JP2009064907A - Optically-coupled semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optically-coupled semiconductor device capable of exerting dramatically large heat radiation capability as compared with a conventional one in spite of a simple structure, and of sufficiently responding to miniaturization of a package and increase of current capacity. <P>SOLUTION: This optically-coupled semiconductor device 1 is provided with a light emitting-side lead frame 2 and a light receiving-side lead frame 3, a light emitting element 4 mounted on a semiconductor element mounting header part 21 of the light emitting-side lead frame 2, and a light receiving element 5 mounted on a semiconductor element mounting header part 31 of the light receiving-side lead frame 3, and is structured such that the light emitting element 4 and the light receiving element 5 are arranged oppositely to each other, and both the lead frames 2 and 3 and both the elements 4 and 5 are resin-sealed by a sealing resin 6. The sealing resin 6 is provided with a cooling through-hole 7 communicating with at least one-side semiconductor non-mounting surface 32 of the semiconductor element mounting header part 31. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optically coupled semiconductor device excellent in heat dissipation, a manufacturing method thereof, and an electronic apparatus using the optically coupled semiconductor device.

  As recent technological trends of the optically coupled semiconductor device, the downsizing of the package and the increase of the current capacity are remarkable. Along with this, the heat generated during use is also increasing, and unless sufficient measures are taken for this heat, the optically coupled semiconductor device itself is damaged by the heat generated by itself, leading to deterioration of characteristics. Become. Therefore, it is important to efficiently release the heat generated during use in order to cope with the downsizing of the package and the increase in current capacity.

  Therefore, conventionally, in order to improve heat dissipation in the optically coupled semiconductor device, for example, an integrated circuit element that is easily affected by temperature is brought into contact with a lead frame having high thermal conductivity to reduce the influence of self-heating. In addition, a method of releasing heat from the substrate by bringing the resin package into close contact with the mounting substrate is employed.

  Furthermore, the lead frame is bent in a secondary mold made of light-shielding resin and exposed to the surface of the secondary mold body so that it can be surface-mounted on an external mounting board. (For example, refer to Patent Document 1).

In addition, means has also been proposed in which a through hole is provided in the external mounting substrate, and a convex portion that engages with the through hole is formed on the bottom surface of the secondary mold body to dissipate heat.
JP 09-083013 A

  However, when the current capacity increases, the amount of heat generation increases, and accordingly, it is necessary to further improve the heat dissipation. However, if the means described in Patent Document 1 tries to cope with it, it is surface-mounted on the external mounting board. Therefore, it is necessary to increase the area of the lead frame. As a result, there is a problem in that the entire optically coupled semiconductor device is increased in size and cannot meet the demand for a smaller package.

  If the increase in current capacity is large, the amount of heat generated will exceed the amount of heat released from the board, and heat will accumulate on the board, so it will not be possible to ensure satisfactory heat dissipation and it will be exposed to heat for a long time. As a result, the substrate itself is also damaged by heat.

  On the other hand, in the configuration in which a convex portion is formed on the bottom surface of the secondary mold body to dissipate heat, the through holes must be made larger as the amount of heat generation increases. However, there is a limit to the size of the allowable diameter because the space is naturally limited in providing the through hole on the external mounting board. Therefore, even in this configuration, it is difficult to ensure satisfactory heat dissipation, and there is a problem that it is not possible to cope with downsizing of the optically coupled semiconductor device and increase in current capacity.

  The present invention was devised to solve the above-mentioned conventional problems, and although it has a simple configuration, it can exhibit much greater heat dissipation than the conventional one, and it is possible to reduce the size of the package and increase the current capacity. It is an object of the present invention to provide an optically coupled semiconductor device that can sufficiently cope.

  In order to solve the above problems, an optically coupled semiconductor device according to the present invention includes a light emitting side lead frame and a light receiving side lead frame, a light emitting element mounted on a semiconductor element mounting header portion of the light emitting side lead frame, and the light receiving side lead. A light receiving element mounted on a semiconductor element mounting header portion of the frame, wherein the light emitting element and the light receiving element are arranged opposite to each other, and both the lead frame and the both elements are sealed with a sealing resin. In the bonded semiconductor device, a cooling through hole communicating with at least one semiconductor non-mounting surface of the semiconductor element mounting header portion is provided in the sealing resin.

