JP2009067908A - Curable composition for laminate - Google Patents

Curable composition for laminate Download PDF

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JP2009067908A
JP2009067908A JP2007238644A JP2007238644A JP2009067908A JP 2009067908 A JP2009067908 A JP 2009067908A JP 2007238644 A JP2007238644 A JP 2007238644A JP 2007238644 A JP2007238644 A JP 2007238644A JP 2009067908 A JP2009067908 A JP 2009067908A
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Takayoshi Tanabe
隆喜 田辺
Kazuo Kawaguchi
和雄 河口
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JSR Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable composition for a laminate, exhibiting sufficient peel strength, excellent heat resistance and hygroscopicity. <P>SOLUTION: The curable composition for the laminate contains (A) a curing type main agent containing a compound represented by general formula (1) (wherein, at least two of Z<SP>1</SP>to Z<SP>24</SP>are groups having polymerizable functional groups), and (B) a curing agent. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、優れた特性を有する積層板を製造可能な積層板用硬化性組成物に関する。   The present invention relates to a curable composition for a laminate capable of producing a laminate having excellent characteristics.

従来、プリント配線基板等に加工される積層板として、各種の素材等からなるものが知られている。このような積層板の具体例としては、ガラス布等の基材にエポキシ樹脂等の樹脂を含浸して乾燥することによって作製したプリプレグを所定枚数重ね、必要に応じて銅箔等の金属箔をその片側又は両側に更に重ねた積層体を加熱・加圧成形することによって製造したもの等が知られている。   Conventionally, what consists of various raw materials etc. is known as a laminated board processed into a printed wiring board etc. FIG. As a specific example of such a laminate, a predetermined number of prepregs prepared by impregnating a resin such as an epoxy resin into a substrate such as a glass cloth and drying, a metal foil such as a copper foil is laminated as necessary. A product produced by heating and press-molding a laminated body further laminated on one side or both sides is known.

このような積層板については、プリント配線基板の高密度実装化、高集積化等の傾向に対応し、耐熱性、加工性等の諸特性の向上が要求されている。要求される特性のなかでも重要なものとして、耐熱性を挙げることができ、積層板を構成する樹脂として一般的なエポキシ樹脂の耐熱性を高めることが検討されている。   Such laminated boards are required to improve various characteristics such as heat resistance and workability in response to the trend of high-density mounting and high integration of printed wiring boards. Among the required properties, heat resistance can be cited as an important property, and it has been studied to increase the heat resistance of a general epoxy resin as a resin constituting a laminated board.

エポキシ樹脂の耐熱性を向上させるべく、ジシアンジアミドを用いて多官能型のエポキシ樹脂を硬化させること、DDS、DDM、又はアルキル化若しくはハロゲン化DDMを硬化剤として用いること、或いはエポキシ樹脂をイミド樹脂で変性すること等が提案されている。また、フェノールノボラック樹脂、クレゾールノボラック樹脂、ビスフェノールA型ノボラック樹脂等のフェノール系樹脂を硬化剤として使用することも提案されている。   In order to improve the heat resistance of the epoxy resin, the polyfunctional epoxy resin is cured using dicyandiamide, DDS, DDM, or alkylated or halogenated DDM is used as a curing agent, or the epoxy resin is an imide resin. Modification has been proposed. It has also been proposed to use a phenolic resin such as a phenol novolac resin, a cresol novolak resin, or a bisphenol A type novolak resin as a curing agent.

しかしながら、上記の提案では、エポキシ樹脂の耐熱性は良好となるものの、吸湿性や吸湿後の半田耐熱性が不十分となり、プリプレグの製品寿命が短くなるといった不具合が生ずる傾向にある。このような不具合の発生を回避すべく、フェノール樹脂ワニスにフェノール硬化型ブロム化エポキシ樹脂を配合した積層板用フェノール樹脂組成物(例えば、特許文献1参照)が開示されている。また、ジシアンジアミドとともに、1分子中に2個以上のフェノール性水酸基を有する化合物と、1分子中に2個以上のアミノ基を有する芳香族アミン化合物とを用いたエポキシ樹脂組成物が開示されている(例えば、特許文献2参照)。   However, in the above proposal, although the heat resistance of the epoxy resin is good, there is a tendency that the hygroscopicity and the solder heat resistance after moisture absorption are insufficient and the product life of the prepreg is shortened. In order to avoid the occurrence of such problems, a phenolic resin composition for laminates in which a phenolic curable brominated epoxy resin is blended with a phenolic resin varnish (see, for example, Patent Document 1) is disclosed. Also disclosed is an epoxy resin composition using a compound having two or more phenolic hydroxyl groups in one molecule and an aromatic amine compound having two or more amino groups in one molecule together with dicyandiamide. (For example, refer to Patent Document 2).

しかしながら、特許文献1及び2等で開示された樹脂組成物等であっても、耐熱性は未だ十分であるとはいえなかった。また、低吸湿性やピール強度等の特性に関しても改良の余地があった。   However, even with the resin compositions disclosed in Patent Documents 1 and 2, etc., the heat resistance is still not sufficient. There is also room for improvement in properties such as low hygroscopicity and peel strength.

特開平4−222816号公報JP-A-4-222816 特開平5−51436号公報Japanese Patent Laid-Open No. 5-51436

本発明は、このような従来技術の有する問題点に鑑みてなされたものであり、その課題とするところは、十分なピール強度を有するとともに、優れた耐熱性及び吸湿性を示す積層板を製造可能な積層板用硬化性組成物を提供することにある。   The present invention has been made in view of such problems of the prior art, and the object of the present invention is to produce a laminate having sufficient peel strength and excellent heat resistance and hygroscopicity. The object is to provide a curable composition for a laminate.

本発明者らは上記課題を達成すべく鋭意検討した結果、硬化型の主剤として、その分子構造が特定の一般式で表されるカリックスアレーン系化合物誘導体を用いることによって、上記課題を達成することが可能であることを見出し、本発明を完成するに至った。   As a result of intensive studies to achieve the above-mentioned problems, the present inventors have achieved the above-mentioned problems by using calixarene compound derivatives whose molecular structure is represented by a specific general formula as a curable main agent. As a result, the present invention has been completed.

