JP2009066540A - Washing apparatus - Google Patents

Washing apparatus Download PDF

Info

Publication number
JP2009066540A
JP2009066540A JP2007238670A JP2007238670A JP2009066540A JP 2009066540 A JP2009066540 A JP 2009066540A JP 2007238670 A JP2007238670 A JP 2007238670A JP 2007238670 A JP2007238670 A JP 2007238670A JP 2009066540 A JP2009066540 A JP 2009066540A
Authority
JP
Japan
Prior art keywords
plate
cleaning
rectifying plate
aperture ratio
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007238670A
Other languages
Japanese (ja)
Inventor
Hiroshi Ezaki
博嗣 江崎
Hiroki Takahashi
広毅 高橋
Yoichi Takahara
洋一 高原
Shoji Furuhashi
省司 古橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Hitachi Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Displays Ltd filed Critical Hitachi Displays Ltd
Priority to JP2007238670A priority Critical patent/JP2009066540A/en
Publication of JP2009066540A publication Critical patent/JP2009066540A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a washing apparatus which turns a flow of a washing fluid upward to minimize a downward flow, clarifies the relationship between the aperture rates of a flow regulation plates and of a diffusion plate and the dispersion of liquid flows, and is provided with a means capable of real-timely monitoring the dispersion of liquid flows. <P>SOLUTION: The washing apparatus of the present invention is provided with a washing barrel which holds an upwardly flowing washing fluid, flow regulation plates on the surface of each of which small holes through which a washing fluid passes and which are arranged on the bottom of the washing barrel, and a diffusion plate on the surface of which small holes through which the washing fluid passes and which is situated in position above the feed port of the washing fluid and below the flow regulation plates. Further, the washing apparatus is provided with a means having a flow regulation monitoring mechanism which can visualize the liquid flow near the inside wall of the washing barrel by having one or more fine threads fixed on the inside wall of the washing barrel to real-timely monitor the dispersion of liquid flows. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は洗浄処理装置に関する。   The present invention relates to a cleaning processing apparatus.

例えば液晶表示装置及び半導体素子及びプラズマディスプレイ等の電子デバイス製造工程においては、被処理体の表面に付着したパーティクル、有機汚染物、金属汚染物等のコンタミネーションあるいは表面に形成された自然酸化膜等を除去するために洗浄処理装置が使用されている。従来のオーバーフロー型ウェット洗浄処理装置においては、洗浄処理における界面活性剤あるいは超純水等の洗浄処理液を洗浄処理槽内の下方から上方に供給し、一方、洗浄処理槽内の液流を上向きの層流とすることを目的に槽内に多数の小孔を有する整流板を設置し、その上に被処理体を保持したキャリアを載せた構造のものがあった。ここで上方及び上向きとは物体が重力により自然落下する方向の逆方向のことである。そのような構造の洗浄処理装置は、例えば特許文献1に開示されている。従来は、整流板には小孔が一様に空けられていたが、特許文献1は、整流板内の被処理体に近い部分の小孔を他の部分の小孔より大きくし、また、複数の整流板を配置して、洗浄処理槽の下方から上方に向かう一様な層流を形成し、被処理体を均一に洗浄しようとするものである。また、特許文献1においては洗浄装置内における純水の流動状況を観察する方法としてポリスチレン製の粒子を純水中に混ぜると共に、アルゴンレーザを用いてポリスチレン粒子の挙動を観察する方法を用いている。   For example, in an electronic device manufacturing process such as a liquid crystal display device, a semiconductor element, and a plasma display, contamination of particles, organic contaminants, metal contaminants, etc. attached to the surface of the object to be processed, or a natural oxide film formed on the surface A cleaning processing apparatus is used to remove water. In the conventional overflow type wet cleaning processing apparatus, a cleaning processing liquid such as a surfactant or ultrapure water in the cleaning processing is supplied from the bottom to the top in the cleaning processing tank, while the liquid flow in the cleaning processing tank is directed upward. There is a structure in which a rectifying plate having a large number of small holes is installed in a tank and a carrier holding an object to be processed is placed on the rectifying plate for the purpose of forming a laminar flow. Here, upward and upward are directions opposite to the direction in which an object naturally falls due to gravity. A cleaning processing apparatus having such a structure is disclosed in Patent Document 1, for example. Conventionally, the small holes are uniformly formed in the current plate, but Patent Document 1 makes the small holes in the portion near the workpiece in the current plate larger than the small holes in the other parts, A plurality of rectifying plates are arranged to form a uniform laminar flow from the lower side to the upper side of the cleaning treatment tank so as to uniformly clean the object to be processed. In Patent Document 1, as a method of observing the flow state of pure water in the cleaning device, a method of observing the behavior of polystyrene particles using an argon laser while mixing polystyrene particles in pure water is used. .

特許文献2には、整流板と供給口の上方に配置した拡散板とで構成した整流手段を具備した洗浄処理装置において、洗浄処理液の阻流壁を形成することにより、処理槽内を上昇する洗浄処理液に乱流が起こるのを防止することができることが開示されている。   In Patent Document 2, in a cleaning processing apparatus having a rectifying means composed of a rectifying plate and a diffusion plate disposed above a supply port, the inside of the processing tank is raised by forming a blocking wall for the cleaning processing liquid. It is disclosed that turbulence can be prevented from occurring in the cleaning treatment liquid.

また、特許文献3には、整流板のそれぞれに設けた小孔の位置を互いに隣接する整流板間で相互にずらせたことにより、洗浄処理液の整流化に寄与することが開示されている。   Patent Document 3 discloses that the positions of the small holes provided in each of the rectifying plates are shifted from each other between the rectifying plates adjacent to each other, thereby contributing to rectification of the cleaning liquid.

特開平4−56321号公報Japanese Patent Laid-Open No. 4-56321 特開平6−333907号公報JP-A-6-333907 特開平7−161677号公報JP-A-7-161677

従来の洗浄処理装置において、整流板を設置せずに洗浄処理槽底面中央から洗浄処理液を下方から上方へ流通させ、被処理体を浸漬し洗浄処理を行った場合、洗浄処理槽中心付近の液流と洗浄処理槽壁面付近の液流が部分的に逆流になるという問題があった。その為、被処理体表面から剥がれたパーティクル等の汚染が、逆流により被処理体表面に再度運ばれ、被処理体表面に再付着するという問題があった。   In a conventional cleaning processing apparatus, when the cleaning processing liquid is circulated from the bottom to the top from the center of the bottom surface of the cleaning processing tank without installing a current plate, and the cleaning target is immersed and cleaned, the vicinity of the center of the cleaning processing tank There was a problem that the liquid flow and the liquid flow in the vicinity of the wall of the cleaning treatment tank were partially reversed. For this reason, there has been a problem that contamination such as particles peeled off from the surface of the object to be processed is transported again to the surface of the object to be processed by the backflow and reattached to the surface of the object to be processed.

逆流が発生する問題を解決する為に、特許文献1〜3において、整流板及び拡散板を洗浄槽底部に設置することにより、洗浄処理槽の下方から上方に向かう一様な液流を形成させ、被処理体表面から剥がれたパーティクル等の汚染を効率的に洗浄処理槽外に排出する手段が開示されている。しかしながら、このような洗浄処理装置において、整流板及び拡散板の開口率と液流のバラツキの関係が明確でない為、洗浄処理槽の形状を変化させると、整流板及び拡散板を設置しても洗浄処理槽の下方から上方に向かう一様な液流を形成させることができないという問題があった。ここで開口率とは整流板及び拡散板の面積に対する小孔の面積の総和をパーセンテージで表したものである。また、液流のバラツキとは式1に示す通り、後述する観測方法で洗浄槽内の任意の複数点で観測した流速の標準偏差σのことである。流れの向きが槽の上方へ向かう場合をプラスとし、流れが下向きの場合をマイナスとして標準偏差すなわち液流のバラツキを求めた。   In order to solve the problem of backflow, in Patent Documents 1 to 3, a rectifying plate and a diffusing plate are installed at the bottom of the cleaning tank, thereby forming a uniform liquid flow from the bottom to the top of the cleaning tank. A means for efficiently discharging contamination such as particles peeled off from the surface of the object to be processed out of the cleaning treatment tank is disclosed. However, in such a cleaning processing apparatus, since the relationship between the aperture ratio of the rectifying plate and the diffusion plate and the variation in the liquid flow is not clear, if the shape of the cleaning processing tank is changed, the rectifying plate and the diffusing plate may be installed. There was a problem that a uniform liquid flow from the bottom to the top of the cleaning treatment tank could not be formed. Here, the aperture ratio is a percentage of the total area of the small holes with respect to the areas of the current plate and the diffusion plate. Further, the variation in the liquid flow is a standard deviation σ of the flow velocity observed at a plurality of arbitrary points in the cleaning tank by the observation method described later, as shown in Equation 1. The standard deviation, that is, the variation in the liquid flow, was obtained by setting the case where the flow direction is upward of the tank as a positive value and the case where the flow direction is downward as a negative value.

