JP2009079243A - Partial plating method and apparatus therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To plate only a required part of an article to be plated, with a simple process at a high speed. <P>SOLUTION: This plating method includes: making a plating solution 40 adhere to a peripheral part of a rotary plate 3 to be rotationally driven, by bringing a part of the rotary plate 3 in contact with the plating solution 40; and electroplating the part 11, which is desired to be plated, of the article 1 to be plated, by bringing the plating solution 40 adhering to the perimeter of the rotary plate 3 in contact with the part 11 to be plated, when the peripheral part of the rotary plate 3 passes the vicinity of the part 11, which is desired to be plated, of the article 1 to be plated. The plating method can plate only the desired part to be plated by bringing the plating solution in contact with the part to be plated through the rotary plate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a partial plating method and apparatus for plating only a part of an object to be plated.

  Brush plating methods and sparger plating methods are known as plating methods for plating only a part of the object to be plated. Among these, attention is focused on the point of partial plating, which is disclosed in Patent Document 2 in the former and Patent Document 1 in the latter.

  However, as shown in FIG. 4, for example, the terminals 1 whose contact portions 11 and 11 are the opposite shoulder portions are arranged at a narrow pitch such as 0.4 mm pitch in the direction orthogonal to the drawing sheet. In the case of a hoop material for a connector, it is not possible to perform plating (gold plating) only on the contact portion 11 by the sparger plating method.

In the brush plating method, by matching the shape of the member corresponding to the brush (brush) with the shape of the terminal 1, it is possible to plate (gold plating) only on the contact portion 11 as shown in FIG. However, it is difficult to uniformly plate each terminal supplied in the state of a hoop material, and it is difficult to increase the number of treatments per unit time.
JP 2000-345385 A JP-A-5-132895

  The present invention was invented in view of the above-described conventional problems, and provides a partial plating method and apparatus capable of simply and rapidly performing plating only on a necessary portion. It is to be an issue.

  In order to solve the above-described problems, a partial plating method according to the present invention is a method in which a part of a rotating plate that is driven to rotate is brought into contact with a plating solution, and the plating solution is attached to the peripheral portion of the rotating plate. The electroplating is performed by bringing the plating solution adhering to the periphery of the rotating plate into contact with the portion to be plated on the object to be plated when the peripheral portion of the rotating plate passes in the vicinity of the portion to be plated. Have. Plating can be performed by bringing a plating solution into contact only with a portion where plating is desired by the rotating plate.

  The partial plating apparatus according to the present invention includes a holding body for holding an object to be plated, a rotating plate whose peripheral portion passes in the vicinity of a portion to be plated in the object to be plated held by the holding body, and the rotating plate. And a plating solution supply means for bringing the plating solution into contact with the peripheral edge of the substrate. Here, the plating solution supply means may be a plating solution tank in which the periphery of the rotating plate is immersed.

  And it is a terminal which has the contact part which the to-be-plated objects are connected to each other and facing each other, and the rotating plate has a single rotation when the peripheral part passes between the contact parts facing each other. A plating solution can be simultaneously brought into contact with a pair of contact portions opposed by a plate.

  According to the present invention, since the plating solution adhered to the peripheral portion of the rotating plate comes into contact with the portion where plating is desired to be plated, it is possible to perform plating only at a required portion, In addition to being able to perform many treatments in a short time, it is practically only necessary to provide a rotating plate in terms of equipment.

  Hereinafter, the present invention will be described based on an embodiment shown in the accompanying drawings. FIG. 3 shows a terminal 1 which is an object to be plated, and the connector for a connector having contact portions 11 and 11 as opposed shoulder portions. The terminal 1 is plated on the contact portion 11 in the state of a hoop material in which a large number are arranged at a narrow pitch such as 0.4 mm pitch. In the figure, reference numeral 12 denotes a spring elastic piece connecting the opposing contact portions 11, 11, 13 denotes a fixed piece that extends from one contact portion 11 side and is fixed to a connector body (not shown), etc. Is a connection piece for external connection further extended from the fixed piece 13. The connection piece 14 protrudes outward from the connector body and is connected to a circuit pattern on the circuit board by soldering or the like.

