JP2009032733A - Lead frame for light coupled semiconductor device, and method of manufacturing light coupled semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame for light coupled semiconductor device and a method of manufacturing the light coupled semiconductor device to form a highly accurate resin sealing part (light coupled semiconductor device) with good manufacturing yield by preventing leakage of sealing resin in view of reducing faults to be generated in the manufacturing processes. <P>SOLUTION: When a frame part 11 for a first element of the lead frame 10 for the first element and a frame part 21 for a second element of the lead frame 20 for the second element are overlapped with each other, a tie bar 12 for the first element is engaged with a groove part 25 of the frame part 21 of the second element. The tie bar 12 for the first element has a first convex part 16 opposing to the groove part 25 at a side surface in the side of the resin sealing part 30 and the groove part 25 has a concave part 26 to be engaged with the first convex part 16 at a side surface opposing to the tie bar 12 for the first element. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lead frame for an optically coupled semiconductor device applied to an optically coupled semiconductor device formed by optically coupling a semiconductor light emitting element and a semiconductor light receiving element and encapsulating the resin, and a lead for such an optically coupled semiconductor device. The present invention relates to an optically coupled semiconductor device manufacturing method for manufacturing an optically coupled semiconductor device by applying a frame.

  In a high-voltage electronic device such as a power supply circuit, a photocoupler (an optically coupled semiconductor device) is often applied because high insulation is required. The demand for photocouplers has become stricter as the price and functionality of electronic devices have been reduced, leading to demands for lower prices and higher reliability.

  In order to achieve low cost and high reliability, transfer mold type photocouplers have been proposed. In the manufacture of transfer mold type photocouplers, lead frames (lead frames for optically coupled semiconductor devices) suitable for transfer molds have been proposed.

  A conventional lead frame for an optically coupled semiconductor device will be described with reference to FIGS.

  14A and 14B are explanatory views for explaining a first element lead frame constituting a conventional optically coupled semiconductor device lead frame. FIG. 14A is a plan view, and FIG. 14B is an arrow B-B in FIG. FIG.

  FIGS. 15A and 15B are explanatory views for explaining a second element lead frame constituting a conventional optically coupled semiconductor device lead frame, wherein FIG. 15A is a plan view and FIG. 15B is a side view of FIG.

  The first element lead frame 110 and the second element lead frame 120 are relative to each other. For example, when a semiconductor light receiving element is mounted on the first element lead frame 110, the second element lead frame 120 includes a semiconductor. A light emitting element will be mounted. When a semiconductor light emitting element is mounted on the first element lead frame 110, a semiconductor light receiving element is mounted on the second element lead frame 120.

  The first element lead frame 110 includes a first element frame frame 111, a first element tie bar 112 extending in a cross direction from the first element frame frame 111, and an extension from the first element tie bar 112. And a first element header portion 114 on which a first optical semiconductor element chip (not shown) is mounted.

  The second element lead frame 120 includes a second element frame frame 121, a second element tie bar 122 extending from the second element frame frame 121 in the intersecting direction, and a second element tie bar 122. And a second element header portion 124 on which a second optical semiconductor element chip (not shown) is mounted.

  The second element frame frame 121 has a groove 125 into which the first element tie bar 112 is fitted when the first element frame frame 111 and the second element frame frame 121 are overlapped.

  Further, the first element tie bar 112 is formed with a bent portion 115 so as to be fitted into the groove portion 125 when the first element frame frame portion 111 and the second element frame frame portion 121 are overlapped. That is, the first element tie bar 112 is bent in accordance with the plate thickness of the second element frame frame 121.

  FIG. 16 is a plan view showing a state in which a lead frame for a first element and a lead frame for a second element constituting a conventional lead frame for an optically coupled semiconductor device are overlapped.

  FIG. 17 is a plan view showing a state where a resin sealing portion is formed on a conventional lead frame for an optically coupled semiconductor device.

  For example, a first element lead frame 110 on which a semiconductor light emitting element is mounted and a second element lead frame 120 on which a semiconductor light receiving element is mounted are overlapped. That is, the first element lead frame 110 and the second element lead frame 120 constitute an optically coupled semiconductor device lead frame.