  With this specific matter, outside air is introduced into the at least one semiconductor non-mounting surface of the semiconductor element mounting header portion through the cooling through hole, and direct heat exchange is performed between the semiconductor element mounting header portion and the outside air. Thus, heat dissipation is performed extremely efficiently compared to the conventional method of performing heat dissipation via a lead frame or an external mounting substrate. In order to prevent the semiconductor element mounting header portion from being easily peeled off from the sealing resin by providing the cooling through holes, it is desirable that the size of the diameter of the cooling through holes be smaller than that of the semiconductor element mounting header portion.

  Moreover, although the said cooling through-hole may be one, multiple may be arrange | positioned.

  When a plurality of cooling through holes are arranged, it is possible to more reliably prevent the header portion from being peeled off from the sealing resin while ensuring efficient introduction of outside air to the semiconductor element mounting header portion.

  The cooling through hole may be filled with a heat radiating material.

  In this case, the heat of the semiconductor element mounting header portion is efficiently released to the outside through the heat dissipation material in a state where the insulation between the semiconductor element mounting header portion and the outside is maintained by the heat dissipation material. That is, both insulating properties and heat dissipation properties are achieved.

  Further, irregularities may be provided on the semiconductor non-mounting surface of the semiconductor element mounting header portion.

  In this case, the contact area between the sealing resin and the non-semiconductor mounting surface increases as compared with the case where the non-semiconductor mounting surface is a smooth surface, so that the semiconductor element mounting header is more reliably peeled off from the sealing resin. At the same time, the surface area of the surface facing the cooling hole on the non-semiconductor mounting surface increases compared to a smooth surface, so that the contact area with the outside air can be increased, and the heat radiation to the outside air is more efficient. To be done.

  In addition, a water stop portion that blocks moisture entering from the outside through the cooling through hole may be provided on the semiconductor non-mounting surface of the semiconductor element mounting header portion so as to surround the cooling through hole.

  In this case, even if moisture enters from the outside through the cooling through hole, this can be prevented by the water stop portion.

  Here, the said water stop part may be provided so that the through-hole for cooling may be enclosed in multiple.

  In this case, it is possible to more reliably prevent moisture from entering through the cooling holes.

  Moreover, you may comprise the said water stop part by the some convex part or recessed part formed in the semiconductor non-mounting surface.

  In this case, the water stop portion can be easily formed simply by pressure forming the semiconductor non-mounting surface.

  Further, the cooling through hole may be a groove whose opening end faces the side surface of the sealing resin.

  In this case, the outside air that has touched the non-semiconductor mounting surface can escape from the bottom without staying in the cooling through hole, and fresh outside air is always introduced to the non-semiconductor mounting surface. Will be done more efficiently.

  Further, the cooling through hole may be provided inclined with respect to the semiconductor element mounting header portion.

  In this case, since the outside air is introduced to the non-semiconductor mounting surface through the cooling through hole, heat is efficiently dissipated, and at the same time, the primary side of the apparatus as compared with the case where the cooling through hole is vertically provided. And creepage insulation distance between the secondary side and the secondary side.

  The method of manufacturing an optically coupled semiconductor device according to the present invention is characterized in that a resin sealing mold having a convex portion that comes into contact with a semiconductor non-mounting surface of a semiconductor element mounting header portion when a sealing resin is filled is used. It is.

  By this specific matter, the cooling through hole can be formed simply by pouring the mold resin into the resin sealing mold. Further, when the optically coupled semiconductor device is a flat-mounting type, the semiconductor element mounting header is supported by the convex portion of the mold at the time of resin sealing, so that the shape of the lead frame at the time of molding is stabilized. be able to.

  The method for manufacturing an optically coupled semiconductor device according to the present invention is characterized in that the cooling through hole is formed by cutting a sealing resin.

  With this specific matter, the cooling through hole can be easily formed with an existing cutting device.

