JP2009033117A - Heating device and substrate-treating device using the same, method of manufacturing semiconductor device, and penetrating member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heating device having a new holding structure of an electrical heating element, and to provide a substrate-treating device using the heating device, a method of manufacturing a semiconductor device, and a penetrating member. <P>SOLUTION: The heating device comprises: the planar electrical heating element 20 having a cutout or a through hole; a sidewall member 50 that surrounds a heating space 18 and is made of a conductive material; a holding section 30 that is arranged at the side of the heating space 18 in the sidewall member 50 and holds the electrical heating element 20 only by one end; a penetration 40d that projects at the side of the heating space 18 in the sidewall member 50 for arrangement and penetrates the cutout of the electrical heating element 20 or the through hole 40a between one end 20a of the electrical heating element 20 and the other end; and a penetrating member 40 having projections 40b, 40c that project toward a cross direction crossing a direction penetrating from the penetration 40d on the front and rear of the electrical heating element 20 as compared with the penetration 40d and regulates the movement of the electrical heating element 20 to the penetration direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing technique, and more particularly to a heat treatment technique for performing processing in a state in which a substrate to be processed is accommodated in a processing chamber and heated by a heating element, a heating apparatus, a substrate processing apparatus using the same, and a semiconductor device manufacturing method In addition, the present invention relates to a penetrating member.

  FIG. 1 shows a schematic cross-sectional view of a processing furnace 500 using a conventional heating apparatus. The heating device includes a metal casing 501 having a substantially cylindrical shape with an upper end covered, a substantially cylindrical heat insulating material 502 provided inside the casing 501, and a heating wire provided on the inner wall of the heat insulating material 502. 503. A soaking tube 504 and a reaction tube 505 forming a processing chamber are provided inside the heating device, and a desired heat treatment is performed on the wafer 506 in the reaction tube 505.

  In recent years, in the metal wiring process (Cu annealing or the like), a reduction in process temperature (300 ° C. or less) and further improvement in throughput are required. Therefore, it is important to shorten the temperature raising / lowering time of the wafer. However, if the heating device as shown in FIG. 1 responds to such a request, the current heater has a large-capacity heat insulating material so that it can be used in the middle and high temperature range, so the temperature rise / fall characteristics are poor and the throughput is improved. It was difficult. Therefore, there is a need for a highly responsive heating device with a small heat capacity.

  Further, in the substrate processing apparatus according to Patent Document 1, rapid cooling is enabled by passing a plurality of pins through a heating element and feeding a cooling gas from the pins into the heating space. And the responsiveness of a heating apparatus is improved by paying attention to a cooling characteristic.

  In the substrate processing apparatus according to Patent Document 2, the heater unit includes a heating element laid so as to surround the processing chamber, a first reflector laid so as to surround the heating element, and the first reflector. A second reflector laid so as to surround and surround the outside is provided to improve the heating and cooling efficiency of the processing chamber.

However, in any of the conventional techniques, improvement in throughput is insufficient, and a more appropriate holding structure for the heating element is required.
WO2007 / 023855 JP 2004-311648 A

  In view of the conventional situation, an object of the present invention is to provide a new heating element holding structure.

  In order to achieve the above object, the heating device according to the present invention is characterized by a plate-like heating element having a notch or a through hole, a side wall material made of a conductive material surrounding the heating space, and the side wall material. A holding part that is arranged on the heating space side and holds the heating element only at one end, and is arranged to protrude to the heating space side of the side wall material, and is formed between the one end and the other end of the heating element. Alternatively, with respect to a through portion that penetrates the through hole and a crossing direction that intersects with the direction penetrating from the through portion, the protrusion protrudes on the front and back of the heating element from the penetration portion, and the movement of the heating element with respect to the penetration direction is restricted And having a penetrating member having a protruding portion.

  According to the characteristics of the substrate processing apparatus according to the present invention, since the sidewall material is made of a conductive material, the heat capacity is small and the throughput can be improved. In addition, by restricting the movement of the heating element, particularly the movement of the intermediate part, with respect to the penetrating direction, the heating element, particularly the intermediate part, does not contact the side wall material.

  Other objects, configurations, and effects of the present invention will become apparent from the following embodiments of the present invention.

Next, the present invention will be described in more detail with reference to the accompanying drawings as appropriate.
Hereinafter, a first embodiment as the best mode for carrying out the present invention will be described with reference to the drawings.

  As shown in FIGS. 2 to 7, the substrate processing apparatus 1 generally includes a reaction vessel 309 that forms a processing chamber 308, a heating device 3 disposed on the outer periphery of the reaction vessel, and a main controller 4. Yes.

  The heating device 3 generally includes a ceiling portion 10, a cylindrical intermediate portion 11, a lower portion 12, and a terminal case 13, and a heating element 20 is supported on the intermediate portion 11. The ceiling portion 10 is formed with an elbow-shaped exhaust conduit 81 that opens to the lower surface and the side surface, and further includes a reflection device 90 at the lower portion thereof. The intermediate portion 11 surrounds the inner shell 50 that supports the heating element 20 with the outer shell 60 in an insulated state, and further surrounds the outer periphery with a decorative panel 70. The inner shell 50 and the outer shell 60 are made of a conductive material, for example, a metal material such as a stainless steel material.

  A cooling gas introduction duct 7y is attached between the upper part of the intermediate part 11 and the intake attachment 7x. For example, a butterfly valve is attached as an opening / closing valve 7a to the opening of the intake attachment 7x so that the flow path can be opened and closed. The intake attachment 7 x is connected to the cooling gas supply line 7. An air passage 14 is formed between the inner shell 50 and the outer shell 60 as a cylindrical cooling medium circulation passage. The cooling gas introduction duct 7y communicates with the airway 14 by a plurality of pipes 61 that are arranged substantially equally in an annular shape. On the other hand, a forced exhaust line 8 having an exhaust blower 8 a that performs forced exhaust is connected to the exhaust conduit 81, and forced exhaust of a heating space that is an internal space of the heating device 3 is performed. A gas such as air or an inert gas introduced from the cooling gas supply line 7 is supplied as a cooling gas to the heating space 18 from the airway 14 and a plurality of insulator holes described later, and is exhausted from the forced exhaust line 8.