  After the first element frame frame portion 111 and the second element frame frame portion 121 are overlapped, the first element header portion 114 (for example, a semiconductor light emitting element) and the second element header portion 124 (for example, a semiconductor light receiving element). The resin sealing portion 130 is formed so as to be in an optically coupled state. The sealing resin forming the resin sealing portion 130 is blocked by the resin filling region Rfa defined by the first element tie bar 112 and the second element tie bar 122, and the resin sealing portion 130 can be formed. Become.

  After forming the resin sealing portion 130, the optically coupled semiconductor device lead frame (first element tie bar 112, second element tie bar 122) is appropriately cut, and the resin burrs are removed to form the optically coupled semiconductor device. It becomes.

  18A and 18B are explanatory views showing a state of a resin leakage path when a resin sealing portion is formed with respect to a conventional lead frame for an optically coupled semiconductor device. FIG. 18A is an enlarged plan view, and FIG. It is an end view which shows the end surface of the cross section by arrow BB of A).

  A state where the sealing resin leaks from the resin filling region Rfa when the resin sealing portion 130 shown in FIG. 17 is formed will be described.

  Since the first element tie bar 112 bent in the groove part 125 of the second element frame 121 is fitted, the resin leakage path Rrs of the sealing resin leaking from the resin filling region Rfa is the second element frame. The area 121 and the first element frame frame section 111 are dammed up.

  FIG. 19 is an explanatory view showing a state in which a resin leakage path is short when a resin sealing portion is formed with respect to a conventional lead frame for an optically coupled semiconductor device, (A) is an enlarged plan view, (B) ) Is an end view showing the end face of the cross section at arrow BB in (A).

  In order to reduce the cost, the lead frame for an optically coupled semiconductor device is also reduced in size and size in order to increase the number of units per unit area. For example, in the case of a conventional lead frame for an optically coupled semiconductor device, it is required to reduce the width Wf of the frame frame portion 121 for the second element, and as a result, the length Lg of the groove portion 125 may be shortened.

  When the length Lg of the groove 125 is shortened, the sealing resin leaked from the resin filling region Rfa is connected to the first element lead frame 110 (the first element frame frame 111) and the second through the resin leakage path Rrs. There is a possibility that the element lead frame 120 (second element frame frame portion 121) may wrap around the area where the element lead frame 120 (second element frame frame portion 121) is overlapped to form the leakage resin region Rta beyond the first element tie bar 112.

  Further, when the gap Gi between the first element tie bar 112 and the groove part 125 of the second element frame frame 121 is narrowed to prevent leakage of the sealing resin, light is emitted when the resin sealing part 130 is formed. Since heat is applied to the lead frame for the coupled semiconductor device, the lead frame for the optically coupled semiconductor device is thermally expanded, and the first element tie bar 112 cannot be normally fitted into the groove portion 125, which may cause a process failure. .

  That is, ideally, it is desirable that there is a sufficient margin between the first element tie bar 112 and the groove portion 125 and that the sealing resin does not leak through the resin leakage path Rrs.

  As a method for solving such a conventional problem, there is a method of enlarging the overlapping region to increase the distance of the resin leakage path Rrs and stopping the sealing resin in the middle of the resin leakage path Rrs.

  However, when the width Wf of the second element frame frame 121 is wide, the number of products that can be obtained decreases and the productivity decreases, which is not preferable in terms of production efficiency. Further, widening the width Wf of the second element frame frame 121 increases the number of useless portions of the lead frame for an optically coupled semiconductor device, which causes a problem of increased material costs.

For example, Patent Document 1 discloses the shape of a lead frame for an optically coupled semiconductor device in which measures against resin leakage are taken, but it is difficult to solve the above-described problems. Further, Patent Literature 2, Patent Literature 3, and the like are disclosed as lead frames for optically coupled semiconductor devices.
JP-A-6-237010 Japanese Patent Laid-Open No. 3-141677 Japanese Patent Laid-Open No. 6-132561

  The present invention has been made in view of such a situation, and has a second groove portion into which the first element tie bar is fitted when the first element frame frame portion and the second element frame frame portion are overlapped. This is a case where the lead frame for the optically coupled semiconductor device is downsized by providing the element frame frame portion and the first element tie bar having the first convex portion facing the groove portion on the side surface on the resin sealing portion side. However, it is possible to provide a lead frame for an optically coupled semiconductor device that can prevent resin leakage of the encapsulating resin, reduce process defects, and form a highly accurate resin-encapsulated portion (optically coupled semiconductor device) with high yield. Objective.

