JP2009089306A - Movement mechanism, imaging unit, and imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and multifunctional movement unit, imaging unit and imaging device which solves problems required for miniaturization of actuators and is suitable for compact digital cameras, camera modules for mobile telephones with cameras, or the like. <P>SOLUTION: Problems required for miniaturization of actuators are solved by driving a moving part for mounting a part to be moved with a driving part composed of driving elements arranged ranging from a displacement transmission part, a thin-walled part and a fixed part to another displacement transmission part, another thin-walled part and another fixed part, through connecting parts. In addition, performance of a movement function can be improved. Thereby, a compact and multifunctional movement mechanism, imaging unit and imaging apparatus suitable for compact digital cameras, camera modules for mobile telephones with cameras, or the like can be provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a moving mechanism, an imaging unit, and an imaging apparatus, and more particularly, to a moving mechanism, an imaging unit, and an imaging apparatus that include a displacement transmission unit, a thin portion, a driving unit having a fixed unit and a driving element.

  In recent years, it has become necessary to achieve both miniaturization and high functionality (for example, mounting of an autofocus function, etc.) of an imaging apparatus such as a compact digital camera or a camera module for a camera-equipped mobile phone. However, even if an autofocus function is considered, for example, the conventional method of moving the photographic lens using a motor cannot be miniaturized, and a small actuator that replaces the motor is required.

  In order to reduce the size of the actuator, there are the following problems.

Problem 1) Reduction of driving load (driven body mass, mechanism friction, electric wiring, air convection, etc.) Problem 2) Simplification of assembly Problem 3) Countermeasures against dust The problems described above are described below.

Problem 1) In general, the output of an actuator becomes smaller as the size of the actuator is reduced. As an example, in an autofocus mechanism of a type that drives an imaging lens unit that is currently on the market, the mass of the imaging lens unit that is a driven body is about 0.2 g even if it is light, and the friction of the mechanism and the load due to the spring, In general, a load of about 10 ⁻² N is added to the load by a flexible substrate for electric wiring. The volume of the actuator for driving these loads is about 50 mm ³ and is quite large. In order to further reduce the size of the actuator, it is essential to reduce the load.

  Problem 2) In the above-described commercially available autofocus mechanism, there are about 10 parts constituting the actuator and the mechanism, and there are about the same parts where these parts are joined. In a further miniaturized autofocus mechanism, it is difficult to realize these joints with high accuracy in a short time, and it is essential to reduce the number of parts and joint points.

  Problem 3) The most commonly known small actuator is an electrostatic actuator, but the electrostatic actuator has a gap of about several μm between the fixed electrode and the moving electrode, and guarantees the operation. It is indispensable to have a sealed structure that prevents entry of garbage. A method of performing autofocus by sealing an image sensor and an electrostatic actuator in an image sensor package and driving the image sensor with the electrostatic actuator has been proposed. An electrostatic actuator that can be placed in the image sensor package In this case, it is difficult to drive an image sensor having a weak ability and a relatively large number of pixels and pixel size.

  Therefore, a method for realizing an autofocus function by translating the image sensor package in the direction of the optical axis using an actuator in which a plurality of S-shaped bimorph piezoelectric elements with separate electrodes and polarization directions are joined is proposed. (For example, refer to Patent Document 1).

In addition, as an example of a micro actuator, a method of forming a shape memory alloy (hereinafter referred to as SMA) thin film as a displacement element on a silicon substrate by applying a thin film forming technique and using it as an actuator is shown (for example, Non-Patent Document 1).
Japanese Patent Laid-Open No. 5-48957 Furuya et al. "Future Actuator Materials and Devices" pages 128-129 (CMC Publishing)

  However, in the method of Patent Document 1, since the image pickup device package is moved, a large driving force is required, which is contrary to the above-described problem 1). Further, since a plurality of S-shaped bimorph piezoelectric elements are joined in a complicated shape, the assembly of the actuator is complicated, which is contrary to the above-mentioned problem 2). Further, it is necessary to take measures against dust of the bimorph type piezoelectric element, and it is expected that the bimorph type piezoelectric element will be enlarged by a casing or the like, which is contrary to the above-described problem 3).

