JP2009087615A - Manufacturing method of conductive material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive material which is suitable for adhesive performance between an image and a functional layer, and has a metal pattern suitable for adhesive performance between a support and the image. <P>SOLUTION: In the manufacturing method for the conductive material wherein a conductive material precursor having at least a physical developing core layer and a silver halide emulsion layer on the support in this order is exposed in an image shape, and then, metal silver is deposited by developing treatment, the conductive material precursor has an under-coated layer including no protein between the support and the physical developing core layer, and enzyme treatment is applied after the developing treatment. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for producing a conductive material that can be used in applications such as an electric circuit, an antenna circuit, an electromagnetic shielding material, and a touch panel.

  In recent years, electronic devices such as printed circuit boards have been required to have higher density and higher definition as electronic devices are strongly required to be downsized.

  Examples of methods for manufacturing electrical circuits include: 1) applying an insulating substrate coated with a conductive material such as copper, gold, ITO, tin oxide, 2) applying a photoresist agent such as a photosensitive resin, 3) desired 4) Curing the photoresist agent by applying UV mask etc. 5) After removing the uncured part, 6) Remove the unnecessary copper foil part by chemical etching etc. A forming method (subtractive method) is known. In this method, the process is complicated, and it is difficult to draw a high-definition image line because it has a metal etching process.

  As a method of drawing a high-definition image line, 1) electroless plating catalyst is applied to an insulating substrate, 2) a photoresist agent is applied, exposed and developed, and 3) electroless plating is performed to form a conductive pattern. 4) A method of removing the plating resist (full additive method), or 1) An electroless plating catalyst is applied to the insulating substrate, electroless plating is applied, and 2) a photoresist agent is applied, exposed and developed. 3) A method (semi-additive method) in which electrolytic plating is performed to form a conductive pattern and 4) a plating resist or the like is peeled is also known. However, these methods have complicated steps, and the subtractive method also has a problem that all of the used photoresist agent must be finally discarded.

  As a method of manufacturing an electric circuit by a simple process, a method of forming an electric circuit by printing a metal paste on a substrate by a screen printing method, an ink jet printing method, or the like and sintering it is known. However, it has been difficult to draw high-definition lines of 50 μm or less by screen printing or ink jet printing. Furthermore, in the case of screen printing, when a high-definition image line is to be drawn continuously, a high-definition wrinkle must be used. However, there is a problem that the wrinkle is easily clogged. In the case of the inkjet method, there is a problem that the inkjet nozzle is always clogged not only when an electric circuit is manufactured, but also when an ink composition containing a solid content is printed, including a consumer inkjet printer. . Therefore, when an electric circuit is manufactured using a printing method, there is a problem in its stability.

  In view of easily and stably producing a uniform and high-definition pattern, a method using a silver salt photographic light-sensitive material having a silver halide emulsion layer as a conductive material precursor has been proposed in recent years. For example, in WO 01/51276 pamphlet and JP-A 2004-221564, a silver salt photographic photosensitive material is subjected to 1) image exposure and development treatment, and 2) a method for producing a conductive material by performing metal plating treatment. Proposals have been made. Similarly, a method using a silver salt diffusion transfer method has been proposed as a method using a silver salt photosensitive material, for example, Japanese Patent Application Laid-Open No. 2003-77350 (Patent Document 1). Since the conductive materials obtained by these methods use silver salt photography, it is easy to draw high-definition lines, high stability, simple processes, and very good characteristics. Show.

  When using a conductive material as an electromagnetic shielding film for a plasma display panel, for example, it is attached to the front surface of the plasma display panel together with a functional film having performances such as antireflection, antiglare, hard coat, and ultraviolet absorption. Installed as a filter. For example, the ultraviolet absorbing film is used to prevent deterioration of the transparent film and other materials due to ultraviolet rays. The UV absorbing film is formed by dispersing an organic UV absorber such as benzotriazole or benzophenone in a dispersing agent or dissolving it in a suitable solvent on the transparent film, and forming an UV absorbing layer on the transparent film. Can be obtained. Furthermore, the plasma display panel filter is required to be as thin as possible from the viewpoint of improving the image quality and reducing the weight. Therefore, for the purpose of reducing the number of plastic films, it is required to directly coat a functional layer such as an ultraviolet absorbing layer on the electromagnetic wave shielding film without using the functional film as described above. Yes.

  However, in the conductive material produced by subjecting the above-mentioned silver salt photographic light-sensitive material to image exposure and development and then metal plating, the surface of the conductive material from which a water-soluble polymer such as gelatin was obtained was obtained. There were cases where it remained. For this reason, the surface of the conductive material obtained by this method has a problem that the affinity with a substance having low polarity is very low and the adhesion with the substance having low polarity is weak. In the conductive material manufactured using the silver salt diffusion transfer method of Patent Document 1 described above, the hydrophilic colloid layer containing a water-soluble polymer such as a silver halide emulsion layer constituting the conductive material precursor is Since it is removed at the time of development, the above-mentioned adhesion problem is less than that of the conductive material precursor that does not use the silver salt diffusion transfer method, but the adhesion to the functional layer coated on the conductive material In some cases, the image itself may peel off even with a slight force.

  In a conductive material produced by using a silver salt diffusion transfer method, Japanese Patent Application Laid-Open No. 2005-250169 (Patent Document 2) discloses a physical development nucleus layer, a support, and a physical development nucleus layer for the purpose of increasing conductivity. A method is disclosed in which gelatin is not contained in the undercoat layer. However, even with the conductive material thus obtained, the adhesion with the functional layer as described above was not sufficiently satisfactory.