  The present invention also provides a lead frame fitting step in which the first element lead frame and the second element lead frame are overlapped, and the first element tie bar is fitted into the groove of the second element frame frame, The lead frame for an optically coupled semiconductor device can be reduced in size by providing a pressing process for pressing the region extending between the first convex portion and the groove portion that the one-element tie bar faces the groove portion on the side surface on the resin sealing portion side. Even in the case of reducing the resin leakage path, it is possible to prevent leakage of the sealing resin in the resin sealing process, reduce process defects, and form a highly accurate resin sealing portion. It is another object to provide a method for manufacturing an optically coupled semiconductor device.

  A lead frame for an optically coupled semiconductor device according to the present invention includes a first element frame frame portion, a first element tie bar extending in an intersecting direction from the first element frame frame portion, and the first element tie bar. A first element lead frame having a first element header portion disposed at a front end of a first element lead terminal extended from the first element and having a first optical semiconductor element chip mounted thereon; and a second element frame frame portion A second element tie bar extending in a cross direction from the second element frame frame portion, and a second optical semiconductor element disposed at the tip of a second element lead terminal extended from the second element tie bar A second element lead frame having a second element header portion on which a chip is mounted; and the first optical semiconductor element is formed by overlapping the first element frame frame portion and the second element frame frame portion. Chi And a lead frame for an optically coupled semiconductor device that forms an optically coupled semiconductor device by forming a resin sealing portion so that the second optical semiconductor element chip can be optically coupled. The frame frame portion has a groove portion into which the first element tie bar is fitted when the first element frame frame portion and the second element frame frame portion are overlapped, and the first element tie bar is It has the 1st convex part which counters the above-mentioned slot on the side by the side of the above-mentioned resin sealing part.

  With this configuration, even when the width of the frame frame portion for the second element is reduced to reduce the length of the groove portion in the direction of the resin outflow path, the resin leakage path can be narrowed or lengthened. Even when the lead frame for a coupled semiconductor device is downsized, resin leakage of the sealing resin can be prevented, process defects can be reduced, and a highly accurate resin sealing portion can be formed with high yield.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the groove portion has a concave portion that meshes with the first convex portion on a side surface facing the first element tie bar.

  With this configuration, the resin leakage path can be reliably narrowed or lengthened.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the first element tie bar has a second convex portion along the second element frame frame portion on a side surface on the resin sealing portion side. Features.

  With this configuration, the resin leakage path can be more reliably narrowed or lengthened.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the frame frame portion for the second element has a third protrusion along the first element tie bar on a side surface on the resin sealing portion side. Features.

  With this configuration, the resin leakage path can be more reliably narrowed or lengthened.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the first convex portion has a thin plate portion made thinner than a plate thickness of the first element tie bar, and the concave portion is a frame frame for the second element. The thin plate portion of the first convex portion and the thin plate portion of the concave portion are disposed on opposite surfaces and are formed to be in contact with each other and overlap each other. It is characterized by being.

  With this configuration, since the thin plate portion of the first convex portion and the thin plate portion of the concave portion are brought into contact with each other, the resin leakage path can be narrowed or lengthened, and leakage of the sealing resin through the resin leakage path can be achieved. It becomes possible to shut off reliably.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the side surface of the first convex portion has an inclined portion inclined from one surface to the other surface, and the side surface of the concave portion is one surface. An inclined portion inclined from one side to the other surface, and the inclined portion of the first convex portion and the inclined portion of the concave portion are arranged so as to face each other and are formed to overlap each other. It is characterized by.

