JP2016203251A - Metal joining method and metal joint structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metal joining method which involves simplified process.SOLUTION: At a normal temperature in ambient air, a joint object member 1 having a structure such that a joint material 4 is sandwiched between metallic members 2, 3 and elastic members 11, 12 which are located at upper and lower positions of the joint object member 1 are vertically pressurized by a pressing part 13 and a joint tool part 15 of a resonator 14, the joint tool 15 is resonated with sonic vibration or supersonic vibration which is transmitted from an oscillator 16 connected to one end of the resonator 14 and is moved in a cross direction, whereby an interface part between the metallic member 2 and the joint material 4 and an interface part between the metallic member 3 and the joint material 4 are diffused thereby forming an alloy. After the joint material 4 joins the metallic members 2, 3 with each other, vertical pressurization by the pressing part 13 and the resonator 14 is released, the joint object member 1 and the elastic members 11, 12 which became a metal joint structure are removed from between the pressing part 13 and the resonator 14, and the joint object member 1 and the elastic members 11, 12 are separated from each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a metal bonding method and a metal bonding structure capable of obtaining bonding strength such as brazing.

  With reference to FIG. 8, a method for joining the electrode portion of the circuit board and the electrode portion of the semiconductor device disclosed in the summary of Patent Document 1, paragraph 0036, and FIG. 2 will be described. As shown in FIG. 8, the pads 102 as the electrode portions of the circuit board 101 and the solder bumps 104 as the electrode portions of the semiconductor chip 103 as the semiconductor device are overlapped with each other, and the circuit board 101 and the semiconductor chip 103 are An ultrasonic gas is blown in between and ultrasonic vibration is applied to at least one of the circuit board 101 and the semiconductor chip 103 to temporarily bond the pad 102 and the solder bump 104 to each other, and then the solder bump 104 is reflowed to refill the pad. 102 and the solder bump 104 are bonded to each other.

  However, in the method disclosed in Patent Document 1, the pads 102 and the solder bumps 104 are temporarily joined to each other by ultrasonic vibration, and then the solder bumps 104 are reflowed with heat of 300 ° C. or more, so that the pads 102 and the solder bumps 104 are bonded. Since these are soldered to each other, it is not possible to obtain a bonding strength like brazing.

  FIG. 9 illustrates a case where a semiconductor device is die-bonded (fixed on a semiconductor chip) on a circuit board using the invention disclosed in Patent Document 1. As shown in FIG. 9, the fixing metal portion 112 provided on the front surface of the circuit board 111 and the fixing metal portion 114 provided on the back surface of the semiconductor device 113 are in the form of a sheet, film, or plate therebetween. Ultrasonic waves are applied to at least one of the circuit board 111 and the semiconductor device 113 while injecting an inert gas between the circuit board 111 and the semiconductor device 113 with the solder 115 configured in a solid shape interposed therebetween. After applying the vibration to temporarily fix the fixing metal portions 112 and 114 and the solder 115 to each other, the solder 115 is reflowed by heat of 300 ° C. or more to bond the fixing metal portions 112 and 114 and the solder 115 to each other. Then, the semiconductor device 113 is die-bonded on the circuit board 111.

  However, in the method described in FIG. 9, the fixing metal portions 112 and 114 and the solder 115 are temporarily joined to each other by ultrasonic vibration, and then the solder 115 is reflowed with heat of 300 ° C. or more to fix the fixing metal portions 112 and 114. Since 114 and solder 115 are bonded to each other, a bonding strength such as brazing cannot be obtained.

JP 2012-9909 A

  The present invention has been made in view of the above-described background art, and an object thereof is to provide a metal joining method capable of obtaining joining strength such as brazing.

  The present invention is a structure in which a bonding target member sandwiches a bonding material between a plurality of metal members, and elastic members are arranged on one or both of the upper and lower sides of the bonding target member. In a state in which the resonator is pressurized in the vertical direction, the resonator resonates with the sonic vibration or ultrasonic vibration transmitted from the vibrator attached to one end of the resonator, and in the transverse direction perpendicular to the pressurized direction. A plurality of metal members are bonded to each other with a bonding material by vibration.

