JP2009037646A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve interchangeability between an IC card of a particular standard (e.g., MMC card standard) and an IC card of other standard (e.g., MS card standard or USB terminal standard) or the like. <P>SOLUTION: A controller IC 17 connected with a flash memory 15 inside the IC card 1 (MMC card) is provided with a pull-down detection unit 35, a mode controller 33, a USB mode I/F controller 37, an MS mode I/F controller 39 and an MMC/SD mode I/F controller 41. Also, the adaptor side is arranged with only an element in which wirings or resistances are formed easily and inexpensively. The pull-down detection unit 35 detects the pull-down with the resistances. The mode controller 33 selects the USB mode I/F controller 37, the MS mode I/F controller 39 or the MMC/SD mode I/F controller 41. Thus, the interchangeability with IC cards of other standards is achieved by changing the modes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC card, and more particularly to a technique that is effective when a specific IC card is used as another IC card having various shapes, numbers of pins (external terminals), and characteristics.

  As a small-sized memory card, development of a memory card having a size of about a postage loaded with a nonvolatile memory (flash EEPROM: Electrically Erasable Programmable Read Only Memory) that can be electrically written and erased is underway.

  Many of such small memory cards have already been put into practical use as storage media for small devices such as digital cameras and mobile phones.

  However, there are a plurality of standards (external dimensions, number of pins, internal functions, etc.) of such a small memory card, and there are standards that are not compatible with each other. FIG. 46 shows a development company, a product name, its external dimensions, and the like as an example of a standard for a small memory card.

  For example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 7-141114), the information device 22 and the memory card 3a are inserted into the memory card slot 21 of the information device 22 by inserting the adapter 30 with the memory card 3a attached thereto. A technique is disclosed in which information signals can be transmitted and received between the two devices using serial data (see FIG. 10).

Further, in Patent Document 2 (Japanese Patent Laid-Open No. 2001-307801), the SD card connector part 10 to which the SD card 50 is attached and detached and the SIM card connector part 20 to which the SIM card 60 is attached and detached are inseparably integrated with each other. A memory card connector molded in (1) is disclosed (see FIG. 2).
See JP-A-7-141114, summary and FIG. See Japanese Patent Application Laid-Open No. 2001-307801, abstract and FIG.

  As described above, it is an important consideration to achieve compatibility between various small memory cards using an adapter or the like.

  In addition, by reducing the size of the semiconductor chip built in the memory card, it meets the demand for smaller memory cards, increases the number of chips acquired from a single semiconductor wafer, and increases the product cost. Can be reduced.

  Therefore, the memory card of the same standard has been improved in performance including its outer shape.

  However, the new memory card is effective for use with the latest equipment compatible with this memory card, but cannot be used directly with the old model. In addition, the usage of memory cards has been diversified as functions of small devices have been improved.

  Therefore, it is important to improve compatibility with existing memory cards and take measures applicable to various devices in order to increase the demand for new memory cards and meet customer needs.

  An object of the present invention is to provide an IC card that can be compatible with other standard IC cards and the like by being attached to an adapter.

  Another object of the present invention is to provide an adapter used when the IC card is used as an IC card of another standard.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

The IC card of the present invention is a first standard IC card inserted into an adapter,
A plurality of external terminals, a flash memory chip capable of electrical writing and erasing, a controller chip for controlling the flash memory chip, and among the external terminals, the adapter is connected to an external device to generate a potential. A potential level detection terminal whose level changes,
The controller chip corresponds to a first mode interface controller corresponding to a first standard IC card, a second mode interface controller corresponding to a second standard IC card, and a third standard IC card. A third mode interface controller that is connected to the potential level detection terminal, detects a change in potential level, and the first mode interface controller and the second mode interface according to a detection result of the detection unit A controller, a mode controller for switching to one of the third mode interface controllers, a flash memory controller for controlling the flash memory chip, the first mode interface controller, and the flash controller A first wiring for connecting the memory controller, a second wiring for connecting the second mode interface controller and the flash memory controller, and a third wiring for connecting the third mode interface controller and the flash memory controller. With
When the detection unit detects the first pull-down, the mode controller switches from the first mode interface controller to the second mode interface controller,
The mode controller switches from the first mode interface controller to the third mode interface controller when the detection unit detects a second pull down having a potential different from that of the first pull down.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  In the IC card of the first standard, a detection unit for detecting a potential level of a predetermined external terminal among a plurality of external terminals, and a mode controller connected to the detection unit are provided, and based on the signal of the detection unit Since the first mode interface controller corresponding to the first standard or the second mode interface controller corresponding to the second standard is appropriately selected, compatibility with the IC card of the second standard can be achieved.

  Further, compatibility with the second standard IC card can be achieved by inserting the first standard IC card into an adapter having the outer shape of the second standard IC card. In this case, compatibility with other standard IC cards or the like can be achieved only by providing an element that can be easily and inexpensively formed on the adapter side, such as wiring and resistance.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. Also, in the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary. Further, in the drawings for explaining the following embodiments, hatching may be given even in a plan view for easy understanding of the configuration.

(Embodiment 1)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.

  Hereinafter, the structure of an IC card (memory card) and an adapter according to an embodiment of the present invention will be described.

  1 to 5 are diagrams showing the structure of an IC card according to the present embodiment, FIG. 1 is a front view and a first side view of the IC card, and FIG. 2 is a back view of the IC card. FIG. 3 is a cross-sectional view taken along the line AA ′ of the second to third side views and the rear view. Each side view corresponds to a view seen from the direction of arrows (ad) in the plan view. FIG. 3 is a front perspective view of the IC card 1, and FIG. 4 is a rear perspective view of the IC card 1. FIG. 5 is an example of a cross-sectional view of the main part of the IC card. FIG. 6 is a front perspective view showing the relationship between the IC card 1 and the extender. Hereinafter, the surface where the external terminal is exposed in the IC card or adapter is defined as the back surface.

  As shown in the figure, the outer shape of the IC card 1 is a substantially rectangular shape having a short side of about 18 mm and a long side of about 24 mm, and the thickness thereof is about 1.4 mm. However, an index chamfered portion (a notched portion, a tapered portion) 3 is provided at one of the four corners. The chamfered portion 3 has a function of preventing the IC card 1 from being inserted in the reverse direction when the IC card 1 is mounted on an electronic device such as a personal computer. Of the four corners, the other three corners are chamfered to increase the curvature, and the size of the chamfered portions of these three corners is distinguished from the chamfered portion 3. It is getting smaller.