  Further, the method of Non-Patent Document 1 merely shows the possibility as an actuator, and is considered as an actuator when actually applied to the apparatus, such as the above-described problems 1), 2), and 3). No consideration has been given to what should be done.

  The present invention has been made in view of the above circumstances, and solves the problems necessary for downsizing the actuator, such as reduction in driving load, simplification of assembly, and countermeasures against dust, as described in the above-mentioned problems. It is an object of the present invention to provide a small and highly functional moving mechanism, an imaging unit, and an imaging apparatus suitable for a camera, a camera module for a camera-equipped mobile phone, and the like.

  The object of the present invention can be achieved by the following constitution.

1. A plate-shaped moving part for mounting the moved part;
A driving unit for moving the moving unit;
A connecting portion connecting the moving portion and the driving portion;
The drive unit has a pair of displacement units,
Each of the pair of displacement parts has a fixed part at one end and a displacement transmission part at the other end, and has a thin part connecting the fixed part and the displacement transmission part, and the fixed part, the thin part, and And having a drive element disposed across the displacement transmission section, and each of the displacement transmission sections is integrally coupled,
The connection unit connects the moving unit and the displacement transmission unit coupled together.

2. The moving part is rectangular;
The displacement transmission part of each of the two sets of the drive parts is connected to two opposing sides of the moving part by the two sets of connection parts,
Each of the two sets of the driving parts has a U-shape surrounding three sides of the moving part,
The displacement transmission part is a middle side of a U-shape,
The displacement part is both sides of a U-shape,
2. The moving mechanism according to 1, wherein the moving portion, the connecting portion, the displacement transmitting portion, the thin portion, and the fixing portion are integrally formed.

  3. 3. The moving mechanism according to 1 or 2, wherein the driving element is a piezoelectric element.

  4). 3. The moving mechanism according to 1 or 2, wherein the driving element is a shape memory alloy.

  5). The moving mechanism according to any one of 1 to 4, wherein the driving element is formed by sputtering.

  6). The moving mechanism according to any one of 1 to 5, wherein the moving section, the connecting section, and the driving section are configured by an SOI (Silicon on Insulator) substrate.

  7. The moving mechanism according to any one of 1 to 6, wherein the connection portion and the thin portion are formed in the same layer of an SOI substrate.

The moving mechanism according to any one of 8.1 to 7,
An image sensor as a driven part mounted on a moving part of the moving mechanism;
An image pickup device package enclosing the moving mechanism and the image pickup device;
An imaging unit, wherein the imaging device is moved by the moving mechanism.

An imaging unit according to 9.8;
An imaging optical system that forms a subject image on the imaging surface of the imaging element;
An image pickup apparatus, wherein the image pickup device is moved in an optical axis direction of the image pickup optical system by the moving mechanism.

  According to the present invention, the moving part for mounting the moved part is disposed across the displacement transmitting part, the thin part and the fixing part, and the displacement transmitting part, the thin part and the fixing part via the connecting part. By driving with a drive unit composed of drive elements, it is possible to solve the problems necessary for downsizing the actuator, and also to improve the performance of the moving function, for compact digital cameras and camera-equipped mobile phones. A small and highly functional moving mechanism, an imaging unit, and an imaging apparatus suitable for a camera module or the like can be provided.

  Hereinafter, the present invention will be described based on the illustrated embodiment, but the present invention is not limited to the embodiment. In the drawings, the same or equivalent parts are denoted by the same reference numerals, and redundant description is omitted.

  First, an embodiment of an imaging apparatus and an imaging unit according to the present invention will be described with reference to FIG. 1. FIG. 1 is a schematic diagram illustrating an example of a configuration of an embodiment of an imaging apparatus and an imaging unit according to the present invention. FIG. 1A is a cross-sectional view of the camera 1 that is an image pickup apparatus, and FIG. 1B is a cross-sectional view of the image pickup unit 10.