On the other hand, the ratio of the binder (gelatin) to the silver of the conductive material is not a technique using the silver salt diffusion transfer method, but the conductive material precursor obtained by the chemical development method is enzymatically treated under certain conditions. Japanese Patent Laid-Open No. 2007-12404 (Patent Document 3) discloses a technique for enzymatically treating a conductive material precursor having a silver halide emulsion layer for the purpose of lowering the relative resistance and increasing the conductivity. The adhesion with the functional layer was not satisfactory. Japanese Patent Application Laid-Open No. 2007-127946 (Patent Document 4) describes that a development treatment may be performed using a silver salt diffusion transfer method or a curing development method, and an enzyme treatment may be performed before the metal plating treatment. However, the adhesion with the functional layer as described above was not sufficiently satisfactory.
Japanese Patent Laying-Open No. 2003-77350 (first page) Japanese Patent Laying-Open No. 2005-250169 (first page) JP 2007-12404 A (first page) JP 2007-127946 A (page 11)

  Accordingly, an object of the present invention is to provide a method for producing a conductive material having a metal pattern having good adhesion between an image and a functional layer and having good adhesion between a support and an image. There is to do.

The above object of the present invention has been achieved by the following invention.
In the method for producing a conductive material, a conductive material precursor having at least a physical development nucleus layer and a silver halide emulsion layer in this order on a support is imagewise exposed, and then metallic silver is precipitated by development processing. A method for producing a conductive material, wherein the conductive material precursor has a subbing layer containing substantially no protein between the support and the physical development nucleus layer, and is subjected to an enzyme treatment after the development treatment.

  According to the present invention, it is possible to provide a method for producing a conductive material that has a metal pattern that has good adhesion to a functional layer and that has good adhesion to a support.

  The conductive material precursor used in the present invention has at least a physical development nucleus layer and a silver halide emulsion layer in this order on a support. Further, in the present invention, a layer that is in contact with the physical development nucleus layer and is provided closer to the support than the physical development nucleus layer is called an undercoat layer, and the conductive material precursor of the present invention is at least one undercoat layer. Has a layer. The conductive material precursor of the present invention can be provided with a backing layer on the side opposite to the side having the silver halide emulsion layer of the support, if necessary. A light-insensitive layer can be provided between the physical development nuclei layer or on the silver halide emulsion layer. Furthermore, in the conductive material precursor of the present invention, an antistatic layer or the like can be provided between the backing layer and the support, if necessary.

  Examples of the support for the conductive material precursor used in the present invention include polyester resins such as polyethylene terephthalate, diacetate resins, triacetate resins, acrylic resins, polycarbonate resins, polyvinyl chloride, polyimide resins, cellophane, and celluloid. A film, a glass plate, etc. are mentioned.

  In the conductive material precursor used in the present invention, the undercoat layer can have one layer or a plurality of layers. In the present invention, the undercoat layer is substantially free of protein. Here, “substantially free of protein” means that the protein content is 10% by mass or less, preferably 6% by mass or less, based on the total solid content of the undercoat layer. By not containing protein substantially, even if the enzyme process after silver image formation mentioned later is implemented, the adhesive force of a support body and a silver image does not deteriorate.

  The undercoat layer of the conductive material precursor used in the present invention is a layer containing substantially no protein and a polymer compound capable of forming a water-swellable film such as a polymer latex or a water-soluble polymer.

  The polymer latex and the water-soluble polymer that can be used for the undercoat layer are not particularly limited. For example, various known latexes such as a homopolymer and a copolymer can be used as the polymer latex. Examples of the homopolymer include vinyl acetate, vinyl chloride, styrene, methyl acrylate, butyl acrylate, methacrylonitrile, butadiene, and isoprene polymer. Examples of the copolymer include ethylene / butadiene copolymer and styrene / butadiene copolymer. Polymer, styrene / p-methoxystyrene copolymer, styrene / vinyl acetate copolymer, vinyl acetate / vinyl chloride copolymer, vinyl acetate / diethyl maleate copolymer, methyl methacrylate / acrylonitrile copolymer, methyl methacrylate・ Butadiene copolymer, methyl methacrylate / styrene copolymer, methyl methacrylate / vinyl acetate copolymer, methyl methacrylate / vinylidene chloride copolymer, methyl acrylate / acrylonitrile copolymer, methyl acrylate / Tadiene copolymer, methyl acrylate / styrene copolymer, methyl acrylate / vinyl acetate copolymer, acrylic acid / butyl acrylate copolymer, methyl acrylate / vinyl chloride copolymer, butyl acrylate / styrene copolymer, polyether Urethane, polyester urethane, polycarbonate urethane and the like. Examples of the water-soluble polymer include polyethyleneimine, polyvinyl alcohol, polyvinyl pyrrolidone, polyacrylic acid, nitrocellulose, and a mixture thereof.

  Among these, a particularly preferred form of the undercoat layer in the present invention is shown. Hereinafter, a particularly preferred form of the undercoat layer is referred to as an undercoat layer A. The undercoat layer A is provided at a position in contact with the physical development nucleus layer. The undercoat layer A contains a polymer latex of 60% by mass or more based on the total solid content of the undercoat layer and contains a water-soluble polymer having a primary or secondary amino group.

  As the water-soluble polymer having a primary or secondary amino group used in the undercoat layer A, any one having these groups can be used. Examples of the water-soluble polymer having a primary amino group or a secondary amino group include the following water-soluble polymers. Mucopolysaccharides such as hyaluronic acid, “polymer reaction of macromolecules” (Nobu Okawara, 1972, Chemical Dojinsha), chapter 2.6.4 aminated cellulose, polyethyleneimine, amino group and ethylenically unsaturated double bond Homopolymers obtained by polymerizing monomers having a single monomer, copolymers obtained by copolymerizing plural types of monomers having amino groups and ethylenically unsaturated double bonds, for example, primary or secondary amino acids such as vinyl acetate and vinylpyrrolidone Examples thereof include a copolymer obtained by copolymerizing another monomer having no group with a monomer having an amino group and an ethylenically unsaturated double bond. Examples of the homopolymer include, for example, a copolymer formed by copolymerizing a plurality of monomers having an amino group and an ethylenically unsaturated double bond, such as polyvinylamine, polyallylamine, polydiallylamine, and poly-4-aminostyrene. As a copolymer formed by copolymerizing a monomer having no amino group and an ethylenically unsaturated double bond and a monomer having an amino group and an ethylenically unsaturated double bond, such as a copolymer of allylamine and diallylamine Examples thereof include a copolymer of diallylamine and maleic anhydride, a copolymer of diallylamine and sulfur dioxide, and the like. In the case of using a copolymer obtained by copolymerizing another monomer having no primary or secondary amino group and a monomer having an amino group and an ethylenically unsaturated double bond in the undercoat layer A, an amino group And a copolymer having a ratio of the monomer having an ethylenically unsaturated double bond of at least 2% by mass or more, preferably 10% by mass or more. Examples of the water-soluble polymer preferably used for the undercoat layer A include polyethyleneimine.

