JP2009041790A - Reduced-pressure drying device - Google Patents

Reduced-pressure drying device Download PDF

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JP2009041790A
JP2009041790A JP2007204356A JP2007204356A JP2009041790A JP 2009041790 A JP2009041790 A JP 2009041790A JP 2007204356 A JP2007204356 A JP 2007204356A JP 2007204356 A JP2007204356 A JP 2007204356A JP 2009041790 A JP2009041790 A JP 2009041790A
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substrate
chamber lid
drying apparatus
rib
reduced
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JP5192747B2 (en
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Daisuke Okuda
大輔 奥田
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP2007204356A priority Critical patent/JP5192747B2/en
Priority to TW097126230A priority patent/TWI397663B/en
Priority to KR20080072193A priority patent/KR101478527B1/en
Priority to CN2008101461387A priority patent/CN101363681B/en
Publication of JP2009041790A publication Critical patent/JP2009041790A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reduced-pressure drying device capable of suppressing production of defective substrates by suppressing separation and the like of a welded part of a chamber cover portion. <P>SOLUTION: In this reduced-pressure drying device comprising the chamber cover portion relatively separatable to a substrate loading portion, and drying coating liquid by reducing a pressure in a substrate receiving portion in a state that the substrate coated with the coating liquid is received in the substrate receiving portion formed by the substrate loading portion and the chamber cover portion, the chamber cover portion is opposed to the substrate loading portion and has the square shape having four edge portions, and reinforcement ribs extending in the direction intersecting the edge portions adjacent thereto, are welded to an outer surface at a side opposite to the substrate loading portion side. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、基板に塗布された塗布液を減圧乾燥させることにより、基板上に塗布膜を形成する減圧乾燥装置に関するものである。   The present invention relates to a reduced pressure drying apparatus that forms a coating film on a substrate by drying the coating solution applied to the substrate under reduced pressure.

液晶ディスプレイやプラズマディスプレイ等のフラットパネルディスプレイには、ガラス基板上にレジスト液が塗布されたもの（塗布基板と称す）が使用されている。この塗布基板は、塗布装置により基板上に均一にレジスト液が塗布された後、減圧乾燥装置により塗布液を乾燥させることにより生産される。   A flat panel display such as a liquid crystal display or a plasma display uses a glass substrate coated with a resist solution (referred to as a coated substrate). The coated substrate is produced by uniformly applying a resist solution on the substrate by a coating device and then drying the coating solution by a reduced pressure drying device.

この減圧乾燥装置は、例えば、下記特許文献１に示されるように、昇降動作可能なチャンバ蓋と基板を載置する下部プレートとによって形成される処理室（チャンバ）を有しており、チャンバ蓋が下降した状態では、処理室が密閉状態を維持できるようになっている。そして、下部プレートには、処理室内の空気を排気するための排気口と処理室内にＮ２等のガスを供給するためのガス供給口とが形成されている。これにより、処理室内に塗布基板を載置した状態で排気口から処理室内の空気を排気することにより処理室内を減圧（低圧化）させて塗布液を乾燥させるとともに、乾燥が終了すれば処理室内にＮ２ガスを供給することにより減圧状態を解除できるようになっている。   This vacuum drying apparatus has, for example, a processing chamber (chamber) formed by a chamber lid capable of moving up and down and a lower plate on which a substrate is placed, as shown in Patent Document 1 below. In a state in which the process chamber is lowered, the process chamber can be maintained in a sealed state. The lower plate is formed with an exhaust port for exhausting air in the processing chamber and a gas supply port for supplying a gas such as N 2 into the processing chamber. As a result, air in the processing chamber is exhausted from the exhaust port while the coating substrate is placed in the processing chamber, thereby reducing the pressure in the processing chamber (lowering the pressure) and drying the coating solution. The reduced pressure state can be canceled by supplying N 2 gas to the gas tank.

特開平１０−７６２１１号公報JP-A-10-76211

ここで、図５は従来のチャンバ蓋を示すものである。この図５に示すように、チャンバ蓋９０には、補強リブ９１が溶接により取り付けられている。すなわち、塗布基板を減圧乾燥させるために処理室を減圧すると、チャンバ蓋９０は大気圧で押圧され処理室側に僅かに変形することにより、処理室内の気流が影響を受ける。この僅かな気流の乱れが発生すると、塗布膜に筋状の模様が形成されるなど、塗布液を一様に乾燥させることが困難になる。そのため、補強リブ９１を設けることにより、チャンバ蓋９０の剛性を高めて不良基板の発生を抑えている。   Here, FIG. 5 shows a conventional chamber lid. As shown in FIG. 5, a reinforcing rib 91 is attached to the chamber lid 90 by welding. That is, when the processing chamber is depressurized in order to dry the coated substrate under reduced pressure, the chamber lid 90 is pressed at atmospheric pressure and slightly deformed toward the processing chamber, so that the airflow in the processing chamber is affected. When this slight air flow turbulence occurs, it becomes difficult to uniformly dry the coating liquid, for example, a streak pattern is formed on the coating film. Therefore, by providing the reinforcing rib 91, the rigidity of the chamber lid 90 is increased and the occurrence of defective substrates is suppressed.

