JPH1021747A - Bus-bar and manufacture of bus-bar - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify joining, to allow free design of a circuit, and to contemplate integration, by fixing a chip by a load normal to a vibration plane when a terminal member sandwiched by the chip is pressurized in a standing state and supersonically joined to a bus-bar proper. SOLUTION: A supersonic joining device 10 is equipped with a chip 17 attached integrally to a tip end of a lateral vibration bar 14 and an anvil 23 disposed thereunder at predetermined intervals. Further, pressurizing is conducted by a pressurizing means 16 via a rigid weight body 15 mounted on the upper end of the bar 14. A lower part 17c of the chip 17 comprises a cylindrical body having a slit 17D whose lower end is opened, and a terminal member A having a shape of a tab, etc., is inserted therein and attached thereto. Further, the chip 17, when it is supersonically vibrated via a horn 13, is fastened by a load from a load generation part 20 which is applied normal to a vibration plane via the rigid weight body 19 and a flexible vibration member 18. Meanwhile, the member A is caused to butt into and abut with a bus-bar proper B placed on the anvil 23, downward force being exerted thereon, and supersonic joining is conducted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a bus bar constituting a bus bar circuit board which is an internal circuit of an electrical junction box (junction box) accommodating a fuse or the like used for wiring of an electric circuit of an automobile, and the manufacturing thereof. Bus bar using the method.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 16, a bus bar circuit board 200 constituting an internal circuit of an electric junction box includes a plurality of bus bars 202 and a wiring board 204 provided with grooves for disposing the bus bars. Consisting of
6 are stacked and housed inside. in this case,
As shown in FIG. 17, the bus bar 202 is formed by punching a conductive metal thin plate based on a predesigned pattern and, if necessary, forming a terminal portion 203 to be an electric terminal such as a tab-shaped terminal or a receptacle terminal. The bus bar is configured to stand upright by being bent upward or downward.

[0003]

By the way, in the method in which the bus bar is formed by punching and the terminal portion is erected by bending (raising) the terminal portion, the terminal portion must be provided in an expanded state. ,
A circuit cannot be provided in that portion (the hatched portion C in FIG. 17), so that a detour circuit must be provided, so that the circuit cannot be integrated, and the electric connection box itself has become large.

In addition, when a terminal portion is bent as in the prior art, it is difficult to provide a plurality of terminal portions at a narrow interval. Was supposed to be. Furthermore, in the case where the thickness of the bus bar body and the terminal portion has to be changed, in the conventional bending and erecting method, a specific portion of the terminal portion must be bulged to secure the thickness. Had to go through a complicated process.

In the case where the bus bar is plated with a metal having conductivity, the conventional method requires plating the entire bus bar including the terminal portion, and particularly requires plating only the terminal portion which is a contact portion. In some cases, it was uneconomic.

In view of such a situation, the present inventor has conducted intensive studies. As a result, if the bus bar main body and the terminal portion are formed of different members, and the terminal portion is joined to the bus bar main body in an upright state, the bus bar can be formed. We focused on the fact that circuits can be freely taken. By the way, as such a joining method, an ultrasonic joining method is conventionally known. As the ultrasonic joining method, as shown in FIG. 18, two members to be joined are placed on an anvil 113. The members to be joined B are fixed on the anvil 113 by being placed on top of each other, and the pressing means 10 is pressed from above.
From No. 6, the other member A to be joined fixed to the chip 107 is vibrated in the direction of the arrow while being pressed against the member B to be joined by the frictional heat via the chip 107 (welding).
How to

However, in such a method, flat metal plates can be overlapped and joined together. However, in order to butt join the terminal members to the bus bar body in an upright state, the terminal members may be formed into an L shape, Since a terminal member must be fixed to the chip 107 by providing a flange or the like and pressed against the bus bar body fixed on the anvil 113 to perform ultrasonic bonding, it is not practically suitable due to the shape of the terminal member. It is.

For this reason, although not shown, the structure of the chip 107 is composed of a chip main body and a substantially semicircular pressing member separated from the chip main body, and a terminal member is sandwiched between the chip main body and the pressing member. A so-called screw fastening type in which fastening is performed by a plurality of screws penetrating the holding member is considered. However, in this method, the ultrasonic vibration also acts on the screw portion at the time of ultrasonic bonding, and the screwed portion of the screw and the screw hole is welded, or the screwed portion is extremely worn or loosened. Therefore, it was difficult to perform ultrasonic bonding.