Figure 2009066540
Figure 2009066540

また、特許文献1においては、洗浄装置内における純水の流動状況を観察する方法としてポリスチレン製の粒子を純水中に混ぜると共に、アルゴンレーザを用いてポリスチレン粒子の挙動を観察する方法を用いているが、流動状況を観測する為の時間が掛かり、実際の製造ラインにおける流動状況を把握することが困難であるという問題があった。   Moreover, in patent document 1, while using the method of observing the behavior of a polystyrene particle using an argon laser while mixing the particle | grains made from a polystyrene as a method of observing the flow condition of the pure water in a washing | cleaning apparatus. However, there is a problem that it takes time to observe the flow state and it is difficult to grasp the flow state in the actual production line.

一方、特許文献3において、整流板のそれぞれに設けた小孔の位置を互いに隣接する整流板間で相互にずらせたことにより、洗浄処理液の整流化に寄与することが開示されているが、相互にずらす事の具体的な手法が明らかになっていないという問題があった。   On the other hand, Patent Document 3 discloses that the position of the small holes provided in each of the rectifying plates is mutually shifted between the rectifying plates adjacent to each other, thereby contributing to the rectification of the cleaning treatment liquid. There was a problem that the specific method of shifting was not clarified.

この発明は上記事情に鑑みなされたもので、洗浄処理液の洗浄処理槽内流れを上向きの流れとし、下向きの流れを最小にすると共に、整流板及び拡散板の開口率と液流のバラツキの関係を明確にし、液流のバラツキを実際の製造ラインにおいてリアルタイムにモニターできる手段を具備した洗浄処理装置を提供することを目的とするものである。   The present invention has been made in view of the above circumstances, and the flow of the cleaning treatment liquid in the cleaning treatment tank is an upward flow, the downward flow is minimized, and the opening ratio of the rectifying plate and the diffusion plate and the variation of the liquid flow are reduced. It is an object of the present invention to provide a cleaning processing apparatus having means for clarifying the relationship and capable of monitoring liquid flow variations in real time in an actual production line.

本発明に係る洗浄処理装置は、例えば液晶表示装置の液晶セルの全体または一部を被処理体とするものであって、上方向に流れる洗浄処理液を貯留し、当該洗浄処理液に被処理体が浸漬される洗浄処理槽と、洗浄処理槽の洗浄処理液面からオーバーフローして排出される洗浄処理液を回収する洗浄処理液受け皿と、洗浄処理槽の供給口へ洗浄処理液を供給するポンプと、被処理体を充填した洗浄バスケットを洗浄処理槽間搬送ロボットアームが保持し洗浄処理槽中に吊るす機構と、を有し、洗浄処理槽内底部の洗浄処理液供給口にそれぞれ洗浄処理液を流通させる1個もしくは複数の小孔が面内に配列された1枚もしくは複数枚の整流板と、上記供給口の上方と上記整流板の下方に位置する、それぞれ洗浄処理液を流通させる1個もしくは複数の小孔が面内に配列された拡散板と、を有し、洗浄処理槽内壁面に整流モニター機構を一箇所ないし複数箇所有していることを特徴とする。   The cleaning processing apparatus according to the present invention uses, for example, the whole or a part of the liquid crystal cell of the liquid crystal display device as an object to be processed, stores the cleaning processing liquid flowing upward, and performs processing on the cleaning processing liquid. The cleaning treatment tank in which the body is immersed, the washing treatment liquid receiving tray for collecting the washing treatment liquid overflowing and discharged from the washing treatment liquid surface of the washing treatment tank, and the washing treatment liquid being supplied to the supply port of the washing treatment tank A cleaning mechanism that holds the cleaning basket filled with the object to be processed and is held by the transfer robot arm between the cleaning processing tanks, and suspends the cleaning basket in the cleaning processing tank at the bottom of the cleaning processing tank. One or a plurality of rectifying plates in which one or a plurality of small holes through which the liquid circulates are arranged in a plane, and a cleaning treatment liquid positioned above the supply port and below the rectifying plate are circulated. One or more And a diffusion plate in which the small holes are arranged in the plane, and one or a plurality of rectification monitoring mechanisms are provided on the inner wall surface of the cleaning treatment tank.

本発明に係る整流モニター機構は、洗浄処理槽内壁面に一本ないし複数本の細糸が固定されることにより、洗浄処理槽内壁面近傍の液流が可視化される機構を有することを特徴とする。   The rectification monitoring mechanism according to the present invention has a mechanism that visualizes the liquid flow in the vicinity of the inner wall surface of the cleaning treatment tank by fixing one or more thin threads on the inner wall surface of the cleaning processing tank. To do.

本発明に係る洗浄処理装置の整流板は、洗浄処理槽底面の面積と同等もしくはそれ以下の面積を有する整流板Aと、上記整流板Aの一方面と接した、洗浄処理槽底面の面積から洗浄バスケット底面の面積分を差し引いた面積を有する整流板Bと、槽底面へ固定もしくは接触させて配置する為の整流板取付け脚と、を有し、洗浄処理液を流通させる1個もしくは複数の小孔は正方形格子の格子点に配置されることを特徴とする。   The flow straightening plate of the cleaning treatment apparatus according to the present invention has a flow straightening plate A having an area equal to or less than the area of the bottom surface of the washing treatment tank, and the area of the bottom surface of the washing treatment tank in contact with one surface of the flow straightening plate A. One or a plurality of rectifying plates B having an area obtained by subtracting the area of the bottom surface of the cleaning basket, and rectifying plate mounting legs for arranging the rectifying plate to be fixed or in contact with the bottom surface of the tank The small holes are arranged at lattice points of a square lattice.

本発明に係る洗浄処理装置の整流板上に設けた洗浄処理液を流通させる1個もしくは複数の小孔は、例えば、直径5mmの円形小孔が配列され、小孔を正方形格子の各交点に配置する配列パターンにおいて、小孔の配列ピッチは中心間隔で12mmに設定されることを特徴とする。   The one or more small holes through which the cleaning solution provided on the current plate of the cleaning apparatus according to the present invention flows are arranged, for example, as circular holes having a diameter of 5 mm, and the small holes are arranged at each intersection of the square lattice. In the arrangement pattern to be arranged, the arrangement pitch of the small holes is set to 12 mm at the center interval.

本発明に係る洗浄処理装置の整流板Bは、洗浄槽の直方体の長辺と同等の横幅を有する長辺側整流板と、直方体の短辺と同等の横幅を有する短辺側整流板とを有していることを特徴とする。   The rectifying plate B of the cleaning treatment apparatus according to the present invention includes a long side rectifying plate having a width equal to the long side of the rectangular parallelepiped of the cleaning tank, and a short side rectifying plate having a width equal to the short side of the cuboid. It is characterized by having.

ここで、本発明に係る洗浄処理槽は、洗浄処理液がオーバーフローして排出される面が開放された、立方体または長方形の形状を有している。前記した長辺側整流板及び短辺側整流板は、それぞれ洗浄処理槽底面の長辺方向および短辺方向に配置された整流板を示す。   Here, the cleaning treatment tank according to the present invention has a cubic or rectangular shape with an open surface on which the cleaning treatment liquid overflows and is discharged. The long side rectifying plate and the short side rectifying plate described above indicate the rectifying plates disposed in the long side direction and the short side direction of the bottom surface of the cleaning treatment tank, respectively.

本発明に係る洗浄処理装置の長辺側整流板と短辺側整流板は、整流板Aの一方面と接し長辺及び短辺側整流板を整流板Aに対してスライドさせ、両整流板それぞれに設けられた小孔のオーバーラップ部分によって形成される小孔の面積を可変とするスライド機構とを有していることを特徴とする。   The long-side rectifying plate and the short-side rectifying plate of the cleaning treatment apparatus according to the present invention are in contact with one surface of the rectifying plate A, and the long-side and short-side rectifying plates are slid with respect to the rectifying plate A. It has a slide mechanism which makes variable the area of the small hole formed by the overlap part of the small hole provided in each, It is characterized by the above-mentioned.

本発明に係る洗浄処理装置の長辺側整流板と短辺側整流板のスライドによって形成される整流板Aとのオーバーラップ部分によって形成される小孔の開口率は、望ましくは、12%から8%の範囲内であることを特徴とする。   The aperture ratio of the small holes formed by the overlapping portion of the rectifying plate A formed by the slide of the long side rectifying plate and the short side rectifying plate of the cleaning treatment apparatus according to the present invention is preferably from 12%. It is characterized by being in the range of 8%.

本発明に係る洗浄処理装置の拡散板は、整流板の下側に供給口の上に重なるように取付けることができ、供給口と拡散板間の高さを調整できる機構を有し、洗浄処理液を流通させる1個もしくは複数の小孔は同心円状に配置されることを特徴とする。   The diffusion plate of the cleaning processing apparatus according to the present invention can be attached to the lower side of the rectifying plate so as to overlap the supply port, and has a mechanism capable of adjusting the height between the supply port and the diffusion plate. One or a plurality of small holes through which the liquid flows are arranged concentrically.

本発明に係る洗浄処理装置の拡散板の小孔は、小孔を流通する洗浄処理液をせき止める役割を担う物体で塞がれる機構と、この物体の取付け及び取外しによって拡散板の開口率を変えることのできる機構を有していることを特徴とする。この物体は例えば小孔と同径のネジやゴム栓やその他の物質である。   The small hole of the diffusion plate of the cleaning processing apparatus according to the present invention has a mechanism that is blocked by an object that plays a role of blocking the cleaning processing liquid flowing through the small hole, and changes the aperture ratio of the diffusion plate by attaching and removing the object. It has the mechanism which can do. This object is, for example, a screw, rubber plug or other substance having the same diameter as the small hole.

