JP2009043285A - Communication substrate mounting device for ic card processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card processor changeable easily to an IC card processor for a contact type IC card or a noncontact type IC card, and capable of mounting a different noncontact type IC card or a communication substrate of a different maker, and an IC card recovery device. <P>SOLUTION: This communication substrate mounting device 16 is provided with the first base 64, in the IC card processor with the communication substrate mounting device 16 communicable with the IC card arranged along a conveying route of the IC card; the first base 64 is arranged with a mounting device 11 of the communication substrate, and the mounting device can selectively mount the second base 66 having a contact type communication substrate 158 of the contact type IC card, or a communication substrate mounting part 119 of the noncontact type IC card. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a processing device for contact-type and non-contact-type IC cards.
  More specifically, the present invention relates to an IC card processing device that can be easily changed to a contact IC card processing device or a non-contact IC card processing device.
More specifically, the present invention relates to an IC card processing device provided with a card collection device.

An IC card processing device that reads / writes information from / to a non-contact type IC card normally communicates with the IC card via one antenna (see Patent Document 1).
A technique is also known in which a plurality of antennas are arranged and communication with an IC card is performed using an antenna at a position most suitable for communication. (See Patent Document 2).
These conventional technologies basically communicate with one type of IC card via one antenna.
JP2000-137772 JP-A-11-120304

There has been no IC card processing apparatus that can use either a contact type IC card or a non-contact type IC card.
There are roughly three types of non-contact type IC cards, and communication boards including antennas that communicate with these different cards have different shapes depending on manufacturers.
For this reason, when using different types of non-contact type IC cards, or using the same type of non-contact type IC card, but using a different manufacturer's communication board, replace it with a communication board mounted on a different communication board mounting device. It was necessary to carry out complicated replacement work.
Further, since the communication board mounting device is prepared for each different communication board, it is expensive.

The present invention has been made in view of these problems.
A first object of the present invention is to provide an IC card processing apparatus that can be easily used for either a contact type IC card or a non-contact type IC card.
The second object of the present invention is that it can be easily used for either a contact type IC card or a non-contact type IC card and can be easily changed, and a different non-contact type IC card or a communication board of a different manufacturer can be mounted. An IC card processing device is provided.
A third object of the present invention is to provide an IC card recovery device that can be easily changed to an IC card processing device for a contact type IC card or a non-contact type IC card.

The present invention relates to an IC card processing device in which a communication board mounting device with an IC card is arranged along the IC card conveyance path, wherein the communication board mounting device includes a first base, and the first base includes a communication board. An IC card processing device in which a second base having a contact type communication board of a contact IC card or a communication board mounting part of a non-contact type IC card can be selectively attached to the mounting device. It is.

In this configuration, the second base on which the contact type communication board of the contact IC card or the non-contact type IC card is attached can be selectively attached to the first base communication board mounting apparatus.
Accordingly, the contact type IC card or the non-contact type IC card can be easily installed by selectively mounting the contact type communication board of the contact type IC card or the second base on which the non-contact type IC card is mounted on the mounting device. It can be changed to a processing device.

In the present invention, the second base has a first communication board mounting part and a second communication board mounting part, and is arranged at different positions in a direction perpendicular to the transport path so as to be layered vertically. It is preferable that the processing apparatus.
In this configuration, the non-contact type IC card is transported along the transport path, and passes through the communication board mounting device on the way of transport.
  A first communication board mounting part and a second communication board mounting part are formed on a second base constituting the communication board mounting apparatus, and the first communication board or the second communication board is selectively attached.
  Therefore, the non-contact type IC card to be used or the communication board corresponding to the manufacturer of the communication board may be attached to the corresponding mounting portion of the communication board mounting apparatus including the first base and the second base.
  In other words, it is easy to mount the communication board because different types of communication boards may be attached to a common communication board mounting apparatus.
  Further, since the first base and the second base are common to a plurality of communication boards, they are inexpensive due to the mass production effect.

In the present invention, it is preferable that the second base is attached to the first base by a one-touch mounting device, and when the second base is attached, the upper surface thereof constitutes the transport path.
  In this configuration, the second base to which the first communication board or the second communication board is selectively attached is attached to the first base by the one-touch mounting device.
  Therefore, after the selected communication board is mounted on the second base removed from the first base, the second base can be mounted on the first base with one touch, so that the mounting work is easy.
  Also, since the surface of the second base constitutes the IC card transport path, the non-contact type IC card is supported by this and the position thereof is stabilized. Therefore, communication between the antenna of the communication board and the antenna of the IC card is possible. Is performed stably, and the read / write processing of the IC card is surely performed.

