JP2009079246A - Substrate-treating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus which can improve productivity and also can easily cope with a change of a treatment process. <P>SOLUTION: The substrate-treating apparatus 11 includes a plurality of chambers 15 of which the atmosphere is adjusted to differ from the air, and a substrate transfer chamber 14 which transports a substrate 12 to be treated to the plurality of the chambers 15. The substrate transfer chamber 14 has a recessed transfer base 24 which slides along a convexed transfer guide 25. The transfer base 24 has a transfer chamber 23 mounted thereon of which the atmosphere is adjusted to differ from the air, and which transports the substrate 12 to be treated to each of the chambers 15. Each of the chambers 15 can communicate with the substrate transfer chamber through a structure in which one of side parts 20 that constitute the chamber 15 is connected with the substrate transfer chamber 14 through gate valves 21 and 26. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate to be processed in an atmosphere different from air.

  The substrate processing apparatus described above is used when manufacturing an organic EL (Electro Luminescence) device, a liquid crystal device, a semiconductor device, and the like. For example, as described in Patent Document 1, a processing chamber for processing a substrate to be processed is provided. Have more than one. FIG. 3 is a schematic diagram showing the arrangement relationship of a conventional substrate processing apparatus. A plurality of processing stations 111 constituting the substrate processing apparatus 101 have processing chambers 112 arranged in a cluster system, and are set to an atmosphere different from the atmosphere. The processing station 111 is connected to the processing station 111 adjacent to the processing station 111 so that the processing order can be taken into consideration.

  Specifically, the processing station 111 is provided with a transfer robot 115 that transfers the substrate to be processed 113 to the processing chamber 112 or the like at the center of the chamber 114. Further, the processing station 111 can transport the substrate 113 to be processed to the adjacent processing station 111 via the substrate transport path 116.

JP 2006-190894 A

  However, since the other processing stations 111 are sequentially connected one by one on the basis of one processing station 111, it takes time to bring the substrate processing apparatus 101 into a processable state. Further, when it is desired to add a new processing station 111 or change the processing order, the arrangement position of the processing station 111 must be changed, and the entire substrate processing apparatus 101 must be stopped. Furthermore, it is necessary to confirm the transfer operation of the substrate 113 to be processed, and it takes time to start up the substrate processing apparatus 101. From these things, there exists a problem that productivity falls.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A substrate processing apparatus according to this application example is capable of transferring a substrate to be processed to a plurality of fixed chambers adjusted to an atmosphere different from the atmosphere and to an atmosphere different from the atmosphere. A plurality of fixed chambers, a processing chamber for processing the substrate to be processed being disposed around the fixed chamber, and the peripheral chambers. A part thereof is connected to the transfer chamber so as to communicate therewith.

  According to this configuration, since the transfer chamber and each of the plurality of fixed chambers are connected so as to communicate with each other, it is possible to simultaneously connect a plurality of fixed chambers based on the transfer chamber when starting up the substrate processing apparatus. become. Therefore, the time for starting up the substrate processing apparatus can be shortened. Further, since the transfer chamber moves and transfers the substrate to be processed to each fixed chamber, it is not necessary to arrange the fixed chambers in the order of processing. Therefore, when it is desired to add a new process, it can be handled by simply connecting a new fixed chamber to the transfer chamber. Moreover, since it can respond even if it does not stop an operation | work other than the fixed chamber to connect, it can suppress that productivity falls. Furthermore, when it is desired to change the process order, it can be dealt with only by changing the transfer order of the transfer chambers, so that other fixed chambers are not adversely affected. As a result, productivity can be improved.

  Application Example 2 In the substrate processing apparatus according to the application example described above, the fixed chamber is connected to the transfer chamber through a first gate valve so as to be able to communicate with the first gate valve and the transfer chamber. It is preferable to be connected to the transfer chamber through a second gate valve provided.

