JP2009092357A - Tabular heat pipe - Google Patents

Tabular heat pipe Download PDF

Info

Publication number
JP2009092357A
JP2009092357A JP2007266293A JP2007266293A JP2009092357A JP 2009092357 A JP2009092357 A JP 2009092357A JP 2007266293 A JP2007266293 A JP 2007266293A JP 2007266293 A JP2007266293 A JP 2007266293A JP 2009092357 A JP2009092357 A JP 2009092357A
Authority
JP
Japan
Prior art keywords
heating element
heat pipe
temperature
substrate
hydraulic fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007266293A
Other languages
Japanese (ja)
Inventor
Tatsuya Shudo
竜哉 首藤
Akio Kurihara
明男 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2007266293A priority Critical patent/JP2009092357A/en
Publication of JP2009092357A publication Critical patent/JP2009092357A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tabular heat pipe capable of approximating a temperature detected by a temperature detecting part of a heating element attached to a heating element attaching part to a temperature near an actual temperature of the heating element. <P>SOLUTION: The tabular heat pipe 1 is provided with a substrate 2 formed by two metal plates joined together. The heating element attaching part 5 and a heat radiation part 6 are provided on the substrate 2. A heat pipe part 8 laid across the heating element attaching part 5 and the heat radiation part 6 is formed on the substrate 2. The heat pipe part 8 is provided with an evaporation part 10 existing on the heating element attaching part 5 in the heat pipe part 8, and a bypass part 13 communicating a condensing part 11 with a portion existing on the heat radiation part 6. A temperature detection position 14 for detecting the temperature by the temperature detecting part S1 of the heating element S attached to the heating element attaching part 5 is provided in a portion provided with the bypass part 13 in the heating element attaching part 5 of the substrate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、たとえば工作機械および制御用ロボットなどに用いられるIPM(Intelligent Power Module)や、IGBT(Insulated Gate Bipolar Transistor)、サイリスタなどの発熱電子部品を冷却するのに用いられる平板状ヒートパイプに関する。   The present invention relates to a flat plate heat pipe used for cooling heat generating electronic components such as IPM (Intelligent Power Module), IGBT (Insulated Gate Bipolar Transistor), and thyristor used for machine tools and control robots, for example.

この明細書および特許請求の範囲において、図1および図3の上下を上下というものとする。   In this specification and the claims, the top and bottom of FIGS. 1 and 3 are the top and bottom.

この種の平板状ヒートパイプとして、互いに接合された2枚の金属板により基板が形成され、基板に、発熱体取付部および放熱部が設けられるとともに、少なくともいずれか一方の金属板を膨出させることによって発熱体取付部および放熱部に跨る中空状作動液封入部が形成され、作動液封入部内に作動液が封入されることによりヒートパイプ部が形成されており、ヒートパイプ部における発熱体取付部に存在する部分が蒸発部になるとともに、放熱部に存在する部分が凝縮部になっており、凝縮部の上端部が蒸発部よりも上方にのびている平板状ヒートパイプが知られている(特許文献1参照)。   As this type of flat heat pipe, a substrate is formed by two metal plates joined together, and a heating element mounting portion and a heat radiating portion are provided on the substrate, and at least one of the metal plates is expanded. As a result, a hollow hydraulic fluid enclosing portion is formed across the heating element mounting portion and the heat radiating portion, and a heat pipe is formed by enclosing the operating fluid in the operating fluid enclosing portion, and the heating element mounting in the heat pipe portion A plate-like heat pipe is known in which the part existing in the part becomes the evaporation part, the part existing in the heat radiating part becomes the condensation part, and the upper end part of the condensation part extends above the evaporation part ( Patent Document 1).

ところで、工作機械の制御装置に用いられるIPMは、平板状ヒートパイプの基板の温度を検出する温度検出部を有しており、温度検出部により検出される平板状ヒートパイプの基板の温度がしきい値を超えると、IPMの損傷を防止するために、工作機械が停止させられるようになっている。   By the way, the IPM used for the control device of a machine tool has a temperature detection unit that detects the temperature of the substrate of the flat plate heat pipe, and the temperature of the substrate of the flat plate heat pipe detected by the temperature detection unit is adjusted. When the threshold is exceeded, the machine tool is stopped to prevent damage to the IPM.