  In FIG. 1A, a camera 1 that is an imaging apparatus includes an imaging unit 10, an imaging optical system 20, and the like. The imaging unit 10 includes an imaging element 100, a moving mechanism 200, and the like. The imaging element 100 is disposed on the optical axis 21 of the imaging optical system 20 and is focused by being moved by the moving mechanism 200 in the direction of the optical axis 21 (the arrow AF direction in the figure).

  In FIG. 1B, the imaging unit 10 includes a housing 13, a lead frame 15 and a cover glass 17 that constitute the imaging device package 11, an imaging device 100 enclosed in the imaging device package 11, a moving mechanism 200, and a base. It comprises a table 290 and the like. Although the details will be described later, the moving mechanism 200 is formed by a microfabrication technique called a so-called MEMS (Micro Electro Mechanical Systems) technique.

  The image sensor 100 is mounted on the moving mechanism 200 and is moved by the moving mechanism 200 in the direction of the optical axis 21 (the arrow AF direction in the figure). The moving mechanism 200 is fixed on the base 290 by a fixing portion described later, and the moving portion described later is moved in the direction of the optical axis 21 (the arrow AF direction in the drawing) with reference to the base 290, whereby the image sensor 100. Is moved in the direction of the optical axis 21 (arrow AF direction in the figure). The base 290 is fixed on the bottom surface of the housing 13 or the lead frame 15. Of course, the bottom surface of the housing 13 or the lead frame 15 may be used as the base 290.

  As shown in FIG. 1B, by taking a configuration in which the image pickup device 100 and the moving mechanism 200 are enclosed in the image pickup device package 11, it is only necessary to prevent dust from adhering to the image pickup surface of the image pickup device 100. Therefore, it is possible to prevent the entry of dust into the moving mechanism 200, and to achieve the above-described problem 3) countermeasure against dust.

  Further, by moving the image sensor 100 by the moving mechanism 200, it is not necessary to move a heavy object like the image sensor package 11 as in the above-mentioned “Patent Document 1”, and the image sensor 100 and the moving mechanism 200 are not moved. Are encapsulated in the image pickup device package 11, and it is not necessary to consider an increase in load due to air convection in the camera 1, and the above-described problem 1) reduction in driving load can be achieved.

  Next, an embodiment of the moving mechanism 200 described above will be described with reference to FIG. FIG. 2 is a schematic diagram showing an example of an embodiment of the moving mechanism 200, FIG. 2 (a) is a schematic diagram showing a configuration of the moving mechanism 200, and FIGS. 2 (b) and 2 (c) are FIG. 2 (a). ) Is a cross-sectional view taken along the line AA 'of FIG.

  2A, the moving mechanism 200 includes a rectangular flat plate-shaped moving unit 201 for mounting the imaging device 100, a first driving unit 210, a second driving unit 250, connecting units 203 and 205, and the like. Is done.

  The first drive unit 210 includes a displacement transmission unit 211 and a pair of displacement units 213a and 213b connected to both ends thereof. The displacement part 213a has a fixing part 215a at the end opposite to the connection part with the displacement transmission part 211, and a thin part 217a is formed between the connection part with the displacement transmission part 211 and the fixation part 215a. In addition, the drive element 221a is disposed across the thin wall portion 217a and the fixed portion 215a from the end portion of the displacement transmitting portion 211.

  The same applies to the displacement portion 213b, which includes a fixed portion 215b, a thin portion 217b, a drive element 221b, and the like. The central part of one side of the moving part 201 and the central part of the displacement transmitting part 211 of the first driving part 210 are connected by a connecting part 203.

  Similarly, the second drive unit 250 includes a displacement transmission unit 251 and a pair of displacement units 253a and 253b connected to both ends thereof. The displacement part 253a has a fixed part 255a at the end opposite to the connection part with the displacement transmission part 251, and a thin part 257a is formed between the connection part with the displacement transmission part 251 and the fixation part 255a. In addition, the drive element 261a is disposed across the thin-walled portion 257a and the fixed portion 255a from the end portion of the displacement transmitting portion 251.

