lower than that of the piezoelectric body is formed between the operating portion and the magnetic head.
(Appendix 9)
The head slider according to appendix 7, wherein a material having a Young's modulus lower than that of the piezoelectric body is disposed between the adjacent operating portions.
(Appendix 10)
The head slider according to appendix 1, wherein the pair of electrodes include nickel.
(Appendix 11)
The magnetic head has a recording unit for recording information or a reproducing unit for reproducing information;
2. The head slider according to claim 1, wherein the operating portion is sandwiched between the slider substrate and the recording portion, or between the slider substrate and the reproducing portion.
(Appendix 12)
A slider substrate;
An operating unit comprising a pair of electrodes composed of first and second electrodes disposed at an end of the slider substrate, and a piezoelectric body disposed between the pair of electrodes;
A magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween,
The first electrode and the second electrode in the direction between the pair of electrodes are distorted perpendicularly to the direction of the electric field by the applied electric field, so that the magnetic head is in the direction of the electric field. A head slider comprising a thickness and a material movable along the head slider.
(Appendix 13)
13. The head slider according to appendix 12, wherein a layer having a Young's modulus lower than that of the piezoelectric body is formed between the operating portion and the magnetic head.
(Appendix 14)
Forming a piezoelectric body on the slider substrate;
Processing the piezoelectric body into a convex portion;
Forming a first electrode having a first value of a product of Young's modulus and a thickness in a direction between the electrodes on one side surface of the convex portion;
Forming, on the other side surface of the convex portion, a second electrode in which the product of the Young's modulus and the thickness in the inter-electrode direction is a second value smaller than the first value;
And a step of forming a magnetic head on a slider substrate on which the convex portion, the first electrode and the second electrode are formed.
(Appendix 15)
15. The method of manufacturing a head slider according to appendix 14, wherein the longitudinal direction of the electrodes extends along a direction connecting the slider substrate and the magnetic head.
(Appendix 16)
14. The method for manufacturing a head slider according to claim 13, further comprising a step of forming a layer having a Young's modulus lower than that of the piezoelectric body before the step of forming the magnetic head.
(Appendix 17)
15. The method of manufacturing a head slider according to appendix 14, wherein the piezoelectric body, the first electrode, the second electrode, and the magnetic head are formed using a thin film formation process.
(Appendix 18)
In a storage device comprising a storage medium for recording and reproducing information, and a head slider arranged to face the storage medium,
The head slider is
A slider substrate;
A pair of electrodes including a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes, and a pair of Young's modulus in the first electrode. A product of the thickness in the inter-electrode direction is greater than the product of the Young's modulus in the second electrode and the thickness in the pair of electrodes,
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween.

It is the schematic which shows the magnetic-recording apparatus using the head slider of this invention. It is the schematic which shows the magnetic-recording apparatus using the head slider of this invention. 1 is a perspective view showing a schematic structure of a head slider which is an embodiment of a head slider of the present invention. It is a typical sectional view showing one embodiment of a head slider of the present invention and a magnetic head support provided with the magnetic head slider of the present invention. FIG. 5 is a schematic cross-sectional view in which a portion A of the head slider in FIG. 4 is enlarged. It is a conceptual diagram which shows operation | movement of a unimorph type piezoelectric element. It is the schematic of the head slider which performed the simulation of the actuator provided with a unimorph type piezoelectric element. It is the schematic of the head slider which performed the simulation of the actuator provided with a unimorph type piezoelectric element. FIG. 5 is a conceptual perspective view showing an actuator in the head slider in FIGS. 3 and 4. It is a schematic diagram which shows the positional relationship of an element and an action | operation part seen from the front-end | tip of a head slider. It is typical sectional drawing for every process which shows one Embodiment of the manufacturing method of the head slider of this invention.

