JP4490492B2 - Heating apparatus, substrate processing apparatus using the same, semiconductor device manufacturing method, and insulator - Google Patents

Description

  The present invention relates to a semiconductor manufacturing technique, and more particularly to a heat treatment technique for performing processing in a state where a substrate to be processed is accommodated in a processing chamber and heated by a heating element, a heating apparatus, a substrate processing apparatus using the same, and a semiconductor device manufacturing method And an insulator.

  FIG. 1 shows a schematic cross-sectional view of a processing furnace 500 using a conventional heating apparatus. The heating device includes a metal casing 501 having a substantially cylindrical shape with an upper end covered, a substantially cylindrical heat insulating material 502 provided inside the casing 501, and a heating wire provided on the inner wall of the heat insulating material 502. 503. A soaking tube 504 and a reaction tube 505 forming a processing chamber are provided inside the heating device, and a desired heat treatment is performed on the wafer 506 in the reaction tube 505.

  In recent years, in the metal wiring process (Cu annealing or the like), a reduction in process temperature (300 ° C. or less) and further improvement in throughput are required. Therefore, it is important to shorten the temperature raising / lowering time of the wafer. However, if the heating device as shown in FIG. 1 responds to such a request, the current heater has a large-capacity heat insulating material so that it can be used in the middle and high temperature range, so the temperature rise / fall characteristics are poor and the throughput is improved. It was difficult. Therefore, there is a need for a highly responsive heating device with a small heat capacity.

  Further, in the substrate processing apparatus according to Patent Document 1, rapid cooling is enabled by passing a plurality of pins through a heating element and feeding a cooling gas from the pins into the heating space. And the responsiveness of a heating apparatus is improved by paying attention to a cooling characteristic. In the substrate processing apparatus according to Patent Document 2, the heater unit includes a heating element laid so as to surround the processing chamber, a first reflector laid so as to surround the heating element, and the first reflection. A second reflector laid so as to surround and surround the outside of the body is provided to improve the heating and cooling efficiency of the processing chamber.

By the way, in order to improve the responsiveness of the heating device, it is necessary to alleviate interference of radiant heat and heat dissipation with respect to the temperature detector and improve temperature measurement accuracy. In Patent Document 3, various configurations have been proposed in the heating device configured as shown in FIG. 1, but it is still insufficient. Further, in Patent Document 4, a heat insulating material, an outer shell, a cooling passage, and a water cooling cover are arranged in this order, and a temperature detection unit that penetrates them is provided. Although a heat insulating member for preventing heat dissipation is individually provided in the cooling passage portion of the temperature detecting portion, the temperature measurement accuracy is insufficient.
WO2007 / 023855 JP 2004-311648 A Japanese Patent Application Laid-Open No. 2004-228381 JP-A-7-18446

  In view of such a conventional situation, an object of the present invention is to improve the responsiveness of a heating device by improving temperature measurement accuracy by a temperature detector.

  In order to achieve the above object, the heating device according to the present invention is characterized by a heating element, an inner shell made of a conductive material that supports the heating element, and a conductive material disposed on the outer periphery of the inner shell. An outer shell made of a conductive material, a cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, and a second opening provided in the outer shell An opening is provided so as to form a gap between the first opening and the second opening toward the second opening, or the first opening to the first opening A space that is provided so as to form a gap with the first opening toward the opening of the cooling medium and that is separated from the cooling medium circulation passage at least between the inner shell and the outer shell A partition body made of a conductive material and the gap formed between the partition body and the second opening or between the partition body and the first opening. And a temperature detector which is provided at least in part in the space and detects the temperature of the heating element.

  According to the characteristics of the substrate processing apparatus according to the present invention, the responsiveness of the heating apparatus can be improved by improving the temperature measurement accuracy by the temperature detector.

  Other objects, configurations, and effects of the present invention will become apparent from the following embodiments of the present invention.

Next, the present invention will be described in more detail with reference to the accompanying drawings as appropriate.
Hereinafter, a first embodiment as the best mode for carrying out the present invention will be described with reference to the drawings.

  As shown in FIGS. 2 to 7, the substrate processing apparatus 1 generally includes a reaction vessel 309 that forms a processing chamber 308, a heating device 3 disposed on the outer periphery of the reaction vessel, and a main controller 4. Yes.

  The heating device 3 generally includes a ceiling portion 10, a cylindrical intermediate portion 11, a lower portion 12, and a terminal case 13, and a heating element 20 is supported on the intermediate portion 11. The ceiling portion 10 is formed with an elbow-shaped exhaust conduit 81 that opens to the lower surface and the side surface, and further includes a reflection device 90 at the lower portion thereof. The intermediate portion 11 surrounds the inner shell 50 that supports the heating element 20 with the outer shell 60 in an insulated state, and further surrounds the outer periphery with a decorative panel 70. The inner shell 50 and the outer shell 60 are made of a conductive material, for example, a metal material such as a stainless steel material.

  A cooling gas introduction duct 7y is attached between the upper part of the intermediate part 11 and the intake attachment 7x. For example, a butterfly valve is attached as an opening / closing valve 7a to the opening of the intake attachment 7x so that the flow path can be opened and closed. The intake attachment 7 x is connected to the cooling gas supply line 7. An air passage 14 is formed between the inner shell 50 and the outer shell 60 as a cylindrical cooling medium circulation passage. The cooling gas introduction duct 7y communicates with the airway 14 by a plurality of pipes 61 that are arranged substantially equally in an annular shape. On the other hand, a forced exhaust line 8 having an exhaust blower 8 a that performs forced exhaust is connected to the exhaust conduit 81, and forced exhaust of a heating space that is an internal space of the heating device 3 is performed. A gas such as air or an inert gas introduced from the cooling gas supply line 7 is supplied as a cooling gas to the heating space 18 from the airway 14 and a plurality of insulator holes described later, and is exhausted from the forced exhaust line 8.

  The reaction vessel 309 includes a soaking tube 315 and a reaction tube 310 that are sequentially arranged concentrically in the heating space 18, and a processing chamber 308 is formed in the reaction tube 310. The processing chamber 308 stores a boat 300 that holds wafers 305 in multiple horizontal stages. The boat 300 can be loaded into and pulled out from the processing chamber 308 by a boat elevator (not shown).

  In the reaction tube 310, a reaction gas introduction tube 5x and an exhaust tube 6x are communicated. The reaction gas introduction pipe 5x is provided with a flow rate controller 5a, and the exhaust pipe 6x is provided with a pressure controller 6a. The reaction gas is introduced at a predetermined flow rate, and the internal gas is exhausted from the exhaust port 6y so that the inside of the reaction tube 310 is maintained at a predetermined pressure, and is discharged out of the processing chamber through the exhaust pipe 6x.