  In addition, external terminals Cn (n: 1 to 13) are provided on the long side portion on the side where the chamfered portion 3 is formed. The external terminal is a conductive portion exposed on the back side of the IC card 1 and is electrically connected to a chip built in the IC card 1 (see FIG. 5). The external terminal Cn has a substantially rectangular shape and extends in parallel with the short side of the IC card 1. Among these external terminals, C1 to C7 are arranged along the long side of the IC card, and C8 to C13. Is located at the rear stage of the C1-C7 column. Furthermore, C8 is located outside C7, and C9 is located outside C1. C10 is located between C1 and C2, C11 is located between C2 and C3, C12 is located between C5 and C6, and C13 is located between C6 and C7. In this way, by arranging the external terminals Cn in a staggered manner, it becomes easy to form the internal terminals of the adapter described later.

  The number of external terminals (number of pins) is not limited to 13. However, the number of external terminals needs to be equal to or greater than the maximum number of terminal functions in the IC card standard and the IC card standard for ensuring compatibility described later. .

  Further, extender mounting portions 5 are provided at both ends of the long side of the IC card where the chamfered portion 3 is not formed. Further, a groove portion 7 for fixing the extender is provided in the central portion of the long side. Therefore, as shown in FIG. 6, the IC card 1 and the extender 9 can be fixed by inserting the protruding portion 11 of the extender 9 into the groove portion 7. At this time, the corner 13 of the extender is positioned on the extender mounting portion 5.

  As described above, the IC card 1 can be applied not only to the card slot of the full outline (half size) but also to an electronic apparatus having a card slot of almost double the outline (full size).

  Such an IC card 1 contains a chip (IC), for example, a chip on which a memory is formed, a chip for a controller, and the like.

  In FIG. 5, for example, three chips (ICs) are incorporated. For example, the chip 15 is a flash memory, and is mounted in a state where two chips 15 are overlapped. The chip 17 is a controller chip.

  These chips 15 and 17 are bonded onto the base substrate 19 using, for example, an adhesive, and the chips and the wiring on the surface of the base substrate (not shown) are connected using a gold wire 14 or the like. . Furthermore, the wiring on the surface of the base substrate is connected to the external terminal Cn.

  The chips 15 and 17 are covered with a sealing resin 21, and a cap portion 23 is provided around the chips 15 and 17.

  Note that the chip mounting form is not limited to that shown in FIG. 5. For example, the chip may be adhered to the lead frame and covered with a sealing resin, or mounted with only the base substrate and the cap. Can exist.

  Next, the internal functions of the IC card of this embodiment will be described. FIG. 7 is a block diagram showing functions of the IC card according to the present embodiment.

  Here, the IC card of the present embodiment is a first standard IC card, specifically, a multimedia card. The multimedia card (hereinafter referred to as “MMC card”) is a card based on a standard (hereinafter referred to as “MMC card standard”) defined by a multimedia card association (MMCA).

  The IC card of this embodiment is compatible with the following 2nd standard IC card (SD memory card), 3rd standard IC card (memory stick) and 4th standard IC card (USB compatible memory). Have. That is, the IC card (MMC) of this embodiment functions as an SD memory card, a memory stick, and a USB compatible memory.

  An SD (secure digital) memory card (hereinafter referred to as “SD card”) is a card based on a standard defined by the SD Card Association (hereinafter referred to as “SD card standard”), and is a card slightly thicker in the same shape as an MMC card. .

  Memory Stick (hereinafter referred to as “MS”) is a card developed by Sony Corporation. This card standard is called a Memory Stick card standard (MS card standard).

  USB is an abbreviation for “Universal Serial Bus” and is a specification for an interface for a personal computer for connecting peripheral devices. For example, the interface of a mouse, a keyboard, a printer, a modem, etc. is made common and only one USB connector is provided to facilitate the connection of the peripheral devices. Therefore, a memory (USB compatible memory) having a USB connector can be inserted into a USB terminal of a personal computer or the like and function as a memory.

  Many of the cards and the like are not compatible due to differences in standards, but compatibility can be ensured by using the IC card of the present embodiment as described below.

  As shown in the figure, an IC card (MMC card) 1 includes a flash memory 15, an IC card chip 16 and a controller IC 17.

  The controller IC 17 includes a flash memory controller 31, a mode controller 33, a pull-down detection unit 35, a USB mode I / F controller 37, an MS mode I / F controller 39, an MMC / SD mode I / F controller 41, and an IC card chip I / F. A controller 43 and a bus controller 45 are included. The MMC / SD mode I / F controller 41 has a x1 bit mode 41a, a x4 bit mode 41b, a x8 bit mode 41c, and an SPI mode 41d. “I / F” means an interface.

  The flash memory 15 is connected to the flash memory controller 31, and the IC card chip 16 is connected to the IC card chip I / F controller 43.

  The flash memory controller 31 is connected to the USB mode I / F controller 37, the MS mode I / F controller 39, and the MMC / SD mode I / F controller 41.

  The mode controller 33 is connected to the USB mode I / F controller 37, the MS mode I / F controller 39, and the MMC / SD mode I / F controller 41, and based on the signal from the pull-down detection unit 35, the USB, MS, MMC / Switch SD mode.

  The pull-down detector 35 is connected to the external terminal Cn via the bus controller. In addition, the mode controller 33, the USB mode I / F controller 37, the MS mode I / F controller 39, and the MMC / SD mode I / F controller 41 are also connected to the external terminal Cn via the bus controller. The external terminals C6 and C3 are ground potential terminals, and C4 is a drive potential terminal.

  Thus, according to the IC card of the present embodiment, the USB mode I / F controller 37 and the MS mode I / F controller 39 are provided in the controller IC, so that it can be used as an MS or USB compatible memory. .

  The IC card chip I / F controller 43 is connected to, for example, the MMC / SD mode I / F controller 41, and the controller 43 and the IC card chip 16 are used when strengthening the secure function of the card.

  Mode switching by the mode controller 33 will be described in detail in section (5).

  (1) The case where the IC card (MMC card) of this embodiment is used as an SD card will be described. In the following description, the IC card of the present embodiment is indicated as “RS-MMC” in order to distinguish it from the full-size IC card 1 described with reference to FIG.