  According to this configuration, since each fixed chamber is connected to the transfer chamber via the first gate valve, the atmosphere of each fixed chamber can be maintained at a predetermined atmosphere, and the fixed chamber can be added or removed. Can be easily performed. Moreover, since the second gate valve is provided in the transfer chamber, the inside of the transfer chamber can be maintained in an atmosphere different from the atmosphere. In addition, since the substrate to be processed is transferred between the fixed chamber and the transfer chamber via the first gate valve and the second gate valve, it can be transferred while maintaining an atmosphere different from the atmosphere.

  Application Example 3 In the substrate processing apparatus according to the application example described above, it is preferable that the fixed chamber has side portions that are continuous with an inner angle, and one side portion of the side portions is connected to the transfer chamber. .

  According to this configuration, since the fixed chamber has side portions that are continuous with an inner angle, a plurality of processing chambers can be connected to the side portions of the respective fixed chambers. Further, since the side portion and the transfer chamber are connected, the position of the fixed chamber relative to the transfer chamber can be determined relatively easily.

  Application Example 4 In the substrate processing apparatus according to the application example described above, at least two fixed chambers among the plurality of fixed chambers are connected by a transfer path capable of transferring the substrate to be processed to the fixed chambers. It is preferable that

  According to this configuration, since at least two fixed chambers are directly connected by the transfer path, it can be transferred to the next fixed chamber earlier than when transferred through the transfer chamber (transfer chamber). . Further, when a plurality of substrates to be processed are processed simultaneously in the substrate processing apparatus, the plurality of substrates to be processed can be efficiently transferred.

  Application Example 5 In the substrate processing apparatus according to the application example described above, the transfer chamber is formed in a rectangular shape, and the transfer chamber is provided so as to be capable of reciprocating along the long side direction of the transfer chamber. It is preferable that

  According to this configuration, since it only reciprocates along the long side direction, it can be transported by a relatively simple operation, and the transport time can be shortened.

  Application Example 6 In the substrate processing apparatus according to the application example, the transfer chamber is rotatably provided so that the second gate valve provided in the transfer chamber faces the fixed chamber. Is preferred.

  According to this configuration, since the transfer chamber is rotatably provided, the substrate to be processed can be transferred to a plurality of processing chambers arranged around the transfer chamber.

  Application Example 7 In the substrate processing apparatus according to the application example, it is preferable that the transfer chamber moves along a transfer rail provided in the transfer chamber.

  According to this configuration, since the transfer chamber is moved using the transfer rail as a guide, the transfer chamber can be easily moved, and variations in the position of the transfer chamber and the positions of the fixed chambers can be suppressed. . Therefore, the transfer chamber and the fixed chamber can be communicated in an airtight manner.

  Application Example 8 In the substrate processing apparatus according to the application example described above, it is preferable that at least one fixed chamber among the plurality of fixed chambers is adjusted to an atmosphere different from the atmosphere.

  According to this configuration, it is possible to perform processing under a plurality of types of atmospheres in one substrate processing apparatus. Therefore, it is possible to omit the operation of transporting the substrate to be processed from the substrate processing apparatus to the substrate processing apparatus in another atmosphere, and the transport time can be shortened.

(First embodiment)
FIG. 1 is a schematic plan view showing the configuration of the substrate processing apparatus. Hereinafter, the configuration of the substrate processing apparatus will be described with reference to FIG.

  As shown in FIG. 1, the substrate processing apparatus 11 is an apparatus used for manufacturing an organic EL device, a liquid crystal device, a semiconductor device, and the like including a substrate to be processed 12, and a cluster type processing station 13 (13 a to 13 f). A plurality. In addition, the substrate processing apparatus 11 includes a substrate transfer chamber 14 connected so as to be able to communicate with a plurality of processing stations 13 (13a to 13f). Hereinafter, the first processing station 13a among the plurality of processing stations 13 (13a to 13f) will be specifically described.

