JP2009047934A - Electro-optical element and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow mass production of an electro-optical element at low cost. <P>SOLUTION: The electro-optical element has an electro-optical crystal 1, on-electro-optical-crystal electrodes 3, 3a formed respectively on one face 1a and the other face 1b of the electro-optical crystal 1, an insulator 5 having the first face 51 opposed to the other face 1b of an obverse and a reverse of the electro-optical crystal 1 in an angled position, and having the second face 52 opposed to one end face 1c of the electro-optical crystal 1, and an on-insulator electrode 7 formed on the first face 51. Only a volume of the ridge portion in a conventional electro-optical element is required as the electro-optical crystal, and the expensive electro-optical crystal is used efficiently thereby to reduce a cost. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical element and a manufacturing method capable of mass-producing the same.

  By using an electro-optic element that detects a change in optical properties of an electro-optic crystal due to an electric field with laser light, a slight change in the electric field can be measured. For example, in electric field communication using a surface of a living body or the like as a transmission path, a technique for transmitting information using an electro-optic element is known (for example, see Patent Document 1).

  Since the electro-optical element is a comparatively large element having a size on the order of millimeters, a ridge is shaved from a rectangular parallelepiped electro-optical crystal to manufacture the electro-optical element.

  However, when processed by hand, there is a problem that it is difficult to produce in large quantities. In addition, the electro-optic crystal to be processed has a size on the order of millimeters and has a larger pattern than conventional semiconductor elements, so it can be processed at low cost without using expensive fine processing techniques such as dry etching. Is desirable.

In order to improve the reproducibility and efficiency of production for these improvements, mass production of a small electro-optic element having a thin ridge 20 as shown in FIG. 17 is possible by a technique using dicing and cleavage techniques. (For example, see Patent Document 2).
JP 2005-277719 A JP 2007-183517 A

  However, even if dicing and cleaving techniques are used to efficiently produce a small electro-optic element while maintaining the performance, the pedestal part is made of electro-optic crystal, and the ridge part is also shaved off the electro-optic crystal. Therefore, expensive electro-optic crystals are not used efficiently, and from the viewpoint of cost, the prospect of being inexpensively manufactured is not sufficient.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electro-optic element having a small volume of an electro-optic crystal and a manufacturing method capable of mass-producing the same.

  In order to solve the above problems, the present invention of claim 1 is directed to an electro-optic crystal and an electro-optic crystal formed on one surface of the electro-optic crystal, or on one surface and the other surface. An upper electrode and an insulator, the first surface facing the other surface of the electro-optic crystal at the corner of the insulator, and the second surface facing one end face of the electro-optic crystal And an electro-optic element characterized by comprising an electrode on an insulator formed on the first surface.

  According to a second aspect of the present invention, the one surface is included in a surface including a third surface adjacent to the second surface, and is opposed to the end surface in a surface including a fourth surface adjacent to the first surface. The electro-optical element according to claim 1 is used as a solving means.

  According to a third aspect of the present invention, there is provided an insulator upper electrode formed on a third surface adjacent to the second surface, and a conductive material passed between the insulator upper electrode and the electro-optic crystal upper electrode. The electro-optical element according to claim 1 or 2 is used as a solving means.

  According to a fourth aspect of the present invention, there is provided a step of forming a groove in the insulator, a step of adding a resist to the bottom of the groove, and a part of the insulator so as to leave one inner wall surface and the bottom of the groove. A step of separating, a step of forming an upper electrode on an insulator on a surface which was one inner wall surface of the groove, and an upper electrode of the insulator on the resist in this step is removed by removing the resist. Formed on the surface that was the inner wall surface of the groove, and the step of forming an electrode on the electro-optic crystal on one surface of the front and back surfaces of the electro-optic crystal, or on the one surface and the other surface. And a process for making the other surface of the electro-optic crystal face the electrode on the insulator.

  The present invention of claim 5 is characterized in that the step of providing the electrode on the electro-optic crystal is a step of providing the electrode on the electro-optic crystal by vapor deposition while rotating the electro-optic crystal. The electro-optic element manufacturing method is used as a solution.