  The same applies to the displacement portion 253b, which includes a fixed portion 255b, a thin portion 257b, a drive element 261b, and the like. The central part of the opposite side connected to the displacement transmission part 211 of the moving part 201 and the central part of the displacement transmission part 251 of the second drive part 250 are connected by a connection part 205.

  The moving part 201, connecting parts 203 and 205, displacement transmitting parts 211 and 251, thin parts 217a, 217b, 257a and 257b, and fixing parts 215a, 215b, 255a and 255b are integrated with an SOI (Silicon On Insulator) substrate described later. Configured. The moving unit 201, the displacement transmitting units 211 and 251 and the fixed units 215a, 215b, 255a, and 255b are configured by the same layer of the SOI substrate and have rigidity.

  Similarly, the connection portions 203 and 205 and the thin portions 217a, 217b, 257a, and 257b are formed of the same layer of the SOI substrate and have spring properties. With such an integrated configuration, the number of parts constituting the moving mechanism can be reduced, and the above-described problem 2) simplification of assembly can be achieved.

  As shown in FIG. 2A, the pair of displacement portions 213a and 213b of the first drive unit 210 is disposed so as to surround the outside of the pair of displacement portions 253a and 253b of the second drive unit 250. ing. In addition to the illustrated example, for example, the displacement unit 253b, the displacement unit 213b, the moving unit 201, the displacement unit 253a, and the displacement unit 213a may be arranged in this order from the left side of the drawing.

  In FIG. 2B, the displacement part 213a has a fixing part 215a at the end opposite to the connection part with the displacement transmission part 211, and between the connection part with the displacement transmission part 211 and the fixation part 215a. Is formed with a thin portion 217a, and a drive element 221a is disposed across the thin portion 217a and the fixed portion 215a from the end of the displacement transmitting portion 211. The fixed portion 215a is fixed to the base 290 shown in FIG. 1B, which is made of, for example, a glass substrate, and does not move.

  In FIG. 2C, when a driving voltage is applied to the driving element 221a of the displacement portion 213a and the driving element 221a contracts in the arrow Y direction in the figure, the thin-walled part 217a moves in the arrow Z direction in the figure due to its spring property. It is bent and the displacement transmission part 211 is moved in the direction of arrow Z in the figure. A similar operation is performed for the displacement portion 213b, and the displacement transmission portion 211 is moved in the direction of the arrow Z in the figure by applying a drive voltage to the drive element 221b.

  The displacement portions 253a and 253b operate in the same way as shown in FIGS. 2B and 2C except that they are upside down. When a drive voltage is applied to the drive elements 261a and 261b, the displacement transmission portion 251 is moved in the direction of arrow Z in the figure. From the above operation, when the same drive voltage is applied to the drive elements 221a, 221b, 261a, and 261b, the displacement transmitting units 211 and 251 and the moving unit 201 and the moving unit 201 connected to each other by the connecting units 203 and 205 are used. 1 is translated in the direction of arrow Z in the figure, that is, in the direction of the optical axis 21 in FIG.

  3 is a cross-sectional view taken along the line BB ′ of FIG. 2, and is a schematic diagram for explaining that the moving unit 201 and the imaging device 100 described above are translated in the direction of the optical axis 21. FIG. FIG. 3B shows a state in which the drive voltage is not applied to the drive elements 221a, 221b, 261a and 261b, and FIG. 3B shows a state in which the same drive voltage is applied to the drive elements 221a, 221b, 261a and 261b.

  In FIG. 3A, no drive voltage is applied to the drive elements 221a, 221b, 261a, and 261b (not shown), so that the thin portions 217a, 217b, 257a, and 257b shown by bold broken lines in the figure are straight. It has a shape.

  In FIG. 3B, when the same drive voltage is applied to the drive elements 221a, 221b, 261a, and 261b (not shown), the thin portions 217a, 217b, 257a, and 257b shown by the thick broken lines in the figure are fixed. Bending in the direction of the arrow Z in the figure with the parts 215a, 215b, 255a and 255b as the base point, the rigid moving part 201 and the movement through the rigid displacement transmitting parts 211 and 251 and the springy connecting parts 203 and 205 The imaging device 100 mounted on the unit 201 is translated in the direction of the optical axis 21 (arrow AF direction), and focus adjustment is performed by changing the distance from the imaging optical system 20 shown in FIG.

