JP2009039905A - Water absorbent laminate and water absorbent pouch using the laminate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water absorbent laminate or the like which has high barrier properties to gases including oxygen and water vapor and a high function to collect water existing or generated in a pouch for packaging and is especially excellent as a laminate used for a pouch for preserving an electronic instrument or the like. <P>SOLUTION: The water absorbent laminate having gas-barrier properties is made of a water absorbent nonwoven fabric using a substrate film (i), a barrier-membrane layer (ii), and a thermoplastic resin (iii) carrying a desiccant. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a moisture-absorbing laminate and a moisture-absorbing pouch using the same. More specifically, the present invention prevents oxygen gas, water vapor, and the like from permeating, has excellent barrier properties, traps moisture present or generated in the pouch, and is useful for protecting the quality of the contents. The present invention relates to a moisture-absorbing laminate having a good barrier property, and a moisture-absorbing pouch using the same.

  Conventionally, materials such as plastic films, paper base materials, metal foils or vapor-deposited films thereof are used, and any combination of these materials is used to produce packaging materials having various layer configurations, which are then used for packaging bags. A plastic packaging made of various forms filled with packaging and packaging of various foods and drinks, chemical products such as liquid detergents, cosmetics, pharmaceuticals, miscellaneous goods, industrial materials, etc. Products have been developed and proposed.

In the packaging material constituting the plastic packaging product described above, from the viewpoint of protecting the quality of the contents, extending the storage period, etc., it is excellent in heat sealability and can sufficiently satisfy the sealability and consumption. Sometimes it is required to have an easy-open property that allows the packaging bag to be easily opened. In addition, the packaging material constituting the plastic packaging product described above has a gas barrier property that prevents permeation of oxygen gas, water vapor, etc., depending on the contents to be filled and packaged, or the odor of the contents. It is also required to have a fragrance retaining property that protects and the like. Furthermore, the packaging material constituting the plastic packaging product is also required to have a light shielding property or a light shielding property for preventing transmission of sunlight, fluorescent light, and the like.
Therefore, in recent years, various materials, materials, etc. have been used to develop packaging materials having various layer configurations, and accordingly, packaging bags, packaging products, etc. having various forms have been developed and proposed. Yes.

In recent years, for example, various packaging articles have been provided as containers that prevent the deterioration of contents by removing moisture from the container and preventing water vapor from entering the container from outside the container. Has been.
For example, Patent Document 1 describes a desiccant-mixed film obtained by kneading a powdery desiccant into a resin, and Patent Document 2 describes a simple film made of a desiccant resin containing a molecular sieve. A desiccant film formed by laminating a layer or multilayer desiccant film layer and a reinforcing film made of a thermoplastic resin is described.

In the desiccant-mixed films described in Patent Documents 1 and 2, desiccants such as molecular sieves are mixed in a resin such as a thermoplastic resin and can only absorb water vapor that has passed through the resin. Therefore, there is a problem that it takes a long time to absorb moisture.
In Patent Document 3, a liquid obtained by mixing an aliphatic compound (A) having an unsaturated group and a metal salt (B) of a transition metal is mixed with one or more solids selected from calcium oxide or magnesium chloride. An oxygen scavenger composition that absorbs water vapor is described.

  Although the composition described in Patent Document 3 has the advantage of being able to absorb oxygen and water vapor rapidly, it is filled in the form of powder, granules, tablets, and sheets in a packaging container. When used in powder form, it adheres to the contents, so it cannot be used for storage of precision equipment, for example, even if it is used in the form of tablets or sheets Even if it exists, depending on conveyance and storage conditions, tablets and the like are crushed, and the same problems as in the case of using powders occur.

Further, Patent Document 4 describes a moisture absorbing sheet that includes a hygroscopic powder and ultrafine fibers in a dispersed state, and the hygroscopic powder is held by the ultrafine fibers.
Although the moisture-absorbing sheet has a moisture absorption property, it cannot prevent the transmission of oxygen and water vapor. Therefore, the moisture-absorbing sheet can be used as a sheet for removing moisture in the electronic device, but is used as a packaging material. It is not possible.
JP 2002-206046 A JP-A-2005-280188 JP 2002-35579 A JP 2003-340231 A

As mentioned above, especially for packaging pouches that preserve the contents whose performance is likely to be deteriorated due to moisture such as electronic parts, electronic devices, electronic equipment, printed boards, etc., block the transmission of oxygen, water vapor, etc. from the outside. At the same time, it is required to have a function of rapidly collecting the moisture present or generated in the packaging pouch, but no pouch having such characteristics has been obtained.
On the other hand, the present invention has a high gas barrier property against oxygen, water vapor and the like, and also has a high collection function for moisture present or generated in the packaging pouch, electronic components, electronic devices, electronic equipment, It is an object of the present invention to provide a moisture-absorbing laminate that is particularly excellent as a laminate for use in a pouch for storing contents whose performance is liable to be deteriorated due to moisture such as printed circuit boards.

As a result of diligent research to improve the above problems, the present inventor has used a non-woven fabric using a thermoplastic resin carrying a desiccant as a part of the laminated material used in the pouch. It is possible to absorb moisture present or generated in the water well, and further, by providing a barrier thin film layer or a gas barrier coating film as a part of the laminated material constituting the pouch, oxygen and water vapor can be transmitted from the outside. In particular, the present invention has been completed by discovering that the pouch is excellent in storage of electronic components, electronic devices, electronic equipment, printed boards and the like.
That is, the present invention includes the inventions shown in the following (a) to (c).
(I) A moisture-absorbing laminate having barrier properties, comprising (i) a base film, (ii) a barrier thin film layer, and (iii) a moisture-absorbing nonwoven fabric using a thermoplastic resin carrying a desiccant.
(B) a moisture-absorbing laminate in which a gas barrier coating film is provided on a barrier thin film layer,
The gas barrier coating film has a general formula R ¹ _n M (OR ₂ ) _m (wherein R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m represents a valence of M), a polyvinyl alcohol-based resin, and / or Or an ethylene-vinyl alcohol copolymer, and a gas barrier composition that is polycondensed by the sol-gel method in the presence of a sol-gel method catalyst, water, and an organic solvent. (I) Moisture-absorbing laminate.
(C) A water-absorbing pouch using the water-absorbing laminate described in (i) or (b), wherein the bag is formed so that the nonwoven fabric surfaces of the water-absorbing laminate face each other. Moisture-absorbing pouch.

  The moisture-absorbing laminate of the present invention uses a nonwoven fabric carrying a desiccant. And in the non-woven fabric, a desiccant is supported, and since the entire surface is not covered, when creating a pouch using the moisture-absorbing laminate, moisture present or generated in the pouch is obtained. Can be supplemented quickly and stably. In addition to this action, the moisture-absorbing laminate of the present invention has an action that can prevent permeation of oxygen and water vapor from the outside. That is, the moisture-absorbing pouch using the moisture-absorbing laminate of the present invention stably stores, for a long period of time, contents that are likely to deteriorate in performance due to moisture, such as electronic components, electronic devices, electronic equipment, and printed circuit boards. be able to.

Furthermore, the moisture-absorbing pouch produced using the moisture-absorbing laminate of the present invention does not require a sachet or the like containing another desiccant in the pouch, so that the volume of the packaged product can be reduced. In addition, the pouch can be prevented from being damaged due to the sachet or the like. That is, the water-absorbing pouch of the present invention has an advantage that the contents are excellent in transportation and storage suitability.
In the present invention, when a gas barrier coating film is further provided on the barrier thin film layer, the gas barrier property against oxygen, water vapor, etc. can be remarkably improved.

The moisture-absorbing laminate and moisture-absorbing pouch of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing an example of the layer structure of the moisture-absorbing laminate of the present invention. 2 is a schematic perspective view showing an example of the configuration of the water-absorbing pouch of the present invention produced by bag-making the water-absorbing laminate shown in FIG. 1, and FIG. It is a schematic perspective view which shows the example about the packaged product which filled and packaged the content in the moisture absorptive pouch of this invention shown in the said FIG.

  First, the moisture-absorbing laminate of the present invention will be described. The moisture-absorbing laminate A of the present invention has, for example, a barrier thin film layer 2 on one surface of a base film 1 as shown in FIG. Further, a laminated structure in which the moisture-absorbing nonwoven fabric 3 is provided on the barrier thin film layer is a basic structure.

  Said illustration illustrates an example about the layer structure of the moisture absorption laminated body of this invention, and it cannot be overemphasized that this invention is not limited by this. For example, although not shown, in order to improve the adhesion between the base film and the barrier thin film layer, the corona discharge treatment, the ozone treatment, the low temperature plasma treatment, or the glow discharge is applied to the base surface before forming the barrier thin film layer. A treatment such as a treatment may be applied, or a primer, that is, a coating liquid composed of polyester, acrylic, urethane resin, and isocyanate curing agent may be applied to the surface of the substrate.