  The reaction vessel 309 includes a soaking tube 315 and a reaction tube 310 that are sequentially arranged concentrically in the heating space 18, and a processing chamber 308 is formed in the reaction tube 310. The processing chamber 308 stores a boat 300 that holds wafers 305 in multiple horizontal stages. The boat 300 can be loaded into and pulled out from the processing chamber 308 by a boat elevator (not shown).

  In the reaction tube 310, a reaction gas introduction tube 5x and an exhaust tube 6x are communicated. The reaction gas introduction pipe 5x is provided with a flow rate controller 5a, and the exhaust pipe 6x is provided with a pressure controller 6a. The reaction gas is introduced at a predetermined flow rate, and the internal gas is exhausted from the exhaust port 6y so that the inside of the reaction tube 310 is maintained at a predetermined pressure, and is discharged out of the processing chamber through the exhaust pipe 6x.

  The other cooling gas supply line 5 y is communicated with a soaking tube inner space 317 formed between the soaking tube 315 and the reaction tube 310. The cooling gas supply line 5y is provided with a flow rate controller 5b. The intake attachment 7x is provided with an open / close valve 7a. The forced exhaust line 8 is provided with an exhaust blower 8a as an exhaust device. That is, it is possible to introduce and adjust the cooling gas as appropriate to both the soaking tube inner space 317 and the heating space 18.

  The heating element 20 is divided into a plurality of zones Z1 to Z5 as required with respect to the axial direction of the cylinder of the intermediate portion 11, and zone control is possible. Each zone is provided with a temperature detector that detects the heating temperature of each zone. Note that the heating element 20 may have the same calorific value in each zone by making the molding pattern of each zone the same.

  Each part of the substrate processing apparatus 1 is controlled by the main controller 4. For example, the processing state of the wafer 305 processed in the reaction tube 310 is controlled by the main controller 4. The main controller 4 includes a temperature monitor 4a, a heating controller (heating controller) 4b, a reflection controller 4c, a first flow controller 4d, a pressure controller 4e that controls the pressure in the reaction tube 310, and a second A flow control unit 4f, an exhaust control unit 4g, and a drive control unit 4h for controlling mechanical units such as the boat elevator are provided.

  The temperature monitor unit 4a detects the temperatures of the first to third temperature detectors TC1 to TC3. Here, the first temperature detector TC1 is provided for each of the zones Z1 to Z5 in the vicinity of the heating element 20. The second temperature detector TC2 is provided for each of the zones Z1 to Z5 in the peripheral portion in the reaction tube 310. Further, the third temperature detector TC3 is provided above the reaction tube 310 or in a range including the upper center of the reaction tube 310.

  The heating control unit 4b controls the amount of heat generated by the heating elements 20 in the zones Z1 to Z5 based on the detection result of the temperature monitoring unit 4a. Further, the reflection control unit 4c controls the actuator 99 as a driving device of the reflection device 90 based on the detection result of the temperature monitor unit 4a. Then, the reflector (reflector) 91 having a mirror-finished lower surface is appropriately tilted to change the light collection degree from the heating element 20 to the upper center of the reaction tube 310, and the temperature of the same part is controlled.

  The first flow rate control unit 4d controls the flow rate controller 5a, and the pressure control unit 4e controls the pressure controller 6a to control the introduction of the reaction gas and the pressure. The second flow rate control unit 4f controls the flow rate controller 5b, and the exhaust control unit 4g controls the opening / closing valve 7a and the exhaust blower 8a to control introduction and discharge of the cooling gas.

  FIG. 4 shows an enlarged view of portion A in FIG. The heating element (heater wire) 20 is fixed to the inner shell 50 by a hanging insulator 30 as an insulating material such as alumina. The heating element 20 is made of a heat-generating material that can be rapidly heated, such as an Fe-Al-Cr alloy, and has a cross-sectional shape such as a flat plate so as to increase the heat-generating surface area. It is configured. The heating element 20 has meandering folded portions 21 and 22 above and below, and an intermediate portion includes a strand portion 23 that connects the upper folded portion 21 and the lower folded portion 22 with a half-pitch shift, and each strand. It is comprised from the clearance gap 24 located between the parts 23. FIG. Further, the upper portion of the heating element 20 is bent as a bent portion 20 a held by the hanging insulator 30. The inner surface of the inner shell 50 is mirror-finished, and heat rays radiated from the rear surface of the wire portion 23 of the heating element are reflected by the inner surface and radiated from the gap 24 toward the heating space 18.

  The hanging insulator 30 as an insulating material includes an upper insulator 31 and a lower insulator 32 made of a heat-resistant insulating material such as alumina, and the pin 35 is sandwiched between the upper metal member 33 and the lower metal member 34 with the bent portion 20a at the upper part of the heating element 20 interposed therebetween. It is fixed by welding. The lower metal fitting 34 is attached to the inner shell 50 by bolts 36 at two bent portions.

  The inner shell 50 has a through hole 40a in the center, and a plurality of quench pipes 40 for supplying the cooling gas in the air passage 14 into the inner shell 50 protrude from the inner wall of the inner shell 50 toward the heating space 18 side. Is provided. The quench pipe 40 is made of an insulating heat resistant material such as alumina. The quenching pipe 40 includes a through portion 40d that penetrates the heating element 20 in the gap 24, and a protruding portion that protrudes from the through portion 40d in a direction that intersects the penetration direction V in which the penetration portion 40d penetrates the heating element 20. The movement of the middle of the heating element 20 is limited by the substantially circular ridges 40b and 40c. That is, a groove is formed in the through portion 40d between the pair of flanges 40b and 40c. Furthermore, the lower end of the heating element 20 is provided at a position overlapping the upper end position of the lower hanging insulator 30 to limit the movement of the lower end of the heating element 20 in the penetration direction of the quench pipe 40.

  On the back surface of the inner shell 50, a water cooling pipe 59 as a cooling medium circulation passage is provided. The water-cooled tube 59 is wound around the outer surface of the inner shell 50 in a spiral manner in the axial direction and welded. For example, by flowing a cooling medium such as cooling water through the supply / drainage paths 59a and 59b, the temperature of the inner shell 50 is prevented from rising and kept almost constant.

  The outer shell 60 is attached to the outside of the inner shell 50 in an insulated state via a plurality of connecting insulators 51. Since the connecting insulator 51 is made of an alumina material having insulation and heat resistance, even if the heating element 20 and the inner shell 50 are unexpectedly brought into contact with each other and a current is transmitted to the inner shell 50, for example, the connection insulator 51 is connected. The insulator 51 does not transmit current to the outer shell 60.