In the present invention, it is preferable that the first communication board mounting part is located farther from the upper surface than the second communication board mounting part, and the fixing means of the first communication board and the second communication board are the same. .
In this configuration, since the fixing means for the first communication board and the second communication board are common, the first communication board and the second communication board are fixed to the second guide by the same fixing means.
As a result, the fixing means is inexpensive.
For example, when the fixing means is constituted by screw holes and screws, the number of screw holes and screws is halved and the cost is correspondingly reduced as compared with the case where the screw holes and screws are individually constituted.

In the present invention, the first base is formed with a third communication board mounting portion of a third communication board, and when the second base is attached, the back surface of the second base is the third communication board. It is preferable to fix to the first base.
  In this configuration, the third communication board is sandwiched and attached to the first base and the second base.
  Therefore, a total of three types of non-contact type IC card communication boards can be mounted together with the two types of mounting portions.

In the present invention, it is preferable that when the guide plate is positioned on the back surface of the first base and the first base rotates, the guide plate intersects the obtuse angle with respect to the card transport path.
  With this configuration, the leading edge of the card conveyed by the conveying device is guided by the guide plate and forcedly deviated from the conveying path, so that the IC card that has become unnecessary can be collected and the space of the collecting unit can be reduced.
  In other words, the IC card processing device can be miniaturized.

In this invention, it is preferable to have a 2nd guide part with a larger crossing angle with respect to a conveyance path than a guide plate following a guide plate.
In this configuration, the IC card is guided by the guide plate and deflected from the conveyance path.
Subsequently, since the IC card is guided to the second guide portion having a large crossing angle with respect to the transport path, the IC card can be further forcibly displaced from the transport path.
Therefore, the distance required for moving the IC card from the transport path can be shortened, and as a result, the IC card processing apparatus is further miniaturized.

The present invention preferably includes a first transport device disposed between the card receiving device and the magnetic card processing device, and a second transport device disposed between the magnetic card processing device and the communication board mounting device. .
  In this configuration, since the magnetic card processing device is included, the magnetic card can be used, and the IC card transported by the second transport device is guided and collected by the guide plate, so that the device can be downsized, and Inexpensive.

FIG. 1 is a perspective view of an IC card processing apparatus according to an embodiment.
FIG. 2 is a perspective view of a main part of the IC card processing apparatus according to the embodiment.
FIG. 3 is an exploded perspective view of the contact-type communication board and the communication board mounting apparatus according to the embodiment.
FIG. 4 is a cross-sectional view of the IC card processing apparatus of the embodiment.
FIG. 5 is a sectional view for explaining the operation of the IC card processing apparatus of the embodiment.

In the present embodiment, the contact IC card and the non-contact IC card move horizontally, but the moving direction is not limited to horizontal.
The IC card processing device 10 includes a card receiving device 12, a magnetic card processing device 14, a communication board mounting device 16, and a card transport device 18.

The card processing apparatus 10 includes a frame 28 (see FIG. 4) in which side frames 20 and 22 arranged in parallel at a predetermined interval are connected by stays 24 and 26.
As shown in FIG. 4, a card receiving device 12, a magnetic card processing device 14, and a communication board mounting device 16 are arranged along a conveyance path 32 of a contact IC card (not shown) and a non-contact IC card 30. ing.
The card receiving device 12 has a horizontally long rectangular card receiving port 34.

The magnetic card processing device 14 includes a first magnetic head 36 for a JIS-1 type magnetic card and a second magnetic head 38 for a JIS-2 type magnetic card.
The first magnetic head 36 is a reading type, and has one end fixed to a bracket (not shown) and the other end fixed to the center of a leaf spring 40 slidably attached to the bracket.

The second magnetic head 38 is of a reading type, and is arranged at the center of the leaf spring 42 like the first magnetic head 36 and is arranged vertically symmetrically with respect to the first magnetic head 36.
The magnetic card processing device 14 may be provided with at least one of the first magnetic head 36 or the second magnetic head 38.