  When the RS-MMC 1 is used as an SD card, an SD type adapter (slot, case) 50 is used.

  FIG. 8 to FIG. 10 are top perspective views showing examples of modes in which the RS-MMC is mounted on the SD type adapter. 8 shows an example in which RS-MMC is inserted from the short side direction of the SD type adapter, FIG. 9 shows an example in which RS-MMC is inserted from the surface of the SD type adapter, and FIG. The example which inserts RS-MMC from the long side direction of SD type | mold adapter is shown.

  As shown in FIGS. 8 to 10, this SD type adapter has a space SP enough to mount the RS-MMC 1, and its outer shape is substantially the same as the SD card, with a short side of about 24 mm, The long side is about 32 mm and the thickness is about 2.1 mm. FIG. 11 is a perspective view of the front and back surfaces of the SD card.

  Further, as shown in FIG. 12, which is a rear perspective view of the SD adapter 50, external terminals ACn (n: 1 to 9) are provided on the rear surface of the SD adapter. This external terminal is a conductive portion exposed on the back side of the SD adapter, and is electrically connected to the external terminal Cn of the RS-MMC that is mounted by wiring provided inside the SD adapter.

  In FIG. 13, the principal part top view at the time of mounting | wearing with the RS-MMC1 in SD type | mold adapter 50 is shown. FIG. 14 also shows the external terminals ACn (n: 1 to 9) of the SD adapter, the external terminals Cn (n: 1 to 13) of the RS-MMC, and the wiring of the SD adapter that connects these external terminals. Show the relationship.

  As shown in the figure, for example, the external terminal AC1 of the SD adapter is connected to the external terminal C1 of the RS-MMC. Similarly, AC2 is C2, AC3 is C3, AC4 is C4, and AC5 is AC5. AC5 is connected to C6, AC7 is connected to C7, AC8 is connected to C8, and AC9 is connected to C9.

  In other words, wiring 55 for connecting the external terminal ACn from a portion (internal terminal portion) where the external terminal Cn of the RS-MMC abuts when the RS-MMC is mounted is formed inside the SD adapter. The wiring 55 is preferably routed so as not to intersect as much as possible, but by arranging a plurality of wiring layers in the SD type adapter, it is possible to cope with a layout in which each wiring intersects.

  Note that St1 shown in FIG. 13 is a switch, and the shape of the SD adapter changes depending on the position of the switch (slide part). By recognizing this change by, for example, an electronic device on the host side, whether data can be written can be switched.

  (2) The case where the IC card (RS-MMC) of this embodiment is used as an MS card will be described.

  (2-1) When RS-MMC is used as an MS card, an MS type adapter is used.

  FIG. 15 is a front perspective view showing an example of mounting the RS-MMC on the MS adapter, and FIG. 16 is a rear perspective view. 15 and 16 show an example in which RS-MMC is inserted from the short side direction of the MS type adapter. FIG. 17 is a rear perspective view showing a mode example in which the RS-MMC is attached to the MS type adapter, and shows an example in which the RS-MMC is inserted from the long side direction of the MS type adapter. FIG. 18 is a front perspective view showing an example of attaching the RS-MMC to the MS type adapter, and shows an example in which the RS-MMC is inserted from the surface of the MS type adapter.

  As shown in FIGS. 15 to 18, this MS type adapter 60 has a space SP enough to be fitted with the RS-MMC 1. 0.5 mm, long side of about 50 mm, and thickness of about 2.8 mm. FIG. 19 shows a perspective view of the front and back surfaces of the MS card.

  Further, as shown in FIGS. 16 and 17, external terminals ACn (n: 1 to 10) are provided on the back surface of the MS type adapter 60. This external terminal is a conductive part exposed on the back side of the MS type adapter 60 and is electrically connected to the external terminal Cn of the RS-MMC 1 mounted by wiring provided inside the MS type adapter 60. .

  In FIG. 20, the principal part top view at the time of mounting | wearing with RS-MMC1 in MS type | mold adapter 60 is shown. FIG. 21 also shows the external terminals ACn (n: 1 to 10) of the MS adapter 60, the external terminals Cn (n: 1 to 13) of the RS-MMC, and the wiring of the MS adapter that connects these external terminals. The relationship is shown.

  As shown in the figure, for example, the external terminal AC1 of the MS type adapter is connected to the external terminals C3 and C6 of the RS-MMC. Similarly, AC2 is C2, AC3 is C4, AC4 is C7, and AC5. Is connected to C8, AC6 is connected to C1, AC7 is connected to C9, AC8 is connected to C5, and AC9 is connected to C4. Further, the external terminal AC1 of the MS type adapter is connected to AC10, and AC3 is connected to AC9.

  Also, resistors R1 and R2 are connected in series between AC3 and AC10, and these connection nodes N and AC10 are connected via a switch St2. The node N is connected to the external terminal C13. The switch St2 is a mechanical switch provided on the back surface of the MS-type adapter. For example, by mechanically changing the position of the switch, the connection node N and the AC10 are made conductive (electrically connected). Or a non-conductive state.

  As described above, the wiring that connects the external terminal ACn from the portion (internal terminal portion) where the external terminal Cn of the RS-MMC abuts when the RS-MMC 1 is mounted is formed inside the MS type adapter. Note that, as described in the section (1), by arranging a plurality of wiring layers in the MS type adapter, it is possible to cope with a layout in which each wiring intersects.

  According to such an MS type adapter 60, since the resistors (R1, R2) are provided between the external terminal ACn of the MS type adapter and the external terminal Cn of the RS-MMC, for example, the external terminal Cn of the RS-MMC is connected to the power supply potential. Whether the potential is slightly lower (pull-up potential) or slightly higher than the ground potential (pull-down potential) can be recognized, and RS-MMC mode switching can be facilitated.

  Specifically, as shown in FIG. 21, various potentials (signals) are applied to the external terminal ACn of the MS adapter. 22 shows a signal applied to the left side of the external terminal ACn in FIG. For example, a power supply potential (drive potential, VCC) is applied to AC3, and a ground potential (reference potential, VSS, GND) is applied to AC10. Each signal will be described in detail in section (5).

  Therefore, whether or not to function as an MS card can be determined based on whether or not the potential of C13 is higher than the ground potential by a predetermined potential determined by the resistance (pulled down).