  The other cooling gas supply line 5 y is communicated with a soaking tube inner space 317 formed between the soaking tube 315 and the reaction tube 310. The cooling gas supply line 5y is provided with a flow rate controller 5b. The intake attachment 7x is provided with an open / close valve 7a. The forced exhaust line 8 is provided with an exhaust blower 8a as an exhaust device. That is, it is possible to introduce and adjust the cooling gas as appropriate to both the soaking tube inner space 317 and the heating space 18.

  The heating element 20 is divided into a plurality of zones Z1 to Z5 as required with respect to the axial direction of the cylinder of the intermediate portion 11, and zone control is possible. Each zone is provided with a temperature detector that detects the heating temperature of each zone. Note that the heating element 20 may have the same calorific value in each zone by making the molding pattern of each zone the same.

  Each part of the substrate processing apparatus 1 is controlled by the main controller 4. For example, the processing state of the wafer 305 processed in the reaction tube 310 is controlled by the main controller 4. The main controller 4 includes a temperature monitor 4a, a heating controller (heating controller) 4b, a reflection controller 4c, a first flow controller 4d, a pressure controller 4e that controls the pressure in the reaction tube 310, and a second A flow control unit 4f, an exhaust control unit 4g, and a drive control unit 4h for controlling mechanical units such as the boat elevator are provided.

  The temperature monitor unit 4a detects the temperatures of the first to third temperature detectors TC1 to TC3. Here, the first temperature detector TC1 is provided for each of the zones Z1 to Z5 in the vicinity of the heating element 20. The second temperature detector TC2 is provided for each of the zones Z1 to Z5 in the peripheral portion in the reaction tube 310. Further, the third temperature detector TC3 is provided above the reaction tube 310 or in a range including the upper center of the reaction tube 310.

  The heating control unit 4b controls the amount of heat generated by the heating elements 20 in the zones Z1 to Z5 based on the detection result of the temperature monitoring unit 4a. Further, the reflection control unit 4c controls the actuator 99 as a driving device of the reflection device 90 based on the detection result of the temperature monitor unit 4a. Then, the reflector (reflector) 91 having a mirror-finished lower surface is appropriately tilted to change the light collection degree from the heating element 20 to the upper center of the reaction tube 310, and the temperature of the same part is controlled.

  The first flow rate control unit 4d controls the flow rate controller 5a, and the pressure control unit 4e controls the pressure controller 6a to control the introduction of the reaction gas and the pressure. The second flow rate control unit 4f controls the flow rate controller 5b, and the exhaust control unit 4g controls the opening / closing valve 7a and the exhaust blower 8a to control introduction and discharge of the cooling gas.

  FIG. 4 shows an enlarged view of portion A in FIG. The heating element (heater wire) 20 is fixed to the inner shell 50 by a hanging insulator 30 as an insulating material such as alumina. The heating element 20 is made of a heat-generating material that can be rapidly heated, such as an Fe-Al-Cr alloy, and has a cross-sectional shape such as a flat plate so as to increase the heat-generating surface area. It is configured. The heating element 20 has meandering folded portions 21 and 22 above and below, and an intermediate portion includes a strand portion 23 that connects the upper folded portion 21 and the lower folded portion 22 with a half-pitch shift, and each strand. It is comprised from the clearance gap 24 located between the parts 23. FIG. Further, the upper portion of the heating element 20 is bent as a bent portion 20 a held by the hanging insulator 30. The inner surface of the inner shell 50 is mirror-finished, and heat rays radiated from the rear surface of the wire portion 23 of the heating element are reflected by the inner surface and radiated from the gap 24 toward the heating space 18.

  The hanging insulator 30 as an insulating material includes an upper insulator 31 and a lower insulator 32 made of a heat-resistant insulating material such as alumina, and the pin 35 is sandwiched between the upper metal member 33 and the lower metal member 34 with the bent portion 20a at the upper part of the heating element 20 interposed therebetween. It is fixed by welding. The lower metal fitting 34 is attached to the inner shell 50 by bolts 36 at two bent portions.

  The inner shell 50 has a through hole 40a in the center, and a plurality of quench pipes 40 for supplying the cooling gas in the air passage 14 into the inner shell 50 protrude from the inner wall of the inner shell 50 toward the heating space 18 side. Is provided. The quench pipe 40 is made of an insulating heat resistant material such as alumina. The quenching pipe 40 includes a through portion 40d that penetrates the heating element 20 in the gap 24, and a protruding portion that protrudes from the through portion 40d in a direction that intersects the penetration direction V in which the penetration portion 40d penetrates the heating element 20. The movement of the middle of the heating element 20 is limited by the substantially circular ridges 40b and 40c. That is, a groove is formed in the through portion 40d between the pair of flanges 40b and 40c. Furthermore, the lower end of the heating element 20 is provided at a position overlapping the upper end position of the lower hanging insulator 30 to limit the movement of the lower end of the heating element 20 in the penetration direction of the quench pipe 40.

  On the back surface of the inner shell 50, a water cooling pipe 59 as a cooling medium circulation passage is provided. The water-cooled tube 59 is wound around the outer surface of the inner shell 50 in a spiral manner in the axial direction and welded. For example, by flowing a cooling medium such as cooling water through the supply / drainage paths 59a and 59b, the temperature of the inner shell 50 is prevented from rising and kept almost constant.

  The outer shell 60 is attached to the outside of the inner shell 50 in an insulated state via a plurality of connecting insulators 51. Since the connecting insulator 51 is made of an alumina material having insulation and heat resistance, even if the heating element 20 and the inner shell 50 are unexpectedly brought into contact with each other and a current is transmitted to the inner shell 50, for example, the connection insulator 51 is connected. The insulator 51 does not transmit current to the outer shell 60.

  The inner side of the connecting insulator 51 is fixed to the inner shell 50 with a first bolt 52. On the other hand, the outer side of the connecting insulator 51 is fixed to the outer shell 60 with a second bolt 54 via an annular hollow collar 53 as an insulating heat resistant material. The collar 53 is provided through the mounting hole of the outer shell, is formed thicker than the thickness of the outer shell 60, and provides a clearance (gap) between the lower surface of the head of the second bolt 54 and the outer surface of the connecting insulator 51. Yes. Even if the inner shell 50 swells due to thermal expansion, the amount of deformation is absorbed by this clearance to prevent thermal stress from acting on the outer shell 60 and to prevent deformation of the outer shell 60.