  The inner side of the connecting insulator 51 is fixed to the inner shell 50 with a first bolt 52. On the other hand, the outer side of the connecting insulator 51 is fixed to the outer shell 60 with a second bolt 54 via an annular hollow collar 53 as an insulating heat resistant material. The collar 53 is provided through the outer shell mounting hole, is formed thicker than the thickness of the outer shell 60, and provides a clearance (gap) between the lower surface of the head of the second bolt 54 and the outer surface of the connecting insulator 51. Yes. Even if the inner shell 50 swells due to thermal expansion, the amount of deformation is absorbed by this clearance to prevent thermal stress from acting on the outer shell 60 and to prevent deformation of the outer shell 60.

  On the outer side of the outer shell 60, a decorative panel 70 is provided as a side wall outer layer which is an outermost shell through a column 62. The decorative panel 70 is provided with an opening 61a communicating with the cylindrical airway 14 at the upper part of the outer shell 60 through a pillar 62 having a flange, for example, by a metal rivet 62a. One end of the pipe 61 is welded to 61a. The pipe 61 penetrates the decorative panel 70, and the other end communicates with the cooling gas introduction duct 7y. In addition, the pillar 62 and the decorative panel 70 are comprised from the material which has electroconductivity, for example, is comprised from metal materials, such as stainless steel material. For this reason, the decorative panel 70 and the outer shell 60 are connected in a conductive state via the pillar 62. In addition, by preventing the conduction to the outer shell 60 and the decorative panel 70 as described above, the conduction to the entire substrate processing apparatus is prevented, and an electric shock at the time of work and the electrical components in the substrate processing apparatus are prevented from being damaged.

  As shown in FIG. 4, the inner shell 50 is divided into a plurality of parts in the vertical direction. A gap 50 s is provided between the divided upper shell and the lower shell adjacent thereto. And between the 1st flange 50t provided in the upper shell which is an upper shell among the inner shells 50, and the water cooling pipe 59 of a lower shell, the heat insulation blanket 50a which consists of heat insulation members, such as a ceramic fiber, is interposed, and gap The heat escape from 50s is prevented, and the upper and lower shells are thermally divided.

  As shown in FIG. 7, at the lower part of the intermediate part 11, a heat insulation and a heat insulation blanket as an insulation member are provided between the second flange 50 x projecting outside the inner shell 50 and the third flange 60 x projecting inside the outer shell 60. 50y is interposed. Thereby, the inner shell 50 and the outer shell 60 are insulated from each other and kept airtight by the heat insulating blanket 50y. Further, a heat insulating blanket 60y as a heat insulating member is provided between the third flange 60x and the bottom lid 72a to keep the inner shell 50 internal space airtight. A structure having the same concept is also adopted between the intermediate portion 11 and the ceiling portion 10 to maintain an insulating state and an airtight state. The lower part of the lowermost heating element 20 is supported by a quenching pipe 42 provided separately from the quenching pipe 40 that restricts the movement of the middle of the heating element 20.

  Next, the heating element 20 and its holding structure or support structure will be described with reference to FIGS. 4 to 6 and 8 to 12.

  FIG. 8 shows a state of the heating element 20 ′ after punching and before bending, and FIG. 9 shows the heating element 20 after bending. The meandering upper folded portion 21 of the heating element 20 has a rectangular shape and is turned into a holding folded portion 20a by bending. It is possible to limit movement by a protrusion 32d described later, prevent disconnection / short circuit of the heating element, and extend the life.

  On the other hand, the lower folded portion 22 of the heating element is arcuate with a band width equal to or greater than that of the middle part of the wire to save the mass of the wire portion 23. Thereby, the heat capacity of the whole heat generating body 20 is reduced, and the responsiveness of the whole heat generating body 20 is improved.

  As shown in FIGS. 4 to 6 and 10 to 12, the upper insulator 31 and the lower insulator 32 constituting the suspension insulator 30 are provided with pin penetration holes 31 a and 32 a, respectively, and convex portions on the outer lower surface of the upper insulator 31. 31b and the recessed part 32b of the outer upper surface of the lower insulator 32 are fitted. Thereby, a gap is formed between the inner lower surface 31c of the upper insulator 31 and the inner upper surface 32c of the lower insulator 32 so as to sandwich the previous bent portion 20a. The upper insulator 31 is held so that the inner edge portion 31d protrudes downward and prevents the bent portion 20a from being dropped.

  The lower insulator 32 is provided with a substantially quadrangular prism-shaped protrusion 32d, and the inner upper surface 32c is positioned on both sides of the protrusion. A plurality of lower insulators 32 are penetrated by the pins 35 at intervals, and a bent portion 20a is disposed between adjacent inner upper surfaces 32c. The heating element 20 is disposed along the arc direction R of the inner surface of the cylindrical inner shell 50. However, the movement of the arcuate direction R is restricted by the ends of the bent portion 20a coming into contact with the projection 32d. Is done. Moreover, since the hanging insulator 30 is intermittently arranged with respect to the arc direction R, the overall heat capacity is reduced by reducing the total amount of the insulator having a large heat capacity, and the responsiveness of the entire heating element 20 is improved. ing.

  The quench pipe 40 protrudes in a penetration direction V that is orthogonal to the inner surface of the inner shell 50 and that penetrates the heating element 20. And the movement of the middle part of the above-mentioned heat generating body 20 is restrict | limited by the collars 40b and 40c. Furthermore, the movement of the lower end 22 of the heating element 20 in the penetrating direction V is restricted by arranging the lower end 22 of the heating element 20 at a position overlapping the upper end position of the lower hanging insulator 30. That is, the rapid cooling pipe 40 restricts convex deformation and concave deformation in the heating device radial direction of the heating element 20 in the middle of the vertical direction, and the hanging insulator 30 restricts concave deformation at the lower end of the strand. The inner shell 50 as the side wall material is made of a metal material such as stainless steel having a small heat capacity, and can fix the heating element 20 that can be used in an air atmosphere in an insulated state. Note that most of the conductive materials are low heat capacity materials such as metals, and most of the non-conductive materials are high heat capacity materials such as alumina and quartz. 3 is further improved.