  According to a sixth aspect of the present invention, there is provided a step of forming a groove in the insulator, a step of adding a resist to the bottom portion of the groove, and a part of the insulator at one end in the width direction of the bottom of the groove , A step of forming an electrode on the insulator on the surface that was one inner wall surface of the groove, and removing the electrode on the insulator on the resist in this step by removing the resist And a step of sandwiching a pre-prepared electro-optic crystal between the electrode on the insulator formed on the surface which was one inner wall surface of the groove and another pre-prepared electrode. The manufacturing method of the optical element is used as the solution.

  According to the electro-optic element of the present invention, an electro-optic crystal, an electrode on the electro-optic crystal formed on one surface of the front and back surfaces of the electro-optic crystal, or the one surface and the other surface, and an insulator The first surface facing the other surface of the electro-optic crystal and the second surface facing one end surface of the electro-optic crystal at the corners of the insulator; Since the electro-optic crystal has only the volume of the ridge portion in the conventional electro-optic element, the expensive electro-optic crystal can be efficiently formed. It can be used and the cost can be reduced.

  Further, the one surface is included in a surface including a third surface adjacent to the second surface, and an end surface facing the end surface is included in a surface including the fourth surface adjacent to the first surface. Since the ridge is eliminated, the ridge can be prevented from being lost, and an electro-optic element that can be easily handled can be provided.

  According to the method for manufacturing an electro-optic element of the present invention, the step of forming a groove in the insulator, the step of adding a resist to the bottom of the groove, and leaving one inner wall surface and the bottom of the groove A step of separating a part of the insulator, a step of forming an upper electrode on an insulator on a surface which was one inner wall surface of the groove, and an upper electrode of the insulator attached on the resist in the step A step of forming the electrode on the electro-optic crystal on one side of the front or back of the electro-optic crystal, or the one side and the other side, and one inner wall surface of the groove The other surface of the electro-optic crystal is opposed to the electrode on the insulator formed on the existing surface, so that the electro-optic crystal is a ridge portion of a conventional electro-optic element. Only needs about the volume, and therefore expensive A-optic crystal can be efficiently used, and the cost can be reduced.

  In addition, by forming a plurality of grooves and dividing them into units containing one groove, and dividing the electro-optic crystal similarly without cutting out, a large number of electro-optic elements are produced at one time. Can be mass-produced at low cost.

  Embodiments of an electro-optical element and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view of an electro-optic element according to an embodiment of the present invention.

  The electro-optic elements are formed on the electro-optic crystal 1, the one surface 1 a (referred to as the electro-optic crystal surface 1 a) and the other surface 1 b (referred to as the electro-optic crystal surface 1 b) on the front and back sides of the electro-optic crystal 1, respectively. An optical crystal upper electrode 3, 3 a and an insulator, and at the corner of the insulator, a first surface 51 (referred to as an insulator surface 51) facing the electro-optic crystal surface 1 b and one of the electro-optic crystals 1 It has a second surface 52 (referred to as an insulator surface 52) facing the end face 1 c (referred to as an electro-optic crystal surface 1 c) (referred to as an insulator 5) and an insulator upper electrode 7 formed on the insulator surface 51.

  Here, the electro-optic crystal upper electrode 3a is formed on the electro-optic crystal surface 1b. However, this is not essential. Therefore, without considering this, the insulator surface 51 becomes the electro-optic crystal surface 1b as described above. It was expressed as facing each other.

  In addition, the electro-optic crystal surface 1 a is included in a plane including the third surface 53 (referred to as the insulator surface 53) of the insulator 5 adjacent to the insulator surface 52. An end face 1d (referred to as electro-optic crystal face 1d) facing the electro-optic crystal face 1c is included in a plane including the fourth face 54 (referred to as insulator face 54) of the insulator 5 adjacent to the insulator face 51. That is, the corner portion of the insulator 5 is constituted by the electro-optic crystal 1 and the electro-optic crystal upper electrodes 3 and 3a, and there is no unevenness as a whole.

  Whether or not the electro-optic crystal surface 1a is included in the plane including the insulator surface 53 and whether or not the electro-optic crystal surface 1d is included in the plane including the insulator surface 54 should not be strictly determined. If there is no unevenness, it may be determined that such a condition is satisfied.

