JP2009059791A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic device whose main body is supported by a stand and in which the main body of the device is reliably mounted in the stand with a good workability. <P>SOLUTION: In the electronic device comprising the main body 11 of the device and a stand 12 for supporting the device main body 11, slide grooves 16A, 16B horizontally extended are provided in side surfaces of the device main body 11, the stand 12 is provided with annular projections 24A, 24B, 25A, 25B to be engaged in the slide grooves 16A, 16B, and an engagement mechanism (including engagement recesses 26A, 26B, 27A, 27B and engagement projections 17A, 17B, 18A, 18B) for engaging the annular projections 24A, 24B, 25A, 25B with the device main body 11 when the device main body 11 is mounted at a predetermined mounting position of the stand 12 is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device in which an electronic device body is supported by a stand.

  For example, an electronic device such as a personal computer, a game machine, or a tuner may be installed vertically in consideration of space saving. In this case, if a case-like electronic device is simply placed vertically, the center of gravity is raised and the stability deteriorates. Therefore, the stability is improved by using a normal stand and mounting the electronic device main body on the stand. Therefore, in the electronic apparatus configured to support the apparatus main body using the stand, means for attaching and fixing the stand to the apparatus main body is required.

  Conventionally, in order to fix the stand to the apparatus main body, as shown in Patent Document 1, a method of fixing the stand to the apparatus main body using a screw has been generally adopted. However, this method has a problem in that a screw is required to fix the stand to the apparatus main body, which increases the number of parts and the number of assembling steps.

As a method for coping with this, as disclosed in Patent Document 2, a method of slidingly mounting the electronic device main body on the stand from above is proposed. In this method, the projection provided on the stand sandwiches the electronic device main body while the electronic device main body is mounted on the stand, thereby preventing the electronic device main body from being detached from the stand.
JP 2004-281944 A JP 2001-358469 A

  However, in the method in which the electronic device main body is slid from the upper part to the stand, the heavy electronic device main body is lifted to a position higher than the stand, and the device main body and the stand are positioned in this lifted state to slide the electronic device. There is a problem that the mounting work is troublesome and difficult.

  Further, in the method of mounting the electronic device main body on the stand from the upper part, even if the device main body is mounted on the stand out of the proper position, it is difficult for the person performing the mounting operation to determine this. For this reason, there was also a problem that the electronic device main body was not properly attached to the stand, and the electronic device might be detached from the stand.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic apparatus in which an electronic apparatus main body can be securely attached to a stand with good workability.

From the first aspect of the present invention, the above problem is
An electronic device comprising an electronic device main body (11) and a stand (12) that supports the electronic device main body (11),
A slide groove (16A, 16B) extending in the horizontal direction is provided on a side surface of the electronic device body (11), and a protrusion (24A) that engages the slide groove (16A, 16B) in the stand (12). , 24B, 25A, 25B)
And when the said electronic apparatus main body (11) is mounted | worn in the predetermined mounting position of the said stand (12), the said protrusion (24A, 24B, 25A, 25B) and the said electronic apparatus main body (11) are latched This can be solved by an electronic device provided with a locking mechanism.

In the above invention, the locking mechanism includes an engagement recess (26A, 26B, 27A, 27B) formed in the protrusion (24A, 24B, 25A, 25B) and the slide groove (16A, 16B). ) And locking protrusions (17A, 17B, 18A, 18B) provided in
When the electronic device body (11) is mounted at a predetermined mounting position of the stand (12), the locking projections (17A, 17B, 18A, 18B) are engaged with the engaging recesses (26A, 26B, 27A, 27B). It is desirable that the stand (12) and the electronic device main body (11) be locked by engaging with each other.

In the above invention, the first heat dissipation hole (15) is formed in the lower part of the electronic device body (11), and the second heat dissipation hole (22) is formed in the bottom plate portion of the stand,
It is desirable that the first heat dissipation hole (15) and the second heat dissipation hole (22) face each other when the electronic device body (11) is mounted at the predetermined mounting position.

  In addition, the said reference code is a reference to the last, and description of a claim is not limited by this.

