JP2009076320A5 - - Google Patents

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Publication number
JP2009076320A5
JP2009076320A5 JP2007244210A JP2007244210A JP2009076320A5 JP 2009076320 A5 JP2009076320 A5 JP 2009076320A5 JP 2007244210 A JP2007244210 A JP 2007244210A JP 2007244210 A JP2007244210 A JP 2007244210A JP 2009076320 A5 JP2009076320 A5 JP 2009076320A5
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JP
Japan
Prior art keywords
laminated
bus bar
thermoelectric element
weight body
jig
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Pending
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JP2007244210A
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Japanese (ja)
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JP2009076320A (en
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Priority to JP2007244210A priority Critical patent/JP2009076320A/en
Priority claimed from JP2007244210A external-priority patent/JP2009076320A/en
Publication of JP2009076320A publication Critical patent/JP2009076320A/en
Publication of JP2009076320A5 publication Critical patent/JP2009076320A5/ja
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Claims (7)

金属板と絶縁材を重ね合わせて積層したバスバー積層部材(A)を用いて電子部品間を接続する積層バスバー回路板を製造するための積層バスバー回路板製造方法において、In a laminated bus bar circuit board manufacturing method for manufacturing a laminated bus bar circuit board that connects electronic components using a bus bar laminated member (A) in which a metal plate and an insulating material are laminated and laminated,
前記バスバー積層部材(A)を下部加圧冶具(17)に固定し、前記下部加圧冶具(17)の鉛直下方に下部剛性重量体(20)を設けると共に、前記下部加圧冶具(17)と前記下部剛性重量体(20)との間に下部熱電素子(18)と下部絶縁板(19)を配置してなる第1加圧装置を構成するものとし、  The bus bar laminated member (A) is fixed to the lower pressure jig (17), a lower rigid weight body (20) is provided vertically below the lower pressure jig (17), and the lower pressure jig (17). And a lower thermoelectric element (18) and a lower insulating plate (19) between the lower rigid weight body (20) and a first pressurizing device.
前記第1加圧装置と空隙を介して鉛直上方に上部加圧冶具(16)を固定し、前記上部加圧冶具(16)の鉛直上方に上部剛性重量体(13)を設けると共に、前記上部加圧冶具(16)と前記上部剛性重量体(13)との間に上部熱電素子(15)と上部絶縁板(14)とを配置してなる第2加圧装置を構成するものとし、  An upper pressure jig (16) is fixed vertically above the first pressure device and a gap, and an upper rigid weight body (13) is provided vertically above the upper pressure jig (16). A second pressurizing device comprising an upper thermoelectric element (15) and an upper insulating plate (14) disposed between the pressurizing jig (16) and the upper rigid weight body (13);
前記上部剛性重量体(13)と前記下部剛性重量体(20)の両端部を鉛直方向に向かってそれぞれ二つの支持棒(12)により支持し、  Both ends of the upper rigid weight body (13) and the lower rigid weight body (20) are supported by two support rods (12) in the vertical direction, respectively.
前記支持棒(12)の上端に荷重発生装置(11)を設け、  A load generator (11) is provided at the upper end of the support rod (12),
前記下部加圧治具(17)に固定された前記バスバー積層部材(A)に向かって、前記荷重発生装置(11)を用いることで前記上部加圧冶具(16)に圧力を加えながら積層固定し、  Lamination and fixing while applying pressure to the upper pressure jig (16) by using the load generator (11) toward the bus bar laminated member (A) fixed to the lower pressure jig (17). And
前記上部熱電素子(15)および前記下部熱電素子(18)により、該積層部材(A)に塗布又は付着させた接着剤を熱により溶解させ、該積層部材(A)を構成する金属と絶縁材を強固に接着するようにしたことを特徴とする積層バスバー回路板の製造方法。  The upper thermoelectric element (15) and the lower thermoelectric element (18) dissolve the adhesive applied or adhered to the laminated member (A) by heat, and the metal and the insulating material constituting the laminated member (A) A method of manufacturing a laminated bus bar circuit board, wherein the board is firmly bonded.
前記上部熱電素子(15)および前記下部熱電素子(18)に電流を通電することにより前記上部加圧冶具(16)および前記下部加圧治具(17)の温度を可変させながら、該積層部材(A)を最適に加圧積層を行うことを特徴とする請求項1記載の積層バスバー回路板の製造方法。The laminated member while changing the temperature of the upper pressurizing jig (16) and the lower pressurizing jig (17) by passing a current through the upper thermoelectric element (15) and the lower thermoelectric element (18). The method for producing a laminated bus bar circuit board according to claim 1, wherein (A) is optimally pressure laminated. 前記上部熱電素子(15)および前記下部熱電素子(18)の電流を可変することによって生じ前記上部加圧冶具(16)および前記下部加圧治具(17)の表面温度の状態を監視表示するようにしたことを特徴とする請求項1または2に記載の積層バスバー回路板の製造方法。The surface temperature of the upper pressurizing jig (16) and the lower pressurizing jig (17) generated by varying the current of the upper thermoelectric element (15) and the lower thermoelectric element (18) is monitored and displayed. The method for producing a laminated bus bar circuit board according to claim 1 or 2, wherein the method is made. 前記金属板の表面を導電性を有する金属でメッキすることを特徴とする請求項1〜3のいずれか1項に記載の積層バスバー回路板の製造方法。The method of manufacturing a laminated bus bar circuit board according to any one of claims 1 to 3, wherein the surface of the metal plate is plated with a conductive metal. 請求項1〜4のいずれか1項に記載の積層バスバー回路板の製造方法によって製造されたことを特徴とするバスバー。A bus bar manufactured by the method for manufacturing a laminated bus bar circuit board according to claim 1. 請求項5記載のバスバーを搭載したことを特徴とする電力変換装置。A power conversion device comprising the bus bar according to claim 5. 金属板と絶縁材を重ね合わせて積層したバスバー積層部材(A)を用いて電子部品間を接続する積層バスバー回路板を製造するための積層バスバー回路板製造装置において、In a laminated bus bar circuit board manufacturing apparatus for producing a laminated bus bar circuit board that connects electronic components using a bus bar laminated member (A) in which a metal plate and an insulating material are laminated and laminated,
前記バスバー積層部材(A)を固定した下部加圧冶具(17)と、前記下部加圧冶具(17)の鉛直下方に設けられた下部剛性重量体(20)と、前記下部加圧冶具(17)と前記下部剛性重量体(20)との間に配置されると共に、該積層部材に塗布又は付着させた接着剤を熱により溶解させ、金属と絶縁材を強固に接着するための下部熱電素子(18)と、前記下部熱電素子(18)を電気的に絶縁する下部絶縁板(19)と、を有する第1加圧装置と、  A lower pressure jig (17) to which the bus bar laminated member (A) is fixed, a lower rigid weight body (20) provided vertically below the lower pressure jig (17), and the lower pressure jig (17 ) And the lower rigid weight body (20), and the lower thermoelectric element for firmly bonding the metal and the insulating material by dissolving the adhesive applied or adhered to the laminated member by heat. A first pressurizing device having (18) and a lower insulating plate (19) for electrically insulating the lower thermoelectric element (18);
前記第1加圧装置と空隙を介して鉛直上方に配置された上部加圧冶具(16)と、前記上部加圧冶具(16)の鉛直上方に設けられた上部剛性重量体(13)と、前記上部加圧冶具(16)と前記上部剛性重量体(13)との間に配置されると共に、該積層部材(A)に塗布又は付着させた接着剤を熱により溶解させ、金属と絶縁材を強固に接着するための上部熱電素子(15)と、前記下部熱電素子(15)を電気的に絶縁する上部絶縁板(14)と、を有する第2加圧装置と、  An upper pressure jig (16) arranged vertically above the first pressure device and a gap; an upper rigid weight body (13) provided vertically above the upper pressure jig (16); A metal and an insulating material are disposed between the upper pressure jig (16) and the upper rigid weight body (13), and the adhesive applied or adhered to the laminated member (A) is melted by heat. A second pressurizing device having an upper thermoelectric element (15) for firmly bonding the upper thermoelectric element and an upper insulating plate (14) for electrically insulating the lower thermoelectric element (15);
前記上部剛性重量体(13)と前記下部剛性重量体(20)の両端部を鉛直方向に向かってそれぞれ支持するための二つの支持棒(12)と、  Two support rods (12) for supporting both ends of the upper rigid weight body (13) and the lower rigid weight body (20) in the vertical direction;
前記支持棒(12)の上端に設けられると共に、上方より前記上部剛性重量体(13)に向かって荷重を加える荷重発生装置(11)と、  A load generator (11) provided at the upper end of the support rod (12) and applying a load from above toward the upper rigid weight body (13);
を備えたことを特徴とする積層バスバー回路板の製造装置。An apparatus for manufacturing a laminated bus bar circuit board, comprising:
JP2007244210A 2007-09-20 2007-09-20 Apparatus and method for manufacturing laminated bus bar circuit boards, bus bars and power converter manufactured by them Pending JP2009076320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244210A JP2009076320A (en) 2007-09-20 2007-09-20 Apparatus and method for manufacturing laminated bus bar circuit boards, bus bars and power converter manufactured by them