  It is desirable that the upper metal member 33 and the lower metal member 34 of the hanging insulator 30 are continuous in the arc direction R in terms of rigidity. However, in order to prevent thermal deformation due to thermal expansion during heating of the heating element 20, it is also necessary to divide. Therefore, the upper metal member 33 and the lower metal member 34 are divided for each appropriate number of hanging insulators 30 to keep the gap 34a between the lower metal members 34 due to thermal expansion to a minimum while maintaining the torsional rigidity. Further, the torsional rigidity is further improved by straddling the upper metal fittings 33 between the lower metal fittings 34.

  Next, the structure of the lower part 12 will be described with reference to FIG. The heating element 20 is prevented from approaching the lower folded portion 22 to the inner shell 50 by a lower hanging insulator 30. On the other hand, this hanging insulator does not exist for the lowermost heating element 20. Therefore, in this lowermost stage, a quenching pipe 40 is provided in the middle of the heating element 20 at the same position as described above to suppress deformation of the middle part, and another quenching pipe 42 is also provided in the lower folded portion 22 of the heating element 20. Proximity to the inner shell 50 with respect to the penetrating direction V of the lower folded portion 22 and separation deformation are prevented. In addition, although both the quenching pipes 40 and 42 use the same kind of member, you may use a different thing.

  By the way, in the configuration of FIG. 7, when only the lower quenching pipe 42 is used, deformation of the lower end of the heating element 20 can be restricted, but convex deformation and concave deformation of the middle of the heating element 20 cannot be suppressed. . If the middle of the heating element 20 is convexly deformed toward the heating space 18, there is a risk of contact with the reaction vessel. Further, if the middle of the heating element 20 is concavely deformed, there is a risk of a short circuit due to contact with the inner shell 50 (for example, a short circuit such as a current being transmitted to the inner shell). On the other hand, when only the middle quenching pipe 40 is used, if the lower end of the heating element 20 is concavely deformed, there is a risk of short circuit due to contact with the inner shell 50. Furthermore, if the heating element 20 is frequently convex or concavely deformed by these behaviors, the risk of disconnection increases due to thermal stress, leading to a reduction in the lifetime of the heating element. The configuration shown in FIG. 7 solves these problems. Note that the structure of FIG. 7 using the above-described two quench pipes is not limited to the lowermost stage, and may be applied to a heating element at any position. However, in order to improve the degree of integration of the heating elements 20 with respect to the support direction (vertical direction) of the heating elements 20, it is desirable to prevent the lower folded portion 22 from approaching the inner shell 50 by the lower hanging insulator 30. . Also, from the viewpoint of heat capacity, it is better to reduce the usage of the quench pipe (insulator) by preventing the lower folded portion 22 from approaching the inner shell 50 by the one lower hanging insulator 30.

  As shown in FIGS. 2 and 4, in this embodiment, nine stages of heating elements 20 are provided in the vertical direction, the inner shell 50 is divided into three parts in the vertical direction, and each divided body holds the heating elements 20 in three stages. . A gap 50 s is provided between the inner shells 50 to absorb elongation due to thermal expansion. In addition, the cooling gas closes the gap 50s with a heat insulating blanket 50u as a heat insulating material so that the cooling gas is not supplied into the heating space 18 from the gap 50s. In the present embodiment, a flange 50t is provided at the lower end of the inner shell 50, and a heat insulating blanket 50u is sandwiched between the water-cooled pipe 59 located at the uppermost stage of the lower inner shell 50 and the flange 50t, thereby closing the gap 50s. Yes. According to this configuration, the heat insulation blanket 50 u can absorb expansion / contraction of the inner shell 50 due to its elasticity, and the airtightness between the inner shell 50 and the heating space 18 can be maintained.

  Here, the through hole 40a of the quench pipe 40 rapidly cools the reaction vessel 309 and, in turn, the wafer therein. However, since the gap 50s has less conductance than the quench pipe 40, most of the cooling gas leaks from the gap 50s to the heating space. In addition, the gap 50 s is located between the divided parts of the inner shell 50 and is separated from the reaction vessel 309 than the outlet of the quench pipe 40. In particular, since a heating element exists in front of the reaction vessel 309, cooling to the reaction vessel 309 becomes inefficient. In order to prevent this, a structure for closing the gap 50s is necessary. In this structure, the upper and lower ends of the gap 50s may be provided with the flange 50t or the water-cooled pipe 59, but one of the flanges and the other of the water-cooled pipes is superior in terms of structure without waste.

  In the vicinity of the gap 50s, the water-cooled tube 59 cannot always be disposed at an appropriate position for uniform cooling. Therefore, the inner shell is not divided and provided for each stage of the heating elements 20 stacked in the upper and lower nine stages, but a plurality of stages of the heating elements 20 are supported by one divided body of the inner shell 50, and the temperature between the wafers is increased. The occurrence of deviation is suppressed. Since this point and the amount of expansion due to thermal expansion are relatively small and the problem of gaps can be solved, in this embodiment, the three-stage heating elements 20 are supported by each divided body. In addition, since one system is provided for each divided body, there are three water-cooled pipes as a whole. However, as long as temperature control is possible, the entire three-divided body may be one system or a different number of systems.

Next, the operation of the substrate processing apparatus 1 will be described.
In the processing of the wafer 305, the boat 300 loaded with the wafer 305 is loaded into the reaction tube 310 by a boat elevator and rapidly heated to a predetermined temperature by the heating device 3. While the wafer 305 is heated to a predetermined temperature by the heating device 3, a reaction gas is introduced from the reaction gas introduction pipe 5 x, exhaust gas is discharged through the exhaust pipe 6 x, and a necessary heat treatment is performed on the wafer 305. Made.

  Usually, the temperature of the boat 300 is kept at a required temperature, for example, 550 ° C. before the boat 300 is charged. After the boat 300 is charged, the temperature is raised to a wafer processing temperature, for example, 850 ° C. In addition, the temperature before loading and the processing temperature are appropriately selected according to the processing content in the substrate processing apparatus.

  The heating element 20 at each stage of the heating element 20 is measured for each independent zone by the temperature monitor unit 4a, and the temperature is controlled by the heating element 20 and the reflection device 90. Since the heating element 20 in each zone is one continuous heating element, if there is an abnormality in the heating element 20, for example, if there is a disconnection, it can be detected immediately, and the deterioration state of the heating element in each stage can be easily found. I can grasp it.

