JP2009081345A - Method for manufacturing capacitor - Google Patents

Method for manufacturing capacitor Download PDF

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JP2009081345A
JP2009081345A JP2007250713A JP2007250713A JP2009081345A JP 2009081345 A JP2009081345 A JP 2009081345A JP 2007250713 A JP2007250713 A JP 2007250713A JP 2007250713 A JP2007250713 A JP 2007250713A JP 2009081345 A JP2009081345 A JP 2009081345A
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terminal
anode
capacitor
cathode
anode terminal
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JP5006744B2 (en
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Tetsuhiro Osumi
哲博 大角
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Tokin Corp
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NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a capacitor, which prevents resin from coming into the backside of an anode terminal and a cathode terminal during a coating process in manufacturing a capacitor. <P>SOLUTION: A capacitor is manufactured by a manufacturing method including an arrangement process for arranging a capacitor element having an anode lead wire 62 and a cathode layer 63 in a lead frame 1 having at least an anode terminal 10, a cathode terminal 20, and a connection part 30 that connects the anode terminal 10 and the cathode terminal 20, a connection process for connecting the anode lead wire 62 and the anode terminal 10 and connecting the cathode layer 63 and the cathode terminal 20, a coating process for covering a capacitor element 60 with an insulating material 70, and a cut process for cutting the connection part 30 from the anode terminal 10 and the cathode terminal 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、コンデンサの製造方法に関する。   The present invention relates to a method for manufacturing a capacitor.

コンデンサの製造方法として、リードフレームに形成された陽極端子及び陰極端子の夫々にコンデンサ素子の陽極リード線及び陰極層の夫々を接続した後に、コンデンサ素子を樹脂でモールドする方法が開示されている（例えば、特許文献１乃至特許文献３参照）。   As a method for manufacturing a capacitor, a method is disclosed in which an anode lead wire and a cathode layer of a capacitor element are respectively connected to an anode terminal and a cathode terminal formed on a lead frame, and then the capacitor element is molded with a resin ( For example, see Patent Document 1 to Patent Document 3).

特開２００６−１９０９６５号公報JP 2006-190965 A 特開２００６−２６９８６５号公報JP 2006-269865 A 特開２００７−９６０２１号公報JP 2007-96021 A

上記に開示されている固体電解コンデンサの製造方法では、コンデンサ素子を樹脂で被覆する被覆工程の際に陽極端子の裏側に樹脂が回りこんでしまうという問題があった。   In the manufacturing method of the solid electrolytic capacitor disclosed above, there is a problem that the resin wraps around the back side of the anode terminal during the coating step of coating the capacitor element with the resin.

そこで、本発明は被覆工程の際に陽極端子及び陰極端子の裏側に樹脂が回りこまないようなコンデンサの製造方法を提供することを目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a capacitor in which resin does not flow around the back side of the anode terminal and the cathode terminal during the coating process.

従来、コンデンサ素子の陽極リード線と陽極端子との接続は、例えば、特許文献３の００１４段落に記載されているように抵抗溶接により行われる。この抵抗溶接においては、陽極端子に溶接電極を押し当てた際に陽極端子が変形することがあり、陽極端子が変形してしまった場合には、被覆工程の際にその変形によりできた隙間から樹脂が端子の裏側に回り込むことを見出した。そこで、本発明はこの知見に基づいてなされたものであり、具体的には、上述した課題を解決する手段として以下に掲げるコンデンサの製造方法を提供する。   Conventionally, the connection between the anode lead wire and the anode terminal of the capacitor element is performed by resistance welding as described in paragraph 0014 of Patent Document 3, for example. In this resistance welding, when the welding electrode is pressed against the anode terminal, the anode terminal may be deformed. When the anode terminal is deformed, the gap formed by the deformation during the coating process is deformed. It was found that the resin wraps around the back side of the terminal. Therefore, the present invention has been made on the basis of this finding, and specifically, the following method for manufacturing a capacitor is provided as means for solving the above-described problems.