特許文献1記載の平板状ヒートパイプを、工作機械のIPMの冷却に用いる場合、発熱体取付部に取り付けられるIPMの温度検出部は、基板の発熱体取付部におけるヒートパイプ部の蒸発部よりも上方の部分に設けられ、かつヒートパイプ部の存在しない温度検出位置の温度を検出するようになっている。しかしながら、ヒートパイプ部の存在しない温度検出位置の温度は、実際のIPMの温度よりも高くなるので、温度検出部により検出される温度がしきい値を超えやすくなり、工作機械が停止させられる頻度が多くなるという問題がある。
特開2005−283093号公報
When the flat heat pipe described in Patent Document 1 is used for cooling the IPM of a machine tool, the temperature detection unit of the IPM attached to the heating element mounting part is more than the evaporation part of the heat pipe part in the heating element mounting part of the substrate. The temperature of the temperature detection position provided in the upper part and having no heat pipe portion is detected. However, since the temperature at the temperature detection position where the heat pipe portion does not exist is higher than the actual temperature of the IPM, the temperature detected by the temperature detection portion easily exceeds the threshold value, and the frequency at which the machine tool is stopped. There is a problem that increases.
JP 2005-283093 A

この発明の目的は、上記問題を解決し、発熱体取付部に取り付けられる発熱体の温度検出部により検出される温度を、実際の発熱体の温度に近い温度にすることができる平板状ヒートパイプを提供することにある。   The object of the present invention is to solve the above-mentioned problems and to make the temperature detected by the temperature detection unit of the heating element attached to the heating element mounting part a temperature close to the actual heating element temperature Is to provide.

本発明は、上記目的を達成するために以下の態様からなる。   In order to achieve the above object, the present invention comprises the following aspects.

1)互いに接合された2枚の金属板により基板が形成され、基板に、発熱体取付部および放熱部が設けられるとともに、少なくともいずれか一方の金属板を膨出させることによって発熱体取付部および放熱部に跨る中空状作動液封入部が形成され、作動液封入部内に作動液が封入されることによりヒートパイプ部が形成されており、ヒートパイプ部における発熱体取付部に存在する部分が蒸発部になるとともに、放熱部に存在する部分が凝縮部になっており、凝縮部の上端部が蒸発部よりも上方にのびている平板状ヒートパイプであって、
ヒートパイプ部が、蒸発部と凝縮部とを通じさせるバイパス部を備えており、バイパス部が、ヒートパイプ部の蒸発部の上端部と凝縮部との間において、基板の少なくともいずれか一方の金属板を膨出させることにより形成され、基板の発熱体取付部におけるバイパス部が設けられている部分に、発熱体取付部に取り付けられる発熱体の温度検出部により温度が検出される温度検出位置が設けられている平板状ヒートパイプ。
1) A substrate is formed by two metal plates joined to each other, and a heating element mounting portion and a heat radiating portion are provided on the substrate, and at least one of the metal plates is bulged so that the heating element mounting portion and A hollow hydraulic fluid enclosing part is formed across the heat radiating part, and the heat pipe is formed by enclosing the hydraulic fluid in the hydraulic fluid enclosing part, and the part existing in the heating element mounting part in the heat pipe evaporates A part that exists in the heat radiating part is a condensing part, and the upper end part of the condensing part is a flat plate heat pipe extending above the evaporating part,
The heat pipe portion includes a bypass portion that allows the evaporation portion and the condensation portion to pass through, and the bypass portion is a metal plate at least one of the substrates between the upper end portion of the evaporation portion of the heat pipe portion and the condensation portion. The temperature detection position where the temperature is detected by the temperature detection part of the heating element attached to the heating element attachment part is provided in the part where the bypass part is provided in the heating element attachment part of the substrate. A flat heat pipe.