  The first processing station 13a includes a first chamber 15a as a fixed chamber having an atmosphere different from the atmosphere. Around the first chamber 15a, a plurality of processing chambers 16 for performing desired processing on the substrate 12 to be processed are arranged. Since the substrate to be processed 12 is continuously processed under an atmosphere different from the air, the substrate 12 is reciprocated between the plurality of processing chambers 16 and between the plurality of processing stations 13.

  Next, processing performed on the substrate 12 to be processed will be described. For example, in the case of manufacturing an organic EL device, a metal film forming process using a CVD (Chemical Vapor Deposition) method, a sputtering method, a vapor deposition method, etc. in a vacuum atmosphere on an element substrate as the substrate 12 to be processed; Processing such as a sealing process and a patterning process using a photolithography technique is performed. Moreover, you may make it perform the process of the sealing process of the organic film in nitrogen atmosphere, and also the printing process using an inkjet technique. Hereinafter, the structure of the substrate processing apparatus 11 when processing is performed in a vacuum atmosphere will be described.

As described above, the first processing station 13a includes the first chamber 15a in a vacuum atmosphere, and is set to a vacuum atmosphere of 10 ⁻⁵ Pa, for example. For example, the first chamber 15 a is formed in a regular octagonal planar shape having eight sides 20. Specifically, the side portions 20 are connected to each other with an internal angle of 135 °. As described above, since the first chamber 15 a has a regular octagonal planar shape, the number of the side portions 20 can be increased, and many processing chambers 16 are connected to the side portions 20. be able to.

  A substrate transfer robot 17 is disposed near the center of the first chamber 15a. The substrate transfer robot 17 includes, for example, an arm 18 that transfers, picks up, and places the substrate 12 to be processed. The first chamber 15a and the processing chamber 16 are connected to a vacuuming device (not shown) for creating a vacuum atmosphere.

  In addition, for example, a load chamber 19 that carries the substrate 12 to be processed into the substrate processing apparatus 11 from the outside is connected to one of the eight side portions 20. The processing chamber 16 is connected to four of the eight sides 20. Each side portion 20 is provided with a gate valve (not shown) that switches the side portion 20 to an open state or a closed state. In addition, one of the eight side portions 20 on the substrate transfer chamber 14 side is connected to the substrate transfer chamber 14 via a gate valve 21 so as to be able to communicate therewith.

  The second processing station 13b to the sixth processing station 13f have the same configuration as the first processing station 13a. In the sixth processing station 13f, for example, an unload chamber 22 for carrying the substrate 12 to be processed out of the substrate processing apparatus 11 is connected to one side 20 of the eight sides 20 of the first chamber 15a. Has been.

  The substrate transfer chamber 14 is formed in a substantially rectangular shape, and is connected to one side portion 20 among the eight side portions 20 of each chamber 15 (15a to 15f). Specifically, in the substrate transfer chamber 14, a transfer chamber 23 that transfers the substrate 12 to be processed, a transfer base 24 that moves the transfer chamber 23, and the transfer base 24 along the long side direction of the substrate transfer chamber 14. A conveyance guide 25 is arranged as a conveyance rail for guiding. With this conveyance guide 25, the conveyance chamber 23 can be reciprocated in the long side direction.

  Further, the substrate transfer chamber 14 is set to an atmosphere with a high degree of cleanliness so that dust or the like does not adhere to the transfer chamber 23. Accordingly, it is possible to prevent dust from entering the substrate transfer chamber 14 and prevent the dust from being caught even when the transfer chamber 23 and the chambers 15a to 15f are in close contact with each other via the gate valves 21 and 26. it can.

  The inside of the transfer chamber 23 is set to a vacuum atmosphere, and a table (not shown) on which the substrate 12 to be processed is placed is provided. The transfer chamber 23 is provided with the gate valve 26 described above that opens and closes when the substrate 12 to be processed is transferred between the chambers 15a to 15f.