  According to the present invention, the electronic device main body is placed horizontally with respect to the stand by providing the slide groove extending in the horizontal direction on the side surface of the electronic device main body and providing the protrusion on the stand to engage with the slide groove. It can be mounted by sliding in the direction. This eliminates the need to lift the electronic device main body, which is a heavy object, and simplifies the installation work. In addition, when the electronic device main body is mounted at the predetermined mounting position of the stand, a locking mechanism for locking the protrusion and the electronic device main body is provided to prevent the electronic device main body from being detached from the stand. be able to.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  1 and 2 are diagrams for explaining an electronic device 10 according to an embodiment of the present invention. 1 is a perspective view of the electronic device 10, FIG. 2A is a front view of the electronic device 10, FIG. 2B is a bottom view of the electronic device 10, and FIG. FIG.

  As shown in the drawings, the electronic device 10 is roughly composed of an electronic device main body 11 and a stand 12. The electronic device 10 is, for example, a game machine or a tuner, and has a configuration in which various circuits and devices are incorporated in the electronic device main body 11.

  The electronic device 10 of this type is desired to save installation space. For this reason, the electronic device 10 according to the present embodiment also saves installation space by placing the electronic device body 11 vertically. Further, the electronic device 10 is desired to be reduced in size and weight, and in response to this, various circuits and devices arranged in the electronic device main body 11 are mounted with high density, and the electronic device is also provided. A resin molded product is used as the main body 11 (the conventional electronic device main body 11 is generally a metal case).

  On the other hand, many circuits and devices disposed in the electronic device main body 11 generate heat. Conventionally, since the shape of the electronic device main body was large, a passage for cooling air could be formed in the electronic device main body, and the heat dissipation efficiency was high because the electronic device main body was made of metal. For this reason, the number of heat dissipation holes provided in the electronic device main body is small.

  On the other hand, in this embodiment, since the density of the circuits and the like disposed in the electronic device main body 11 is increased and a resin molded product is used as the electronic device main body 11, there is a concern that the heat dissipation efficiency is deteriorated. Therefore, in this embodiment, the electronic device main body 11 has a large number of heat radiation holes 13, 14, and 15 formed therein.

  Specifically, an upper heat radiating hole 13 is formed in the upper part (upper surface) of the electronic device main body 11, a side heat radiating hole 14 is formed in the side part (side face), and a bottom heat radiating hole is further formed in the bottom part (bottom face). 15 is formed. As described above, the electronic device 10 according to the present embodiment can reduce the size, density, and weight of the device by forming a large number of heat radiation holes 13, 14, and 15 in the electronic device body 11. The heat generated in the electronic device main body 11 is efficiently discharged to the outside of the device.

  As described above, the electronic device 10 according to the present embodiment has a structure in which the electronic device main body 11 is vertically placed in consideration of space saving of the installation space. In this way, in the structure in which the electronic device main body 11 is placed vertically, the center of gravity is raised and the stability is deteriorated. Therefore, also in this embodiment, the stand 12 is used for stabilization.

  The stand 12 is a resin molded product, and has a configuration in which a bottom plate portion 20 and side plate portions 21A and 21B are integrally formed as shown in an enlarged view in FIGS. The side plate portions 21A and 21B are configured to extend upward from both sides of the bottom plate portion 20, and thus the side plate portions 21A and 21B are directed to the bottom plate portion 20 in directions indicated by arrows A1 and A2 in FIG. The structure is slightly elastically deformable. The electronic device main body 11 is mounted in a space formed by the bottom plate portion 20 and the pair of side plate portions 21A and 21B.

  A plurality of stand-side heat radiation holes 22 are formed in the bottom plate portion 20. Further, the bottom plate portion 20 forms a separation portion 41 slightly apart from the contact surface 23 that contacts the installation surface 40 (for example, a desk or the like) on which the stand 12 is actually placed (FIG. 4 ( B)). By forming the separation portion 41, the heat dissipation efficiency of the electronic device main body 11 described later is enhanced. Reference numeral 28 denotes a punched hole into which a jig used to form protrusions 24A, 24B, 25A, and 25B, which will be described later, when the stand 12 is molded with resin.