しかし、従来のチャンバ蓋９０の補強リブ９１では、その溶接部分が剥離することにより、補強リブ９１が本来の機能を発揮することができないおそれがあるという問題がある。すなわち、チャンバ蓋９０が大気圧により押圧されると、その中央部分の撓み変形量が端部に比べて大きくなるにもかかわらず、従来のチャンバ蓋９０では、溶接強度が比較的弱い補強リブ９１同士が交差する部分（リブ交差部９２）がチャンバ蓋９０の中央部分に集中的に形成されているため、そのリブ交差部９２における溶接部分に割れ等が発生し剥離する可能性が高い。   However, in the reinforcing rib 91 of the conventional chamber lid 90, there is a problem that the reinforcing rib 91 may not be able to perform its original function due to peeling of the welded portion. That is, when the chamber lid 90 is pressed by the atmospheric pressure, the reinforcing rib 91 having a relatively weak welding strength is used in the conventional chamber lid 90, although the amount of bending deformation at the center portion is larger than that at the end portion. Since the intersecting portions (rib intersecting portions 92) are formed intensively in the central portion of the chamber lid 90, there is a high possibility that the welded portions at the rib intersecting portions 92 are cracked and peeled off.

本発明は、上記問題点に鑑みてなされたものであり、チャンバ蓋部における溶接部分の剥離等の発生を抑制することにより不良基板が生産されるのを抑えることのできる減圧乾燥装置を提供することを目的としている。   The present invention has been made in view of the above problems, and provides a reduced pressure drying apparatus capable of suppressing the production of defective substrates by suppressing the occurrence of peeling of the welded portion in the chamber lid. The purpose is that.

上記課題を解決するために本発明の減圧乾燥装置は、基板を載置する基板載置部と、この基板載置部に対して相対的に接離可能なチャンバ蓋部とを備え、この基板載置部とチャンバ蓋部とによって形成される基板収容部内に、塗布液が塗布された基板を収容した状態で前記基板収容部内を減圧させることにより前記塗布液を乾燥させる減圧乾燥装置において、前記チャンバ蓋部は、前記基板載置部と対面するとともに４つの縁辺部を有する四辺形状を有しており、基板載置部側と反対側の外表面には、隣り合う縁辺部と交差する方向に延びる補強リブが接合されていることを特徴としている。   In order to solve the above problems, a reduced-pressure drying apparatus according to the present invention includes a substrate placement portion for placing a substrate, and a chamber lid portion that can be moved toward and away from the substrate placement portion. In the reduced-pressure drying apparatus that dries the coating liquid by reducing the pressure in the substrate housing part in a state where the substrate coated with the coating liquid is housed in the substrate housing part formed by the mounting part and the chamber lid part, The chamber lid portion has a quadrilateral shape that faces the substrate placement portion and has four edge portions, and the outer surface opposite to the substrate placement portion side has a direction intersecting with an adjacent edge portion. It is characterized in that reinforcing ribs extending in the direction are joined.

上記減圧乾燥装置によれば、チャンバ蓋部の中央部分を避けた状態で補強リブを設けることができる。すなわち、補強リブがチャンバ蓋部の隣り合う縁辺部と交差する方向に延びる状態で配置されるため、補強リブがチャンバ蓋部の中心に設けられることはなく、その結果、リブ交差部をチャンバ蓋部の中央部分から離れた位置に形成することができる。したがって、従来のように、補強リブがチャンバ蓋部の互いに向かい合う縁辺部に延びる方向（チャンバ蓋部の縁辺部に沿う方向）に配置される場合に比べて、リブ交差部の溶接部分が剥離するのを抑制することができる。   According to the reduced pressure drying apparatus, the reinforcing rib can be provided in a state where the central portion of the chamber lid portion is avoided. That is, the reinforcing rib is arranged in a state extending in the direction intersecting with the adjacent edge portion of the chamber lid portion, so that the reinforcing rib is not provided at the center of the chamber lid portion. It can form in the position away from the center part of the part. Therefore, compared to the conventional case where the reinforcing ribs are arranged in the direction extending along the opposite edge portions of the chamber lid portion (the direction along the edge portion of the chamber lid portion), the welded portion at the rib intersection portion is peeled off. Can be suppressed.