即ち、本発明によれば、第１のコンデンサ製造方法として、少なくとも陽極端子と、陰極端子と、前記陽極端子及び前記陰極端子を接続する接続部とを有するリードフレーム上に、陽極接続部及び陰極接続部を有するコンデンサ素子を配置する配置工程と、前記陽極接続部及び前記陽極端子を接続し、前記陰極接続部及び前記陰極端子を接続する接続工程と、前記コンデンサ素子を絶縁素材にて被覆する被覆工程と、前記接続部を前記陽極端子及び前記陰極端子から切り離す切断工程とを含むコンデンサの製造方法が得られる。   That is, according to the present invention, as a first method of manufacturing a capacitor, an anode connection portion and a cathode are provided on a lead frame having at least an anode terminal, a cathode terminal, and a connection portion connecting the anode terminal and the cathode terminal. An arrangement step of arranging a capacitor element having a connection portion, a connection step of connecting the anode connection portion and the anode terminal, connecting the cathode connection portion and the cathode terminal, and covering the capacitor element with an insulating material A capacitor manufacturing method including a covering step and a cutting step of separating the connection portion from the anode terminal and the cathode terminal is obtained.

また、本発明によれば、第２のコンデンサの製造方法として、第１のコンデンサの製造方法において、前記接続部は、断面コの字型に形成されている、コンデンサ製造方法が得られる。   Further, according to the present invention, as the second capacitor manufacturing method, in the first capacitor manufacturing method, a capacitor manufacturing method is obtained in which the connection portion is formed in a U-shaped cross section.

また、本発明によれば、第３のコンデンサの製造方法として、第１又は第２のコンデンサの製造方法において、前記リードフレームは、前記陽極端子及び前記陰極端子に接続されたカットオフ部を更に備えており、前記切断工程は、前記カットオフ部を前記陽極端子及び前記陰極端子から切り離す工程を更に含むコンデンサ製造方法が得られる。   According to the present invention, as the third capacitor manufacturing method, in the first or second capacitor manufacturing method, the lead frame further includes a cutoff portion connected to the anode terminal and the cathode terminal. And the cutting step further includes a step of separating the cut-off portion from the anode terminal and the cathode terminal.

また、本発明によれば、第１乃至第３のいずれかのコンデンサの製造方法に用いられるリードフレームが得られる。   In addition, according to the present invention, a lead frame used in any one of the first to third capacitor manufacturing methods can be obtained.

本発明によれば、接続部が設けられたリードフレームを用いることで、被覆工程の際に樹脂がリードフレームの裏側に回りこむことを防ぐことができる。また、陽極端子と陰極端子とが接続部により一体として形成されているため、陽極リード線及び陽極端子に溶接用電極を押し当てて抵抗溶接をする際にも従来技術とくらべて陽極端子が変形しにくい。更に、被覆工程後に接続部を切断除去することにより、従来のコンデンサと同様のコンデンサを製造することができる。   According to the present invention, by using the lead frame provided with the connecting portion, it is possible to prevent the resin from wrapping around the back side of the lead frame during the coating process. In addition, since the anode terminal and the cathode terminal are integrally formed by the connecting portion, the anode terminal is deformed as compared with the conventional technique when resistance welding is performed by pressing the welding electrode against the anode lead wire and the anode terminal. Hard to do. Furthermore, a capacitor similar to a conventional capacitor can be manufactured by cutting and removing the connecting portion after the covering step.

以下、図面を参照しながら本発明の実施の形態について説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１に示されるように、本発明の実施の形態に用いるリードフレーム１上には、陽極端子１０と、陰極端子２０と、陽極端子１０及び陰極端子２０を接続する断面コの字型の接続部３０とで構成されるコンデンサ形成部２が複数形成されている。これら複数のコンデンサ形成部２は、後の工程において切り離されるカットオフ部４０及びカットオフ部４１により、互いに平行となるように支持されている。即ち、リードフレーム１は、陽極端子１０及び陰極端子２０と接続されるカットオフ部４０及びカットオフ部４１を有している。   As shown in FIG. 1, on a lead frame 1 used in the embodiment of the present invention, an anode terminal 10, a cathode terminal 20, and a U-shaped connection that connects the anode terminal 10 and the cathode terminal 20. A plurality of capacitor forming portions 2 configured with the portion 30 are formed. The plurality of capacitor forming portions 2 are supported so as to be parallel to each other by a cut-off portion 40 and a cut-off portion 41 that are separated in a later process. That is, the lead frame 1 has a cut-off part 40 and a cut-off part 41 connected to the anode terminal 10 and the cathode terminal 20.