本発明に係る洗浄処理装置の拡散板に設けられる小孔の開口率は、望ましくは、20%から14%の範囲内であることを特徴とする。   The aperture ratio of the small holes provided in the diffusion plate of the cleaning processing apparatus according to the present invention is preferably in the range of 20% to 14%.

本発明によれば、洗浄処理槽内の整流板及び拡散板と洗浄処理液面との間の洗浄処理液の流れを上向きの流れにし、下向きの流れを最小にすることができる。これにより、被処理体から遊離した汚染物質が速やかに洗浄処理液面から排出され、被処理体への再付着が抑制される。   According to the present invention, the flow of the cleaning treatment liquid between the flow straightening plate and diffusion plate in the cleaning treatment tank and the surface of the cleaning treatment liquid can be made upward, and the downward flow can be minimized. As a result, the contaminants released from the object to be processed are quickly discharged from the cleaning liquid surface, and reattachment to the object to be processed is suppressed.

以下、本発明の実施の形態を図面に基づいて詳細に説明する。ここでは、本発明の洗浄処理装置を液晶セルの洗浄処理装置に適用した場合について説明する。なお、実施の形態を説明する為の全図において、同一の部材には原則として同一の符号を付し、その繰り返しの説明は省略する。また、以下の実施の形態では、特に必要なとき以外は同一または同様な部分の説明を原則として繰り返さない。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, a case where the cleaning processing apparatus of the present invention is applied to a cleaning processing apparatus for a liquid crystal cell will be described. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

さらに、以下の実施の形態では、便宜上その必要があるときは、複数のセクションまたは実施の形態に分割して説明するが、とくに明示した場合を除き、それらは互いに無関係なものではなく、一方は他方の一部または全部の変形例、詳細、補足説明などの関係にある。また、以下の実施の形態において、要素の数など(個数、数値、量、範囲などを含む)に言及する場合、特に明示したとき及び原理的に明らかに特定の数に限定されるときを除き、その特定の数に限定されるものではなく、特定の数以上でも以下でもよい。さらに、以下の実施の形態において、その構成要素(要素ステップなどを含む)は、特に明示した場合および原理的に明らかに必須であると考えられる場合を除き、必ずしも必須のものではないことは言うまでもない。   Furthermore, in the following embodiments, when necessary, for convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant, and one of them is The other part or all of the modifications, details, supplementary explanations, and the like are related. In the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), unless explicitly stated or in principle, the number is limited to a specific number. It is not limited to the specific number, and may be a specific number or more. Further, in the following embodiments, it is needless to say that the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Yes.

同様に、以下の実施の形態において、構成要素などの形状、位置関係などに言及するときは、特に明示した場合及び原理的に明らかにそうでないと考えられる場合を除き、実質的にその形状などに近似または類似するものなどを含むものとする。このことは、上記数値及び範囲についても同様である。   Similarly, in the following embodiments, when referring to the shape and positional relationship of components and the like, the shape and the like of the component are substantially different unless explicitly stated or otherwise considered in principle. Including those that are approximate or similar to. The same applies to the above numerical values and ranges.

図1は本発明による洗浄処理装置の第一実施例の概略構造を示す断面図である。当該洗浄処理装置は、液晶セル9を洗浄処理槽16の底面に対して垂直に設置する図示しないカセットを最大で6列2段設置する洗浄バスケット5と、当該洗浄バスケット5を浸漬して液晶セル9を洗浄するための洗浄処理液を満たした洗浄処理槽16と、洗浄処理槽からオーバーフローした洗浄処理液を回収するための洗浄処理液受け皿19とに、洗浄処理液を供給する為のポンプ35と、洗浄処理槽16への洗浄処理液の流入を制御する為のバルブ34と、洗浄処理液の洗浄処理槽16内の液流を整流化する為の整流板3,4及び拡散板2と、洗浄処理槽16内の液流をモニターする為の整流モニター機構6とから構成される。尚、図示しないが、当該洗浄処理装置はこれらの構成に加えて、洗浄処理液の温度を調節するための機能部や被処理体からの汚染物質剥離促進のための超音波印加機能部を有していても構わない。また、洗浄バスケット5は洗浄バスケット吊り下げ部33に洗浄処理槽間搬送ロボットアーム14で支持され、洗浄処理槽16内に吊るされた状態で保持される。さらに、洗浄バスケット5は液晶セル9が洗浄された後に、洗浄処理槽間搬送ロボットアーム14で引き上げられ、図示しない他の洗浄処理装置もしくは図示しない他の工程の処理装置へと搬送される。   FIG. 1 is a sectional view showing a schematic structure of a first embodiment of a cleaning apparatus according to the present invention. The cleaning processing apparatus includes a cleaning basket 5 in which cassettes (not shown) that are installed vertically with respect to the bottom of the cleaning processing tank 16 are installed in six rows and two stages, and a liquid crystal cell that is immersed in the cleaning basket 5 Pump 35 for supplying the cleaning treatment liquid to the cleaning treatment tank 16 filled with the cleaning treatment liquid for washing 9 and the washing treatment liquid receiving tray 19 for collecting the cleaning treatment liquid overflowing from the washing treatment tank A valve 34 for controlling the inflow of the cleaning treatment liquid into the cleaning treatment tank 16, a rectifying plate 3, 4 and a diffusion plate 2 for rectifying the liquid flow of the cleaning treatment liquid in the cleaning treatment tank 16; And a rectifying monitor mechanism 6 for monitoring the liquid flow in the cleaning treatment tank 16. Although not shown, in addition to these components, the cleaning processing apparatus has a function unit for adjusting the temperature of the cleaning process liquid and an ultrasonic wave application function unit for promoting the peeling of contaminants from the object to be processed. It does not matter. Further, the cleaning basket 5 is supported by the cleaning basket suspension robot 33 by the transfer robot arm 14 between the cleaning processing tanks, and is held in a state of being suspended in the cleaning processing tank 16. Further, after the liquid crystal cell 9 is cleaned, the cleaning basket 5 is pulled up by the cleaning tank transfer robot arm 14 and is transferred to another cleaning processing apparatus (not shown) or a processing apparatus of another process (not shown).

図1中に示した矢印は洗浄処理液の液流を示しており、洗浄処理液供給口1から供給された洗浄処理液は洗浄処理槽16の上方へ向かって噴出され、各液晶セル9間を通り、洗浄処理液面15付近へ達した洗浄処理液は矢印17に示すように洗浄処理槽16からオーバーフローし、洗浄処理液受け皿19でオーバーフローした洗浄処理液が回収されるようになっている。   The arrows shown in FIG. 1 indicate the flow of the cleaning processing liquid, and the cleaning processing liquid supplied from the cleaning processing liquid supply port 1 is ejected toward the upper side of the cleaning processing tank 16 between the liquid crystal cells 9. As shown by the arrow 17, the cleaning liquid that has reached the vicinity of the cleaning liquid level 15 overflows from the cleaning tank 16, and the cleaning liquid that has overflowed in the cleaning liquid tray 19 is recovered. .

図2は本発明による整流板と拡散板及び取付け脚の取付け態様を示す分解斜視図である。整流板A 3は洗浄バスケット5の下方に整流板取付け脚7に高さ調整ナット8で固定して取付ける。上記整流板取付け脚7の表面と高さ調整ナット8の内側にネジ山を施しておき、相互にオスネジ及びメスネジの関係にする。この際、高さ調整ナット8を二つ用いて整流板A 3を挟み込む構造で固定するか、整流板A 3の下側だけに高さ調整ナット8を一つ用いて整流板A 3を置く構造にするかはどちらでも良い。また、ここでは図3に示すように、整流板取付け脚7は4本を洗浄処理槽の四隅に配置するように設置したが、整流板が液流によって動かなければどの様な設置方法を取っても良い。さらに、整流板A 3の上側(洗浄処理液面15側)にそれぞれの一方面と接して短辺側整流板4a及び長辺側整流板4bを設置する。短辺側整流板4a及び長辺側整流板4bはそれぞれ短辺側整流板開口率調整ネジ10aと短辺側整流板開口率調整ナット10b、長辺側整流板開口率調整ネジ12aと長辺側整流板開口率調整ナット12bで整流板A 3上に設置される。さらに、拡散板2は整流板A 3の下側に拡散板取付け脚11aと拡散板高さ調整ナット11bを用いて洗浄処理液供給口1の上に重なるように設置される。また、ここでは図4に示すように、拡散板取付け脚11aは4本を拡散板の外周の4点に配置するように設置したが、拡散板が液流によって動かず且つ液流の妨げにならなければどの様な設置方法を取っても良い。   FIG. 2 is an exploded perspective view showing how the rectifying plate, the diffusing plate, and the mounting leg are attached according to the present invention. The rectifying plate A 3 is fixed to the rectifying plate mounting leg 7 below the cleaning basket 5 with a height adjusting nut 8. A screw thread is provided on the surface of the rectifying plate mounting leg 7 and the inside of the height adjusting nut 8 so as to have a male screw and a female screw. At this time, use two height adjustment nuts 8 to fix the current plate A 3 so that it is sandwiched, or place the current plate A 3 using only one height adjustment nut 8 below the current plate A 3. Either structure is acceptable. In addition, as shown in FIG. 3, four rectifying plate mounting legs 7 are installed at the four corners of the cleaning treatment tank. However, if the rectifying plate is not moved by the liquid flow, any installation method is adopted. May be. Further, the short-side rectifying plate 4a and the long-side rectifying plate 4b are installed on the upper side of the rectifying plate A3 (on the cleaning treatment liquid surface 15 side) in contact with the respective one surfaces. Short side rectifying plate 4a and long side rectifying plate 4b are short side rectifying plate opening rate adjusting screw 10a and short side rectifying plate opening rate adjusting nut 10b, long side side rectifying plate opening rate adjusting screw 12a and long side, respectively. It is installed on the rectifying plate A3 by the side rectifying plate opening ratio adjusting nut 12b. Further, the diffusion plate 2 is installed on the lower side of the rectifying plate A 3 so as to overlap the cleaning treatment liquid supply port 1 using the diffusion plate mounting legs 11a and the diffusion plate height adjustment nut 11b. Further, here, as shown in FIG. 4, the four diffusion plate mounting legs 11a are installed at four points on the outer periphery of the diffusion plate. However, the diffusion plate is not moved by the liquid flow and obstructs the liquid flow. If not, you can take any installation method.