また、前記補強リブは、前記チャンバ蓋部の中心と、隣り合う縁辺部同士が交差する角部との中点を通るように設けられている構成が好ましい。   The reinforcing rib is preferably provided so as to pass through the midpoint between the center of the chamber lid portion and the corner portion where adjacent edge portions intersect.

この構成によれば、少ない補強リブでチャンバ蓋部全体をバランスよく補強することができる。   According to this configuration, the entire chamber lid can be reinforced with a small number of reinforcing ribs in a balanced manner.

また、前記補強リブが一方向に延びる形状を有しており、これらの補強リブが前記チャンバ蓋部の外表面に四辺形を形成するように配置され、前記補強リブ同士が交差するリブ交差部が前記縁辺部に形成されている構成とすることもできる。   Further, the reinforcing ribs have a shape extending in one direction, the reinforcing ribs are arranged so as to form a quadrilateral on the outer surface of the chamber lid portion, and the rib intersecting portion where the reinforcing ribs intersect with each other It can also be set as the structure currently formed in the said edge part.

この構成によれば、比較的溶接強度の弱いリブ交差部を撓み変形の小さい縁辺部に設けられているため、リブ交差部が剥離する問題を抑制することができる。また、リブ交差部の数が多くなると、チャンバ蓋の製作時における洗浄作業等が複雑になることによりチャンバ蓋部全体のコストがかかるという問題があるが、この構成によれば、リブ交差部の数を減らすことができるため、安価なチャンバ蓋部とすることができる。   According to this structure, since the rib intersection part with comparatively weak welding strength is provided in the edge part with a small bending deformation, the problem which a rib intersection part peels can be suppressed. In addition, if the number of rib intersections increases, there is a problem that the cost of the entire chamber lid increases due to the complexity of cleaning operations at the time of manufacturing the chamber lid. Since the number can be reduced, an inexpensive chamber lid can be obtained.

また、前記チャンバ蓋部は、載置された基板とほぼ平行であって基板載置部側表面が平坦に形成される平板部と平板部の端部において基板載置部側に突出する収容壁部とを有しており、前記リブ交差部は、この収容壁部に対応する平板部の外表面に形成されている構成とすることもできる。   Further, the chamber lid portion is substantially parallel to the placed substrate and the substrate placing portion side surface is formed flat, and an accommodation wall protruding toward the substrate placing portion side at the end of the flat plate portion The rib crossing portion may be formed on the outer surface of the flat plate portion corresponding to the housing wall portion.

この構成によれば、平板部の肉厚部は撓み変形の影響を受けにくいため、この肉厚部に対応する部分にリブ交差部を設けることにより、リブ交差部の溶接部分が剥離するのを抑制することができる。   According to this configuration, since the thick part of the flat plate part is not easily affected by the bending deformation, by providing the rib crossing part in the part corresponding to this thick part, the welded part of the rib crossing part is peeled off. Can be suppressed.

本発明の減圧乾燥装置によれば、溶接部分の剥離等の発生を抑制して不良基板が生産されるのを抑えることができる。   According to the vacuum drying apparatus of the present invention, it is possible to suppress the generation of a defective substrate by suppressing the occurrence of peeling of the welded portion.

本発明に係る実施の形態を図面を用いて説明する。   Embodiments according to the present invention will be described with reference to the drawings.

図１〜４は、本発明の一実施形態における減圧乾燥装置を概略的に示す図であり、図１は、減圧乾燥装置のチャンバ蓋部１０が開いた状態を示す図であり、図２は、チャンバ蓋部１０が閉まった状態を示す図であり、図３は、チャンバ蓋部１０の上面図、図４は、チャンバ蓋部１０の縁端付近を拡大した図である。   1 to 4 are diagrams schematically illustrating a vacuum drying apparatus according to an embodiment of the present invention, FIG. 1 is a diagram illustrating a state in which a chamber lid 10 of the vacuum drying apparatus is opened, and FIG. FIG. 3 is a diagram showing a state in which the chamber lid 10 is closed, FIG. 3 is a top view of the chamber lid 10, and FIG. 4 is an enlarged view of the vicinity of the edge of the chamber lid 10.

図１〜図４に示すように、減圧乾燥装置は、基板１上に形成されたレジスト液などの塗布膜を乾燥させるものであり、基板載置部２０とチャンバ蓋部１０とを備えている。   As shown in FIGS. 1 to 4, the reduced-pressure drying apparatus dries a coating film such as a resist solution formed on the substrate 1, and includes a substrate platform 20 and a chamber lid 10. .

なお、以下の説明では、図１における紙面上側を減圧乾燥装置の上方、図１における紙面下側を減圧乾燥装置の下方として説明を進めることとする。   In the following description, the upper side of the paper in FIG. 1 will be described above the vacuum drying apparatus, and the lower side of the paper in FIG. 1 will be described below the vacuum drying apparatus.

