JP2009081233A - Electronic circuit device, and hermetic electric compressor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device having reliability against electrification while improving heat radiation capability even when housed in a housing box, in an electronic circuit device having a structure where semiconductor elements such as an IPM (intelligent power module) used for an inverter control apparatus or the like, and a control element such as a microcomputer are mounted on a sub-board and surrounded by a heat radiation plate. <P>SOLUTION: By grounding the heat radiation plate and grounding a cover 185 of the housing box 181 as well, safety against electrification in the cover 185 is secured. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic circuit device in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board, and is particularly suitable for driving a hermetic electric compressor for a refrigerator. .

  In recent years, there are many devices using inverter control such as refrigerators, but in the electronic circuit devices of these inverter devices, the inverter drive circuit such as a motor and the protection circuit against overcurrent of the drive circuit as one module In general, an embedded IPM semiconductor element is used.

  These IPM semiconductor elements have a DIP (dual inline package) type shape with terminals on both sides of the main body, and a SIP (single inline package) type shape with terminals on one side of the main body. There is something.

  A microcomputer or the like is generally used as a control semiconductor element for controlling and driving these IPM semiconductor elements.

  Since these IPM semiconductor elements generate heat, a heat sink must be attached. However, a SIP type IPM semiconductor element and a control semiconductor element such as a microcomputer are mounted on one vertical sub board, and the heat sink is a vertical sub board. There has been proposed an electronic circuit device that is configured so as to surround a substrate and that is downsized by mounting a vertical sub-substrate and a heat sink on a main substrate (see, for example, Patent Document 1).

  The conventional electronic circuit device will be described below with reference to the drawings.

  8 is a perspective view of a conventional electronic circuit device described in Patent Document 1, FIG. 9 is a side view of the conventional electronic circuit device, and FIG. 10 is an electric circuit block diagram of the conventional electronic circuit device.

  11 is a perspective view of the conventional electronic circuit device before bending of the heat sink, FIG. 12 is a perspective view of the conventional electronic circuit device housed in a dedicated storage box, and FIG. 13 is a CC view of FIG. FIG.

  In FIG. 10, an electronic circuit device 71 includes an IPM 51, which is a SIP semiconductor element in which a drive circuit 51a and an overcurrent protection circuit 51b are formed as an electric circuit.

  The electronic circuit device 71 includes a microcomputer 61a which is a control semiconductor element, an oscillator 61c connected to the microcomputer 61a, and a position detection circuit 61b which detects the rotor position of the three-phase motor 8. The rotation speed control circuit 61 issues a command to the IPM 51.

  Further, the electronic circuit device 71 includes a power supply circuit 69 including a motor drive power supply circuit 69a for the IPM 51 and a control power supply circuit 69b for the rotation speed control circuit 61, the power supply connector 5 electrically connected to the power supply and the ground, An output connector 7 for electrically connecting the circuit device 71 and the motor 8 is provided.

  Further, as shown in FIGS. 8 to 13, the electronic circuit device 71 includes, as other components, a main board 67, a vertical sub board 53, a heat sink 59, an IPM mounting screw 55, a nut in order to constitute the electric circuit. 57, a substrate terminal 65, and the like.

  Hereinafter, a detailed configuration of the electronic circuit device will be described.

  The IPM 51, which is a SIP type semiconductor element, includes a plurality of element terminals 51c, and is mounted by soldering the element terminals 51c to the vertical sub board 53 so that the vertical sub board 53 and the IPM 51 face each other in parallel. ing.

  The microcomputer 61 a and the oscillator 61 c of the rotation speed control circuit 61 that controls the IPM 51 are surface-mounted on the vertical sub-board 53.

  Further, the IPM 51 is mounted by an IPM mounting screw 55 and a nut 57 so as to be in close contact with a heat radiating plate 59 formed by bending a metal flat plate shown in FIG. 11 into a U shape. It arrange | positions so that the board | substrate 53 and IPM51 may be enclosed.

  An insulating sheet 99 is disposed between the IPM 51 and the heat radiating plate 59 to ensure an insulating distance between the element terminal 51 c and the heat radiating plate 59.

  The vertical sub board 53 and the heat sink 59 are mounted on the main board 67, but a plurality of board terminals 65 are attached to the end face of the vertical sub board 53 on the main board 67 side. Thus, the vertical sub board 53 and the main board 67 are electrically connected.

  The power supply connector 5 is attached to the main board 67, and an input power supply (for example, AC100V) is supplied to the electronic circuit device 71 and is connected to the ground (not shown).