即ち、本発明によれば、以下に示す積層板用硬化性組成物が提供される。   That is, according to this invention, the curable composition for laminated boards shown below is provided.

[1](A)下記一般式(1)で表される化合物を含む硬化型の主剤と、(B)硬化剤と、を含有する積層板用硬化性組成物。   [1] A curable composition for a laminate comprising (A) a curable main agent containing a compound represented by the following general formula (1), and (B) a curing agent.

Figure 2009067908
Figure 2009067908

前記一般式(1)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、Z〜Z24は、相互に独立に、水素原子、重合性官能基を有する基、アルカリ可溶性基を有する基、アルキル鎖の炭素数が1〜8の置換アルキル基、又は隣り合う2つのZが結合して形成する炭素数1〜8の置換若しくは非置換アルキレン基を示し(但し、Z〜Z24のうちの少なくとも2個は、重合性官能基を有する基である)、q〜q12は、相互に独立に、0又は1の整数を示す。 In the general formula (1), R 1 to R 6 each independently represent a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represent 1 carbon atom. Substituted or unsubstituted alkyl group having 10 to 10 carbon atoms, substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, substituted or unsubstituted carbon group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, and Z 1 to Z 24 are groups having a hydrogen atom or a polymerizable functional group, independently of each other; , A group having an alkali-soluble group, a substituted alkyl group having 1 to 8 carbon atoms in the alkyl chain, or a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms formed by bonding two adjacent Z's (provided that , Z 1 ~Z At least two of the 4 is a group having a polymerizable functional group), q 1 to q 12 are independently of each other, an integer of 0 or 1.

[2]前記重合性官能基が、置換又は非置換のグリシジル基である前記[1]に記載の積層板用硬化性組成物。   [2] The curable composition for laminates according to [1], wherein the polymerizable functional group is a substituted or unsubstituted glycidyl group.

[3]前記(B)硬化剤が、下記一般式(2)で表される化合物を含む前記[1]又は[2]に記載の積層板用硬化性組成物。   [3] The curable composition for laminates according to [1] or [2], wherein the (B) curing agent includes a compound represented by the following general formula (2).

Figure 2009067908
Figure 2009067908

前記一般式(2)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、q〜q12は、相互に独立に、0又は1の整数を示す。 In the general formula (2), R 1 to R 6 each independently represent a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represent 1 carbon atom. Substituted or unsubstituted alkyl group having 10 to 10 carbon atoms, substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, substituted or unsubstituted carbon group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group; q 1 to q 12 each independently represents an integer of 0 or 1;

[4](A)下記一般式(3)で表される化合物と、下記一般式(4)で表される化合物を縮合させて得られるフェノール性水酸基を有する化合物の、前記フェノール性水酸基の水素原子の少なくとも二つを、重合性官能基を有する基で置換した化合物を含む硬化型の主剤と、(B)硬化剤と、を含有する積層板用硬化性組成物。   [4] (A) Hydrogen of the phenolic hydroxyl group of a compound having a phenolic hydroxyl group obtained by condensing a compound represented by the following general formula (3) and a compound represented by the following general formula (4) A curable composition for laminates, comprising a curable main agent comprising a compound in which at least two of the atoms are substituted with a group having a polymerizable functional group, and (B) a curing agent.

Figure 2009067908
Figure 2009067908

前記一般式(3)中、Xは、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、qは、0又は1の整数を示す。   In the general formula (3), X is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, or a substituted or unsubstituted group having 2 to 10 carbon atoms. An alkynyl group, a substituted or unsubstituted aralkyl group having 7 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, q is an integer of 0 or 1 Indicates.

Figure 2009067908
Figure 2009067908

前記一般式(4)中、Rは、炭素数1〜8の置換又は非置換のアルキレン基を示す。   In the general formula (4), R represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms.

[5]前記一般式(4)中、Rがプロピレン基である前記[4]に記載の積層板用硬化性組成物。   [5] The curable composition for laminated boards according to [4], wherein R in the general formula (4) is a propylene group.

本発明の積層板用硬化性組成物は、十分なピール強度を有するとともに、優れた耐熱性及び吸湿性を示す積層板を製造可能であるといった効果を奏するものである。   The curable composition for laminated boards of the present invention has an effect that a laminated board having sufficient peel strength and exhibiting excellent heat resistance and hygroscopicity can be produced.

以下、本発明の実施の最良の形態について説明するが、本発明は以下の実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で、当業者の通常の知識に基づいて、以下の実施の形態に対し適宜変更、改良等が加えられたものも本発明の範囲に入ることが理解されるべきである。   BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below, but the present invention is not limited to the following embodiment, and is based on the ordinary knowledge of those skilled in the art without departing from the gist of the present invention. It should be understood that modifications and improvements as appropriate to the following embodiments also fall within the scope of the present invention.

本発明の積層板用硬化性組成物の一実施形態は、(A)前記一般式(1)で表される化合物を含む硬化型の主剤と、(B)硬化剤とを含有するものである。以下、その詳細について説明する。   One embodiment of the curable composition for laminated boards of the present invention contains (A) a curable main agent containing the compound represented by the general formula (1), and (B) a curing agent. . The details will be described below.

((A)主剤)
本発明の積層板用硬化性組成物に含有される(A)主剤は、下記一般式(1)で表される化合物(いわゆる「カリックスアレーン系化合物誘導体」)を含むものであり、(B)硬化剤によって硬化することが可能な成分である。なお、(A)主剤には、エポキシ樹脂をはじめとする積層板を構成するために用いることのできる硬化性の樹脂材料が含まれていてもよい。但し、(A)主剤は、実質的に下記一般式(1)で表される化合物からなるものであることが好ましい。
((A) Main agent)
The main component (A) contained in the curable composition for laminated boards of the present invention contains a compound represented by the following general formula (1) (so-called “calixarene compound derivative”), and (B) It is a component that can be cured by a curing agent. Note that (A) the main agent may contain a curable resin material that can be used to form a laminate including an epoxy resin. However, (A) the main agent is preferably substantially composed of a compound represented by the following general formula (1).