図２に示されるように、本実施の形態において、陽極端子１０及びカットオフ部４０の境界上及び陰極端子２０及びカットオフ部４１の境界上には、リードフレーム１の上面から垂直上向きに突出した中空の突起部５０及び突起部５１が形成されている。   As shown in FIG. 2, in the present embodiment, on the boundary between the anode terminal 10 and the cut-off portion 40 and on the boundary between the cathode terminal 20 and the cut-off portion 41, it protrudes vertically upward from the upper surface of the lead frame 1. The hollow protrusion part 50 and the protrusion part 51 which were made are formed.

図３に示されるように、本実施の形態におけるコンデンサ素子６０は、直方体形状の陽極体６１と、陽極体６０の側面から延びる陽極リード線（陽極接続部）６２と、陽極体６０の外側を覆うようにして設けられている陰極層（陰極接続部）６３とで構成されている。   As shown in FIG. 3, the capacitor element 60 according to the present embodiment includes a rectangular parallelepiped anode body 61, an anode lead wire (anode connection portion) 62 extending from the side surface of the anode body 60, and the outside of the anode body 60. The cathode layer (cathode connection portion) 63 is provided so as to cover it.

本実施の形態における配置工程では、陰極端子２０のうち突起部５１の陰極端子側側面５４と陰極端子側側面５４から接続部方向へ連続する水平部分５５に導電性接着剤６５を塗布した状態で、コンデンサ形成部２上にコンデンサ素子６０を配置する。詳しくは、陽極リード線６２の向きがリードフレーム１の長手方向と平行になるように、陽極リード線６２を突起部上面５２に載せる一方、コンデンサ素子６０の陰極層６３を導電性接着剤６５でリードフレーム１に固着する。これにより、陰極層６３と陰極端子２０は導電性接着剤６５により電気的に接続されることとなる。   In the disposing step in the present embodiment, the conductive adhesive 65 is applied to the cathode terminal side surface 54 of the cathode terminal 20 and the horizontal portion 55 that continues from the cathode terminal side surface 54 to the connecting portion direction. The capacitor element 60 is disposed on the capacitor forming unit 2. Specifically, the anode lead wire 62 is placed on the protrusion upper surface 52 so that the direction of the anode lead wire 62 is parallel to the longitudinal direction of the lead frame 1, while the cathode layer 63 of the capacitor element 60 is covered with the conductive adhesive 65. Secure to the lead frame 1. Thereby, the cathode layer 63 and the cathode terminal 20 are electrically connected by the conductive adhesive 65.

次に、陽極リード線６２と突起部上面５２を抵抗溶接により溶接する。これにより、陽極リード線６２と陽極端子１０は電気的に接続される。   Next, the anode lead wire 62 and the protrusion upper surface 52 are welded by resistance welding. Thereby, the anode lead wire 62 and the anode terminal 10 are electrically connected.

続いて、図４に示されるように、コンデンサ素子６０をリードフレーム１上で樹脂７０にて被覆する。   Subsequently, as shown in FIG. 4, the capacitor element 60 is covered with a resin 70 on the lead frame 1.

最後に、図２及び図４に示した境界線１１及び境界線２１の夫々を通るようにダイシングを行い、更に、接続部３０を陽極端子１０及び陰極端子２０から切断除去するためにダイシングライン３１上をダイシングにより切断する。これにより、図５に示される構造のコンデンサを製造することができる。   Finally, dicing is performed so as to pass through each of the boundary line 11 and the boundary line 21 shown in FIGS. 2 and 4, and further, a dicing line 31 for cutting and removing the connection portion 30 from the anode terminal 10 and the cathode terminal 20. Cut the top by dicing. Thereby, the capacitor having the structure shown in FIG. 5 can be manufactured.