  In the present invention, since the metal bonding material is diffused and alloyed to bond the plurality of metal members to each other, it is possible to obtain a bonding strength such as brazing at a joint portion between the plurality of metal members and the bonding material. In addition, it is possible to provide a metal bonding method and a metal bonding structure that do not require a gold layer on the bonding material side of the plurality of metal members.

The front view which showed the metal joining apparatus which concerns on the form 1 for implementing invention. The front view which showed the metal joining method which concerns on the form 2 for implementing invention. The front view which showed the metal joining method which concerns on the form 3 for implementing invention. The front view which showed the metal joining method which concerns on the form 4 for implementing invention. The front view which showed the metal joining method which concerns on the form 4 for implementing invention. The flowchart which showed the metal joining method which concerns on the form 5 for implementing invention. The front view which showed the metal joining apparatus which concerns on the form 6 for implementing invention. The front view which showed the metal joining apparatus which concerns on the form 7 for implementing invention. The schematic diagram which showed the metal joining method disclosed by patent document 1. FIG. The schematic diagram which showed another metal joining method using the metal joining method disclosed by patent document 1. FIG.

  With reference to FIG. 1 thru | or 4, the to-be-joined member 1 used for the metal joining method which concerns on the form 1 thru | or 4 for implementing invention is demonstrated.

  The joining target member 1 shown in FIG. 1 has a structure in which a metallic joining material 4 is sandwiched between a plurality of metal members 2 and 3.

  The member 1 to be joined shown in FIG. 2 has a metal member 2 constituting a part of an electric circuit provided on one surface as an upper surface of the circuit board 5 and an electric provided on one surface as a lower surface of the semiconductor device 6. The bonding material 4 is sandwiched between the metal member 3 constituting a part of the circuit, and the bonding material 4 is sandwiched between the plurality of metal members 2 and 3.

  3 has a structure in which a bonding material 4 is sandwiched between a plurality of metal members 2 and 3 and a metal bonding material 8 is sandwiched between a plurality of metal members 3 and 7. It has become.

  The joining target member 1 shown in FIG. 4 has a joining material 4 between a metal member 2 as a heat sink and a metal member 3 constituting a part of an electric circuit provided on one surface as a lower surface of the circuit board 5. A metal member 3 constituting a part of an electric circuit provided on one surface as an upper surface of the circuit board 5 and a metal member constituting a part of an electric circuit provided on one surface as a lower surface of the semiconductor device 6 7, the bonding material 8 is sandwiched between the plurality of metal members 2, 3, and the bonding material 8 is sandwiched between the plurality of metal members 3, 7. It has a structure. The circuit board 5 shown in FIG. 2 has a structure having the metal member 3 on one surface as an upper surface, whereas the circuit board 5 shown in FIG. 4 has a structure having the metal member 3 on two surfaces as upper and lower surfaces. It is different.

  The metal joining method according to Embodiments 1 and 2 for carrying out the invention shown in FIGS. 1 and 2 is an elastic member 11 disposed above and below the joining target member 1 and the joining target member 1 in a normal temperature state in the atmosphere. , 12 are pressed in the vertical direction by the pressurizing unit 13 and the joining tool unit 15 of the resonator 14, and the sound wave vibration transmitted from the vibrator 16 coupled to one end of the resonator 14 is connected to the joining tool unit 15. Or, by resonating with the ultrasonic vibration and vibrating in the lateral direction indicated by the arrow 17, intense free motion is generated in the atoms of the bonding material 4, and finally the atoms of the bonding material 4 are in an excited state and bonded to the metal member 2. Each of the interface portion between the metal member 4 and the interface portion between the metal member 3 and the bonding material 4 is diffused into an alloy, and the bonding material 4 melts to bond the metal members 2 and 3 together. Then, after the metal members 2 and 3 are bonded to each other with the bonding material 4, the pressurization by the pressurizing unit 13 is stopped, and the stopped state is maintained for about 0.1 to several seconds. Thereafter, the pressurization from the vertical direction by the pressurizing unit 13 and the resonator 14 is released, and the joining target member 1 and the elastic members 11 and 12 that are the metal joint structure are connected to the pressurizing unit 13 and the resonator 14. The member 1 to be joined and the elastic members 11 and 12 are separated from each other, and one joining operation to the member 1 to be joined is completed.