  With this configuration, since the inclined portion of the first convex portion and the inclined portion of the concave portion face each other, both inclined portions can be brought close to each other, and leakage of the sealing resin through the resin leakage path is ensured. It becomes possible to suppress and prevent.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the first convex portion has a stepped portion having a plurality of plate thicknesses thinner than the plate thickness of the first element tie bar, and the concave portion is A step portion having a plurality of thicknesses smaller than a plate thickness of the frame frame portion for the second element, and the step portion of the first protrusion and the step portion of the recess are arranged on opposite surfaces. And are formed so as to be engaged with each other.

  With this configuration, the stepped portion of the first convex portion and the stepped portion of the recessed portion are engaged with each other, so that leakage of the sealing resin through the resin leakage path can be reliably suppressed and prevented.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the groove portion has a groove bottom portion serving as a bottom surface in the middle of the plate thickness of the second element frame frame portion, and the first element tie bar. The fitting thin plate portion fitted into the groove portion is made thinner than the plate thickness of the first element tie bar.

  With this configuration, the resin leakage path can be more reliably narrowed.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the region extending over the groove and the first protrusion is pressed.

  With this configuration, it is possible to narrow the space for the alignment margin between the second element frame frame (groove) and the first element tie bar (first protrusion) by pressing. Thus, the resin leakage path can be more reliably narrowed.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the frame frame portion for the second element includes a through hole in the vicinity of the groove portion.

  With this configuration, it is possible to absorb the thermal expansion of the optically coupled semiconductor device lead frame (second element lead frame) during resin sealing, and it is possible to absorb stress and improve fitting accuracy.

  In the lead frame for an optically coupled semiconductor device according to the present invention, the first element frame frame portion includes a through hole in the vicinity of the first element tie bar.

  With this configuration, it is possible to absorb the thermal expansion of the optically coupled semiconductor device lead frame (first element lead frame) during resin sealing, and it is possible to absorb stress and improve fitting accuracy.

  In the lead frame for an optically coupled semiconductor device according to the present invention, when the first element tie bar is fitted in the groove, the first element tie bar and the second element tie bar corresponding to the resin sealing part are provided. Is formed to be flush with each other.

  With this configuration, the resin sealing portion can be formed with high accuracy and high yield with less resin leakage in the resin leakage path.

  Further, the optically coupled semiconductor device manufacturing method according to the present invention includes a first element lead including a first element frame frame and a first element tie bar extending in a crossing direction from the first element frame frame. A first lead frame preparation step of preparing a first element lead frame by mounting a first optical semiconductor element chip on a first element header portion of the frame; a second element frame frame portion; and a second element frame portion A second optical semiconductor element chip is mounted on a second element header portion of a second element lead frame having a second element tie bar extending in a cross direction from the frame frame portion, and the second element lead frame is mounted. The second lead frame preparation step to be prepared, and the first element lead frame and the second element lead frame are overlapped with each other in the groove portion of the second element frame frame portion. A lead frame fitting step for fitting a tie bar for one element, and a state in which the first optical semiconductor element chip and the second optical semiconductor element chip can be optically coupled with the first tie bar for the element being fitted in the groove. And a resin sealing step for forming a resin sealing portion so that the first element tie bar is on the resin sealing portion side after the lead frame fitting step. And a pressing step of pressing the region extending between the first convex portion and the groove portion facing the groove portion on the side surface.

  With this configuration, it is possible to press the region extending over the groove and the first convex portion after the lead frame fitting step, so even if the lead frame for an optically coupled semiconductor device is downsized, the resin Provided is a method for manufacturing an optically coupled semiconductor device capable of narrowing a leakage path to prevent leakage of a sealing resin in a resin sealing process, reducing process defects, and forming a highly accurate resin sealing portion. can do.

  According to the lead frame for an optically coupled semiconductor device according to the present invention, the second element frame frame portion includes the first element tie bar when the first element frame frame portion and the second element frame frame portion overlap each other. Since the first element tie bar has a first convex part that faces the groove part on the side surface on the resin sealing part side, the width of the second element frame frame part is reduced to form the groove part. Even when the length of the resin in the direction of the resin outflow path is reduced, the resin leakage path can be narrowed or lengthened. Even if the lead frame for an optically coupled semiconductor device is downsized, sealing is possible. There is an effect that the resin leakage of the resin can be prevented, process defects can be reduced, and a highly accurate resin sealing portion can be formed with a high yield.