  The water-soluble polymer having a primary or secondary amino group contained in the undercoat layer A may be a single type or a mixture of a plurality of types. Further, a known water-soluble polymer having no primary or secondary amino group, for example, polyvinyl alcohol, polyvinyl pyrrolidone, polyacrylic acid or the like is used in combination with a water-soluble polymer having a primary or secondary amino group. However, the content of the water-soluble polymer having a primary or secondary amino group is 30% by mass or less, preferably 20% by mass or less.

  As the polymer latex used for the undercoat layer A, various known latexes as described above can be used. Among them, urethane latex, and further, polycarbonate-type urethane latex or polyether-type urethane latex have high conductivity and undercoat layer. It is preferable at the point which can obtain the strong adhesive force of a metal pattern.

  Urethane is synthesized from polyol and polyisocyanate, and examples of the polyol used therefor include polyether polyol, polyester polyol, polycarbonate polyol, and acrylic polyol. In the undercoat layer A, the polyether-based urethane means a material using a polyether as a polyol, the polyester-based urethane means a material using a polyester as a polyol, and the polycarbonate-based urethane means a material using a polycarbonate as a polyol. The polycarbonate polyol can be obtained, for example, by reacting a carbonate and a diol. Examples of the carbonate ester include ethylene carbonate, dimethyl carbonate, diethyl carbonate, diphenyl carbonate, dicyclohexyl carbonate and the like. Examples of the diol include 1,6-hexanediol, 1,4-cyclohexanediol, 1,4- Examples include cyclohexanedimethanol, 3-methyl-1,5-pentanediol, polyethylene glycol, polypropylene glycol, polycaprolactone diol, 1,4-butanediol, and bisphenol A. Moreover, the polyester polycarbonate obtained by reaction with polycarbonate diol, dicarboxylic acid, or polyester may be sufficient.

  Examples of polyether polyols include aliphatic polyether polyols and aromatic ring-containing polyether polyols. Aliphatic polyether polyols include aliphatic low molecular weight active hydrogen atom-containing compounds (divalent to octavalent or higher aliphatic polyhydric alcohols having a hydroxyl group equivalent of 30 to less than 150, and primary as active hydrogen atom-containing groups. Alternatively, an alkylene oxide (hereinafter abbreviated as AO) adduct of a compound containing a secondary amino group can be used. The aliphatic polyhydric alcohol to which AO is added includes a linear or branched aliphatic dihydric alcohol [(di) ethylene glycol, (di) propylene glycol, 1,2-, 1,3-, 2,3- And 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, 2-methyl-1,8-octanediol, 1,9-nonanediol, and 1, 12-dodecanediol and the like] and alicyclic dihydric alcohols [low molecular diols having a cyclic group, such as those described in JP-B No. 45-1474], aliphatic trihydric alcohols [glycerin, trimethylolpropane, trialkanolamines] Etc.], and aliphatic tetravalent or higher alcohol [pentaerythritol, diglycerin, triglycerin, dipen Erythritol, sorbitol, sorbitan, and the like is sorbide, etc.]. Examples of the compound containing a primary or secondary amino group to which AO is added include alkyl (1 to 12 carbon atoms) amine, and (poly) alkylene polyamine (2 to 6 carbon atoms of an alkylene group, 1 number of alkylene groups). -4, the number of amines 2-5) and the like. As the aromatic ring-containing polyether polyol, an AO adduct of an aromatic low-molecular-weight active hydrogen atom-containing compound (dihydric to octavalent or higher, phenols and aromatic amines having a hydroxyl group equivalent of 30 to less than 150) is used. it can. Examples of phenols to which AO is added include hydroquinone, catechol, resorcin, bisphenol A, bisphenol S, and bisphenol F, and examples of aromatic amines include aniline and phenylenediamine. As AO used for manufacture of an AO adduct, C2-C12 or more AO, for example, ethylene oxide (hereinafter abbreviated as EO), propylene oxide (hereinafter abbreviated as PO), 1,2-, 2, Examples include 3- and 1,3-butylene oxide, tetrahydrofuran (THF), α-olefin oxide, styrene oxide, epihalohydrin (such as epichlorohydrin), and combinations of two or more of these (random and / or block). Examples of the aliphatic polyether polyol include polyoxyethylene polyol [polyethylene glycol and the like], polyoxypropylene polyol [polypropylene glycol and the like], polyoxyethylene / propylene polyol, polytetramethylene ether glycol and the like. Examples of the aromatic ring-containing polyether polyol include polyols having a bisphenol skeleton, for example, EO addition products of bisphenol A [EO 2 mol addition product of bisphenol A, EO 4 mol addition product of bisphenol A, EO 6 mol addition product of bisphenol A, bisphenol A EO 8 mol adduct, bisphenol A EO 10 mol adduct, bisphenol A EO 20 mol adduct, etc.] and bisphenol A PO adduct [bisphenol A PO 2 mol adduct, bisphenol A PO 3 mol adduct, bisphenol A PO5 mole adducts, etc.], and resorcin EO or PO adducts.