  When the process is complete, it is rapidly cooled to the wafer exit temperature, eg, 550 ° C. For the cooling after the processing of the wafer 305, the flow rate controller 5a and the air valve 7a are opened, and an inert gas such as air or nitrogen gas is supplied from the cooling gas supply lines 5y and 7 as a cooling gas. The cooling gas supplied from the cooling gas supply line flows into the heating space 18 through the through hole 40a of the quenching pipe 40, and cools the heating element 20 from both the outer surface and the inner surface.

  In such a configuration using the cooling pipe 40, the cooling rate of the heater, and thus the cooling rate of the wafer can be improved, and the throughput of the wafer processing can be improved. Further, since the cooling pipe 40 serves as both a heating element presser and a cooling gas supply pipe, it is not necessary to provide a separate gas pipe for cooling the heater, so that the area of the heating element on the inner wall of the heater can be improved. Furthermore, since the opening part of the through-hole 40a of the cooling pipe 40 is opened inside the heat generating body 20, the heat generating body 20 is prevented from being locally cooled by the cooling gas. As a result, local deformation, twisting, and cracking of the heating element 20 can be suppressed, and further, disconnection of the heating element 20 and contact with the reaction tube 310 can be prevented.

  The cooling gas introduced into the cylindrical air passage 14 is dispersed through the cooling gas introduction duct 7y having a large volume, so that the cooling gas uniformly flows into the air passage 14 and the occurrence of uneven cooling is prevented. Thereafter, the cooling gas is blown into the heating space 18 through the plurality of pipes 61, the airway 14, and the plurality of quenching pipes 40, and rises in the heating space 18 and is exhausted from the exhaust conduit 81. The inner surface of the inner shell 50 is cooled by the cooling gas rising in the heating space 18, and the soaking tube 315 and the reaction tube 310 are rapidly cooled by the cooling gas rising in the heating space 18 and the soaking tube inner space 317. As a result, the wafer 305 in the reaction tube 310 is rapidly cooled. By adopting a heating element such as Fe—Cr—Al, carbon, or SiC as the heating element 20, rapid heating and high temperature heating are possible, and further rapid cooling is possible by cooling the heating device 3 with a cooling gas. .

  When the cooling is completed, the boat 300 is lowered by the boat elevator, and the processed wafer 305 is discharged from the boat 300. In the case of the decompression process, the boat 300 is lowered after returning the reaction chamber to atmospheric pressure.

This specification includes the following inventions.
1) A heating device used in a substrate processing apparatus for processing a substrate, which is a plate-like heating element having a notch or a through hole, a side wall material made of a conductive material surrounding a heating space, and heating of the side wall material A holding portion (holding body) for the heating element arranged on the space side, and a penetrating member that protrudes to the heating space side of the side wall member and penetrates the notch or the through hole, The heating element is held only at one end, and the penetrating member has a penetrating part (penetrating part) penetrating the notch or the through hole of the heating element at an intermediate part (intermediate part) between one end and the other end of the heating element. And a protrusion that protrudes on the front and back of the heating element relative to the crossing direction intersecting the penetrating direction and restricts the movement of the heating element in the penetrating direction.

  2) A heating element having a meandering folded structure, a conductive inner wall, a first insulator provided perpendicular to the inner wall, and a second insulator provided perpendicular to the inner wall The folded portion (folded portion) at the upper end of the heating element is attached to the first insulator, and the second insulator is inserted into the folded portion at the lower end of the heating element. A substrate processing apparatus, a heating apparatus, and a heating element holding structure configured to limit the movement of the heating element with two ridges provided perpendicular to the second insulator.

  3) A processing chamber for storing and processing the substrate, and a heating element for heating the substrate in the processing chamber. The heating element is a first inner cylindrical member located outside the heating element and the heating element. A first inner shell and a second inner shell, and the first and second inner shells are stacked in a state where a predetermined gap is provided, and the first hook is disposed at the lower end of the first inner shell. The substrate processing which provided and provided the 2nd ridge at the upper end of the 2nd inner shell located in the lower stage of this 1st inner shell, and has arranged the member which has elasticity between this 1st and this 2nd ridge Device, heating device and heating element holding structure. The second rod is preferably a water-cooled tube for cooling the inner shell.

  4) A processing chamber for storing and processing the substrate, and a heating element for heating the substrate in the processing chamber, and a suspension insulator supported by sandwiching the upper end of the heating element, and inserted into the lower end of the strand, A substrate processing apparatus, a heating apparatus, and a heating element holding structure that are held by two insulators having two ridges that suppress uneven deformation of the heating element.

  5) It has a processing chamber for storing and processing the substrate, and a heating element for heating the substrate in the processing chamber. The heating element is folded in a meandering shape, and its upper end is held by an insulator. A substrate processing apparatus having a heating element, a heating apparatus, and a holding structure for the heating element, wherein the bent portion at the upper end of the substrate is formed in a square shape and movement in the circumferential direction is restricted by a protrusion provided inside the insulator.

  6) A side wall formed in a cylindrical shape and a plate-shaped heating element having a plurality of gaps, the inner surface of the side wall being finished so as to be able to reflect heat rays, and the heating element is arranged along the cylindrical inner surface of the side wall The heating element surface of the heating element radiates heat rays toward the heating space, and the heating ray radiated from the back surface of the heating element portion is reflected by the inner surface and passes through the gap to be radiated to the heating space. Apparatus, substrate processing apparatus, and heating element holding structure. In this structure, the width of the gap 24 is sufficiently larger than the width of the strand portion 23, so that the heat rays reflected from the inner surface can be effectively used. If a gap is formed along the cylindrical central axis and the upper side of the central axis is supported by the holding member, the radiant heat can be effectively used and the surface density of the heating element can be improved. It is possible to improve the thermal responsiveness. Further, by making the cylindrical inner surface a concave curved surface, it is possible to improve the efficiency with which the reflected heat rays are radiated into the heating space through the gap, and it is desirable that the concave curved surface is an arc surface. .

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.

  13 to 17 illustrate modified examples 43 to 47 of the quench pipes 40 and 42 as penetrating members. These quench pipes 43 to 47 are made of a heat-resistant insulating material such as alumina.