  3 and 4, the metal joining method according to embodiments 3 and 4 is an elastic member 11 disposed above and below the joining target member 1 and the joining target member 1 in a state of normal temperature in the atmosphere. , 12 are pressed in the vertical direction by the pressurizing unit 13 and the joining tool unit 15 of the resonator 14, and the sound wave vibration transmitted from the vibrator 16 coupled to one end of the resonator 14 is connected to the joining tool unit 15. Alternatively, by resonating with the ultrasonic vibration and vibrating in the lateral direction indicated by the arrow 17, intense free motion is generated in the atoms of the bonding material 4, and finally the atoms of the bonding materials 4 and 8 are excited and the metal member 2 is excited. The interface portion between the metal member 3 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 8, and the interface portion between the metal member 7 and the bonding material 8 are diffused. It becomes an alloy, and the bonding materials 4 and 8 melt and the metal members 2 and 3 Joining each between the metal member 3 and 7. Then, after the metal members 2 and 3 are bonded to each other with the bonding material 4 and the metal members 3 and 7 are bonded to each other with the bonding material 8, the pressurization by the pressure unit 13 is stopped, and the stopped state is 0.1. For about a few seconds. Thereafter, the pressurization from the vertical direction by the pressurizing unit 13 and the resonator 14 is released, and the joining target member 1 and the elastic members 11 and 12 that are the metal joint structure are connected to the pressurizing unit 13 and the resonator 14. The member 1 to be joined and the elastic members 11 and 12 are separated from each other, and one joining operation to the member 1 to be joined is completed. It should be noted that the elastic members 11 and 12 can be applied even if they are arranged on one of the upper and lower sides of the joining target member 1.

  In the metal bonding method shown in FIGS. 1 to 4, the elastic members 11 and 12 can be considered as elastic members for metal particle excitation sintering with respect to the bonding target member 1, and the elastic members 11 and 12 can be made of the same material as each other. The elastic members 11 and 12 can be applied even if they are arranged on the upper and lower sides of the joining target member 1, and the elastic member 11 can be applied from the joining target member 1 and the joining tool portion 15. Any of the separated configuration and the configuration in which the elastic member 11 is fixed to the joining target member 1 or the joining tool unit 15 can be applied, and the elastic member 12 is separated from the joining target member 1 and the pressurizing unit 13. Any configuration in which the elastic member 12 is fixed to the joining target member 1 or the pressure unit 13 is applicable.

  In the metal bonding method shown in FIGS. 1 to 4, the layer in which energy acting on the bonding is generated has a correlation between the pressure applied by the pressurizing unit 13 and the bonding tool unit 15 and the amplitude generated by the bonding tool unit 15. Determined by. Therefore, in the metal bonding method shown in FIGS. 1 to 4, the energy acting on the bonding is the interface portion between the metal member 2 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 4, the metal member 3 and the bonding material. 8, and the pressure applied by the pressurizing part 13 and the joining tool part 15 and the amplitude by the joining tool part 15 are controlled so as to concentrate on the interface part between the metal member 7 and the joining material 8. The interface portion between the metal member 2 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 8, and the interface portion between the metal member 7 and the bonding material 8. Each receives pressure and vibration energy and diffuses into an alloy, the metal members 2 and 3 are joined together by the joining material 4, and the metal members 3 and 7 are joined together by the joining material 8.

  In the metal bonding method shown in FIGS. 1 to 4, if sonic vibration is used, the metal member 3 of the block and the thick metal member 2 can be bonded. Bonding of mechanical structures is possible, and large-area bonding is possible, which is impossible with ultrasonic bonding.

  The metal members 2, 3, and 7 shown in FIGS. 1 to 4 are made of aluminum, copper, gold, silver, nickel, and other metals, aluminum, copper, A metal having a coating such as gold, silver, nickel, the same kind or different kinds of metals is also applicable. The shape of the metal members 2, 3, 7 is not limited to the plate shape as shown in FIGS. 1 to 4, and the parts to be joined are overlapped with each other and added via the elastic members 11, 12. Any shape that is sandwiched between the pressure part 13 and the welding tool part 15 is applicable. The portion where the pressurizing portion 13 and the joining tool portion 15 sandwich the portion where the metal members 2, 3 and 7 are overlapped is a portion where the metal members 2, 3 and 7 are overlapped even if the portion is a plane or a curved surface Any shape can be applied as long as the portion sandwiching the surface can be sandwiched in a planar shape.