  Examples of the polyisocyanate used as a raw material for the polycarbonate urethane latex and the polyether urethane latex preferably used for the undercoat layer A include aromatic polyisocyanates and aliphatic / alicyclic polyisocyanates. It is preferable to use aliphatic / alicyclic polyisocyanates such as methylene diisocyanate and isophorone diisocyanate.

  The average particle size of the polymer latex used for the undercoat layer A is preferably 0.01 to 0.3 μm, more preferably 0.02 μm or more and less than 0.1 μm. Moreover, it is preferable that the glass transition temperature is 40 degrees C or less. These polymer latexes may be used singly or as a mixture of a plurality of types of polymer latex, but the ratio of polycarbonate urethane and polyether urethane, which are particularly preferred polymer latexes, is 50 mass of the solid content of the total polymer latex. % Or more, preferably 70% by mass or more.

  The solid content of the polymer latex in the undercoat layer A is 60% by mass or more, preferably 70 to 97% by mass, based on the total solid content of the undercoat layer. The water-soluble polymer having a primary or secondary amino group is contained in an amount of 1 to 60% by mass, preferably 3 to 30% by mass, based on the polymer latex.

Preferably 0.01-5 g / m ² as a solid content coating amount of the undercoat layer, more preferably from 0.1 to 1.0 g / m ^2.

  The undercoat layer is desirably crosslinked with a crosslinking agent. Particularly preferred crosslinking agents include inorganic compounds such as chromium alum, aldehydes such as formaldehyde, glyoxal, malealdehyde and glutaraldehyde, N-methylol compounds such as urea and ethylene urea, mucochloric acid, 2,3- Aldehyde equivalents such as dihydroxy-1,4-dioxane, compounds having active halogen such as 2,4-dichloro-6-hydroxy-s-triazine salt and 2,4-dihydroxy-6-chloro-triazine salt , Divinyl sulfone, divinyl ketone, N, N, N-triacryloyl hexahydrotriazine, compounds having two or more active three-membered ethyleneimino groups, compounds having two or more epoxy groups in the molecule, such as Sorbitol polyglycidyl ether and polyglycerol poly Isocyanic compounds such as lysidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, hexamethylene diisocyanate, tetramethylene diisocyanate, etc. (Nobuo Okawara 1972, Chemical Dojinsha Co., Ltd.) 2, 6, 7 chapters, 5 chapters 2 chapters, 9 chapter 3 chapters and the like can also contain known polymer crosslinking agents.

  The addition amount of the crosslinking agent in the undercoat layer is preferably 1 to 10% by mass, more preferably 3 to 7% by mass, based on the total amount of the polymer latex and the water-soluble polymer in the undercoat layer in contact with the physical development nucleus layer. Is preferred.

  The subbing layer contains known photographic additives as described in Research Disclosure Item 17643 (December 1978) and 18716 (November 1979) and 308119 (December 1989) as necessary. It can also be made.

  In the conductive material precursor of the present invention, when a plurality of undercoat layers are provided, another undercoat layer is provided between the undercoat layer and the support. In this case, the polymer latex and water-soluble polymer that can be used for the undercoat layer on the support side are not particularly limited, but protein is not substantially contained as described above.

In the conductive material precursor used in the present invention, fine particles (having a particle size of about 1 to several tens of nm) made of heavy metals or sulfides thereof are used as the physical development nuclei. Examples thereof include colloids such as gold and silver, metal sulfides obtained by mixing water-soluble salts such as palladium and zinc and sulfides, and the like. The fine particle layer of these physical development nuclei can be provided on the support on which the undercoat layer is formed by a coating method or an immersion treatment method. From the viewpoint of production efficiency, a coating method is preferably used. The content of physical development nuclei in the physical development nuclei layer is suitably about 0.1 to 10 mg per m ^{2 in} terms of solid content.

  The physical development nucleus layer used in the present invention may contain a water-soluble polymer. When the water-soluble polymer is used, the addition amount is preferably about 0 to 500% by mass with respect to the physical development nucleus. As the water-soluble polymer, gum arabic, cellulose, sodium alginate, polyvinyl alcohol, polyvinyl pyrrolidone, polyacrylamide, a copolymer of acrylamide and vinyl imidazole, and the like can be used.

  The physical development nucleus layer used in the present invention can also contain a crosslinking agent. Examples of the crosslinking agent include inorganic compounds such as chromium alum, aldehydes such as formaldehyde, glyoxal, malealdehyde, and glutaraldehyde, N-methylol compounds such as urea and ethylene urea, mucochloric acid, and 2,3-dihydroxy. Aldehydes such as -1,4-dioxane, 2,4-dichloro-6-hydroxy-s-triazine salts, compounds having active halogen such as 2,4-dihydroxy-6-chloro-triazine salts, divinyl Sulfone, divinyl ketone, N, N, N-triacryloyl hexahydrotriazine, compounds having two or more active three-membered ethyleneimino groups or epoxy groups in the molecule, dialdehyde as a polymer hardener One or more of various compounds such as starch can be used. Among these crosslinking agents, dialdehydes such as glyoxal, glutaraldehyde, 3-methylglutaraldehyde, succinaldehyde, and adipaldehyde are preferable, and glutaraldehyde is more preferable. The crosslinking agent is preferably contained in the physical development nucleus layer in an amount of 0.1 to 30% by mass, particularly preferably 1 to 20% by mass, based on the water-soluble polymer contained in the physical development nucleus layer.

  The physical development nucleus layer and the undercoat layer can be applied by a coating method such as dip coating, slide coating, curtain coating, bar coating, air knife coating, roll coating, gravure coating, spray coating, and the like.

  In the conductive material precursor used in the present invention, a silver halide emulsion layer is provided as an optical sensor. Techniques used for silver halide photographic films, photographic papers, printing plate-making films, photomask emulsion masks, and the like relating to silver halides can be used as they are.