In view of the above situation, according to the present invention, when a terminal member is erected on a bus bar main body, ultrasonic bonding can be easily and surely performed, and the position of the terminal portion is affected. It is an object of the present invention to provide a bus bar manufacturing method and a bus bar using the manufacturing method, in which the circuit design is free, the circuit can be integrated, and the electric junction box can be made compact.

[0010]

DISCLOSURE OF THE INVENTION The present invention has been made to achieve the above-mentioned problems and objects in the prior art, and the method of manufacturing a bus bar according to the present invention comprises a method of manufacturing a tab, a receptacle or the like. A method of manufacturing a bus bar in which a terminal member is butt-joined to a bus bar main body in an upright state, wherein the bus bar main body is fixed on an anvil, the terminal member is sandwiched between chips, and the terminal is connected to the bus bar main body. While the members are butted, the bus bar body and the terminal member are ultrasonically vibrated in a state where the chip is pressurized between the chip and the anvil. In the direction perpendicular to the direction, and in the direction facing each other, by applying a load to the chip, by ultrasonic bonding method that continues to fix the terminal member to the chip, A method for producing a bus bar, characterized in that the butt joining the serial terminal member to the bus bar body in a standing state.

According to such a bus bar manufacturing method,
The terminal member to be joined is held between the chip and fixed to the chip itself, and a load is applied in a direction perpendicular to the ultrasonic vibration direction surface and in a direction opposite to the chip. Can be fixed so as to sandwich the terminal member fixed to the terminal. Accordingly, by applying ultrasonic vibration to the chip in this state, that is, to the terminal member on the chip side, the terminal member can be butt-joined to the bus bar body on the anvil in an upright state.

Further, the bus bar of the present invention is characterized in that the terminal member is joined to the bus bar main body in an upright state by ultrasonic bonding according to such a bus bar manufacturing method.

By doing so, conventionally,
In the case where a standing portion is formed by punching and bending a terminal portion, a circuit cannot be formed at a position which becomes a terminal portion in an unfolded state. A circuit can be provided, the circuit can be integrated, and the electric junction box can be made compact.

[0014]

Further, the method of manufacturing a bus bar according to the present invention is characterized in that, during the above-described ultrasonic vibration, the chip is attached to the chip in a direction perpendicular to the ultrasonic vibration direction surface and in a direction facing each other. The means for applying a load is a means for applying a load to the chip via a flexural vibration member.

By doing so, the ultrasonic vibration of the chip is substantially attenuated by the bending vibration member, and the load generating portion is protected, so that the load of the load generating portion is applied to the chip even during the ultrasonic vibration of the chip. It is possible to operate and keep the terminal member fastened and fixed to the chip. In addition, since the direction of the load applied to the chip is orthogonal to the direction of the chip that vibrates ultrasonically, the ultrasonic vibration of the chip is not hindered. The pressing force and the ultrasonic vibration are efficiently transmitted, and the terminal member and the bus bar main body can be reliably subjected to ultrasonic joining.

In this case, the terminal member whose surface is plated with a conductive metal can be used. In this case, only the terminal member needs to be metal-plated. is there. In addition, when the metal plating can be made to be tin suitable as a contact member, and the joining surface of the terminal member is cut and tin-plated by using a tin-plated surface other than the joining surface, In this case, the base metal of the terminal member that is difficult to be joined to the bus bar main body is exposed at the joint surface, so that even the tin-plated terminal member can be ultrasonically joined.

[0017] Further, by making the joining surface of the terminal member have an inclined surface, the joining area is gradually increased when joining with the bus bar main body, so that joining can be made easier by ultrasonic joining.

Further, the bus bar of the present invention basically has a terminal member joined to the bus bar body in an upright state by an ultrasonic joining method using such an ultrasonic joining device. Various configurations such as the following, which were impossible with the raising method, are now possible.
This increases the degree of freedom in circuit design and makes the electrical junction box compact.