図5は本発明による拡散板2と拡散板取付け脚11aと拡散板高さ調整ナット11bとの詳細な取付け方法を図示したものである。拡散板2の下側から拡散板取付け脚11aを押え板11cとワッシャ11dと共に差し込み、拡散板2の上側から拡散板高さ調整ナット11bと押え板11cとワッシャ11dとに拡散板取付け脚11aの脚部分を通し、拡散板2と拡散板取付け脚11aを固定する。他の拡散板取付け脚11aも同様に取付ける。上記拡散板取付け脚11aの表面と拡散板高さ調整ナット11bの内側にネジ山を施しておき、相互にオスネジ及びメスネジの関係にする。   FIG. 5 shows a detailed mounting method of the diffusion plate 2, the diffusion plate mounting leg 11a, and the diffusion plate height adjusting nut 11b according to the present invention. The diffusion plate mounting leg 11a is inserted from the lower side of the diffusion plate 2 together with the holding plate 11c and the washer 11d, and from the upper side of the diffusion plate 2, the diffusion plate height adjusting nut 11b, the holding plate 11c and the washer 11d are connected to the diffusion plate mounting leg 11a. The diffusion plate 2 and the diffusion plate mounting leg 11a are fixed through the leg portion. The other diffusion plate mounting legs 11a are mounted in the same manner. A screw thread is provided on the surface of the diffusion plate mounting leg 11a and the inner side of the diffusion plate height adjusting nut 11b so that the male screw and the female screw are in mutual relation.

図6は本発明による整流板A 3と拡散板2及び拡散板取付け脚11aの取付け態様を示す拡大断面図である。拡散板2と拡散板取付け脚11aとを取付けた上記部品を整流板A 3の下側に、拡散板高さ調整ナット11bと押え板11cとワッシャ11dの3個の部品を2セット用い、整流板A 3を挟み込む構造で拡散板取付け脚11aを通して固定する。他の拡散板取付け脚11aも同様に取付ける。この際、拡散板取付け脚11aの脚部分の長さ分だけ整流板A 3と拡散板2との間の距離を可変にできる。また、拡散板取付け脚11aの脚部分の径を洗浄処理液流通小孔20に通すことができる大きさにしておけば、洗浄処理液供給口1の位置が変化しても、拡散板2の取付け位置をそれに合わせて対応できる。   FIG. 6 is an enlarged cross-sectional view showing how the rectifying plate A3, the diffusing plate 2 and the diffusing plate mounting leg 11a are attached according to the present invention. Using two sets of three parts, diffusion plate height adjustment nut 11b, presser plate 11c, and washer 11d, on the lower side of the rectifying plate A3, the above parts with the diffusion plate 2 and diffusion plate mounting leg 11a attached The plate A 3 is sandwiched and fixed through the diffusion plate mounting leg 11a. The other diffusion plate mounting legs 11a are mounted in the same manner. At this time, the distance between the rectifying plate A 3 and the diffusion plate 2 can be made variable by the length of the leg portion of the diffusion plate mounting leg 11a. Further, if the diameter of the leg portion of the diffusion plate mounting leg 11a is made large enough to pass through the cleaning treatment liquid circulation small hole 20, even if the position of the cleaning treatment solution supply port 1 changes, the diffusion plate 2 The mounting position can be adjusted accordingly.

以下に請求項6に示した、拡散板のそれぞれに設けた小孔を塞ぐことにより、拡散板の開口率を変化させる構造について図示して説明する。   A structure for changing the aperture ratio of the diffusion plate by closing small holes provided in each of the diffusion plates shown in claim 6 will be described below.

図7は第一実施例における開口率20%の拡散板2を示す平面図である。ここで拡散板2は例えば円形のものを示すが、その他に正方形や長方形や三角形やひし形などでも良い。洗浄処理液流通小孔20は拡散板2の中心と外周との同心円状に配置させる。その関係は以下の通りである。拡散板2の半径をRとし、Rを4等分し1/4R、2/4R、3/4Rの半径の同心円上に洗浄処理液流通小孔20を設ける。1/4Rと2/4Rの円上には円周を8等分する配置で洗浄処理液流通小孔20を設け、3/4Rの円上には円周を16等分する配置で洗浄処理液流通小孔20を設けた。但し、拡散板取付け脚11aのヘッド部分が同心円上にある場合は、洗浄処理液流通小孔20を設けない。ここで、洗浄処理液流通小孔20の形状は例えば円状のものを示すが、その他に正方形や長方形や三角形やひし形などでも良い。本発明においては円状孔直径4mmのものを上記同心円状に配置させる。開口率は前述の通り整流板及び拡散板の面積に対する孔の面積の総和をパーセンテージで表したものである。従って、本実施例においては拡散板2の半径Rを24.5mmとするならば、拡散板の面積は約1885mm2となり、洗浄処理液流通小孔20の面積の総和は約377 mm2となる。つまり拡散板の開口率は約20%と表すことができる。その他の拡散板の開口率も同様に表すことができる。 FIG. 7 is a plan view showing the diffusion plate 2 having an aperture ratio of 20% in the first embodiment. Here, the diffusion plate 2 is, for example, a circular one, but may be a square, a rectangle, a triangle, a rhombus, or the like. The cleaning treatment liquid circulation small holes 20 are arranged concentrically with the center and the outer periphery of the diffusion plate 2. The relationship is as follows. The radius of the diffusing plate 2 is R, and R is divided into four equal parts, and the cleaning treatment liquid circulation small holes 20 are provided on concentric circles having radii of 1 / 4R, 2 / 4R, and 3 / 4R. On the 1 / 4R and 2 / 4R circles, there is a small hole 20 for cleaning treatment liquid arranged to divide the circumference into 8 equal parts, and on the 3 / 4R circle, the washing process is arranged to divide the circumference into 16 equal parts. A liquid flow small hole 20 was provided. However, when the head portion of the diffusion plate mounting leg 11a is concentric, the cleaning treatment liquid circulation small hole 20 is not provided. Here, the shape of the cleaning treatment liquid circulation small hole 20 is, for example, circular, but may be a square, a rectangle, a triangle, a rhombus, or the like. In the present invention, those having a circular hole diameter of 4 mm are arranged concentrically. As described above, the aperture ratio is a percentage of the total area of the holes with respect to the areas of the current plate and the diffusion plate. Therefore, if a 24.5mm radius R of the diffuser 2 in this embodiment, the area of the diffuser about 1885Mm 2 becomes, the total area of the cleaning liquid flow ostium 20 of about 377 mm 2. That is, the aperture ratio of the diffusion plate can be expressed as about 20%. The aperture ratios of other diffusion plates can be similarly expressed.

図8は第一実施例における開口率14%の拡散板を示す平面図である。洗浄処理液流通小孔20の配置は図7で述べた配置と同様である。ここでは洗浄処理液流通小孔20に拡散板開口率調整ネジ21をはめる事により開口率が14%となるように調整する。拡散板開口率調整ネジ21はここでは便宜上ネジと呼んでいるが、洗浄処理液流通小孔20を通過する洗浄処理液の液流をせき止める役割をする物体であり、且つ洗浄処理液に浸食されず洗浄処理液中にパーティクル等の汚染物質を撒き散らさない物体であればどの様なものでも良い。例えばこのような条件を満たす物体として、ステンレス製のネジが挙げられる。   FIG. 8 is a plan view showing a diffusion plate having an aperture ratio of 14% in the first embodiment. The arrangement of the cleaning solution circulation small holes 20 is the same as that shown in FIG. Here, the aperture ratio is adjusted to 14% by fitting the diffusion plate aperture ratio adjusting screw 21 to the cleaning treatment liquid circulation small hole 20. The diffusion plate opening ratio adjusting screw 21 is referred to as a screw here for convenience, but is an object that serves to block the flow of the cleaning processing liquid passing through the cleaning processing liquid circulation small holes 20, and is eroded by the cleaning processing liquid. Any object may be used as long as it does not scatter contaminants such as particles in the cleaning solution. For example, a stainless steel screw is an example of an object that satisfies such conditions.