基板載置部２０は、基板１を載置するものであり、塗布装置等によりレジスト液が塗布された基板１を載置する載置プレート２１を有している。そして、この基板載置部２０の載置プレート２１と後述するチャンバ蓋部１０とによって、図２に示すように、基板１を収容する基板収容部３０が形成されるようになっている。   The substrate mounting unit 20 is for mounting the substrate 1 and has a mounting plate 21 for mounting the substrate 1 on which a resist solution is applied by a coating apparatus or the like. A substrate accommodating portion 30 for accommodating the substrate 1 is formed by the placing plate 21 of the substrate placing portion 20 and the chamber lid portion 10 described later, as shown in FIG.

基板載置部２０には、基板１を昇降動作させる基板昇降機構が設けられている。すなわち、基板載置部２０の載置プレート２１には、基板１を載置する領域に複数のピン孔２２が形成されており、このピン孔２２にはＺ軸方向に昇降動作可能なリフトピン４０が埋設されている。そして、このリフトピン４０には駆動装置４１が接続されており、この駆動装置４１を駆動させることによりリフトピン４０が載置プレート２１表面から所定高さ位置（上昇位置）まで突出するようになっている。これにより、基板１を載置プレート２１に載置する際には、リフトピン４０を上昇位置まで上昇させた状態で、供給された基板１をリフトピン４０の先端部分で保持し、その状態からリフトピン４０を下降させることにより載置プレート２１に基板１を載置できるようになっている。そして、載置プレート２１には静電気を発生させる基板保持手段（不図示）が設けられており、この基板保持手段により載置された基板が載置プレート２１上に保持されるようになっている。   The substrate platform 20 is provided with a substrate lifting mechanism that moves the substrate 1 up and down. That is, a plurality of pin holes 22 are formed in a region where the substrate 1 is placed on the placement plate 21 of the substrate placement unit 20, and lift pins 40 that can be moved up and down in the Z-axis direction. Is buried. A driving device 41 is connected to the lift pin 40. By driving the driving device 41, the lift pin 40 protrudes from the surface of the mounting plate 21 to a predetermined height position (upward position). . As a result, when the substrate 1 is placed on the placement plate 21, the supplied substrate 1 is held at the tip of the lift pin 40 with the lift pin 40 raised to the raised position, and the lift pin 40 is lifted from this state. Is lowered so that the substrate 1 can be placed on the placement plate 21. The mounting plate 21 is provided with substrate holding means (not shown) that generates static electricity, and the substrate placed by the substrate holding means is held on the mounting plate 21. .

また、載置プレート２１には、その表面に開口する複数の排気口２３とガス供給口２４とが形成されている。この排気口２３は、基板収容部３０内の空気を排気することにより、基板収容部３０内を大気圧よりも小さい圧力に減圧するためのものである。具体的には、排気口２３と真空ポンプ５が連通して接続されており、この真空ポンプ５を作動させることにより、基板収容部３０内の空気が排気できるようになっている。また、ガス供給口２４は、基板収容部３０内の減圧状態を解除させるものである。具体的には、ガス供給口２４とＮ２ガス供給源６が連通して接続されており、Ｎ２ガス供給源６を作動させると、基板収容部３０内にＮ２ガスが供給されることにより、基板収容部３０が大気圧に戻り減圧状態が解除されるようになっている。   The mounting plate 21 is formed with a plurality of exhaust ports 23 and gas supply ports 24 that open on the surface thereof. The exhaust port 23 is for exhausting the air in the substrate housing portion 30 to reduce the inside of the substrate housing portion 30 to a pressure smaller than the atmospheric pressure. Specifically, the exhaust port 23 and the vacuum pump 5 are connected in communication, and by operating the vacuum pump 5, the air in the substrate housing portion 30 can be exhausted. Further, the gas supply port 24 is for releasing the decompressed state in the substrate housing portion 30. Specifically, the gas supply port 24 and the N 2 gas supply source 6 are connected in communication, and when the N 2 gas supply source 6 is operated, the N 2 gas is supplied into the substrate housing portion 30, thereby The accommodating part 30 returns to atmospheric pressure, and the reduced pressure state is released.

チャンバ蓋部１０は、載置プレート２１に載置された基板１を覆う形状を有しており、載置プレート２１と対面する平板部１１と、この平板部１１の端部における縁辺部１１ａから載置プレート２１側に突出する収容壁部１２とを有している。   The chamber lid portion 10 has a shape that covers the substrate 1 placed on the placement plate 21, and includes a flat plate portion 11 that faces the placement plate 21, and an edge portion 11 a at the end of the flat plate portion 11. It has the accommodating wall part 12 which protrudes in the mounting plate 21 side.