That is, it is possible to join the terminal members to both surfaces of the bus bar body, or to join the terminal members to the same position on both surfaces of the bus bar body. In addition, it is also possible to join a plurality of terminal members to the bus bar body in a continuous state,
It is also possible to join a plurality of terminal members to the bus bar body in a state of being connected in parallel. Further, the terminal members can be joined at an inclined angle to the longitudinal direction of the bus bar main body, or the thickness of the terminal member can be configured to be different from the thickness of the bus bar main body.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic front view showing one embodiment of an ultrasonic bonding apparatus for carrying out the method of manufacturing a bus bar of the present invention, FIG. 2 is a right side view of the ultrasonic bonding apparatus of FIG. 1, and FIG. It is a perspective view showing one example of a bus bar manufactured by a manufacturing method of a bus bar of the present invention.

In FIGS. 1 and 2, reference numeral 10 indicates an ultrasonic bonding apparatus 10 as a whole. Ultrasonic welding device 10
The ultrasonic transmitter 11, the ultrasonic transducer 12 connected to the ultrasonic transmitter 11, the horn 13 coupled to one end face of the ultrasonic transducer 12, and the upper and lower surfaces of the tip of the horn 13 A lateral vibrating rod 14 fixed vertically, and a tip 17 integrally attached to the tip of the lateral vibrating rod 14
And an anvil 23 provided below and separated from the chip 17 by a predetermined distance. In addition, a rigid weight body 15 is attached to the upper end of the upper lateral vibration rod 14,
Pressurizing means 16 for applying a pressing force from above through the rigid weight body 15 is provided.

The chip 17 is formed of a cylindrical body having a lower portion 17C having an open lower end, and a vertical slit 1 having an open lower end.
7D, and the tab member 34 that is joined to the member A to be joined, for example, the bus bar body 32 of the bus bar 30 shown in FIG. 3 in an upright state, is tightened while being inserted into the lower portion 17C of the chip 17. It can be fixed.

The tip 17 ultrasonically vibrates in the direction of the arrow through the horn 13, and the bending vibration member 18, the rigid weight body 19, and the load generating section 20 are moved in a direction perpendicular to the vibration direction plane. In this order, the load generating unit 2
The load generated at 0 is transmitted to the chip 17 via the rigid weight body 19 and the flexural vibration member 18 to fasten the chip 17, and the tab member 34 can be fastened and fixed to the chip 17.

On the other hand, another member B to be joined, for example, the bus bar body 32 of the bus bar 30 shown in FIG. 3 is placed and held on the anvil 23, and the member A to be joined is placed on the member B to be joined. The ultrasonic welding can be performed by applying a downward pressing force in a state where they are brought into contact with each other.

According to such an ultrasonic bonding apparatus, the member A to be bonded on the tip 17 is brought into contact with the member B to be bonded on the anvil 23, and the ultrasonic wave is transmitted while being pressed through the pressing means 16. The chips 17 are ultrasonically vibrated through the vessel 11 to join both the members A and B to be joined. On this occasion,
The ultrasonic vibration of the tip 17 is substantially attenuated by the bending vibration member, is cut off by the rigid weight body 19, and is not transmitted to the load generating unit 20, so that the load generating unit 20 is protected. Therefore, even during the ultrasonic vibration of the chip 17, the load of the load generating portion 20 acts on the chip, and the member A to be joined is continuously tightened and fixed to the chip 17. Also, since the direction of the load applied to the chip 17 is orthogonal to the direction of the chip that vibrates ultrasonically, the ultrasonic vibration of the chip 17 is not hindered.
The downward pressing force and ultrasonic vibration required for joining are efficiently transmitted to the joined member A on the tip 17 side, and the joined ultrasonic joining of the joined members A and B is reliably achieved.

The bus bar according to the present application basically connects the terminal member to the bus bar body in an upright state by an ultrasonic bonding method using such an ultrasonic bonding apparatus. By the way, as shown in FIG. 3, the bus bar 30 according to the first embodiment of the present invention has a bus bar main body 32 that forms an electric circuit according to a predetermined circuit pattern in a flat plate shape.
And a tab member 34 as a terminal member joined to the upper surface 32A of the bus bar main body 32 in an upright state in parallel with the longitudinal direction of the bus bar 32. As described above, the tab member 34 is formed on the upper surface 32 of the bus bar main body 32 by the ultrasonic bonding method using the ultrasonic bonding apparatus.
It is joined to A.