  Next, a mechanism for locking the electronic device main body 11 to the stand 12 (hereinafter referred to as a locking mechanism) will be described. The locking mechanism includes locking protrusions 17A, 17B, 18A, and 18B formed in the slide grooves 16A and 16B, and protrusions 24A, 24B, 25A, and 25B formed on the stand 12. .

As shown in FIGS. 5 and 6, the slide grooves 16 </ b> A and 16 </ b> B are formed so as to extend in the horizontal direction (the directions of the arrows X <b> 1 and X <b> 2 in the drawing) on both side surfaces of the electronic device body 11. The slide grooves 16A and 16B are formed to extend in the horizontal direction. Specifically, the extending direction of the slide grooves 16 </ b> A and 16 </ b> B is parallel to the contact surface 23 (equivalent to the installation surface 40) of the stand 12 when the electronic device body 11 is mounted on the stand 12. It is set as follows.
Direction.

  The locking projections 17A and 18A formed in the slide groove 16A are formed so as to protrude in the direction of the arrow Y2 in the figure, and the locking projections 17B and 18B formed in the slide groove 16B are shown in the figure. It is formed so as to protrude in the arrow Y1 direction. The locking projections 17A and the locking projections 17B are formed so as to face each other in the directions of the arrows Y1 and Y2, and the locking projections 18A and the locking projections 18B are also faced in the directions of the arrows Y1 and Y2. Is formed.

  The protrusions 24A and 25A are formed on the inner side of the side plate part 21A, and the protrusions 24B and 25B are formed on the inner side of the side plate part 21B. The protruding amount T of each protrusion 24A, 24B, 25A, 25B from the inner surface of the side plate portion 21A, 21B should be 2.0 mm or more from the viewpoint of preventing the occurrence of rattling during sliding and the stability of the slide. desirable. According to the experiment of the present inventor, when the protrusion amount T is 1.5 mm or more and less than 2.0 mm, the above-described rattling or destabilization (hereinafter referred to as defective) may occur, and the protrusion amount T is less than 1.5 mm. In almost all cases, defects occurred.

The protrusion 24A has an engaging recess 26A. Similarly, the protrusion 24B has an engagement recess 26B, the protrusion 25A has an engagement recess 27A, and the protrusion 25B has an engagement. Joint recesses 27B are respectively formed.
The formation positions of the engagement recesses 26A and 26B are formed at positions slightly shifted from the center positions of the protrusions 24A and 24B toward the arrow X2 direction in the figure, and the formation positions of the engagement recesses 27A and 27B are the protrusions. It is formed at a position slightly shifted in the direction of the arrow X1 in the drawing from the center position of the portions 25A and 25B.

    In addition, the engagement recess 26A and the engagement recess 26B, and the engagement recess 27A and the engagement recess 27B are formed to face each other in the width direction (Y1, Y2 direction). Furthermore, in each of the engaging recesses 26A, 26B, 27A, and 27B, the protruding portion 24A and the protruding portion 25A are symmetrically arranged (a line object with respect to the center line O with respect to the longitudinal direction shown in FIG. 4A), and The ridges 24B and the ridges 25B are also set to be line symmetric with respect to the center line O.

  Next, slide grooves 16A, 16B and locking projections 17A, 17B, 18A, 18B provided on the electronic device main body 11, protrusions 24A, 24B, 25A, 25B and engagement recesses formed on the stand 12 are provided. The relationship between 26A, 26B, 27A, and 27B will be described.

  The slide groove 16A provided in the electronic device main body 11 is configured to engage with the protrusions 24A and 25A formed on the stand 12, and the slide groove 16B is configured to engage with the protrusions 24B and 25B. Has been. Accordingly, when the electronic device main body 11 is mounted on the stand 12, the protrusions 24A, 24B, 25A, and 25B are relatively mounted by sliding in the slide grooves 16A and 16B.

  At this time, the protrusion amount T of the protrusions 24A, 24B, 25A, and 25B is set to a value that provides good slidability and stability as described above. Further, the protrusions 24A, 24B, 25A, 25B have a relatively long width W in the sliding direction (arrow X1, X2 direction) (only the engagement recess 26A is shown in FIG. 5, but the other engagement recesses 26B, 27A). , 27B). Therefore, the electronic device main body 11 can be reliably slid with respect to the stand 12, and the mounting stability of the electronic device main body 11 and the stand 12 can be improved after the slide is mounted.