上述した方法によれば、リードフレーム１の陽極端子１０及び陰極端子２０を接続する接続部３０を設けているため、被覆工程において従来よりも陽極端子１０の裏側への樹脂の回り込みを防ぐことができる。   According to the above-described method, since the connecting portion 30 for connecting the anode terminal 10 and the cathode terminal 20 of the lead frame 1 is provided, it is possible to prevent the resin from wrapping around the back side of the anode terminal 10 in the coating process. it can.

なお、接続部を陽極端子及び陰極端子と別体としてもよいが、接続部を別体とすると接続部を陽極端子及び陰極端子の夫々に粘着剤等で固定する必要がある。この場合、被覆工程後に接続部を陽極端子及び陰極端子から取り外す工程が必要となる上、その工程において陽極端子及び陰極端子に対してコンデンサ素子から離れる方向（即ち、リードフレームと直交する方向）に向かう力が加わるために陽極端子及び陰極端子が変形してしまう可能性がある。一方、本実施の形態の接続部３０は、陽極端子１０及び陰極端子２０と一体に成形されており、被覆工程後に接続部をリードフレームの下面に沿ってダイシングすることにより除去されるものであるため、陽極端子及び陰極端子の夫々には、リードフレームの下面と平行な力が加わることとなる。即ち、接続部を除去する際に、陽極端子及び陰極端子に対してコンデンサ素子から離れる方向へ向かう力が加わることはないため、陽極端子及び陰極端子が変形することもない。従って、接続部は陽極端子及び陰極端子と一体成形されていることが好ましい。   The connecting portion may be separated from the anode terminal and the cathode terminal. However, if the connecting portion is separated, it is necessary to fix the connecting portion to each of the anode terminal and the cathode terminal with an adhesive or the like. In this case, a step of removing the connection portion from the anode terminal and the cathode terminal after the coating step is required, and in the step, the direction away from the capacitor element with respect to the anode terminal and the cathode terminal (that is, the direction orthogonal to the lead frame). There is a possibility that the anode terminal and the cathode terminal are deformed due to the applied force. On the other hand, the connection portion 30 of the present embodiment is formed integrally with the anode terminal 10 and the cathode terminal 20, and is removed by dicing the connection portion along the lower surface of the lead frame after the covering step. Therefore, a force parallel to the lower surface of the lead frame is applied to each of the anode terminal and the cathode terminal. That is, when removing the connecting portion, no force is applied to the anode terminal and the cathode terminal in the direction away from the capacitor element, so that the anode terminal and the cathode terminal are not deformed. Therefore, it is preferable that the connecting portion is integrally formed with the anode terminal and the cathode terminal.

更に、接続部を陽極端子１０及び陰極端子２０と一体に成形することにより、陽極リード線と陽極端子に対して溶接用電極を押し当てて抵抗溶接する際にも、従来技術と比較して陽極端子が変形しにくい。   Further, by forming the connecting portion integrally with the anode terminal 10 and the cathode terminal 20, the anode electrode and the anode terminal can be pressed against the anode lead wire and the anode terminal for resistance welding as compared with the prior art. Terminals are difficult to deform.

以上、説明した実施の形態において、接続部は、断面コの字型に成形されているものとして説明したが、例えば、断面Ｖ字型のものなど、本実施の形態の接続部３０のようにリードフレーム下面に沿ってダイシングする方法で除去できる他の形状としてもよい。   In the above-described embodiment, the connection portion has been described as having a U-shaped cross section. However, for example, the connection portion 30 of the present embodiment such as a V-shaped cross section is used. Other shapes that can be removed by dicing along the lower surface of the lead frame may be used.

本発明の実施の形態によるリードフレームを示す図である。It is a figure which shows the lead frame by embodiment of this invention. 図１のリードフレーム上のコンデンサ形成部近傍を示す部分拡大図である。FIG. 2 is a partially enlarged view showing the vicinity of a capacitor forming portion on the lead frame in FIG. 1. 図２のリードフレームにコンデンサ素子を配置した状態を示す図である。It is a figure which shows the state which has arrange | positioned the capacitor | condenser element to the lead frame of FIG. 図３のコンデンサ素子を樹脂で被覆した状態を示す断面図である。It is sectional drawing which shows the state which coat | covered the capacitor | condenser element of FIG. 3 with resin. 本発明の実施の形態による製造方法で製造されたコンデンサの断面図である。It is sectional drawing of the capacitor | condenser manufactured with the manufacturing method by embodiment of this invention.