  A vacuum pump 27 (for example, a dry pump) for making the inside of the transfer chamber 23 a vacuum atmosphere is attached to the transfer base 24. The transfer chamber 23 can be rotated about a normal line with the transfer base 24 as a fixed base. Specifically, for example, it can be rotated within a range of 180 °. More specifically, for example, it is rotated at intervals of 90 °. Thereby, the to-be-processed substrate 12 can be conveyed with respect to the processing stations 13a-13f (fixed chamber 15a-15f) arrange | positioned around the substrate conveyance chamber 14. FIG.

  Further, the transfer chamber 23 is provided such that the transfer base 24 can be reciprocated in the direction in which the chambers 15 are arranged (vertical direction in FIG. 1) with the transfer base 24 as a fixed base. As a result, the gate valve 26 of the transfer chamber 23 and the gate valve 21 of the first processing station 13a can be brought into close contact with each other, and the substrate 12 to be processed is moved back and forth between the transfer chamber 23 and each of the chambers 15a to 15f. be able to.

  The conveyance guide 25 is formed in a convex shape, for example, and extends from the first processing station 13a side to the fifth processing station 13e side. In addition, a concave depression is formed in the conveyance base 24, and the convex conveyance guide 25 and the concave conveyance base 24 are arranged so as to be slidable. That is, the transfer chamber 23 can be easily moved to the positions of the first chamber 15a to the sixth chamber 15f by moving the transfer base 24 using the transfer guide 25 as a guide.

  The positional relationship between the first chamber 15a and the substrate transfer chamber 14 is not limited as long as the gate valve 21 of the first chamber 15a and the gate valve 26 of the transfer chamber 23 can be in close contact with each other and the substrate 12 to be processed can be transferred in a vacuum atmosphere. For example, the arrangement position of the first chamber 15 a may be separated from the substrate transfer chamber 14. In other words, it is sufficient that only the connection portion can be brought into close contact with a specified accuracy. Moreover, as long as the gate valves 21 and 26 satisfy the above positional relationship, the positions of the first chamber 15a to the sixth chamber 15f may vary.

  Further, the processing station 13 (chamber 15) described above only needs to be compatible with a portion connected to the substrate transfer chamber 14, and can be freely determined from various types of processing apparatuses. Further, since the chamber 15 and the transfer chamber 23 are transferred via the gate valves 21 and 26, the substrate 12 to be processed can be transferred in a vacuum atmosphere.

  Next, the transfer operation of the substrate processing apparatus 11 will be described with reference to FIG. In addition, the substrate processing apparatus 11 of this embodiment shall process sequentially from the 1st processing station 13a to the 6th processing station 13f, for example.

  First, the substrate 12 to be processed is carried into the substrate processing apparatus 11 through the load chamber 19. Next, a desired process is performed on the substrate 12 to be processed in the first processing station 13a. The substrate 12 to be processed is transferred from the load chamber 19 to the processing chamber 16 by the substrate transfer robot 17. The substrate transfer robot 17 also transfers between the processing chambers 16.

  Next, the substrate 12 to be processed is transferred from the first processing station 13 a to the substrate transfer chamber 14. First, the transfer chamber 23 is moved to a position close to the first processing station 13a. In addition, you may make it wait in the position of the 1st processing station 13a previously. Further, when the transfer chamber 23 is moved, the transfer chamber 23 is preferably rotated so that the gate valve 26 faces the longitudinal direction of the substrate transfer chamber 14 so that the gate valve 26 does not contact the substrate transfer chamber 14. .

  Next, the transfer chamber 23 is rotated so that the gate valve 26 is directed toward the first processing station 13a, and then the transfer chamber 23 is moved toward the first chamber 15a, so that the gate valve 21 of the first chamber 15a is moved. And the gate valve 26 of the transfer chamber 23 are brought into close contact with each other.