Figure 2009067908
Figure 2009067908

前記一般式(1)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、Z〜Z24は、相互に独立に、水素原子、重合性官能基を有する基、アルカリ可溶性基を有する基、アルキル鎖の炭素数が1〜8の置換アルキル基、又は隣り合う2つのZが結合して形成する炭素数1〜8の置換若しくは非置換アルキレン基を示し、q〜q12は、相互に独立に、0又は1の整数を示す。 In the general formula (1), R 1 to R 6 each independently represent a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represent 1 carbon atom. Substituted or unsubstituted alkyl group having 10 to 10 carbon atoms, substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, substituted or unsubstituted carbon group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, and Z 1 to Z 24 are groups having a hydrogen atom or a polymerizable functional group, independently of each other; , A group having an alkali-soluble group, a substituted alkyl group having 1 to 8 carbon atoms in the alkyl chain, or a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms formed by bonding two adjacent Z's, q 1 ~q 12 is Independently of one another, an integer of 0 or 1.

前記一般式(1)中のZ〜Z24のうちの少なくとも2個、好ましくは8個以上、更に好ましくは16個以上、特に好ましくは24個(全て)が、重合性官能基を有する基である。前記一般式(1)中のZ〜Z24のうちの少なくとも2個が重合性官能基を有する基であることにより、この一般式(1)で表される化合物が主剤に含まれる本発明の積層板用硬化性組成物は、硬化性の組成物として優れた特性を示すこととなる。また、前記一般式(1)で表される化合物は、一つの芳香環に一以上の重合性官能基を有するものであることが好ましく、一つの芳香環に二つの重合性官能基を有することが更に好ましい。 In the general formula (1), at least 2, preferably 8 or more, more preferably 16 or more, particularly preferably 24 (all) of Z 1 to Z 24 have a polymerizable functional group. It is. The present invention in which the compound represented by the general formula (1) is contained in the main agent when at least two of Z 1 to Z 24 in the general formula (1) are groups having a polymerizable functional group. This curable composition for laminates exhibits excellent properties as a curable composition. Further, the compound represented by the general formula (1) preferably has one or more polymerizable functional groups in one aromatic ring, and has two polymerizable functional groups in one aromatic ring. Is more preferable.

重合性官能基の具体例としては、重合性不飽和構造を有する基、環状エーテル構造を有する基等を挙げることができる。より具体的には、ビニル基、ビニリデン基、アクリロイル基、メタクリロイル基、置換又は非置換のグリシジル基、置換又は非置換のオキセタニル基、置換又は非置換のスピロオルトエステル基等を挙げることができる。これらのなかでも、重合性官能基は、置換又は非置換のグリシジル基であることが好ましい。   Specific examples of the polymerizable functional group include a group having a polymerizable unsaturated structure and a group having a cyclic ether structure. More specifically, a vinyl group, a vinylidene group, an acryloyl group, a methacryloyl group, a substituted or unsubstituted glycidyl group, a substituted or unsubstituted oxetanyl group, a substituted or unsubstituted spiro orthoester group, and the like can be given. Among these, the polymerizable functional group is preferably a substituted or unsubstituted glycidyl group.

前記一般式(1)中、Z〜Z24で表される基は、アルカリ可溶性基を有する基であることも好ましい。アルカリ可溶性基の具体例としては、カルボキシル基、アミノ基、スルホンアミド基、スルホン酸基及びリン酸基等を挙げることができる。 In the general formula (1), the group represented by Z 1 to Z 24 is preferably a group having an alkali-soluble group. Specific examples of the alkali-soluble group include a carboxyl group, an amino group, a sulfonamide group, a sulfonic acid group, and a phosphoric acid group.

前記一般式(1)中、Z〜Z24で表される基のうちの少なくとも一つは、アルキル鎖の炭素数が1〜8の置換アルキル基であることが好ましい。例えば、アルキル基をスペーサーとして、その先端に上述のような官能基を付けることにより、官能基の自由度が向上し、反応性が向上する。或いは、上述のような官能基を付加又は置換し得る置換基で置換された置換アルキル基を有する誘導体も好ましい。更に、上述のような官能基や置換基が保護基により保護された置換アルキル基を有する誘導体も好ましい。 In the general formula (1), at least one of the groups represented by Z 1 to Z 24 is preferably a substituted alkyl group having 1 to 8 carbon atoms in the alkyl chain. For example, by using an alkyl group as a spacer and attaching a functional group as described above to the tip, the degree of freedom of the functional group is improved and the reactivity is improved. Or the derivative | guide_body which has the substituted alkyl group substituted by the substituent which can add or substitute the above functional groups as mentioned above is also preferable. Furthermore, derivatives having a substituted alkyl group in which the functional group or substituent as described above is protected by a protecting group are also preferred.

前記一般式(1)中、隣り合う2つのZが結合して炭素数1〜8の置換又は非置換アルキレン基を形成していることも好ましい。このような構造とすることにより、配座を強固に固定することができ、特定の化合物を包摂する包摂化合物としても有用となる。   In the general formula (1), it is also preferable that two adjacent Zs are bonded to form a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms. By adopting such a structure, the conformation can be firmly fixed, and it is also useful as an inclusion compound that includes a specific compound.

前記一般式(1)中、一つの芳香環における置換基(X〜X12)は、なくてもよいが、目的に応じて種々の置換基を有するように構成することも好ましい。前記一般式(1)中のX〜X12は、相互に独立に、水素原子又はメチル基であることが好ましい。 In the general formula (1), the substituents (X 1 to X 12 ) in one aromatic ring may be omitted, but it is also preferable to have various substituents depending on the purpose. X 1 to X 12 in the general formula (1) are preferably each independently a hydrogen atom or a methyl group.

前記一般式(1)中、R〜Rは、炭素数3、5、7又は8のアルキレン基であることが、環状体の基本骨格を容易に形成できる点で好ましい。更に、R〜Rがいずれも炭素数3の直鎖のアルキレン基の場合に非常に収率良く環状体の基本骨格を形成することができるために更に好ましい。 In the general formula (1), R 1 to R 6 are preferably an alkylene group having 3, 5, 7 or 8 carbon atoms from the viewpoint that the basic skeleton of the cyclic body can be easily formed. Furthermore, when all of R 1 to R 6 are straight-chain alkylene groups having 3 carbon atoms, it is more preferable because the basic skeleton of the cyclic body can be formed with a very high yield.