  Next, the structure of the water-absorbing pouch of the present invention using the water-absorbing laminate will be described. As such a water-absorbing pouch, for example, as shown in FIG. A sheet is prepared, and the surfaces of the moisture-absorbing nonwoven fabric 3 located in the innermost layer are made to face each other, and thereafter, heat sealing portions 11, 11, and 11 are performed by heat-sealing the three ends of the outer periphery. The three-side seal type moisture-absorbing pouch B can be manufactured by forming the opening 12 and forming the opening 12.

  In the present invention, the moisture-absorbing pouch B is filled with the contents 15 such as an electronic component, an electronic device, an electronic device, and a printed board from the opening 12, and then the opening 12 is opened. The package product C of the present invention using the water-absorbing pouch B of the present invention can be manufactured by heat sealing to form the upper seal portion 16.

  Although not shown, the moisture-absorbing pouch can be provided with an opening notch such as an I notch or a V notch. The above illustrations are examples of the water-absorbing pouch and packaged product of the present invention, and the present invention is not limited thereto, for example, as a form of a packaging bag according to the present invention. Although not shown, for example, moisture-absorbing pouches having various forms such as a pillow packaging form, a gusset packaging form, and a standing (self-supporting) pouch packaging form can be manufactured. Furthermore, with respect to the irradiation of ultraviolet light, for example, the state of the raw film before bag making, the packaging bag before filling the contents, the packaging bag after filling, or the packing bag at the same time as filling, the ultraviolet ray is irradiated. Light can be irradiated.

Next, materials, manufacturing methods, and the like that constitute the moisture-absorbing laminate of the present invention will be described.
1. Base film As the base film for forming the moisture-absorbing laminate of the present invention, since this is the basic material constituting the moisture-absorbing laminate of the present invention, mechanical, physical, chemical In particular, since it has strength and toughness, and has heat resistance, and further, it forms an inorganic oxide vapor deposition film, a gas barrier coating film, etc. A resin film or sheet that can withstand the forming conditions and satisfy the conditions such as being able to hold them satisfactorily without impairing their characteristics is used.

  Specifically, as the base film, for example, polyethylene resin, polypropylene resin, cyclic polyolefin resin, fluorine resin, polystyrene resin, acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene. Copolymer (ABS resin), polyvinyl chloride resin, fluorine resin, poly (meth) acrylic resin, polycarbonate resin, polyester resins such as polyethylene terephthalate and polyethylene naphthalate, and polyamide resins such as various nylons , Polyimide resin, polyamideimide resin, polyarylphthalate resin, silicone resin, polysulfone resin, polyphenylene sulfide resin, polyethersulfone resin, polyurethane resin, acetal resin, cell It can be used films or sheets of various resins such as over scan resins. In the present invention, it is particularly preferable to use a film or sheet of polypropylene resin, polyester resin, or polyamide resin.

As the above-mentioned various resin films or sheets, for example, one or more of the above-mentioned various resins are used to form a film such as an extrusion method, a cast molding method, a T-die method, a cutting method, and an inflation method. A method of forming a film of each of the above-mentioned various resins alone, or a method of forming a multi-layer coextrusion film using two or more of various resins, Used to produce various resin films or sheets by mixing and forming a film before forming a film, and if necessary, for example, using a tenter method or a tubular method Thus, various resin films or sheets formed by stretching in a uniaxial or biaxial direction can be used.
In the present invention, the film thickness of various resin films or sheets is preferably 6 to 100 μm, more preferably 9 to 50 μm.

In addition, when using one or more of the above-mentioned various resins and forming the film, for example, film processability, heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slipperiness In addition, various plastic compounding agents and additives can be added for the purpose of improving and modifying mold release properties, flame retardancy, antifungal properties, electrical properties, strength, etc. An extremely small amount to several tens of percent can be arbitrarily added depending on the purpose.
In the above, general additives include, for example, colorants such as lubricants, crosslinking agents, antioxidants, ultraviolet absorbers, light stabilizers, fillers, antistatic agents, lubricants, antiblocking agents, dyes, pigments, and the like. Etc. can be used arbitrarily, and further, a modifying resin or the like can also be used.

Further, in the present invention, the surface of the above-described various resin films or sheets on which the barrier thin film layer is provided is provided in advance as necessary in order to improve the tight adhesion with the barrier thin film layer described later. A desired surface treatment layer can be provided.
As the surface treatment layer, for example, pretreatment such as corona discharge treatment, ozone treatment, low temperature plasma treatment using oxygen gas or nitrogen gas, glow discharge treatment, oxidation treatment using chemicals, etc. is optional. For example, a corona discharge treatment layer, an ozone treatment layer, a plasma treatment layer, an oxidation treatment layer and the like can be formed and provided.

The surface pretreatment is carried out as a method for improving the close adhesion between various resin films or sheets and a barrier thin film to be described later, but as a method for improving the above close adhesion. For example, on the surface of various resin films or sheets, in advance, a primer coating agent layer, an undercoat agent layer, an anchor coating agent layer, an adhesive layer, or a deposition anchor coating agent layer is arbitrarily formed, It can also be a surface treatment layer.
Examples of the pretreatment coating agent layer include polyester resins, polyamide resins, polyurethane resins, epoxy resins, phenol resins, (meth) acrylic resins, polyvinyl acetate resins, polyethylene, and polypropylene. A resin composition comprising a main component of a vehicle such as a polyolefin resin or a copolymer or modified resin thereof, a cellulose resin, or the like can be used.

2. Next, the barrier thin film layer constituting the moisture-absorbing laminate of the present invention will be described. The barrier thin film layer can be formed of a vapor-deposited film of an inorganic oxide by chemical vapor deposition or physical vapor deposition.

(1) Formation of vapor-deposited film by chemical vapor deposition As chemical vapor deposition, specifically, for example, chemical vapor deposition such as plasma chemical vapor deposition, thermal chemical vapor deposition, and photochemical vapor deposition. An inorganic oxide vapor-deposited film can be formed using a phase growth method (chemical vapor deposition method, CVD method).
More specifically, on one side of the base film, a monomer gas for vapor deposition such as an organosilicon compound is used as a raw material, an inert gas such as argon gas or helium gas is used as a carrier gas, and oxygen is used as a supply gas. A vapor deposition film of an inorganic oxide such as silicon oxide can be formed by using a low temperature plasma chemical vapor deposition method using a low temperature plasma generator or the like.
In the above, as the low-temperature plasma generator, for example, generators such as high-frequency plasma, pulse wave plasma, microwave plasma can be used, but in the present invention, in order to obtain a highly active stable plasma, It is desirable to use a high frequency plasma generator.

Specifically, an example of the method for forming a vapor-deposited film of an inorganic oxide by the plasma chemical vapor deposition method will be described. FIG. 4 is a schematic configuration diagram of a low-temperature plasma chemical vapor deposition apparatus showing the outline of the method for forming a deposited film of an inorganic oxide by the plasma chemical vapor deposition method.
As shown in FIG. 4, in the present invention, the base film 1 is unwound from an unwinding roll 23 disposed in the vacuum chamber 22 of the plasma chemical vapor deposition apparatus 21, and the base film 1 is further supported as an auxiliary material. It is conveyed onto the circumferential surface of the cooling / electrode drum 25 at a predetermined speed via the roll 24.

  In the present invention, vapor deposition monomer gas such as oxygen gas, inert gas, organosilicon compound or the like is supplied from the gas supply devices 26 and 27 and the raw material volatilization supply device 28, and a mixed gas composition for vapor deposition composed thereof is prepared. The mixed gas composition for vapor deposition is introduced into the vacuum chamber 22 through the raw material supply nozzle 29, and glow discharge plasma is formed on the substrate film 1 conveyed on the peripheral surface of the cooling / electrode drum 25. The plasma is generated by irradiating and irradiating the plasma to form a deposited film of an inorganic oxide such as silicon oxide to form a film.

In the present invention, a predetermined power is applied to the cooling / electrode drum 25 from the power supply 31 arranged outside the chamber at that time, and a magnet 32 is provided in the vicinity of the cooling / electrode drum 25. Arrangement is promoted to generate plasma. Next, the base film 1 on which the inorganic oxide vapor deposition film such as silicon oxide is formed is wound around the take-up roll 34 via the guide roll 33, and the base film 1 having the inorganic oxide vapor deposition film is obtained. Can be manufactured.
The above exemplification is an example, and the present invention is not limited thereby.