  On the outer side of the outer shell 60, a decorative panel 70 is provided as a side wall outer layer which is an outermost shell through a column 62. The decorative panel 70 is provided with an opening 61a communicating with the cylindrical airway 14 at the upper part of the outer shell 60 through a pillar 62 having a flange, for example, by a metal rivet 62a. One end of the pipe 61 is welded to 61a. The pipe 61 penetrates the decorative panel 70, and the other end communicates with the cooling gas introduction duct 7y. In addition, the pillar 62 and the decorative panel 70 are comprised from the material which has electroconductivity, for example, is comprised from metal materials, such as stainless steel material. For this reason, the decorative panel 70 and the outer shell 60 are connected in a conductive state via the pillar 62. In addition, by preventing the conduction to the outer shell 60 and the decorative panel 70 as described above, the conduction to the entire substrate processing apparatus is prevented, and an electric shock at the time of work and the electrical components in the substrate processing apparatus are prevented from being damaged.

  As shown in FIG. 4, the inner shell 50 is divided into a plurality of parts in the vertical direction. A gap 50 s is provided between the divided upper shell and the lower shell adjacent thereto. And between the 1st flange 50t provided in the upper shell which is an upper shell among the inner shells 50, and the water cooling pipe 59 of a lower shell, the heat insulation blanket 50a which consists of heat insulation members, such as a ceramic fiber, is interposed, and gap The heat escape from 50s is prevented, and the upper and lower shells are thermally divided.

  As shown in FIG. 7, at the lower part of the intermediate part 11, a heat insulation and a heat insulation blanket as an insulation member are provided between the second flange 50 x projecting outside the inner shell 50 and the third flange 60 x projecting inside the outer shell 60. 50y is interposed. Thereby, the inner shell 50 and the outer shell 60 are insulated from each other and kept airtight by the heat insulating blanket 50y. Further, a heat insulating blanket 60y as a heat insulating member is provided between the third flange 60x and the bottom lid 72a to keep the inner shell 50 internal space airtight. A structure having the same concept is also adopted between the intermediate portion 11 and the ceiling portion 10 to maintain an insulating state and an airtight state. The lower part of the lowermost heating element 20 is supported by a quenching pipe 42 provided separately from the quenching pipe 40 that restricts the movement of the middle of the heating element 20.

  Next, the attachment structure 100 of the temperature sensor 101 as the first temperature detector TC1 will be described with reference to FIGS. The temperature sensor 101 detects the temperature in the vicinity of the heating element 20 and is used for controlling the output of the heater. In order to perform accurate temperature control, it is necessary to accurately detect the temperature of the heating element 20. Therefore, it is desirable to install the temperature sensor in the vicinity of the heating element 20. As shown in part in FIG. 10, two temperature sensor mounting structures 100 are provided on the left and right sides of the terminal case 13 so as to correspond to the zones Z1 to Z5.

  The temperature sensor 101 has a thermocouple contact 102 as a temperature detector at the tip of a protective tube 103 made of a transparent insulating material such as quartz or alumina, and the strand is protected by an insulator tube 104 and fixed to the insulator 107. Connected to the terminal 108. The insulator tube 104 and the insulator 107 are made of an insulating material such as alumina. The inner rod 105 and the outer rod 106 are fixed to the metal pipe 109a by welding. The inner collar 105 functions as a first opening blocking body provided so as to form a gap with the first opening 55a. Further, the outer casing 106 functions as a support portion that supports the temperature sensor. The protective tube 103 is inserted into the metal tube 109a. The two set screws 109b screwed to the metal tube 109a pass through a hole formed in the protective tube 103 at the same position and press against the insulator tube 104a inside the protective tube to prevent the protective tube 103 from rotating. And it is fixed. The insulator 107 is fixed to the outer casing 106 with a screw 106x. The protective tube 103 is bent in an L shape so as to have a bent portion, and the temperature of the tip of the temperature sensor 101 is lowered by separating the thermocouple contact 102 from a portion communicating with the outside of the heating device, for example, the terminal 108. Is suppressed. Further, a gap 103x is provided between the metal tube 109a penetrating the protective tube 103 and the inner surface of the box 55b, and the presence of the gap 103x suppresses a temperature drop due to heat conduction. Furthermore, even if there is a gap 103y between the opening 55a of the inner shell 50 and the inner flange 105, a temperature decrease due to heat conduction is suppressed.

  The inner shell 50 is provided with a first opening 55a, and a box 55b as a partition wall is provided in an airtight manner with respect to the opening 55a. A flange 55c is provided on the other surface of the box 55b to form an airtight box. A gap 65a is provided between the flange 55c and the second opening 65 of the outer shell 60 to ensure insulation between the box 55b and the outer shell 60, that is, between the inner shell 50 and the outer shell 60. The box 55b and the collar 55c are made of a conductive material, and are made of a metal material such as a stainless steel material, for example.

  The first packing 111 and the second packing 112 having substantially the same shape are attached by using four screws 65x so as to close the openings 65 of the outer shell 60. The first packing 111 is made of a member such as heat-resistant paper having insulating properties, heat resistance, and stretchability. Further, the second packing 112 is made of a member such as polyvinylidene fluoride having insulation and heat resistance, and having a suitable hardness that is at least harder than the first packing 111, and has elasticity. Press 111 evenly.

  The temperature sensor 101 is attached to the flange 55c using two screws 55x. At this time, since the first and second packings 111 and 112 are further pressed by the outer casing 106, the atmosphere of the airway 14 can be prevented from flowing into the inner shell 50 through the gap 65a. The metal outer casing 106 is electrically connected to the inner shell 50 through the screw 55x, but is insulated by the first and second packings 111 and 112 and is not electrically connected to the outer shell 60. The inner flange 105 passes through the holes 111a and 112a of the first and second packings 111 and 112, enters the box 55b, and closes the opening 55a, so that the heat rays from the heating element 20 are directly applied to the first and second packings. This prevents the packings 111 and 112 from reaching and prevents these packings from being deteriorated by heat rays. Moreover, by providing the gap 103y, the atmosphere in the heating space 18 and the atmosphere inside the box 55b can be set to the same temperature, and the temperature sensor 101 is adversely affected by the temperature effect of the atmosphere inside the box 55b. More accurate temperature can be measured.

  Since the temperature sensor 101 is airtightly attached to the inner shell 50 as described above, there is no inflow of cooling gas from the airway 14, and the temperature of the heating element 20 can be detected more accurately. Further, since the gap 65a is provided and the gap 65a is closed with an insulator, insulation between the inner shell 50 and the outer shell 60 can be secured. Even if the heating element 20 is thermally deformed in the vicinity of the temperature sensor 101, the possibility of reaching the inner shell 105 or the metal tube 109a formed with the same size as the outer shape of the temperature sensor 101 is extremely low. It comes into contact with a certain protective tube 103, and insulation can be ensured even at temperature sensor mounting portions such as the inner flange 105 and the outer flange 106. Moreover, the inner shell 50 does not have a heat insulating material on the inner surface, and by adopting the airway 14 and the quenching tube 40, the throughput of temperature rise and temperature fall can be improved.