(A)主剤にエポキシ樹脂を含有させる場合において、このエポキシ樹脂としては、電気用の積層板等の樹脂成分として従来使用されている任意のものを使用することができる。エポキシ樹脂の具体例としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ジアミノジフェニルエーテル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂等の三官能型エポキシ樹脂;四官能型エポキシ樹脂;これらのハロゲン化物等を挙げることができる。なお、エポキシ樹脂のエポキシ当量は、150〜1000g/eqであることが好ましい。これらのエポキシ樹脂は、一種単独で又は二種以上を組み合わせて用いることができる。   (A) In the case where an epoxy resin is contained in the main agent, as the epoxy resin, any conventionally used resin component such as an electrical laminate can be used. Specific examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, diaminodiphenyl ether type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy. Examples thereof include trifunctional epoxy resins such as resins, isocyanurate type epoxy resins and triphenylmethane type epoxy resins; tetrafunctional type epoxy resins; halides thereof and the like. In addition, it is preferable that the epoxy equivalent of an epoxy resin is 150-1000 g / eq. These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

((B)硬化剤)
本発明の積層板用硬化性組成物には(B)硬化剤が含有される。本発明の積層板用硬化性組成物には、その分子構造中に重合性官能基を有する基を持つ前述の化合物(カリックスアレーン系化合物誘導体)を含む硬化性の(A)主剤が含有されている。従って、この(B)硬化剤を含有させることにより、(A)主剤を硬化させることができる。
((B) curing agent)
The curable composition for laminated boards of the present invention contains (B) a curing agent. The curable composition for laminated boards of the present invention contains a curable (A) main agent containing the above-mentioned compound (calixarene compound derivative) having a group having a polymerizable functional group in its molecular structure. Yes. Therefore, the main component (A) can be cured by including the curing agent (B).

(B)硬化剤としては、一液性又は二液性のエポキシ樹脂用の硬化剤として一般的に用いられるものを用いることができる。(B)硬化剤の具体例としては、アミン化合物、イミダゾール化合物、変性アミン化合物、変性イミダゾール化合物、フェノール系化合物、及びフェノール系樹脂等を挙げることができる。   (B) As a hardening | curing agent, what is generally used as a hardening | curing agent for one-component or two-component epoxy resins can be used. Specific examples of (B) curing agents include amine compounds, imidazole compounds, modified amine compounds, modified imidazole compounds, phenolic compounds, and phenolic resins.

アミン化合物の具体例としては、ジシアンジアミド;ジエチレントリアミン、トリエチレンテトラミン、ジエチルアミノプロピルアミン等の脂肪族ポリアミン;m−キシレンジアミン、ジアミノジフェニルメタン等の芳香族ポリアミン;イソホロンジアミン、メンセンジアミン等の脂環族ポリアミン;ポリアミド等を挙げることができる。   Specific examples of the amine compound include dicyandiamide; aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and diethylaminopropylamine; aromatic polyamines such as m-xylenediamine and diaminodiphenylmethane; alicyclic polyamines such as isophoronediamine and mensendiamine. A polyamide or the like.

イミダゾール化合物の具体例としては、2−メチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール等を挙げることができる。   Specific examples of the imidazole compound include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the like.

変性アミン化合物の具体例としては、エポキシ化合物にアミン化合物を付加させたエポキシ化合物付加ポリアミン等を挙げることができる。また、変性イミダゾール化合物としては、エポキシ化合物にイミダゾール化合物を付加させたイミダゾール付加物等を挙げることができる。   Specific examples of the modified amine compound include an epoxy compound-added polyamine obtained by adding an amine compound to an epoxy compound. Examples of the modified imidazole compound include an imidazole adduct obtained by adding an imidazole compound to an epoxy compound.

フェノール系化合物の具体例は、ビスフェノールA、ピロガロールカテコール、レゾルシン、クレゾール、アリル化ビスフェノールA等を挙げることができる。また、フェノール系樹脂の具体例としては、ノボラック型フェノール樹脂、アルキルフェノール樹脂、ベンジルエーテル型フェノール樹脂、フェノールアラルキル樹脂、アルケニル基含有フェノール樹脂、アリル基含有フェノール樹脂、ポリ−P−ビニルフェノール等を挙げることができる。   Specific examples of the phenol compound include bisphenol A, pyrogallol catechol, resorcin, cresol, allylated bisphenol A, and the like. Specific examples of phenolic resins include novolak type phenolic resins, alkylphenolic resins, benzyl ether type phenolic resins, phenol aralkyl resins, alkenyl group-containing phenolic resins, allyl group-containing phenolic resins, poly-P-vinylphenol, and the like. be able to.

(B)硬化剤として、下記一般式(2)で表される化合物(カリックスアレーン系化合物)を用いることが、より良好なピール強度を有するとともに、更に優れた耐熱性及び吸湿性を示す積層板を製造可能となるために好ましい。   (B) Use of a compound represented by the following general formula (2) (calixarene compound) as a curing agent has a better peel strength, and further exhibits excellent heat resistance and moisture absorption. Is preferable because it can be manufactured.

Figure 2009067908
Figure 2009067908

前記一般式(2)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、q〜q12は、相互に独立に、0又は1の整数を示す。 In the general formula (2), R 1 to R 6 each independently represent a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represent 1 carbon atom. Substituted or unsubstituted alkyl group having 10 to 10 carbon atoms, substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, substituted or unsubstituted carbon group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group; q 1 to q 12 each independently represents an integer of 0 or 1;

前記一般式(2)中の芳香環は、一置換又は非置換のレゾルシノール環である。芳香環が一置換又は非置換のレゾルシノール環であると、配座の固定が容易となり、水酸基に対する化学修飾による機能化が容易となる。   The aromatic ring in the general formula (2) is a monosubstituted or unsubstituted resorcinol ring. When the aromatic ring is a monosubstituted or unsubstituted resorcinol ring, the conformation can be easily fixed, and the functionalization by chemical modification with respect to the hydroxyl group is facilitated.