In the present invention, the inorganic oxide vapor-deposited film may be not only one layer of the inorganic oxide vapor-deposited film but also a multilayer film in which two or more layers are laminated, and one kind of material is used. Alternatively, it is also possible to form a vapor-deposited film of an inorganic oxide that is used in a mixture of two or more kinds and mixed with different materials.
In the above, the inside of the vacuum chamber is depressurized by a vacuum pump, and the degree of vacuum is 1.33 × 10 ^{−1 to} 1.33 × 10 ⁻⁸ mbar, preferably, the degree of vacuum is 1.33 × 10 ^{−3 to} 1.33 × 10. It is preferable to adjust to ^-7 mbar.

In the raw material volatilization supply device, the organic silicon compound as the raw material is volatilized and mixed with oxygen gas, inert gas, etc. supplied from the gas supply device, and this mixed gas is supplied to the vacuum chamber via the raw material supply nozzle. Introduce in.
In this case, the content of the organosilicon compound in the mixed gas can be 1 to 40%, the content of oxygen gas can be 10 to 70%, and the content of inert gas can be 10 to 60%. The mixing ratio of the organosilicon compound, oxygen gas, and inert gas can be 1: 6: 5 to 1:17:14.

On the other hand, since a predetermined voltage is applied to the cooling / electrode drum from the electrode, glow discharge plasma is generated in the vicinity of the opening of the raw material supply nozzle in the vacuum chamber and the cooling / electrode drum. The plasma is derived from one or more gas components in the mixed gas. In this state, the substrate film is conveyed at a constant speed, and the substrate on the peripheral surface of the cooling / electrode drum is transferred by glow discharge plasma. A vapor-deposited film of an inorganic oxide such as silicon oxide can be formed on the film.
The degree of vacuum in the vacuum chamber at this time is 1.33 × 10 ^{−1 to} 1.33 × 10 ⁻⁴ mbar, preferably 1.33 × 10 ^{−1 to} 1.33 × 10 ^−2. It is preferable to adjust to mbar, and it is desirable to adjust the conveyance speed of the base film to 10 to 300 m / min, preferably 50 to 150 m / min.

  In addition, in the plasma chemical vapor deposition apparatus described above, an inorganic oxide vapor deposition film such as silicon oxide is formed as a thin film in the form of SiOx while oxidizing a plasma source gas with oxygen gas on a base film. Therefore, the formed vapor-deposited film of inorganic oxide such as silicon oxide is a dense, flexible continuous layer having few gaps. Therefore, the gas barrier property of the vapor-deposited film of inorganic oxide such as silicon oxide is much higher than that of the vapor-deposited film of inorganic oxide such as silicon oxide formed by the conventional vacuum vapor deposition method or the like. Can provide sufficient gas barrier properties.

In the present invention, the surface of the base film is cleaned by SiOx plasma, and polar groups and free radicals are generated on the surface of the base film. This has the advantage that the tight adhesion between the deposited film of the product and the substrate film is high.
Furthermore, as described above, the degree of vacuum when forming a continuous film of an inorganic oxide such as silicon oxide is 1.33 × 10 ^{−1 to} 1.33 × 10 ⁻⁴ mbar, preferably 1.33 × 10 ^{−. Since} it is adjusted to ^{1 to} 1.33 × 10 ⁻² mbar, it is compared with the degree of vacuum (1.33 × 10 ^{−4 to} 1.33 × 10 ⁻⁵ mbar) when forming a deposited film by the conventional vacuum deposition method. Since the degree of vacuum is low, it is possible to shorten the time for setting the vacuum state when the base film is exchanged, the degree of vacuum is stabilized, and the film forming process is stabilized.

In the present invention, a vapor deposition film of silicon oxide formed using a vapor deposition monomer gas such as an organosilicon compound chemically reacts with a vapor deposition monomer gas such as an organosilicon compound and oxygen gas, and the reaction product is It is closely bonded to one surface of the base film to form a dense, flexible thin film, and is usually represented by a general formula: SiOx (wherein x represents a number of 0 to 2). It is a continuous thin film mainly composed of silicon oxide.
As the above-described silicon oxide vapor deposition film, silicon oxide vapor deposition represented by the general formula: SiOx (wherein x represents the number of 1.3 to 1.9) is required from the viewpoint of transparency and barrier properties. A thin film mainly composed of a film is preferable.
In the above, the value of x varies depending on the molar ratio of vapor deposition monomer gas to oxygen gas, plasma energy, etc. Generally, the gas permeability decreases as the value of x decreases, but the film itself is yellow. It becomes sexual and becomes less transparent.

  The silicon oxide vapor-deposited film is mainly composed of silicon oxide, and further, at least one kind of carbon, hydrogen, silicon or oxygen, or at least one compound composed of two or more kinds of elements is chemically chemistry. It is preferably contained by bonding or the like. For example, when a compound having a C—H bond, a compound having a Si—H bond, or a carbon unit is in the form of graphite, diamond, fullerene, or the like, an organic silicon compound as a raw material or a derivative thereof is further added. It may be contained by a chemical bond or the like.

Specific examples include hydrocarbons having a CH ₃ site, hydrosilica such as SiH ₃ silyl and SiH ₂ silylene, and hydroxyl derivatives such as SiH ₂ OH silanol.
In addition to the above, the type, amount, etc., of the compound contained in the deposited film of silicon oxide can be changed by changing the conditions of the vapor deposition process.
As a content rate which said compound contains in the vapor deposition film | membrane of a silicon oxide, 0.1 to 50%, Preferably, 5 to 20% is preferable.
In the above, if the content is less than 0.1%, the impact resistance, spreadability, flexibility, etc. of the deposited silicon oxide film become insufficient, and scratches, cracks, etc. easily occur due to bending, It becomes difficult to stably maintain a high barrier property, and if it exceeds 50%, the gas barrier property is lowered, which is not preferable.

  Further, in the present invention, in the silicon oxide vapor-deposited film, the content of the above compound is preferably decreased from the surface of the silicon oxide vapor-deposited film in the depth direction, whereby the silicon oxide vapor-deposited film is formed. On the surface, the impact resistance and the like can be enhanced by the above compound, etc. On the other hand, since the content of the above compound is small at the interface with the base material, the close adhesion between the base material film and the deposited silicon oxide film is improved. It will be solid.

  In the present invention, for the above-described deposited film of silicon oxide, for example, a surface analyzer such as an X-ray photoelectron spectrometer (Xray Photoelectron Spectroscopy, XPS) or a secondary ion mass spectrometer (Secondary Ion Mass Spectroscopy, SIMS) is used. The physical properties as described above can be confirmed by performing elemental analysis of the deposited film of silicon oxide using a method of analysis by ion etching in the depth direction.

Further, in the present invention, the film thickness of the above-described silicon oxide vapor deposition film is preferably 50 to 4000 mm, and specifically, the film thickness is preferably 100 to 1000 mm. If the thickness is more than 1000 mm, and more than 4000 mm, cracks and the like are likely to occur in the film, which is not preferable. If the thickness is less than 100 mm, and less than 50 mm, the gas barrier effect cannot be expected.
The film thickness of the deposited film can be measured by a fundamental parameter method using, for example, a fluorescent X-ray analyzer (model name, RIX2000 type) manufactured by Rigaku Corporation.
In addition, as means for changing the film thickness of the silicon oxide vapor deposition film, the volume velocity of the vapor deposition film is increased, that is, the method of increasing the amount of monomer gas and oxygen gas or the method of slowing the vaporization rate. Etc.

In the present invention, as a monomer gas for vapor deposition of an organic silicon compound or the like that forms a vapor deposition film of an inorganic oxide such as silicon oxide, for example, 1,1,3,3-tetramethyldisiloxane, hexamethyldisiloxane, vinyl Trimethylsilane, methyltrimethylsilane, hexamethyldisilane, methylsilane, dimethylsilane, trimethylsilane, diethylsilane, propylsilane, phenylsilane, vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane , Methyltriethoxysilane, octamethylcyclotetrasiloxane, and the like can be used.
Among the organosilicon compounds as described above, 1,1,3,3-tetramethyldisiloxane or hexamethyldisiloxane is used as a raw material because of its handleability and the characteristics of the formed continuous film. Is particularly preferred.
Moreover, in the above, as an inert gas, argon gas, helium gas, etc. can be used, for example.