  Next, a specific example of the drive element described above will be described with reference to FIG. FIG. 4 is a schematic diagram showing a specific example of the drive element. FIG. 4A is an example in which a piezoelectric element is used as the drive element, and FIG. 4B is a shape memory alloy (hereinafter referred to as SMA) as the drive element. An example using is shown. Here, the drive element 221a will be described as an example, but the same applies to the drive elements 221b, 261a, and 261b.

  In FIG. 4A, the thin part 217a is configured by the spring layer 231 of the SOI substrate 230, and the displacement transmitting unit 211 and the fixing unit 215a are configured by the spring layer 231 of the SOI substrate 230, the insulating layer 233, and the rigid layer 235. Is done. On the thin part 217a, the first electrode 223, the piezoelectric layer 225, and the second electrode 227 of the piezoelectric element 221a as a driving element are stacked across the displacement transmission part 211, the thin part 217a, and the fixing part 215a, and the thin part The portion 217a and the piezoelectric element 221a form a so-called unimorph structure.

  The drive voltage V is applied between the contact 223a of the first electrode 223 of the piezoelectric element 221a and the second electrode 227 via the switch SW, and the piezoelectric element 221a is applied by the application of the drive voltage V. The piezoelectric layer 225 expands in the direction of the applied electric field and contracts in the direction perpendicular to the applied electric field (in the direction of arrow Y in the figure). Due to the contraction in the Y direction of the piezoelectric element 221a and the spring property of the thin portion 217a, the displacement transmitting portion 211 is displaced in the arrow Z direction in the figure.

  When the switch SW is turned off, the electric charge accumulated in the piezoelectric element 221a is discharged through the discharging resistor R, the piezoelectric element 221a returns to its original shape, and the displacement transmission unit 211 also returns to its original position. The amount of movement of the displacement transmission unit 211 can be controlled by the magnitude of the drive voltage V.

  In order to prevent the thin-walled portion 217a from being deformed when the load is applied to the displacement transmitting portion 211 and reducing the displacement, the piezoelectric element 221a is provided across the displacement transmitting portion 211, the thin-walled portion 217a, and the fixed portion 215a. ing.

  In FIG. 4B, the thin part 217a, the displacement transmission part 211, and the fixing part 215a have the same structure as in FIG. On the thin part 217a, the SMA 221a as a driving element is stacked across the displacement transmitting part 211, the thin part 217a, and the fixed part 215a.

  A drive voltage V is applied between the end of the SMA on the displacement transmission unit 211 side and the end on the fixed unit 215a side via the switch SW. By applying the drive voltage V, the SMA 221a is applied. Generates heat due to its own Joule heat, and contracts in the direction of arrow Y in the figure due to an increase in Young's modulus. Due to the contraction of the SMA 211a in the Y direction and the spring property of the thin portion 217a, the displacement transmitting portion 211 is displaced in the direction of the arrow Z in the figure.

  When the switch SW is turned off, the SMA 221a is dissipated to reduce the Young's modulus, and the displacement transmitting portion 211 returns to the original position due to the spring property of the thin portion 217a. The amount of movement of the displacement transmission unit 211 can be controlled by the magnitude of the drive voltage V.

  Similar to FIG. 4A, the SMA 221a has a displacement transmitting portion 211, a thin portion 217a, and a fixed portion to prevent the thin portion 217a from being deformed when the load is applied to the displacement transmitting portion 211 to reduce the displacement. It is provided across the part 215a.

  Next, a method for forming the moving mechanism 200 described above will be described with reference to FIGS. FIG. 5 is a process diagram showing an example of a method of forming the moving mechanism 200, and FIGS. 6 and 7 are schematic views showing the respective processes of FIG. Here, an example in which the piezoelectric element of FIG. 4A is used as the driving element 221a is shown, but the same applies to SMA. Further, although the formation of the A-A ′ cross-section portion of FIG. 2 will be described here, the entire moving mechanism 200 shown in FIG. 2 is actually formed at the same time.