  The connector terminals 1 are electrically connected and mechanically connected to each other when the contact portions of the corresponding connector terminals are fitted into the contact portions 11 and 11 and come into contact with the contact portions 11.

  The holding body 2 in FIGS. 1 and 2 holds the terminal 1 (hoop material), and the holding body 2 connects the end portions of the terminal 1 on the connection piece 14 side to each other to connect the hoop material. Hold the part you are trying to.

  On the other hand, a rotating plate 3 having a thickness of 0.2 mm is disposed above the plating solution tank 4 containing the plating solution 40. The rotating plate 3 whose center side is reinforced by the reinforcing plate 30 is rotated by driving by a motor 31 and, as shown in FIG. , 11 are disposed at positions that pass equidistantly. In addition, as the rotating plate 3, what consists of titanium, for example, and the surface of the peripheral part was roughened can be used suitably.

  Further, when the rotating plate 3 is rotated, the portion located below the peripheral portion is always immersed in the plating solution 40, so that the plating solution 40 is attached to the peripheral portion. The plating solution 40 adhering to the peripheral portion of the rotating plate 3 stays at the peripheral portion due to the centrifugal force generated by the rotation of the rotating plate 3, and both contacts when passing through the vicinity of the opposing contact portions 11, 11. The parts 11 and 11 are contacted.

  Since the plating solution 40 is brought into contact with only the contact portions 11 and 11, the electroplating to the terminal 1 is performed without plating other than the contact portions 11 and 11, and in the illustrated example. Can simultaneously perform plating on the opposing contact portions 11, 11. In addition, as shown in FIG. 3, the plating layer 10 formed on the contact portion 11 can be thicker on the facing surface facing the electrode 4 than on the back side of the contact portion 11.

  For this reason, the fixed piece 13 or the piece 12 is not plated, and if the fixed piece 13 has the plating layer 10, the fixed piece 13 is fixed when the connection piece 14 is soldered to the circuit pattern. Although the plating layer 10 on the piece 13 may cause the solder to scoop up and cause trouble, such a situation is not caused.

  In the illustrated example, the rotation axis of the rotating rotating plate 3 is inclined 45 degrees, but this angle is not limited at all. Further, in the illustrated example, the case where the object to be plated is a terminal having the contact portions 11 and 11 facing each other is shown. Can also be applied. Further, although the terminal 1 is for a connector, it is needless to say that the terminal 1 is not limited to this.

  Further, the holding body 2 has a shape that functions as a guide when the hoop material is fed reel-to-reel, and a shape that can feed the terminal 1 (hoop material) in an arc shape along the periphery of the rotating plate 3. Since continuous processing becomes possible, a high processing speed can be obtained.

It is a principal part enlarged view of an example of embodiment of this invention. It is a front view same as the above. It is a side view of the terminal plated by this invention. It is a side view of the terminal which performed the conventional plating process.

Explanation of symbols

1 Terminal 3 Rotating plate 11 Contact part

Claims (3)

  A part of the rotating plate that is driven to rotate is brought into contact with the plating solution so that the plating solution is attached to the peripheral portion of the rotating plate, and the peripheral portion of the rotating plate passes in the vicinity of the portion to be plated on the object to be plated. A partial plating method characterized in that electroplating is performed by bringing a plating solution adhering to the periphery of the rotating plate into contact with a portion of the workpiece to be plated.   A holding body for holding an object to be plated, a rotating plate whose peripheral part passes in the vicinity of a portion to be plated in the object to be plated held by the holding body, and plating in which a plating solution is brought into contact with the peripheral part of the rotating plate A partial plating apparatus comprising a liquid supply means.   A terminal having contact parts that are opposite to each other while the objects to be plated are connected to each other, and the rotating plate has a peripheral part that passes between the contact parts that face each other. 2. The partial plating apparatus according to 2.

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