上記1)の平板状ヒートパイプによれば、 ヒートパイプ部が、蒸発部と凝縮部とを通じさせるバイパス部を備えており、バイパス部が、ヒートパイプ部の蒸発部の上端部と凝縮部との間において、基板の少なくともいずれか一方の金属板を膨出させることにより形成され、基板の発熱体取付部におけるバイパス部が設けられている部分に、発熱体取付部に取り付けられる発熱体の温度検出部により温度が検出される温度検出位置が設けられているので、基板の温度検出位置の温度が、特許文献1記載の平板状ヒートパイプに比較して低くなり、発熱体取付部に取り付けられる発熱体の温度検出部により検出される温度を、実際の発熱体の温度に近い温度にすることができる。したがって、たとえばこの平板状ヒートパイプを工作機械のIPMの冷却に用いる場合、発熱体取付部に取り付けられるIPMの温度検出部により検出される温度がしきい値を超えにくくなり、工作機械が停止させられる頻度が減少する。また、ヒートパイプ部の蒸発部で発生したガス状作動液は、バイパス部を通っても凝縮部に流れるので、平板状ヒートパイプの放熱性能が向上する。   According to the flat plate heat pipe of 1) above, the heat pipe portion includes a bypass portion that allows the evaporation portion and the condensation portion to pass through, and the bypass portion is formed between the upper end portion of the evaporation portion of the heat pipe portion and the condensation portion. The temperature detection of the heating element attached to the heating element mounting portion is formed by expanding the metal plate of at least one of the substrates in the middle, and the bypass heating portion of the heating element mounting portion of the board is provided. Since the temperature detection position where the temperature is detected by the part is provided, the temperature at the temperature detection position of the substrate is lower than that of the flat plate heat pipe described in Patent Document 1, and the heat generation attached to the heating element attachment part The temperature detected by the body temperature detection unit can be set to a temperature close to the actual temperature of the heating element. Therefore, for example, when this flat plate heat pipe is used for cooling the IPM of a machine tool, the temperature detected by the temperature detection unit of the IPM attached to the heating element mounting part is difficult to exceed the threshold value, and the machine tool is stopped. Less frequently. Further, since the gaseous hydraulic fluid generated in the evaporation part of the heat pipe part flows through the bypass part to the condensation part, the heat dissipation performance of the flat plate heat pipe is improved.

以下、この発明の実施形態を、図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

なお、以下の説明において、図1の左右を左右というものとする。また、以下の説明において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。   In the following description, the left and right in FIG. In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

図1は平板状ヒートパイプの全体構成を示し、図2はその要部の構成を示す。また、図3は平板状ヒートパイプを用いた放熱装置を示す。   FIG. 1 shows the overall configuration of a flat plate heat pipe, and FIG. 2 shows the configuration of the main part thereof. FIG. 3 shows a heat dissipation device using a flat plate heat pipe.

図1および図2において、平板状ヒートパイプ(1)は、互いにろう付された2枚の金属板(3)(4)により形成された垂直状の基板(2)を備えている。基板(2)には、発熱体取付部(5)と、発熱体取付部(5)の右側縁部に連なって一体に形成されかつ上端部が発熱体取付部(5)よりも上方に至る放熱部(6)とが設けられている。また、基板(2)に、少なくともいずれか一方、ここでは一方の金属板(3)のみを膨出させることによって、発熱体取付部(5)および放熱部(6)に跨る中空状作動液封入部(7)が形成され、作動液封入部(7)内に作動液(図示略)が封入されることによりヒートパイプ部(8)が形成されている。ヒートパイプ部(8)における発熱体取付部(5)に存在する部分が蒸発部(10)になるとともに、放熱部(6)に存在する部分が凝縮部(11)になっている。   1 and 2, the flat plate heat pipe (1) includes a vertical substrate (2) formed by two metal plates (3) and (4) brazed to each other. The board (2) is integrally formed with the heating element mounting part (5) and the right edge of the heating element mounting part (5), and the upper end portion extends above the heating element mounting part (5). A heat radiating part (6) is provided. In addition, by enlarging at least one of the substrates (2), in this case, only one metal plate (3), a hollow working fluid is enclosed across the heating element mounting portion (5) and the heat radiating portion (6). A part (7) is formed, and a heat pipe part (8) is formed by sealing a working liquid (not shown) in the working liquid sealing part (7). A portion of the heat pipe portion (8) existing in the heating element mounting portion (5) is the evaporation portion (10), and a portion existing in the heat dissipation portion (6) is the condensing portion (11).