  Electronic equipment according to the present invention is characterized by using the above-described optically coupled semiconductor device.

  According to the present invention, there is provided an optically coupled semiconductor device capable of exhibiting much larger heat dissipation than the conventional one with a simple configuration and capable of sufficiently responding to the downsizing of the package and the increase in current capacity. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, an example in which the present invention is applied to a counter-type photocoupler will be described.

<Embodiment 1>
FIG. 1A is a perspective view showing a schematic configuration of the optically coupled semiconductor device (opposing photocoupler) according to the first embodiment of the present invention as viewed from the front, and FIG. 1B is a bottom view when viewed from below. FIG.

  This optically coupled semiconductor device 1 includes a light emitting side lead frame 2 and a light receiving side lead frame 3, a light emitting element 4 mounted on a semiconductor element mounting header portion 21 of the light emitting side lead frame 2, and a semiconductor element of the light receiving side lead frame 3. The light receiving element 5 mounted on the mounting header portion 31 is provided. The light emitting element 4 and the light receiving element 5 are arranged to face each other and are sealed with resin 6 together with both lead frames 3 and 4.

  The sealing resin 6 is provided with a cooling through hole 7 communicating with the semiconductor non-mounting surface 32 in the semiconductor element mounting header portion 31 of the light receiving side lead frame 3. The cross-sectional shape of the cooling through hole 7 is circular, and the inner diameter of the cooling through hole 7 is such that the semiconductor element mounting header portion 31 is not easily peeled off from the sealing resin 6 by providing the cooling through hole 7. It is desirable to make it smaller than the portion 31. The cross-sectional shape of the cooling through hole 7 is not limited to a circular shape, and may be an arbitrary shape such as a triangle, a polygon more than a pentagon, or an ellipse.

  As described above, since the cooling through hole 7 is provided in the sealing resin 6, the outside air is introduced into the semiconductor non-mounting surface 32 of the semiconductor element mounting header portion 31 through the cooling through hole 7, and the semiconductor element mounting is performed. Heat exchange is performed directly between the header portion 31 and the outside air, and heat dissipation is performed extremely efficiently compared to the conventional method of performing heat dissipation via a lead frame or an external mounting board.

<Embodiment 2>
FIG. 2A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 2 of the present invention as viewed from the front, and FIG. 2B is a bottom view when viewed from below. FIG. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. Since the second embodiment is different from the first embodiment only in the configuration of the cooling through hole 7, only this difference will be described.

  In the second embodiment, a plurality of cooling through holes 7 (five in the illustrated example) are provided. Each cooling through hole 7 has a considerably smaller inner diameter than that described in the first embodiment, and is arranged so as to be distributed substantially uniformly on the semiconductor non-mounting surface 32. Each of the cooling through holes 7 has a circular cross-sectional shape as in the first embodiment, but is not limited thereto, and can take any shape such as a triangle, a polygon of pentagon or higher, or an ellipse. Also, the number is not limited to five, and may be two to four or six or more. However, it is desirable to increase the inner diameter of each cooling through hole 7 as the number decreases, and to decrease the inner diameter of each cooling through hole 7 as the number increases. Furthermore, the arrangement pattern of the cooling through holes 7 is not limited to the illustrated example, and the heat generation distribution on the non-semiconductor mounting surface 32 is grasped, and the cooling through holes 7 are arranged in a concentrated manner at a location where a large amount of heat is generated. You may do it.

  In the case of the second embodiment, as in the first embodiment, outside air is introduced into the semiconductor non-mounting surface 32 of the semiconductor element mounting header portion 31 through the plurality of cooling holes 7, and the semiconductor element mounting header portion 31 and the outside air are connected. The heat exchange is performed directly between the two and the heat dissipation, and the heat dissipation is performed extremely efficiently compared to the conventional method of performing heat dissipation via the lead frame or the external mounting substrate. Further, by providing a plurality of cooling through holes 7 having a small inner diameter, there is no possibility of peeling of the semiconductor element mounting header portion 31 from the sealing resin 6 due to the cooling through holes 7.