(2) Formation of Vapor Deposition Film by Physical Vapor Deposition Method In the present invention, the inorganic oxide vapor deposition film may be a physical layer such as a vacuum vapor deposition method, a sputtering method, an ion plating method, or an ion cluster beam method. It can be formed using a phase growth method (Physical Vapor Deposition method, PVD method).
Specifically, a metal oxide is used as a raw material, and this is heated to deposit on a base film, or a metal or metal oxide is used as a raw material, and oxygen is introduced to oxidize. An amorphous thin film of an inorganic oxide can be formed by using an oxidation reaction deposition method in which the film is deposited on a base film and a plasma-assisted oxidation reaction deposition method in which the oxidation reaction is supported by plasma. .
In the above, the heating method of the vapor deposition material can be performed by, for example, a resistance heating method, a high frequency induction heating method, an electron beam heating method (EB), or the like.
Examples of the deposited film of the inorganic oxide include a deposited film of a metal oxide. Specifically, silicon (Si), aluminum (Al), magnesium (Mg), calcium (Ca), potassium (K ), Tin (Sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), yttrium (Y), etc. it can. Preferable examples include metals such as silicon (Si) and aluminum (Al).

The deposited metal oxide film can be referred to as a metal oxide such as silicon oxide, aluminum oxide, and magnesium oxide. The notation can be expressed by, for example, MOx such as SiOx, AlOx, and MgOx. (In the formula, M represents a metal element, and the value of x varies depending on the metal element).
Moreover, as a range of said value of x, silicon (Si) is 0-2, aluminum (Al) is 0-1.5, magnesium (Mg) is 0-1, calcium (Ca) is 0-1, 0 to 0.5 for potassium (K), 0 to 2 for tin (Sn), 0 to 0.5 for sodium (Na), 0 to 1.5 for boron (B), 0 to 2 for titanium (Ti). Lead (Pb) can take values in the range of 0 to 1, zirconium (Zr) in the range of 0 to 2, and yttrium (Y) in the range of 0 to 1.5.
In the above, when x = 0, it is a perfect metal and cannot be used because it is not transparent. In addition, the upper limit of the range of x is a completely oxidized value.
In the present invention, silicon (Si) and aluminum (Al) are preferably used, and silicon (Si) has a value in the range of 1.0 to 2.0, and aluminum (Al) has a value in the range of 0.5 to 1.5. Things can be used.

In the present invention, the film thickness of the inorganic oxide vapor-deposited film as described above varies depending on the metal used or the type of metal oxide, but is, for example, 50 to 4000 mm, preferably 100 to 1000 mm. It is desirable to select and form arbitrarily within the range.
In the present invention, the inorganic oxide vapor-deposited film is a metal to be used, or the metal oxide is one or a mixture of two or more, and mixed with different materials. It is also possible to constitute a vapor deposition film.

Next, in the present invention, a method for forming a vapor-deposited film of the above inorganic oxide will be described. FIG. 5 is a schematic configuration diagram illustrating an example of a take-up vacuum deposition apparatus.
As shown in FIG. 5, the base film 1 fed out from the unwinding roll 42 in the winding chamber 41 of the winding type vacuum vapor deposition apparatus 40 is transferred to the cooled coating drum 45 via the guide rolls 43 and 44. Guided.
The evaporation source 46 heated by the crucible 52, for example, metal aluminum, aluminum oxide or the like is evaporated on the substrate film 1 guided on the cooled coating drum, and oxygen gas is added if necessary. For example, a vapor deposition film of an inorganic oxide such as aluminum oxide is formed on the base film 1 through the mask 48 while supplying oxygen gas and the like from the blowout port 47.

Next, for example, the base film 1 on which an inorganic oxide vapor-deposited film such as aluminum oxide is formed is wound around a take-up roll 51 via guide rolls 49 and 50, and the inorganic oxide vapor-deposited film is provided. Film 1 can be manufactured.
The degree of vacuum of the take-up chamber is 10 ⁰ to 10 ⁻⁵ mbar, preferably 10 ⁻¹ to 10 ⁻⁴ mbar. Further, the degree of vacuum of the vapor deposition chamber is preferably 10 ⁻² to 10 ⁻⁸ mbar, preferably 10 ⁻³ to 10 ⁻⁷ mbar before introducing the oxygen gas, and is preferably 10 ⁻³ to 10 ⁻⁷ mbar after introducing the oxygen gas. ^-1 to 10 ^-6 mbar, preferably 10 ^-2 to 10 ^-5 mbar. Moreover, as a conveyance speed of a base film, 10-800 m / min, Preferably 50-600 m / min is desirable.
The above exemplification is an example, and the present invention is not limited thereby.

In the present invention, the first-layer inorganic oxide vapor deposition film is first formed using the above-described take-up vacuum vapor deposition apparatus, and then the inorganic oxide vapor deposition film is formed in the same manner. Further, an inorganic oxide vapor deposition film is formed on the substrate, or the above-described winding type vacuum vapor deposition apparatus is used to connect the two in series, and the inorganic oxide vapor deposition is continuously performed. By forming the film, it is possible to form an inorganic oxide vapor-deposited film composed of two or more multilayer films.
After forming a vapor-deposited film of an inorganic oxide on a substrate by chemical vapor deposition or physical vapor deposition as described above, the vapor-deposited film may be further subjected to glow discharge treatment, plasma treatment, or microwave treatment. Good. This further improves the adhesion between the deposited film and the following gas barrier coating film.

3. Gas barrier coating film In order to further improve the gas barrier properties of the moisture-absorbing laminate of the present invention, it is preferable to provide a gas barrier coating film on the barrier thin film layer. The gas barrier coating film will be described. The gas barrier coating film contains an alkoxide and a water-soluble polymer. Specifically, as the gas barrier coating film, a general formula: R ¹ _n M (OR ² A gas barrier coating film made of a gas barrier composition obtained by polycondensation of a composition containing at least one alkoxide represented by _m , polyvinyl alcohol and / or ethylene / vinyl alcohol by a sol-gel method is used.

The alkoxide that can be suitably used in the present invention has a general formula: R ¹ _n M (OR ² ) _m (wherein M is a metal atom, R ¹ and R ² are organic groups having 1 to 8 carbon atoms, and n is 0 or more) , M represents an integer of 1 or more, and n + m represents a valence of M), and at least one kind of a partial hydrolyzate of alkoxide or a hydrolyzed condensate of alkoxide can be used. . In addition, as a partial hydrolyzate of said alkoxide, all the alkoxy groups do not need to be hydrolyzed, The thing by which one or more was hydrolyzed, and its mixture may be sufficient. Further, the hydrolysis condensate represents a dimer or more of a partially hydrolyzed alkoxide, and a 2-6 mer is usually used.

As the metal atom represented by M in the above general formula: R ¹ _n M (OR ² ) _m , silicon, zirconium, titanium, aluminum and the like can be used, and preferably silicon. These alkoxides can be used singly or as a mixture of two or more different metal atom alkoxides in the same solution.
Specific examples of the organic group R ¹ include, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n- Examples thereof include alkyl groups such as hexyl group and n-octyl group. Specific examples of the organic group R ² include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, and a sec-butyl group. These alkyl groups in the same molecule may be the same or different.

Among the alkoxides, an alkoxysilane in which M is Si is preferable, and the alkoxysilane is represented by Si (OR ^a ) ₄ and R is a lower alkyl group. As R ^a , a methyl group, an ethyl group, an N-propyl group, an N · butyl group, or the like is used. Specific examples of alkoxysilane include tetramethoxysilane Si (OCH ₃ ) ₄ , tetraethoxysilane Si (OC ₂ H ₅ ) ₄ , tetrapropoxysilane Si (OC ₃ H ₇ ) ₄ , tetrabutoxysilane Si (OC ₄ H ₉ ) _{4 and the} like.

Further, alkylalkoxysilane R ^b _m Si (OR ^c ) _4-m can be used (m is an integer of 1, 2, 3). As R ^b and R ^c , a methyl group, an ethyl group or the like is used. Specific examples of the alkylalkoxysilane include methyltrimethoxysilane CH ₃ Si (OCH ₃ ) ₃ , methyltriethoxysilane CH ₃ Si (OC ₂ H ₅ ) ₃ , dimethyldimethoxysilane (CH ₃ ) ₂ Si (OCH ₃ ) ₂ , dimethyldiethoxysilane (CH ₃ ) ₂ Si (OC ₂ H ₅ ) _{2 and the} like. These alkoxysilanes and alkylalkoxysilanes can be used alone or in combination of two or more.