図9は第一実施例における開口率8%の拡散板を示す平面図である。洗浄処理液流通小孔20の配置は小孔の中心と中心を正方形格子状の1点として各頂点に合計8個配置し、また小孔の中心と拡散板取付け脚11aのヘッド部分との間を結ぶ線から±45度の角度で、かつ上記正方形格子状に配置した小孔の中心から15mmの位置に配置される。   FIG. 9 is a plan view showing a diffusion plate having an aperture ratio of 8% in the first embodiment. As for the arrangement of the cleaning solution circulation small holes 20, the center of the small holes and the center of the small holes 20 are arranged at each apex, and a total of eight holes are arranged at each vertex, and between the center of the small holes and the head portion of the diffusion plate mounting leg 11a. Is arranged at a position of 15 mm from the center of the small holes arranged in a square lattice shape at an angle of ± 45 degrees from the line connecting the two.

図10は第一実施例における開口率40%の拡散板を示す平面図である。洗浄処理液流通四角小孔24の形状は一辺が2mmの正四角形をしており、各四角小孔の中心と他方の四角小孔の中心との間隔は4mmにすることにより開口率が40%に設定される。   FIG. 10 is a plan view showing a diffusion plate having an aperture ratio of 40% in the first embodiment. The shape of the cleaning liquid flow square hole 24 is a square with a side of 2 mm, and the opening ratio is 40% by setting the distance between the center of each square hole and the center of the other square hole to 4 mm. Set to

以下に請求項3に示した、整流板のそれぞれに設けた小孔の位置を整流板間で相互にずらせることにより、整流板の開口率を可変とする構造を図示して説明する。   A structure for changing the aperture ratio of the rectifying plate by shifting the positions of the small holes provided in each of the rectifying plates between the rectifying plates will be described below.

図11は第一実施例における開口率12%の整流板を示す拡大断面図である。整流板A 3と整流板B 4が互いの一方の面同士を接して、短辺側整流板開口率調整ネジ10a及び長辺側整流板開口率調整ネジ12aと、短辺側整流板開口率調整ナット10b及び長辺側整流板開口率調整ナット12bとで挟み込んで設置されている。この際、整流板A側洗浄処理液流通小孔20aと整流板B側洗浄処理液流通小孔20bが重ね合わせて設置することにより、整流板全面の開口率が12%に設定される。矢印25は開口率12%整流板における洗浄処理液の液流の様子を示す。整流板A側洗浄処理液流通小孔20aと整流板B側洗浄処理液流通小孔20bが重ね合わせて設置されていることにより、小孔を流通する液流は洗浄処理液自身の粘度以外の影響を受けないことがわかる。洗浄処理槽内全体の液流としては、整流板の小孔を施していない部分の抵抗を受け、全ての液流が小孔と流通して洗浄処理液面15方向である上向きへ流れる。   FIG. 11 is an enlarged cross-sectional view showing a current plate having an aperture ratio of 12% in the first embodiment. The rectifying plate A 3 and the rectifying plate B 4 are in contact with each other, and the short side rectifying plate opening ratio adjusting screw 10a, the long side rectifying plate opening ratio adjusting screw 12a, and the short side rectifying plate opening ratio The adjustment nut 10b and the long side rectifying plate opening ratio adjustment nut 12b are sandwiched and installed. At this time, the opening ratio of the entire surface of the rectifying plate is set to 12% by arranging the rectifying plate A side cleaning treatment liquid circulation small holes 20a and the rectifying plate B side cleaning treatment liquid circulation small holes 20b in an overlapping manner. An arrow 25 indicates a state of the flow of the cleaning treatment liquid on the 12% aperture ratio rectifying plate. By arranging the rectifying plate A-side cleaning treatment liquid circulation small hole 20a and the rectifying plate B-side cleaning treatment liquid circulation small hole 20b in an overlapping manner, the liquid flow through the small hole has a viscosity other than the viscosity of the cleaning treatment liquid itself. It turns out that it is not influenced. As the entire liquid flow in the cleaning treatment tank, the resistance of the portion of the rectifying plate not provided with the small holes is received, and all the liquid flows through the small holes and flows upward in the direction of the cleaning treatment liquid surface 15.

図12は第一実施例における開口率10%の整流板を示す拡大断面図である。本図は上述の図11の断面図から、整流板B 4をスライドした事により、整流板B 4上全ての小孔の開口率で50%になるように設置されている。スライドさせた整流板B 4は短辺側整流板4aと長辺側整流板4bの各2枚で合計4枚である。この4枚の整流板を小孔の面積で50%になるようにスライドさせることにより、整流板全体の開口率としては10%として設置されている。つまり4枚の整流板以外の部分は洗浄バスケット5の下に対応する領域であり、その領域の小孔の開口率を100%とし、4枚の整流板で遮蔽した領域の小孔の開口率を50%として、小孔の総面積を求め、整流板の総面積に占める割合を算出すると整流板全体の開口率としては10%となる。矢印26は開口率10%整流板における洗浄処理液の液流の様子を示す。   FIG. 12 is an enlarged cross-sectional view showing a current plate having an aperture ratio of 10% in the first embodiment. This figure is installed so that the opening ratio of all small holes on the rectifying plate B 4 is 50% by sliding the rectifying plate B 4 from the cross-sectional view of FIG. 11 described above. There are a total of four rectifying plates B 4 that are slid, each of the short side rectifying plate 4a and the long side rectifying plate 4b. By sliding these four rectifying plates so that the area of the small holes is 50%, the opening ratio of the entire rectifying plate is set to 10%. That is, the portion other than the four current plates is a region corresponding to the bottom of the cleaning basket 5, and the aperture ratio of the small holes in that region is 100%, and the aperture ratio of the small holes in the region shielded by the four current plates is When the total area of the small holes is calculated with the ratio of 50% and the ratio of the total area of the current plate is calculated, the opening ratio of the current plate is 10%. An arrow 26 indicates a state of the flow of the cleaning treatment liquid on the rectifying plate having an aperture ratio of 10%.

図13は第一実施例における開口率8%の整流板を示す拡大断面図である。本図は上述の図12の断面図から、整流板B 4をスライドした事により、整流板B 4上全ての小孔の開口率で0%になるように設置されている。これにより、洗浄処理液は整流板B 4の小孔を流通できない状態になる。スライドさせた整流板B 4は短辺側整流板4aと長辺側整流板4bの各2枚で合計4枚である。この4枚の整流板を小孔の面積で0%になるようにスライドさせることにより、整流板全体の開口率としては8%として設置されている。つまり4枚の整流板以外の部分は洗浄バスケット5の下に対応する領域であり、その領域の小孔の開口率を100%とし、4枚の整流板で遮蔽した領域の小孔の開口率を0%として、小孔の総面積を求め、整流板の総面積に占める割合を算出すると整流板全体の開口率としては8%となる。矢印27は開口率8%整流板における洗浄処理液の液流の様子を示す。   FIG. 13 is an enlarged sectional view showing a current plate having an aperture ratio of 8% in the first embodiment. This figure is installed so that the opening ratio of all small holes on the rectifying plate B 4 is 0% by sliding the rectifying plate B 4 from the cross-sectional view of FIG. 12 described above. As a result, the cleaning treatment liquid cannot flow through the small holes of the rectifying plate B4. There are a total of four rectifying plates B 4 that are slid, each of the short side rectifying plate 4a and the long side rectifying plate 4b. By sliding the four current plates so that the area of the small holes becomes 0%, the opening ratio of the whole current plate is set to 8%. That is, the portion other than the four current plates is a region corresponding to the bottom of the cleaning basket 5, and the aperture ratio of the small holes in that region is 100%, and the aperture ratio of the small holes in the region shielded by the four current plates is If the total area of the small holes is determined with 0%, and the ratio of the total area of the rectifying plate is calculated, the opening ratio of the entire rectifying plate is 8%. An arrow 27 indicates a state of the flow of the cleaning treatment liquid on the rectifying plate having an aperture ratio of 8%.

図14は第一実施例における開口率12%の整流板を示す拡大平面図である。本図は図11の断面状態図を平面図に置き換えたものであり、整流板B 4の短辺側整流板4aと長辺側整流板4bのスライドさせる前の状態を示している。短辺側整流板4aは短辺側整流板開口率調整隙間29において短辺側整流板開口率調整ネジ10aを用いて整流板A 3に固定されている。長辺側整流板4bは長辺側整流板開口率調整隙間28において長辺側整流板開口率調整ネジ12aを用いて整流板A 3に固定されている。   FIG. 14 is an enlarged plan view showing a current plate having an aperture ratio of 12% in the first embodiment. This figure is obtained by replacing the sectional state diagram of FIG. 11 with a plan view, and shows a state before the short side rectifying plate 4a and the long side rectifying plate 4b of the rectifying plate B 4 are slid. The short side rectifying plate 4a is fixed to the rectifying plate A3 using the short side rectifying plate opening ratio adjusting screw 10a in the short side rectifying plate opening ratio adjusting gap 29. The long side rectifying plate 4b is fixed to the rectifying plate A3 using the long side rectifying plate opening ratio adjusting screw 12a in the long side rectifying plate opening ratio adjusting gap 28.