  The formation of silver halide emulsion grains used in the silver halide emulsion layer is performed by Research Disclosure Item 17643 (December 1978) and 18716 (November 1979), 308119 (forward mixing, reverse mixing, simultaneous mixing, etc.). (December 1989) can be used. Among them, it is preferable to use a so-called controlled double jet method, which is one of the simultaneous mixing methods and keeps the pAg in the liquid phase to be formed constant, from the viewpoint of obtaining silver halide emulsion grains having a uniform particle size. . In the conductive material precursor of the present invention, the preferred silver halide emulsion grains have an average grain size of 0.25 μm or less, particularly preferably 0.05 to 0.2 μm. There is a preferable range for the halide composition of the silver halide emulsion used in the present invention, and it is preferable that the chloride is contained in an amount of 80 mol% or more, particularly 90 mol% or more is the chloride.

  In the production of silver halide emulsions, group VIII such as sulfite, lead salt, thallium salt, rhodium salt or complex thereof, iridium salt or complex thereof, in the process of forming silver halide grains or physical ripening as necessary A metal element salt or a complex salt thereof may coexist. Further, it can be sensitized by various chemical sensitizers, and methods commonly used in the art such as sulfur sensitization method, selenium sensitization method and noble metal sensitization method can be used alone or in combination. In the conductive material precursor of the present invention, the silver halide emulsion can be dye-sensitized as necessary.

  The ratio of the amount of silver halide and the amount of gelatin contained in the silver halide emulsion layer is such that the mass ratio of silver halide (silver equivalent) to gelatin (silver / gelatin) is 1.2 or more, more preferably 1. 5 or more.

  In the silver halide emulsion layer, known photographic additives can be used for various purposes. These are described in Research Disclosure Item 17643 (December 1978) and 18716 (November 1979), 308119 (December 1989) or cited.

  As described above, the conductive material precursor of the present invention can be provided with a non-photosensitive layer between the silver halide emulsion layer and the physical development nucleus layer or on the silver halide emulsion layer. These non-photosensitive layers are layers having a water-soluble polymer as a main binder. As the water-soluble polymer mentioned here, any polymer can be selected as long as it easily swells with a developing solution and allows the developing solution to easily penetrate into the underlying silver halide emulsion layer and physical development nucleus layer.

  Specifically, gelatin, albumin, casein, polyvinyl alcohol, or the like can be used. Particularly preferred water-soluble polymers are proteins such as gelatin, albumin and casein. In order to sufficiently obtain the effects of the present invention, the amount of the binder in the non-photosensitive layer is preferably in the range of 20 to 100% by mass, particularly 30 to 80% by mass, based on the total amount of binder in the silver halide emulsion layer. % Is preferred.

  These non-photosensitive layers may be added to known photographic additives as described in Research Disclosure Item 17643 (December 1978) and 18716 (November 1979), 308119 (December 1989), if necessary. An agent can be included. Further, the film can be hardened with a crosslinking agent as long as the peeling of the silver halide emulsion layer after the treatment is not prevented.

In the conductive material precursor of the present invention, it is preferable to use a non-sensitizing dye or pigment having an absorption maximum in the photosensitive wavelength region of the silver halide emulsion layer as a halation for improving image quality or an irradiation prevention agent. The antihalation agent is preferably provided with the above-described undercoat layer or physical development nucleus layer, or an intermediate layer provided as necessary between the physical development nucleus layer and the silver halide emulsion layer, or a support. It can be contained in the backing layer. The irradiation inhibitor is preferably contained in the silver halide emulsion layer. The amount added may vary widely as long as the desired effect can be obtained. For example, when it is contained in the backing layer as an antihalation agent, it is preferably in the range of about 20 mg to about 1 g per m ² , preferably The absorbance at the maximum absorption wavelength is 0.5 or more.

  In the present invention, a method for producing a conductive material using a conductive material precursor will be described. Examples of the conductive material include a silver thin film having a mesh pattern. In this case, the conductive material precursor is exposed and developed, and then subjected to an enzyme treatment to form a silver thin film having a mesh pattern. Hereinafter, exposure, development processing, and enzyme processing in the present invention will be described in order.

  The exposure of the conductive material precursor in the present invention will be described. The silver halide emulsion layer of the conductive material precursor is exposed to a network pattern. As an exposure method, a method in which the transmission original of the network pattern and the silver halide emulsion layer are closely exposed, or various laser beams are used. For example, there is a scanning exposure method. In the above-described method of exposing with laser light, for example, a blue semiconductor laser (also referred to as a violet laser diode) having an oscillation wavelength of 400 to 430 nm can be used.

  The development processing of the conductive material precursor in the present invention will be described. The silver halide emulsion layer of the conductive material precursor exposed as described above undergoes physical development by processing with a silver salt diffusion transfer developer, and the unexposed silver halide is dissolved to form a silver complex salt. Then, it is reduced on the physical development nuclei, and metallic silver is deposited, so that a silver thin film having a network pattern can be obtained. On the other hand, the exposed portion is chemically developed in the silver halide emulsion layer to become blackened silver. After development, unnecessary silver halide emulsion layers, intermediate layers, protective layers, and the like are removed, and a silver thin film having an unexposed portion shape pattern is exposed on the surface.

  As a method for removing a layer provided on a physical development nucleus layer such as a silver halide emulsion layer after development, there is a method of removing by washing with water or transferring to a release paper. There are two methods for removing the water washing: a method of removing hot water using a scrubbing roller or the like while jetting it with a nozzle or the like, and a method of removing hot water by jetting with a nozzle or the like. In addition, the method of transferring and peeling with a release paper or the like is to squeeze the excess alkali solution (silver complex diffusion transfer developer) on the silver halide emulsion layer in advance with a roller or the like, and remove the silver halide emulsion layer and the release paper. In this method, the silver halide emulsion layer and the like are transferred from a plastic resin film to a release paper and peeled off. As the release paper, water-absorbing paper or non-woven fabric, or paper having a water-absorbing void layer formed of fine pigment such as silica and binder such as polyvinyl alcohol on the paper is used.