  Further, in the MS type adapter according to the present embodiment, the switch St2 is arranged between the connection node N between the resistors R1 and R2 and the AC10, so that the switch St2 is turned on and off. And the potential level of C13 can be changed.

  For example, when the switch St2 is on (write inhibit mode), C13 is completely pulled down. In addition, when the switch St2 is off (the writable mode), C13 pulls down intermediately.

  In this way, the write enable / disable mode can be switched with the degree of pull-down of C13.

  (2-2) This MS card has a smaller type (memory stick duo, hereinafter referred to as “MS Duo card”).

  When RS-MMC is used as an MSDuo card, an MSDuo type adapter is used.

  FIG. 22 is a rear surface and front perspective view showing an example in which the RS-MMC is mounted on the MSDuo adapter, and shows an example in which the RS-MMC is inserted from the short side direction of the MSDuo adapter. FIG. 23 is a front perspective view showing a mode example in which the RS-MMC is attached to the MSDuo type adapter, and shows an example in which the RS-MMC is inserted from the long side direction of the MS type adapter. FIG. 24 is a front perspective view showing an example of mounting the RS-MMC on the MS type adapter, and shows an example in which the RS-MMC is inserted from the surface of the MS type adapter.

  As shown in FIGS. 22 to 24, this MSDuo-type adapter 70 has a space SP enough to be fitted with the RS-MMC 1 and its outer shape is almost the same as that of the MSDuo card, with a short side of about 20 mm. The long side is about 31 mm and the thickness is about 1.6 mm. FIG. 25 is a perspective view of the front and back surfaces of the MSDuo card.

  Further, as shown in FIG. 22, external terminals ACn (n: 1 to 10) are provided on the back surface of the MSDuo adapter. This external terminal is a conductive part exposed on the back side of the MSDuo adapter 70, and is electrically connected to an external terminal of the RS-MMC to be mounted by wiring provided inside the MSDuo adapter.

  The relationship between the external terminal ACn (n: 1 to 10) of the MSDuo type adapter, the external terminal Cn (n: 1 to 13) of the RS-MMC, and the wiring of the MSDuo type adapter connecting these external terminals is as follows: Since this is the same as the case of the MS type adapter described with reference to FIG. 21, the description thereof is omitted.

  Accordingly, as in the case of the MS type adapter, by providing resistors (R1, R2) between the external terminal ACn and the external terminal Cn of the RS-MMC, the mode is switched depending on whether or not the external terminal is pulled down. The write enable / disable mode can be switched to the extent of.

  (3) A case where the IC card (RS-MMC) of the present embodiment is used as a USB compatible memory will be described.

  When RS-MMC is used as a USB compatible memory, a USB adapter (slot with USB terminal) is used.

  FIG. 26 is a front perspective view showing a mode example in which the RS-MMC is attached to the USB adapter, and the RS-MMC 1 is inserted from the short side direction of the USB adapter 80, that is, inserted in the insertion direction of the USB terminal. An example is shown. FIG. 27 is a front perspective view showing a mode example in which the RS-MMC is attached to the USB adapter, and the RS-MMC is inserted from the long side direction of the USB adapter, that is, orthogonal to the insertion direction of the USB terminal. An example of inserting in the direction to perform. FIG. 28 is a front perspective view showing an example of a mode in which the RS-MMC is mounted on the USB adapter, and shows an example in which the RS-MMC is inserted from the surface of the USB adapter.

  As shown in FIGS. 26 to 28, this USB adapter has a space SP enough to be fitted with an RS-MMC, and includes a case portion 80a and a USB terminal portion 80b.

  The USB terminal portion 80b is provided with external terminals ACn (n: 1 to 4) as shown in FIG. 26, for example. This external terminal is a conductive part provided on the inner wall of the USB terminal part, and is electrically connected to an external terminal of the RS-MMC attached by wiring provided inside the case part 80a.

  FIG. 29 shows the relationship between the external terminals ACn (n: 1 to 4) of the USB terminal unit, the external terminals Cn (n: 1 to 13) of the RS-MMC, and the wiring in the case unit that connects these external terminals. .

  As shown in the figure, for example, the external terminal AC1 of the USB terminal unit is connected to the external terminal C4 of the RS-MMC. Similarly, AC2 is connected to C12, and AC3 is connected to C11. AC4 is connected to C3 and C6, and AC4 is connected to C10 via a resistor R3.

  As described above, a wiring for connecting the external terminal ACn from a portion (internal terminal portion) where the external terminal Cn of the RS-MMC abuts when the RS-MMC is mounted is formed inside the case portion. Note that, as described in the section (1), by arranging a plurality of wiring layers in the USB adapter, it is possible to deal with a layout in which the respective wirings intersect.

  According to such a USB adapter 80, since the resistor (R3) is provided between the external terminal ACn of the USB terminal portion and the external terminal Cn of the RS-MMC, for example, the external terminal Cn of the RS-MMC is slightly smaller than the power supply potential. It is possible to recognize whether the potential is slightly lower (pull-up potential) or slightly higher than the ground potential (pull-down potential), and the mode switching of the RS-MMC 1 can be facilitated.

  Specifically, as shown in FIG. 29, various potentials (signals) are applied to the external terminal ACn of the USB adapter. 30 shows a signal applied to the left side of the external terminal ACn of FIG. For example, a ground potential (GND) is applied to AC4.

  Therefore, whether or not to function as a USB-compatible memory can be determined based on whether or not the potential of C10 is higher than the ground potential by a predetermined potential determined by the resistance (pulled down).

  (4) When the IC card (RS-MMC) 1 of this embodiment is used as a full-size MMC card, the extender 9 described with reference to FIG. 6 is used. When this extender is attached and inserted into the host (electronic device), the external terminals Cn (n: 1 to 13) of the RS-MMC come into contact with the terminals on the host side, and signals can be transmitted. . Therefore, no wiring or space is formed in the extender 9 shown in FIG.

  When the RS-MMC is directly inserted into the host (electronic device), the external terminal Cn (n: 1 to 13) of the RS-MMC is in contact with the terminal on the host side, and signal transmission is possible. Needless to say.