A first transport device 44 is disposed between the receiving device 12 and the first magnetic head 36 and the second magnetic head 38.
The first transport device 44 includes a first drive roller 46 disposed on the lower side of the transport path 32 and a first pressing roller 48 disposed on the upper side of the transport path 32.
The first drive roller 46 includes a first rotating shaft 50 that is rotatably supported by the side frames 20 and 22, and rollers 52 and 54 that are fixed to both ends of the first rotating shaft 50.

The rollers 52 and 54 are configured such that the main body is formed of resin or metal and a rubber ring is fitted on the peripheral surface of the main body.
The first pressing roller 48 is elastically supported so as to be separated from the first driving roller 46.
That is, the first pressing roller 48 includes a shaft 58 that is elastically supported by the support box 56 and rollers 60 and 62 that are rotatably supported at the ends of the shaft 58.

The reason why the elastic support structure of the first pressing roller 48 is adopted is that the magnetic card and the IC card have the same vertical and horizontal sizes, but the thickness varies depending on the manufacturer, etc. This is because the card is conveyed regardless of the thickness.
The structure of the rollers 60 and 62 is the same as that of the rollers 52 and 54.
The roller 60 is disposed above the roller 52 at an interval equal to or less than the thickness of the circumferential surface of the roller 52 and the thinnest card.

The roller 62 is disposed above the roller 54 at a distance equal to or smaller than the circumferential surface of the roller 54 and the thickness of the card.
The support box 56 is detachably attached between the side frames 20 and 22.
The second magnetic head 38 is attached to the support box 56.

Next, the communication board mounting device 16 will be described mainly with reference to FIG.
The communication board mounting device 16 includes a first base 64 and a second base 66.
One selected communication board is attached to the communication board mounting device 16.
That is, in the present embodiment, the first communication board 68 is an international standard type A (commonly known as Myfair) company X communication board, and the antenna and the communication circuit are mounted on the same rectangular board 70.

Two through holes 74 of fixing means 72 for fixing the second base 66 to the side edge of the substrate 70 are drilled.
The fixing means 72 is, for example, a screw or a one-touch fixed pin.
The second communication board 76 is a communication board for a so-called Felica (SONY) card, has a rectangular shape, and is equipped with an antenna.
The communication circuit (not shown) is attached to the frame 28.
The third communication board 78 is a communication board made by Company Y for Myfair Card, is T-shaped, and is equipped with only an antenna.
The communication circuit of the third communication board 78 is fixed to the frame 28.

The first base 64 includes a first substrate 80 that is normally positioned horizontally, and a left side plate 82 and a right side plate 84 that are vertically integrated on both sides thereof, thereby forming an upward groove 86.
The conveyance path 32 is located in the groove 86.
The ends of the left and right plates 82 and 84 on the opposite side to the magnetic card processing device 14 can pivot about the third rotation shaft 88.

The third rotating shaft 88 is rotatably attached to the side frames 20 and 22.
A third substrate mounting portion 90 of the third communication substrate 78 is formed on the upper surface of the first substrate 80.
The third communication board mounting portion 90 is a T-shaped groove for fitting the third communication board 78 and is formed by a rib 92 on the first board 80.
The plurality of protrusions 94 of the third board mounting portion 90 are for positioning the third communication board 78 and fit into the plurality of positioning holes 96 of the third communication board 78.

The first substrate 80 is usually disposed slightly below the transport path 32.
Notches 98 and 100 are formed above the first substrate 80 on the end surfaces of the left and right plates 82 and 84 on the card receiving device 12 side.
Further, an L-shaped mounting groove 106 is formed by a vertical groove 102 extending downward from an upper surface of the right side plate 84 on the third rotating shaft 88 side and a lateral groove 104 continuous therewith.
These notches 98 and 100 and the mounting groove 106 constitute a one-touch mounting part 110.

Next, the second base 66 will be described.
The second base 66 has a flat plate-like second substrate 112, a second left side plate 114 and a second right side plate 116 extending upward from both ends thereof.
A surface 118 which is the upper surface of the second substrate 112 is adjacent to the lower side of the transport path 32 and has a function of guiding and holding the IC card 30.
Support portions 120, 122, 124, and 126 projecting inward from the upper portions of the second left side plate 114 and the second right side plate 116 are formed.

The lower surfaces of the support portions 120, 122, 124 and 126 are formed in parallel with the surface 118 at a predetermined interval.
That is, the lower surfaces of the support portions 120, 122, 124, and 126 are positioned adjacent to the upper side of the transport path 32, the surface 118 is positioned on the lower side of the transport path 32, and the IC card 30 that moves along the transport path 32 To be guided by.