  A power supply circuit 69 composed of a motor drive power supply circuit 69a and a control power supply circuit 69b is mounted on the main board 67. The power supply input from the power supply connector 5 is input to the IPM 51 as a drive system voltage (for example, DC280V). A control system voltage (for example, DC 5 V) is supplied to the rotation speed control circuit.

  The output connector 7 is attached to the main board 67, and the output of the IPM 51 is output to the motor 8 via the vertical sub board 53, the main board 67, and the output connector 7.

  Next, an electronic circuit device in the case of a specification for storage in a storage box will be described.

  FIG. 12 shows a case where the electronic circuit device 71 is used for driving a hermetic electric compressor or the like and the electronic circuit device 71 is stored in the storage box 81 so that it can be installed in the vicinity of the hermetic electric compressor or the like. The electronic circuit device 71 is housed in the housing box 81, covered with a metallic cover 85, and fixed with a cover mounting screw 87.

  The cover 85 is in contact with the heat radiating plate 59 so that the heat radiating plate 59 and the cover 85 conduct heat.

  A window 81 a is provided on the side of the storage box 81 to take out the electrical wiring 95 connected to the power supply connector 5 and the output connector 7 to the outside of the storage box 81. The wiring cover 89 is stored with the wiring cover mounting screw 91. The storage box 81 is hermetically sealed by being fixed to the box 81, and water or dust is prevented from entering the storage box 81 from the outside.

  The operation of the electronic circuit device configured as described above will be described below.

  The rotation speed control circuit 61 receives the three-phase position detection signal fed back from the motor 8 as input, detects the rotation state of the motor 8 with the position detection circuit 61b and performs arithmetic processing with the microcomputer 61a. The microcomputer 61a generates a clock for operation by the oscillator 61c, thereby executing the program stored therein to control the IPM 51. To do.

  The drive circuit 51a inside the IPM 51 outputs a three-phase drive voltage waveform to the motor 8 based on the drive signal from the microcomputer 61a of the rotation speed control circuit 61 so that the motor 8 operates at a predetermined rotation speed. 8 is operated at a predetermined rotational speed.

  The overcurrent protection circuit 51b of the IPM 51 monitors the output current value output from the drive circuit 51a to the motor 8, and stops the drive output to the motor 8 when the current value exceeds a specified current value. Protect.

  Next, the heat dissipation operation of the electronic circuit device 71 will be described. In the electronic circuit device 71, when the motor 8 is driven, the IPM 51 that is a drive element generates heat.

The heat generated by the IPM 51 is thermally conducted to the heat radiating plate 59 through the insulating sheet 99 and further radiated to the outside of the storage box 81 by conducting heat to the cover 85.
JP 2006-24746 A

  However, in the above-described conventional configuration, when the user's hand touches the metallic cover 85 of the storage box 81, the heat radiating plate 59 and the drive system voltage are supplied from the viewpoint of safety against electric shock. Since the insulation distance of the charging part or the like (for example, the insulation distance between the heat sink 59 and the element terminal of the IPM 51) is determined by safety standards to ensure a certain distance or more, an insulating sheet is provided between the IPM 51 and the heat sink 59. In addition, the IPM 51 having a good heat dissipation property in which a metal plate is used for the body of the IPM 51 cannot be used because the insulation distance cannot be secured by screwing the IPM 51 to the heat dissipation plate 59. Had.

  The present invention solves the above-described conventional problems, and provides an electronic circuit device that has good heat dissipation and satisfies the insulation requirements of safety standards without using an insulating sheet.

  In order to solve the above conventional problems, the electronic circuit device of the present invention is configured such that the cover of the storage box and the heat sink are electrically and thermally connected and the heat sink is grounded. Is radiated to the outside through the cover of the storage box, and the cover of the storage box is also grounded.

  The electronic circuit device of the present invention can dissipate the heat of the heat dissipation plate to the outside through the cover of the storage box, and the cover of the storage box that may be touched by the hand is also grounded. Safety against electric shock can also be ensured.

  The invention according to claim 1 is mounted on the vertical sub-substrate and the vertical sub-substrate, the SIP-type semiconductor element mounted on the vertical sub-substrate so as to face the vertical sub-substrate, and the vertical sub-substrate. A control semiconductor element for controlling the driving of the SIP type semiconductor element, a heat sink formed so as to surround the vertical type sub board and the SIP type semiconductor element, and an end part of the vertical type sub board. A main board on which the vertical sub-board is mounted by being electrically connected by a board terminal, a storage box for hermetically storing the main board, a heat sink and a thermal box that are thermally and electrically connected to the storage. The heat sink is grounded, the heat dissipation of the storage box is good, heat can be prevented from being stored in the storage box, and the insulation requirements of safety standards are also met. It can be a secure electronic circuit device against shock and.