<Embodiment 3>
3A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 3 of the present invention as viewed from the front, and FIG. 3B is a bottom view when viewed from below. FIG. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. The third embodiment is different from the above-described embodiments only in the configuration of the cooling through hole 7, and only this difference will be described.

  In the third embodiment, the heat radiation material 8 is filled in the cooling through hole 7 of the optically coupled semiconductor device 1 shown in the first embodiment. The heat radiating material 8 is preferably made of a material having a specific heat lower than that of the sealing resin 6, and examples thereof include ceramics, but are not limited thereto.

  Thus, when the heat dissipation material 8 is provided in the cooling through hole 7, the semiconductor element mounting header portion 31 is maintained in a state in which the insulation between the semiconductor element mounting header portion 31 and the outside is maintained by the heat dissipation material 8. Is efficiently released to the outside through the heat dissipating material 8. That is, both insulating properties and heat dissipation properties are achieved.

<Embodiment 4>
FIG. 4 is a front perspective view showing a schematic configuration of the optically coupled semiconductor device (opposing photocoupler) according to the fourth exemplary embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. The fourth embodiment is different from the above embodiments only in the configuration of the semiconductor non-mounting surface 32 of the semiconductor element mounting header portion 31, and only this difference will be described.

  In the fourth embodiment, the unevenness 9 is provided on the semiconductor non-mounting surface 32 of the semiconductor element mounting header portion 31. The unevenness 9 extends over the entire semiconductor non-mounting surface 32.

  When such unevenness 9 is provided on the non-semiconductor mounting surface 32, the contact area between the sealing resin 6 and the non-semiconductor mounting surface 32 is such that the non-semiconductor mounting surface 32 is a smooth surface (see Embodiment 1). Therefore, it is possible to more reliably prevent the semiconductor element mounting header portion 31 from being peeled off from the sealing resin 6, and at the same time, the surface area of the portion facing the cooling hole 7 of the semiconductor non-mounting surface 32 is a smooth surface. Since it increases compared with a certain case, the contact area with the outside air can be gained, and the heat radiation to the outside air can be performed more efficiently.

<Embodiment 5>
FIG. 5A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 5 of the present invention as viewed from the front, and FIG. 5B is a bottom view when viewed from below. FIG. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. Since this Embodiment 5 differs only in the point which provided the water stop part 10 from said each embodiment, only this difference is demonstrated.

  In the fifth embodiment, the water stop portion 10 that blocks moisture entering from the outside through the cooling through hole 7 is provided on the semiconductor non-mounting surface 32 of the semiconductor element mounting header portion 31 so as to surround the cooling through hole 7. ing. The water-stop portion 10 is configured by a large number of wedge-shaped convex portions that protrude intermittently and concentrically with the cooling through hole 7 on the surface of the semiconductor non-mounting surface 32.

  As described above, since the cooling through hole 7 is surrounded by the water stop portion 10, even if moisture enters from the outside through the cooling through hole 7, the water stop portion 10 can prevent and stop this.

  In addition, the water stop part 10 is not only comprised by the above convex parts, but as shown to Fig.6 (a) and the same figure (b), it is a through-hole for cooling on the surface of the semiconductor non-mounting surface 32. 7 may be constituted by a large number of recesses intermittently engraved in a concentric manner. Further, the water stop portion 10 surrounds the cooling through hole 7 in a single layer, but as shown in FIGS. 6 (a) and 6 (b), it may be enclosed in multiple layers. Intrusion of moisture through the service hole 7 is more reliably prevented.

  As described above, in the case where the water-stopping portion 10 is constituted by a plurality of convex portions or concave portions formed on the semiconductor non-mounting surface 32, the water-stopping portion 10 can be easily formed only by pressure molding the semiconductor non-mounting surface 32. Can be formed. In addition, when comprising the water stop part 10 by a convex part or a recessed part, it is not necessary to comprise only any one, You may mix a convex part and a recessed part suitably.

<Embodiment 6>
FIG. 7A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 6 of the present invention as viewed from the front, and FIG. 7B is a bottom view when viewed from below. FIG. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. Since the sixth embodiment is different from the above embodiments only in the configuration of the cooling through hole 7, only the difference will be described.