  Moreover, the adapter etc. which were demonstrated by said (1) to (4) shape | molded wiring by etching the copper foil of the surface of a copper foil tension glass epoxy board | substrate inside the housing | casing shape | molded, for example with resin. An internal terminal for contacting the external terminal of the RS-MMC to be mounted is connected to the wiring board, and a part of the wiring of the wiring board forms the shape of the external terminal. It is exposed from the external terminal window of the body. The internal terminal may have a shape or mechanism that can apply a pressing force to the external terminal Cn (n: 1 to 13) of the RS-MMC, such as a bent metal leaf spring, for example. preferable.

  (5) Next, a determination flow for switching between modes when the IC card (RS-MMC) of the present embodiment is attached to any of the adapters or when the IC card alone is set in the host will be described.

  FIG. 30 is a flowchart showing a mode determination method (determination procedure) by the controller IC 17 of FIG. 7 and a procedure for switching the function of the controller IC 17 in accordance with the determined mode.

  This will be described below with reference to this flowchart (FIG. 30) and FIG.

  When the power is turned on after setting the IC card 1 to the host, the setup operation starts, the ground potential (VSS, GND) is supplied to the external terminals C3 and C6 of the RS-MMC, and the power supply potential is supplied to the external terminal C4. (VCC) is supplied.

  (Step 1) Next, the pull-down detector 35 determines whether or not the external terminal C10 has a pull-down. When the external terminal C10 has a pull-down, that is, when the RS-MMC 1 is attached to the USB adapter 80 described with reference to FIG. 29 and the like, the USB mode is selected by the mode controller 33.

  Thereafter, as shown in FIG. 31, the USB mode I / F controller assigns a + Data terminal to the external terminal C11 of the RS-MMC and a -Data terminal to C12. The + Data terminal is a data signal terminal, and the -Data terminal is an inverted signal terminal of the data signal. The external terminals C3 and C6 of the RS-MMC are GND terminals, and the external terminal C4 is a VBus terminal. The VBus terminal is a terminal for driving voltage of 5V, for example.

  (Step 2) Next, when the external terminal C10 has no pull-down, the pull-down detector 35 determines whether or not the external terminal C13 has an intermediate pull-down. When the external terminal C13 has a pull-down and the potential is an intermediate potential (intermediate pull-down), that is, the RS-MMC1 is mounted on the MS adapter 60 or the MSDuo adapter described with reference to FIG. In this case, the mode controller 33 selects the MS mode. Further, in the case of the intermediate pull-down, the switch St1 is in a non-conducting state and enters a writable mode.

  After that, as shown in FIG. 32, the MS mode I / F controller has the RS-MMC external terminal C1, the INS terminal, the C2, BS terminal, the C5, the SCLK terminal, and the C7 DIO terminal. Assign RSV terminals to C8 and C9.

  The INS terminal is a terminal for stick insertion / extraction detection, and the BS terminal is a terminal for a serial protocol bus state signal. The SCLK terminal is a serial protocol clock signal terminal, and the DIO terminal is a serial protocol data signal terminal. The RSV terminal is a reserved terminal. The external terminals C3 and C6 of the RS-MMC are VSS terminals, and the external terminal C4 is a VCC terminal. The VSS terminal is a terminal for ground voltage, and the VCC terminal is a terminal for driving voltage of 3.3V, for example.

  (Step 3) Next, when there is no intermediate pull-down at the external terminal C13, the pull-down detector 35 determines whether or not the pull-down is a complete pull-down. When the external terminal C13 has a pull-down and its potential is lower than the intermediate potential, that is, when the RS-MMC is attached to the MS type adapter or the MSDuo type adapter, the MS mode is selected by the mode controller. The Further, when the pull-down is complete, the switch St1 is in a conductive state, and the write inhibit mode is set.

  Thereafter, as described with reference to FIG. 32, each signal terminal is assigned to the external terminal Cn by the MS mode I / F controller.

  (Step 4) Next, when there is no complete pull-down at the external terminal C13, that is, the SD adapter 50 described with reference to FIGS. 13 and 14 or the extender 9 described with reference to FIG. 6 is mounted. In this case, or when the RS-MMC 1 alone is set, the mode controller 33 selects the MMC / SD mode.

  Furthermore, after this, according to the procedure shown below, the “SPI mode”, “× 4 bit mode (SD mode)”, “× 8 bit mode (high-speed MMC mode)” or “× 1 bit mode (standard MMC mode)” Make a selection.

  (Step 4-1) First, it is determined whether or not the chip select (CS) signal of the external terminal C1 is asserted while the external terminal C2 is receiving the reset command.

  When the CS signal is asserted, the SPI mode 41d is selected by the MMC / SD mode I / F controller 41. In the SPI mode, unlike other MMC (1-bit, 8-bit) modes, command signal transmission is unidirectional.

  The relationship between the external terminal Cn and the signal terminal is as shown in FIG. That is, the external terminal C2 of the RS-MMC is a DI terminal, C5 is an SCLK terminal, and C7 is a DO terminal. The DI terminal is a terminal for an input data signal (DI), and the DO terminal is a terminal for an output data signal (DO). C1 is a CS signal terminal, C3 and C6 are VSS terminals, and C4 is a VCC terminal.

  (Step 4-2) When the CMD (start command) signal of the SD mode (× 4 bit mode) is input to C2, the SD mode start preparation completion response is returned, and the SD mode (× 4 bit mode) 41b. Is selected.

  The relationship between the external terminal Cn and the signal terminal is as shown in FIG. That is, the external terminal C1 of the RS-MMC is a CD / DAT3 terminal, C5 is a CLK terminal, C7 is a DAT0 terminal, and C8 and C9 are a DAT1 terminal and a DAT2 terminal. The CD / DAT3 terminal is a terminal for a card detect (CD) signal or a third data signal (DAT3) that tells the host side that a memory card has been inserted. The DAT0 terminal, the DAT1 terminal, and the DAT2 terminal are a terminal for the 0th data signal (DAT0), a terminal for the first data signal (DAT1), and a terminal for the second data signal (DAT2), respectively. Further, C2 is a terminal for CMD signals, C3 and C6 are VSS terminals, and C4 is a VCC terminal.

  (Step 4-3) When a CMD (start command) signal in the high speed MMC mode (× 8 bit mode) is input to C2, the high speed MMC mode (× 8 bit mode) 41c is selected.