  On the other hand, the distance between the locking projection 17A and the locking projection 18A formed on the electronic device body 11 and the distance between the locking projection 17B and the locking projection 18B (indicated by an arrow L1 in FIG. 5). The distance between the engagement recess 26A and the engagement recess 27A formed on the stand 12 and the distance between the engagement recess 26B and the engagement recess 27B (indicated by the arrow L2 in FIG. 5) are the same distance. (L1 = L2). Therefore, when the electronic device main body 11 is mounted on the stand 12 from the state shown in FIG. 5, the locking projection 17A engages with the engaging recess 26A and the locking projection 17B is engaged with the engaging recess 26B as shown in FIG. The locking projection 18A engages with the engagement recess 27A, and the locking projection 18B engages with the engagement recess 27B.

  Thus, when the electronic device main body 11 is mounted on the stand 12, the locking projections 17A, 17B, 18A, 18B are formed in the engaging recesses 26A, 26B, 27A, 27B as shown in an enlarged view in FIG. Engage and lock. FIG. 7 shows a state in which the locking protrusion 17A is engaged with the engaging recess 26A. As shown in the figure, the shape of the locking projection 17A and the shape of the engaging recess 26A correspond to each other, so that the locking is reliably performed. In FIG. 7, only the position indicated by the arrow P in FIG. 6 is shown enlarged, but the other locking positions are the same.

  Next, a mounting operation for mounting the electronic device main body 11 to the stand 12 will be described. As shown in FIG. 5, when the electronic device body 11 is mounted on the stand 12 in the direction of the arrow X1, the slide groove 16A and the ridge portion 24A, the slide groove 16B and the ridge portion 24B are aligned, and the ridge portion 24A, 24B is inserted into the slide grooves 16A and 16B and slid in the direction of the arrow X1.

  By this operation, the locking projections 18A and 18B first come into contact with the ridges 24A and 24B. As described above, since the side plate portions 21A and 21B are elastically deformable in the directions of arrows A1 and A2 (see FIG. 4B), the electronic device main body 11 is strongly moved in the direction of arrow X1 for locking. The protrusions 18A and 18B move over 24A and 24B, and further move in the X1 direction relatively within the slide grooves 16A and 16B.

  With this movement, the locking projections 18A and 18B abut on the ridges 25A and 25B, and the locking projections 17A and 17B abut on the ridges 24A and 24B. After this state is reached, when the electronic device main body 11 is pushed more strongly in the direction of the arrow X1, the locking projections 17A, 17B, 18A, 18B ride on the protrusions 24A, 24B, 25A, 25B, and further in the X1 direction. When the electronic device main body 11 is moved, the protrusions 24A, 24B, 25A, 25B are engaged and locked with the corresponding engaging recesses 26A, 26B, 27A, 27B.

  When each of the protrusions 24A, 24B, 25A, and 25B engages with the engaging recesses 26A, 26B, 27A, and 27B, the operator can feel this engagement as a click feeling, and the predetermined mounting position (stand 12 It can also be recognized as a sensation that the electronic device main body 11 is mounted at a position where the electronic device main body 11 is properly mounted and locked. Further, when the protrusions 24A, 24B, 25A, 25B are engaged with the engaging recesses 26A, 26B, 27A, 27B, the ends of the protrusions 24A, 24B on the X2 direction side are stepped portions 19A, 19B. Because of the engagement, the electronic device main body 11 is not moved in the X1 direction from the default mounting position.

  As described above, in this embodiment, the slide grooves 16A and 16B extending in the horizontal direction are provided on the side surface of the electronic device main body 11, and the protrusions 24A, 24B, and 25A that engage the slide grooves 16A and 16B in the stand 12 are provided. , 25B can be mounted by sliding the electronic device body 11 in the horizontal direction (X1, X2 direction) with respect to the stand 12.