Furthermore, polycondensation products of alkoxysilanes can be used, and specific examples include polytetramethoxysilane and polytetraemethoxysilane.
Among the alkoxides, specific examples of zirconium alkoxides in which M is Zr include tetramethoxyzirconium Zr (O—CH ₃ ) ₄ , tetraethoxyzirconium Zr (O—C ₂ H ₅ ) ₄ , tetraipropoxyzirconium Zr. _{(O-Iso-C 3 H} 7) 4, tetra-n-butoxy zirconium _{Zr (O-C 4 H 9} ) 4 and the like can be preferably used.
Among the above alkoxides, specific examples of titanium alkoxides in which M is Ti include tetramethoxytitanium Ti (O—CH ₃ ) ₄ , tetraethoxytitanium Ti (O—C ₂ H ₅ ) ₄ , and tetraisopropoxytitanium Ti. _{(O-Iso-C 3 H} 7) 4, tetra-n-butoxy titanium _{Ti (O-C 4 H 9} ) 4 and the like can be preferably used.
Among the alkoxides, specific examples of aluminum alkoxides in which M is Al include tetramethoxyaluminum Al (O—CH ₃ ) ₄ , tetraethoxyaluminum Al (O—C ₂ H ₅ ) ₄ tetraisopropoxyaluminum Al ( _{O-Iso-C 3 H 7} ) 4, tetra-n-butoxy aluminum _{Al (O-C 4 H 9} ) 4 and the like can be preferably used.

  Two or more kinds of these alkoxides may be mixed and used. In particular, by using a mixture of alkoxysilane and zirconium alkoxide, the toughness, heat resistance and the like of the resulting laminated film are improved, and a decrease in the retort resistance of the film during stretching can be avoided. The amount of zirconium alkoxide used is in the range of 10 parts by weight or less, preferably about 5 parts by weight, based on 100 parts by weight of alkoxysilane. When the amount exceeds 10 parts by weight, the formed composite polymer is easily gelled, the brittleness of the composite polymer is increased, and the composite polymer layer is easily peeled off when the base film is coated.

  In particular, by using a mixture of alkoxysilane and titanium alkoxide, the thermal conductivity of the resulting film is lowered, and the heat resistance of the base film is remarkably improved. The amount of titanium alkoxide used is in the range of 5 parts by weight or less, preferably about 3 parts by weight, based on 100 parts by weight of alkoxysilane. If the amount exceeds 5 parts by weight, the brittleness of the composite polymer formed becomes large, and the composite polymer is easily peeled off when the base film is coated.

  In the present invention, a silane coupling agent is preferably used in combination with the alkoxide. As the silane coupling agent, a known organic reactive group-containing organoalkoxysilane can be used. In particular, an organoalkoxysilane having an epoxy group is suitable. Examples include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Two or more kinds of such silane coupling agents may be mixed and used. The amount of the silane coupling agent used is in the range of 0.1 to 20 parts by weight with respect to 100 parts by weight of the alkoxysilane. When 20 parts by weight or more is used, the composite polymer formed is increased in rigidity and brittleness, and the insulation and workability of the composite polymer layer are lowered.

In the present invention, the composition (coating liquid) for forming a gas barrier coating film contains polyvinyl alcohol and / or ethylene / vinyl alcohol copolymer as a water-soluble polymer. By combining polyvinyl alcohol and ethylene / vinyl alcohol copolymer, gas barrier properties, water resistance, weather resistance, and the like of the obtained coating film are remarkably improved. Furthermore, a laminated film in which polyvinyl alcohol and ethylene / vinyl alcohol copolymer are combined is excellent in hot water resistance and gas barrier property after hot water treatment in addition to gas barrier properties, water resistance, and weather resistance.
When the combination of polyvinyl alcohol and ethylene / vinyl alcohol copolymer is employed, the weight ratio of each is preferably 10: 0.05 to 10: 6, more preferably about 10: 1.

  The total content of the polyvinyl alcohol and / or ethylene / vinyl alcohol copolymer is in the range of 5 to 600 parts by weight, preferably about 50 to 400 parts by weight, with respect to 100 parts by weight of the total amount of the alkoxide. If it exceeds 600 parts by weight, the brittleness of the composite polymer increases, and the water resistance and weather resistance of the resulting laminated film also deteriorate. When the amount is less than 5 parts by weight, the gas barrier property is lowered.

  In the present invention, the above composition (coating solution) is applied onto the barrier thin film layer, and the composition is polycondensed by a sol-gel method to obtain a coating film. As the sol-gel catalyst, mainly a polycondensation catalyst, a tertiary amine that is substantially insoluble in water and soluble in an organic solvent is used. For example, there are N, N-dimethylbenzylamine, tripropylamine, tributylamine, tripentylamine and the like, and NN-dimethylbenzylamine is particularly preferable. The amount used is 0.01 to 1 part by weight, preferably about 0.03 part by weight, per 100 parts by weight of the total amount of alkoxide and silane coupling agent.

  In the present invention, the above composition may contain an acid instead of the tertiary amine or further. The acid is used as a catalyst for a sol-gel method, mainly as a catalyst for hydrolysis of an alkoxide, a silane coupling agent or the like. As the acid, mineral acids such as sulfuric acid, hydrochloric acid and nitric acid, and organic acids such as acetic acid and tartaric acid are used. The amount of the acid used is 0.001 to 0.05 mol, preferably about 0.01 mol, based on the total molar amount of the alkoxide and the alkoxide content (for example, silicate moiety) of the silane coupling agent.

  In the present invention, the composition for forming a gas barrier coating film contains water in a proportion of 0.1 to 100 mol, preferably 0.8 to 2 mol, relative to 1 mol of the total molar amount of alkoxide. It is preferable. When the amount of water exceeds 2 mol, the polymer obtained from the alkoxysilane and the metal alkoxide becomes spherical particles, and the spherical particles are three-dimensionally cross-linked to form a porous polymer having a low density. . The porous polymer cannot improve the gas barrier property of the moisture-absorbing laminate. When the amount of water is less than 0.8 mol, the hydrolysis reaction hardly proceeds.

Moreover, it is preferable that the composition for gas-barrier coating film formation contains an organic solvent. As the organic solvent, methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butanol and the like are used.
The polyvinyl alcohol and / or ethylene / vinyl alcohol copolymer is preferably in a state of being dissolved in a composition (coating liquid) containing the alkoxide, silane coupling agent, or the like. Therefore, the type of the organic solvent is appropriately selected. Is done. When employing a combination of polyvinyl alcohol and ethylene-vinyl alcohol copolymer, it is preferable to use n-butanol. An ethylene-vinyl alcohol copolymer solubilized in a solvent is commercially available, for example, as Soarnol (trade name). The amount of the organic solvent used is usually 30 to 500 parts by weight per 100 parts by weight of the total amount of the alkoxide, silane coupling agent, polyvinyl alcohol and / or ethylene / vinyl alcohol copolymer, acid, and sol-gel method catalyst. .

A method for forming the gas barrier coating film will be described below.
First, an alkoxide such as alkoxysilane, a silane coupling agent, a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer, a sol-gel catalyst, water, an organic solvent, and, if necessary, a metal alkoxide Etc. are mixed to prepare a gas barrier coating solution. In the gas barrier coating liquid, the polycondensation reaction gradually proceeds.
Next, on the barrier thin film layer provided on one surface of the base film, the gas barrier coating solution is applied by a conventional method and dried. By the drying, the polycondensation of the alkoxide, metal alkoxide, silane coupling agent, and vinyl alcohol polymer further proceeds to form a composite polymer layer. Preferably, the above operation is repeated to laminate a plurality of composite polymer layers.
Finally, the film coated with the coating solution is subjected to a temperature of 50 ° C. to 300 ° C., preferably 70 ° C. to 200 ° C. under a normal environment, for 0.005 minutes to 60 minutes, preferably 0.01 minutes. By heating and drying for 10 minutes, condensation is performed and a gas barrier coating film can be formed.

In the present invention, an ethylene / vinyl alcohol copolymer or a composition using both an ethylene / vinyl alcohol copolymer and polyvinyl alcohol may be used instead of the vinyl alcohol polymer. A laminated film using both an ethylene / vinyl alcohol copolymer and polyvinyl alcohol is further improved in gas barrier properties after hot water treatment such as boil treatment and retort treatment.
As another aspect of forming the gas barrier coating film, the following laminated film is preferably formed in order to improve the gas barrier property after the hot water treatment.

That is, a composition containing polyvinyl alcohol is previously formed on at least one surface of a substrate film or the like to form a first composite polymer layer, and then the ethylene / vinyl alcohol copolymer is contained on the coated surface. The composition is applied to further form a second composite polymer layer. Thereby, the gas barrier property of the laminated film obtained improves.
Furthermore, in the present invention, a plurality of gas barrier coating films may be formed on the barrier thin film layer. By providing a plurality of gas barrier coating films, the gas barrier property can be further improved.