  The relationship between the external terminal Cn and the signal terminal is as shown in FIG. That is, the external terminal C1 of the RS-MMC is a DAT3 terminal, C5 is a CLK terminal, C7 is a DAT0 terminal, and C8 to C13 are DAT1, DAT2, and DAT4 to DAT7 terminals, respectively. The DAT0 terminal is a terminal for the 0th data signal (DAT0), and the DAT1 to DAT7 terminals are terminals for the 1st to 7th signals (DAT1 to 7). Further, C2 is a terminal for CMD signals, C3 and C6 are VSS terminals, and C4 is a VCC terminal.

  (Step 4-4) No CS signal was asserted, SD mode (× 4 bit mode) CMD (start command) signal, or high speed MMC mode (× 8 bit mode) CMD (start command) signal was not input In this case, the standard MMC mode (× 1 bit mode) 41a is selected.

  The relationship between the external terminal Cn and the signal terminal is as shown in FIG. That is, the external terminal C1 of the RS-MMC is an RSV / CS terminal, C5 is a CLK terminal, and C7 is a DAT terminal. The RSV / CS terminal is a reserve signal (RSV) terminal or a CS signal terminal. Further, C2 is a terminal for CMD signals, C3 and C6 are VSS terminals, and C4 is a VCC terminal.

  As described above, according to the IC card of the present embodiment, the pull-down detector 35, the mode controller 33, the I / F controller of the memory of other standards, such as the USB mode I / F controller 37 and the MS mode I / F controller 39, etc. Can be used as a memory of other standards.

  Further, since such a controller IC 17 is incorporated in a basic IC card to be mounted, it is not necessary to provide a controller in the adapter, and the cost of the adapter can be reduced.

  For example, it is possible to provide a mode switching function (35, 33, 37, 39, etc.) to another standard on the adapter side, but in this case, it is necessary to provide a semiconductor chip (IC) on the adapter side as well. Become high.

  However, if the pull-down detection unit and the mode controller are provided in the IC card as in this embodiment, it is only necessary to provide elements that can be easily and inexpensively formed on the adapter side, such as wiring and resistance. Compatibility with a standard memory can be achieved.

  In this embodiment, the SD card, the MS card, and the USB compatible memory have been described as examples of the other standard memory. However, an I / F controller for compatibility with the other standard may be provided. Further, the number of other standards for compatibility is not limited to three, and may be two or more.

  Further, according to the present embodiment, the pull-down resistor is provided in the USB adapter or the MS adapter, but the adapter type using the resistor can be changed as appropriate.

  In this embodiment, the pull-down is described as an example. However, pull-up may be used, and a change in potential due to a resistor can be used as a signal as appropriate. Further, a detection unit that is an external terminal on the adapter side and that determines whether there is a short circuit between terminals that do not become signal terminals may be provided as the detection unit.

(Embodiment 2)
In the present embodiment, the mounting direction of the RS-MMC card described in the first embodiment to the adapter and the internal terminal shape on the adapter side will be described.

  (1) FIG. 37 is a perspective view showing the internal terminal shape on the adapter side when the RS-MMC 1 is inserted from the short side direction of the adapter AD as described in the first embodiment with reference to FIG. FIG.

  As illustrated, when the RS-MMC 1 is inserted into the adapter AD, the external terminal Cn of the RS-MMC is connected to an internal terminal BCn formed on the inner wall of the adapter AD. The internal terminal BCn is a spring-type terminal, and its planar pattern is substantially rectangular. The long side of the internal terminal is in the RS-MMC insertion direction (the direction in which the long side of the adapter and the RS-MMC extends). Extend. In addition, the internal terminal BCn has a mountain-shaped (convex) cross section along the direction in which the long side of the RS-MMC extends.

  In this way, the internal terminal BCn on the adapter side is a terminal that is long in the card insertion direction, or the internal terminal BCn on the adapter side is formed in a mountain shape, so that the internal terminal of the adapter and the RS- The stress applied to the external terminal of the MMC can be reduced, and adhesion with the external terminal of the RS-MMC can be ensured. In addition, the broken line in a figure shows the contact area | region of the external terminal of RS-MMC (same in FIG. 40 and FIG. 41).

  FIG. 13 (plan view of the main part when the RS-MMC is mounted in the SD type adapter) and FIG. 20 (plan view of the main part when the RS-MMC is mounted in the MS type adapter) described in the first embodiment FIG. 38 and FIG. 39 are main part plan views when the internal terminals BCn of the present embodiment are arranged.

  (2) FIG. 40 is a perspective view showing the internal terminal shape on the adapter side when the RS-MMC 1 is inserted from the long side direction of the adapter AD as described with reference to FIG. FIG.

  As shown in the figure, the internal terminal BCn on the adapter side has a substantially rectangular plane pattern, and the long side of the internal terminal is in the RS-MMC insertion direction (the direction in which the short side of the adapter and the RS-MMC extends). Extend to. Moreover, the cross section along the direction where the short side of RS-MMC is extended has a mountain shape.

  Also in this case, the adapter-side internal terminal BCn is a terminal that is long in the card insertion direction, or the adapter-side internal terminal BCn is formed in a mountain shape, so that the adapter internal terminal and RS- Stress applied to the external terminals of the MMC can be reduced, and adhesion between the external terminals of the RS-MMC can be ensured. In this case, it is easy to ensure the interval between the internal terminals BCn.

  (3) FIG. 41 shows the internal terminal shape on the adapter side when the RS-MMC 1 is inserted from the surface of the adapter AD as described in the first embodiment with reference to FIG. It is a perspective view which shows the mounting process.

  As shown in the figure, the adapter internal terminal BCn has a substantially rectangular planar pattern, and the long side of the internal terminal extends in the direction in which the short side of the RS-MMC extends. Moreover, the cross section along the direction where the short side of RS-MMC is extended has a mountain shape.

  In this case, a hooking claw 91 and a lock claw 93 are provided on the adapter side, and the RS-MMC 1 can be securely fixed by these claws.

  The adapter-side internal terminals BCn described in (1) to (3) may be arranged corresponding to all 13 terminals of the RS-MMC, but correspond to terminals that are not used depending on the mode. An internal terminal may not be arranged.

  The shape of the adapter AD of the present embodiment may be any of an SD type adapter, an MS type adapter, an MSDuo type adapter, and a USB type adapter.

  In addition, the internal terminal BCn described in the present embodiment is, for example, bonded and fixed to the wiring board in the adapter using a flat surface of a metal strip whose end is processed into a chevron, and the fixed By forming the end opposite to the side as a free end that is not fixed, it is formed to have a shape or mechanism capable of applying a pressing force to the external terminal Cn (n: 1 to 13) of the RS-MMC. Is preferred.