In FIG. 5, the base SOI substrate 230 is made of a silicon oxide film (SiO ₂ ) between a spring layer 231 made of silicon (Si) and a rigid layer 235 as shown in FIG. A three-layer structure having an insulating layer 233 is employed.

  In step S11 (first electrode formation step) in FIG. 5, as shown in FIG. 6B, the first electrode 223 made of, for example, a silver alloy or the like is formed on the spring layer 231 by sputtering. At this time, the 1st electrode 223 is formed so that the displacement transmission part 211, the thin part 217a, and the fixing | fixed part 215a which are formed later may be straddled. The first electrode 223 is also formed with a contact 223a for applying a driving voltage.

  In step S13 (piezoelectric layer forming step) in FIG. 5, as shown in FIG. 6C, a piezoelectric layer 225 made of, for example, lead zirconate titanate (PZT) or the like is formed on the first electrode 223 by sputtering. Is done. At this time, the piezoelectric layer 225 is formed so as to straddle the displacement transmitting portion 211, the thin portion 217a, and the fixed portion 215a to be formed later.

  In step S15 (second electrode formation step) in FIG. 5, as shown in FIG. 6D, a second electrode 227 made of, for example, a silver alloy is formed on the piezoelectric layer 225 by sputtering. At this time, the 2nd electrode 227 is formed so that the displacement transmission part 211, the thin part 217a, and the fixing | fixed part 215a which are formed later may be straddled. This completes the formation of the piezoelectric element 221a as the drive element.

  In step S17 (rigid layer etching step) in FIG. 5, as shown in FIG. 7A, the portion RL of the rigid layer 235 of the SOI substrate 230 other than the portions to be the displacement transmitting portion 211 and the fixing portion 215a is photoetched. Removed by technology. Similarly, the portion RL of the rigid layer 235 other than the displacement transmitting portion 251, the fixed portions 215 b, 255 a, 255 b, and the moving portion 201 is also removed by the photoetching technique.

In step S19 (SiO ₂ layer etching step) in FIG. 5, as shown in FIG. 7B, the portion SL of the insulating layer 233 of the SOI substrate 230 other than the portions to be the displacement transmitting portion 211 and the fixing portion 215a is hooked. The thin portion 217a is formed by etching with acid. Similarly, the portion SL of the insulating layer 233 other than the displacement transmitting portion 251, the fixing portions 215b, 255a, 255b and the moving portion 201 is also removed by etching with hydrofluoric acid, and the thin portions 217b, 257a, 257b, connection portions 203 and 205 are formed.

  In step S21 (spring-like layer etching step) in FIG. 5, portions other than the portion for forming the moving mechanism 200 of the spring-like layer 231 of the SOI substrate 230 are removed by the same photoetching technique as in step S17. Each part is formed.

  In step S23 (piezoelectric element polarization processing step) in FIG. 5, as shown in FIG. 7C, the piezoelectric element 221a is subjected to polarization processing in the direction of the electric field during driving (in the direction of arrow P in the figure). Thereby, the piezoelectric element 221a functions as an actuator.

  When SMA is used as the drive element 221a, for example, electrodes at both ends of the SMA are formed by sputtering using, for example, a silver alloy in step S11, and an SMA layer is formed by sputtering using, for example, a NiTi alloy in step S13. Step S15 is not necessary. The subsequent steps are the same as described above.

  As described above, the SOI substrate is etched to integrate the moving unit 201, the connecting units 203 and 205, the displacement transmitting units 211 and 251, the thin portions 217a, 217b, 257a, and 257b, and the fixing units 215a, 215b, 255a, and 255b. By forming the driving element 221a by sputtering, not only the number of parts of the moving mechanism 200 can be reduced, but also the dimensional accuracy of each part constituting the moving mechanism 200 is improved, and the performance of the moving mechanism is improved. can do.