前記平板部１１は、基板１の形状と対応する形状、すなわち四辺形状に形成されている。本実施形態では、図３に示すように、平板部１１の隣り合う縁辺部１１ａ同士が直交する長方形状に形成されている。また、平板部１１は一定の厚みｔで形成されており、載置プレート２１に対向する面（基板載置部側表面１１ｂ）は、載置プレート２１に対してほぼ平行であって平坦に形成されている。これにより、基板収容部３０内の気流が乱れるのを抑えることができるようになっている。   The flat plate portion 11 is formed in a shape corresponding to the shape of the substrate 1, that is, a quadrilateral shape. In this embodiment, as shown in FIG. 3, the adjacent edge parts 11a of the flat plate part 11 are formed in a rectangular shape orthogonal to each other. Further, the flat plate portion 11 is formed with a constant thickness t, and the surface facing the placement plate 21 (substrate placement portion side surface 11b) is substantially parallel to the placement plate 21 and formed flat. Has been. Thereby, it can suppress that the airflow in the board | substrate accommodating part 30 is disturb | confused.

また、収容壁部１２は、平板部１１の４つの縁辺部１１ａそれぞれから載置プレート２１側に延びて形成されており、載置された基板１を囲むように形成されている。そして、チャンバ蓋部１０の縁辺部１１ａの厚み寸法、すなわち収容壁部１２の厚み方向寸法Ｔは、チャンバ蓋部１０の平板部１１の厚み方向寸法ｔよりも大きくなっている。   The accommodating wall portion 12 is formed to extend from the four edge portions 11 a of the flat plate portion 11 to the placement plate 21 side, and is formed so as to surround the placed substrate 1. The thickness dimension of the edge portion 11 a of the chamber lid portion 10, that is, the thickness direction dimension T of the accommodating wall portion 12 is larger than the thickness direction dimension t of the flat plate portion 11 of the chamber lid portion 10.

このチャンバ蓋部１０は、昇降動作するように構成されている。すなわち、チャンバ蓋部１０には駆動装置７が設けられており、この駆動装置７を駆動させることにより、チャンバ蓋部１０が基板載置部２０の載置プレート２１に対して接離可能になっている。そして、収容壁部１２の底面１２ａは、載置プレート２１とほぼ平行をなすように形成されており、この収容壁部１２の底面１２ａと、載置プレート２１の表面に基板１を囲むように設けられたシール材（不図示）が当接することにより、基板収容部３０が密閉されるようになっている。すなわち、駆動装置４１を駆動させてチャンバ蓋部１０を下降させると、収容壁部１２の底面１２ａとシール材とが密着することにより、基板収容部３０とその外部がシール材により遮断される。これにより、基板収容部３０が密閉されるようになっている。   The chamber lid 10 is configured to move up and down. That is, the chamber lid portion 10 is provided with a driving device 7, and by driving the driving device 7, the chamber lid portion 10 can be brought into and out of contact with the placement plate 21 of the substrate placement portion 20. ing. The bottom surface 12 a of the housing wall 12 is formed so as to be substantially parallel to the mounting plate 21, and the substrate 1 is surrounded by the bottom surface 12 a of the housing wall 12 and the surface of the mounting plate 21. When the provided sealing material (not shown) abuts, the substrate housing portion 30 is hermetically sealed. That is, when the driving device 41 is driven to lower the chamber lid 10, the bottom surface 12 a of the housing wall 12 and the sealing material are brought into close contact with each other, whereby the substrate housing portion 30 and the outside thereof are blocked by the sealing material. Thereby, the board | substrate accommodating part 30 is sealed.

また、図３、図４に示すように、チャンバ蓋部１０の上面（外表面１１ｃ）には、補強リブ１３が取り付けられている。具体的には、補強リブ１３が、チャンバ蓋部１０の外表面１１ｃ上に溶接により接合されており、本実施形態では、４本の補強リブ１３が平板部１１の隣り合う縁辺部１１ａと交差する方向に延びるように溶接されている。この隣り合う縁辺部１１ａとは、一の縁辺部１１ａに対して、角部Ｃを形成するように交差（本実施形態では直交）する他の縁辺部１１ａである。   As shown in FIGS. 3 and 4, a reinforcing rib 13 is attached to the upper surface (outer surface 11 c) of the chamber lid 10. Specifically, the reinforcing ribs 13 are joined to the outer surface 11c of the chamber lid portion 10 by welding, and in this embodiment, the four reinforcing ribs 13 intersect with the adjacent edge portions 11a of the flat plate portion 11. It is welded so that it may extend in the direction of. This adjacent edge part 11a is the other edge part 11a which cross | intersects so that the corner | angular part C may be formed with respect to the one edge part 11a (in this embodiment, orthogonal).