  According to a second aspect of the present invention, in the first aspect of the present invention, the heat sink and the cover are grounded by electrically connecting the heat sink and the ground pattern of the main board. The connection configuration can be simplified and the workability of ground connection can be improved.

  The invention according to claim 3 is the invention according to claim 1 or 2, wherein a notch opening is provided on a side surface of the heat sink that faces the control semiconductor element in close proximity, and external surge or It is possible to provide a hermetic electric compressor that does not easily malfunction due to noise.

  The invention according to claim 4 uses the electronic circuit device according to any one of claims 1 to 3 for a hermetic electric compressor, has good heat dissipation, and satisfies the insulation requirements of safety standards. It can be set as a hermetic electric compressor.

  According to a fifth aspect of the invention, in the invention of the fourth aspect, an output connector to the sealed electric compressor of the main board is provided with a ground terminal connected to the ground pattern of the main board, and connected to this terminal. It is grounded by electrically connecting the grounded electric wire and the sealed container, simplifying the ground connection configuration of the hermetic electric compressor and simplifying the production process of equipment equipped with the hermetic electric compressor Therefore, the working efficiency is improved and it can be manufactured at a low cost.

(Embodiment 1)
1 is a perspective view of an electronic circuit device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a perspective view of a substrate component of the electronic circuit device according to the first embodiment. 4 is a cross-sectional view taken along line BB in FIG.

  FIG. 5 is an electric circuit block diagram of the electronic circuit device according to the embodiment, FIG. 6 is a perspective view before the heat sink is bent, and FIG. 7 is a hermetic electric compressor according to the embodiment. It is an electric circuit block diagram of.

  The electronic circuit device 171 is roughly composed of a board component 171a and a storage box 181. The board component 171a is stored inside the storage box 181 and covered with a cover 185 and fixed with a cover mounting screw 187. It has a structure.

  The electronic circuit device 171 includes an IPM 151 that is a SIP type semiconductor element, a rotation speed control circuit 161, a power circuit 169, a power connector 105 that is electrically connected to a power source and a ground, an electronic circuit device 171 and a motor 108. The output connector 107 is electrically connected.

  The IPM 151 includes a drive circuit 151a and an overcurrent protection circuit 151b inside. The rotation speed control circuit 161 includes a microcomputer 161a that is a control semiconductor element that gives a command to the IPM 151, an oscillator 161c that is connected to the microcomputer 161a, and a position detection circuit 161b that detects the rotor position of the three-phase motor 108. Has been.

  The power supply circuit 169 includes a motor drive power supply circuit 169a for the IPM 151 and a control power supply circuit 169b for the rotation speed control circuit 161.

  The electronic circuit device 171 includes, as other components, a main board 167, a vertical sub-board 153, a heat sink 159, an IPM mounting screw 155, a nut 157, a board terminal 165, and a heat sink mounted in order to configure the above electric circuit. A screw 163 and the like are provided.

  Hereinafter, a detailed configuration of the electronic circuit device 171 will be described.

  The IPM 151, which is a SIP type semiconductor element, includes a plurality of element terminals 151c, and is mounted by soldering the element terminals 151c to the vertical sub-board 153 so that the vertical sub-board 153 and the IPM 151 face each other in parallel. Yes.

  The microcomputer 161 a and the oscillator 161 c of the rotation speed control circuit 161 that controls the IPM 151 are surface-mounted on the vertical sub-board 153.

  The IPM 151 is attached by an IPM mounting screw 155 and a nut 157 so as to be in close contact with a heat sink 159 formed by bending a metal plate into a U-shape, and the heat sink 159 includes the vertical sub-board 153 and the IPM 151. Has come to enclose.

  Further, the heat sink 159 is provided with a notch opening 159c and a notch opening 159d, and the microcomputer 161a and the oscillator 161c are not in close proximity to the heat sink 159.

  The vertical sub board 153 and the heat dissipation plate 159 are mounted on the main board 167, and a plurality of board terminals 165 are attached to the end face of the vertical sub board 153 on the main board 167 side. By 165, the vertical sub-board 153 and the main board 167 are electrically connected.

  A power connector 105 is attached to the main board 167, and an input power (for example, AC 100V) is supplied to the electronic circuit device 171 and is connected to the ground.

  A power supply circuit 169 composed of a motor drive power supply circuit 169a and a control power supply circuit 169b is mounted on the main board 167, and receives a power supply input from the power supply connector 105 as an input to the IPM 151 and a drive system voltage (for example, DC280V) and rotation A control system voltage (for example, DC 5 V) is supplied to the number control circuit.