Examples of the method for applying the gas barrier coating film forming composition include one or more times by a coating means such as a roll coat such as a gravure coater, a spray coat, a spin coat, a dipping, a brush, a barcode, and an applicator. With this coating, it is possible to form the gas barrier coating film of the present invention having a dry-baked film thickness of 0.01 to 30 μm, preferably 0.1 to 10 μm.
If necessary, when applying the gas barrier composition of the present invention, a primer agent or the like can be applied on the inorganic oxide vapor-deposited film in advance.
In the embodiment of the present invention, after providing the vapor deposition layer and the gas barrier coating film on the base film, further providing the vapor deposition layer, and forming the gas barrier coating film on the vapor deposition layer in the same manner as described above. Also good. Thus, by increasing the number of laminated layers, it is possible to realize a laminated film having further excellent gas barrier properties.

4). Next, the moisture-absorbing nonwoven fabric constituting the moisture-absorbing laminate of the present invention will be described.
Such moisture-absorbing non-woven fabric contains moisture existing in or in the packaged product such as moisture present in the head space in the packaged product filled and packaged with the contents, and moisture generated due to changes in storage conditions such as temperature. Absorbing and supplementing, a non-woven fabric can be formed from a fiber using a resin composition optionally containing a thermoplastic resin and other additives, and a non-woven fabric carrying a desiccant can be used. .

The moisture-absorbing laminate of the present invention is mainly used as a packaging material for precision equipment such as electronic components, electronic devices, electronic equipment, and printed circuit boards. As the desiccant used for the moisture-absorbing non-woven fabric, it is preferable to use a desiccant having a high moisture absorption rate, an excellent hygroscopic ability even under low humidity, and having no corrosiveness or deliquescence. Examples of such a desiccant include zeolite, molecular sieve, silica gel, and activated alumina. These may be used alone or in admixture of two or more. Furthermore, the average particle diameter of the desiccant is preferably 5 μm to 20 μm so that the function of the desiccant can be maximized and the nonwoven fabric can be stably supported. The content of the desiccant in the nonwoven fabric varies depending on the type of desiccant, but is generally 1 g / m ^{2 to} 20 g / m ² , preferably 2.5 g / m ^{2 to} 12.5 g / m ^2. It is desirable that If the content of the desiccant in the resin composition is less than 1 g / m ² , more preferably less than 2.5 g / m ² , the desired moisture absorption effect cannot be obtained, and 20 g / m ² , or 12 If it exceeds 0.5 g / m ² , the cost increases, which is not preferable.

  Further, the fibers forming the moisture-absorbing nonwoven fabric can be stably supported without dropping the desiccant, and the moisture-absorbing nonwoven fabric constitutes the innermost layer of the moisture-absorbing laminate. Therefore, it is preferable to use one having heat sealing performance.

  As fibers having such properties, fibers made of thermoplastic resin, specifically, low density polyethylene, medium density polyethylene, high density polyethylene, linear (linear) low density polyethylene, metallocene catalyst are used. Polymerized ethylene-α / olefin copolymer, polypropylene, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-methacrylic acid copolymer, Polyolefin resins such as ethylene-methyl methacrylate copolymer, ethylene-propylene copolymer, methylpentene polymer, polybutene polymer, polyethylene or polypropylene are treated with acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid Change with unsaturated carboxylic acid such as The acid-modified polyolefin resins, may be used fibers made of polyvinyl acetate-based resins, poly (meth) acrylic resin, resins such as polyvinyl chloride resin or mixed resin of two or more kinds of these resins.

  Further, the above thermoplastic resins include, for example, processability, heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slip properties, mold release properties, flame retardancy, antifungal properties of formed fibers. Various plastic compounding agents and additives can be added for the purpose of improving and modifying properties, electrical properties, strength, etc. Depending on the case, it can be added arbitrarily to form fibers.

  In the above, general additives include, for example, colorants such as lubricants, crosslinking agents, antioxidants, ultraviolet absorbers, light stabilizers, fillers, antistatic agents, lubricants, antiblocking agents, dyes, pigments and the like. Etc. can be arbitrarily used, and further, a modifying resin or the like can also be used.

  Furthermore, in the present invention, as a fiber forming the moisture-absorbing nonwoven fabric, a heat-adhesive conjugate fiber having a low melting point resin as a sheath component and a high melting point resin as a core component, for example, high density polyethylene / polypropylene, high density polyethylene / polyester , Thermal adhesive (sheath / core) composite fiber made of polypropylene copolymer / polyester, conjugate long fiber of copolymer polyester composition and high melting point polyester, mat made of pulp fiber impregnated with thermal adhesive binder A fixed heat-adhesive fiber or the like can also be used.

  The fiber diameter of the fibers forming the nonwoven fabric is 0.5 μm to 20 μm, preferably 2.5 μm to 15 μm. If the fiber diameter is less than 0.5 μm, further less than 2.5 μm, the rigidity of the resulting non-woven fabric will decrease, and if it exceeds 20 μm, further 15 μm, the entire surface of the desiccant will be coated with fibers made of thermoplastic resin or the like. , Since the hygroscopicity of the desiccant is lowered, it is not preferable. The fiber length of the fibers is 1 mm to 50 mm, preferably 5 mm to 25 mm. If the fiber length is less than 1 mm, or even less than 5 mm, it is difficult to form a nonwoven fabric, and if it exceeds 50 mm, or even 25 mm, it is difficult to produce a nonwoven fabric having a uniform fiber density.

  Next, the manufacturing method of said moisture-absorbing nonwoven fabric will be explained. First, fibers such as the thermoplastic resin and a desiccant are prepared. This aggregate is a collection of fibers such as the above-mentioned thermoplastic resin, and the aggregate state is not particularly limited, but a bundle state in which the fibers are regularly aligned in a certain direction, a randomly oriented aggregate state Can be mentioned. Next, the aggregate of fibers and the desiccant are supplied to the nozzle, and are ejected from the nozzle into the gas by the action of the compressed gas to generate individual fibers from the aggregate of fibers. Disperse. The dispersed fibers and desiccant are then accumulated to form a fibrous web containing the desiccant. The accumulation of the fiber and the desiccant can be performed using a support such as a porous roll or a net. Next, the fibrous web containing the desiccant is heat-sealed by a hot roll or the like in order to prevent the desiccant from falling off or to increase the mechanical strength.

The basis weight of the moisture-absorbing nonwoven fabric is 5 to 200 g / m ² , preferably about 30 to 60 g / m ² . When the weight per unit area is less than 5 g / m ² , the strength and the flexibility are inferior, and the secondary workability may be deteriorated. When it exceeds 200 g / m ² , the fiber density becomes too high, and the desiccant becomes the above heat. It becomes the same state as that covered with the plastic resin, and the desired hygroscopicity cannot be obtained. The thickness of the moisture-absorbing nonwoven fabric is 20 μm to 60 μm so that when the moisture-absorbing laminate is formed, it can be easily processed into a packaging material because it is used as a packaging material. It is preferable to manufacture as follows.

5). Manufacturing method of moisture-absorbing laminate Next, a manufacturing method of the moisture-absorbing laminate of the present invention will be described.
The moisture-absorbing laminate is obtained by laminating the above-described barrier thin film layer, or a base film provided with a barrier thin film layer and a barrier coating film, and a moisture-absorbing nonwoven fabric through a laminating adhesive layer or the like. It can be produced using a dry lamination lamination method or a melt extrusion lamination lamination method in which various resins are laminated while being melt-extruded through an anchor coating agent layer or the like.
Examples of the adhesive for laminating include, for example, polyvinyl acetate adhesives, homopolymers such as ethyl acrylate, or polyacrylate ester adhesives composed of copolymers of these with methyl methacrylate, Cyanoacrylate adhesive, ethylene copolymer adhesive consisting of a copolymer of ethylene and vinyl acetate, cellulose adhesive, polyester adhesive, polyamide adhesive, alkali metal silicate, low melting point glass It is possible to use an adhesive such as an inorganic adhesive made of, for example. The adhesive can be applied by, for example, a coating method such as a roll coating method, a gravure roll coating method, a kiss coating method, or a printing method, and is 0.1 to 10.0 g / m ^{2 in} a dry state. It is desirable to coat so that

In addition, in the above, as the anchor coating agent constituting the anchor coating agent layer, for example, various aqueous or oil-based anchor coating agents such as organic titanium-based, isocyanate-based, polyethyleneimine-based, polyptadiene-based alkyl titanate, etc. are used. can do. The anchor coating agent can be coated using, for example, a coating method such as roll coating, gravure roll coating, kiss coating, and the coating amount is 0.1 to 5.0 g / m ^{2 in} a dry state. desirable.