基板(2)を構成する2枚の金属板(3)(4)はアルミニウムベア材からなり、2枚の金属板(3)(4)の合せ面のうちの少なくともいずれか一方の面に圧着防止剤を所要パターンに印刷し、この状態で2枚の金属板(3)(4)を圧着して非圧着部を有する合せ板をつくり、合せ板の非圧着部に流体圧を導入することによって作動液封入部(7)を一挙に形成する、いわゆるロールボンド法によって製造される。なお、合せ板の非圧着部は、作動液封入部(7)に対応する形状の作動液封入部用非圧着部と、作動液封入部用非圧着部から合せ板の周縁に至る流体圧導入用非圧着部とからなる。流体圧導入用非圧着部から流体圧を導入して作動液封入部(7)を形成すると、流体圧導入用非圧着部は、一端が作動液封入部(7)に連なるとともに他端が合せ板の周縁に開口した作動液注入部となる。作動液注入部は作動液の注入後封止される。また、基板(2)を構成する2枚の金属板(3)(4)が、片面にろう材層を有するアルミニウムブレージングシートからなり、このろう材層を利用して互いにろう付されることにより基板(2)が形成されることもある。この場合、いずれか一方の金属板に、プレス加工により予め作動液封入部(7)を形成しておく。   The two metal plates (3) and (4) constituting the substrate (2) are made of an aluminum bare material, and are crimped to at least one of the mating surfaces of the two metal plates (3) and (4). Print the inhibitor in the required pattern, and press the two metal plates (3) and (4) in this state to make a laminated plate with non-crimped parts, and introduce fluid pressure into the non-crimped parts of the laminated plates Is produced by a so-called roll bond method in which the hydraulic fluid enclosing portion (7) is formed at once. In addition, the non-crimping part of the laminating plate is a non-crimping part for the hydraulic fluid enclosing part having a shape corresponding to the hydraulic fluid enclosing part (7), and fluid pressure introduction from the non-crimping part for the hydraulic fluid enclosing part to the periphery of the laminating plate It consists of a non-crimping part. When fluid pressure is introduced from the non-crimped portion for introducing fluid pressure to form the hydraulic fluid enclosing portion (7), one end of the non-crimped portion for introducing fluid pressure is connected to the hydraulic fluid enclosing portion (7) and the other end is aligned. It becomes the hydraulic fluid injection | pouring part opened to the peripheral edge of the board. The hydraulic fluid injection part is sealed after the hydraulic fluid is injected. Also, the two metal plates (3) and (4) constituting the substrate (2) are made of an aluminum brazing sheet having a brazing material layer on one side, and are brazed to each other using this brazing material layer. A substrate (2) may be formed. In this case, the hydraulic fluid enclosing part (7) is formed in advance on any one of the metal plates by press working.

ヒートパイプ部(8)の蒸発部(10)は、方形のループ状部分(10a)と、ループ状部分(10a)に囲まれた部分においてループ状部分(10a)に連なるように形成された格子状部分(10b)とよりなる。ヒートパイプ部(8)の凝縮部(11)は、下端部が発熱体取付部(5)のループ状部分(10a)の下端部と同一高さ位置にあるとともに、上端部がループ状部分(10a)よりも上方に位置する上下方向に長い方形状のループ状部分(11a)と、ループ状部分(11a)に囲まれた部分においてループ状部分(11a)に連なるように形成された格子状部分(11b)とよりなる。また、ヒートパイプ部(8)は、蒸発部(10)のループ状部分(10a)の右側辺部と、凝縮部(11)のループ状部分(11a)の左側辺部の下部との間に上下方向に間隔をおいて設けられ、かつ両ループ状部分(10a)(11a)どうしを通じさせる複数の連通部(12)を備えている。また、ヒートパイプ部(8)を構成する作動液封入部(7)の一方の金属板(3)の膨出部の断面形状は等脚台形状であり、その膨出側頂壁は平坦壁となっている(図2参照)。   The evaporation part (10) of the heat pipe part (8) is a square loop-shaped part (10a) and a lattice formed so as to be continuous with the loop-shaped part (10a) in a part surrounded by the loop-shaped part (10a). It consists of a shape part (10b). The condensation part (11) of the heat pipe part (8) has a lower end part at the same height as a lower end part of the loop part (10a) of the heating element attachment part (5) and an upper end part of the loop part ( A rectangular loop-shaped portion (11a) that is longer in the up-down direction than 10a), and a lattice shape that is connected to the loop-shaped portion (11a) in a portion surrounded by the loop-shaped portion (11a) It consists of part (11b). Further, the heat pipe part (8) is located between the right side part of the loop part (10a) of the evaporation part (10) and the lower part of the left side part of the loop part (11a) of the condensation part (11). A plurality of communication portions (12) that are provided at intervals in the vertical direction and that allow both loop-like portions (10a) and (11a) to pass through are provided. Further, the cross-sectional shape of the bulging portion of one metal plate (3) of the hydraulic fluid enclosing portion (7) constituting the heat pipe portion (8) is an isosceles trapezoid, and the bulging side top wall is a flat wall. (See FIG. 2).