  The circuit board 5 shown in FIGS. 2 and 4 is a DCB board in which a copper circuit is bonded to an alumina ceramic board by the DCB (Direct Copper Bond) method, but a DBA (Direct Bonded Aluminum) having an aluminum circuit on the surface of the ceramic board. Even a substrate can be applied to a flexible printed circuit (FPC) having electric wires on the surface of a synthetic resin member having flexibility and elasticity. When the circuit board is an FPC, since the synthetic resin member of the FPC functions as one of the elastic members 11 and 12, one of the elastic members 11 and 12 can be omitted. In FIG. 4, when a DCB substrate is used as the circuit board 5, a copper metal member 2 as a heat sink and a metal member 3 as a copper circuit on one surface side as a lower surface of the DCB substrate as the circuit board 5 A part of the electric circuit provided on one surface as the lower surface of the semiconductor member 6 and the metal member 3 as one surface side as the upper surface of the DCB substrate with the bonding material 4 having solder as a main component interposed therebetween A bonding material 8 composed mainly of solder is sandwiched between the metal member 7 made of nickel and the elastic member 11 disposed above and below the bonding target member 1. 12 is pressed in the vertical direction by the pressing unit 13 and the bonding tool unit 15 of the resonator 14, and the bonding tool unit 15 is subjected to the sound wave vibration transmitted from the vibrator 16 coupled to one end of the resonator 14. Resonate and indicated by arrow 17 Vibrate laterally, between metallic members 2, 3 are joined by bonding material 4, between the metal member 3 and 7 are joined by bonding material 4. Further, in FIG. 4, when a DBA substrate is used as the circuit substrate 5, tin is mainly used between the metal member 2 made of copper plate and the metal member 3 as an aluminum circuit provided on one surface as the lower surface of the DBA substrate. A bonding material 8 mainly composed of tin is interposed between a metal member 3 as an aluminum circuit provided on one surface as an upper surface of the DBA substrate and a metal member 7 made of a copper plate with the bonding material 4 as a component interposed therebetween. The member 1 to be sandwiched and the elastic members 11 and 12 arranged above and below the member 1 to be joined are pressed by the pressurizing unit 13 and the joining tool unit 15 of the resonator 14 in the vertical direction. Then, the joining tool portion 15 resonates with the sound wave vibration transmitted from the vibrator 16 coupled to one end portion of the resonator 14 and vibrates in the lateral direction indicated by the arrow 17, and the joining member 4 is connected between the metal members 2 and 3. The metal members 3 and 7 are joined They are joined in wood 4. A terminal called a bus bar is connected to the surface of one metal member 7 made of a copper plate joined to the DBA substrate, without using the elastic members 11 and 12 in the metal joining device 21 shown in FIGS. Are joined together.

  The bonding materials 4 and 8 shown in FIGS. 1 to 4 are composed of either a sheet-like, film-like, plate-like, or foil-like metal or a paste-like metal. As the bonding materials 4 and 8 that are solid in the form of a sheet, film, plate, or foil, for example, tin, solder, aluminum or the like whose melting temperature is lower than the melting temperature of the metal members 2 and 3 can be applied. It is. When the bonding materials 4 and 8 are mainly composed of tin, the purity of tin is higher than that of lead-free solder, for example, high purity of 99.9% or more, which is bonded by a metal bonding method. Even if the welding target member 1 is heated up to 400 ° C. with a hot plate and checked for strength and burned with a flame of 1000 ° C. or higher in a burner, It was confirmed that 1 was not peeled apart, and it was confirmed that bonding strength such as brazing was obtained. For example, in the metal joining method shown in FIGS. 1 to 4, one of the metal members 2 and 3 is nickel, the other of the metal members 2 and 3 is copper, and nickel is sandwiched between the joining materials 4 mainly composed of tin. When the member 1 to be bonded with copper was made, it was confirmed that the heat resistance of the member 1 to be bonded was 750 ° C. or higher. Moreover, as the metal members 2, 3, and 7 joined by the joining materials 4 and 8 containing tin as a main component, metal members other than copper and metal members other than nickel can be applied. A configuration in which a copper layer is provided on the surface of the member is also applicable, and a configuration in which a nickel layer is provided on the surface of a metal member other than nickel is also applicable.

