JP2009042028A - Socket for testing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein in a low temperature test of a semiconductor device performed while being exposed to the atmosphere, dew formation on the periphery of a DUT has adverse effects on the precision of the test by decreasing electrical insulation between terminals, and causes a corrosion of a measuring instrument. <P>SOLUTION: In order to solve the problem incident to the dew formation under the low temperature, it is effective to employ a socket having a hermetically-sealed structure and to bring about such a situation as the spatial capacity is as small as possible in accordance with the package of the DUT. Since the dew formation takes place when moisture contained in the atmosphere condenses by being brought into contact with a material at the low temperature, condensation takes place continuously under the situation of being exposed to the atmosphere, and the dew is formed. When an elastic film is arranged above the DUT secured in the socket for test, and the atmosphere in the internal space of the socket for test is discharged forcibly, and the DUT is held airtightly by tightly attaching the elastic film to the surface of the DUT, the moisture only in that space is condensed and the dew formation extremely small in quantity within a range having no impact to the test. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a test socket used in a semiconductor device inspection process.

The constant temperature test of semiconductor devices is done by DUT (Device
A test socket equipped with an Under Test (device under test) is placed in a thermostatic chamber and given a specific environmental and electrical condition. This test is performed for the purpose of screening initial defects of the DUT.

  Particularly in the low temperature test, it is necessary to cool the DUT to minus 40 ° C, so if it is cooled in the atmosphere, a large amount of dew condensation occurs in the low temperature part, causing an electrical short-circuit condition and affecting the electrical characteristics test. The problem of giving and the problem that condensation will condense and it becomes difficult to attach and detach the DUT with freezing.

  Therefore, in the past, large-scale equipment and devices have been required to prevent condensation from forming around the DUT, such as placing the DUT in a thermostat or performing a test while blowing dry air to the DUT with a thermostreamer. It was. For example, Patent Document 1 discloses providing a dehumidifier that dehumidifies the circulating gas in order to prevent condensation and frost formation on a DUT or IC socket.

  Patent Document 2 describes an IC socket that can be easily attached to and detached from a substrate. Patent Document 3 discloses a burn-in test treatment in which a space in which a semiconductor bare chip is placed is compressed by compressing an O-ring and a plate-shaped packing. Patent Document 4 describes a socket for a Bayer chip IC provided with means for pressing the printed circuit board, the conductive rubber connector, and the Bayer chip IC against each other.

On the other hand, various methods for generating low temperatures have been devised, and downsizing is possible until it can be mounted on a semiconductor test socket, and many low temperature test methods and test sockets using these have been devised.
Japanese Patent Laid-Open No. 10-90348 International Publication No. 00-04610 JP-A-6-130122 Japanese Unexamined Patent Publication No. 7-326692

  However, even though the conventional technology can reduce the temperature of the semiconductor device, it does not give sufficient consideration to the occurrence of condensation due to cooling, and it is assumed that it will be used in a constant temperature bath or dry air as before. It has become.

  An object of the present invention is to prevent the dew condensation that occurs when the DUT is cooled in the atmosphere by improving the airtight mechanism and the heat insulation structure of the DUT socket.

  In the semiconductor device test socket of the present invention, a stretchable film is disposed on an upper portion of the DUT fixed inside the test socket, and the atmosphere in the internal space of the test socket is forcibly discharged. The DUT is kept airtight by closely contacting the surface of the DUT.

  According to the present invention, a low-temperature test of a semiconductor device can be performed in the air exposure without using a large-scale facility such as a thermostatic bath. If low-temperature testing is possible without using large-scale equipment, the overall cost of semiconductor testing can be reduced. In addition, the physical distance between the DUT and the test apparatus can be shortened, and the test quality can be significantly improved.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 is an exploded perspective view of a semiconductor device test socket according to a first embodiment of the present invention.