  The insulator upper electrode 7 is formed so as to cover the insulator surface 51 and the insulator surface 54. The insulator upper electrode 7 on the insulator surface 54 is not essential, but it is preferable that a lead wire or the like can be connected to the insulator upper electrode 7. Moreover, it is convenient also in manufacture.

  Also, an insulator upper electrode 7a is formed on the insulator surface 53, and a conductive material 15 such as silver paste is added so as to pass between the insulator upper electrode 7a and the electro-optic crystal upper electrode 3, thereby Is conducted. Further, the electro-optic crystal 1 and the electro-optic crystal upper electrodes 3 and 3 a are fixed to the insulator 5 with an adhesive 16.

  For example, the width of the insulator 5 is 1.5 mm, for example. For example, the width, height, and length of the electro-optic crystal 1 are 0.2 mm, 0.5 mm (or 1.0 mm), and 7.0 mm, respectively.

  In this electro-optic element, the electro-optic crystal upper electrode 3 and the insulator upper electrode 7a are electrically connected to one place across the place where the electric field change to be detected occurs, and the electro-optic crystal upper electrode 3a and The insulator upper electrode 7 is electrically connected, whereby a voltage is applied between the electro-optic crystal upper electrodes 3 and 3a. Then, the electric field strength in the electro-optic crystal 1 changes according to the electric field change, and the optical characteristics of the electro-optic crystal 1 change. The laser light 21 incident from one end face perpendicular to the longitudinal direction of the electro-optic crystal 1 and perpendicular to the electric field direction is modulated by a change in optical characteristics and emitted from the other end face. By processing this modulated laser beam, the change in the electric field to be detected is detected.

  Next, a method for manufacturing an electro-optic element according to an embodiment of the present invention will be described.

  In this manufacturing method, a first step of forming a groove in the insulator 5, a second step of adding a resist to the bottom of the groove, a part of the insulator 5 so as to leave one inner wall surface and the bottom of the groove. A third step of separating, a fourth step of forming the upper insulator electrode 7 on the insulator surface 51 and the resist, which was one inner wall surface of the groove, and an upper insulator electrode attached on the resist in the fourth step 5 is removed by removing the resist, a sixth step of forming the electrooptic crystal upper electrode 3 on the electrooptic crystal surface 1a, and an electrooptic on the insulator upper electrode 7 formed on the insulator surface 51. And a seventh step of making the crystal face 1b face each other.

  In the first step, the second step, the third step, the fourth step, and the fifth step, the rectangular flat insulator 5 as shown in FIG. 2 is processed.

  FIG. 3A is a diagram showing a portion denoted by reference numeral 11 in FIG. 2, and FIGS. 3B to 3D, FIGS. 4A and 4B show changes in the manufacturing process of that portion. FIG. The processing according to the description with reference to these drawings is applied not only to this part but also to other parts.

  In the first step, first, as shown in FIG. 3B, the insulator upper electrode 7 made of a metal electrode material is entirely formed on the insulator 3. Here, for example, Cr and Au or Cr and Al are deposited by sputtering.

  Next, as shown in FIG. 3C, a resist 6 is entirely applied on the insulator upper electrode 7. Thus, the insulator upper electrode 7 is protected.

  Next, as shown in FIG. 3D, for example, a dicing blade 13 having a width of 0.22 mm is moved, and by this dicing, an upper electrode on the insulator is applied from above the resist 6 as shown in FIG. 7 is divided and a groove 9 is formed in the insulator 5. The plurality of grooves 1 formed in this way, including those not shown, are parallel and the pitch is, for example, 3.0 mm.

  In place of dicing, a wire cut, a laser cut, or a micro drill may be used.

  In the subsequent second step, first, a resist 6A is applied to the groove 9 as shown in FIG.

  Next, as shown in FIG. 4C, for example, the dicing blade 13 having a width of 0.22 mm is moved in the length direction of the groove 9, and by this dicing, as shown in FIG. The resist 6A in the portion above the resist 6A at the bottom of the substrate is removed.