Next, the second communication board mounting part 119 will be described.
The support portions 120, 122, 124, and 126 have notches 128, 130, 132, and 134 so that the four corners of the second communication board 76 are fitted together.
The upper surface 136 of the second left side plate 114 is parallel to the surface 118, and screw holes 138 and 140 are formed on the sides of the support portions 120 and 122, respectively.
The upper surface 142 of the second right side plate 116 is parallel to the surface 118, and screw holes 144 and 146 are formed on the sides of the support portions 124 and 126.

The second communication board 76 has four corners fitted into the notches 128, 130, 132, and 134, and holding plates 150, 152 attached by the same screw 72 screwed into the screw holes 138, 140, 144, 146, respectively. By pressing the upper surface of the second base 66, the upper surface is pressed.
The pressing plates 150 and 152 are fixed to the upper surfaces 136 and 142 via spring washers 148.

Next, the first communication board mounting part 154 will be described.
The first communication board mounting part 154 has upper surfaces 136 and 142.
That is, the lower surfaces of the left and right end portions of the first communication board 68 are applied to the upper surfaces 136 and 142 and fixed to the second base 66 by the screws 72 that pass through the through holes 74.
Next, the one-touch mounting part 157 on the second base 66 side of the one-touch mounting part 110 will be described.
One protrusion 156 extending outward is fixed to the side surface of the second left side plate 114, and two protrusions 156 extending outward are fixed to the side surface of the second right side plate 116.

  When attaching the second base 66 to the first base 64, the protrusion 156 is lowered along the longitudinal groove 102 of the mounting portion 106 (at this time, the protrusion 156 on the magnetic card processing device 14 side is located on the side of the left and right side plates 114, 116). Next, the second base 66 is attached to the first base 64 by sliding it to the diamagnetic card processing device 14 side and fitting the projections 156 into the lateral grooves 104 and the notches 98 and 100, The second base 66 is fixed to the first base 64 by screwing a screw (not shown) into the second base 66 through the drilled through hole 155.

At this time, the first left side plate 114 and the second right side plate 116 are positioned inside the left side plate 82 and the right side plate 84.
Accordingly, the one-touch mounting device 159 is configured by the one-touch attachment portions 110 and 157.
The third communication board 78 is pressed against the first board 80 by the back surface of the second board 112 by being inserted into the third communication board mounting portion 90 and attaching the second base 66 to the first base 64 as described above. Fixed.

The first communication board mounting part 154, the second communication board mounting part 119, and the third communication board mounting part 90 are configured in layers with respect to the transport path 32.
In other words, the second communication board mounting portion 119 is disposed immediately above the transport path 32, the first communication board mounting section 154 is disposed immediately above the transport path 32, and the third communication board mounting section 90 is immediately on the transport path 32. It is arranged below.
Thus, by arranging a plurality of mounting portions in layers, each communication board is positioned at a substantially constant position in the transport path 32, so that there is an advantage that processing can be performed without changing the stop position of the IC card 30 or the transport process. is there.

When a contact type IC card is used, a contact type communication board 158 is attached to the first base 64 instead of the second base 66.
The contact-type communication board 158 can be attached to the first base 64 with the protrusions 160 protruding from the left and right side surfaces of the contact-type communication board 158 fitted into the one-touch attachment part 110 in the same manner as the protrusions 156.
The contact type communication board 158 has a contact point and a communication circuit for the contact type IC card.
Therefore, the contact IC card (not shown) inserted into the card receiving port 34 is processed after reaching the contact communication board 158 through the same path as the non-contact card 30.
When the card is returned to the card receiving port 34 and when it is recovered by the recovery device 161, the same processing as that of the contact card 30 is performed.

Next, the recovery device 161 for the contact IC card and the non-contact IC card 30 that are no longer necessary will be described.
The collection device 161 includes at least a moving device 162, a second transfer device 184, and a deflecting device 208.
First, the moving device 162 of the communication board mounting device 16 will be described.
A long hole 166 is formed obliquely with respect to the horizontal in a passive plate 164 extending downward from the right side plate 84.
A roller 172 attached to a lever 170 supported by a shaft 168 fixed to the side frame 20 so as to be pivotable is inserted into the elongated hole 166.

One end of a rod 176 is attached to a pin 174 fixed to the lower end of the lever 170 so as to be pivotable.
The other end of the rod 176 is pivotally attached to an armature 180 of a solenoid 178 by a pin 182.