  When the bonding materials 4 and 8 shown in FIGS. 1 to 4 are composed mainly of solder, they are lead-free solders, for example, a sheet made of tin, silver and copper, or a sheet made of tin, silver and copper nickel, or It is configured as a film-like or plate-like solid. In the metal joining method shown in FIGS. 1 to 4, when the joining target member 1 of nickel and copper is formed with the joining material 4 mainly composed of solder, the joining target member 1 after joining is 400 by a hot plate. After checking the strength by raising the temperature to 0 ° C. and scooping it with a flame of 1000 ° C. or higher in a burner, it can be confirmed that the target member 1 does not peel apart even if it hits the target member 1 with a tool such as a screwdriver. It was confirmed that bonding strength such as brazing was obtained. The interface between solder and nickel receives pressure and vibrational energy and diffuses into an alloy, eliminating the need for a gold layer on the nickel solder side, and bonding copper to solder at room temperature without flux It was confirmed that copper and nickel could be joined with solder at room temperature without flux.

  In the metal joining method shown in FIGS. 1 and 2, when the joining target member 1 having a two-layer structure of copper and copper is formed with the solder base interposed, the solder melting temperature is generally 220 ° C. It was confirmed that the heat resistance of the manufactured member 1 to be joined was 400 ° C. or higher.

  The bonding materials 4 and 8 in the form of paste are composed of organic materials such as dispersants and diluents and metal particles having a low electrical resistivity such as gold, silver, copper, and aluminum, and are semi-molten with a viscosity. Metal nano paste, metal micro paste, solder paste or the like in which metal particles are incorporated in the organic material. In the case of the bonding materials 4 and 8 configured in a paste form, the bonding materials 4 and 8 are subjected to the pressurization and the friction caused by the vibration in the lateral direction, and the dispersants and diluents in the bonding materials 4 and 8. The organic material evaporates, and metal particles having a small electrical resistivity such as gold, silver, copper, aluminum, or solder in the bonding materials 4 and 8 are changed into ingot layers. Vigorous free motion occurs in the atoms, and finally the atoms of the bonding materials 4 and 8 are in an excited state. Therefore, the interface portion between the metal member 2 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 4, the interface portion between the metal member 3 and the bonding material 8, and the interface portion between the metal member 7 and the bonding material 8. Each of them diffuses to become an alloy, the bonding material 4 melts and bonds between the metal members 2 and 3, and the bonding material 8 melts and bonds between the metal members 3 and 7.

  The elastic members 11 and 12 shown in FIGS. 1 to 4 are configured in a sheet shape, a film shape, or a plate shape made of Teflon (registered trademark), silicone resin, or the like. As the elastic members 11 and 12, an elastic member such as a synthetic resin or an elastomer other than Teflon (registered trademark) or silicone resin can be applied as long as it has heat resistance against heat during bonding. The elastic members 11 and 12 can be applied to the same material or different materials. The elastic members 11 and 12 are either a configuration separated from the joining target member 1, the pressurizing unit 13, and the joining tool unit 15, or a configuration fixed to the joining target member 1 or the pressurizing unit 13 and the joining tool unit 15. But it is applicable. Further, even if the joining target member 1 is overlaid on the elastic member 11 mounted on the joining tool portion 15 and the elastic member 12 is overlaid on the joining target member 1, or the joining target member 1 and The present invention can also be applied to a case where a laminated object composed of the elastic members 11 and 12 is mounted on the welding tool portion 15. Although it can be applied without using one of the elastic members 11 and 12, it is preferable to dispose the elastic member on the side that may be deformed by pressurization.