図15は第一実施例における開口率10%の整流板を示す拡大平面図である。本図は図12の断面状態図を平面図に置き換えたものであり、整流板B 4の短辺側整流板4aと長辺側整流板4bを整流板B 4上全ての小孔に対して50%の開口率になるようにスライドさせた状態を示している。短辺側整流板4aは短辺側整流板開口率調整隙間29において短辺側整流板開口率調整ネジ10aを緩め、整流板B 4上全ての小孔に対して50%の開口率になるようにスライドさせ、もう一度短辺側整流板開口率調整ネジ10aを締め直すことにより整流板A 3に固定されている。長辺側整流板4bは長辺側整流板開口率調整隙間28において長辺側整流板開口率調整ネジ12aを緩め、整流板B 4上全ての小孔に対して50%の開口率になるようにスライドさせ、もう一度長辺側整流板開口率調整ネジ12aを締め直すことにより整流板A 3に固定されている。   FIG. 15 is an enlarged plan view showing a current plate with an aperture ratio of 10% in the first embodiment. This figure replaces the sectional state diagram of FIG. 12 with a plan view, and the short side rectifying plate 4a and the long side rectifying plate 4b of the rectifying plate B 4 are connected to all small holes on the rectifying plate B 4. A state of sliding so as to obtain an aperture ratio of 50% is shown. In the short side rectifying plate 4a, the short side rectifying plate opening ratio adjusting screw 10a is loosened in the short side rectifying plate opening ratio adjusting gap 29, and the opening ratio is 50% for all the small holes on the rectifying plate B4. Then, the short side rectifying plate opening ratio adjusting screw 10a is fastened again to fix it to the rectifying plate A3. In the long side rectifying plate 4b, the long side rectifying plate opening ratio adjusting screw 12a is loosened in the long side rectifying plate opening ratio adjusting gap 28, and the opening ratio is 50% for all the small holes on the rectifying plate B4. The long side rectifying plate opening ratio adjusting screw 12a is tightened again to fix the rectifying plate A3.

図16は第一実施例における開口率8%の整流板を示す拡大平面図である。本図は図13の断面状態図を平面図に置き換えたものであり、整流板B 4の短辺側整流板4aと長辺側整流板4bを整流板B 4上全ての小孔に対して0%の開口率になるようにスライドさせた状態を示している。短辺側整流板4aは短辺側整流板開口率調整隙間29において短辺側整流板開口率調整ネジ10aを緩め、整流板B 4上全ての小孔に対して0%の開口率になるようにスライドさせ、もう一度短辺側整流板開口率調整ネジ10aを締め直すことにより整流板A 3に固定されている。長辺側整流板4bは長辺側整流板開口率調整隙間28において長辺側整流板開口率調整ネジ12aを緩め、整流板B 4上全ての小孔に対して0%の開口率になるようにスライドさせ、もう一度長辺側整流板開口率調整ネジ12aを締め直すことにより整流板A 3に固定されている。   FIG. 16 is an enlarged plan view showing a current plate having an aperture ratio of 8% in the first embodiment. This figure is obtained by replacing the sectional state diagram of FIG. 13 with a plan view. The short side rectifying plate 4a and the long side rectifying plate 4b of the rectifying plate B 4 are connected to all small holes on the rectifying plate B 4. A state in which the aperture ratio is 0% is shown. In the short side rectifying plate 4a, the short side rectifying plate opening ratio adjusting screw 10a is loosened in the short side rectifying plate opening ratio adjusting gap 29, and the opening ratio becomes 0% with respect to all small holes on the rectifying plate B4. Then, the short side rectifying plate opening ratio adjusting screw 10a is fastened again to fix it to the rectifying plate A3. In the long side rectifying plate 4b, the long side rectifying plate opening ratio adjusting screw 12a is loosened in the long side rectifying plate opening ratio adjusting gap 28, and the opening ratio becomes 0% for all small holes on the rectifying plate B4. The long side rectifying plate opening ratio adjusting screw 12a is tightened again to fix the rectifying plate A3.

整流板A 3及び整流板B 4は、例えば数mm程度の比較的薄い厚みに形成される。さらに、整流板A 3及び整流板B 4は、洗浄処理液内にて劣化や水圧による変形を生じない材料で構成される。これらの観点から、本装置の整流板A 3及び整流板B 4は耐食性を有したステンレス鋼で形成される。   The rectifying plate A 3 and the rectifying plate B 4 are formed to have a relatively thin thickness of about several mm, for example. Furthermore, the rectifying plate A 3 and the rectifying plate B 4 are made of a material that does not deteriorate or deform due to water pressure in the cleaning liquid. From these viewpoints, the current plate A 3 and the current plate B 4 of the present apparatus are formed of stainless steel having corrosion resistance.

整流板A 3及び整流板B 4に設けられる一様な小孔の大きさは、例えば、直径5mmの円形小孔が配列される。例えば、小孔を正方形格子の各交点に配置する配列パターンにおいて、小孔の配列ピッチは中心間隔で12mmに設定される。
上記装置構成において、好適な条件の決定に際しては、洗浄処理槽16にミルクを注入する方法により、洗浄処理槽内の流れを可視化し、これを観察することによって、洗浄処理槽16内の液流のバラツキを前述の式1より求めた。
As for the size of the uniform small holes provided in the rectifying plate A 3 and the rectifying plate B 4, for example, circular small holes having a diameter of 5 mm are arranged. For example, in the arrangement pattern in which the small holes are arranged at each intersection of the square lattice, the arrangement pitch of the small holes is set to 12 mm at the center interval.
In the above apparatus configuration, when determining suitable conditions, the flow in the cleaning tank 16 is visualized by observing the flow in the cleaning tank 16 by injecting milk into the cleaning tank 16, and the liquid flow in the cleaning tank 16 is observed. The variation was obtained from the above-mentioned formula 1.

以下に請求項7に示した拡散板の開口率が20%から14%の範囲内であることの技術的意義について図示して説明する。   The technical significance that the aperture ratio of the diffusion plate shown in claim 7 is in the range of 20% to 14% will be described below.

図19は本発明による整流板開口率10%における拡散板の開口率と液流のバラツキの関係を示すグラフである。本関係において、拡散板の開口率100%の条件とは従来槽における拡散板を設置せずに開口率10%の整流板のみを設置した条件である。例えば、その条件の洗浄処理槽の流れを図17に示す。また、拡散板の開口率40%の条件とは図10に示した拡散板を設置し、開口率10%の整流板を設置した洗浄処理槽のことである。同様に、拡散板の開口率20%の条件とは図7に示した拡散板を設置した条件であり、拡散板の開口率14%の条件とは図8に示した拡散板を設置した条件であり、拡散板の開口率8%の条件とは図9に示した拡散板を設置した条件である。これらの各条件において、上述の流れの可視化により液流のバラツキを求めグラフ化したものが図19である。上記条件の洗浄処理槽内の液流を検討した結果、液流のバラツキが10以下の拡散板の開口率が22%から0%の時、洗浄処理槽内の液流がほぼ上向きの流れになり、下向きの流れが小さくになっている。この為、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が増大し、異物の被処理体への再付着確率が減少する。液流のバラツキが10より大きい場合は、洗浄処理槽内に下向きの液流が多く発生する為、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が減少し、異物の被処理体への再付着確率が増大する。より好ましくは、整流度合い8.5以下の拡散板の開口率が20%から14%の時が望ましい。なぜなら、この時、洗浄処理槽内の液流がほぼ上向きの流れになり、下向きの流れが最小になっていることが本実験により明らかになっているからである。つまり、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が最大となり、異物の被処理体への再付着確率が最小となる。   FIG. 19 is a graph showing the relationship between the aperture ratio of the diffusion plate and the variation in the liquid flow when the current plate aperture ratio is 10% according to the present invention. In this relationship, the condition of the diffusion plate having an aperture ratio of 100% is a condition in which only the current plate having an aperture ratio of 10% is installed without installing the diffusion plate in the conventional tank. For example, FIG. 17 shows the flow of the cleaning treatment tank under the conditions. Further, the condition of the diffusion plate having an aperture ratio of 40% refers to a cleaning treatment tank in which the diffusion plate shown in FIG. 10 is installed and a current plate having an aperture ratio of 10% is installed. Similarly, the condition of the diffusion plate having an aperture ratio of 20% is a condition for installing the diffusion plate shown in FIG. 7, and the condition of the diffusion plate having an aperture ratio of 14% is a condition for installing the diffusion plate shown in FIG. The condition of the diffusion plate with an aperture ratio of 8% is a condition in which the diffusion plate shown in FIG. 9 is installed. FIG. 19 is a graph showing the variation in the liquid flow obtained by visualizing the flow under the above conditions. As a result of examining the liquid flow in the cleaning treatment tank under the above conditions, when the aperture ratio of the diffusion plate having a liquid flow variation of 10 or less is 22% to 0%, the liquid flow in the cleaning treatment tank is almost upward. The downward flow is small. For this reason, the probability that foreign matter such as particles released from the surface of the object to be processed overflows from the cleaning liquid surface 15 and is discharged out of the system increases, and the probability of reattachment of the foreign matter to the object to be processed decreases. When the dispersion of the liquid flow is larger than 10, many downward liquid flows are generated in the cleaning tank, so that particles such as particles released from the surface of the object to be processed overflow from the cleaning liquid surface 15 and are discharged out of the system. This reduces the probability that the foreign matter is reattached to the object to be processed. More preferably, the aperture ratio of the diffusion plate having a rectification degree of 8.5 or less is 20% to 14%. This is because, at this time, it is clear from this experiment that the liquid flow in the cleaning treatment tank is almost upward and the downward flow is minimized. That is, the probability that foreign matter such as particles released from the surface of the object to be processed overflows from the cleaning process liquid surface 15 and is discharged out of the system is maximized, and the probability of reattachment of the foreign matter to the object to be treated is minimized.