The moving device 162 only needs to have a function of moving the communication substrate processing device 16 away from the transport path 32.
Therefore, the moving device 162 can employ an air cylinder, a linear motor, or the like.

A second transfer device 184 is disposed between the magnetic card processing device 14 and the communication board mounting device 16.
Similar to the first transport device 44, the second transport device 184 includes a second drive roller 186 disposed on the lower side of the transport path 32 and a second pressing roller 188 disposed on the upper side of the transport path 32.
In the second driving roller 186, rollers 192 and 194 having the same configuration as the rollers 52 and 54 are fixed to the second rotating shaft 190.

The second rotating shaft 190 is rotatably supported by the side frames 20 and 22.
The second pressing roller 188 includes rollers 200 and 202 that are rotatable on a shaft 198.
The rollers 200 and 202 have the same structure as the rollers 60 and 62.
The shaft 198 is elastically attached to the support box 56 like the first shaft 58.
As shown in FIG. 4, guide boards 204 and 206 are arranged above and below the transport path 32 between the card receiving device 12 and the second transport device 184 to guide the IC card 30.

Next, the deflecting device 208 for the IC card 30 will be described.
The deflecting device 208 has a function of sending the IC card 30 to the collecting unit 210 on the lower side of the communication board mounting device 16.
Specifically, the lower surface of the first substrate 80 of the first base 64 is the guide plate 212.
Following the guide plate 212, a second guide portion 214 having an obtuse angle with respect to the guide plate 212 is formed.
In other words, the second guide portion 214 protrudes in a triangular shape from the lower surface of the second substrate 80 downward.
The guide plate 212 can be formed in a rail shape by fixing a rod-like body extending along the transport path 32 to the back surface of the first substrate 80.

As shown in FIG. 5, the guide plate 212 is disposed so as to cross the conveyance path 32 when the communication board mounting device 16 pivots around the third rotation shaft 88.
That is, the guide plate 212 intersects the transport path 32 at an obtuse angle.
At this time, the extension line of the second guide portion 214 intersects the transport path 32 at a larger angle than the guide plate 212.
With this configuration, the length of the communication board mounting device 16 in the card transport direction is shortened.
A third transfer device 216 is arranged on the communication substrate mounting device 16 on the side of the diamagnetic card processing device 14.

The third transfer device 216 has the same structure as the first transfer device 44 and the second transfer device 184.
A third drive roller 218 disposed below the transport path 32 and a third pressing roller 220 disposed above the transport path 32 are included.
In the third driving roller 218, rollers 222 and 224 are fixed to the third rotating shaft 88.
The third rotating shaft 88 is rotatably supported by the side frames 20 and 22.
The third pressing roller 220 includes rollers 228 and 230 that are rotatable about the shaft 226.
The rollers 228 and 230 have the same structure as the rollers 52 and 54.
As shown in FIG. 1, the shaft 226 is fixed to a leaf spring 227 attached to the side frames 20 and 22.

The distance between the first transport device 44 and the second transport device 184 is set so that the IC card 30 is held by both transport devices.
The distance between the second transport device 184 and the third transport device 216 is such that the third drive roller 218 and the third press roller 220 immediately after the IC card 30 is held by the second drive roller 192 and the second press roller 200. It is set to get out of between.

The third transfer device 216 is necessary when an IC card delivery device is installed on the right side of the third delivery device 216 and a new IC card is sent to the card receiving device 12.
Therefore, when the new IC card is not sent out, it is not necessary to attach the third transport device 216.
In other words, the third rotating shaft 88 may be arranged in a fixed state or a rotatable state.
The transport device 18 includes at least a first transport device 44 and a second transport device 184.

When paying out a new IC card, the transport device 18 also includes a third transport device 216.
The transport device 18 may be of any type as long as it has a function of transporting the IC card 30 in a predetermined direction.

Next, the driving device 232 of the first transport device 44, the second transport device 184, and the third transport device 216 will be described with reference to FIG.
A timing pulley 238 is fixed to an output shaft 236 of a motor 234 with a speed reducer (see FIG. 4) disposed below the transport path 32 between the second transport device 184 and the communication board mounting device 16.

A timing belt 242 is wound between a timing pulley 240 and a timing pulley 238 fixed to the second rotating shaft 190.
A timing belt 246 is wound around a timing pulley 244 fixed to the first rotating shaft 50 and a timing pulley 242 fixed to the second rotating shaft 190.