  In the sixth embodiment, the cooling through hole 7 is a groove whose opening end 71 faces the side surface 61 of the sealing resin 6.

  In this case, the outside air that has touched the semiconductor non-mounting surface 32 can escape from the bottom of the sealing resin 6 without staying in the cooling through hole 7, and fresh fresh air is always introduced into the semiconductor non-mounting surface 32. Therefore, heat dissipation is performed more efficiently.

<Embodiment 7>
FIG. 8A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 7 of the present invention viewed from the front, and FIG. 8B is a bottom view viewed from below. FIG. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and the description is abbreviate | omitted. Since the present embodiment 7 is different from the above embodiments only in the configuration of the cooling through hole 7, only this difference will be described.

  In the seventh embodiment, the cooling through hole 7 is provided to be inclined with respect to the semiconductor element mounting header portion 31.

  In this case, since the outside air is introduced to the non-semiconductor mounting surface 32 through the cooling through hole 7, heat is efficiently dissipated and at the same time the cooling through hole 7 is vertically provided (see Embodiment 1). ), The creeping insulation distance between the primary side and the secondary side of the apparatus can be earned.

<Embodiment related to manufacturing method>
Next, an embodiment of a method for manufacturing an optically coupled semiconductor device according to the present invention will be described with reference to FIGS. 9 (a) and 9 (b).

  FIG. 9A is a perspective view showing a schematic configuration of an example in which the present invention is applied to the manufacturing of the opposed photocoupler shown in each of the above embodiments, and FIG. 9B is a plane-mounted photocoupler. It is the perspective view seen from the front which shows schematic structure of the example which applied this invention to manufacture of this.

  In any type of optically coupled semiconductor device, the resin sealing molds 12 and 13 have protrusions 14 that contact the semiconductor non-mounting surfaces 32 and 22 of the semiconductor element mounting header portions 31 and 21 when the sealing resin is filled. Is provided. The lead frames 2 and 3 on which the light emitting element 4 and the light receiving element 5 are respectively mounted are arranged in the resin sealing molds 12 and 13 having such a configuration, and the convex portions 14 in the molds 12 and 13 are arranged on the convex parts 14. The semiconductor non-mounting surfaces 32 and 22 of the semiconductor element mounting header portions 31 and 21 are brought into contact with each other. Thereafter, the cooling through hole 7 is formed simply by pouring mold resin into the molds 12 and 13. Here, in the case where the optically coupled semiconductor device 1 is a planar mounting type as shown in FIG. 9B, the semiconductor element mounting header portions 21 and 31 are supported by the convex portions 14 of the mold 13 during resin sealing. Therefore, it is possible to stabilize the shape of the lead frames 2 and 3 during molding.

  In the method for manufacturing an optically coupled semiconductor device according to the present invention, the cooling through hole 7 may be formed by cutting the sealing resin 6.

  In this case, the cooling through hole can be easily formed with an existing cutting apparatus.

  Further, the present invention includes not only the above-described optically coupled semiconductor device and the manufacturing method thereof but also an electronic device using the above-described optically coupled semiconductor device. As the electronic device, there is a power supply device for a television receiver or an FA, and any kind of electronic device may be used as long as it includes a circuit for performing signal transmission with insulation between input and output.