(Embodiment 3)
In the present embodiment, a sales set (sales kit) of various adapters of the RS-MMC card described in the first embodiment will be described.

  (1) FIG. 42 is a perspective view showing a set of the RS-MMC 1 and various adapters.

  As illustrated, the RS-MMC 1, the SD adapter 50, the MS adapter 60, the MSDuo adapter 70, and the USB adapter 80 can be provided to the customer as a set.

  At this time, a plurality of (× N) RS-MMCs in the set may be used. Further, the extender 9 described with reference to FIG. 6 may be included in the set.

  In this way, by providing the customer with RS-MMC and various adapters as a set, it is possible to meet the demand for SD cards, MS cards, or USB-compatible memories, and it is also possible to support various electronic devices. . Further, it is possible to easily cope with data movement (writing, reading) between various electronic devices.

  (2) Further, as shown in FIG. 43, only various adapters may be provided as a set. FIG. 43 is a perspective view showing a set of various adapters.

  The SD type adapter 50, the MS type adapter 60, the MS Duo type adapter 70, and the USB type adapter 80 can be provided to the customer as a set. At this time, the extender 9 described with reference to FIG. 6 may be included in the set.

  By using such an adapter, it is possible to deal with various electronic devices. Further, it is possible to easily cope with data movement (writing, reading) between various electronic devices. In addition, the number of users of the RS-MMC 1 can be increased.

(Embodiment 4)
In the first embodiment, only the wiring and the resistor are provided on the adapter side. However, as shown in FIG. 44, a mode determination command semiconductor chip CH may be provided.

  44 shows the relationship between the external terminals ACn (n: 1 to 10) of the MS type adapter 60, the external terminals Cn (n: 1 to 13) of the RS-MMC 1, and the wiring of the MS type adapter that connects these external terminals. FIG.

  Since the external terminal ACn of the MS type adapter 60 and the external terminal Cn of the RS-MMC 1 have been described with reference to FIG. 21 in (2) of the first embodiment, description thereof is omitted here. Further, regarding the connection relationship between the external terminal ACn and the external terminal Cn, the description of the same part as in FIG. 21 is omitted, and only the different part will be described.

  As illustrated, for example, a semiconductor chip CH is connected between the external terminals AC3 and AC10 of the MS adapter, and the semiconductor chip CH and AC10 are connected via a switch St2. The semiconductor chip CH is connected to the external terminal C13. The switch St2 is a mechanical switch provided on the back surface of the MS-type adapter 60. For example, by mechanically changing the position of the switch, the semiconductor chip CH and the AC 10 are made conductive (electrical). Connected) or in a non-conductive state.

  For example, according to the flowchart shown in FIG. 45, the MS mode writable mode or write inhibit mode can be selected.

  Since steps other than Step 2 and Step 3 can be determined according to the procedure described with reference to FIG. 30 in Embodiment 1, only Steps 2 and 3 will be described here.

  (Step 2) When the write enable / disable determining switch St2 is non-conductive, a write enable mode command is generated in the semiconductor chip CH and transmitted to the external terminal C13. When a writable mode command is input, the MS mode (39) is selected by the mode controller 33 of FIG. 7, and the writable mode is entered.

  (Step 3) When the write enable / disable determining switch St2 is conductive, a write inhibit mode command is generated in the semiconductor chip CH and transmitted to the external terminal C13. When a write inhibit mode command is input, the MS mode is selected by the mode controller 33 in FIG. 7, and the write inhibit mode is entered.

  Next, when there is no response from the external terminal C13, the process proceeds to step 4 in FIG.

  As described above, the pull-down detection unit 35 in FIG. 7 may not be provided, and the mode may be switched depending on the presence or absence of a command transmitted from the adapter-side semiconductor chip CH.

  In such a case, the cost for the semiconductor chip CH is increased as compared with the adapter described in the first embodiment.

  On the other hand, such a command generation mechanism may be provided on the host (electronic device) side to switch modes.

  However, the IC card and the adapter according to the present embodiment have no limitation on the applicable host and can improve versatility compared to such host correspondence.

  Further, it is possible to reduce the cost of the semiconductor chip itself by suppressing the function to a level that the function required for the semiconductor chip CH is only the command generation mechanism.

  Specifically, a complex and large-scale circuit constituting a circuit used for writing or reading an IC card, for example, an I / F controller in various modes, is provided on the RS-MMC side (controller in the RS-MMC). Since it is provided, the semiconductor chip CH of the adapter does not need these.

  Further, if only a command generation circuit is used, the circuits constituting these are simple, and the semiconductor chip CH having these can be formed at a relatively low cost. Therefore, the circuit is mounted in the semiconductor chip CH on the adapter side. But you can make the adapter cheaper.

  Moreover, it is preferable that a simple circuit that is a function common to various adapters (a function necessary for any adapter) is mounted in the semiconductor chip CH on the adapter side. When the semiconductor chip CH can be shared by various adapters, the cost of the semiconductor chip CH can be reduced.

  Further, according to the present embodiment, the semiconductor chip CH is provided in the MS type adapter, but the adapter type using the semiconductor chip CH can be changed as appropriate.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The present invention can be applied to an IC card.