  The metal joining method shown in FIGS. 1 to 4 was experimented with a sound wave fixed at a certain frequency in the range of 10 kHz to 20 kHz, and the joined member 1 was examined. , No warping or distortion due to heat, no residual stress and whiskers, no voids, the thickness of the bonding material 4 is several μm, aluminum, copper, gold as the metal members 2, 3, 7, The bonding of silver and nickel is possible, the bonding time is a few seconds, the load on the member 1 to be bonded can be reduced, and the bonding materials 4 and 8 can be bonded at room temperature in the air in a few seconds. I was able to confirm. That is, the sound energy generated by the sound wave vibration is a joint portion formed by the interface portion between the metal member 2 and the bonding material 4, a joint portion formed by the interface portion between the metal member 3 and the bonding material 4, and the metal member 3 and the bonding material 8. Some reaction is accelerated while the atoms are excited and heat is generated instantaneously in each narrow thin region of the joint part consisting of the interface part and the joint part consisting of the interface part between the metal member 7 and the bonding material 8. It is thought that there is. In addition, the finish of each competitor was burned with heat generated overall, but the joining using the sound energy generated by the above-mentioned sonic vibration did not cause burn and was a beautiful finish. In addition, when ultrasonic vibration is used, the bonding time is longer than that of sonic vibration, but it is possible to bond aluminum, copper, gold, silver, and nickel as metal members 2, 3, and 7, It was also confirmed that the load on the member 1 could be lowered, and as a result, the occurrence of residual stress could be prevented.

  Further, the size of the metal members 2, 3, and 7 shown in FIG. 4 is not limited to the following numerical values, but in the metal bonding method according to the embodiment 4 for carrying out the invention shown in FIG. As an example of the size used, the metal member 2 is a square having a side of 30 mm and another side of 40 mm and a thickness of 2 mm, the metal member 3 is a square having a side of 15 mm and a thickness of 500 μm, and the metal member 7 is 1 The side was a 6 mm square and the thickness was 100 μm. Further, the present invention can also be applied by bonding a plurality of circuit boards 5 to a metal member 2 as one heat sink and bonding a plurality of semiconductor devices 6 to one circuit board 5.

  With reference to FIG. 5, the metal joining method which concerns on the form 5 for inventing is demonstrated. The metal bonding method shown in FIG. 5 includes the bonding step by sonic vibration or ultrasonic vibration shown in step 501 and the heating step after bonding shown in step 502. The joining step by the sonic vibration or the ultrasonic vibration shown in step 501 uses the joining target member 1 joined by the metal joining method by the sonic vibration or ultrasonic vibration shown in FIGS. Although possible, the joining target member 1 that has been joined by the metal joining method using the sonic vibration or the ultrasonic vibration shown in FIG. In the heating step after the joining shown in Step 502, the normal temperature and 260 ° C. are applied to the joining target member 1 that is a metal joining structure from the joining members 3 composed mainly of the metal members 2 and 3 and tin. A heat cycle process repeated several times and an accelerated heat treatment at 700 ° C. or higher are performed. When the joining target member 1 that has been subjected to the heat cycle process in the heating step shown in step 502 is examined, even if one or both of the metal members 2 and 3 are struck with a tool such as a screwdriver, It was confirmed that the bonding material 4 mainly composed of tin was not peeled off from each other, and it was confirmed that a bonding strength such as brazing was obtained.

  Next, a metal bonding apparatus 21 used in the metal bonding method according to the first to fourth embodiments for carrying out the invention shown in FIGS. 1 to 4 will be described with reference to FIGS.

  A working space portion 23 is provided in the device housing portion 22 of the metal joining device 21 as the sixth embodiment for carrying out the invention shown in FIG. A support 24 is provided below the work space 23 of the device housing 22. The support 24 includes support portions 26 on both the left and right sides of the support space portion 25 penetrating in the front-rear direction and the lower direction. A resonator 27 is installed on the support 24. The resonator 27 includes a joining tool part 28 and a supported part 29. The length of the resonator 27 from one end to the other end is a linear rod having at least one wavelength of the resonance frequency of the sonic vibration or ultrasonic vibration transmitted from the vibrator 30. Maximum vibration amplitude points are located at both ends and the center in the length direction of the resonator 27. A joining tool portion 28 is provided on the outer surface portion where the maximum vibration amplitude point is located in the central portion in the length direction of the resonator 27.