  As described above, according to the present invention, the moving part for mounting the moved part is connected to the displacement transmitting part, the thin part and the fixed part, and the displacement transmitting part, the thin part and the fixed part via the connection part. Compact digital camera that can solve the problems required for miniaturization of the actuator and can improve the performance of the moving function by driving with the drive unit composed of drive elements arranged across the unit In addition, it is possible to provide a small and highly functional moving mechanism, an imaging unit, and an imaging apparatus suitable for a camera module for a mobile phone with a camera.

  It should be noted that the detailed configuration and detailed operation of each component constituting the moving mechanism, the imaging unit, and the imaging apparatus according to the present invention can be changed as appropriate without departing from the spirit of the present invention.

It is a mimetic diagram showing an example of composition of an embodiment of an imaging device and an imaging unit in the present invention. It is a schematic diagram which shows one example of embodiment of a moving mechanism. It is a schematic diagram for demonstrating that a moving part and an image pick-up element are translated in an optical axis direction. It is a schematic diagram which shows the specific example of a drive element. It is process drawing which shows an example of the formation method of a moving mechanism. It is a schematic diagram which shows process S11 to S15 of FIG. It is a schematic diagram which shows process S17 to S23 of FIG.

Explanation of symbols

1 Camera (imaging device)
DESCRIPTION OF SYMBOLS 10 Image pick-up unit 11 Image pick-up element package 13 Case 15 Lead frame 17 Cover glass 20 Imaging optical system 21 Optical axis 100 Image pick-up element 200 Moving mechanism 201 Moving part 203 Connecting part 205 Connecting part 210 First drive part 211 Displacement transmitting part 213a Displacement Part 213b displacement part 215a fixing part 215b fixing part 217a thin part 217b thin part 221a driving element 221b driving element 223 first electrode 223a contact 225 piezoelectric layer 227 second electrode 230 SOI substrate 231 spring layer 233 insulating layer 235 rigid layer 250 first 2 drive part 251 displacement transmission part 253a displacement part 253b displacement part 255a fixed part 255b fixed part 257a thin part 257b thin part 261a drive element 261b drive element 290 base SW switch V drive power Pressure

Claims (9)

A plate-shaped moving part for mounting the moved part;
A driving unit for moving the moving unit;
A connecting portion connecting the moving portion and the driving portion;
The drive unit has a pair of displacement units,
Each of the pair of displacement parts has a fixed part at one end and a displacement transmission part at the other end, and has a thin part connecting the fixed part and the displacement transmission part, and the fixed part, the thin part, and And having a drive element disposed across the displacement transmission section, and each of the displacement transmission sections is integrally coupled,
The connection unit connects the moving unit and the displacement transmission unit coupled together. The moving part is rectangular;
The displacement transmission part of each of the two sets of the drive parts is connected to two opposing sides of the moving part by the two sets of connection parts,
Each of the two sets of the driving parts has a U-shape surrounding three sides of the moving part,
The displacement transmission part is a middle side of a U-shape,
The displacement part is both sides of a U-shape,
The moving mechanism according to claim 1, wherein the moving portion, the connecting portion, the displacement transmitting portion, the thin portion, and the fixing portion are integrally formed. The moving mechanism according to claim 1, wherein the driving element is a piezoelectric element. The moving mechanism according to claim 1, wherein the driving element is a shape memory alloy. The moving mechanism according to claim 1, wherein the driving element is formed by sputtering. The moving mechanism according to any one of claims 1 to 5, wherein the moving section, the connecting section, and the driving section are configured by an SOI (Silicon on Insulator) substrate. The moving mechanism according to claim 1, wherein the connection portion and the thin portion are formed in the same layer of an SOI substrate. A moving mechanism according to any one of claims 1 to 7,
An image sensor as a driven part mounted on a moving part of the moving mechanism;
An image pickup device package enclosing the moving mechanism and the image pickup device;
An imaging unit, wherein the imaging device is moved by the moving mechanism. The imaging unit according to claim 8,
An imaging optical system that forms a subject image on the imaging surface of the imaging element;
An image pickup apparatus, wherein the image pickup device is moved in an optical axis direction of the image pickup optical system by the moving mechanism.

Images