By doing so, conventionally,
In the case where an upright portion is formed by punching and bending the terminal portion, a circuit could not be formed at a position to be the terminal portion in the unfolded state. However, as shown in FIG. Even in the vicinity of the position, the circuit 36 using the bus bar 32 can be provided, so that the circuit can be integrated and the electric junction box can be made compact.
In addition, since the circuit configuration can be freely taken in this way, there is no restriction on the design, and it is difficult to use the conventional bending and raising router (automatic wiring software)
Allows design.

In this embodiment, the tab member 34 is used as the terminal member. However, the terminal member is not limited to this. For example, in addition to the receptacle as shown in FIG. Although not shown, it can be used for various terminal members such as a tab with a crocodile, a receptacle with a crocodile, and a positioning tab, and is not particularly limited. In addition, it has been conventionally difficult to change the thickness of the tab member and the bus bar main body. However, in the case of joining using the ultrasonic bonding as in the present embodiment, the thickness of the bus bar main body and the terminal member is changed. It is also possible. Further, the bus bar body and the terminal member can be joined to each other even if they are of the same kind of metal or different metals.

Furthermore, it is difficult to plate only the terminal portion with a conductive metal by the conventional punching and bending method. However, according to the present invention, a conductive metal only on the terminal member, for example, It is also possible to apply gold plating, tin plating, or the like. When tin plating is applied, the entirety of the tab member substrate 130 to which the tab members 134 are connected is tin-plated as shown in FIG. When cutting is performed, if the lower end 134A serving as the joining surface of the tab member is cut and used for ultrasonic joining, the base metal of the tab member 134 is exposed to the joining surface,
Ultrasonic bonding can be performed even with the tin-plated tab member 134.

As shown in FIGS. 11A and 11B, the joining surface 34A of the tab member 34 is inclined.
By cutting so as to have C and 34D and gradually increasing the joining area when joining with the bus bar main body, it is possible to more easily join by ultrasonic joining. Further, as shown in FIG.
It is preferable to provide a projecting portion 35 protruding outward in a trapezoidal shape in the vicinity of the joining surface 34A at the bottom of the joint to reinforce the joining portion when the projecting portion 35 performs ultrasonic joining. . The shape of the protruding portion is a trapezoidal shape 34.
In addition to E, a projecting portion having a corrugated shape 34F as shown in FIGS. 13 to 15 or a projecting portion having a U-shaped shape 34G and an L-shaped shape 34H may be used. In order to form the protruding portion in such a shape, it is also possible to form the chip in a shape corresponding to a trapezoidal shape or a wavy shape (FIGS. 12, 14, and 15).

The same applies to the following embodiments. FIG. 4 is a perspective view showing a second embodiment of the bus bar of the present invention. In this embodiment, the bus bar 4
0 is the busbar body 42 and the upper surface 4 of the busbar body 42
The tab member 44A is joined to the lower surface 42B of the bus bar main body 42 in an upright state, and the tab member 44B is joined to the lower surface 42B of the busbar body 42 in an upright state.

FIG. 5 is a perspective view showing a third embodiment of the bus bar of the present invention. In this embodiment, the bus bar 50
A bus bar body 52 and an upper surface 52 of the bus bar body 52;
A and a tab member 54B joined to the lower surface 52B of the bus bar main body 52 in the same position as the position where the upper tab member 54 is erected on the lower surface 52B of the bus bar body 52. Have been. Conventional punching,
In the bending and raising method, providing the terminal portions projecting in the vertical direction at the same position on the bus bar main body 52 as described above
Although it was difficult to provide such terminal portions in the unfolded state, it was difficult. However, according to ultrasonic bonding, such tab members 54A and 54B can be provided at the same position in the vertical direction. is there.

FIG. 6 is a perspective view showing a fourth embodiment of the bus bar of the present invention. In this embodiment, the bus bar 60
Is a bus bar main body 62 and an upper surface 62 of the bus bar main body 62.
A is composed of a plurality of tab members 64A, 64A which are erected and joined in a state where a plurality of tab members 64A are continuously provided at a predetermined interval. In the conventional punching and bending-up method, it is difficult to provide a plurality of terminal portions in a state of being connected to the bus bar main body 62 because a space for a circuit configuration is required. According to the joining, it is only necessary to join the tab members without affecting the circuit configuration at all. Therefore, it is easy to set up the tab members in such a continuous state. In this embodiment, a plurality of tab members 64A, 6A are provided only on the upper surface 62A of the bus bar main body 62.
Although 4A is provided upright, it is a matter of course that a plurality of tab members may be joined to the lower surface 62B of the bus bar body 62 in a continuous state.