  According to the optically coupled semiconductor device manufacturing method of the present invention, the first element tie bar is placed in the groove of the second element frame frame by overlapping the first element lead frame and the second element lead frame. A lead frame fitting step for fitting, and a pressing step for pressing a region extending between the first convex portion and the groove portion that the first element tie bar has on the side surface on the resin sealing portion side facing the groove portion. Even when the lead frame for an optically coupled semiconductor device is downsized, the resin leakage path is narrowed to prevent leakage of the sealing resin in the resin sealing process, and the process defects are reduced to provide a high-precision resin. There is an effect that it is possible to provide a method for manufacturing an optically coupled semiconductor device capable of forming a sealing portion.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
The lead frame for an optically coupled semiconductor device according to the first embodiment of the present invention will be described with reference to FIGS.

  1A and 1B are explanatory views for explaining a lead frame for a first element constituting a lead frame for an optically coupled semiconductor device according to Embodiment 1 of the present invention. FIG. 1A is a plan view, and FIG. It is an end view which shows the end surface of the cross section by arrow BB of).

  2A and 2B are explanatory views for explaining a second element lead frame constituting the lead frame for an optically coupled semiconductor device according to the first embodiment of the present invention. FIG. 2A is a plan view, and FIG. FIG. In the side view, the second element header portion is omitted.

  The lead frame for an optically coupled semiconductor device according to the present embodiment for forming the optically coupled semiconductor device includes a first element lead frame 10 and a second element lead frame 20. That is, the first element lead frame 10 and the second element lead frame 20 constitute an optically coupled semiconductor device lead frame.

  As described for the prior art, the first element lead frame 10 and the second element lead frame 20 are relative to each other. For example, when the semiconductor light receiving element is mounted on the first element lead frame 10, the second element A semiconductor light emitting element is mounted on the lead frame 20 for use. When a semiconductor light emitting element is mounted on the first element lead frame 10, a semiconductor light receiving element is mounted on the second element lead frame 20.

  Hereinafter, the semiconductor element mounted on the first element lead frame 10 is referred to as a first optical semiconductor element chip, and the semiconductor element mounted on the second element lead frame 20 is referred to as a second optical semiconductor element chip. Since the present invention relates to a lead frame for an optically coupled semiconductor device, description of the semiconductor element is omitted.

  The first element lead frame 10 includes a first element frame frame 11, a first element tie bar 12 extending in the crossing direction from the first element frame frame 11, and an extension from the first element tie bar 12. The first element header portion 14 is disposed at the tip of the first element lead terminal 13 and has a first optical semiconductor element chip (not shown) mounted thereon.

  The second element lead frame 20 includes a second element frame frame portion 21, a second element tie bar 22 extending from the second element frame frame portion 21 in the crossing direction, and a second element tie bar 22. And a second element header portion 24 on which a second optical semiconductor element chip (not shown) is mounted.

  The second element frame frame portion 21 has a groove 25 into which the first element tie bar 12 is fitted when the first element frame frame portion 11 and the second element frame frame portion 21 are overlapped. Therefore, the groove portion 25 is formed so as to penetrate the second element frame frame portion 21 in the plate thickness Tf direction.

  Further, the first element tie bar 12 is formed with a bent portion 15 so as to be fitted into the groove portion 25 when the first element frame frame portion 11 and the second element frame frame portion 21 are overlapped. That is, the first element tie bar 12 is bent in accordance with the thickness of the second element frame frame 21 (see FIG. 1B).

  The first element lead frame 10 has a planar first element tie bar 12 bent by a plate thickness with respect to the planar first element frame frame portion 11. The second element lead frame 20 has a planar shape, and the first element frame frame portion 11 is overlaid on the second element frame frame portion 21. Accordingly, the second element lead frame 20 and the first element tie bar 12 are in the same plane.