FIG. 1A is a perspective view of a schematic configuration of the optically coupled semiconductor device according to the first embodiment of the present invention viewed from the front, and FIG. 1B is a bottom view thereof viewed from below. FIG. 2A is a perspective view seen from the front showing the schematic configuration of the optically coupled semiconductor device according to the second embodiment of the present invention, and FIG. 2B is a bottom view seen from below. FIG. 3A is a perspective view seen from the front showing a schematic configuration of the optically coupled semiconductor device according to Embodiment 3 of the present invention, and FIG. 3B is a bottom view seen from below. FIG. 4 is a front perspective view showing a schematic configuration of the optically coupled semiconductor device according to Embodiment 4 of the present invention. FIG. 5A is a perspective view of the schematic configuration of the optically coupled semiconductor device according to the fifth embodiment of the present invention viewed from the front, and FIG. 5B is a bottom view of the optical coupled semiconductor device viewed from below. FIG. 6A shows a modified example of the fifth embodiment of the present invention, FIG. 6A is a perspective view showing a schematic configuration of the optically coupled semiconductor device viewed from the front, and FIG. 6B is a bottom view seen from below. . FIG. 7A is a perspective view showing a schematic configuration of an optically coupled semiconductor device (opposing photocoupler) according to Embodiment 6 of the present invention as viewed from the front, and FIG. 7B is a bottom view when viewed from below. It is a figure FIG. 8A is a perspective view seen from the front showing a schematic configuration of the optically coupled semiconductor device according to Embodiment 7 of the present invention, and FIG. 8B is a bottom view seen from below. FIG. 9A is a perspective view seen from the front showing a schematic configuration of an example in which the present invention is applied to the manufacture of a counter-type photocoupler, and FIG. 9B is an application of the present invention to the manufacture of a plane-mounted photocoupler. It is the perspective view seen from the front which shows schematic structure of the example which was made.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical coupling semiconductor device 2 Light emission side lead frame 21 Semiconductor element mounting header part 22 Semiconductor non-mounting surface 3 Light receiving side lead frame 31 Semiconductor element mounting header part 32 Semiconductor non-mounting surface 4 Light emitting element 5 Light receiving element 6 Sealing resin 61 Side surface 7 Cooling hole 71 Open end 8 Heat dissipating material 9 Uneven surface of semiconductor non-mounting surface 10 Water stop 12 Resin sealing mold 13 Resin sealing mold 14 Convex

Claims (12)

A light emitting side lead frame and a light receiving side lead frame;
A light emitting element mounted on a semiconductor element mounting header portion of the light emitting side lead frame;
A light receiving element mounted on a semiconductor element mounting header portion of the light receiving side lead frame,
In the optically coupled semiconductor device in which the light emitting element and the light receiving element are arranged to face each other, and both the lead frames and the both elements are sealed with a sealing resin.
An optically coupled semiconductor device, wherein the sealing resin is provided with a cooling through hole communicating with at least one semiconductor non-mounting surface of the semiconductor element mounting header portion. The optically coupled semiconductor device according to claim 1,
An optically coupled semiconductor device comprising a plurality of cooling holes. The optically coupled semiconductor device according to claim 1,
An optically coupled semiconductor device, wherein the cooling through hole is filled with a heat dissipation material. The optically coupled semiconductor device according to claim 1,
An optically coupled semiconductor device, wherein the semiconductor non-mounting surface is provided with irregularities. The optically coupled semiconductor device according to claim 1,
An optically coupled semiconductor device, wherein a water stop portion for blocking moisture entering from the outside through the cooling through hole is provided on the non-semiconductor mounting surface so as to surround the cooling through hole. The optically coupled semiconductor device according to claim 5,
The optically coupled semiconductor device, wherein the water stop portion is provided so as to surround the cooling through hole in multiple layers. In the optical coupling semiconductor device according to claim 5 or 6,
The optically coupled semiconductor device, wherein the water stop portion is configured by a plurality of convex portions or concave portions formed on the semiconductor non-mounting surface. The optically coupled semiconductor device according to claim 1,
The optical coupling semiconductor device, wherein the cooling through hole is a groove whose opening end faces a side surface of the sealing resin. The optically coupled semiconductor device according to claim 1,
The optical coupling semiconductor device, wherein the cooling through hole is provided to be inclined with respect to the header portion.   2. The method of manufacturing an optically coupled semiconductor device according to claim 1, wherein a resin sealing mold having a convex portion that comes into contact with the semiconductor non-mounting surface of the semiconductor element mounting header portion when the sealing resin is filled is used.   The method for manufacturing an optically coupled semiconductor device according to claim 1, wherein the cooling through hole is formed by cutting a sealing resin.   An electronic apparatus comprising the optically coupled semiconductor device according to claim 1.

Images