Next, the operation of the substrate processing apparatus 1 will be described.
In the processing of the wafer 305, the boat 300 loaded with the wafer 305 is loaded into the reaction tube 310 by a boat elevator and rapidly heated to a predetermined temperature by the heating device 3. While the wafer 305 is heated to a predetermined temperature by the heating device 3, the reaction gas is introduced from the reaction gas introduction pipe 5 x, the exhaust gas is discharged through the exhaust pipe 6 x, and a necessary heat treatment is performed on the wafer 305. Made.

  Usually, the temperature of the boat 300 is kept at a required temperature, for example, 550 ° C. before the boat 300 is charged. After the boat 300 is charged, the temperature is raised to a wafer processing temperature, for example, 850 ° C. In addition, the temperature before loading and the processing temperature are appropriately selected according to the processing content in the substrate processing apparatus.

  The heating element 20 at each stage of the heating element 20 is measured for each independent zone by the temperature monitor unit 4a, and the temperature is controlled by the heating element 20 and the reflection device 90. Since the heating element 20 in each zone is one continuous heating element, if there is an abnormality in the heating element 20, for example, if there is a disconnection, it can be detected immediately, and the deterioration state of the heating element in each stage can be easily found. I can grasp it.

  When the process is complete, it is rapidly cooled to the wafer exit temperature, eg, 550 ° C. For the cooling after the processing of the wafer 305, the flow rate controller 5a and the air valve 7a are opened, and an inert gas such as air or nitrogen gas is supplied from the cooling gas supply lines 5y and 7 as a cooling gas. The cooling gas supplied from the cooling gas supply line flows into the heating space 18 through the through hole 40a of the quenching pipe 40, and cools the heating element 20 from both the outer surface and the inner surface.

  In such a configuration using the cooling pipe 40, the cooling rate of the heater, and thus the cooling rate of the wafer can be improved, and the throughput of the wafer processing can be improved. Further, since the cooling pipe 40 serves as both a heating element presser and a cooling gas supply pipe, it is not necessary to provide a separate gas pipe for cooling the heater, so that the area of the heating element on the inner wall of the heater can be improved. Furthermore, since the opening part of the through-hole 40a of the cooling pipe 40 is opened inside the heat generating body 20, the heat generating body 20 is prevented from being locally cooled by the cooling gas. As a result, local deformation, twisting, and cracking of the heating element 20 can be suppressed, and further, disconnection of the heating element 20 and contact with the reaction tube 310 can be prevented.

  The cooling gas introduced into the cylindrical air passage 14 is dispersed through the cooling gas introduction duct 7y having a large volume, so that the cooling gas uniformly flows into the air passage 14 and the occurrence of uneven cooling is prevented. Thereafter, the cooling gas is blown into the heating space 18 through the plurality of pipes 61, the airway 14, and the plurality of quenching pipes 40, and rises in the heating space 18 and is exhausted from the exhaust conduit 81. The inner surface of the inner shell 50 is cooled by the cooling gas rising in the heating space 18, and the soaking tube 315 and the reaction tube 310 are rapidly cooled by the cooling gas rising in the heating space 18 and the soaking tube inner space 317. As a result, the wafer 305 in the reaction tube 310 is rapidly cooled. By adopting a heating element such as Fe—Cr—Al, carbon, or SiC as the heating element 20, rapid heating and high temperature heating are possible, and further rapid cooling is possible by cooling the heating device 3 with a cooling gas. .

  When the cooling is completed, the boat 300 is lowered by the boat elevator, and the processed wafer 305 is discharged from the boat 300. In the case of the decompression process, the boat 300 is lowered after returning the reaction chamber to atmospheric pressure.

  Next, second to sixth embodiments of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the member similar to 1st embodiment.

  In the second embodiment shown in FIG. 12, the temperature sensor 121 in the temperature sensor mounting structure 100 includes a packing 129 and screws 120b between the outer shell 126 and the opening 65 of the outer shell 60 having a larger diameter and a gap 65a. It is blocked by 120c. The packing 129 is preferably a heat-resistant member having flexibility and insulation, and polyvinylidene fluoride or the like is used. Airtight inner box 127 and outer box 128 are formed between inner casing 125 and outer casing 126 fixed to opening 55a of inner shell 50, and cooling gas in airway 14 flows into inner shell 50. Is preventing.

  In this structure, since the packing 129 has flexibility, the deformation due to the thermal expansion of the inner shell 50 can be absorbed. In addition, since there is a clearance between the inner box 127 and the outer box 128, unexpected cooling of the temperature sensor 101 by the cooling gas can be prevented. Note that it is difficult to attach and remove the screw 120a for fixing the inner collar 125. The first embodiment is superior in that the inner flange 125 is enlarged due to the operation of the screw 120a, the interval between the water-cooled tubes 59 is increased from that of the first embodiment, and rapid cooling becomes difficult.

  The third embodiment shown in FIG. 13 is different from the first embodiment in that the flange 55c of the box 55b is oriented inward. In the third embodiment, the same effects as in the first embodiment are obtained. However, when the temperature sensor 101 having the same size is used, the first embodiment is different in that the opening 55a of the inner shell 50 is increased. Are better.

  In the fourth embodiment shown in FIG. 14, the temperature sensor 151 as a temperature detector in the temperature sensor mounting structure 100 is different from the second embodiment in that an inner collar 154 is provided on the other surface of the box 152, The space 155 and the heating space 18 are communicated with each other. In the first embodiment described above, a space in the box 55b is formed just outside the thermal contact 102 of the temperature sensor 151, and the space and the heating space 18 have the same atmosphere, so that the temperature of the airway 14 by the cooling gas is increased. The decrease is suppressed. Therefore, compared with the present embodiment, the first embodiment is superior in that a more accurate temperature measurement is possible. However, in this embodiment, unlike the second embodiment, the space 155 and the heating space 18 can be made the same atmosphere, and it is possible to prevent a decrease in the detected temperature due to heat escape to the outside of the temperature sensor 151. It is superior to the second embodiment. Moreover, this space 155 forms a gap 155a between the metal tube 109a and the box 152. This gap 155a can prevent a temperature drop due to heat conduction with the cooling gas flowing through the airway 14. Therefore, the temperature of the heating element 20 can be detected more accurately. The following fifth and sixth embodiments have the same configuration.