  A quench pipe 43 as a second modified example shown in FIG. 13 is provided with a large-diameter portion 43c having substantially the same diameter as the flange 43b up to the inner shell 50, and the through portion 43d penetrates the gap 24 of the heating element 20. The wall thickness ta of the large-diameter portion 43c is thicker than that in the above embodiment, and prevents the cooling gas passing through the through-hole 43a from being heated by the atmosphere outside the large-diameter portion 43c. Therefore, a cooling gas having a lower temperature can be ejected from the through hole 43a.

  In the quench pipe 44 as a third modified example shown in FIG. 14, an outer tube 44c having the same diameter as the flange 44b is extrapolated to a small diameter portion 44x having the same diameter as the through portion 44d. The total thickness ta of the small-diameter portion 44x and the outer tube 44c is formed to be thicker than that in the above embodiment, and has the same effect as the second modified example.

  In the quench pipe 45 as the fourth modified example shown in FIG. 15, the flange 45b and the large-diameter portion 45c of the wall thickness ta have the same diameter, and a through portion 45d is formed by left and right cuts. The through portion 45d is inserted from the gap 24 on the upper folded portion 21 side. The thin portion of the through-hole 45d having a thickness tb is small, and heating of the cooling gas can be more reliably prevented.

  In the quench pipe 46 as the fifth modified example shown in FIG. 16, the flange 46b and the large diameter portion 46c have the same elliptical shape as viewed in the axial direction of the through hole 46a. The minor axis of the ellipse is narrower than the gap 24, and the flange 46b can pass through the gap with the major axis oriented in the longitudinal direction of the gap 24. The through portion 46d has substantially the same diameter as the short axis. Further, by rotating the long axis about 90 degrees after passing through the gap 24, the position of the heating element 20 can be regulated with respect to the orthogonal direction by the flange 46b and the large diameter portion 46c. That is, the attachment of the quench pipe 46 to the inner shell 50, the attachment of the heating element 20 to the suspension insulator 30, and the attachment of the heating element 20 to the quench pipe 46 can be performed in separate steps.

  A support rod 47 as a sixth modification shown in FIG. 17 allows a small diameter portion 47 b protruding from a large diameter portion 47 a fixed in the orthogonal direction of the inner shell 50 to pass through the hole 23 a of the heating element 20. And the movement of the heat generating body 20 is controlled by inserting the wedge 47d into the small hole 47c formed in the small diameter portion 47b.

  18 and 19 illustrate still another modified example (seventh modified example) of the quench pipes 40 and 42 as penetrating members. The quench pipe 48 as a seventh modified example is provided with a substantially circular flange 48c as a protruding portion protruding from the penetrating portion 48d only on the inner shell 50 side (heating element 20 back side) as a side wall material from the heating element 20. It is. By providing the flange 48c on the inner shell 50 side of the heating element 20, thermal deformation of the heating element 20 toward the inner shell 50 side can be prevented, and a short circuit due to contact with the inner shell 50 can be prevented.

  Conventionally, in consideration of contact with the side wall material due to thermal deformation of the heating element, the side wall material has been formed of an insulating material or a heat insulating material. However, since these materials have a large heat capacity, the responsiveness of the heating device has been reduced. By providing the protruding portion on the side wall material side of the heating element, it is possible to prevent thermal deformation of the heating element toward the side wall material side, and it is possible to configure the side wall material with a metal material having a small heat capacity. As a result, the heat capacity of the side wall can be reduced, and the responsiveness of the heating device can be further improved.

  Moreover, since no ridges are provided as protruding portions that protrude on the surface of the heating element 20 (on the heating space 18 side), it is easy to manufacture a quench pipe. Furthermore, since no soot is located on the surface side of the heating element 20, the heating efficiency is also improved. In addition, since the heating element 20 does not have to be sandwiched from the front and back by a pair of scissors, the assembly work is facilitated.

  By the way, only the upper end of the heating element 20 is held by the holding unit 30, and the lower end 22 of the heating element 20 is suspended from the upper end 21 so as to be separated from the inner shell 50 and inclined more than the vertical posture. With this configuration, even if thermal deformation occurs in the heating element 20, the heating element 20 is pressed against the side wall surface by the action of gravity, and the heating element 20 is unlikely to warp toward the heating space.

  In the other modified examples described above, the protruding portion may be provided only on the inner shell 50 side. Moreover, it is also possible to use suitably combining the penetration member which provided the protrusion part in the front and back of a heat generating body, and the penetration member which provided the protrusion part in the side wall material side from a heat generating body.

  Although the reaction vessel has been described as including both the soaking tube and the reaction tube, the reaction vessel may include only the reaction tube without including the soaking tube. In addition, you may be comprised not only in a double pipe but in the number of pipes of 1 pipe or a triple pipe or more.

  The heat treatment is not limited to oxidation treatment, diffusion treatment, and diffusion, but is not limited to carrier activation after ion implantation and reflow and annealing treatment for planarization, and may be heat treatment such as film formation treatment. The substrate is not limited to a wafer, but may be a photomask, a printed wiring board, a liquid crystal panel, an optical disk, a magnetic disk, or the like. The present invention is not limited to batch-type heat treatment apparatuses and single-wafer-type heat treatment apparatuses, and can be applied to all semiconductor manufacturing apparatuses provided with a heater unit. The inner shell 50 and the mirror finish portion of the reflector 91 may be mirror-finished by polishing stainless steel, or may be plated with a noble metal such as gold or platinum.