基板(2)の発熱体取付部(5)の右側部分は上方に突出するとともに放熱部(6)と一体化されている。この上方突出部を(5a)で示す。ヒートパイプ部(8)は、発熱体取付部(5)の上端部、上方突出部(5a)および放熱部(6)の左側縁部に跨り、かつ蒸発部(10)と凝縮部(11)とを通じさせるバイパス部(13)を備えている。バイパス部(13)は、発熱体取付部(5)の上端部、上方突出部(5a)および放熱部(6)の左側縁部において、作動液封入部(7)が形成された側の金属板(3)が作動液封入部(7)と同方向に膨出させられることにより、ヒートパイプ部(8)の蒸発部(10)の上端部と凝縮部(11)との間に形成されている。なお、バイパス部(13)を構成する膨出部の断面形状は、作動液封入部(7)を形成する膨出部の形状と同じである。バイパス部(13)は、蒸発部(10)のループ状部分(10a)の上辺部の左右方向中央部と、凝縮部(11)のループ状部分(11a)の左側辺部の下端部とを通じさせている。基板(2)の発熱体取付部(5)におけるバイパス部(13)が設けられている部分に、発熱体取付部(5)に取り付けられる発熱体の温度検出部により基板(2)の温度が検出される温度検出位置(14)が設けられている。   The right side portion of the heating element mounting portion (5) of the substrate (2) protrudes upward and is integrated with the heat radiating portion (6). This upward protrusion is indicated by (5a). The heat pipe section (8) spans the upper end of the heating element mounting section (5), the upper protrusion (5a) and the left edge of the heat radiating section (6), and the evaporation section (10) and the condensation section (11). A bypass part (13) is provided. The bypass portion (13) is a metal on the side where the hydraulic fluid enclosing portion (7) is formed at the upper end portion of the heating element mounting portion (5), the upper protruding portion (5a), and the left edge portion of the heat radiating portion (6). The plate (3) is formed between the upper end of the evaporation section (10) of the heat pipe section (8) and the condensation section (11) by bulging in the same direction as the hydraulic fluid sealing section (7). ing. Note that the cross-sectional shape of the bulging portion constituting the bypass portion (13) is the same as the shape of the bulging portion forming the hydraulic fluid sealing portion (7). The bypass part (13) passes through the central part in the left-right direction of the upper side part of the loop part (10a) of the evaporation part (10) and the lower end part of the left side part of the loop part (11a) of the condensation part (11). I am letting. The temperature of the substrate (2) is detected by the temperature detector of the heating element attached to the heating element mounting part (5) in the part where the bypass part (13) is provided in the heating element mounting part (5) of the board (2). A temperature detection position (14) to be detected is provided.

図3に示すように、平板状ヒートパイプ(1)を用いた放熱装置(15)は、基板(2)の放熱部(6)の両面に、その上下方向にのびる放熱フィン(16)が全体にわたって固定されたものである。放熱フィン(16)は、金属、ここではアルミニウムから形成された平板状ベース部(17)と、ベース部(17)の片面に一体に形成された上下方向にのびる複数の並列状フィン部(18)とからなる。一方の放熱フィン(16)は、ベース部(17)全体が作動液封入部(7)が形成されていない金属板(4)の外面に面接触した状態で平板状ヒートパイプ(1)に固定され、他方の放熱フィン(16)は、ベース部(17)が作動液封入部(7)を形成する膨出部の平坦な膨出端壁に接触した状態で平板状ヒートパイプ(1)に固定されている。放熱フィン(16)の平板状ヒートパイプ(1)への固定は、ろう付やねじ止めなどにより行われる。   As shown in FIG. 3, the heat dissipating device (15) using the flat plate heat pipe (1) has the heat dissipating fins (16) extending vertically on both surfaces of the heat dissipating part (6) of the substrate (2). It is fixed over. The heat dissipating fin (16) includes a flat base portion (17) made of metal, here aluminum, and a plurality of parallel fin portions (18 that extend integrally in one side of the base portion (17) and extend vertically. ). One radiating fin (16) is fixed to the flat plate heat pipe (1) in a state where the entire base portion (17) is in surface contact with the outer surface of the metal plate (4) where the hydraulic fluid enclosing portion (7) is not formed. The other radiating fin (16) is connected to the flat heat pipe (1) in a state where the base portion (17) is in contact with the flat bulging end wall of the bulging portion forming the hydraulic fluid sealing portion (7). It is fixed. The radiating fin (16) is fixed to the flat plate heat pipe (1) by brazing or screwing.