  Further, in the temperature sensor 151 according to the fourth embodiment, an inner flange 154 large enough to close the first opening 55a is fixed to the inner shell 50 by a screw 150a with a packing 161 such as heat-resistant paper interposed therebetween. As a result, leakage of the cooling gas from the air passage 14 to the heating space 18 can be reliably prevented, and machine differences between the heating elements 20 can be suppressed. However, in the present embodiment, the packing 161 easily receives heat rays from the heating element 20 and is likely to be thermally deteriorated. In this respect, the first embodiment with less influence of heat rays on the packings 111 and 112 is superior. Further, a gap 65a is provided between the outer casing 153 and the second opening 65 of the outer shell 60, and the gap 65a is closed by the first and second packings 111 and 112 to ensure insulation and airtightness.

  By the way, in 1st embodiment, it is necessary to align the collar 55c of the box 55b, the outer collar 106 of the temperature sensor 101, and the outer shell 60 on the same plane. However, the box 55b, the collar 55c, the outer collar 106, and the outer shell 60 have manufacturing tolerances, respectively, and the inner shell 50 and the outer shell 60 have a cylindrical shape and are circumferentially curved. . Further, the box 55b is attached to the inner shell 50 by welding. Under such conditions, it is difficult to align the three members of the flange 55c, the outer flange 106, and the outer shell 60 on the same circumferential surface. Therefore, the gap 65a is closed with two insulating materials having different hardnesses, and is further pressed by the outer casing 106 to perform alignment.

  On the other hand, in order to ensure the airtightness of the gap 65a, it is necessary to align the above-mentioned three members on the same peripheral surface. However, in this embodiment, since the box 152 is attached to the outer casing 153 of the temperature sensor 151, the outer casing 153 also serves as a box casing, and the alignment between the outer casing 153 and the outer shell 60 is sufficient. Further, since the inner collar 154 of the box 152 is attached to the inner shell 50 with the screw 150a, the alignment is also facilitated. Therefore, it is possible to easily align the outer casing 153 and the outer shell 60, simplify the manufacture of the heater, and ensure the airtightness of the gap 65a.

  In the first embodiment, the box 55b is attached to the inner shell 50, and the flange 55c of the box 55b and the outer flange 106 of the temperature sensor 101 are fixed to the outer shell 60. Therefore, in order to make the distance between each temperature sensor 101 and the heating element 20 uniform, it is necessary to align the box 55b, the collar 55c and the outer collar 106 of the temperature sensor 101. However, as described above, it is difficult to align these members, and the gap 65a is fixed via two insulating materials having different hardnesses.

  On the other hand, in the present embodiment, since the box 152 is attached to the outer casing 153 of the temperature sensor 151, the outer casing 153 also serves as a casing of the box 152, and alignment between the outer casing 153 and the outer shell 60 is sufficient. Therefore, the outer casing 153 and the outer shell 60 can be easily aligned, and the distance between each temperature sensor 101 and the heating element 20 can be made uniform.

  By the way, in 1st embodiment, in order to ensure the airtightness of the clearance gap 65a, the screw 55x is tightened firmly so that an insulating material may be pressed on the clearance gap 65a with the outer casing 106. In the case of such tightening, it may be difficult to remove the member at a high temperature due to deformation due to thermal expansion of the member. On the other hand, in the present embodiment, the outer casing 153 and the outer shell 60 can be easily aligned as described above. Therefore, it is not necessary to firmly tighten the screws 150b and 150 so as to press the insulating material in order to obtain the airtightness of the gap 65a. Therefore, the airtightness of the gap 65a can be secured even if the screw is tightened with the specified torque. Further, as described above, it is not difficult to remove the screw. Note that the screw 55x of the first embodiment is used between the outer shell 60 and the airway 14, and the phenomenon as described above hardly occurs.

  However, in the present embodiment, since the inner flange 154 is fixed to the inner shell 50 with the screw 150a, the screw 150a is difficult to install and remove. In addition, there is a possibility of dropping screws inside during the installation work. Moreover, the inner flange 154 is enlarged due to the operation of the screw 150a, the interval between the water-cooled tubes 59 is increased as compared with the first embodiment, and rapid cooling becomes difficult. The first embodiment is superior in that there are no inconveniences.

  In the fifth embodiment shown in FIG. 15, a gap 55 d is provided between the inner flange 154 and the first opening 55 a of the inner shell 50. A packing 161 such as heat-resistant paper as an insulator is attached to the inner shell 50 with a screw 150a. Then, by fixing the outer flange 153 to the outer shell 60, the inner flange 154 is pressed against the packing 161 to close the gap 55d. By this gap 55d, the inner shell 50 and the outer shell 60 can be insulated at a location close to the heating element 20. Further, because of the structure, even if the heat generating element 20 is thermally deformed, the heat generating element 20 contacts the protective tube 103 which is an insulator, and the possibility of contacting the metal inner casing 154 and the metal tube 109a is extremely high. Low. Therefore, the inner shell 50 and the inner casing 154 are not electrically connected, and even if the heating element 20 and the inner shell 50 come into contact with each other, the current leaks to the outer shell 60, the decorative panel 70, and the entire substrate processing apparatus via the outer casing 153. There is nothing. Since the gap 55d can insulate, the outer casing 153 large enough to block the second opening 65a and the inner casing 154 can be directly fixed to the outer shell 60 with screws.

  By the way, also in this embodiment, since packing 161 is fixed to an inner shell with the screw 150a, operation, such as attachment / detachment of the screw 150a, becomes difficult on the structure. Further, in order to attach / remove the packing 161 that closes the gap 55d, it is necessary to remove the temperature sensor 151, and the removal work becomes complicated. On the other hand, in the first embodiment, the insulator that closes the gap 65a from the outside of the outer shell 60 can be easily attached and detached. Therefore, the first embodiment is superior in that there is no such inconvenience. In addition, since the packing 161 directly receives the heat rays from the heating element 20, it easily deteriorates, and due to this deterioration and thermal expansion of the inner shell 50 and the outer shell 60, a gap is easily formed between the inner flange 154 and the packing 161. For the above, the first embodiment is superior.

  In the sixth embodiment shown in FIG. 16, the inner flange 154 is fixed to the inner shell 50 with an insulating material 171 such as Teflon (registered trademark) with screws 171a made of an insulating material, and these insulating materials 171 and 171a are used. The inner flange 154 and the inner shell 50 are insulated. The thickness of the insulating material 171 may be set to a thickness that can be insulated according to the supply voltage. For example, when the supply voltage is 200 V, the thickness may be set to about 5 mm. With this configuration, as in the fifth embodiment, it is possible to ensure insulation at a portion closer to the heating element 20 and prevent the inner shell 50 and the temperature sensor 151 from conducting.