FIG. 7 is a perspective view showing a fifth embodiment of the bus bar of the present invention. In this embodiment, the bus bar 70
Is provided on the upper surface 72A of the bus bar main body 72.
2 are constituted by a plurality of tab members 74A, 74A which are erected in a state of being continuously provided in a state of being separated from each other by a predetermined distance in the longitudinal direction and in parallel with each other (that is, in a direction crossing the bus bar main body). According to the conventional punching and bending-up method, it is structurally impossible to provide such a terminal portion in an unfolded state by providing a plurality of terminal portions in a state of being connected in parallel to the bus bar main body 72. However, according to the ultrasonic bonding, it is only necessary to simply join the tab members, and thus the tab members can be erected in parallel in a continuous state. In this embodiment, the upper surface 7 of the busbar body 72 is also used.
Although the plurality of tab members 74A, 74A are erected only on 2A, it is needless to say that the plurality of tab members may be joined to the lower surface 72B of the bus bar main body 72 in parallel and connected.
Further, in the present embodiment, a plurality of tab members are provided in parallel, that is, so as to cross the bus bar main body, but it is a matter of course that a single tab member may be the bus bar main body.

FIG. 8 is a perspective view showing a sixth embodiment of the bus bar of the present invention. In this embodiment, the bus bar 80
Is mounted on the upper surface 82A of the busbar body 82.
The tab member 8 has an inclination angle α with respect to the longitudinal direction of the tab member 8.
4A are joined in an upright state. According to the conventional punching and bending-up method, it is difficult to provide the terminal portion on the busbar main body 82 at an inclined angle with respect to the longitudinal direction of the busbar main body in terms of structure, but according to the ultrasonic bonding, Since it is only necessary to simply join the tab members, it is possible to stand upright at an inclination angle α with respect to the longitudinal direction of the bus bar body 82 in this way. In addition,
Also in this embodiment, a plurality of the tab members 84A may be provided in series.
Although only a single tab member 84A is erected on 2A, a single tab member or a plurality of tab members may be joined to the lower surface 82B of the bus bar main body 82 in parallel. Of course.

The above embodiment is merely an example, and one bus bar can be formed by freely combining the tab members described in the above embodiment, that is, the joining states of the terminal members. is there.

[0037]

According to the bus bar manufacturing method of the present invention,
A flexural vibration member, a rigid weight body, and a load generating section are provided in a direction perpendicular to the vibration direction of the ultrasonically vibrating chip, and the terminal member is fastened and fixed to the chip by using them. The bus bar body fixed to the anvil side can be fixed firmly and reliably during ultrasonic vibration without disturbing the ultrasonic vibration of the terminal member on the chip side. Pressure and ultrasonic vibration are efficiently transmitted, and when the terminal member is erected on the bus bar body, reliable and reliable ultrasonic bonding can be performed.

Therefore, according to the bus bar manufacturing method of the present invention and the bus bar using the manufacturing method, punching and bending are not required as in the prior art, so that there is no need to provide a detour circuit, and the terminal portion is not erected. Since the circuit design is free, such as the selection circuit and the matching circuit using the common circuit pattern, without being affected by the installation position, the circuit can be integrated and the electric junction box can be made compact. In addition, since the circuit configuration can be freely set in this way, it is possible to design with a router (auto CAD), which has been difficult to use with the conventional bending and raising, without any restrictions on the design.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing one embodiment of an ultrasonic bonding apparatus for carrying out a method of manufacturing a bus bar according to the present invention.

FIG. 2 is a right side view of the ultrasonic bonding apparatus of FIG.

FIG. 3 is a perspective view showing one embodiment of a bus bar manufactured by the bus bar manufacturing method of the present invention.

FIG. 4 is a perspective view showing a second embodiment of the bus bar of the present invention.

FIG. 5 is a perspective view showing a third embodiment of the bus bar of the present invention.