そして、補強リブ１３は、一の縁辺部１１ａの中央部とこの縁辺部１１ａと隣り合う他の縁辺部１１ａの中央部との間に設けられており、各補強リブ１３の長手方向縁端部１３ａが平板部１１の縁辺部１１ａまで延伸されている。そして、これらの補強リブ１３が、平板部１１の中心Ｏと平板部１１の隣り合う縁辺部１１ａ同士が交差する角部Ｃとの中点Ｍを通るように設けられている。すなわち、本実施形態では、平板部１１の中心Ｏと４つの角部Ｃとのそれぞれの中点Ｍを通るように補強リブ１３が取り付けられており、チャンバ蓋部１０の外表面１１ｃ上にひし形を形成するように設けられている。   And the reinforcing rib 13 is provided between the center part of one edge part 11a, and the center part of the other edge part 11a adjacent to this edge part 11a, and the longitudinal direction edge part of each reinforcing rib 13 13 a is extended to the edge portion 11 a of the flat plate portion 11. These reinforcing ribs 13 are provided so as to pass through the midpoint M between the center O of the flat plate portion 11 and the corner portion C where adjacent edge portions 11a of the flat plate portion 11 intersect. That is, in this embodiment, the reinforcing ribs 13 are attached so as to pass through the midpoints M of the center O and the four corners C of the flat plate part 11, and the rhombus is formed on the outer surface 11 c of the chamber lid part 10. Are provided.

また、一の補強リブ１３の長手方向縁端部１３ａと、他の補強リブ１３の長手方向縁端部１３ａとが近接するリブ交差部８が平板部１１の縁辺部１１ａ、具体的には、収容壁部１２に対応する外表面１１ｃ上に形成されている。これにより、収容壁部１２はその厚み方向寸法が平板部１１の中央部分の厚み方向寸法よりも大きく設定されていることから、基板収容部３０内を減圧させることにより平板部１１が大気圧による押圧の影響を受けた場合であっても、その厚み方向における撓みが抑制されるため、他の溶接部分Ｐよりも強度的に弱くなる傾向にあるリブ交差部８における溶接部分Ｐの剥離が有効に抑えられる。   Further, the rib crossing portion 8 where the longitudinal edge portion 13a of one reinforcing rib 13 and the longitudinal edge portion 13a of another reinforcing rib 13 are close to each other is the edge portion 11a of the flat plate portion 11, specifically, It is formed on the outer surface 11 c corresponding to the housing wall portion 12. Thereby, since the thickness direction dimension of the storage wall part 12 is set larger than the thickness direction dimension of the center part of the flat plate part 11, the flat plate part 11 is under atmospheric pressure by depressurizing the inside of the substrate storage part 30. Even in the case of being affected by the pressing, since the bending in the thickness direction is suppressed, it is effective to peel off the welded portion P at the rib intersection 8 that tends to be weaker in strength than the other welded portions P. Can be suppressed.

次に減圧乾燥装置の動作について説明する。   Next, the operation of the vacuum drying apparatus will be described.

まず、塗布基板１の供給が行われる。具体的には、チャンバ蓋部１０を上昇させた状態で、ロボットハンドなどにより、レジスト液が塗布された塗布基板１が、上昇位置で停止しているリフトピン４０の先端部分に載置される。そして、駆動装置４１を作動させてリフトピン４０を下降させることにより、塗布基板１を基板載置部２０の載置プレート２１上に載置された状態で保持される。   First, the coated substrate 1 is supplied. Specifically, with the chamber lid 10 raised, the coated substrate 1 coated with the resist solution is placed on the tip of the lift pin 40 stopped at the raised position by a robot hand or the like. Then, by operating the drive device 41 and lowering the lift pins 40, the coated substrate 1 is held in a state of being placed on the placement plate 21 of the substrate placement portion 20.

次に、塗布基板１を乾燥させる。具体的には、チャンバ蓋部１０を下降させて基板収容部３０を密閉した後、真空ポンプ５を作動させて基板収容部３０内を減圧させることにより、基板１上の塗布液を乾燥させる。ここで、基板収容部３０内を減圧させると大気圧によりチャンバ蓋部１０が押圧される。これにより、チャンバ蓋部１０の中央部分が基板収容部３０側に僅かに撓み変形するが、本実施形態のリブ交差部８は、すべて中央部分よりも厚みの大きい収容壁部１２上に設けられているため、大気圧の押圧による撓み変形が中央部分に比べて小さくなる。したがって、他の部分に比べて溶接力が弱いリブ交差部８に亀裂等が発生することにより、リブ交差部８における溶接部分Ｐが剥離する問題を抑えることができる。   Next, the coated substrate 1 is dried. Specifically, after the chamber lid 10 is lowered to seal the substrate housing portion 30, the coating liquid on the substrate 1 is dried by operating the vacuum pump 5 to depressurize the inside of the substrate housing portion 30. Here, when the inside of the substrate accommodating portion 30 is depressurized, the chamber lid portion 10 is pressed by the atmospheric pressure. As a result, the central portion of the chamber lid portion 10 is slightly bent and deformed toward the substrate accommodating portion 30, but all the rib intersection portions 8 of the present embodiment are provided on the accommodating wall portion 12 having a thickness larger than that of the central portion. Therefore, the bending deformation due to the pressure of atmospheric pressure is smaller than that in the central portion. Therefore, the crack etc. generate | occur | produce in the rib crossing part 8 with weak welding power compared with another part, and the problem that the welding part P in the rib crossing part 8 peels can be suppressed.