以下に請求項4に示した整流板の開口率が12%から8%の範囲内であることの技術的意義について図示して説明する。   The technical significance that the opening ratio of the current plate shown in claim 4 is in the range of 12% to 8% will be described below.

図20は本発明による拡散板開口率20%における整流板の開口率と液流のバラツキの関係を示すグラフである。本関係において、整流板の開口率100%の条件とは従来槽における整流板を設置せずに開口率20%の拡散板のみを設置した条件である。また、整流板の開口率12%の条件とは図11に示した整流板を設置し、開口率20%の拡散板を設置した洗浄処理槽のことである。同様に、整流板の開口率10%の条件とは図12に示した整流板を設置した条件であり、整流板の開口率8%の条件とは図13に示した整流板を設置した条件である。これらの各条件において、上述の流れの可視化により液流のバラツキを求めグラフ化したものが図20である。上記条件の洗浄処理槽内の液流を検討した結果、液流のバラツキが10以下の整流板の開口率が20%から6%の時、洗浄処理槽内の液流がほぼ上向きの流れになり、下向きの流れが小さくになっている。この為、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が増大し、異物の被処理体への再付着確率が減少する。液流のバラツキが10より大きい場合は、洗浄処理槽内に下向きの液流が多く発生する為、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が減少し、異物の被処理体への再付着確率が増大する。より好ましくは、整流度合い8.5以下の拡散板の開口率が12%から8%の時が望ましい。なぜなら、この時、洗浄処理槽内の液流がほぼ上向きの流れになり、下向きの流れが最小になっていることが本実験により明らかになっているからである。つまり、被処理体表面から遊離したパーティクル等の異物が洗浄処理液面15からオーバーフローし系外に排出される確率が最大となり、異物の被処理体への再付着確率が最小となる。   FIG. 20 is a graph showing the relationship between the aperture ratio of the rectifying plate and the variation in the liquid flow when the diffusion plate aperture ratio is 20% according to the present invention. In this relationship, the condition of the opening ratio of the rectifying plate of 100% is a condition in which only the diffusion plate having an opening ratio of 20% is installed without installing the rectifying plate in the conventional tank. Further, the condition of the opening ratio of 12% of the rectifying plate is a cleaning treatment tank in which the rectifying plate shown in FIG. Similarly, the condition for the 10% aperture ratio of the rectifying plate is the condition for installing the rectifying plate shown in FIG. 12, and the condition for the 8% aperture ratio of the rectifying plate is the condition for installing the rectifying plate shown in FIG. It is. FIG. 20 is a graph showing the variation of the liquid flow obtained by visualizing the flow under the above conditions. As a result of examining the liquid flow in the cleaning treatment tank under the above conditions, when the opening ratio of the rectifying plate having a liquid flow variation of 10 or less is 20% to 6%, the liquid flow in the cleaning treatment tank is almost upward. The downward flow is smaller. For this reason, the probability that foreign matter such as particles released from the surface of the object to be processed overflows from the cleaning liquid surface 15 and is discharged out of the system increases, and the probability of reattachment of the foreign matter to the object to be processed decreases. When the dispersion of the liquid flow is larger than 10, many downward liquid flows are generated in the cleaning tank, so that particles such as particles released from the surface of the object to be processed overflow from the cleaning liquid surface 15 and are discharged out of the system. This reduces the probability that the foreign matter is reattached to the object to be processed. More preferably, the aperture ratio of the diffusion plate having a rectification degree of 8.5 or less is 12% to 8%. This is because, at this time, it is clear from this experiment that the liquid flow in the cleaning treatment tank is almost upward and the downward flow is minimized. That is, the probability that foreign matter such as particles released from the surface of the object to be processed overflows from the cleaning process liquid surface 15 and is discharged out of the system is maximized, and the probability of reattachment of the foreign matter to the object to be treated is minimized.

図18は本発明による洗浄処理装置の第二実施例の概略構造を示す断面図である。装置構成は上記第一実施例と同等である。整流板B 4を洗浄処理液面15方向へ可変させ、整流板の開口率と液流のバラツキを観測した。その結果、従来槽に対して洗浄処理槽内の液流は、上向きの流れが多くなり下向きの流れが少なくなった。   FIG. 18 is a sectional view showing a schematic structure of a second embodiment of the cleaning processing apparatus according to the present invention. The apparatus configuration is the same as that of the first embodiment. The rectifying plate B4 was varied in the direction of the cleaning treatment liquid surface 15, and the opening ratio of the rectifying plate and variations in the liquid flow were observed. As a result, the liquid flow in the cleaning treatment tank increased in the upward direction and decreased in the downward direction with respect to the conventional tank.

本発明による洗浄処理装置の第一実施例の概略構造を示す断面図である。It is sectional drawing which shows schematic structure of the 1st Example of the cleaning processing apparatus by this invention. 本発明による整流板と拡散板及び取付け脚の取付け態様を示す分解斜視図である。It is a disassembled perspective view which shows the attachment aspect of the baffle plate, diffusion plate, and attachment leg by this invention. 本発明による整流板と拡散板及び取付け脚の取付け態様を示す概略斜視図である。It is a schematic perspective view which shows the attachment aspect of the baffle plate, diffusion plate, and attachment leg by this invention. 本発明による整流板と拡散板及び取付け脚の取付け態様を示す拡大斜視図である。It is an expansion perspective view which shows the attachment aspect of the baffle plate, diffusion plate, and attachment leg by this invention. 本発明による拡散板と取付け脚の取付け態様を示す分解斜視図である。It is a disassembled perspective view which shows the attachment aspect of the diffusion plate and attachment leg by this invention. 本発明による整流板と拡散板及び取付け脚の取付け態様を示す拡大断面図である。It is an expanded sectional view which shows the attachment aspect of the baffle plate, diffusion plate, and attachment leg by this invention. 第一実施例における開口率20%の拡散板を示す平面図である。It is a top view which shows the diffusion plate of 20% of aperture ratio in a 1st Example. 第一実施例における開口率14%の拡散板を示す平面図である。It is a top view which shows the diffusion plate of 14% of aperture ratio in a 1st Example. 第一実施例における開口率8%の拡散板を示す平面図である。It is a top view which shows the diffusion plate of 8% of aperture ratio in a 1st Example. 第一実施例における開口率40%の拡散板を示す平面図である。It is a top view which shows the diffusion plate of 40% of aperture ratio in a 1st Example. 第一実施例における開口率12%の整流板を示す拡大断面図である。It is an expanded sectional view which shows the baffle plate of 12% of aperture ratio in a 1st Example. 第一実施例における開口率10%の整流板を示す拡大断面図である。It is an expanded sectional view showing a current plate with an aperture ratio of 10% in the first embodiment. 第一実施例における開口率8%の整流板を示す拡大断面図である。It is an expanded sectional view which shows the baffle plate of 8% of aperture ratio in a 1st Example. 第一実施例における開口率12%の整流板を示す拡大平面図である。It is an enlarged plan view showing a current plate with an aperture ratio of 12% in the first embodiment. 第一実施例における開口率10%の整流板を示す拡大平面図である。It is an enlarged plan view showing a current plate with an aperture ratio of 10% in the first embodiment. 第一実施例における開口率8%の整流板を示す拡大平面図である。It is an enlarged plan view showing a current plate with an aperture ratio of 8% in the first embodiment. 従来の洗浄処理装置を示す断面図である。It is sectional drawing which shows the conventional washing | cleaning processing apparatus. 本発明による洗浄処理装置の第二実施例の概略構造を示す断面図である。It is sectional drawing which shows schematic structure of the 2nd Example of the cleaning processing apparatus by this invention. 本発明による整流板開口率10%における拡散板の開口率と液流のバラツキの関係を示すグラフである。It is a graph which shows the relationship between the aperture ratio of a diffuser plate, and the dispersion | variation in a liquid flow in the rectifier plate aperture ratio 10% by this invention. 本発明による拡散板開口率20%における整流板の開口率と液流のバラツキの関係を示すグラフである。It is a graph which shows the relationship between the aperture ratio of a baffle plate in the diffusion plate aperture ratio 20% by this invention, and the dispersion | variation in a liquid flow.