FIG. 6 is a perspective view showing a fourth embodiment of the bus bar of the present invention.

FIG. 7 is a perspective view showing a fifth embodiment of the bus bar of the present invention.

FIG. 8 is a perspective view showing a bus bar according to a sixth embodiment of the present invention.

FIG. 9 is a perspective view showing another embodiment of the terminal member.

FIG. 10 is a perspective view of a tab member substrate.

FIG. 11 is a front view of one embodiment of a tab member.

FIG. 12 is a side view of another embodiment of the tab member.

FIG. 13A is a perspective view of another embodiment of the tab member, and FIG. 13B is a top view in the DD direction.

FIG. 14 is a perspective view of another embodiment of the tab member.

FIG. 15 is a side view of another embodiment of the tab member.

FIG. 16 is a partially cutaway perspective view of a conventional electric junction box.

FIG. 17 is a perspective view of a conventional bus bar.

FIG. 18 is a schematic front view of a conventional ultrasonic bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Ultrasonic bonding apparatus 11 ... Ultrasonic transmitter 12 ... Ultrasonic vibrator 13 ... Horn 14 ... Transverse vibration bar 15 ... Rigid weight body 16 ... Pressurizing means DESCRIPTION OF SYMBOLS 17 ... Tip 18 ... Flexural vibration member 19 ... Rigid weight body 20 ... Load generating part 23 ... Anvil 30, 40, 50, 60, 70, 80 ... Bus bar 32, 42, 52, 62, 72, 82 ... busbar body 34 ... tab member

Claims (16)

[Claims] 1. A method of manufacturing a bus bar in which terminal members such as tabs and receptacles are butted and joined to a bus bar body in an upright state, wherein the bus bar body is fixed on an anvil and the terminal member is sandwiched between chips. Abutting the terminal member against the busbar main body, and ultrasonically vibrating the chip in a state where the busbar main body and the terminal member are pressed between the chip and the anvil; In this case, a load is applied to the chip in a direction perpendicular to the ultrasonic vibration direction surface and in a direction opposite to the ultrasonic vibration direction surface, and the terminal is formed by an ultrasonic bonding method that keeps the terminal member fixed to the chip. A method for manufacturing a bus bar, wherein a member is butt-joined to a bus bar body in an upright state. 2. A means for applying a load to the chip in a direction perpendicular to an ultrasonic vibration direction surface and in a direction opposite to each other at the time of the ultrasonic vibration; The method for producing a bus bar according to claim 1, wherein the means is a means for applying a load to the chip. 3. The method according to claim 1, wherein a surface of the terminal member is plated with a metal having conductivity. 4. The bus bar according to claim 3, wherein the plating metal is tin, and the surface other than the joint surface is tin-plated by cutting the joint surface of the terminal member. Manufacturing method. 5. The method for manufacturing a bus bar according to claim 1, wherein a joining surface of the terminal member is an inclined surface. 6. An ultrasonic bonding to a bus bar main body.
A bus bar characterized by joining terminal members in an upright state. 7. The bus bar according to claim 6, wherein the terminal members are joined to both surfaces of a bus bar main body. 8. The bus bar according to claim 7, wherein the terminal members are joined at the same position on both surfaces of the bus bar main body. 9. The bus bar according to claim 6, wherein a plurality of the terminal members are joined to the bus bar body in a continuous state. 10. The bus bar according to claim 9, wherein a plurality of the terminal members are joined to the bus bar body in a state of being connected in parallel. 11. The bus bar according to claim 5, wherein the terminal members are joined at an angle to the longitudinal direction of the bus bar main body. 12. The bus bar according to claim 5, wherein the thickness of the terminal member is different from the thickness of the bus bar body.
12. The bus bar according to any one of items 1 to 11. 13. The bus bar according to claim 5, wherein a surface of the terminal member is plated with a conductive metal. 14. The bus bar according to claim 13, wherein the plating metal is tin, and a surface other than a joint surface of the terminal member is plated with tin. 15. The bus bar according to claim 13, wherein the plating metal is tin, and a surface other than a joining surface of the terminal member is tin-plated. 16. The ultrasonic bonding method according to claim 1, wherein said ultrasonic bonding is performed by an ultrasonic bonding method.
The bus bar according to any of the above.