  In FIG. 1, 1 is a test socket, 2 is a DUT (semiconductor device), 3 is a substrate, 4 is a socket body, 5 is a socket lid, 6 is an anisotropic conductive sheet, 7 is an O-ring (packing), 8 is O-ring (packing), 9 is a socket fixing screw, 10 is a spring washer, 11 is a socket fixing nut, 12 is a socket lid fixing screw, and 13 is a device holding screw.

  As a method for solving the problem of dew condensation at low temperatures, it is effective to make the test socket 1 have a hermetically sealed structure and create a situation with as little space capacity as possible in accordance with the package size. Condensation causes moisture contained in the atmosphere to condense in contact with the low temperature. Therefore, condensation occurs continuously under the exposure to the atmosphere. If the package is enclosed in a sealed space, only the moisture in the space condenses, so that the generated condensation is very small and can be kept within a range that does not affect the test. Condensation that occurs on the outer periphery of the socket in a low temperature state can be avoided by surrounding the outer periphery of the socket with a heat insulating material.

  In the test socket 1 of FIG. 1, a DUT (semiconductor device) 2 is placed inside a socket body 4 disposed on a substrate 3, and in a sealed structure formed by the socket body 4 and a socket lid 5. Stored.

  An anisotropic conductive sheet 6 and an O-ring (packing) 7 are disposed on the substrate 3, and a socket fixing screw 9 is coupled to a socket fixing nut 11 via a spring washer 10, so that the socket body 4 and the substrate 3 are connected. Is fixed in an airtight state.

  An O-ring (packing) 8 is disposed on the upper surface of the socket body 4, and the socket lid 5 and the socket body 4 are fixed in an airtight state by a socket lid fixing screw.

  The socket lid 5 is provided with a device holding screw 13. When the device holding screw 13 holds the DUT (semiconductor device) 2 placed inside the socket body 4, the DUT (semiconductor device) 2 The tip of the terminal pin disposed on the lower surface presses the anisotropic conductive sheet 6.

  The pressed portion of the anisotropic conductive sheet 6 conducts in the vertical direction, and electrically connects the terminal pins of the DUT (semiconductor device) 2 and the terminals of the printed wiring arranged under the anisotropic conductive sheet 6. Thus, an electrical test of the DUT (semiconductor device) 2 can be performed.

  In the test socket having the airtight mechanism of the first embodiment, the airtight state is secured by using the O-ring packings 7 and 8.

  FIG. 2 is an exploded perspective view of the semiconductor device test socket according to the second embodiment of the present invention.

  In FIG. 2, 1 is a test socket, 2 is a DUT (semiconductor device), 3 is a substrate, 4 is a socket body, 5 is a socket lid, 6 is an anisotropic conductive sheet, 7 is an O-ring (packing), 9 is Socket fixing screws, 10 is a spring washer, 11 is a socket fixing nut, 12 is a socket lid fixing screw, and 13 is a device holding screw.

  In Example 2 of FIG. 2, a stretchable membrane 14 and a rubber coat 16 are used as the test socket 1 having an airtight mechanism instead of the socket lid 5 and the O-ring packing 8.

  By exhausting the gas in the socket body 4 from the exhaust hole 15 communicating with the space in the socket body 4, the DUT 2 and the socket lid are used using the pressure difference between the space in the socket body 4 to which the DUT 2 is mounted and the socket body 4. 5 can be securely fixed.

  In addition, the elastic membrane 14 adheres to the surface of the DUT 2 by exhausting the gas in the socket body 4 from the exhaust hole 15 communicating with the space in the socket body 4 to depressurize the space in which the DUT 2 is placed. However, it can create a situation with as little space as possible.

  Further, the rubber coating 16 is applied to the portion in contact with the DUT 2, and the rubber coating 16 is brought into close contact with the DUT 2 by reducing the pressure in the space where the DUT 2 is placed, so that the DUT 2 can be securely fixed in the socket body 4. .