The embodiment of the present invention is configured as described above, but may be more comprehensively configured as described below.
The first aspect of the heating device according to the present invention is a plate-like heating element having a notch or a through-hole, a side wall material made of a conductive material surrounding the heating space, and a heating space side of the side wall material. A holding portion that holds the heating element only at one end, and protrudes toward the heating space of the side wall member, and has a notch or a through-hole in the heating element between one end and the other end of the heating element. A penetrating portion that penetrates, and a projecting portion that projects on the front and back of the heating element from the penetrating portion with respect to a crossing direction that intersects the direction penetrating from the penetrating portion, and restricts the movement of the heating element in the penetrating direction; And a penetrating member.
In addition, a second aspect of the heating device according to the present invention is a plate-like heating element having a notch or a through hole, a side wall material made of a conductive material surrounding the heating space, and a heating space for the side wall material. A holding part that holds the heating element at one end only, and protrudes toward the heating space side of the side wall member, and is notched or penetrated between the one end and the other end of the heating element. The penetrating part that penetrates the hole and the crossing direction that intersects the direction penetrating from the penetrating part protrude from the penetrating part on the side wall material side of the heating element, and move the heating element to the side wall material side. And a penetrating member having a protruding portion to be regulated.
In the first and second aspects, the protrusion may be formed in a bowl shape. Further, a plurality of the through members are provided for at least one notch or one through hole of the heating element, and at least one of the penetrating members is provided at the lowermost step portion of the notch or one through hole of the heating element. It is good to provide.
Said 1st aspect WHEREIN: You may provide the said protrusion part from the back surface side of the said heat generating body to the said side wall material. In the second aspect, the protruding portion may be provided from the side wall material side of the heating element to the side wall material. In these embodiments, the protruding portion may be provided separately from the penetrating portion. And it is desirable that a groove is formed in the penetrating portion and the protruding portion is provided in the groove. In addition, the protruding portion is formed in an elliptical shape, the short axis side of the elliptical shape is narrower than the width of the notch or the through hole of the heating element, and the long axis side of the elliptical shape is the width of the notch or the through hole of the heating element. You may form more widely. Further, a hole may be formed in the through portion, and the protruding portion may be formed in a wedge shape and inserted into the hole. In the second aspect, the heating element may be held inclined with respect to the vertical direction so that the other end is located on the heating space side from the one end. Thereby, even if thermal deformation occurs in the heating element, the heating element can be guided to move to the protruding portion by gravity, and the movement toward the heating space can be suppressed.
Further, a third aspect of the heating device according to the present invention is a heating element that is folded in a meandering shape, the upper bent portion is formed in a square shape, and the lower bent portion is formed in an arc shape, and the heating element The insulator has a protrusion that holds both ends of the bent portion of the adjacent upper end of the heating element. A fourth aspect of the heating device according to the present invention includes a heating element, a cylindrical inner shell that is located outside the heating element and has a first flange at the lower end, and the outside of the heating element. And a cylindrical inner shell provided with a second ridge at the upper end, and a stretchable member provided between the first ridge and the second ridge.
In the substrate processing apparatus according to the present invention, in each of the first to fourth heating apparatuses, a reaction vessel for processing a substrate is provided in the heating space inside the heating apparatus.
A first aspect of a method for manufacturing a semiconductor device according to the present invention includes a step of carrying a substrate into a reaction vessel, a heating plate-like heating element having a notch or a through-hole, and a conductive material surrounding a heating space. A side wall member configured to be disposed on the heating space side of the side wall material, and holding the heating element only at one end; and protruding from the heating space side of the side wall member, and one end of the heating element Projecting on the front and back of the heating element rather than the penetrating part with respect to the crossing direction intersecting the direction penetrating from the notch or the through hole of the heating element between the other end and the through hole, And heating the inside of the reaction vessel in a heating apparatus having a penetrating member having a projecting portion for restricting movement of the heating element with respect to the penetrating direction, and processing the substrate.
A second aspect of the method for manufacturing a semiconductor device according to the present invention includes a step of carrying a substrate into a reaction vessel, a heating plate-like heating element having a notch or a through hole, and a conductive material surrounding the heating space. A side wall member configured to be disposed on the heating space side of the side wall material, and holding the heating element only at one end; and protruding from the heating space side of the side wall member, and one end of the heating element The side wall material side of the heating element with respect to the penetrating part that passes through the notch or the through hole of the heating element and the crossing direction that intersects the direction penetrating from the penetrating part between the heating part and the other end And heating the inside of the reaction vessel in a heating apparatus having a penetrating member that has a protruding portion that protrudes on the side wall material side and restricts the movement of the heating element, and processes the substrate.
A first aspect of the penetrating member according to the present invention is a plate-like heating element having a notch or a through hole, a side wall member made of a conductive material surrounding the heating space, and a heating space side of the side wall member. It is an aspect used for a heating device provided with at least a holding part which holds the heating element only at one end, and is arranged to protrude to the heating space side of the side wall material, and one end and the other end of the heating element Between the through portion penetrating the notch or the through hole of the heating element and the crossing direction intersecting the direction penetrating from the through portion, and projecting on the front and back of the heating element from the penetration portion, and the penetrating direction And a protrusion for restricting the movement of the heating element relative to.
The second aspect of the penetrating member according to the present invention is a plate-like heating element having a notch or a through hole, a side wall material made of a conductive material surrounding the heating space, and a heating space side of the side wall material. It is an aspect used for a heating device provided with at least a holding part which holds the heating element only at one end, and is arranged to protrude to the heating space side of the side wall material, and one end and the other end of the heating element Projecting closer to the side wall material of the heating element than the penetration part, with respect to the crossing direction that intersects the notch or through hole of the heating element and the direction penetrating from the penetration part, And a protruding portion for restricting movement of the heating element on the side wall member side.

  The present invention is, for example, film formation by oxidation treatment, diffusion treatment, carrier activation after ion implantation or planarization, annealing, and thermal CVD reaction on a semiconductor wafer on which a semiconductor integrated circuit device (semiconductor device) is formed. It can utilize for the substrate processing apparatus used for a process etc. The present invention is effective for a process in such a substrate processing apparatus particularly in a low temperature region.

It is a schematic sectional drawing of the processing furnace using the conventional heating apparatus. It is a longitudinal cross-sectional view which shows the outline of the substrate processing apparatus in this invention. FIG. 3 is a cross-sectional view in the vicinity of the ceiling portion of FIG. 2. It is the A section enlarged view in FIG. It is the B section enlarged view in FIG. It is the C section enlarged view in FIG. It is the D section enlarged view in FIG. It is a front view which shows the state of the heat generating body after a punching process and before a bending process. The state of the heating element after bending is shown, (a) is a front view, (b) is a plan view, and (c) is a side view. The upper insulator of a hanging insulator is shown, (a) is a side view, (b) is a plan view, and (c) is a front view. The lower insulator of a hanging insulator is shown, (a) is a side view, (b) is a plan view, and (c) is a front view. FIG. 6 is a view corresponding to FIG. 5 in a state where an upper metal fitting is removed. It is the side view which fractured a part of quenching pipe concerning the 2nd modification. It is the side view which fractured | ruptured a part of quenching pipe concerning a 3rd modification. The quenching pipe concerning a 4th modification is shown, (a) is the side view which crushed a part, (b) is the front view which cut | disconnected the collar part. The quenching pipe concerning a 5th modification is shown, (a) is the side view which crushed a part, (b) is a front view. The support bar concerning a 6th modification is shown, (a) is a side view which crushed a part, and (b) is a front view. FIG. 10 is a view corresponding to FIG. 4 showing a quench pipe according to a seventh modified example. FIG. 10 is a view corresponding to FIG. 7 showing a quench pipe according to a seventh modified example.