  The bonding tool portion 28 is provided so as to protrude from the outer surface of the resonator 27, when provided on the same surface as the outer surface of the resonator 27, or when provided below the outer surface of the resonator 27. But it is applicable. A supported portion 29 is provided on the outer surface portion located at the minimum vibration amplitude point existing on both sides in the length direction from the joining tool portion 28 of the resonator 27.

  A vibrator 30 is attached to one end of the resonator 27. It is also possible to apply a booster (not shown) between the resonator 27 and the vibrator 30. The length direction of the resonator 27 is directed to the support 24 in the left-right direction indicated by the arrow 17, and the resonator 27 is disposed in the support space 25 so that portions other than the supported portion 29 do not contact the support 24. Then, the supported portion 29 is supported by the support portion 26, whereby the resonator 27 is installed on the support tool 24.

  A pressurizing mechanism 31 is provided above the work space 23 of the apparatus housing 22. The output member 32 of the pressurizing mechanism 31 is disposed in the work space 23 from the upper part of the apparatus housing 22. The lower part of the output member 32 arranged in the work space 23 moves up and down linearly in the work space 23 by driving the pressurizing mechanism 31. A receiving portion 40 is provided at a lower portion of the output member 32 disposed in the work space portion 23.

  In the metal bonding apparatus 21 shown in FIG. 6, the pressurizing mechanism 31, the output member 32, and the receiving part 40 correspond to the pressurizing part 13 shown in FIGS. 1 to 4, and the resonator 27 is shown in FIGS. The bonding tool part 28 corresponds to the resonator 14 shown, the bonding tool part 28 corresponds to the bonding tool part 15 shown in FIGS. 1 to 4, and the vibrator 30 corresponds to the vibrator 16 shown in FIGS. When joining the member 1 to be joined by sonic vibration, the resonator 14 is larger and heavier than when joining the member 1 by ultrasonic vibration, but the metal joining device 21 shown in FIG. The large and heavy resonator 27 is structured not to move in the vertical direction, and the area of the upper surface of the welding tool portion 28 can be formed wider than the case where the welding target member 1 is bonded by ultrasonic vibration. By forming the area of the upper surface of the tool part 28 wide, it is suitable as an apparatus for joining the member 1 to be joined by sonic vibration.

  A metal bonding method using the metal bonding apparatus 21 shown in FIG. 6 will be described. First, the output member 32 stops at the raised position, and the joining tool part 28 and the receiving part 40 form a space in which a laminated object composed of the joining target member 1 and the elastic members 11 and 12 can be inserted. And it is in the state which opposed in the up-and-down direction. In this state, on the joining tool portion 28, after the stacked object composed of the joining target member 1 and the elastic members 11 and 12 is mounted, the pressurizing mechanism 31 is driven and the output member 32 is lowered. Accordingly, the joining target member 1 and the elastic members 11 and 12 are sandwiched and pressed by the joining tool portion 28 and the joining tool portion 37 from above and below, and the resonator 27 is transmitted from the vibrator 30. Resonating with vibration, the joining tool portion 28 vibrates in the lateral direction indicated by the arrow 17, and the plurality of metal members and the joining material in the joining target member 1 receive vibration energy due to the pressurization and the lateral vibration. Are joined together.

  Thereafter, as the pressurizing mechanism 31 is driven and the output member 32 is raised, the receiving portion 40 is separated from the elastic member 12, and the elastic members 11 and 12 and the bonding target member 1 that has become a bonded structure are formed. It remains on the joining tool part 28. The elastic members 11 and 12 and the joining target member 1 remaining on the joining tool portion 28 are taken out from the joining tool portion 28, the elastic members 11 and 12 and the joining target member 1 are separated from each other, and the metal joining apparatus The one-time joining operation to the joining target member 1 by 21 is completed.