  The first element header portion 14 and the second element header portion 24 are formed by being appropriately bent so that the first optical semiconductor element chip and the second optical semiconductor element chip can be optically coupled. Since this point is as known in the art, the description thereof is omitted.

  FIG. 3 is a plan view showing a state in which a resin sealing portion is formed on the lead frame for an optically coupled semiconductor device according to the embodiment of the present invention.

  For example, a first element lead frame 10 (first element frame frame portion 11) on which a semiconductor light emitting element is mounted, and a second element lead frame 20 (second element frame frame portion 21) on which a semiconductor light receiving element is mounted; And the first element tie bar 12 is fitted into the groove 25.

  In a state in which the first element tie bar 12 is fitted in the groove 25, the first element tie bar 12 and the second element tie bar 22 corresponding to the resin sealing portion 30 are formed to be flush with each other. Therefore, there is little resin leakage in the resin leakage path Rrs (see FIG. 4), and it becomes possible to suppress the process defects and form the resin sealing portion 30 with high accuracy and high yield.

  After the first element frame frame portion 11 and the second element frame frame portion 21 are overlaid, the first element header portion 14 (for example, a semiconductor light emitting element) and the second element header portion 24 (for example, a semiconductor light receiving element). The resin sealing portion 30 is formed by applying a well-known sealing technique (transfer mold) so as to be in an optically coupled state.

  The sealing resin forming the resin sealing portion 30 is blocked by the resin filling region Rfa defined by the first element tie bar 12 and the second element tie bar 22, and the resin sealing portion 30 can be formed. Become.

  After forming the resin sealing portion 30, the optically coupled semiconductor device lead frame (first element tie bar 12, second element tie bar 22) is appropriately cut, and the resin burrs are removed to form the optically coupled semiconductor device. It becomes.

  4A and 4B are explanatory diagrams for explaining the main configuration of the lead frame for an optically coupled semiconductor device according to the first embodiment of the present invention, where FIG. 4A is an enlarged plan view and FIG. 4B is an arrow of FIG. It is an end elevation which shows the end surface of the cross section in BB.

  As described above, the second element frame frame portion 21 has the groove 25 into which the first element tie bar 12 is fitted when the first element frame frame portion 11 and the second element frame frame portion 21 are overlapped. . Further, the first element tie bar 12 has a first convex portion 16 facing the groove portion 25 on the side surface on the resin sealing portion 30 side.

  Accordingly, even when the width Wf of the second element frame 21 is reduced to reduce the length Lg of the groove 25 in the resin leakage path direction, the resin leakage path Rrs can be narrowed or lengthened. Thus, even when the lead frame for an optically coupled semiconductor device is downsized, it is possible to prevent the resin leakage of the sealing resin, reduce process defects, and form the resin sealing portion 30 with high yield and high accuracy. .

  Further, the groove 25 has a concave portion 26 that meshes with the first convex portion 16 on the side surface facing the first element tie bar 12. Therefore, the resin leakage path Rrs can be reliably narrowed or lengthened. In addition, the same effect | action is acquired also when the 1st convex part 16 is made to oppose the groove part 25 in the state which does not provide the recessed part 26. FIG.

  Since the resin leakage path Rrs can be extended, even when the gap Gi between the first element tie bar 12 and the groove 25 is widened, the resistance to leakage of the sealing resin in the resin leakage path Rrs is Since it is large, it becomes possible to suppress and prevent resin leakage.

  As the lead frame for the optically coupled semiconductor device (the lead frame for the first element 10 and the lead frame for the second element 20), a copper material or an iron material is used, but even when a material having a relatively large thermal expansion is used. There is a big effect.

  According to the lead frame for an optically coupled semiconductor device according to the present embodiment, it is possible to improve productivity by suppressing and reducing process defects such as resin leakage while maintaining production efficiency as compared with the conventional case. It becomes.

<Embodiment 2>
A lead frame for an optically coupled semiconductor device according to the second embodiment of the present invention will be described with reference to FIGS. The present embodiment is a modification of the first embodiment in which a convex portion is supplementarily added to the first element tie bar 12 or the second element frame frame portion 21.