  FIG. 3 is a cross-sectional view illustrating the procedure for assembling the test socket for the semiconductor device according to the third embodiment of the present invention.

  In FIG. 3, 21 is a test socket, 22 is a DUT (BGA: Ball Grid Array) package, 23 is a substrate, 24 is a frame with a stretchable film, 25 is a stretchable film, and 26 penetrates the substrate 23. A plurality of discharge holes are shown.

  In Example 3 of FIG. 3, as a test socket 1 having an airtight mechanism, a stretchable film 25 and a discharge hole 26 are used instead of the socket lid 5 and the O-ring packing 8.

  3A, a DUT (BGA) package 22 is placed on a substrate 23, and a frame 24 with a stretchable film is placed thereon. The DUT (BGA) package 22 has connection terminals (BGA terminals) disposed on the lower surface thereof, and is connected to corresponding terminals on the substrate 23.

  In FIG. 3B, the DUT (BGA) package placed on the substrate 23 is covered with a stretchable film 25.

  In FIG. 3C, air is discharged from the discharge hole 26 penetrating the substrate 23 to reduce the pressure in the space where the DUT (BGA) package 22 is placed, and a stretchable film is formed on the surface of the DUT 22. The situation where the space capacity is as small as possible can be created.

  In the embodiment of FIG. 3, a plurality of DUTs 22 can be placed on the substrate, and the whole can be fixed and airtight.

1 is an exploded perspective view of a semiconductor device test socket according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the semiconductor device test socket according to the second embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating the procedure for assembling the test socket for the semiconductor device according to the third embodiment of the present invention.

Explanation of symbols

1 Test socket 2 DUT (semiconductor device)
3 Substrate 4 Socket body 5 Socket lid 6 Anisotropic conductive sheet 7 O-ring (packing)
8 O-ring (packing)
9 Socket fixing screw 10 Spring washer 11 Socket fixing nut 12 Socket lid fixing screw 13 Device holding screw 14 Elastic film 15 Exhaust hole 16 Rubber coating 21 Test socket 22 DUT (BGA) package 23 Substrate 24 Stretched film Frame 25 Stretchable membrane 26 Drain hole

Claims (8)

In the test socket for semiconductor devices,
An elastic membrane is disposed on the top of the DUT fixed inside the test socket, the air in the internal space of the test socket is forcibly discharged, and the elastic membrane is brought into close contact with the surface of the DUT. The test socket is characterized in that the DUT is kept airtight. In the test socket for semiconductor devices,
A rubber coat is installed on a portion of the test socket that is in contact with the DUT, the air in the internal space of the test socket is forcibly discharged, and the rubber coat is brought into close contact with the DUT to keep the DUT airtight. Socket for testing. In the test socket according to claim 1 or 2,
A test socket having a discharge hole for forcibly discharging the air in the internal space of the test socket to the outside of the socket on a side wall of a socket body to which the DUT is mounted. The test socket according to claim 3,
A test socket comprising a packing for airtightness between the socket body and a substrate on which the test socket is mounted. The test socket according to claim 4,
A test socket comprising a heat insulation mechanism on an outer periphery of the socket body and a socket lid that covers the socket body. In the test socket for semiconductor devices,
A stretchable film covering the DUT is disposed on the DUT placed on the substrate of the test socket, the atmosphere in the internal space of the test socket is forcibly discharged, and the stretchable film is A test socket characterized in that the DUT is kept airtight by being in close contact with the surface of the DUT. The test socket according to claim 6,
A test socket having a plurality of through holes for forcibly discharging the air in the internal space of the test socket to the outside of the socket on the substrate of the test socket. The test socket according to claim 7,
A plurality of DUTs are disposed on the substrate of the test socket, a stretchable film covering the plurality of DUTs is disposed on top of the plurality of DUTs, and the air in the internal space of the test socket is forcibly discharged. A test socket, wherein the stretchable film is adhered to the surfaces of the plurality of DUTs.

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