  In the subsequent third step, as shown in FIG. 4 (e), a part of the insulator 5 is removed by the dicing blade 13 so as to leave one inner wall surface and the bottom of the groove 9 and Separate with resist 6A.

  Actually, as shown in FIG. 5, a plurality of insulators 5 provided with an insulator upper electrode 7 (not shown) and a resist 6A (not shown) are obtained. For example, the width, height, and length of the insulator 5 are 1.5 mm, 3.0 mm, and 7.0 mm, respectively.

  Next, the obtained insulators 5 after processing are arranged as shown in FIG.

  In the subsequent fourth step, as shown in FIG. 7A, the insulator upper electrode 7 is formed on the insulator surface 51 which was one inner wall surface of the groove 9. Here, for example, Cr and Au or Cr and Al are deposited by sputtering. Along with this, insulation is performed on the resist 6A attached to the insulator surface 52 which is the bottom of the groove 9 and also on the insulator surface 53 which is a surface which appears when part of the insulator 5 is cut off in the third step. An on-body electrode 7 is formed. The insulator upper electrode 7 on the insulator surface 53 is referred to as the insulator upper electrode 7a in FIG.

  In the subsequent fifth step, by melting and removing the resist 6A shown in FIG. 7B, the portion of the upper insulator electrode 7 attached on the resist 6A attached to the insulator surface 52 is changed to that shown in FIG. Remove and wash as shown in That is, the portion of the upper insulator electrode 7 to be removed loses its support and is removed. As a result, as shown in FIG. 8, the insulator 5 is processed and provided with the insulator upper electrodes 7 and 7a.

In the sixth step, first, as shown in FIG. 9A, for example, a compound semiconductor crystal having a ZnTe or zinc flash steel type is formed by sputtering using a deposition source 17 of Au and a deposition source 18 of Cu. GaAs, InP, CdTe, etc.) or Shirenaito compound _{(Bi 12 GeO 20, Bi 12} SiO 20, Bi 12 TiO 20 , etc.) material as the depositing plate-like electro-optic metallic electrode material on the entire surface of the crystal 1. That is, the electrodes 3 and 3a on the electro-optic crystal are deposited.

  At this time, by rotating the electro-optic crystal 1, the stress can be made uniform, thereby preventing warping and cracking. Further, the effect is further increased by vapor deposition at a low temperature.

  Alternatively, as shown in FIG. 9B, a metal electrode material is attached to the entire surface of the electro-optic crystal 1 by electroless plating in which the flat electro-optic crystal 1 is immersed in an electrolytic solution 19. That is, the electrodes 3 and 3a on the electro-optic crystal are attached. In plating, stress is less likely to occur, so warpage and cracking are less likely to occur.

  Next, the electro-optic crystal 1 formed with the electro-optic crystal upper electrodes 3 and 3a is cut into a rectangle. This is further divided to obtain the electrooptic crystal 1 shown in FIG. 1 in which the electrooptic crystal upper electrodes 3 and 3a are formed (referred to as an electrooptic crystal component 1A).

  Here, as shown in FIG. 10, first, one of the front and back surfaces of the electro-optic crystal component 1A before the division is scribed with a scribing head H. Here, as shown in the figure, scribing is performed slightly vertically from each of a plurality of locations in contact with the end surface 91 which is one of the 100 surfaces. Since the scribe pitch is the same as the length of the electro-optic crystal component 1A, it is, for example, 7.0 mm. In addition, scribing is similarly performed from a plurality of locations in contact with the end face (100 face) facing the end face 91.

  Next, an impact is applied by the cleavage bar 22 from the front and back surfaces that are not scribed, whereby the electro-optic crystal component 1A before division is cleaved at the scribe position. Since the surfaces other than the end surface 91 and the end surface opposed to the end surface 91 are 110 surfaces, this cleavage can be easily performed. The electro-optic crystal component 1A needs to be further divided, and even in this state, it is still halfway.