符号の説明Explanation of symbols

1…洗浄処理液供給口、2…拡散板、3…整流板A、4…整流板B、4a…短辺側整流板、4b…長辺側整流板、5…洗浄バスケット、6…整流モニター機構、7…整流板取付け脚、8…高さ調整ナット、9…液晶セル、10a…短辺側整流板開口率調整ネジ、10b…短辺側整流板開口率調整ナット、11a…拡散板取付け脚、11b…拡散板高さ調整ナット、11c…押え板、11d…ワッシャ、12a…長辺側整流板開口率調整ネジ、12b…長辺側整流板開口率調整ナット、13…液晶セル固定棒、14…洗浄処理槽間搬送ロボットアーム、15…洗浄処理液面、16…洗浄処理槽、17…洗浄処理液のオーバーフローの様子を示す矢印、18…洗浄処理液の供給口における液流の様子を示す矢印、19…洗浄処理液受け皿、20…洗浄処理液流通小孔、20a…整流板A側洗浄処理液流通小孔、20b…整流板B側洗浄処理液流通小孔、21…拡散板開口率調整ネジ、22…開口率8%拡散板、23…開口率40%拡散板、24…洗浄処理液流通四角小孔、25…開口率12%整流板における洗浄処理液の液流の様子を示す矢印、26…開口率10%整流板における洗浄処理液の液流の様子を示す矢印、27…開口率8%整流板における洗浄処理液の液流の様子を示す矢印、28…長辺側整流板開口率調整隙間、29…短辺側整流板開口率調整隙間、30…従来槽における壁面付近の液流の様子を示す矢印、31…従来槽における液晶セル付近の液流の様子を示す矢印、32…第二実施例における壁面付近の液流の様子を示す矢印、33…洗浄バスケット吊り下げ部、34…液流調整バルブ流量計、35…ポンプ。   1 ... Cleaning liquid supply port, 2 ... Diffusion plate, 3 ... Rectifying plate A, 4 ... Rectifying plate B, 4a ... Short side rectifying plate, 4b ... Long side rectifying plate, 5 ... Cleaning basket, 6 ... Rectification monitor Mechanism, 7 ... Rectifying plate mounting leg, 8 ... Height adjusting nut, 9 ... Liquid crystal cell, 10a ... Short side rectifying plate opening rate adjusting screw, 10b ... Short side rectifying plate opening rate adjusting nut, 11a ... Diffusion plate mounting Leg, 11b ... Diffusion plate height adjustment nut, 11c ... Presser plate, 11d ... Washer, 12a ... Long-side rectifying plate opening ratio adjusting screw, 12b ... Long-side rectifying plate opening ratio adjusting nut, 13 ... Liquid crystal cell fixing rod , 14: Transfer robot arm between cleaning treatment tanks, 15 ... Cleaning treatment liquid surface, 16 ... Cleaning treatment tank, 17 ... Arrow indicating the overflow of the cleaning treatment liquid, 18 ... Liquid flow at the cleaning treatment liquid supply port , 19 ... Cleaning treatment liquid tray, 20 ... Cleaning treatment liquid circulation small hole, 20a ... Rectification plate A side cleaning treatment liquid circulation small hole, 20b ... Rectification plate B side cleaning treatment Flow hole, 21 ... diffusion plate aperture ratio adjusting screw, 22 ... aperture ratio 8% diffusion plate, 23 ... aperture ratio 40% diffuser plate, 24 ... cleaning solution flow square hole, 25 ... aperture ratio 12% rectifier plate An arrow indicating the state of the liquid flow of the cleaning treatment liquid, 26... An arrow indicating the state of the liquid flow of the cleaning processing liquid on the 10% aperture ratio rectifying plate, 27. , 28 ... Long side rectifying plate opening ratio adjustment gap, 29 ... Short side rectifying plate opening ratio adjustment gap, 30 ... Arrow indicating the state of liquid flow near the wall surface in the conventional tank, 31 ... Liquid crystal in the conventional tank An arrow indicating the state of the liquid flow near the cell, 32... An arrow indicating the state of the liquid flow near the wall surface in the second embodiment, 33... The washing basket hanging part, 34.

Claims (8)

洗浄処理装置において、洗浄処理槽内底部の洗浄処理液供給口側に、1個もしくは複数の小孔を有する1枚もしくは複数の水平に配置された整流板と、該洗浄処理液供給口の上方と該整流板の下方に位置する、1個もしくは複数の小孔を有する水平に配置された拡散板と、洗浄処理槽内壁面に1個もしくは複数の整流モニター機構を設けたことを特徴とする洗浄処理装置。   In the cleaning processing apparatus, one or a plurality of horizontally arranged rectifying plates having one or a plurality of small holes on the side of the cleaning processing liquid supply port at the bottom of the cleaning processing tank, and above the cleaning processing liquid supply port And a horizontally disposed diffusion plate having one or a plurality of small holes positioned below the rectifying plate, and one or a plurality of rectifying monitor mechanisms on the inner wall surface of the cleaning treatment tank. Cleaning processing equipment. 請求項1において、整流板の開口率を変化させる構造を具備したことを特徴とする洗浄処理装置。   The cleaning apparatus according to claim 1, further comprising a structure for changing an aperture ratio of the current plate. 請求項2において、該整流板のそれぞれに設けた小孔の位置を整流板間で相互にずらせることにより、整流板の開口率を変化させる構造を具備したことを特徴とする洗浄処理装置。   3. The cleaning apparatus according to claim 2, further comprising a structure for changing the aperture ratio of the current plate by shifting the positions of the small holes provided in each of the current plates between the current plates. 請求項3において、整流板の開口率が12%から8%の範囲内であることを特徴とする洗浄処理装置。   4. The cleaning apparatus according to claim 3, wherein the opening ratio of the current plate is in a range of 12% to 8%. 請求項1または2において、拡散板の開口率を変化させる構造を具備したことを特徴とする洗浄処理装置。   3. The cleaning apparatus according to claim 1, further comprising a structure for changing an aperture ratio of the diffusion plate. 請求項5において、該拡散板のそれぞれに設けた小孔を塞ぐことにより、拡散板の開口率を変化させる構造を具備したことを特徴とする洗浄処理装置。   6. The cleaning apparatus according to claim 5, further comprising a structure for changing an aperture ratio of the diffusion plate by closing a small hole provided in each of the diffusion plates. 請求項6において、拡散板の開口率が20%から14%の範囲内であることを特徴とする洗浄処理装置。   7. A cleaning apparatus according to claim 6, wherein the aperture ratio of the diffusion plate is in the range of 20% to 14%. 請求項1において、洗浄処理槽内壁面に一本ないし複数本の細糸が固定されることにより、洗浄処理槽内壁面近傍の液流が可視化される機構を有することを特徴とする洗浄処理装置。   2. The cleaning apparatus according to claim 1, further comprising a mechanism for visualizing a liquid flow in the vicinity of the inner wall surface of the cleaning treatment tank by fixing one or a plurality of thin threads on the inner wall surface of the cleaning processing tank. .
JP2007238670A 2007-09-14 2007-09-14 Washing apparatus Pending JP2009066540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007238670A JP2009066540A (en) 2007-09-14 2007-09-14 Washing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007238670A JP2009066540A (en) 2007-09-14 2007-09-14 Washing apparatus

Publications (1)

Publication Number Publication Date
JP2009066540A true JP2009066540A (en) 2009-04-02

Family

ID=40603368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007238670A Pending JP2009066540A (en) 2007-09-14 2007-09-14 Washing apparatus

Country Status (1)

Country Link
JP (1) JP2009066540A (en)

Similar Documents

Publication Publication Date Title
US5542441A (en) Apparatus for delivering ultra-low particle counts in semiconductor manufacturing
JP2008118109A (en) Nozzle, and substrate treatment device provided with the same
KR20010053300A (en) Method and apparatus for immersion treatment of semiconductor and other devices
US9233390B2 (en) Processing cup and substrate processing apparatus
JP3343033B2 (en) Substrate processing equipment
US7208858B2 (en) Ultrasonic cleaning tank
JP6433872B2 (en) Dust collector and dust collection system
JP2009066540A (en) Washing apparatus
US20070227563A1 (en) Cleaning apparatus and cleaning method
JPH07115080A (en) Cleaning tank
KR101426373B1 (en) Apparatus to Plate Substrate
JPH0448629A (en) Liquid processor for semiconductor wafer
JP2010212363A (en) Substrate processing apparatus and substrate processing method
CN218963433U (en) Solution cleaning device
JP3226026B2 (en) Chemical treatment equipment
JP3247322B2 (en) Cleaning equipment
CN213779610U (en) Sampling device
CN212412019U (en) Palladium plating device for wafer
CN217499430U (en) Cleaning device for high-purity electrolytic copper
JPH10242105A (en) Wet treating apparatus
JPH10189521A (en) Apparatus and method for cleaning of substrate
WO2016042959A1 (en) Treatment system and treatment method
CN113714201A (en) Groove type process system for single-chip wet treatment process
KR102257429B1 (en) Substrate processing apparatus and component inspection method of substrate processing apparatus
Ota et al. Horizontal laminar flow cleaning in wet batch cleaning process

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20100127

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100303