前記一般式(1)中、一つの芳香環における置換基(X〜X12)は、なくてもよいが、目的に応じて種々の置換基を有するように構成することも好ましい。前記一般式(1)中のX〜X12は、相互に独立に、水素原子又はメチル基であることが好ましい。 In the general formula (1), the substituents (X 1 to X 12 ) in one aromatic ring may be omitted, but it is also preferable to have various substituents depending on the purpose. X 1 to X 12 in the general formula (1) are preferably each independently a hydrogen atom or a methyl group.

前記一般式(1)中、R〜Rは、炭素数3、5、7又は8のアルキレン基であることが、環状体の基本骨格を容易に形成できる点で好ましい。更に、R〜Rがいずれも炭素数3の直鎖のアルキレン基の場合に非常に収率良く環状体の基本骨格を形成することができるために更に好ましい。 In the general formula (1), R 1 to R 6 are preferably an alkylene group having 3, 5, 7 or 8 carbon atoms from the viewpoint that the basic skeleton of the cyclic body can be easily formed. Furthermore, when all of R 1 to R 6 are straight-chain alkylene groups having 3 carbon atoms, it is more preferable because the basic skeleton of the cyclic body can be formed with a very high yield.

(その他の成分)
本発明の積層板用硬化性組成物には、必要に応じて、本発明の効果を損なわない限りにおいてその他の成分を配合することができる。配合可能なその他の成分としては、硬化促進剤、重合開始剤、溶剤等を挙げることができる。
(Other ingredients)
In the curable composition for laminates of the present invention, if necessary, other components can be blended as long as the effects of the present invention are not impaired. Examples of other components that can be blended include a curing accelerator, a polymerization initiator, and a solvent.

硬化促進剤の具体例としては、エポキシ樹脂用の硬化促進剤として従来公知のイミダゾール化合物、アミン化合物等を挙げることができる。   Specific examples of the curing accelerator include conventionally known imidazole compounds and amine compounds as curing accelerators for epoxy resins.

重合開始剤の具体例としては、ベンゾイン、ベンゾインエチルエーテル、ジベンジル、イソプロピルベンゾインエール、ベンゾフェノン、ミヒラーズケトンクロロチオキサントン、ドデシルチオキサントン、ジメチルチオキサントン、アセトフェノンジエチルケタール、ベンジルジメチルケタール、α−ヒドロキシシクロヘキシルフェニルケトン等の光重合開始剤;熱重合開始剤等を挙げることができる。   Specific examples of the polymerization initiator include benzoin, benzoin ethyl ether, dibenzyl, isopropyl benzoin ale, benzophenone, Michler's ketone chlorothioxanthone, dodecyl thioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, etc. Photopolymerization initiators; thermal polymerization initiators and the like.

また、溶剤の具体例としては、メチルエチルケトン、アセトン、エチレングリコールモノメーチルエーテル、プロピレングリコールモノメチルエーテル、メタノール、エタノール、トルエン、キシレン、ジメチルホルムアミド(DMF)、ジメチルアセトアミド(DMAc)等を挙げることができる。なお、溶剤を用いる場合には、固形分濃度が50〜70質量%となるように配合することが好ましい。   Specific examples of the solvent include methyl ethyl ketone, acetone, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, methanol, ethanol, toluene, xylene, dimethylformamide (DMF), dimethylacetamide (DMAc) and the like. . In addition, when using a solvent, it is preferable to mix | blend so that solid content concentration may be 50-70 mass%.

(カリックスアレーン系化合物の製造方法)
前記一般式(2)で表されるフェノール性水酸基を有する化合物(カリックスアレーン系化合物)は、例えば、国際公開第2005/075398号パンフレットに記載されているように、下記一般式(3)で表される化合物と下記一般式(4)で表される化合物を縮合させることにより製造することができる。
(Method for producing calixarene compound)
The compound (calixarene compound) having a phenolic hydroxyl group represented by the general formula (2) is represented by the following general formula (3) as described in, for example, International Publication No. 2005/075398. Can be produced by condensing the compound represented by the following general formula (4).

Figure 2009067908
Figure 2009067908

前記一般式(3)中、Xは、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、qは、0又は1の整数を示す。   In the general formula (3), X is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, or a substituted or unsubstituted group having 2 to 10 carbon atoms. An alkynyl group, a substituted or unsubstituted aralkyl group having 7 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, q is an integer of 0 or 1 Indicates.

Figure 2009067908
Figure 2009067908

前記一般式(4)中、Rは、炭素数1〜8の置換又は非置換のアルキレン基を示す。   In the general formula (4), R represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms.

前記一般式(3)で表される化合物は、一置換又は非置換のジヒドロキシベンゼンである。また、前記一般式(3)におけるX及びqは、前記一般式(2)におけるX〜X12及びq〜q12にそれぞれ対応する。前記一般式(3)で表される化合物の具体例としては、レゾルシノール、2−メチルレゾルシノール、2−ブチルレゾルシノール等を挙げることができる。なかでも、レゾルシノール、2−メチルレゾルシノールが好ましい。 The compound represented by the general formula (3) is monosubstituted or unsubstituted dihydroxybenzene. Moreover, X and q in the general formula (3) respectively correspond to the X 1 to X 12 and q 1 to q 12 in the general formula (2). Specific examples of the compound represented by the general formula (3) include resorcinol, 2-methylresorcinol, 2-butylresorcinol and the like. Of these, resorcinol and 2-methylresorcinol are preferable.

前記一般式(4)で表される化合物は、ジアルデヒド系の化合物である。前記一般式(4)におけるRは、前記一般式(2)におけるR〜Rに対応する。前記一般式(4)で表される化合物の具体例としては、1,5−ペンタンジアール、1,7−ヘプタンジアール、1,9−ノナンジアール、1,10−デカンジアール等を挙げることができる。なお、前記一般式(4)中のRは、プロピレン基であることが好ましい。 The compound represented by the general formula (4) is a dialdehyde compound. R in the general formula (4) corresponds to R 1 to R 6 in the general formula (2). Specific examples of the compound represented by the general formula (4) include 1,5-pentane dial, 1,7-heptane dial, 1,9-nonane dial, 1,10-decandial, and the like. . In addition, it is preferable that R in the said General formula (4) is a propylene group.