  A developing solution for silver salt diffusion transfer development used in the development processing of the conductive material precursor in the present invention will be described. The developer is an alkaline solution containing a soluble silver complex salt forming agent and a reducing agent. The soluble silver complex salt forming agent is a compound that dissolves silver halide to form a soluble silver complex salt, and the reducing agent is a compound for reducing the soluble silver complex salt to deposit metallic silver on the physical development nucleus. .

  Soluble silver complex forming agents used in the developer include thiosulfates such as sodium thiosulfate and ammonium thiosulfate, thiocyanates such as sodium thiocyanate and ammonium thiocyanate, and sulfites such as sodium sulfite and potassium bisulfite. Salts, oxazolidones, 2-mercaptobenzoic acid and derivatives thereof, cyclic imides such as uracil, alkanolamines, diamines, mesoionic compounds described in JP-A-9-171257, US Pat. No. 5,200,294 Thioethers, 5,5-dialkylhydantoins, alkylsulfones, and others described in the specification, “The Theory of the Photographic Process (4th edition, p474-475)”, T. et al. H. Examples include compounds described in James.

  Among these soluble silver complex salt forming agents, alkanolamine is particularly preferable. A relatively low value is obtained for the surface resistance of the conductive film developed with the processing solution containing alkanolamine.

  Examples of the alkanolamine include N- (2-aminoethyl) ethanolamine, diethanolamine, N-methylethanolamine, triethanolamine, N-ethyldiethanolamine, diisopropanolamine, ethanolamine, 4-aminobutanol, N, N- Examples include dimethylethanolamine, 3-amino-1-propanol, and 2-amino-2-methyl-1-propanol.

  These soluble silver complex salt forming agents can be used alone or in combination.

  The reducing agent used in the developer is a development known in the field of photographic development as described in Research Disclosure Item 17643 (December 1978) and 18716 (November 1979), 308119 (December 1989). The main drug can be used. For example, hydroquinone, catechol, pyrogallol, methylhydroquinone, chlorohydroquinone and other polyhydroxybenzenes, ascorbic acid and its derivatives, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1-phenyl-3-pyrazolidone, 1- Examples include 3-pyrazolidones such as phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone, paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, paraphenylenediamine, and the like. These reducing agents can be used alone or in combination.

  The content of the soluble silver complex salt forming agent is preferably 0.001 to 5 mol, more preferably 0.005 to 1 mol, per liter of the developer. The content of the reducing agent is preferably from 0.01 to 1 mol, more preferably from 0.05 to 1 mol, per liter of the developer.

  The pH of the developer is preferably 10 or more, and more preferably 11-14. In order to adjust to a desired pH, an alkali agent such as sodium hydroxide or potassium hydroxide, or a buffering agent such as phosphoric acid or carbonic acid is contained alone or in combination. The developer of the present invention preferably contains a preservative such as sodium sulfite or potassium sulfite.

  As the enzyme used in the enzyme treatment in the present invention, a proteolytic enzyme capable of acting on a protein such as gelatin constituting a silver halide emulsion layer or the like is used. As the proteolytic enzyme, a known plant or animal enzyme is used. For example, pepsin, rennin, trypsin, chymotrypsin, cathepsin, papain, ficin, thrombin, renin, collagenase, bromelain, bacterial protease (for example, Biolase manufactured by Nagase Sangyo Co., Ltd.) and the like can be mentioned. Of these, trypsin, papain, ficin, and bacterial protease are particularly preferable.

  In the enzyme treatment according to the present invention, the enzyme treatment solution may be used alone or in combination. The enzyme content in the enzyme treatment solution is suitably about 0.5 to 50 g / L. The pH of the enzyme treatment solution varies depending on the enzyme to be used. For example, when alkaline protease is used among bacterial proteases, the optimum pH is 8 to 10, whereas when neutral protease is used, it becomes 6 to 7. Therefore, it is preferable to contain a buffering agent corresponding to the optimum pH of the enzyme in the enzyme treatment solution. In addition, the enzyme treatment solution may contain a surfactant, an antifoaming agent, a fungicide, a chelating agent, a protein or saccharide for maintaining the activity of the enzyme, a thickener, an aggregating agent, and the like. The temperature of the enzyme treatment in the present invention also varies depending on the enzyme, but if the temperature is too high, problems such as evaporation and concentration of the enzyme treatment solution occur in the continuous treatment, so 30 to 45 ° C is preferable. The treatment time is 5 to 180 seconds, preferably 30 to 60 seconds.

  The enzyme treatment in the present invention can be carried out by immersing or coating the conductive material precursor in an enzyme treatment solution. Alternatively, it is possible to use a method of spraying the enzyme treatment liquid by a jet method, or a method of rubbing the conductive material precursor with a scrub roller while spraying the treatment liquid.

  The enzyme treatment in the present invention may be carried out at any time after the aforementioned development treatment. For example, after the development treatment, the layer on the physical development nucleus layer can be washed with water and then subjected to enzyme treatment. Further, after the development treatment, the enzyme treatment can be carried out simultaneously with the enzyme treatment solution while removing the layer on the physical development nucleus layer. Furthermore, an enzyme treatment can be performed after a plating treatment or a post-treatment described later.

  The conductive material after the enzyme treatment in the present invention is washed. The conductive material may be washed only with water, or an enzyme inhibitor such as a heavy metal ion, a chelating agent, or a quaternary amine may be used to wash the enzyme. Or it is also preferable to wash with water at a temperature at which the enzyme is deactivated.

  Plating can be performed for various purposes such as obtaining higher conductivity in the silver image portion of the conductive material formed by the exposure and development processing, or changing the color tone of the silver image. As the plating treatment in the present invention, electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating can be used. The plating treatment may be performed before the enzyme treatment or after the enzyme treatment as long as the layer on the physical development nucleus layer is washed and removed after the development treatment.