符号の説明Explanation of symbols

１ リードフレーム
１０ 陽極端子
２０ 陰極端子
３０ 接続部
４０、４１ カットオフ部
５０、５１ 突起部
６０ コンデンサ素子
６１ 陽極体
６２ 陽極リード線
６３ 陰極層
６５ 導電性接着剤
７０ 樹脂 DESCRIPTION OF SYMBOLS 1 Lead frame 10 Anode terminal 20 Cathode terminal 30 Connection part 40, 41 Cut-off part 50, 51 Protrusion part 60 Capacitor element 61 Anode body 62 Anode lead wire 63 Cathode layer 65 Conductive adhesive 70 Resin

Claims (4)

少なくとも陽極端子と、陰極端子と、前記陽極端子及び前記陰極端子を接続する接続部とを有するリードフレーム上に、陽極接続部及び陰極接続部を有するコンデンサ素子を配置する配置工程と、
前記陽極接続部及び前記陽極端子を接続し、前記陰極接続部及び前記陰極端子を接続する接続工程と、
前記コンデンサ素子を絶縁素材にて被覆する被覆工程と、
前記接続部を前記陽極端子及び前記陰極端子から切り離す切断工程と
を含むコンデンサの製造方法。 An arrangement step of disposing a capacitor element having an anode connection portion and a cathode connection portion on a lead frame having at least an anode terminal, a cathode terminal, and a connection portion connecting the anode terminal and the cathode terminal;
Connecting the anode connecting portion and the anode terminal, and connecting the cathode connecting portion and the cathode terminal;
A coating step of coating the capacitor element with an insulating material;
A method of manufacturing a capacitor including a cutting step of separating the connecting portion from the anode terminal and the cathode terminal. 前記接続部は、断面コの字型に形成されている、請求項１に記載のコンデンサ製造方法。   The capacitor manufacturing method according to claim 1, wherein the connection portion is formed in a U-shaped cross section. 前記リードフレームは、前記陽極端子及び前記陰極端子に接続されたカットオフ部を更に備えており、
前記切断工程は、前記カットオフ部を前記陽極端子及び前記陰極端子から切り離す工程を更に含む
請求項１又は請求項２に記載のコンデンサ製造方法。 The lead frame further includes a cut-off portion connected to the anode terminal and the cathode terminal,
3. The capacitor manufacturing method according to claim 1, wherein the cutting step further includes a step of separating the cut-off portion from the anode terminal and the cathode terminal. 請求項１乃至請求項３のいずれかに記載のコンデンサ製造方法に用いられるリードフレーム。   The lead frame used for the capacitor | condenser manufacturing method in any one of Claim 1 thru | or 3.
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GB2473532A (en) * 2009-09-10 2011-03-16 Avx Corp Capacitor leadframe
US8075640B2 (en) 2009-01-22 2011-12-13 Avx Corporation Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency
JP2015233046A (en) * 2014-06-09 2015-12-24 日本ケミコン株式会社 Method for manufacturing solid electrolytic capacitor
JP2015233045A (en) * 2014-06-09 2015-12-24 日本ケミコン株式会社 Method for manufacturing solid electrolytic capacitor

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US8075640B2 (en) 2009-01-22 2011-12-13 Avx Corporation Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency
GB2473532A (en) * 2009-09-10 2011-03-16 Avx Corp Capacitor leadframe
JP2011061213A (en) * 2009-09-10 2011-03-24 Avx Corp Electrolytic capacitor assembly and method using recessed leadframe channel
CN102024576A (en) * 2009-09-10 2011-04-20 Avx公司 Electrolytic capacitor assembly and method with recessed leadframe channel
JP2015233046A (en) * 2014-06-09 2015-12-24 日本ケミコン株式会社 Method for manufacturing solid electrolytic capacitor
JP2015233045A (en) * 2014-06-09 2015-12-24 日本ケミコン株式会社 Method for manufacturing solid electrolytic capacitor

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