放熱装置(15)は、平板状ヒートパイプ(1)の基板(2)の発熱体取付部(5)におけるいずれかの面、ここでは作動液封入部(7)が膨出した側の面に、たとえば制御装置のIPM(S)が熱的に接触させられた状態でCNC(コンピュータ数値制御)工作機械に用いられる。CNC工作機械のIPM(S)の温度検出部(S1)は、平板状ヒートパイプ(1)の発熱体取付部(5)におけるバイパス部(13)が設けられているの部分の温度検出位置(14)の温度を測定する。   The heat dissipating device (15) is placed on any surface of the heating element mounting portion (5) of the substrate (2) of the flat plate heat pipe (1), here the surface on which the hydraulic fluid enclosing portion (7) swells. For example, it is used for a CNC (computer numerical control) machine tool in a state where the IPM (S) of the control device is in thermal contact. The temperature detection part (S1) of the IPM (S) of the CNC machine tool is the temperature detection position of the part where the bypass part (13) is provided in the heating element mounting part (5) of the flat plate heat pipe (1) ( Measure the temperature of 14).

そして、IPM(S)から発せられた熱は、金属板(3)を経てヒートパイプ部(8)の蒸発部(10)内の液相の作動液に伝わり、作動液が蒸発する。蒸発した気相の作動液は、連通部(12)およびバイパス部(13)を通って凝縮部(11)内に入り、凝縮部(11)内を上昇する。気相の作動液の有する熱は、凝縮部(11)において、金属板を経て放熱フィン(16)のベース部(17)に伝わり、ベース部(17)からフィン部(18)に伝わってフィン部(18)から放熱される。その結果、気相の作動液は凝縮し、液相の作動液が連通部(12)を通ってヒートパイプ部(8)の蒸発部(10)に戻る。このような動作を繰り返して、IPM(S)から発せられる熱が放熱される。   The heat generated from the IPM (S) is transmitted to the liquid-phase working fluid in the evaporation section (10) of the heat pipe section (8) through the metal plate (3), and the working liquid is evaporated. The vaporized working fluid that has evaporated passes through the communication part (12) and the bypass part (13), enters the condensing part (11), and ascends in the condensing part (11). The heat of the gas-phase hydraulic fluid is transferred to the base part (17) of the radiating fin (16) through the metal plate in the condensing part (11), and then transferred from the base part (17) to the fin part (18). Heat is radiated from the part (18). As a result, the gas-phase hydraulic fluid is condensed, and the liquid-phase hydraulic fluid passes through the communication portion (12) and returns to the evaporation portion (10) of the heat pipe portion (8). By repeating such an operation, the heat generated from the IPM (S) is radiated.