  Further, since the inner flange 154 and the inner shell 50 are insulated, the outer cover 154 having a smaller diameter than the second opening 65 and the inner flange 154 is fixed to the outer shell 60 by a metal cover 172 that can be manufactured at low cost. A temperature sensor 151 can be attached. Note that the cover 172 may be made of an insulating material in order to further improve the insulation. In such a case, the gap 65a between the outer casing 153 and the outer shell 60 is closed by the cover 172 serving as an insulator, and the outer casing 153 and the outer shell 60 can be insulated. However, even in this embodiment, operations such as attachment / detachment of the insulation screw 171a become difficult. Also, the attaching / detaching work of the insulating material 171 requires the temperature sensor 151 to be removed, and the removing work becomes complicated. The first embodiment is superior in that there is no such inconvenience. In addition, in 4th and 5th embodiment, there exists an effect similar to 1st embodiment except the point mentioned above.

  Next, a comparative example for the above embodiment will be described with reference to FIGS. In the first comparative example of FIG. 17, it is necessary to provide the contact 102 of the temperature sensor 131 in the vicinity of the heating element 20. Holes H1, H2, and H3 are provided. With such a structure, since the cooled atmosphere in the airway 14 flows into the inner shell 50 through the through holes H1, H2, and H3, the temperature detected by the contact 102 decreases, and a more accurate heating element The temperature cannot be detected. In particular, when the quenching blower is operated, the amount of the cooling gas increases, so that the temperature of the heating element can hardly be detected. For example, approximately room temperature is detected, and accurate temperature control is difficult. Here, the case of using the exhaust blower for rapid cooling includes not only rapid cooling with a ramp down rate set but also temperature control.

  In the second comparative example of FIG. 18, the temperature sensor 132 is provided with a hook to close the through holes H1, H2, and H3. A metal pipe 134 is penetrated through the protective pipe 133, and three flanges 135 a, 135 b, 135 c are welded to the pipe 134. The collars 135a, 135b, and 135c close the through holes H1, H2, and H3, respectively. With such a configuration, the insulation between the inner shell 50 and the outer shell 60 and the decorative panel 70 cannot be obtained. It is dangerous. In this comparative example, the diameters of the inner shell 50 and the outer shell 60 change due to thermal expansion, and there are gaps between the through holes H1 and H2 and the flanges 135a and 135b, and the temperature detected by the temperature sensor 132 decreases. End up. Furthermore, since the inner shell 50, the outer shell 60, and the flanges 135a and 135b have manufacturing tolerances, it is extremely difficult to seal the openings of the inner shell 50 and the outer shell 60. The first to third embodiments described above can eliminate these disadvantages.

  In the above comparative example, since the protective tube 133 has a linear shape, the distance between the terminal 108 and the contact 102 is short, and the heat escape to the outside of the heater is large, leading to a decrease in the detection temperature, and accurate temperature detection is difficult. It is. Therefore, the protective tube is preferably bent in an L shape like the protective tube 103 of the first embodiment, but may be formed as a straight tube type.

This specification includes the following inventions.
1) A substrate processing apparatus in which a gap 103x is provided between the partition wall as the box 55b and the temperature detector.

  2) A method of manufacturing a semiconductor device using the above-described substrate processing apparatus, wherein the heating control unit is configured to perform heating based on a temperature measured by the temperature detector while the cooling medium flows through the cooling medium circulation passage 14. A method for manufacturing a semiconductor device, which controls the heating device 3 to process the substrate.

  3) A heating device used in a substrate processing apparatus for processing a substrate, comprising a heating element, an inner shell that supports the heating element, an outer shell disposed on the outer periphery of the inner shell, and the inner shell and the outer shell. A cooling medium flow passage for flowing a cooling medium therebetween, and a temperature detector for detecting the temperature of the heating element, wherein the inner shell has a first opening 55a, and the outer shell has a second opening 65. A partition wall 55b for isolating the temperature detector 101 from the cooling medium flow path is provided from the first opening toward the vicinity of the second opening, and the partition body and the second opening A heating device provided with a gap 65a for insulation therebetween and closing the gap with insulators 111 and 112.

  4) A side wall formed in a cylindrical shape and a plate-like heating element having a plurality of gaps, the inner surface of the side wall being finished so as to be able to reflect heat rays, and the heating element is arranged along the cylindrical inner surface of the side wall The heating element surface of the heating element radiates heat rays toward the heating space, and the heat ray radiated from the back surface of the heating element part is reflected by the inner surface and passes through the gap to be radiated to the heating space. Apparatus, substrate processing apparatus, and heating element holding structure. In this structure, the width of the gap 24 is sufficiently larger than the width of the strand portion 23, so that the heat rays reflected from the inner surface can be effectively used. If a gap is formed along the cylindrical central axis and the upper side of the central axis is supported by the holding member, the radiant heat can be effectively used and the surface density of the heating element can be improved. It is possible to improve the thermal responsiveness. Further, by making the cylindrical inner surface a concave curved surface, it is possible to improve the efficiency with which the reflected heat rays are radiated into the heating space through the gap, and it is desirable that the concave curved surface is an arc surface. .

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.

  Although the reaction vessel has been described as including both the soaking tube and the reaction tube, the reaction vessel may include only the reaction tube without including the soaking tube. In addition, you may be comprised not only in a double pipe but in the number of pipes of 1 pipe or a triple pipe or more.

  The heat treatment is not limited to oxidation treatment, diffusion treatment, and diffusion, but is not limited to carrier activation after ion implantation and reflow and annealing treatment for planarization, and may be heat treatment such as film formation treatment. The substrate is not limited to a wafer, but may be a photomask, a printed wiring board, a liquid crystal panel, an optical disk, a magnetic disk, or the like. The present invention is not limited to batch-type heat treatment apparatuses and single-wafer-type heat treatment apparatuses, and can be applied to all semiconductor manufacturing apparatuses provided with a heater unit. The inner shell 50 and the mirror finish portion of the reflector 91 may be mirror-finished by polishing stainless steel, or may be plated with a noble metal such as gold or platinum.

  The decorative panel 70 may not be provided. In this case, for example, in the second embodiment, the inner surface of the insulator 107 may be configured to be flush with the outer surface of the outer casing 126.