  The basic configuration of the optically coupled semiconductor device lead frame according to the present embodiment is the same as that of the optically coupled semiconductor device lead frame according to the first embodiment. The different items will be described.

  FIG. 5 is an enlarged plan view showing an essential configuration of a lead frame for optically coupled semiconductor devices (Modification 1) according to Embodiment 2 of the present invention.

  The first element tie bar 12 provided in the first element lead frame 10 according to the present embodiment has a second convex portion 17 along the second element frame frame portion 21 on the side surface on the resin sealing portion 30 side. Therefore, the resin leakage path Rrs can be further narrowed or lengthened more reliably, and a further excellent effect can be obtained as compared with the first embodiment.

  FIG. 6 is an enlarged plan view showing an essential configuration of a lead frame for optically coupled semiconductor devices (modification 2) according to Embodiment 2 of the present invention.

  The optically coupled semiconductor device lead frame shown in FIG. 6 narrows or lengthens the resin leakage path Rrs, similar to the optically coupled semiconductor device lead frame shown in FIG.

  The second element frame frame portion 21 provided in the second element lead frame 20 according to the present embodiment has a third convex portion 27 along the first element tie bar 12 on the side surface on the resin sealing portion 30 side. Therefore, the resin leakage path Rrs can be further narrowed or lengthened more reliably, and a further excellent effect can be obtained as compared with the first embodiment.

<Embodiment 3>
Based on FIG. 7 thru | or FIG. 9, the lead frame for optically coupled semiconductor devices which concerns on Embodiment 3 of this invention is demonstrated. The present embodiment is a modification of the first embodiment in which the first element tie bar 12 or the second element frame frame 21 is modified in the thickness direction.

  The basic configuration of the optically coupled semiconductor device lead frame according to the present embodiment is the same as that of the optically coupled semiconductor device lead frame according to the first and second embodiments. Is mainly described for different matters.

  FIGS. 7A and 7B are explanatory diagrams for explaining the main configuration of a lead frame for optically coupled semiconductor devices according to Embodiment 3 of the present invention (Modification 3). FIG. 7A is an enlarged plan view, and FIG. It is an end view which shows the cross section in the arrow BB of A).

  The first convex portion 16 included in the first element lead frame 10 according to the present embodiment has a thin plate portion 16 h that is thinner than the plate thickness Tt of the first element tie bar 12. Further, the recess 26 of the second element lead frame 20 according to the present embodiment has a thin plate portion 26 h that is thinner than the plate thickness Tf of the second element frame frame portion 21.

  Further, the thin plate portion 16h of the first convex portion 16 and the thin plate portion 26h of the concave portion 26 are arranged on opposite surfaces and are formed so as to be in contact with each other and overlapped.

  That is, since the thin plate portion 16h of the first convex portion 16 and the thin plate portion 26h of the concave portion 26 are brought into contact with each other, the resin leakage path Rrs can be narrowed or lengthened, and sealing via the resin leakage path Rrs is performed. It is possible to reliably suppress and prevent resin leakage.

  FIG. 8 is an end view showing a cross section of the main part configuration of the lead frame for optically coupled semiconductor devices (Modification 4) according to Embodiment 3 of the present invention. Since the plan view can be configured in the same manner as in the third modification, the illustration is omitted.

  The side surface of the first convex portion 16 included in the first element lead frame 10 according to the present embodiment has an inclined portion 16sp that is inclined from one surface to the other surface. Further, the side surface of the recess 26 included in the second element lead frame 20 according to the present embodiment has an inclined portion 26sp that is inclined from one surface to the other surface.

  Further, the inclined portion 16sp of the first convex portion 16 and the inclined portion 26sp of the concave portion 26 are disposed so as to face each other and are formed to overlap each other.

  That is, since the inclined portion 16sp of the first convex portion 16 and the inclined portion 26sp of the concave portion 26 face each other, the inclined portions 16sp and 26sp can be brought close to each other, and the sealing resin via the resin leakage path Rrs can be made. Leakage can be reliably suppressed and prevented.

  FIG. 9 is an end view showing a cross section of the main part configuration of the lead frame for optically coupled semiconductor devices (Modification 5) according to Embodiment 3 of the present invention. Since the plan view can be configured in the same manner as in the third modification, the illustration is omitted.