  Next, as shown in FIG. 11, the anti-reflection is applied to the opposite end faces (here, the end face appearing by cleaving and the end face facing this end face) of the non-front and back end faces of the electro-optic crystal component 1A in this state. A coat (referred to as Anti-Reflection Coat, hereinafter referred to as “AR coat” for short) is applied. One of the end surfaces to which the AR coating is applied is a laser light incident surface, and the other is a laser light emission surface.

  Next, as shown in FIG. 12, the electro-optic crystal component 1A is diced and divided perpendicularly to the end surface to which the AR coating has been applied, or cleaved and divided, and the electro-optic crystal component 1A as shown in FIG. That is, a plurality of materials including the electro-optic crystal 1 and the electro-optic crystal upper electrodes 3 and 3a are obtained. The AR coating may be applied not to the middle but to a plurality of the AR coatings obtained in this way.

  In a subsequent seventh step, as shown in FIG. 13, the electro-optic crystal surface 1 b is opposed to the insulator upper electrode 7 formed on the insulator surface 51. And as shown in FIG. 1, the electroconductive material 15 is added and the conduction | electrical_connection between electrodes is aimed at by this. In addition, an adhesive 16 is added and solidified with ultraviolet rays to fix the electro-optic crystal component 1A.

  In the above description, the electro-optic crystal surface 1d is included in the plane including the insulator surface 54 as shown in FIG. 1, but the electro-optic crystal is included in the plane including the insulator surface 54 as shown in FIG. The surface 1d may not be included. In the above description, as shown in FIG. 1, the electro-optic crystal surface 1 a is included in the plane including the insulator surface 53, but the electro-optic crystal surface 1 a may not be included in the plane including the insulator surface 53. Good. That is, the electro-optic crystal 1 may be larger than that shown in FIG. 1 or smaller.

  In addition, since the manufacturing method of such an electro-optic element is the same as that of said manufacturing method, duplication description and illustration of a manufacturing process are abbreviate | omitted.

  In place of the sixth and seventh steps, an electro-optic crystal prepared in advance may be sandwiched between the insulator upper electrode 7 formed on the insulator surface 51 and another electrode prepared in advance.

  Specifically, as shown in FIG. 15A, the insulator 5 is formed with the insulator upper electrode 7, the insulator surface 53 is provided with the protrusion 531, and the insulator 30 is provided with the electrode 31 and the groove 32. Prepare things.

  Further, as shown in FIG. 15B, the electro-optic crystal 1 manufactured in the same manner as the above manufacturing method is prepared.

  Then, as shown in FIG. 15 (c), the electro-optic crystal 1 is sandwiched between the insulator upper electrode 7 and the electrode 31. At this time, the protrusion 531 is inserted into the groove 32 so that the insulator 5 and the insulator 30 are not displaced from each other and are fixed by the adhesive 16.

  Next, an example of use of this electro-optical element will be described with reference to the schematic diagram of FIG. The electric field detection optical device 110 detects an electric field by an electro-optical technique using laser light and the electro-optical element 100, and includes a laser diode 121, photodiodes 143a and 143b, and the electro-optical element 100. The electrodes 30a and 30b of the electro-optical element 100 are one electrode and the other electrode that sandwich the electro-optical crystal 1 in the above description, and are connected to the signal electrode 129 and the ground electrode 131, respectively. A first wave plate 135 and a second wave plate 137 are connected to both ends of the electro-optical element 100. A collimator lens 133 is provided between the electro-optical element 100 and the laser diode 121, and a polarizing beam splitter 139 and condenser lenses 141a and 141b are provided between the electro-optical element 100 and the photodiodes 143a and 143b.

  Laser light output from the laser diode 121 enters the electro-optic crystal of the electro-optic element 100 via the collimator lens 133 and the first wavelength plate 135. The incident laser light is modulated and emitted by the electric field from the signal electrode 129.

  The laser light emitted from the electro-optical element 100 is separated into a P wave component and an S wave component by the polarization beam splitter 139 via the second wave plate 137, and is condensed by the condensing lenses 141a and 141b. It is converted into an electric signal in the diodes 143a and 143b.

