JP2009072813A5 - - Google Patents

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Publication number
JP2009072813A5
JP2009072813A5 JP2007244520A JP2007244520A JP2009072813A5 JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5 JP 2007244520 A JP2007244520 A JP 2007244520A JP 2007244520 A JP2007244520 A JP 2007244520A JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5
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JP
Japan
Prior art keywords
bonding film
adherend
region
bonding
metal atom
Prior art date
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Withdrawn
Application number
JP2007244520A
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English (en)
Japanese (ja)
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JP2009072813A (ja
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Publication date
Application filed filed Critical
Priority to JP2007244520A priority Critical patent/JP2009072813A/ja
Priority claimed from JP2007244520A external-priority patent/JP2009072813A/ja
Publication of JP2009072813A publication Critical patent/JP2009072813A/ja
Publication of JP2009072813A5 publication Critical patent/JP2009072813A5/ja
Withdrawn legal-status Critical Current

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JP2007244520A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009072813A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244520A JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244520A JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009072813A JP2009072813A (ja) 2009-04-09
JP2009072813A5 true JP2009072813A5 (cg-RX-API-DMAC7.html) 2010-09-02

Family

ID=40608337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244520A Withdrawn JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

Country Link
JP (1) JP2009072813A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014188536A (ja) * 2013-03-26 2014-10-06 National Institute For Materials Science 金属材の拡散接合方法および金属材の拡散接合装置
CN114999948A (zh) * 2022-06-06 2022-09-02 闽南师范大学 一种高真空磁控溅射热压键合一体机以及键合方法

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