次に、所定時間減圧乾燥状態を維持することにより、塗布液を乾燥させた後、塗布基板１の取出しを行う。具体的には、ガス供給口２４からＮ２ガスを基板収容部３０に供給することにより基板収容部３０内を大気圧に戻す。そして、チャンバ蓋部１０を上昇させて塗布基板１の取出しを行うことにより、一連の減圧乾燥装置の動作が終了する。   Next, the coating substrate 1 is taken out after the coating liquid is dried by maintaining the vacuum dried state for a predetermined time. Specifically, the inside of the substrate housing portion 30 is returned to atmospheric pressure by supplying N 2 gas from the gas supply port 24 to the substrate housing portion 30. And the operation | movement of a series of decompression drying apparatuses is complete | finished by raising the chamber cover part 10 and taking out the coating substrate 1. FIG.

以上説明した通りの減圧乾燥装置によれば、補強リブ１３が平板部１１の隣り合う縁辺部１１ａと交差する方向に延びる状態で配置されるため、リブ交差部８をチャンバ蓋部１０の中央部分から離れた位置に形成することができる。そして、前記補強リブ１３は、チャンバ蓋部１０の中心と平板部１１の隣り合う縁辺部１１ａ同士が交差する角部との中点Ｍを通るように設けることにより、少ない補強リブ１３でチャンバ蓋をバランスよく補強することができる。したがって、従来のように、補強リブ１３が平板部１１の互いに向かい合う縁辺部１１ａに延びる方向に配置される場合に比べて、リブ交差部８の溶接部分Ｐが剥離するのを抑制することができ、チャンバ蓋部１０のコストを抑え安価な減圧乾燥装置とすることができる。   According to the vacuum drying apparatus as described above, the reinforcing ribs 13 are arranged in a state extending in the direction intersecting the adjacent edge portions 11 a of the flat plate portion 11, so that the rib intersecting portion 8 is formed at the central portion of the chamber lid portion 10. It can form in the position away from. The reinforcing rib 13 is provided so as to pass through the midpoint M between the center of the chamber lid portion 10 and the corner portion where the adjacent edge portions 11a of the flat plate portion 11 intersect with each other. Can be reinforced in a well-balanced manner. Therefore, as compared with the conventional case where the reinforcing ribs 13 are arranged in the direction extending to the edge portions 11a of the flat plate portion 11 facing each other, it is possible to prevent the welded portion P of the rib intersecting portion 8 from peeling off. In addition, the cost of the chamber lid 10 can be reduced, and an inexpensive reduced pressure drying apparatus can be obtained.

上記実施形態では、補強リブ１３をひし形を形成するように配置した例について説明したが、正方形や長方形を形成するように配置したものであってもよい。具体的には、補強リブ１３が平板部１１の縁辺部１１ａまで延伸するものであり、リブ交差部８が平板部１１の縁辺部１１ａで形成されるものであれよい。すなわち、大気圧による歪みの影響が平板部１１の中央部分に比べて縁辺部１１ａで小さくなるため、リブ交差部８における溶接部が剥離する問題を抑えることができる。   In the above embodiment, the example in which the reinforcing ribs 13 are arranged so as to form a rhombus has been described, but the reinforcing ribs 13 may be arranged so as to form a square or a rectangle. Specifically, the reinforcing rib 13 may extend to the edge portion 11 a of the flat plate portion 11, and the rib intersection portion 8 may be formed by the edge portion 11 a of the flat plate portion 11. That is, since the influence of distortion due to atmospheric pressure is smaller at the edge portion 11 a than at the central portion of the flat plate portion 11, it is possible to suppress the problem that the welded portion at the rib intersection portion 8 peels off.

また、上記実施形態では、収容壁部１２上にリブ交差部８を形成する例について説明したが、これに限定されるものではない。すなわち、最も撓み変形の大きくなる平板部１１の中央部分よりも縁辺部１１ａ側にリブ交差部８を設けることにより、リブ交差部８における溶接部分Ｐの剥離を抑えることができる。   Moreover, although the said embodiment demonstrated the example which forms the rib crossing part 8 on the accommodation wall part 12, it is not limited to this. That is, by providing the rib intersecting portion 8 on the side of the edge portion 11a with respect to the central portion of the flat plate portion 11 where the bending deformation becomes the largest, the separation of the welded portion P at the rib intersecting portion 8 can be suppressed.