前記一般式(3)で表される化合物(以下、「化合物(A)」ともいう)と、前記一般式(4)で表される化合物(以下、「化合物(B)」ともいう)を縮合させるに際して、これらの化合物のモル比については特に制限はないが、収率の観点から、化合物(B)/化合物(A)の値(モル比)が、0.05〜0.85であることが好ましく、0.075〜0.6であることが更に好ましく、0.1〜0.3であることが特に好ましい。また、反応溶液中のモノマー濃度(化合物(A)と化合物(B)の合計の濃度)についても特に制限はないが、収率の観点から、2mol/L以上であることが好ましく、4mol/L以上であることが更に好ましく、4〜10mol/Lであることが特に好ましい。化合物(A)と化合物(B)を、触媒の存在下、適当な溶媒中で脱水縮合させることにより逐次的に反応が進み、最終的にカリックスアレーン系化合物を得ることができる。   Condensation of the compound represented by the general formula (3) (hereinafter also referred to as “compound (A)”) and the compound represented by the general formula (4) (hereinafter also referred to as “compound (B)”) In the process, the molar ratio of these compounds is not particularly limited, but from the viewpoint of yield, the value (molar ratio) of compound (B) / compound (A) is 0.05 to 0.85. Is preferable, 0.075 to 0.6 is more preferable, and 0.1 to 0.3 is particularly preferable. Further, the monomer concentration in the reaction solution (the total concentration of the compound (A) and the compound (B)) is not particularly limited, but is preferably 2 mol / L or more from the viewpoint of yield, and 4 mol / L. More preferably, it is more preferably 4 to 10 mol / L. The reaction proceeds sequentially by dehydrating and condensing the compound (A) and the compound (B) in an appropriate solvent in the presence of a catalyst, and finally a calixarene compound can be obtained.

(カリックスアレーン系化合物誘導体の製造方法)
前記一般式(1)で表されるカリックスアレーン系化合物誘導体は、例えば、国際公開第2005/075398号パンフレットに記載されているように、上述の方法によって得られる前記一般式(2)で表されるフェノール性水酸基を有する化合物(カリックスアレーン系化合物)におけるフェノール性水酸基の水素原子を、重合性官能基を有する基、アルカリ可溶性基を有する基、アルキル鎖の炭素数が1〜8の置換アルキル基で置換することにより製造することができる。なお、フェノール性水酸基の水素原子の置換は、従来公知の方法で行うことができる。例えば、ハロゲンやエポキシ基等のフェノール性水酸基との反応性を有する基と、重合性官能基等の所望の官能基とを有する化合物を、THF等の溶媒中、トリエタノールアミン等の触媒の存在下、前記一般式(2)で示される化合物に対して反応させることにより、カリックスアレーン系化合物誘導体を得ることができる。
(Method for producing calixarene compound derivative)
The calixarene compound derivative represented by the general formula (1) is represented by the general formula (2) obtained by the above-described method as described in, for example, International Publication No. 2005/075398. A hydrogen atom of a phenolic hydroxyl group in a compound having a phenolic hydroxyl group (calixarene compound), a group having a polymerizable functional group, a group having an alkali-soluble group, or a substituted alkyl group having 1 to 8 carbon atoms in the alkyl chain It can manufacture by substituting with. In addition, substitution of the hydrogen atom of a phenolic hydroxyl group can be performed by a conventionally well-known method. For example, a compound having a reactivity with a phenolic hydroxyl group such as a halogen or an epoxy group and a desired functional group such as a polymerizable functional group is present in a solvent such as THF in the presence of a catalyst such as triethanolamine. A calixarene compound derivative can be obtained by reacting with the compound represented by the general formula (2).

(積層板の製造方法)
次に、本発明の一実施形態である積層板用硬化性組成物を用いて積層板を製造する方法の一例について説明する。本実施形態の積層板用硬化性組成物は、基材に塗布又は含浸されるので、通常は溶剤に希釈した状態(液状)で用いられる。希釈する溶剤としては、前述の溶剤を用いることができる。
(Laminate production method)
Next, an example of a method for producing a laminated board using the curable composition for laminated boards according to an embodiment of the present invention will be described. Since the curable composition for laminated boards of this embodiment is apply | coated or impregnated at a base material, it is normally used in the state (liquid state) diluted with the solvent. As the solvent to be diluted, the above-mentioned solvents can be used.

ガラスクロス、ガラスペーパー、クラフト紙、リンター紙、布等の適宜な基材に積層板用硬化性組成物を含浸させた後、乾燥機中、120〜180℃の範囲で3〜10分間程度乾燥することにより、B−ステージ(半硬化)状態のプリプレグを得ることができる。得られたプリプレグを、150〜200℃、10〜50kg/cmの条件下で加熱加圧等すれば積層板を製造することができる。なお、印刷配線用の金属箔を貼り付ければ印刷配線用金属箔張積層板を製造することもできる。貼り付けることのできる金属箔の具体例としては、銅箔、アルミニウム箔、ステンレス箔等を挙げることができる。所定枚数の金属箔とプリプレグを積層成形すればよい。また、エポキシ樹脂系材料を用いて多層積層板を製造する場合には、一般的に、内層銅箔の表面を化学的に処理(黒化処理)して酸化銅とするため、成形時の温度は150〜180℃とすることが好ましい。 After impregnating the curable composition for laminates on a suitable substrate such as glass cloth, glass paper, kraft paper, linter paper, cloth, etc., it is dried for about 3 to 10 minutes at 120 to 180 ° C. in a dryer. By doing so, a prepreg in a B-stage (semi-cured) state can be obtained. If the obtained prepreg is heated and pressed under conditions of 150 to 200 ° C. and 10 to 50 kg / cm 2, a laminate can be produced. In addition, if the metal foil for printed wiring is affixed, the metal foil tension laminated board for printed wiring can also be manufactured. Specific examples of the metal foil that can be attached include copper foil, aluminum foil, and stainless steel foil. A predetermined number of metal foils and a prepreg may be laminated and formed. In addition, when manufacturing a multilayer laminate using an epoxy resin material, the surface of the inner layer copper foil is generally chemically treated (blackened) to form copper oxide. Is preferably 150 to 180 ° C.