  Thereby, it is not necessary to lift the electronic device main body 11 which is a heavy object as high as in the conventional case, and the mounting work can be simplified. Further, when the electronic device main body 11 is mounted at the predetermined mounting position of the stand 12, each protrusion 24A, 24B, 25A, 25B engages and locks with the corresponding engagement recess 26A, 26B, 27A, 27B. Therefore, it is possible to prevent the electronic device main body 11 from being detached from the stand 12.

  Further, when the electronic device main body 11 is mounted at the default mounting position of the stand 12, the bottom heat radiating hole 15 formed in the electronic device main body 11 and the stand side heat radiating hole 22 formed in the stand 12 are configured to face each other. Yes. Thereby, the heat discharged from the bottom heat radiating hole 15 formed in the bottom of the electronic device body 11 is shown in the stand-side heat radiating hole 22 and the separation part 41 between the bottom plate part 20 and the installation surface 40 (FIG. 4B). ) To the outside. Therefore, according to the configuration of the present embodiment, it is possible to improve the heat dissipation efficiency even in the electronic device main body 11 that is densified and miniaturized.

  Further, as described above, the locking projections 17A and 17B and the locking projections 18A and 18B are arranged so as to be symmetrical with respect to the center line O, and the engaging recesses 26A, 26B, 27A, and 27B are also included therein. Since it is formed so as to correspond, the electronic device main body 11 can be attached to the stand 12 from the direction of the arrow X1 or from the direction of X2. Therefore, when the electronic apparatus main body 11 is mounted on the stand 12, the mounting direction is not directional, and the mounting operation can be easily performed.

  In addition, when removing the electronic apparatus main body 11 from the stand 12, since what is necessary is just to perform operation opposite to above mounting operation, the description is abbreviate | omitted.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above, and various modifications can be made within the scope of the present invention described in the claims. It can be modified and changed.

FIG. 1 is a perspective view of an electronic device according to an embodiment of the present invention. 2A and 2B show an electronic device according to an embodiment of the present invention, in which FIG. 2A is a front view, FIG. 2B is a bottom view, and FIG. 2C is a left side view. FIG. 3 is a perspective view of a stand constituting the electronic apparatus according to the embodiment of the present invention. 4A and 4B show a stand constituting an electronic apparatus according to an embodiment of the present invention, in which FIG. 4A is a plan view and FIG. 4B is a front view. FIG. 5 is a diagram for explaining an operation of mounting the electronic device main body on the stand in the electronic device according to the embodiment of the present invention (part 1). FIG. 5 is a diagram for explaining an operation of mounting the electronic device main body on the stand in the electronic device according to the embodiment of the present invention (part 2). FIG. 7 is an enlarged view of a region indicated by P in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic apparatus 11 Electronic apparatus main body 12 Stand 13 Upper heat radiation hole 14 Side heat radiation hole 15 Bottom heat radiation hole 16A Slide groove 16B Slide groove 17A, 17B, 18A, 18B Locking protrusion 20 Bottom plate part 21A, 21B Side plate part 22 Stand side Radiation hole 23 Contact surface 24A, 24B, 25A, 25B Projection part 26A, 26B Engagement recess

Claims (3)

An electronic device comprising an electronic device main body and a stand that supports the electronic device main body,
A slide groove extending in the horizontal direction is provided on a side surface of the electronic device main body, and a protrusion is provided on the stand to engage with the slide groove.
And the electronic device which provided the latching mechanism which latches the said protrusion and the said electronic device main body when the said electronic device main body was mounted | worn in the default mounting position of the said stand. The locking mechanism is constituted by an engaging recess formed in the ridge and a locking protrusion provided in the slide groove,
The electronic device main body is configured to be locked to the stand by engaging the locking protrusion with the engaging recess when the electronic device main body is mounted at a predetermined mounting position of the stand. Item 2. The electronic device according to Item 1. Forming a first heat dissipating hole in the lower part of the electronic device main body, and forming a second heat dissipating hole in the bottom plate of the stand;
3. The electronic device according to claim 1, wherein when the electronic device main body is mounted at the predetermined mounting position, the first heat dissipation hole and the second heat dissipation hole face each other.

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