  The output connector 107 is attached to the main board 167, and the output of the IPM 151 is output to the motor 108 via the vertical sub board 153, the main board 167, and the output connector 107.

  In addition, a window portion 181a for taking out the electrical wiring connected to the power connector 105 and the output connector 107 is provided on the side surface of the storage box 181. The wiring cover 189 is attached to the storage box 181 with a wiring cover mounting screw 191. By fixing and covering, the storage box 181 is hermetically sealed to prevent water, dust, and the like from entering from the outside.

  When the electronic circuit device 171 is placed in the storage box 181, the heat generated in the IPM 151 or the like is trapped inside the storage box 181 and the temperature rises. Therefore, the cover 185 is made of a metal having good heat conductivity such as aluminum. The cover 185 and the heat sink 159 are brought into thermal contact with each other, and the heat generated by the IPM 151 is released to the outside of the storage box 181.

  For this purpose, the heat sink 159 is provided with a fixing hole 159e that is tabbed, and the cover 185 and the heat sink 159 are fixed by a fixing screw 193, so that the heat sink 159 and the cover 185 are electrically connected. Is conducting.

  On the main board 167, an earth pattern 167a electrically connected to the earth terminal 107b of the power connector 105 is formed of copper foil, and the heat radiating plate 159 has a fixing portion 159a bent at a right angle. In addition, a mounting hole 159b that is tabbed is provided, and the heat radiating plate 159 is grounded by electrically connecting the heat radiating plate 159 and the ground pattern 167a by the heat radiating plate mounting screw 163, and at the same time, the cover 185 is also grounded. It is like that.

  The output connector 107 has a ground terminal 107b as a terminal in addition to the drive terminal 107a to the motor 108. The ground terminal 107b is electrically connected to the ground pattern 167a by soldering.

  FIG. 7 shows a hermetic electric compressor 194 using an electronic circuit device 171. In FIG. 7, the hermetic electric compressor 194 houses a motor 108 and a compression element 192 in a hermetic container 195. ing.

  The hermetic container 195 of the hermetic electric compressor 194 is electrically connected to the earth pattern 167a of the electronic circuit device 171 through the earth terminal 107b, which is the terminal of the output connector 107, by the grounding electric wire 197, and the output connector. The electric wiring for driving connected to the driving terminal 107a of 107 is put together.

  The operation of the electronic circuit device configured as described above will be described below.

  The rotation speed control circuit 161 receives the three-phase position detection signal fed back from the motor 108, detects the rotation state of the motor 108 with the position detection circuit 161b, and performs arithmetic processing with the microcomputer 161a. The drive signal is output to the IPM 151 so as to rotate at the rotation speed of the microcomputer 161a. The microcomputer 161a generates a clock for operation by the oscillator 161c, thereby executing the program stored therein and controlling the IPM 151. To do.

  Based on the drive signal from the microcomputer 161a of the rotation speed control circuit 161, the drive circuit 151a inside the IPM 151 outputs a three-phase drive voltage waveform to the motor 108 so that the motor 108 operates at a predetermined rotation speed. 108 is operated at a predetermined rotational speed.

  The overcurrent protection circuit 151b of the IPM 151 monitors the output current value output from the drive circuit 151a to the motor 108. When the current value exceeds a specified current value, the drive output to the motor 108 is stopped, and the IPM 151 and the motor 108 are turned off. Protect.

  Further, when the motor 108 is operated, the IPM 151 generates heat. However, by radiating the heat generated by the IPM 151 by the heat radiating plate 159 and the cover 185, the temperature of the IPM 151 is prevented from excessively rising, and the IPM 151 increases excessively. To prevent failure.

  Further, the cover 185 is connected to the ground of the power connector 105 through the heat sink 159 and the ground pattern 167a. By being grounded, the cover 185 secures safety against electric shock and the hermetic electric compressor 194. Be driven.

  By the way, when the heat sink 159 is connected to the ground, the vertical sub board 153 and the heat sink 159 are close to each other, so that the electronic circuit of the vertical sub board 153 is caused by an external surge or noise through the ground. There is a drawback that it is easy to malfunction due to radiation noise from the.

  In particular, the clock oscillation circuit composed of the microcomputer 161a and the oscillator 161c is an electronic circuit that is likely to malfunction due to external noise, but the heat sink 159 has a notch opening 159c, so that the microcomputer 161a and the oscillator 161 Since 161 c has a structure that does not face the heat sink 159, the electronic circuit device 171 can operate the motor 108 and the hermetic electric compressor 194 without receiving radiation noise from the heat sink 159.