  The silver image of the conductive material can be post-processed. Examples of the post-treatment liquid include aqueous solutions of reducing substances, water-soluble phosphorus oxoacid compounds, water-soluble halogen compounds, and the like. 2θ = 38.2 ° by X-ray diffraction of the silver image pattern by treating with such a post-treatment liquid at 50 to 70 ° C., more preferably 60 to 70 ° C. for 10 seconds or more, preferably 30 seconds to 3 minutes. It is preferable that the full width at half maximum is 0.35 or less because very high conductivity can be obtained and the resistance value does not fluctuate even under high temperature and high humidity. The post-treatment may be performed before the enzyme treatment or after the enzyme treatment as long as the layer on the physical development nucleus layer is washed and removed after the development treatment.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but it is needless to say that the present invention is not limited by this description.

  In order to produce the conductive material precursor, a polyethylene terephthalate base having a thickness of 100 μm and an easy adhesion layer mainly composed of vinylidene chloride was used as a transparent support. A coating solution was prepared on this support according to the undercoat formulation of the following composition, applied onto a polyethylene terephthalate base, dried, and then heated at 50 ° C. for 1 day to obtain a base coated with an undercoat layer.

<Under prescription 1/1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by Dainippon Ink & Chemicals, Inc.)
1.6g (solid content 0.56g)
Epomin SP-200 (polyethyleneimine made by Nippon Shokubai Co., Ltd.)
0.2g
Denacol EX614 (Nagase ChemteX sorbitol polyglycidyl ether / crosslinking agent) 5mg
Surfactant (S-1) 3mg

  Next, a palladium sulfide sol solution was prepared as follows, and a physical development nucleus solution was prepared using the obtained sol.

<Preparation of palladium sulfide sol>
Liquid A Palladium chloride 5g
Hydrochloric acid 40mL
Distilled water 1000mL
B liquid sodium sulfide 8.6g
Distilled water 1000mL
Liquid A and liquid B were mixed with stirring, and 30 minutes later, the solution was passed through a column filled with an ion exchange resin to obtain palladium sulfide sol.

<Physical development nuclear solution composition / m ² >
The palladium sulfide sol 0.4mg
0.08 mL of 2% glutaraldehyde solution

  This physical development nucleus layer coating solution was applied onto the undercoat layer of the base coated with the undercoat layer and dried.

Subsequently, a backing layer having the following composition was applied to the surface opposite to the side on which the physical development nucleus layer was applied.
<Backcoat layer composition / per 1 m ² >
2g gelatin
Amorphous silica matting agent (average particle size 5μm) 20mg
Dye 1 200mg
Surfactant (S-1) 400mg

  Subsequently, an intermediate layer, a silver halide emulsion layer, and an outermost layer having the following composition were coated on the physical development nucleus layer in order from the side closer to the support. The silver halide emulsion was prepared by a general double jet mixing method for photographic silver halide emulsions. This silver halide emulsion was prepared with 95 mol% of silver chloride and 5 mol% of silver bromide, and an average grain size of 0.15 μm. The silver halide emulsion thus obtained was subjected to gold sulfur sensitization using sodium thiosulfate and chloroauric acid according to a conventional method. The silver halide emulsion thus obtained contains 0.5 g of gelatin per gram of silver.

<Intermediate layer composition / 1 m ² per>
Gelatin 0.5g
Surfactant (S-1) 5mg

<Silver halide emulsion layer composition / 1m ² per>
Gelatin 0.5g
Silver halide emulsion 3.0g Silver equivalent 1-Phenyl-5-mercaptotetrazole 3.0mg
Surfactant (S-1) 20mg

<Outermost layer composition / per 1 m ² >
1g of gelatin
Amorphous silica matting agent (average particle size 3.5μm) 10mg
Surfactant (S-1) 10mg

  The conductive material precursor thus obtained was brought into close contact with a transparent original having a fine line width of 20 μm and a lattice pattern of 300 μm through a resin filter that cuts light of 400 nm or less with a contact printer using a mercury lamp as a light source. Exposed.

  Thereafter, the previously exposed conductive film precursor was immersed in the following developer at 20 ° C. for 60 seconds, and then the silver halide emulsion layer, intermediate layer, outermost layer and backing layer were washed with warm water at 40 ° C. Removed and dried. A conductive material in which a silver thin film was formed in a mesh pattern was obtained from the exposed sample.

<Diffusion transfer developer composition>
Potassium hydroxide 25g
Hydroquinone 18g
1-phenyl-3-pyrazolidone 2g
Potassium sulfite 80g
N-methylethanolamine 15g
Potassium bromide 1.2g
Bring the total volume to 1000 mL with water.
Adjust to pH = 12.2.

  The obtained conductive material was immersed in the following enzyme treatment solution at 40 ° C. for 30 seconds for enzyme treatment, and then washed with warm water at 40 ° C. for 10 seconds.

<Enzyme treatment liquid formulation>
20g triethanolamine
Phosphoric acid 5g
Biolase AL-15 (neutral protease: proteolytic enzyme, manufactured by Nagase Sangyo Co., Ltd.)
1g
Add water to adjust total volume to 1000 mL. The pH was adjusted to 7.4.

  The following evaluation was carried out on the conductive material on which the mesh-patterned silver thin film obtained as described above was formed.

(1) Surface resistivity Based on JIS-K7194, it measured using the Diastar Co., Ltd. make and a Lorester GP / ESP probe. The results are shown in Table 1.

(2) Nitto Denko polyester pressure-sensitive adhesive tape No. 1 on the surface on which the silver thin film was formed in the mesh pattern of the conductive conductive material adhesive between the support and the image. 31 was affixed to the surface of the metal mesh so that no air bubbles entered, and then the tape was peeled off vigorously to conduct a peel test. The peel test was evaluated visually and evaluated in five stages. A sample that was not peeled at all was marked with ◯, a sample that was completely peeled off was marked with ×, and an intermediate part was divided into three stages. The results are shown in Table 1.