以下、本発明を実施例に基づいて具体的に説明するが、本発明はこれらの実施例に限定されるものではない。なお、実施例、比較例中の「部」及び「%」は、特に断らない限り質量基準である。   EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples. In the examples and comparative examples, “parts” and “%” are based on mass unless otherwise specified.

(合成例1)
レゾルシノール2.20g(20mmol)をエタノール4.5mLに溶解させ塩酸1.5mL加えた。撹拌しながら5℃まで氷冷し、グルタルアルデヒドの50%水溶液0.40g(2mmol)をゆっくりと滴下した。その後、80℃で48時間加熱して黄色の懸濁液を得た。得られた懸濁液をメタノール中に注ぎ、生成した沈殿物をろ過した後、メタノールで3回洗浄した。得られた沈殿物を室温で24時間減圧乾燥し、粉末状の淡黄色固体(化合物(1))を得た。得られた化合物(1)の構造確認を、MALDI−TOF−MS、IR、及びH−NMRで行った。構造確認の結果を以下に示す。また、得られた化合物(1)の構造を下記式(5)に示す。なお、下記式(5)中、それぞれの水素原子に付した記号(a〜f)は、H−NMRのデータにおける水素の記号に対応する。
(Synthesis Example 1)
2.20 g (20 mmol) of resorcinol was dissolved in 4.5 mL of ethanol and 1.5 mL of hydrochloric acid was added. The mixture was ice-cooled to 5 ° C. with stirring, and 0.40 g (2 mmol) of a 50% aqueous solution of glutaraldehyde was slowly added dropwise. Then, it heated at 80 degreeC for 48 hours, and obtained the yellow suspension. The obtained suspension was poured into methanol, and the produced precipitate was filtered and washed with methanol three times. The obtained precipitate was dried under reduced pressure at room temperature for 24 hours to obtain a powdery pale yellow solid (compound (1)). The structure of the obtained compound (1) was confirmed by MALDI-TOF-MS, IR, and 1 H-NMR. The results of the structure confirmation are shown below. The structure of the obtained compound (1) is shown in the following formula (5). In the following formula (5), symbols (af) attached to the respective hydrogen atoms correspond to the symbols of hydrogen in 1 H-NMR data.

質量分析(MALDI−TOF−MS):分子量=1705.86の化合物のみが得られたことが示された。
収量:0.43g(収率:79%)
IR(film法、cm−1):3406(νOH);2931(νC−H);1621、1505、1436(νC=C(aromatic)
H−NMR(500MHz、溶媒;CDCl、内部標準;TMS):δ(ppm)=0.86〜2.35(b,32.0H,H,H)、3.98〜4.22(m,4.0H,H)、6.09〜7.42(m,8.0H,aromaticH,H)、8.65〜9.56(m,8.0H,OH
Mass spectrometry (MALDI-TOF-MS): It was shown that only a compound with a molecular weight of 1705.86 was obtained.
Yield: 0.43 g (Yield: 79%)
IR (film method, cm −1 ): 3406 (ν OH ); 2931 (ν C—H ); 1621, 1505, 1436 (ν C = C (aromatic) )
1 H-NMR (500 MHz, solvent; CDCl 3 , internal standard; TMS): δ (ppm) = 0.86 to 2.35 (b, 32.0H, H a , H b ), 3.98 to 4. 22 (m, 4.0H, H c ), 6.09~7.42 (m, 8.0H, aromaticH d, H e), 8.65~9.56 (m, 8.0H, OH f)

Figure 2009067908
Figure 2009067908

(合成例2)
「合成例1」で得た化合物(1)0.30g(0.18mmol、OH当量4.22mmol)、及びテトラブチルアンモニウムブロミド(TBAB)0.07g(0.21mmol)を9mLのNMPに溶解させた後、水素化ナトリウム0.25g(10.6mmol)を加え、室温で1時間撹拌した。塩形成後、3−クロロ−1,2−プロピレンオキシド1.18g(12.7mmol)更に加え、80℃で48時間撹拌した。反応終了後、酢酸エチルで希釈し、蒸留水で3回洗浄後、有機相を無水硫酸マグネシウムで乾燥させた。乾燥剤をろ別後濃縮し、良溶媒にクロロホルム、貧溶媒にn−ヘキサンを用いて再沈殿を行い、白色粉末固体(化合物(2))を得た。得られた化合物(2)の構造確認を、IR、H−NMR、及びMALDI−TOF−MSで行ったところ得られた化合物(2)のエーテル化率は100%であることが判明した。得られた化合物(2)の構造を下記式(6)に示す。
(Synthesis Example 2)
Compound (1) 0.30 g (0.18 mmol, OH equivalent 4.22 mmol) obtained in “Synthesis Example 1” and 0.07 g (0.21 mmol) of tetrabutylammonium bromide (TBAB) were dissolved in 9 mL of NMP. After that, 0.25 g (10.6 mmol) of sodium hydride was added and stirred at room temperature for 1 hour. After salt formation, 1.18 g (12.7 mmol) of 3-chloro-1,2-propylene oxide was further added, and the mixture was stirred at 80 ° C. for 48 hours. After completion of the reaction, the reaction mixture was diluted with ethyl acetate, washed three times with distilled water, and the organic phase was dried over anhydrous magnesium sulfate. The desiccant was filtered off and concentrated. Reprecipitation was performed using chloroform as a good solvent and n-hexane as a poor solvent to obtain a white powder solid (compound (2)). The structure of the obtained compound (2) was confirmed by IR, 1 H-NMR, and MALDI-TOF-MS, and it was found that the etherification rate of the obtained compound (2) was 100%. The structure of the obtained compound (2) is shown in the following formula (6).