  Examples of the melt-extruded resin layer in the melt-extrusion laminate method include, for example, polyethylene resins, polypropylene resins, acid-modified polyethylene resins, acid-modified polypropylene resins, ethylene-acrylic acid or methacrylic acid copolymers, etc. One or more of these thermoplastic resins can be used. Further, in the melt extrusion laminate lamination method, in order to obtain stronger adhesive strength, for example, lamination can be performed via an anchor coat agent layer such as the above-described anchor coat agent.

In the present invention, when performing the above-described lamination, if necessary, for example, pretreatment such as corona discharge treatment, ozone treatment, flame treatment, and plasma treatment is performed on the surface of each substrate to be laminated. Can be applied arbitrarily.
Note that the water-absorbing pouch produced using the water-absorbing laminate of the present invention is usually subjected to severe physical and chemical conditions. Strict packaging suitability is required, and various conditions such as deformation prevention strength, drop impact strength, pinhole resistance, heat resistance, sealing performance, quality maintenance, workability, and hygiene are required. In addition to the above materials, other materials that satisfy the above-mentioned various conditions can be arbitrarily used and laminated to produce a moisture-absorbing laminate.

Specifically, for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-ethyl acrylate. Copolymer, ethylene-acrylic acid or methacrylic acid copolymer, methylpentene polymer, polybutene resin, polyvinyl chloride resin, polyvinyl acetate resin, polyvinylidene chloride resin, vinyl chloride-vinylidene chloride copolymer, Poly (meth) acrylic resin, polyacrylonitrile resin, polystyrene resin, acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyester resin, polyamide resin Resin, Polycar Nate resin, polyvinyl alcohol resin, saponified ethylene-vinyl acetate copolymer, fluorine resin, diene resin, polyacetal resin, polyurethane resin, nitrocellulose resin film or sheet can be selected arbitrarily Can be used.
Furthermore, in the present invention, a heat-sealable resin film made of a thermoplastic resin, or a resin having a barrier property that prevents permeation of synthetic paper, water vapor, water, etc., according to other properties required for a moisture-absorbing pouch. Films or sheets of the above can be used.

6). Moisture-absorbing pouch of the present invention and method for producing a packaged product using the same Next, the method for producing the moisture-absorbing pouch of the present invention will be described. For example, the moisture-absorbing laminate produced by the method as described above 2 sheets are prepared, and the moisture-absorbing nonwoven fabric surfaces of the inner layer are opposed to each other and folded, or the two sheets are stacked, for example, side seal type, two-side seal type, three-side seal type, four-side seal Moisture-absorbing pouches that are heat-sealed in various forms such as molds, envelope-sealed seals, palm-sealed seals (pillow seals), pleated seals, flat bottom seals, square bottom seals, etc. Can be manufactured.
In the above, as a heat sealing method, for example, a known method such as a bar seal, a rotary roll seal, a belt seal, an impulse seal, a high frequency seal, and an ultrasonic seal can be used.

The moisture-absorbing pouch of the present invention produced as described above is filled with and packed with various precision equipment such as electronic components, electronic devices, electronic equipment, and printed circuit boards to produce packaging products of various forms. Can do.
And in the present invention, the moisture-absorbing pouch is filled with the contents from the opening, and then the opening of the packaging bag is heat-sealed to form a sealing portion and sealed, The packaged product according to the present invention is manufactured.
Next, the present invention will be described more specifically with reference to examples.

[Example 1]
1. Manufacture of moisture-absorbing laminate (1) Manufacture of moisture-absorbing non-woven fabric A fiber resin made of high-pressure low-density polyethylene (HDPE, fiber diameter 10 μm, fiber length 10 mm) is heat-bonded so that HDPE melts. A nonwoven fabric was formed, and simultaneously, silica gel having a particle size of 8 μm as a desiccant was mixed so as to be 5 g / m ² and cooled to obtain an HDPE-based nonwoven fabric carrying silica gel having a thickness of 60 μm.

(2) Formation of a barrier thin film layer on a base film A biaxially stretched polyethylene terephthalate film is used as a base film, and the above biaxially stretched polyethylene terephthalate film is first mounted on a delivery roll of a plasma chemical vapor deposition apparatus. did. Next, this was fed out, and an organic silicon oxide vapor deposition film having a thickness of 200 mm was formed as a barrier thin film layer on the biaxially stretched polyethylene terephthalate film under the following vapor deposition conditions.
(Deposition conditions)
Reaction gas mixing ratio: hexamethyldisiloxane: oxygen gas: helium = 1: 10: 2.5 (unit: slm)
Ultimate pressure: 5.0 × 10 ^-5 mbar
Film ^- forming pressure: 7.0 × 10 ⁻² mbar
Line speed: 150 m / min
Power: 35kW

(3) Production of moisture-absorbing laminate On the barrier thin film layer surface (deposited film surface of organic silicon oxide) of the base film on which the barrier thin film layer produced in (2) above is formed, by a gravure roll coating method, A two-component curable urethane-based adhesive was laminated so as to be 4.0 g / m ² in a dry state, and bonded to the above-described moisture-absorbing nonwoven fabric to produce the moisture-absorbing laminate of the present invention.

2. Manufacture of moisture-absorbing pouches and packaged products Prepare two sheets of moisture-absorbing laminate manufactured as described above, overlap each other so that the moisture-absorbing nonwoven fabric faces each other, and heat-seal the edges around the outer periphery. The moisture-absorbing pouch of the present invention comprising a three-sided seal-type soft packaging bag having a seal portion and an opening at the top was produced.
Furthermore, the printed board was put into the moisture-absorbing pouch produced above, and the opening was heat-sealed to form an upper seal portion to produce the packaged product of the present invention.

[Example 2]
Through the following steps, a plasma treatment surface is provided on the barrier thin film layer provided on the base material, and a gas barrier coating film is laminated on the plasma treatment surface, and a natural zeolite having a particle size of 8 μm as a desiccant on the nonwoven fabric A water-absorbing laminate, a water-absorbing pouch, and a packaged product of the present invention were produced in the same manner as in Example 1 except that the mixture was mixed to 10 g / m ² .

1. Formation of Plasma Treated Surface A glow discharge plasma generator is used on the barrier thin film layer surface (organic silicon oxide vapor deposition film surface) provided on the substrate, and the power is 9 kw, oxygen gas (O ₂ ): argon gas (Ar) = Using a mixed gas of 7.0: 2.5 (unit: slm), oxygen / argon mixed gas plasma treatment was performed at a mixed gas pressure of 8.0 × 10 ⁻⁵ mbar and a processing speed of 100 m / min, and organic A plasma-treated surface was formed in which the surface tension of the deposited silicon oxide film surface was improved by 54 dyne / cm or more.

2. Lamination of gas barrier coating film According to the composition shown in the following (Table 1), a prepared composition a. A pre-prepared composition b. In a mixed solution comprising an aqueous polyvinyl alcohol solution, isopropyl alcohol and ion-exchanged water. A hydrolyzed solution consisting of ethyl silicate, silane coupling agent, isopropyl alcohol, 0.5N hydrochloric acid aqueous solution and ion-exchanged water was added and stirred sufficiently to obtain a colorless and transparent barrier coating solution.

  Next, the above 1. Using the gas barrier composition produced above on the plasma-treated surface of the organic silicon oxide vapor-deposited film formed by coating with the gravure roll coat method, and then heat-treating at 100 ° C. for 30 seconds. A gas barrier coating film having a thickness of 0.4 μm (in a dry operation state) was formed.

[Example 3]
A moisture-absorbing nonwoven fabric was produced using a fiber resin (fiber diameter: 10 μm, fiber length: 10 mm) made of HDPE and polyethylene (PP) instead of HDPE, and a physical vaporizer was used for the substrate using a vacuum deposition apparatus. The moisture-absorbing laminate, moisture-absorbing pouch, and packaged product of the present invention were produced by the same method as in Example 2 except that 300 mm thick aluminum oxide was formed under the following deposition conditions by the phase growth method. Manufactured.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 2.0 × 10 ⁻⁴ mbar
Degree of vacuum in the winding chamber: 2 × 10 ^-2 mbar
Film transport speed: 300 m / min Electron beam power: 25 kW

[Comparative Example 1]
A water-absorbing laminate, a water-absorbing pouch, and a packaged product were obtained in the same manner as in Example 3 except that a water-absorbing resin film produced by the following method was used instead of the water-absorbing nonwoven fabric. Manufactured.
(1) Production of moisture-absorbing resin film First, the following resin compositions (a) to (c) were prepared.
(A) First layer High pressure method low density polyethylene [HPLDPE, density: 0.923 g / m ³ , melt flow rate (MFR): 3.5 g / 10 min] 100.0 parts by weight and synthetic silica 0.5 weight Part, 0.05 part by weight of erucic acid amide, and 0.05 part by weight of ethylene bisoleic acid amide were sufficiently kneaded to prepare a resin composition forming the first layer.