  Next, the gate valves 21 and 26 are changed from the closed state to the open state, and the first chamber 15a and the transfer chamber 23 are communicated with each other. Then, the substrate to be processed 12 is transferred from the first chamber 15a to the transfer chamber 23 using the substrate transfer robot 17, and the substrate 12 to be processed is placed on a table (not shown). After the substrate 12 to be processed is transferred, the gate valves 21 and 26 are changed from the open state to the closed state.

  Next, the substrate 12 to be processed is transferred to the second processing station 13b. First, the transfer chamber 23 is moved to the second chamber 15b side, and then the transfer chamber 23 is rotated so that the gate valve 26 faces the second processing station 13b. Then, the transfer chamber 23 is moved to the second processing station 13b side, and the gate valve 26 of the transfer chamber 23 and the gate valve 21 of the second processing station 13b are brought into close contact with each other.

  Next, the gate valves 21 and 26 are changed from the closed state to the open state, and the second chamber 15b and the transfer chamber 23 are communicated with each other. Then, the substrate transfer robot 17 is used to transfer the substrate 12 to be processed from the transfer chamber 23 to the second chamber 15b, and the substrate 12 to be processed is further transferred to the processing chamber 16 of the second processing station 13b. After the substrate 12 to be processed is transferred, the gate valves 21 and 26 are changed from the open state to the closed state.

  Thereafter, the substrate to be processed 12 is transported from the second processing station 13b to the sixth processing station 13f by the same method, and the substrate to be processed 12 is processed. Then, after the processing of the sixth processing station 13f is completed, the substrate 12 to be processed is taken out from the unload chamber 22.

  According to such a substrate processing apparatus 11, in addition to the effect of shortening the time required for starting up to a processable state, for example, various conditions are set in the development and prototyping stages, and processing is performed in various processing orders. The effect can be obtained in any case.

  As described above in detail, according to the substrate processing apparatus 11 of the first embodiment, the following effects can be obtained.

  (1) According to the first embodiment, since the substrate transfer chamber 14 and each of the chambers 15a to 15f are connected so as to communicate with each other, when the substrate processing apparatus 11 is started up, the substrate transfer chamber 14 is used as a reference. A plurality of chambers 15a to 15f can be connected at the same time, and the startup time can be shortened.

  (2) According to the first embodiment, since the transfer chamber 23 moves and transfers the substrate 12 to be processed to each of the chambers 15a to 15f, it is not necessary to arrange the chambers 15a to 15f in the processing order. If it is desired to add a process, it can be handled by simply connecting a new chamber 15 to the substrate transfer chamber 14. Moreover, since it can respond even if it does not stop work except the chamber 15 to connect, it can suppress that productivity falls. Furthermore, if it is desired to change the process order, it can be dealt with only by changing the transfer order of the transfer chamber 23, so that it can be handled without adversely affecting the other chambers 15, and productivity can be improved. it can.

  (3) According to the first embodiment, since the substrate transfer chamber 14 is in an atmosphere with a high degree of cleanliness, even when the transfer chamber 23 moves or comes into close contact with the gate valve 21 of each chamber 15, the gate The valves 21 and 26 can be kept clean. Therefore, it is possible to prevent impurities from entering the substrate processing apparatus 11 and the like.

(Second Embodiment)
FIG. 2 is a schematic plan view showing the configuration of the substrate processing apparatus of the second embodiment. Hereinafter, the configuration of the substrate processing apparatus of the second embodiment will be described with reference to FIG. The substrate processing apparatus of the second embodiment is different from that of the first embodiment in a portion in which adjacent chambers are directly connected by a substrate transfer path. In addition, the same code | symbol is attached | subjected to the same structural member as 1st Embodiment, and those description is abbreviate | omitted or simplified here.

  As shown in FIG. 2, the substrate processing apparatus 31 includes a first processing station 13a to a sixth processing station 13f as in the first embodiment.