  Further, since the hermetic container 195 of the hermetic electric compressor 194 is connected to the earth pattern 167a of the electronic circuit device 171 by the grounding electric wire 197, it is securely grounded and the safety against electric shock in the hermetic electric compressor 194 is ensured. Then drive.

  As described above, the heat sink 159 is grounded, and the cover 185 is also grounded by electrically and thermally connecting the heat sink 159 and the cover 185 of the storage box 181. It is not necessary, and the loss of heat transfer by the insulating sheet can be reduced, and the effect of improving the reliability against electric shock while improving the heat dissipation can be obtained.

  In addition, by electrically connecting the heat sink 159 and the ground pattern 167a of the main board 167, it is possible to simplify the ground connection configuration of the heat sink 159 and simplify the ground connection work. it can.

  In addition, since the heat sink 159 has the notch opening 159c and the notch opening 159d, the microcomputer 161a and the oscillator 161c are not in close proximity to the heat sink 159, so that the electronic circuit device 171 is grounded. When an external surge or noise is applied, it is possible to obtain an effect that the microcomputer 161a does not receive radiation noise from the heat sink 159 and does not malfunction.

  Moreover, also in the hermetic electric compressor 194 using the electronic circuit device 171, the heat dissipation can be improved and the reliability against electric shock can be improved, thereby simplifying the connection configuration and simplifying the ground connection work. In addition, it is possible to obtain an effect that no malfunction occurs due to an external surge or noise via the ground.

  Further, a ground terminal 107 b is provided on the output connector 107, and the grounded electric compressor 194 is grounded by connecting the grounding electric wire 197 connected to the ground terminal 107 b and the sealed container 195 of the sealed electric compressor 194. Therefore, the ground connection configuration of the hermetic electric compressor 194 can be simplified, the production process of the device on which the hermetic electric compressor 194 is mounted can be simplified, and the cost can be reduced.

  As described above, the electronic circuit device according to the present invention can improve heat dissipation, improve safety against electric shock, and improve reliability against external noise. Instead, the present invention can also be applied to other electronic circuit devices using semiconductor elements.

The perspective view of the electronic circuit device in Embodiment 1 of this invention Sectional view of the AA line in FIG. The perspective view of the board | substrate structure part of the electronic circuit device in the embodiment Sectional view of the BB line in FIG. Electric circuit block diagram of electronic circuit device in the embodiment The perspective view before the bending process of the heat sink in the same embodiment Electrical circuit block diagram of hermetic electric compressor in the same embodiment A perspective view of a conventional electronic circuit device Side view of a conventional electronic circuit device Electric circuit block diagram of a conventional electronic circuit device The perspective view before the bending process of the heat sink in the conventional electronic circuit device A perspective view of a conventional electronic circuit device housed in a dedicated storage box 12 is a side sectional view taken along line CC in FIG.

Explanation of symbols

107 Output connector 107b Ground terminal 151 IPM
153 Vertical sub-board 159 Heat sink 159c, 159d Notch opening 161a Microcomputer 167 Main board 167a Earth pattern 171 Electronic circuit device 181 Storage box 185 Cover 194 Sealed electric compressor 195 Sealed container 197 Ground wire

Claims (5)

  A vertical sub-substrate, a SIP (single in-line package) type semiconductor device mounted on the vertical sub-substrate so as to face the vertical sub-substrate in parallel, and mounted on the vertical sub-substrate A control semiconductor element for controlling the driving of the SIP type semiconductor element, a heat sink formed so as to surround the vertical type sub board and the SIP type semiconductor element, and an end part of the vertical type sub board. A main board on which the vertical sub-board is mounted by being electrically connected by a board terminal, a storage box for hermetically storing the main board, a heat sink and a thermal box that are thermally and electrically connected to the storage. An electronic circuit device comprising: a cover for sealing the box, wherein the heat sink is grounded.   The electronic circuit device according to claim 1, wherein the heat radiating plate and the cover are grounded by electrically connecting the heat radiating plate and a ground pattern of the main board.   The electronic circuit device according to claim 1, wherein a notch opening is provided in a side surface facing the control semiconductor element of the heat sink.   A hermetic electric compressor using the electronic circuit device according to any one of claims 1 to 3.   An output terminal for the main board sealed electric compressor is provided with a ground terminal connected to the ground pattern of the main board, and the ground wire connected to this terminal is electrically connected to the sealed container for grounding. The hermetic electric compressor according to claim 4.