Figure 2009067908
Figure 2009067908

(実施例1)
「合成例1」で得た化合物(1)、「合成例2」で得た化合物(2)を所定の割合で混合した後、メチルセロソルブとDMFの混合溶剤(質量比=1:1)に溶解し、40℃で30分間撹拌後、20℃まで冷却した。所定量の2−エチル−4−メチル−イミダゾールを硬化促進剤として加え、硬化性組成物を調製した。調製した硬化性組成物をガラス布に含浸させてプリプレグを得、得られたプリプレグを用いて1.6mm両面銅箔張積層板を製造した。製造した積層板の銅箔ピール強度、ガラス転移温度(Tg)、及び吸湿率を測定及び評価した。その結果、いずれについても良好な結果を示すものであり、バランスの良い耐熱特性を有する積層板を製造することができた。
Example 1
The compound (1) obtained in “Synthesis Example 1” and the compound (2) obtained in “Synthesis Example 2” were mixed at a predetermined ratio, and then mixed with a mixed solvent of methyl cellosolve and DMF (mass ratio = 1: 1). Dissolved, stirred at 40 ° C. for 30 minutes, and then cooled to 20 ° C. A predetermined amount of 2-ethyl-4-methyl-imidazole was added as a curing accelerator to prepare a curable composition. A glass cloth was impregnated with the prepared curable composition to obtain a prepreg, and a 1.6 mm double-sided copper foil-clad laminate was produced using the obtained prepreg. The copper foil peel strength, glass transition temperature (Tg), and moisture absorption rate of the manufactured laminate were measured and evaluated. As a result, good results were obtained for all, and it was possible to produce a laminate having a well-balanced heat resistance.

本発明の積層板用硬化性組成物を用いれば、十分なピール強度を有するとともに、優れた耐熱性及び吸湿性を示す積層板を製造することができる。   If the curable composition for laminated boards of this invention is used, while having sufficient peel strength, the laminated board which shows the outstanding heat resistance and moisture absorption can be manufactured.

Claims (5)

(A)下記一般式(1)で表される化合物を含む硬化型の主剤と、
(B)硬化剤と、を含有する積層板用硬化性組成物。
Figure 2009067908
(前記一般式(1)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、Z〜Z24は、相互に独立に、水素原子、重合性官能基を有する基、アルカリ可溶性基を有する基、アルキル鎖の炭素数が1〜8の置換アルキル基、又は隣り合う2つのZが結合して形成する炭素数1〜8の置換若しくは非置換アルキレン基を示し(但し、Z〜Z24のうちの少なくとも2個は、重合性官能基を有する基である)、q〜q12は、相互に独立に、0又は1の整数を示す)
(A) a curable main agent containing a compound represented by the following general formula (1);
(B) The curable composition for laminated boards containing a hardening | curing agent.
Figure 2009067908
(In the general formula (1), R 1 to R 6 each independently represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represents a carbon number. A substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, a substituted or unsubstituted group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, Z 1 to Z 24 each independently have a hydrogen atom and a polymerizable functional group. A group having an alkali-soluble group, a substituted alkyl group having 1 to 8 carbon atoms in the alkyl chain, or a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms formed by bonding two adjacent Z's ( However, Z 1 ~ At least two of the 24, a group having a polymerizable functional group), q 1 to q 12 are independently of each other, an integer of 0 or 1)
前記重合性官能基が、置換又は非置換のグリシジル基である請求項1に記載の積層板用硬化性組成物。   The curable composition for laminated boards according to claim 1, wherein the polymerizable functional group is a substituted or unsubstituted glycidyl group. 前記(B)硬化剤が、下記一般式(2)で表される化合物を含む請求項1又は2に記載の積層板用硬化性組成物。
Figure 2009067908
(前記一般式(2)中、R〜Rは、相互に独立に、炭素数1〜8の置換又は非置換アルキレン基を示し、X〜X12は、相互に独立に、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、q〜q12は、相互に独立に、0又は1の整数を示す)
The curable composition for laminates according to claim 1 or 2, wherein the (B) curing agent contains a compound represented by the following general formula (2).
Figure 2009067908
(In the general formula (2), R 1 to R 6 each independently represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms, and X 1 to X 12 each independently represents a carbon number. A substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, a substituted or unsubstituted group having 7 to 10 carbon atoms An aralkyl group, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, and q 1 to q 12 each independently represents an integer of 0 or 1)
(A)下記一般式(3)で表される化合物と、下記一般式(4)で表される化合物を縮合させて得られるフェノール性水酸基を有する化合物の、前記フェノール性水酸基の水素原子の少なくとも二つを、重合性官能基を有する基で置換した化合物を含む硬化型の主剤と、
(B)硬化剤と、を含有する積層板用硬化性組成物。
Figure 2009067908
(前記一般式(3)中、Xは、炭素数1〜10の置換若しくは非置換のアルキル基、炭素数2〜10の置換若しくは非置換のアルケニル基、炭素数2〜10の置換若しくは非置換のアルキニル基、炭素数7〜10の置換若しくは非置換のアラルキル基、炭素数1〜10の置換若しくは非置換のアルコキシ基、又は置換若しくは非置換のフェノキシ基を示し、qは、0又は1の整数を示す)
Figure 2009067908
(前記一般式(4)中、Rは、炭素数1〜8の置換又は非置換のアルキレン基を示す)
(A) at least a hydrogen atom of the phenolic hydroxyl group of a compound having a phenolic hydroxyl group obtained by condensing a compound represented by the following general formula (3) and a compound represented by the following general formula (4) A curable main agent comprising a compound in which two are substituted with a group having a polymerizable functional group;
(B) The curable composition for laminated boards containing a hardening | curing agent.
Figure 2009067908
(In the general formula (3), X represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, or a substituted or unsubstituted group having 2 to 10 carbon atoms. An alkynyl group, a substituted or unsubstituted aralkyl group having 7 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group, q is 0 or 1 Indicates an integer)
Figure 2009067908
(In the general formula (4), R represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms)
前記一般式(4)中、Rがプロピレン基である請求項4に記載の積層板用硬化性組成物。   The curable composition for laminated boards according to claim 4, wherein R in the general formula (4) is a propylene group.
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