ここで、温度検出位置(14)が、基板(2)の発熱体取付部(5)におけるバイパス部(13)が設けられている部分に設けられているので、基板(2)の温度検出位置(14)の温度が、特許文献1記載の平板状ヒートパイプに比較して低くなり、発熱体取付部(5)に取り付けられたIPM(S)の温度検出部(S1)により検出される温度を、IPM(S)の実際の温度に近い温度にすることができる。したがって、発熱体取付部(5)に取り付けられるIPM(S)の温度検出部(S1)により検出される温度がしきい値を超えにくくなり、工作機械が停止させられる頻度が減少する。また、ヒートパイプ部(8)の蒸発部(10)で発生したガス状作動液は、バイパス部(13)を通っても凝縮部(11)に流れるので、平板状ヒートパイプ(1)の放熱性能が向上する。   Here, since the temperature detection position (14) is provided at the portion where the bypass portion (13) is provided in the heating element mounting portion (5) of the substrate (2), the temperature detection position of the substrate (2) The temperature detected by the temperature detection part (S1) of the IPM (S) attached to the heating element attachment part (5) is lower than that of the flat plate heat pipe described in Patent Document 1. Can be brought close to the actual temperature of the IPM (S). Therefore, the temperature detected by the temperature detection part (S1) of the IPM (S) attached to the heating element attachment part (5) does not easily exceed the threshold value, and the frequency at which the machine tool is stopped is reduced. Further, the gaseous hydraulic fluid generated in the evaporation section (10) of the heat pipe section (8) flows to the condensation section (11) even after passing through the bypass section (13). Performance is improved.

この発明による平板状ヒートパイプを示す正面図である。It is a front view which shows the flat heat pipe by this invention. 図1のA−A線拡大断面図である。It is an AA line expanded sectional view of FIG. 図1の平板状ヒートパイプを用いた放熱装置を示す分解斜視図である。It is a disassembled perspective view which shows the thermal radiation apparatus using the flat heat pipe of FIG.

符号の説明Explanation of symbols

(1):平板状ヒートパイプ
(2):基板
(3)(4):金属板
(5):発熱体取付部
(6):放熱部
(7):作動液封入部
(8):ヒートパイプ部
(10):蒸発部
(11):凝縮部
(13):バイパス部
(14):温度検出位置
(S):IPM(発熱体)
(S1):温度検出部
(1): Flat heat pipe
(2): Board
(3) (4): Metal plate
(5): Heating element mounting part
(6): Heat radiation part
(7): Hydraulic fluid enclosure
(8): Heat pipe section
(10): Evaporation section
(11): Condensing part
(13): Bypass section
(14): Temperature detection position
(S): IPM (heating element)
(S1): Temperature detector

Claims (1)

互いに接合された2枚の金属板により基板が形成され、基板に、発熱体取付部および放熱部が設けられるとともに、少なくともいずれか一方の金属板を膨出させることによって発熱体取付部および放熱部に跨る中空状作動液封入部が形成され、作動液封入部内に作動液が封入されることによりヒートパイプ部が形成されており、ヒートパイプ部における発熱体取付部に存在する部分が蒸発部になるとともに、放熱部に存在する部分が凝縮部になっており、凝縮部の上端部が蒸発部よりも上方にのびている平板状ヒートパイプであって、
ヒートパイプ部が、蒸発部と凝縮部とを通じさせるバイパス部を備えており、バイパス部が、ヒートパイプ部の蒸発部の上端部と凝縮部との間において、基板の少なくともいずれか一方の金属板を膨出させることにより形成され、基板の発熱体取付部におけるバイパス部が設けられている部分に、発熱体取付部に取り付けられる発熱体の温度検出部により温度が検出される温度検出位置が設けられている平板状ヒートパイプ。
A substrate is formed by two metal plates joined to each other, and a heating element mounting portion and a heat radiating portion are provided on the substrate, and at least one of the metal plates is bulged to thereby form the heating element mounting portion and the heat radiating portion. A hollow hydraulic fluid enclosing portion is formed over the surface, and the heat pipe is formed by enclosing the hydraulic fluid in the hydraulic fluid enclosing portion, and the portion existing in the heating element mounting portion in the heat pipe portion is the evaporation portion In addition, the portion present in the heat radiating part is a condensing part, and the upper end part of the condensing part is a flat plate heat pipe extending above the evaporating part,
The heat pipe portion includes a bypass portion that allows the evaporation portion and the condensation portion to pass through, and the bypass portion is a metal plate at least one of the substrates between the upper end portion of the evaporation portion of the heat pipe portion and the condensation portion. The temperature detection position where the temperature is detected by the temperature detection part of the heating element attached to the heating element attachment part is provided in the part where the bypass part is provided in the heating element attachment part of the substrate. A flat heat pipe.
JP2007266293A 2007-10-12 2007-10-12 Tabular heat pipe Pending JP2009092357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007266293A JP2009092357A (en) 2007-10-12 2007-10-12 Tabular heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007266293A JP2009092357A (en) 2007-10-12 2007-10-12 Tabular heat pipe