(3) The test was carried out only for samples for which an evaluation of Δ or higher was obtained for the adhesiveness (2) between the functional layer (ultraviolet absorbing layer) and the image. (In (2), a sample of Δ × or less could not confirm the adhesion between the functional layer and the image because the adhesion between the image and the support was insufficient.) Silver in the mesh pattern of the conductive material On the surface on which the thin film was formed, an ultraviolet absorbent (manufactured by Nippon Shokubai Co., Ltd., Hals Hybrid UV-G101) was applied using a # 8 wire bar, dried at 50 ° C. for 2 minutes to remove the solvent, and the thickness was 3 μm. A conductive material having an ultraviolet absorbing layer was obtained. In order to confirm the adhesion between the ultraviolet absorbing layer and the conductive material, 100 square cuts reaching the support through the ultraviolet absorbing layer were removed by using a cutter guide with a gap distance of 2 mm. Put on. Next, a cellophane adhesive tape (manufactured by Nichiban Co., Ltd., No. 405: 24 mm width) is attached to the grid-shaped cut surface and rubbed with an eraser to completely adhere. Thereafter, the cellophane adhesive tape is peeled off vertically from the ultraviolet absorbing layer surface, and the number of squares peeled off from the ultraviolet absorbing layer surface of the conductive material is visually counted. -50 masses were marked as Δ, 51-70 squares as Δx, and 71 cells or more as x. Table 1 shows the results of the surface resistivity, the adhesion between the support and the image, and the adhesion between the functional layer (ultraviolet absorption layer) and the image.

  A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 2. The results are shown in Table 1.

<Under prescription 2 / 1m ² >
Hydran WLS210 1.6g
Epomin SP-200 0.2g
Gelatin 0.03g
Denacol EX614 5mg
Surfactant (S-1) 3mg

  A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 3. The results are shown in Table 1.

<Under prescription 3 / 1m ² >
Hydran WLS210 1.6g
Epomin SP-200 0.2g
Gelatin 0.07g
Denacol EX614 5mg
Surfactant (S-1) 3mg

(Comparative Example 1)
A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 4. The results are shown in Table 1.

<Under prescription 4 / 1m ² >
Hydran WLS210 1.6g
Epomin SP-200 0.2g
Gelatin 0.11g
Denacol EX614 5mg
Surfactant (S-1) 3mg

  A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 5. The results are shown in Table 1.

<Under prescription 5 / 1m ² >
Hydran WLS210 1.6g
PVA235 (Kuraray Co., Ltd. 88% partially saponified PVA, polymerization degree 3500)
0.2g
Deurinate WB40-100 (isocyanate type crosslinking agent manufactured by Asahi Kasei Corporation)
5mg
Surfactant (S-1) 3mg

  A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 6. The results are shown in Table 1.

<Under prescription 6 / 1m ² >
Movinyl 880 (styrene acrylic copolymer made by Nichigo Movinyl)
1.2g (solid content 0.56g)
PVA235 0.2g
Gelatin 0.03g
Deyuranate WB40-100 5mg
Surfactant (S-1) 3mg

  A sample was prepared and evaluated in the same manner as in Example 1 except that the subbing formulation 1 was changed to the following subbing formulation 7. The results are shown in Table 1.

<Under prescription 7 / 1m ² >
Vinizole 1083 (acrylic copolymer manufactured by Daido Kasei Kogyo Co., Ltd.)
3.3 g (solid content 0.56 g)
Gelatin 0.03g
Denacol EX614 5mg
Surfactant (S-1) 3mg

(Comparative Example 2)
A sample was prepared and evaluated in the same manner as in Example 1 except that the enzyme treatment was not performed. The results are shown in Table 1.

  The conductive material after the enzyme treatment is washed with water and subsequently degreased at 60 ° C. for 1 minute with a cleaner 160 (Meltex degreasing solution) diluted to 5% by mass, and then Cu5100 electroless copper plating solution (Meltex Co., Ltd.). The sample was prepared and evaluated in the same manner as in Example 1 except that electroless plating was performed at 50 ° C. for 12 minutes. The results are shown in Table 1.

(Comparative Example 3)
A sample was prepared and evaluated in the same manner as in Example 7 except that the subbing formulation 1 was changed to the subbing formulation 4. The results are shown in Table 1.

  After the development processing, the layer on the physical development nucleus layer is washed away with water, and then degreased at 60 ° C. for 1 minute with a cleaner 160 diluted to 5% by mass (a degreased solution manufactured by Meltex), and then No. Cu5100 electroless copper plating solution A sample was prepared and evaluated in the same manner as in Example 1 except that electroless plating was performed at 50 ° C. for 12 minutes (manufactured by Meltex Co., Ltd.), followed by enzyme treatment and water washing treatment. The results are shown in Table 1.

  The pH was adjusted to 9.0 by reducing the amount of phosphoric acid in the enzyme treatment solution, and the proteolytic enzyme was changed to orientase 22BF (alkaline protease: proteolytic enzyme, manufactured by HIBI), as in Example 1. A sample was prepared and evaluated. The results are shown in Table 1.

  Based on the above results, the present invention is a method for producing a conductive material having a metal pattern having a good adhesion between the image and the functional layer and having a good adhesion between the support and the image. Can understand the effectiveness.

Claims (1)

  In the method for producing a conductive material, a conductive material precursor having at least a physical development nucleus layer and a silver halide emulsion layer in this order on a support is imagewise exposed, and then metallic silver is precipitated by development processing. A method for producing a conductive material, wherein the conductive material precursor has a subbing layer containing substantially no protein between the support and the physical development nucleus layer, and is subjected to an enzyme treatment after the development treatment.