本発明の一実施形態における減圧乾燥装置のチャンバ蓋部が開口した状態を示す概略図である。It is the schematic which shows the state which the chamber cover part of the vacuum drying apparatus in one Embodiment of this invention opened. 上記減圧乾燥装置のチャンバ蓋部が閉口した状態を示す概略図である。It is the schematic which shows the state which the chamber cover part of the said reduced pressure drying apparatus closed. 上記チャンバ蓋部の上面図である。It is a top view of the said chamber cover part. 上記チャンバ蓋部の縁端付近を示す図である。It is a figure which shows the edge edge vicinity of the said chamber cover part. 従来のチャンバ蓋を示す図である。It is a figure which shows the conventional chamber lid.

符号の説明Explanation of symbols

８ リブ交差部
１０ チャンバ蓋部
１１ 平板部
１１ａ 縁辺部
１１ｃ 外表面
１２ 収容壁部
１３ 補強リブ
２０ 基板載置部
２１ 載置プレート
３０ 基板収容部 8 rib crossing portion 10 chamber lid portion 11 flat plate portion 11a edge portion 11c outer surface 12 accommodation wall portion 13 reinforcing rib 20 substrate placement portion 21 placement plate 30 substrate accommodation portion

Claims (4)

基板を載置する基板載置部と、この基板載置部に対して相対的に接離可能なチャンバ蓋部とを備え、この基板載置部とチャンバ蓋部とによって形成される基板収容部内に、塗布液が塗布された基板を収容した状態で前記基板収容部内を減圧させることにより前記塗布液を乾燥させる減圧乾燥装置において、
前記チャンバ蓋部は、前記基板載置部と対面するとともに４つの縁辺部を有する四辺形状を有しており、基板載置部側と反対側の外表面には、隣り合う縁辺部と交差する方向に延びる補強リブが接合されていることを特徴とする減圧乾燥装置。 A substrate mounting portion for mounting a substrate, and a chamber lid portion that can be moved toward and away from the substrate mounting portion, and is formed in the substrate housing portion formed by the substrate mounting portion and the chamber lid portion. In the vacuum drying apparatus for drying the coating liquid by reducing the pressure inside the substrate housing portion in a state where the substrate coated with the coating liquid is housed,
The chamber lid portion has a quadrilateral shape that faces the substrate placement portion and has four edge portions, and intersects an adjacent edge portion on the outer surface opposite to the substrate placement portion side. A reduced-pressure drying apparatus, wherein reinforcing ribs extending in a direction are joined. 前記補強リブは、前記チャンバ蓋部の中心と、隣り合う縁辺部同士が交差する角部との中点を通るように設けられていることを特徴とする請求項１に記載の減圧乾燥装置。   The reduced-pressure drying apparatus according to claim 1, wherein the reinforcing rib is provided so as to pass through a midpoint between a center of the chamber lid portion and a corner portion where adjacent edge portions intersect each other. 前記補強リブが一方向に延びる形状を有しており、これらの補強リブが前記チャンバ蓋部の外表面に四辺形を形成するように配置され、前記補強リブ同士が交差するリブ交差部が前記縁辺部に形成されていることを特徴とする請求項１又は２に記載の減圧乾燥装置。   The reinforcing ribs have a shape extending in one direction, the reinforcing ribs are arranged so as to form a quadrilateral on the outer surface of the chamber lid portion, and the rib intersecting portion where the reinforcing ribs intersect with each other The vacuum drying apparatus according to claim 1 or 2, wherein the vacuum drying apparatus is formed at an edge portion. 前記チャンバ蓋部は、載置された基板とほぼ平行であって基板載置部側表面が平坦に形成される平板部と平板部の端部において基板載置部側に突出する収容壁部とを有しており、前記リブ交差部は、この収容壁部に対応する平板部の外表面に形成されていることを特徴とする請求項１〜３のいずれかに記載の減圧乾燥装置。   The chamber lid part is substantially parallel to the placed substrate and the flat surface of the substrate placing part side surface is formed flat, and the accommodating wall part protruding toward the substrate placing part at the end of the flat plate part The reduced-pressure drying apparatus according to any one of claims 1 to 3, wherein the rib intersecting portion is formed on an outer surface of a flat plate portion corresponding to the housing wall portion.
JP2007204356A 2007-08-06 2007-08-06 Vacuum dryer Active JP5192747B2 (en)

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CN101363681A (en) 2009-02-11
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