Explanation of symbols

6, 6a, 6b, 6c, 6d Piezoelectric body 6 'Insulating layer 7, 8 Insulating layer 9, 9a, 9b, 9c, 9d First electrode 10, 10a, 10b, 10c, 10d Second electrode 11, 11a, 11b, 11c, 11d, 11e Resin 13 Unimorph type piezoelectric element (operation part)
18, 18a, 18b, 18c, 18d Actuating part 14, 17 Electrode pad 14s, 17s Via 14t, 17t Terminal 15, 16 Electrode line 40 Air flow 71 Slider substrate 72 Piezoelectric body 73 Convex piezoelectric body 73a Protruding part 73b, 75b, 76b Groove 74, 75 First conductor layer 76, 77 Second conductor layer 77b Groove 78 Resin 79, 96 Insulating film 80, 105b Magnetic head 91 First electrode (thick electrode)
92 Second electrode (thin electrode)
95, 105c Actuator 101 Magnetic disk device (storage device)
102 Housing 103 Rotating shaft 104 Magnetic disk (storage medium)
104c Magnetic disk surface 105 Head slider 105a Slider substrate 105d Element 105f Air bearing surface 106 Suspension 107 Arm shaft 108 Carriage arm 109 Electromagnetic actuator 110 Control unit 111 Wiring 112 CPU
114 RAM
115 ROM
117 Bus 119 I / O circuit 120 Rotating direction of magnetic disk 121 Magnetic head support 131 Resin layer

Claims (10)

A slider substrate;
A pair of electrodes composed of a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes; and a Young's modulus of the first electrode An operating portion in which the product of the thickness in the direction between the pair of electrodes is larger than the product of the Young's modulus in the second electrode and the thickness in the direction between the pair of electrodes;
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween. The head slider according to claim 1, wherein the longitudinal direction of the electrodes extends along a direction connecting the slider substrate and the magnetic head. 2. The head slider according to claim 1, wherein a thickness of the first electrode in the inter-electrode direction is larger than a thickness of the second electrode in the inter-electrode direction. 2. The head according to claim 1, wherein the piezoelectric body is distorted perpendicularly to the direction of the electric field by the electric field applied between the pair of electrodes, and the magnetic head moves along the electric field direction. 3. Slider. 2. The head slider according to claim 1, wherein two or more of the operating portions are disposed between the magnetic head and the slider substrate.   The head slider according to claim 1, wherein a layer having a Young's modulus lower than that of the piezoelectric body is disposed between the driving unit and the magnetic head.   The head slider according to claim 5, wherein a material having a Young's modulus lower than that of the piezoelectric body is disposed between the adjacent operating portions. A slider substrate;
An operating unit comprising a pair of electrodes composed of first and second electrodes disposed at an end of the slider substrate, and a piezoelectric body disposed between the pair of electrodes;
A magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween,
The first electrode and the second electrode in the direction between the pair of electrodes are distorted perpendicularly to the direction of the electric field by the applied electric field, so that the magnetic head is in the direction of the electric field. A head slider comprising a thickness and a material movable along the head slider. Forming a piezoelectric body on the slider substrate;
Processing the piezoelectric body into a convex portion;
Forming a first electrode having a first value of a product of Young's modulus and a thickness in a direction between the electrodes on one side surface of the convex portion;
Forming, on the other side surface of the convex portion, a second electrode in which the product of the Young's modulus and the thickness in the inter-electrode direction is a second value smaller than the first value;
And a step of forming a magnetic head on a slider substrate on which the convex portion, the first electrode and the second electrode are formed. In a storage device comprising a storage medium for recording and reproducing information, and a head slider arranged to face the storage medium,
The head slider is
A slider substrate;
A pair of electrodes including a first electrode and a second electrode disposed at an end of the slider substrate; and a piezoelectric body disposed between the pair of electrodes, and a pair of Young's modulus in the first electrode. A product of the thickness in the inter-electrode direction is greater than the product of the Young's modulus in the second electrode and the thickness in the pair of electrodes,
And a magnetic head disposed on the opposite side of the slider substrate with the operating portion interposed therebetween.