  Therefore, according to the electro-optic element according to the present embodiment, the electro-optic crystal 1, the electro-optic crystal upper electrode 3 formed on one surface (1a) of the front and back surfaces of the electro-optic crystal 1, the insulator 5, that is, the corner Having a first surface (51) facing the other surface (1b) of the front and back surfaces of the electro-optic crystal 1 and a second surface (52) facing one end surface (1c) of the electro-optic crystal 1 ( 5) and the on-insulator electrode 7 formed on the first surface (51), the electro-optic crystal 1 requires only as much as the volume of the ridge portion in the conventional electro-optic element. Expensive electro-optic crystals can be used efficiently and cost can be reduced.

  In addition, one surface (1a) is included in the surface including the third surface (53) adjacent to the second surface (51), and the surface includes the fourth surface (54) adjacent to the first surface (51). Since the end face (1d) facing the end face (1c) is included therein, the ridge is eliminated, so that the loss of the ridge can be prevented and an electro-optical element that can be easily handled can be provided.

  Further, the insulator upper electrode 7a formed on the third surface (53) adjacent to the second surface (52), and the conductive material 15 delivered to the insulator upper electrode 7a and the electro-optic crystal upper electrode 3 are provided. The resistance between these electrodes is reduced, and accurate detection can be performed.

  In addition, according to the method of manufacturing the electro-optic element according to the present embodiment, the step of forming the groove 9 in the insulator 5, the step of coating the resist 6 </ b> A on the bottom of the groove 9, one inner wall surface of the groove 9, A step of cutting off a part of the insulator 5 so as to leave the bottom, a step of forming the upper electrode 7 on the surface (51) which was one inner wall surface of the groove 9, and the bottom of the groove 9 in this step A step of removing the upper electrode 7 on the resist 6A by removing the resist 6A, a step of forming the upper electrode 3 on the front and back surfaces of the electrooptical crystal 1, and a groove The other surface (1b) of the front and back of the electro-optic crystal 1 is opposed to the insulator upper electrode 7 formed on the surface (51) which is one inner wall surface of the electro-optic crystal 9. As a crystal, only the volume of the ridge portion in the conventional electro-optic element is required. Not, therefore, can use expensive electro-optical crystal efficiently, the cost can be reduced.

  In addition, by forming a plurality of grooves and dividing them into units containing one groove, and dividing the electro-optic crystal similarly without cutting out, a large number of electro-optic elements are produced at one time. Can be mass-produced at low cost.

  Further, the step of providing the electro-optical crystal upper electrode 3 is a step of providing the electro-optical crystal upper electrode 3 by vapor deposition while rotating the electro-optical crystal 1 so that the stress can be made uniform, thereby causing warping and cracking. Can be prevented.

  In addition, according to another method of manufacturing an electro-optic element, the step of forming the groove 9 in the insulator 5, the step of coating the resist 6A on the bottom of the groove 9, and one end in the width direction of the bottom of the groove 9 A step of cutting off a part of the insulator 5 at the bottom position up to the end portion or the end portion, a step of forming the insulator upper electrode 7 on the surface (51) which was one inner wall surface of the groove 9, In this process, the upper insulator electrode 7 attached on the resist 6A at the bottom of the groove 9 is removed by removing the resist 6A, and the surface (51) which is one inner wall surface of the groove 9 is formed. In addition, the electro-optic crystal includes a step of sandwiching the electro-optic crystal 1 prepared in advance between the electrode 7 on the insulator and another electrode 31 prepared in advance. As the electro-optic crystal, the volume of the ridge portion in the conventional electro-optic element is about Only expensive, thus making expensive electro-optic crystals efficient Can be used, it is possible to reduce the cost.

  In addition, by forming a plurality of grooves and dividing them into units containing one groove, and dividing the electro-optic crystal similarly without cutting out, a large number of electro-optic elements are produced at one time. Can be mass-produced at low cost.