The embodiment of the present invention is configured as described above, but may be more comprehensively configured as described below.
A first aspect of the heating device according to the present invention is a heating element, an inner shell made of a conductive material that supports the heating element, and a conductive material disposed on the outer periphery of the inner shell. A configured outer shell, a cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, and a second opening provided in the outer shell, It is provided so as to form a gap between the first opening and the second opening toward the second opening, or from the second opening to the first opening. For forming a space isolated from the cooling medium flow path between at least the inner shell and the outer shell, which is provided so as to form a gap between the first opening and the first shell. A partition body made of an electrically conductive material, and an insulator that blocks the gap formed between the partition body and the second opening or between the partition body and the first opening. And a temperature detector that is at least partially provided in the space and detects the temperature of the heating element. The insulator is formed by laminating two or more insulating members having different hardnesses.
Further, the second aspect of the heating device according to the present invention includes a heating element, an inner shell that supports the heating element, an outer shell disposed on the outer periphery of the inner shell, and cooling between the inner shell and the outer shell. A cooling medium flow path for flowing a medium, a first opening provided in the inner shell, a second opening provided in the outer shell, and the first opening toward the second opening. A partition for forming a space isolated from the cooling medium flow passage between at least the inner shell and the outer shell, which is provided from the second opening toward the first opening. And an insulator that closes a gap formed between the partition body and the second opening or between the partition body and the first opening.
According to the first and second aspects, the insulation between the inner shell and the outer shell can be secured, and the airtightness of the cooling medium circulation passage can be secured. Further, by providing the gap between the second opening and the partition wall, the insulator can be easily attached and removed from the outside of the outer shell.
In the first and second aspects, it is preferable that at least a part of a temperature detector for detecting the temperature of the heating element is provided in the space. In such a case, it is desirable to provide a gap between the partition wall and the temperature detector. Thereby, the temperature fall by the heat conduction from an airway can be suppressed, and the exact temperature measurement of a heat generating body is attained. Moreover, the said insulator is good to laminate | stack two or more insulating members from which hardness differs. Thereby, an insulating member can be pressed uniformly to a clearance gap and the airtightness of a cooling-medium circulation channel | path can be improved more. In the first aspect, the insulator is formed by laminating two or more insulating members having different hardnesses, and at least the insulating member located on the partition body side is a highly flexible insulating member. Is desirable. In the first and second aspects, the opening size of the second opening may be larger than that of the first opening. Thereby, the assembly work is facilitated. In addition, it is possible to suppress heat escape from the heating space that has a large influence on wafer processing. Moreover, in said 1st aspect, it is desirable to further provide the 1st opening part obstruction body provided, forming a clearance gap between said 1st opening parts. In this case, it is preferable that a temperature detector for detecting the temperature of the heating element and a support portion for supporting the temperature detector are provided, and the insulator be provided between the second opening and the support portion.
A first aspect of the substrate processing apparatus according to the present invention is the reaction container according to the first or second aspect of the heating apparatus described above, wherein the heating apparatus has a heating space inside and the substrate is processed in the heating space. Is provided. According to another aspect of the substrate processing apparatus, in the aspect of the heating apparatus in which at least a part of a temperature detector that detects the temperature of the heating element is provided in the space of the heating apparatus, a heating space is provided inside the heating apparatus. And a reaction vessel for processing the substrate is provided in the heating space.
A first aspect of a method for manufacturing a semiconductor device according to the present invention includes a step of carrying a substrate into a reaction vessel, a heating element, an inner shell made of a conductive material that supports the heating element, An outer shell made of a conductive material, disposed on the outer periphery of the inner shell, a cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell, and a first opening provided in the inner shell And a second opening provided in the outer shell and a second opening from the first opening toward the second opening, or a gap is formed, or Provided so as to form a gap between the second opening and the first opening toward the first opening, at least between the inner shell and the outer shell. A partition body made of a conductive material for forming a space isolated from the medium flow path, and between the partition body and the second opening or between the partition body and the first opening; A detection result of the temperature detector in the heating device, comprising: an insulator that closes the gap formed between; and a temperature detector that is provided at least in part in the space and detects the temperature of the heating element. And processing the substrate by heating the inside of the reaction container while controlling the amount of heat generated from the heating element.
A second aspect of another method for manufacturing a semiconductor device according to the present invention includes a step of carrying a substrate into a reaction vessel, a heating element, an inner shell that supports the heating element, and an outer periphery of the inner shell. An outer shell, a cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, a second opening provided in the outer shell, Provided from the first opening toward the second opening or from the second opening toward the first opening, at least between the inner shell and the outer shell A partition body for forming a space isolated from the cooling medium flow path, and formed between the partition body and the second opening, or between the partition body and the first opening. Heating the reaction vessel in the heating device comprising an insulator closing the gap to be a step of processing the substrate.
The first aspect of the insulator according to the present invention is a heat generating element, an inner shell made of a conductive material that supports the heat generating element, and a conductive material disposed on the outer periphery of the inner shell. A configured outer shell, a cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, and a second opening provided in the outer shell, The first opening is provided so as to form a gap between the first opening and the second opening toward the second opening, or from the second opening to the first opening. Conductive for forming a space isolated from the cooling medium flow passage between at least the inner shell and the outer shell, which is provided to form a gap between the first opening and the first shell. A partition body made of the above material and a temperature detector that is provided at least in part in the space and detects the temperature of the heating element, and is an insulator used in a heating device at least, The gap formed between the second opening or between the partition body and the first opening is closed.
The second aspect of the other insulator according to the present invention includes a heating element, an inner shell that supports the heating element, an outer shell disposed on the outer periphery of the inner shell, and cooling between the inner shell and the outer shell. A cooling medium flow path for flowing a medium, a first opening provided in the inner shell, a second opening provided in the outer shell, and the first opening toward the second opening. A partition for forming a space isolated from the cooling medium flow passage between at least the inner shell and the outer shell, which is provided from the second opening toward the first opening. An insulator for use in a heating device comprising at least a body, between the partition body and the second opening or between the partition body and the first opening. Closing the gap formed.

  The present invention is, for example, film formation by oxidation treatment, diffusion treatment, carrier activation after ion implantation or planarization, annealing, and thermal CVD reaction on a semiconductor wafer on which a semiconductor integrated circuit device (semiconductor device) is formed. It can utilize for the substrate processing apparatus used for a process etc. The present invention is effective for a process in such a substrate processing apparatus particularly in a low temperature region.

It is a schematic sectional drawing of the processing furnace using the conventional heating apparatus. It is a longitudinal cross-sectional view which shows the outline of the substrate processing apparatus in this invention. FIG. 3 is a cross-sectional view in the vicinity of the ceiling portion of FIG. It is the A section enlarged view in FIG. It is the B section enlarged view in FIG. It is the C section enlarged view in FIG. It is the D section enlarged view in FIG. It is a cross-sectional view which shows the detail of a temperature sensor attachment part. It is a related figure of the inner / outer shell in the same cross section as FIG. It is a side view of a heating apparatus. It is a side view of a temperature sensor attachment part. FIG. 9 is a view corresponding to FIG. 8 illustrating another embodiment of the temperature sensor mounting portion. FIG. 10 is a view corresponding to FIG. 9 showing still another embodiment of the temperature sensor mounting portion. FIG. 9 is a view corresponding to FIG. 8 showing still another embodiment of the temperature sensor mounting portion. FIG. 9 is a view corresponding to FIG. 8 showing still another embodiment of the temperature sensor mounting portion. FIG. 9 is a view corresponding to FIG. 8 showing still another embodiment of the temperature sensor mounting portion. FIG. 9 is a view corresponding to FIG. 8 illustrating a first comparative example of a temperature sensor. FIG. 9 is a view corresponding to FIG. 8 illustrating a second comparative example of the temperature sensor.