(B) Second layer High pressure method low density polyethylene [HPLDPE, density: 0.923 g / m ³ , melt flow rate (MFR): 3.5 g / 10 min] 100.0 parts by weight, and synthetic silica 0.5 weight Part and 30.0 parts by weight of silica gel having a particle size of 8 μm as a desiccant were sufficiently kneaded to prepare a resin composition for forming the second layer.

(C) Third layer High pressure method low density polyethylene [HPLDPE, density: 0.923 g / m ³ , melt flow rate (MFR): 3.5 g / 10 min] 100.0 parts by weight, and synthetic silica 0.5 weight And a resin composition for forming a third layer was prepared.

  Next, using the resin compositions (a) to (c) prepared above, and using an air blown inflation co-extrusion film forming machine, the first layer of the resin composition (a) is 20 μm, A water-absorbing resin film was produced by co-extrusion so that the second layer of the resin composition of (b) was 10 μm and the third layer of the resin composition of (c) was 20 μm.

[Comparative Example 2]
Other than using a low-density polyethylene (LDPE) film with a thickness of 50 μm instead of a moisture-absorbing non-woven fabric and filling a small bag containing 5 g of silica gel in addition to a printed circuit board when manufacturing a packaging product Produced a moisture-absorbing laminate, a moisture-absorbing pouch, and a packaged product in the same manner as in Example 3.

[Experimental example]
1. Measurement of Oxygen Permeability and Water Vapor Permeability Oxygen permeability and water vapor permeation of the gas barrier layer produced in Examples 1 to 3 and Comparative Examples 1 and 2 or a substrate provided with a gas barrier layer and a gas barrier coating film The degree was measured under the following conditions.
Oxygen permeability: Measured with a measuring instrument (model name, OX-TRAN 2/20) manufactured by MOCON, USA under the conditions of a temperature of 23 ° C. and a humidity of 90% RH (JIS standard K7126).
Water vapor permeability: Measured with a measuring instrument (model name, PERMATRAN 3/31) manufactured by MOCON, USA, under conditions of a temperature of 40 ° C. and a humidity of 90% RH (JIS standard K7129).
The results are shown below (Table 2).

As described above (Table 2), the gas barrier layer produced in Examples 1 to 3 or the base material provided with the gas barrier layer and the gas barrier coating film has excellent oxygen permeability and water vapor permeability. Was confirmed. In particular, the oxygen permeability and water vapor permeability of the base material of Example 2 provided with a gas barrier coating film were 0.3 (cc / m ² .day.atm) and 0.5 (g / m ² .day), respectively. On the other hand, the oxygen permeability and water vapor permeability of the base material of Example 1 in which the gas barrier coating film was not provided were 1.5 (cc / m ² .day.atm), 2.5 ( g / m ² .day) and slightly higher, by providing a gas barrier coating film, it was confirmed that the gas barrier properties such as oxygen barrier properties and water vapor barrier property is further improved.

2. Measurement of hygroscopic amount A 100 mm × 100 mm test piece of the moisture-absorbing laminate produced in Examples 1 to 3 and Comparative Example 1 was placed in a high-temperature and high-humidity chamber at 40 ° C. and 90%, 7 days later, 14 days later, When the weight of the test piece after 28 days was measured, it was confirmed that a saturated state was reached after 7 days.
Therefore, the moisture absorption amount of each test piece after 7 days is shown in the following (Table 3) as a moisture absorption possible amount.

  As described above (Table 3), it was confirmed that all of the moisture-absorbing laminates produced in Examples 1 to 3 had excellent moisture absorption performance.

3. Evaluation of water absorption capacity over time Using the water-absorbing laminates produced in Examples 1 to 3 and Comparative Examples 1 and 2, a flat pouch of 120 mm × 170 mm was prepared in an environment of 23 ° C. and 50% RH, Digital humidity was placed in the pouch and the relative humidity over time was measured. The pouch using the moisture-absorbing laminate of Comparative Example 2 was simultaneously filled with a sachet containing 5 g of silica gel. The results are shown below (Table 4).

As shown in the above (Table 4), the flat pouch produced using the moisture-absorbing laminates of Examples 1 to 3 absorbs moisture rapidly after the start of the test and stably maintains the humidity over a long period of time. It was confirmed that it could be kept low.
For example, the relative humidity after 6 hours of the flat pouches of Examples 1 to 3 was 2RH%, which was almost the same as the flat pouch of Comparative Example 2 filled with a sachet containing silica gel, whereas Comparative Example 1 The relative humidity after 6 hours of the flat pouch is 49 RH%, which is higher than that of the example, and by using the moisture-absorbing laminates of Examples 1 to 3, it rapidly absorbs moisture. In addition, it was confirmed that the humidity could be stably kept low over a long period of time.

4). Preservation test The packaging product of the present invention containing the printed circuit board manufactured in Examples 1 to 3 was stored for one year, and the performance of the printed circuit board as the contents was compared before and after storage, and the performance was found to be degraded. The water-absorbing pouch of the present invention was confirmed to have extremely good storage characteristics.

It is a rough sectional view showing an example of the layer composition about the moisture absorption layered product of the present invention. It is a schematic perspective view which shows an example of the structure of the water | moisture-content absorptive pouch of this invention manufactured by bag-making using the water | moisture-content absorptive body shown in FIG. It is a schematic perspective view which shows the example about the packaged product which filled and packaged the content in the moisture absorptive pouch of this invention shown in FIG. It is a schematic block diagram which shows an example of a low temperature plasma chemical vapor deposition apparatus. It is a schematic block diagram which shows an example of a winding-type vacuum deposition apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base film 2 Barrier thin film layer 3 Water-absorbing nonwoven fabric 11 Heat seal part 12 Opening part 15 Contents 16 Upper seal part 21 Plasma chemical vapor deposition apparatus 22 Vacuum chamber 23 Unwinding roll 24 Auxiliary roll 25 Cooling / electrode drum 26, 27 Gas supply device 28 Raw material volatilization supply device 29 Raw material supply nozzle 30 Glow discharge plasma 31 Power source 32 Magnet 33 Guide roll 34 Winding roll 40 Winding type vacuum deposition device 41 Winding chamber 42 Unwinding roll 43, 44 Guide roll 45 Coating drum 46 Deposition source 47 Oxygen gas outlet 48 Mask 49, 50 Guide roll 51 Take-up roll 52 Crucible 53 Deposition chamber A Moisture absorbing laminate B Moisture absorbing pouch C Packaging product

Claims (9)

  A moisture-absorbing laminate having a barrier property, comprising (i) a base film, (ii) a barrier thin film layer, and (iii) a moisture-absorbing nonwoven fabric using a thermoplastic resin carrying a desiccant.   The moisture-absorbing laminate according to claim 1, wherein the desiccant is at least one selected from the group consisting of zeolite, molecular sieve, silica gel, and activated alumina.   The moisture-absorbing laminate according to claim 1 or 2, wherein the desiccant has a particle size of 5 µm to 20 µm.   The water-absorbing laminate according to claim 1, wherein the water-absorbing nonwoven fabric is made of polyethylene resin, polypropylene resin, or a mixture thereof.   The moisture-absorbing laminate according to claim 1, wherein the fiber diameter of the thermoplastic resin in the moisture-absorbing nonwoven fabric is 0.5 μm to 20 μm, and the fiber length is 1 mm to 50 mm.   The moisture-absorbing nonwoven fabric according to claim 1, wherein the moisture-absorbing nonwoven fabric has a thickness of 20 μm to 65 μm.   The moisture-absorbing laminate according to claim 1, wherein the barrier thin film layer comprises an organic silicon oxide vapor-deposited film by chemical vapor deposition or an inorganic oxide vapor-deposited film by vacuum vapor deposition. . A moisture-absorbing laminate in which a gas barrier coating film is provided on a barrier thin film layer,
The gas barrier coating film has a general formula R ¹ _n M (OR ₂ ) _m (wherein R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m represents a valence of M), a polyvinyl alcohol-based resin, and / or Or an ethylene-vinyl alcohol copolymer, and a gas barrier composition that is polycondensed by the sol-gel method in the presence of a sol-gel method catalyst, water, and an organic solvent. The moisture-absorbing laminate according to any one of claims 1 to 7.   A moisture-absorbing pouch using the moisture-absorbing laminate according to any one of claims 1 to 8, wherein the bag is formed so that the nonwoven fabric surfaces of the moisture-absorbing laminate are opposed to each other. Moisture-absorbing pouch.

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