  A metal bonding apparatus 21 according to Embodiment 7 for carrying out the invention shown in FIG. 7 will be described. The metal bonding apparatus 21 shown in FIG. 7 includes a support 33, a support space 34, a support 35, a resonator 36, a bonding tool 37, a supported tool, and a lower part disposed in the work space 23 of the pressurizing mechanism 31. A part 38 and a vibrator 39 are provided, and a receiving part 40 is provided below the work space part 23 of the apparatus housing part 22. In the metal bonding apparatus 21 shown in FIG. 7, the pressurizing mechanism 31, the output member 32, and the receiving part 40 correspond to the pressurizing part 13 shown in FIGS. 1 to 4, and the resonator 27 is shown in FIGS. The joining tool portion 37 corresponds to the resonator 14 shown in FIGS. 1 to 4, and the vibrator 39 corresponds to the vibrator 16 shown in FIGS. 1 to 4. Further, when joining the member 1 to be joined by ultrasonic vibration, the resonator 14 is smaller and lighter than when joining the member 1 to be joined by sound vibration, but the metal joining device 21 shown in FIG. Since the structure is such that the small and light resonator 36 is moved in the vertical direction, it is suitable for an apparatus for joining the member 1 to be joined by ultrasonic vibration.

  A metal bonding method using the metal bonding apparatus 21 shown in FIG. 7 will be described. First, the output member 32 stops at the raised position, and the joining tool part 37 and the receiving part 40 form a space in which a laminated object composed of the joining target member 1 and the elastic members 11 and 12 can be inserted. And it is in the state which opposed in the up-and-down direction. In this state, on the receiving portion 40, a stacked object composed of the joining target member 1 and the elastic members 11 and 12 is mounted, and then the pressurizing mechanism 31 is driven and the output member 32 is lowered. Accordingly, the joining target member 1 and the elastic members 11 and 12 are sandwiched and pressed by the joining tool portion 37 and the receiving portion 40 from above and below, and the resonator 36 is transmitted from the vibrator 39. Resonating to vibration or ultrasonic vibration, the welding tool portion 37 vibrates in the lateral direction indicated by the arrow 17, and a plurality of metal members in the joining target member 1 receive vibration energy due to the pressurization and the lateral vibration. Are joined together.

  Thereafter, as the pressurizing mechanism 31 is driven and the output member 32 is raised, the joining tool portion 37 is separated from the elastic member 12, and the elastic members 11 and 12 and the joining target member 1 that has become a joining structure are formed. It is left on the receiving part 40. The elastic members 11 and 12 and the joining target member 1 left on the receiving portion 40 are taken out from the receiving portion 40, and the elastic members 11 and 12 and the joining target member 1 are separated from each other, so that the metal joining apparatus The one-time joining operation to the joining target member 1 by 21 is completed.

DESCRIPTION OF SYMBOLS 1 Joining target member 2 Metal member 3 Metal member 4 Joining material 5 Circuit board 6 Semiconductor device 7 Metal member 8 Joining material 11 Elastic member 12 Elastic member 13 Pressurization part 14 Resonator 15 Joining root part 16 Vibrator 17 Shows vibration direction Arrow 21 Metal joining device 22 Device housing 23 Work space portion 24 Support tool 25 Support space portion 26 Support portion 27 Resonator 28 Joining tool portion 29 Supported portion 30 Vibrator 31 Pressure mechanism 32 Output member 33 Support tool 34 Support space Part 35 support part 36 resonator 37 joining tool part 38 supported part 39 vibrator 40 receiving part

The front view which showed the metal joining apparatus which concerns on the form 1 for implementing invention. The front view which showed the metal joining method which concerns on the form 2 for implementing invention. The front view which showed the metal joining method which concerns on the form 3 for implementing invention. The front view which showed the metal joining method which concerns on the form 4 for implementing invention. The flowchart which showed the metal joining method which concerns on the form 5 for implementing invention. The front view which showed the metal joining apparatus which concerns on the form 6 for implementing invention. The front view which showed the metal joining apparatus which concerns on the form 7 for implementing invention. The schematic diagram which showed the metal joining method disclosed by patent document 1. FIG. The schematic diagram which showed another metal joining method using the metal joining method disclosed by patent document 1. FIG.

Claims (1)

The joining target member has a configuration in which a joining material is sandwiched between a plurality of metal members, and an elastic member is disposed on one or both of the upper and lower sides of the joining target member, and the joining target member and the elastic member are arranged in the vertical direction. In the pressurized state, the resonator resonates with the sonic vibration or ultrasonic vibration transmitted from the vibrator attached to one end of the resonator and vibrates in the lateral direction perpendicular to the pressurized direction. A metal joining method, wherein a plurality of metal members are joined together with a joining material.

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