A timing belt 250 is wound around a timing pulley 248 and a timing pulley 238 fixed to the third rotating shaft 88.
Since the timing pulleys 240, 244, and 248 have the same diameter, the first driving roller 46, the second driving roller 186, and the third driving roller 218 are synchronously rotated and the peripheral speed is the same.
The driving device 232 may be of any type as long as it has a function capable of driving the transport device 18 at the same speed.

Next, the shutter device 252 disposed between the card receiving device 12 and the first transport device 44 will be described.
The shutter device 252 includes a plate 254 and a solenoid (not shown) that moves the plate 254.
The plate 254 is located outside the transport path 32 when the card processing apparatus 10 is operating.
When the IC card 30 is inserted and the first sensor 256 disposed between the card receiving device 12 and the first transport device 44 does not detect the IC card 30, the plate 254 is protruded into the transport path 32.

When the second sensor 258 disposed between the first transport device 44 and the second transport device 184 no longer detects the IC card 30, the second transport device 184 is stopped.
Therefore, the IC card 30 stops with its rear end held by the second transport device 184, so that the antenna portion of the IC card 30 stops at a position facing the surface 118.
In addition, the plate 254 protrudes in the transport path 32 to prevent fraud such as the IC card 30 being pulled out.
When the IC card 30 is returned, when the second sensor 258 detects the IC card 30 again, the plate 254 is moved and exits the conveyance path 32.

Next, the operation of the embodiment will be described.
The IC card 30 inserted into the card receiving port 34 is sent to the right in FIG. 4 along the transport path 32 by the first transport device 44 and the second transport device 184.
When the rear end of the IC card 30 passes through the second sensor 258 and is no longer detected, the operation of the transport device 18 is stopped, so the IC card 30 stops while being held by the second transport device 184. .

Therefore, almost the first half of the IC card 30 is supported by the front surface 118 of the second substrate 112 and the back surfaces of the support portions 120, 122, 124, and 126 in the communication substrate mounting device 16.
This position is the read / write position of the IC card 30.

Communication is performed between the antenna of the communication board mounted on the first communication board 68, the second communication board 76, or the third communication board 78 and the antenna of the IC card 30, and a predetermined read / write process is performed. After that, a return signal is sent from the main device.
The motor 234 is reversed by the return signal, and the first drive roller 46, the second drive roller 192, and the third drive roller 218 are rotated counterclockwise in FIG.
As a result, the IC card 30 is returned to the card receiving port 34 by the second transport device 184 and the first transport device 44.

Next, a case where a contact IC card is used will be described.
  A contact type communication board 158 is attached to the first base 64 instead of the second base 66.
  More specifically, the protrusion 160 from which the contact-type communication substrate 158 protrudes on the left and right side faces the one-touch mounting portion 110 and is attached to the first base 64 in the same manner as the protrusion 156.
The contact IC card inserted into the card receiving port 34 is sent to the right in FIG. 4 along the transport path 32 by the first transport device 44 and the second transport device 184.
  When the contact IC card reaches a predetermined position, the operation of the transfer device 18 is stopped, and the contact IC card stops with its contact terminal in contact with the predetermined terminal of the contact communication board 158.
  This position is the read / write position of the contact IC card.

After communication is performed by the contact-type communication board 158 and a predetermined read / write process is performed, a return signal is sent from the main apparatus.
  The motor 234 is reversed by the return signal, and the first drive roller 46, the second drive roller 192, and the third drive roller 218 are rotated counterclockwise in FIG.
  As a result, the contact type IC card is returned to the card receiving port 34 by the second transport device 184 and the first transport device 44.

Next, the operation for collecting the IC card 30 that is no longer needed will be described.
This process is performed after the IC card 30 reaches the read / write position.
When a recovery signal is output from the main device, the motor 234 first reverses.
Thereby, the IC card 30 is transported to the card receiving port 34 side by the second transport device 184 and the first transport device 44.
When the first sensor 256 detects the IC card 30, the motor 234 is stopped.
At this time, the front end of the IC card 30 is located closer to the second transfer device 184 than the first substrate 80 of the first base 64.

Next, the solenoid 178 is excited and the armature 180 is moved inward (leftward in FIG. 2), so that the roller 172 is moved rightward via the pin 182, rod 176, pin 174, and lever 170.
As a result, the roller 172 pivots the first base 64 and thus the communication board mounting device 16 through the elongated hole 166 clockwise as shown in FIG.