1 is a perspective view of an electro-optic element according to an embodiment of the present invention. It is a perspective view of the insulator used with an electro-optical element. It is a front view which shows the mode of the change of 1 part in a part of process of the process of an insulator. It is a front view which shows the mode of change of 1 part in the remaining processes of the process of an insulator. It is a perspective view which shows a mode when obtaining two or more insulators in the middle of processing by division. It is a perspective view which shows a mode when a several insulator is processed continuously. It is a front view which shows the mode of the change of one insulator processed and processed continuously. It is a perspective view of the insulator which finished processing. It is a perspective view which shows a mode that the electrode on an electro-optic crystal is formed in an electro-optic crystal. It is a perspective view which shows a mode that the electro-optic crystal component before a division | segmentation is divided | segmented. It is a perspective view which shows a mode that AR coating is given to an electro-optic crystal component. It is a perspective view of the electro-optic crystal component diced. It is a perspective view which shows a mode that an electro-optic crystal component is combined with an insulator. FIG. 10 is a perspective view of an electro-optical element according to a modification. FIG. 10 is a perspective view of an electro-optical element according to another modification. It is a schematic diagram which shows the usage example of an electro-optical element. It is a perspective view which shows the conventional electro-optical element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electro-optic crystal 1A ... Electro-optic crystal components 1a, 1b, 1c, 1d ... Electro-optic crystal surface 3, 30 ... Insulator 3, 3a ... Electro-optic crystal upper electrode 5 ... Insulator 6 ... Resist 6A ... Resist 7, 7a ... Electrode on insulator 9, 32 ... Groove 15 ... Conductive material 16 ... Adhesive 17, 18 ... Vapor deposition source 19 ... Electrolytic solution 20 ... Ridge 21 ... Laser light 22 ... Cleave bar 30 ... Insulator 30a, 30b, 31 ... Electrode 51 ... First surface (insulator surface) of insulator 5
52 ... 2nd surface (insulator surface) of the insulator 5
53. Third surface of insulator 5 (insulator surface)
54 ... 4th surface (insulator surface) of the insulator 5
DESCRIPTION OF SYMBOLS 91 ... 100 surface of electro-optic crystal 100 ... electro-optic element 110 ... electric field detection optical apparatus 121 ... laser diode 129 ... signal electrode 131 ... ground electrode 133 ... collimating lens 135 ... first wavelength plate 137 ... second wavelength plate 139 ... polarization Beam splitter 141a ... Condensing lens 143a ... Photodiode 531 ... Projection

Claims (6)

An electro-optic crystal;
An electrode on the electro-optic crystal formed on one surface of the front and back surfaces of the electro-optic crystal, or the one surface and the other surface;
An insulator having a first surface opposed to the other surface of the electro-optic crystal and a second surface opposed to one end surface of the electro-optic crystal at a corner of the insulator; ,
An electro-optic element comprising: an insulator upper electrode formed on the first surface. The one surface is included in a surface including a third surface adjacent to the second surface;
The electro-optic element according to claim 1, wherein an end surface facing the end surface is included in a plane including a fourth surface adjacent to the first surface. An on-insulator electrode formed on a third surface adjacent to the second surface;
The electro-optic element according to claim 1, further comprising: an electrically conductive material passed to the insulator upper electrode and the electro-optic crystal upper electrode. Forming a groove in the insulator;
Adding a resist to the bottom of the groove;
Separating a part of the insulator so as to leave one inner wall surface and the bottom of the groove;
Forming an electrode on insulator on a surface that was one inner wall surface of the groove;
Removing the on-insulator electrode attached on the resist in this step by removing the resist;
Forming an electrode on the electro-optic crystal on one surface of the front and back surfaces of the electro-optic crystal, or on the one surface and the other surface;
And a step of making the other surface of the electro-optic crystal face the other electrode on the insulator formed on the surface which was one inner wall surface of the groove. .   5. The method for manufacturing an electro-optic element according to claim 4, wherein the step of providing the electrode on the electro-optic crystal is a step of providing the electrode on the electro-optic crystal by vapor deposition while rotating the electro-optic crystal. Forming a groove in the insulator;
Adding a resist to the bottom of the groove;
Separating a part of the insulator at one end in the width direction of the bottom of the groove;
Forming an electrode on insulator on a surface that was one inner wall surface of the groove;
Removing the on-insulator electrode attached on the resist in this step by removing the resist;
And a step of sandwiching an electro-optic crystal prepared in advance between the upper electrode formed on the surface which was one inner wall surface of the groove and another electrode prepared in advance. Method.

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