Explanation of symbols

   1: substrate processing device, 3: heating device, 4: main control device, 4a: temperature monitoring unit, 4b: heating control unit, 4c: reflection control unit, 4d: first flow rate control unit, 4e: pressure control unit, 4f : Second flow controller, 4g: Exhaust controller, 4h: Drive controller, 5a: Flow controller, 5b: Flow controller, 5x: Reaction gas introduction pipe, 5y: Cooling gas supply line, 6a: Pressure controller , 6x: reaction gas exhaust pipe, 7: cooling gas supply line, 7a: open / close valve, 7b: quenching pipe, 7x: intake attachment, 7y: cooling gas introduction duct, 8: forced exhaust line, 8a: exhaust blower, 10: Ceiling part, 11: Intermediate part, 12: Lower part, 13: Terminal case, 14: Airway (cooling medium flow passage), 18: Heating space, 20: Heating element, 20a: Bending part, 21: Upper turning part, 22 : Lower folding part, 23: Wire part, 24: Clearance, 30: Hanging insulator, 31: Upper insulator, 32: Lower insulator, 33: Upper bracket, 34: Lower bracket, 34a: Clearance, 35: Pin, 36: Bo 40: quenching pipe, 40a: through hole, 40b: trough, 40d: penetration, 42: quenching pipe, 50: inner shell (side wall inner layer), 50s: gap, 50t: first flange, 50u : Insulation blanket, 50x: Second flange, 50y: Insulation blanket, 51: Connection insulator, 52: First bolt, 53: Collar, 54: Second bolt, 55a: Opening (first opening), 55b: Box (partition body), 55c: 鍔, 55x: Screw, 59: Water-cooled pipe, 60: Outer shell (side wall middle layer), 60x: Third flange, 60y: Thermal insulation blanket, 61: Pipe, 61a: Opening, 62: Column, 62a: rivet, 65: opening (second opening), 65a: gap, 70: decorative panel (side wall outer layer), 71: screw, 72a: bottom lid, 72b: coil wall, 81: exhaust conduit, 81a: exhaust port , 82: first aperture, 83: second aperture, 90: reflector, 91: reflector, 91a: gap, 92: moving mechanism, 93: shaft, 94: center plate, 95: Bolt, 99: Actuator, 100: Mounting structure, 101: Temperature sensor (temperature detector), 102: Thermocouple contact (temperature detector), 103: Protection tube, 103x: Clearance, 103y: Clearance, 104: Insulator tube, 105: inner cage, 106: outer cage, 107: insulator, 108: terminal, 109a: metal tube, 109b: set screw, 111: first packing, 111a: hole, 112: second packing, 112a: hole, 120a ~ c: Screw, 121: Temperature sensor (temperature detector), 125: Inner cage, 126: Outer cage, 127: Inner box, 128: Outer box, 129: Packing, 131: Temperature sensor (temperature detector), 132: Temperature sensor (temperature detector), 133: protection tube, 135a to c: dredging, 300: boat, 305: wafer, 308: processing chamber, 309: reaction vessel, 310: reaction tube, 315: heat equalizing tube, 317: soaking Heat pipe space, 320: L-type temperature sensor (temperature detector), 321: Contact (temperature detector), 322: Contact (temperature detector), 330: Temperature sensor (temperature detector), Z1 to Z5: Zone , H1 to H3: through hole, R: arc direction, V: penetration direction

Claims (5)

A heating element having a plate-like shape with a notch or a through hole;
A sidewall material made of a conductive material surrounding the heating space;
A holding portion that is disposed on the heating space side of the side wall material and holds the heating element only at one end;
The side wall member is disposed so as to protrude toward the heating space, and intersects a through-hole passing through the notch or the through-hole of the heating element between one end and the other end of the heating element and a direction penetrating from the penetration part. A heating device having a penetrating member that protrudes in the crossing direction on the front and back sides of the heating element rather than the penetrating part and has a protruding part that restricts movement of the heating element in the penetrating direction. A heating element having a plate-like shape with a notch or a through hole;
A sidewall material made of a conductive material surrounding the heating space;
A holding portion that is disposed on the heating space side of the side wall material and holds the heating element only at one end;
The side wall member is disposed so as to protrude toward the heating space, and intersects a through-hole passing through the notch or the through-hole of the heating element between one end and the other end of the heating element and a direction penetrating from the penetration part. A heating apparatus having a penetrating member that protrudes on the side of the side wall material of the heat generating element from the penetrating part with respect to the crossing direction and has a protruding part that restricts movement of the heat generating element on the side of the side wall material. The substrate processing apparatus which provided the reaction container which processes a board | substrate in the said heating space inside the said heating apparatus of Claim 1 or 2. Carrying the substrate into the reaction vessel;
A heating plate having a notch or a through-hole in a plate shape to be heated, a side wall material made of a conductive material surrounding the heating space, and disposed on the heating space side of the side wall material, the heating element is held at one end only. A holding portion that protrudes toward the heating space of the side wall member, a through portion that passes through a notch or a through hole of the heating element between one end and the other end of the heating element, and penetrates from the through portion In a heating device having a penetrating member that protrudes from the front and back of the heating element rather than the penetrating part with respect to the intersecting direction that intersects the direction to be, and has a protruding part that restricts movement of the heating element in the penetrating direction. And a step of processing the substrate by heating the inside of the reaction vessel. A heating element having a plate-like shape with a notch or a through hole;
A penetrating member used in a heating device comprising at least a side wall member made of a conductive material surrounding the heating space, and a holding part that is disposed on the heating space side of the side wall member and holds the heating element only at one end. There,
The side wall member is disposed so as to protrude toward the heating space, and intersects a through-hole passing through the notch or the through-hole of the heating element between one end and the other end of the heating element and a direction penetrating from the penetration part. A penetrating member having a projecting portion that projects in front and back of the heating element relative to the penetrating portion with respect to the crossing direction and restricts movement of the heating element in the penetrating direction.

Images