Explanation of symbols

   1: substrate processing device, 3: heating device, 4: main control device, 4a: temperature monitoring unit, 4b: heating control unit, 4c: reflection control unit, 4d: first flow rate control unit, 4e: pressure control unit, 4f : Second flow controller, 4g: Exhaust controller, 4h: Drive controller, 5a: Flow controller, 5b: Flow controller, 5x: Reaction gas introduction pipe, 5y: Cooling gas supply line, 6a: Pressure controller , 6x: reaction gas exhaust pipe, 7: cooling gas supply line, 7a: open / close valve, 7b: quenching pipe, 7x: intake attachment, 7y: cooling gas introduction duct, 8: forced exhaust line, 8a: exhaust blower, 10: Ceiling part, 11: Intermediate part, 12: Lower part, 13: Terminal case, 14: Airway (cooling medium flow passage), 18: Heating space, 20: Heating element, 20a: Bending part, 21: Upper turning part, 22 : Lower folding part, 23: Wire part, 24: Clearance, 30: Hanging insulator, 31: Upper insulator, 32: Lower insulator, 33: Upper bracket, 34: Lower bracket, 34a: Clearance, 35: Pin, 36: Bo 40: quenching pipe, 40a: through hole, 40b: trough, 40d: penetration, 42: quenching pipe, 50: inner shell (side wall inner layer), 50s: gap, 50t: first flange, 50u : Insulation blanket, 50x: Second flange, 50y: Insulation blanket, 51: Connection insulator, 52: First bolt, 53: Collar, 54: Second bolt, 55a: Opening (first opening), 55b: Box (partition body), 55c: 鍔, 55x: Screw, 59: Water-cooled pipe, 60: Outer shell (side wall middle layer), 60x: Third flange, 60y: Thermal insulation blanket, 61: Pipe, 61a: Opening, 62: Column, 62a: rivet, 65: opening (second opening), 65a: gap, 70: decorative panel (side wall outer layer), 71: screw, 72a: bottom lid, 72b: coil wall, 81: exhaust conduit, 81a: exhaust port , 82: first aperture, 83: second aperture, 90: reflector, 91: reflector, 91a: gap, 92: moving mechanism, 93: shaft, 94: center plate, 95: Bolt, 99: Actuator, 100: Mounting structure, 101: Temperature sensor (temperature detector), 102: Thermocouple contact (temperature detector), 103: Protection tube, 103x: Clearance, 103y: Clearance, 104: Insulator tube, 105: inner cage, 106: outer cage, 107: insulator, 108: terminal, 109a: metal tube, 109b: set screw, 111: first packing, 111a: hole, 112: second packing, 112a: hole, 120a ~ c: Screw, 121: Temperature sensor (temperature detector), 125: Inner cage, 126: Outer cage, 127: Inner box, 128: Outer box, 129: Packing, 131: Temperature sensor (temperature detector), 132: Temperature sensor (temperature detector), 133: protection tube, 135a to c: dredging, 300: boat, 305: wafer, 308: processing chamber, 309: reaction vessel, 310: reaction tube, 315: heat equalizing tube, 317: soaking Heat pipe space, 320: L-type temperature sensor (temperature detector), 321: Contact (temperature detector), 322: Contact (temperature detector), 330: Temperature sensor (temperature detector), Z1 to Z5: Zone , H1 to H3: through hole, R: arc direction, V: penetration direction

Claims (5)

A heating element;
An inner shell made of a conductive material that supports the heating element;
An outer shell made of a conductive material, disposed on the outer periphery of the inner shell;
A cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell;
A first opening provided in the inner shell;
A second opening provided in the outer shell;
It is provided so as to form a gap between the first opening and the second opening toward the second opening, or from the second opening to the first opening. A conductive space for forming a space isolated from the cooling medium flow passage between at least the inner shell and the outer shell, which is provided so as to form a gap between the first opening and the first shell. A partition body made of a material;
An insulator that closes the gap formed between the partition body and the second opening or between the partition body and the first opening;
A temperature detector that is provided at least in part in the space and detects the temperature of the heating element;
A heating device comprising: The heating apparatus according to claim 1, wherein the insulator is formed by stacking two or more insulating members having different hardnesses. A substrate processing apparatus having a heating space inside the heating apparatus according to claim 1, wherein a reaction vessel for processing a substrate is provided in the heating space. Carrying the substrate into the reaction vessel;
A heating element, an inner shell made of a conductive material that supports the heating element, an outer shell made of a conductive material disposed on the outer periphery of the inner shell, and between the inner shell and the outer shell A cooling medium flow passage through which the cooling medium flows, a first opening provided in the inner shell, a second opening provided in the outer shell, and the second opening from the first opening. A gap is formed between the second opening and the second opening, or a gap is formed between the second opening and the first opening toward the first opening. A partition body made of an electrically conductive material for forming a space isolated from the cooling medium flow path between at least the inner shell and the outer shell,
An insulator for closing the gap formed between the partition body and the second opening or between the partition body and the first opening;
A temperature detector that is provided at least in part in the space and detects the temperature of the heating element;
And a step of processing the substrate by heating the inside of the reaction vessel while controlling the amount of heat generated from the heating element based on the detection result of the temperature detector in the heating device. A heating element;
An inner shell made of a conductive material that supports the heating element;
An outer shell made of a conductive material, disposed on the outer periphery of the inner shell;
A cooling medium flow passage for flowing a cooling medium between the inner shell and the outer shell;
A first opening provided in the inner shell;
A second opening provided in the outer shell;
The first opening is provided so as to form a gap between the first opening and the second opening, or from the second opening to the first opening. Conductivity for forming a space isolated from the cooling medium flow passage between at least the inner shell and the outer shell, which is provided so as to form a gap between the first opening and the first shell. A temperature detector for detecting the temperature of the heating element, wherein at least a part is provided in the partition body configured of the material and the space;
An insulator used for a heating device comprising at least an insulating material for closing the gap formed between the partition body and the second opening or between the partition body and the first opening. body.

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