It is the surface view and 1st side view of an IC card which are Embodiment 1 of this invention. It is sectional drawing of the A-A 'part of the back view of the IC card which is Embodiment 1 of this invention, the 2nd-3rd side view, and a back view. It is a surface perspective view of the IC card which is Embodiment 1 of the present invention. It is a back surface perspective view of the IC card which is Embodiment 1 of this invention. It is principal part sectional drawing of the IC card which is Embodiment 1 of this invention. It is a surface perspective view which shows the relationship between the IC card which is Embodiment 1 of this invention, and an extender. It is a block diagram which shows the function of the IC card which is Embodiment 1 of this invention. It is a top perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an SD type | mold adapter. It is a top perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an SD type | mold adapter. It is a top perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an SD type | mold adapter. It is the surface and back surface perspective view of an SD card. It is a back surface perspective view of the SD type | mold adapter which is Embodiment 1 of this invention. It is a principal part top view at the time of mounting | wearing RS-MMC in SD type | mold adapter which is Embodiment 1 of this invention. It is a top view which shows the relationship between the external terminal of SD type | mold adapter which is Embodiment 1 of this invention, the external terminal of RS-MMC, and the wiring of the SD type | mold adapter which connects these external terminals. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MS type | mold adapter. It is a back surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MS type | mold adapter. It is a back surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MS type | mold adapter. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MS type | mold adapter. It is the surface and back surface perspective view of MS card. It is a principal part top view at the time of mounting | wearing RS-MMC in the MS type | mold adapter which is Embodiment 1 of this invention. It is a top view which shows the relationship of the wiring etc. of the external terminal of the MS type | mold adapter which is Embodiment 1 of this invention, the external terminal of RS-MMC, and the MS type | mold adapter which connects these external terminals. It is the surface and back surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to a MSDuo type | mold adapter. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MSDuo type | mold adapter. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to an MSDuo type | mold adapter. It is the surface and back surface perspective view of a MSDuo card. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to a USB type | mold adapter. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to a USB type | mold adapter. It is a surface perspective view which shows the example of an aspect which mounts the IC card (RS-MMC) which is Embodiment 1 of this invention to a USB type | mold adapter. It is a top view which shows the relationship between the external terminal of the USB type | mold adapter which is Embodiment 1 of this invention, the external terminal of RS-MMC, and the wiring in the case part which connects these external terminals. It is a flowchart which shows the determination method (determination procedure) of the mode switching of controller IC of the IC card which is Embodiment 1 of this invention. It is a top view which shows the relationship between the external terminal Cn and a signal when a USB mode I / F controller is selected in the IC card which is Embodiment 1 of this invention. It is a top view which shows the relationship between the external terminal Cn and a signal in case the MS mode I / F controller is selected in the IC card which is Embodiment 1 of this invention. 6 is a plan view showing a relationship between an external terminal Cn and a signal when an MMC / SD mode I / F controller is selected and an SPI mode is selected in the IC card according to the first embodiment of the present invention. FIG. FIG. 6 is a plan view showing the relationship between an external terminal Cn and a signal when an MMC / SD mode I / F controller is selected and a 4-bit mode is selected in the IC card according to the first embodiment of the present invention. 5 is a plan view showing a relationship between an external terminal Cn and a signal when an MMC / SD mode I / F controller is selected and an 8-bit mode is selected in the IC card according to the first embodiment of the present invention. FIG. 5 is a plan view showing a relationship between an external terminal Cn and a signal when an MMC / SD mode I / F controller is selected and a 1-bit mode is selected in the IC card according to the first embodiment of the present invention. FIG. It is the top view which shows the insertion direction of IC card (RS-MMC) which is Embodiment 2 of this invention, and a perspective view which shows the internal terminal shape by the side of an adapter. It is a principal part top view at the time of mounting | wearing RS-MMC in SD type | mold adapter which is Embodiment 2 of this invention. It is a principal part top view at the time of mounting | wearing RS-MMC in the MS type | mold adapter which is Embodiment 2 of this invention. It is the top view which shows the insertion direction of IC card (RS-MMC) which is Embodiment 2 of this invention, and a perspective view which shows the internal terminal shape by the side of an adapter. It is the top view which shows the insertion direction of IC card (RS-MMC) which is Embodiment 2 of this invention, and a perspective view which shows the internal terminal shape by the side of an adapter. It is a perspective view which shows the set of the IC card (RS-MMC) which is Embodiment 3 of this invention, and various adapters. It is a perspective view which shows the set of the various adapters which are Embodiment 3 of this invention. It is a top view which shows the external terminal ACn of MS type | mold adapter which is Embodiment 4 of this invention, the external terminal Cn of RS-MMC, the wiring of the MS type | mold adapter which connects these external terminals, etc. It is a flowchart which shows the determination method (determination procedure) of the mode switching of controller IC of the IC card which is Embodiment 4 of this invention. It is a chart which shows a development company, a brand name, its external dimension, etc. as an example of a standard of a small memory card.

Explanation of symbols

1 IC card (RS-MMC)
3 Chamfered portion 5 Extender mounting portion 7 Groove portion 9 Extender 11 Protrusion portion 13 Corner portion 14 Gold wire 15 Flash memory (chip)
16 IC card chip 17 Controller IC (chip)
19 Base substrate 21 Sealing resin 23 Cap part 31 Flash memory controller 33 Mode controller 35 Pull down detection part 37 USB mode I / F controller 39 MS mode I / F controller 41 MMC / SD mode I / F controller 41a x 1 bit mode 41b × 4 bit mode 41c × 8 bit mode 41d SPI mode 43 IC card chip I / F controller 45 Bus controller 50 SD type adapter 55 Wiring 60 MS type adapter 70 MS Duo type adapter 80 USB type adapter 80a Case part 80b USB terminal part 91 Hook Claw 93 Lock claw ACn, AC1 to AC10 External terminal AD adapter BCn, BC1 to BC10 Internal terminal Cn, C1 to C13 External terminal CH Semiconductor chip N Over de R1, R2 resistors R3 St1 switch St2 switch SP space (space)

Claims (2)

A first standard IC card inserted into an adapter,
Multiple external terminals,
A flash memory chip capable of electrical writing and erasing;
A controller chip for controlling the flash memory chip;
Among the external terminals, a potential level detection terminal whose potential level changes when the adapter is connected to an external device;
Have
The controller chip is in the chip,
A first mode interface controller corresponding to a first standard IC card;
A second mode interface controller corresponding to the second standard IC card;
A third mode interface controller corresponding to a third standard IC card;
A detection unit connected to the potential level detection terminal to detect a change in potential level;
A mode controller that switches to one of the first mode interface controller, the second mode interface controller, and the third mode interface controller according to the detection result of the detection unit;
A flash memory controller for controlling the flash memory chip;
A first wiring connecting the first mode interface controller and the flash memory controller;
A second wiring connecting the second mode interface controller and the flash memory controller;
A third wiring connecting the third mode interface controller and the flash memory controller;
With
When the detection unit detects the first pull-down, the mode controller switches from the first mode interface controller to the second mode interface controller,
The mode controller switches from the first mode interface controller to the third mode interface controller when the detection unit detects a second pull down having a potential different from that of the first pull down. card.   3. The IC card according to claim 2, wherein the first standard is a multimedia card standard, the second standard is a USB standard, and the third standard is a memory stick standard.