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244210A JP2009076320A (en) 2007-09-20 2007-09-20 Apparatus and method for manufacturing laminated bus bar circuit boards, bus bars and power converter manufactured by them

Publications (2)

Publication Number Publication Date
JP2009076320A JP2009076320A (en) 2009-04-09
JP2009076320A5 true JP2009076320A5 (en) 2011-11-10

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1194301B (en) * 1983-07-06 1988-09-14 Mecondor Spa METHOD FOR HIGH CAPACITY MANUFACTURING WITH ELECTRICAL CONNECTIONS OBTAINED FOR WELDING, AND RELATED BARS PRODUCED ACCORDING TO THIS METHOD
JPS6052664U (en) * 1983-09-20 1985-04-13 日本メクトロン株式会社 Power supply busbar for circuit board
JPH01133618A (en) * 1987-11-19 1989-05-25 Tokyo Seat Kk Pressurized air forming method and device used therefor
JPH1021747A (en) * 1996-07-01 1998-01-23 Hino Kogyo Kk Bus-bar and manufacture of bus-bar
JPH1177685A (en) * 1997-09-11 1999-03-23 Hitachi Ltd Method for curing molding
JP4043640B2 (en) * 1999-04-09 2008-02-06 古河電気工業株式会社 Laminated bus bar and manufacturing method thereof
JP2006031959A (en) * 2004-07-12 2006-02-02 Nissan Motor Co Ltd Bus bar

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