  The second processing station 13 b includes a second chamber 15 b formed in a regular octagonal planar shape having eight sides 20. A substrate transport path 32 capable of directly transporting the substrate 12 to be processed from the second processing station 13b to the fourth processing station 13d is connected to one side 20 of the eight sides 20.

  Similarly, in the fourth processing station 13d, a substrate transport path 32 is connected to one of the eight sides 20.

  A gate valve (not shown) is provided on the side 20 connected to the substrate transport path 32. By changing the gate valve from the closed state to the open state, the substrate 12 to be processed can be directly transferred from the second chamber 15b to the fourth chamber 15d.

  Thus, although the substrate transfer path 32 is provided, it varies depending on the contents of the processing. For example, when the substrate 12 to be processed is loaded into the second chamber 15b, the transfer chamber 23 is used and the second chamber is used. When the substrate 12 to be processed is carried out from 15b to the fourth chamber 15d, the substrate transfer path 32 may be used, for example, so that the transfer path of the substrate 12 to be processed can be unidirectional. Therefore, the substrate to be processed 12 different from the substrate to be processed 12 being conveyed in the substrate conveyance path 32 can be conveyed to the other chamber 15 by the conveyance chamber 23. Further, depending on the contents of processing, an unload chamber 33 may be installed in the fourth chamber 15d, and the substrate 12 to be processed may be directly carried out of the unload chamber 33 to the outside.

  As described above in detail, according to the substrate processing apparatus 31 of the second embodiment, the following effects can be obtained in addition to the effects (1) to (3) of the first embodiment.

  (4) According to the second embodiment, the substrate transfer path 32 is connected so that the substrate to be processed 12 can be directly transferred from the second chamber 15 b to the fourth chamber 15 d by the substrate transfer path 32. Compared with transport, it can be transported faster. When a plurality of substrates to be processed 12 are processed, the conveyance time of each substrate to be processed 12 can be shortened by using the substrate conveyance path 32 and the conveyance chamber 23 together for conveyance. .

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the planar shape of each of the chambers 15a to 15f is a regular octagon. However, the present invention is not limited to this. For example, an octagon having a shape in which two opposing side portions 20 are partially extended may be used. , Hexagons, squares, or rounds.

(Modification 2)
As described above, the substrate processing apparatus 11 is not limited to processing in a vacuum atmosphere, and may be applied to processing in a nitrogen atmosphere, for example. In this case, the atmosphere in the transfer chamber 23 is preferably the same nitrogen atmosphere as the atmosphere in the processing chamber 16. Further, the substrate processing apparatus 11 may be configured to include both processing in a vacuum atmosphere and processing in a nitrogen atmosphere. In this case, for example, it is preferable to provide a chamber for replacing the vacuum atmosphere and the nitrogen atmosphere in the substrate processing apparatus 11.

(Modification 3)
As described above, the processing is not limited to sequentially performing processing from the first processing station 13a to the sixth processing station 13f. For example, after the processing of the first processing station 13a is completed, the processing of the sixth processing station 13f is performed. You may do it. Further, the processing may be performed in the reverse direction from the sixth processing station 13f to the first processing station 13a.

(Modification 4)
As described above, the number of substrates to be processed 12 processed in the substrate processing apparatus 11 is not limited to one, and a plurality of substrates to be processed 12 may be processed simultaneously. In this case, the substrate 12 to be processed is loaded from the load chamber 19 as needed. In consideration of productivity, it is preferable to select whether to process only one sheet or a plurality of sheets.

(Modification 5)
As described above, moving the transfer chamber 23 to a predetermined position is not limited to sliding the concave transfer base 24 on the convex transfer guide 25, and moving the transfer chamber 23 by any other method. You may do it.

(Modification 6)
As described above, the gate valve 21 is not limited to being directly provided on one of the side portions 20, and for example, the side portion 20 and the substrate transfer chamber 14 may be connected via a bellows-like transfer path. Good. According to this, since the bellows-like transport path has flexibility, even if the arrangement positions of the respective chambers 15 are deviated from the substrate transport chamber 14, it can be hermetically connected. In addition, the substrate transfer chamber 14 and each chamber 15 can be quickly connected.