Publications (1)

Publication Number Publication Date
JP2009092357A true JP2009092357A (en) 2009-04-30

Family

ID=40664507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007266293A Pending JP2009092357A (en) 2007-10-12 2007-10-12 Tabular heat pipe

Country Status (1)

Country Link
JP (1) JP2009092357A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258874A (en) * 2010-06-11 2011-12-22 Showa Denko Kk Power conditioner
JP2014056690A (en) * 2012-09-12 2014-03-27 Showa Denko Kk Cooling structure for battery pack
JP2014082047A (en) * 2012-10-15 2014-05-08 Showa Denko Kk Battery pack refrigeration structure
CN114295399A (en) * 2021-12-29 2022-04-08 上海交通大学 Visual testing arrangement of vapor chamber evaporimeter heat dispersion

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433498A (en) * 1987-07-27 1989-02-03 Inoue Japax Res Heater using heat pipe
JPH09119786A (en) * 1995-10-25 1997-05-06 Showa Alum Corp Radiator
JP2001068610A (en) * 1999-08-30 2001-03-16 Denso Corp Boiling cooler
JP2001248983A (en) * 2000-03-07 2001-09-14 Denso Corp Evaporative cooling device
JP2005283093A (en) * 2004-03-04 2005-10-13 Showa Denko Kk Planar heat pipe and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433498A (en) * 1987-07-27 1989-02-03 Inoue Japax Res Heater using heat pipe
JPH09119786A (en) * 1995-10-25 1997-05-06 Showa Alum Corp Radiator
JP2001068610A (en) * 1999-08-30 2001-03-16 Denso Corp Boiling cooler
JP2001248983A (en) * 2000-03-07 2001-09-14 Denso Corp Evaporative cooling device
JP2005283093A (en) * 2004-03-04 2005-10-13 Showa Denko Kk Planar heat pipe and manufacturing method therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258874A (en) * 2010-06-11 2011-12-22 Showa Denko Kk Power conditioner
JP2014056690A (en) * 2012-09-12 2014-03-27 Showa Denko Kk Cooling structure for battery pack
JP2014082047A (en) * 2012-10-15 2014-05-08 Showa Denko Kk Battery pack refrigeration structure
CN114295399A (en) * 2021-12-29 2022-04-08 上海交通大学 Visual testing arrangement of vapor chamber evaporimeter heat dispersion
CN114295399B (en) * 2021-12-29 2023-09-01 上海交通大学 Visual testing device for heat dissipation performance of vapor chamber evaporator

Similar Documents

Publication Publication Date Title
JP2007003164A (en) Tabular heat pipe or vapor chamber, and its forming method
US8567483B2 (en) Heatsink with flexible base and height-adjusted cooling fins
US20060273137A1 (en) Heat dissipation device with heat pipes
JP2008294283A (en) Semiconductor device
JP2004523911A (en) Heat dissipation device
JP5926928B2 (en) Power semiconductor module cooling device
JP6558114B2 (en) Cooling component joining method
JP2008270297A (en) Power unit and heat dissipation container
JPH10267571A (en) Plate type heat pipe and cooling structure using the same
JP6412456B2 (en) Secondary battery cooling system
US20010022219A1 (en) Plate type heat pipe and its mounting structure
JP2009092357A (en) Tabular heat pipe
JP2007093020A (en) Liquid-cooled heat exchanger and its working fluid sealing method
JP6156368B2 (en) COOLING DEVICE CONNECTION STRUCTURE, COOLING DEVICE, AND COOLING DEVICE CONNECTION METHOD
EP3518072B1 (en) Heat transferring module
US6234242B1 (en) Two-phase thermosyphon including a porous structural material having slots disposed therein
JP6281622B1 (en) Cooling device, mounting method, cooling structure
JP4724435B2 (en) Flat heat pipe and manufacturing method thereof
JP2006310739A (en) Cooling apparatus for electronic equipment
WO1999053256A1 (en) Plate type heat pipe and its installation structure
JP2008206252A (en) Semiconductor power converter
US20070277962A1 (en) Two-phase cooling system for cooling power electronic components
JP4892403B2 (en) Heat pipe type heat dissipation device
JPH05304384A (en) Heat pipe type heat sink
JP2010287840A (en) Radiator

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100702

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120124

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120606