As a result, the guide plate 212 obliquely crosses the transport path 32 as shown in FIG.
Specifically, the guide plate 212 intersects the transport path 32 at an obtuse angle.
Thereafter, the motor 234 is rotated forward, and the IC card 30 is sent rightward in FIG. 5 by the first transport device 44 and the second transport device 184.
As a result, the IC card 30 is guided by the guide plate 212 and tilts downward to the right, and when the IC card 30 deviates from the conveyance path 32, it is naturally dropped into the collection unit 210 and collected.

At this time, since the crossing angle of the second guide portion 214 with the transport path 32 is large, the IC card 30 is forcibly greatly deflected downward.
By this forced deflection, even if the path length of the recovery unit 210 is short, it can be surely dropped naturally.

After a sufficient time has elapsed for the IC card 30 to drop, the motor 234 is stopped.
Next, the solenoid 178 is demagnetized, and the armature 180 is protruded by the built-in spring, so that the lever 170 is pivoted counterclockwise.
Along with this, the communication board mounting device 16 is rotated counterclockwise to be in the horizontal state shown in FIG.
Contact IC cards are also collected.

Next, a case where the new IC card 30 is paid out will be described.
The new IC card 30 is transported along the transport path 32 toward the card receiving port 34 by the third transport device 216, the second transport device 184, and the first transport device 44.
The new IC card 30 is detected by a sensor (not shown) at the read / write position, and its conveyance is stopped.
Next, after performing predetermined communication with the IC card 30 via the communication board, the transfer device 18 is operated again and sent out to the card receiving port 34.

FIG. 1 is a perspective view of the card processing apparatus according to the embodiment. FIG. 2 is a perspective view of a main part of the card processing apparatus according to the embodiment. FIG. 3 is an exploded perspective view of the contact-type communication board and the communication board mounting apparatus according to the embodiment. FIG. 4 is a cross-sectional view of the card processing apparatus according to the embodiment. FIG. 5 is a sectional view for explaining the operation of the card processing apparatus according to the embodiment.

Explanation of symbols

12 Card receiving device
14 Magnetic card processor
16 Communication board mounting device
30 Non-contact IC card
32 Transport route
44 First transfer device
64 1st base
66 2nd base
68 First communication board
72 Fixing means (screw)
76 Second communication board
78 Third communication board
90 Mounting part
159 One-touch device
118 Surface
119 Second communication board mounting part
154 First communication board mounting part
158 Contact IC card read / write device
184 Second transfer device
212 Guide plate
214 Second Guide Part

Claims (8)

In the IC card processing device in which the communication board mounting device (16) with the IC card (30) is arranged along the conveyance path (32) of the IC card (30),
The communication board mounting device (16) includes a first base (64),
A communication board mounting device (110) is disposed on the first base (64),
A contact type communication board (158) of a contact type IC card or a second base (66) having a communication board mounting part (119, 154) of a non-contact type IC card can be selectively mounted on the mounting device. IC card processing device.   The second base has a first communication board mounting part (154) and a second communication board mounting part (119), and is arranged at different positions in a direction perpendicular to the transfer path (32) and forms layers vertically. 2. The IC card processing device according to claim 1, which is arranged as described above.   3. The IC card processing device according to claim 2, wherein the second base is attached to the first base by a one-touch mounting device (159), and the upper surface (118) of the second base constitutes the transport path (32).   The first communication board mounting part is located farther from the upper surface than the second communication board mounting part, and a fixing means (72) for the first communication board (68) and the second communication board (76) is provided. The IC card processing device according to claim 2, which is the same.   The first base is formed with a third communication board mounting portion (90) of a third communication board (78), and when the second base is attached, the back surface of the second base is the third communication board. Is fixed to the first base.   The IC card processing apparatus according to claim 1, wherein a guide plate (212) is positioned on the back surface of the first base, and the guide plate intersects the transport path at an obtuse angle when the first base rotates.   The IC card processing device according to claim 6, further comprising a second guide portion (214) having a larger crossing angle with respect to the transport path than the guide plate following the guide plate. The first transfer device (44) disposed between the card receiving device (12) and the magnetic card processing device (14), and disposed between the magnetic card processing device (14) and the communication board mounting device (16). The IC card processing device according to claim 7, further comprising a second transfer device (184).

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