(Modification 7)
As in the second embodiment, the substrate transport path 32 is not used to transport the substrate 12 to be processed in one direction from the second chamber 15b to the fourth chamber 15d. You may make it carry back and forth. Alternatively, the other chambers 15 may be directly connected by the substrate transport path 32.

(Modification 8)
As described above, the vacuum pump 27 is provided on the transfer base 24 in order to make the inside of the transfer chamber 23 a vacuum atmosphere. However, the vacuum pump 27 may not be provided if each chamber 15 has a low vacuum.

1 is a schematic plan view showing a configuration of a substrate processing apparatus according to a first embodiment. The schematic plan view which shows the structure of the substrate processing apparatus which concerns on 2nd Embodiment. The schematic plan view which shows the structure of the conventional substrate processing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Substrate processing apparatus, 12 ... Substrate to be processed, 13 ... Processing station, 13a ... First processing station, 13b ... Second processing station, 13c ... Third processing station, 13d ... Fourth processing station, 13e ... Fifth processing Station, 13f ... Sixth processing station, 14 ... Substrate transfer chamber, 15 ... Chamber as a fixed chamber, 15a ... First chamber, 15b ... Second chamber, 15c ... Third chamber, 15d ... Fourth chamber, 15e ... First 5 chamber, 15f ... 6th chamber, 16 ... processing chamber, 17 ... substrate transfer robot, 18 ... arm, 19 ... load chamber, 20 ... side, 21 ... gate valve, 22 ... unload chamber, 23 ... transfer chamber, 24 ... Transport base, 25 ... Transport guide as transport rail, 26 ... Gate valve, 27 ... Vacuum pump, 3 ... substrate processing apparatus, 32 ... substrate transport path, 33 ... unload chamber.

Claims (8)

A plurality of fixed chambers adjusted to an atmosphere different from the atmosphere;
A transfer chamber having a transfer chamber that is adjusted to an atmosphere different from the atmosphere and moves to a position where the substrate to be processed can be transferred to the fixed chamber;
The plurality of fixed chambers are characterized in that a processing chamber for processing the substrate to be processed is disposed around the fixed chamber, and a part of the periphery is connected to be able to communicate with the transfer chamber. Substrate processing apparatus. The substrate processing apparatus according to claim 1,
The fixed chamber is connected to the transfer chamber via a first gate valve so as to be able to communicate with the transfer chamber, and is connected to the transfer chamber via the first gate valve and a second gate valve provided in the transfer chamber. A substrate processing apparatus which is connected so as to be able to communicate. The substrate processing apparatus according to claim 1 or 2, wherein
The substrate processing apparatus, wherein the fixed chamber has side portions that are continuous with an inner angle, and one side portion of the side portions is connected to the transfer chamber. A substrate processing apparatus according to any one of claims 1 to 3,
At least two fixed chambers among the plurality of fixed chambers are connected by a transfer path capable of transferring the substrate to be processed to the fixed chambers. A substrate processing apparatus according to any one of claims 1 to 4,
The transfer chamber is formed in a rectangular shape,
The substrate processing apparatus, wherein the transfer chamber is provided so as to be capable of reciprocating along a long side direction of the transfer chamber. A substrate processing apparatus according to any one of claims 2 to 5,
The substrate processing apparatus, wherein the transfer chamber is rotatably provided so that the second gate valve provided in the transfer chamber faces a direction of the fixed chamber. A substrate processing apparatus according to any one of claims 1 to 6,
The substrate processing apparatus, wherein the transfer chamber moves along a transfer rail provided in the transfer chamber. A substrate processing apparatus according to any one of claims 1 to 7,
At least one fixed chamber among the plurality of fixed chambers is adjusted to an atmosphere different from the atmosphere.

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