  The first convex portion 16 of the first element lead frame 10 according to the present embodiment has a step formed by a plurality of plate thicknesses (Tt1 <Tt2 <Tt) smaller than the plate thickness Tt of the first element tie bar 12. Part 16st. Further, the recess 26 of the second element lead frame 20 according to the present embodiment is configured with a plurality of plate thicknesses (Tf1 <Tf2 <Tf) that are thinner than the plate thickness Tf of the second element frame frame portion 21. A step 26st is provided.

  Further, the step portion 16st of the first convex portion 16 and the step portion 26st of the concave portion 26 are disposed on opposite surfaces and are formed to be engaged with each other.

  That is, by making the plate thickness Tf2 face the plate thickness Tt1 and the plate thickness Tf1 face the plate thickness Tt2, the step portion 16st of the first convex portion 16 and the step portion 26st of the concave portion 26 are engaged with each other. Thus, it is possible to reliably suppress and prevent leakage of the sealing resin through the resin leakage path Rrs.

<Embodiment 4>
Based on FIG. 10, an optically coupled semiconductor device lead frame according to a fourth embodiment of the present invention will be described. In the present embodiment, the first element tie bar 12 and the groove portion 25 of the second element frame frame portion 21 are fitted to each other, and the shape is changed in the plate thickness direction. It is a modification with respect to.

  The basic configuration of the optically coupled semiconductor device lead frame according to the present embodiment is the same as that of the optically coupled semiconductor device lead frame according to the first to third embodiments. Is mainly described for different matters.

  10A and 10B are explanatory views for explaining the configuration of the main part of a lead frame for optically coupled semiconductor devices according to Embodiment 4 of the present invention (Modification 6). FIG. 10A is an enlarged plan view, and FIG. It is an end view which shows the cross section in the arrow BB of A).

  The planar shapes of the first element lead frame 10 and the second element lead frame 20 according to the present embodiment are the same as in the first modification of the second embodiment (FIG. 5). In contrast to the modified example 1, in the present embodiment (modified example 6), the groove part 25 is configured to have a groove bottom part 25b serving as a bottom surface in the middle of the plate thickness Tf of the frame frame part 21 for the second element. The groove bottom portion 25b can be formed by, for example, half-etching the second element frame frame portion 21.

  That is, the groove portion 25 has a groove bottom portion 25b in the middle of the plate thickness Tf of the second element frame frame portion 21, and the fitting thin plate portion 12h fitted into the groove portion 25 of the first element tie bar 12 It is made thinner than the plate thickness Tt of the tie bar 12 for one element. The fitting thin plate portion 12h is flush with the first element tie bar 12 in contact with the groove bottom portion 25b.

  Therefore, the resin leakage path Rrs can be more reliably narrowed compared to the first modification.

<Embodiment 5>
Based on FIG. 11, an optically coupled semiconductor device manufacturing method for manufacturing an optically coupled semiconductor device lead frame according to Embodiment 5 of the present invention and an optically coupled semiconductor device to which such an optically coupled semiconductor device lead frame is applied. explain.

  The present embodiment is a modification in which press working is applied to the lead frame for an optically coupled semiconductor device shown in the first embodiment (FIG. 4).

  The basic configuration of the optically coupled semiconductor device lead frame according to the present embodiment is the same as that of the optically coupled semiconductor device lead frame according to the first to fourth embodiments. Is mainly described for different matters.

  As described above, the optically coupled semiconductor device lead frame according to the present embodiment has a planar shape similar to that of the first embodiment. However, the present invention is not limited to this, and the present invention can be similarly applied to a lead frame for optically coupled semiconductor devices according to other embodiments.

  FIG. 11 is an enlarged plan view showing an essential configuration of the lead frame for optically coupled semiconductor devices (modification 7) according to the fifth embodiment of the present invention.

  In the present embodiment, press working is performed on the region extending over the groove 25 and the first convex portion 16 (press working region Ps).

  Accordingly, it is possible to narrow the space for the alignment margin between the second element frame frame portion 21 (groove portion 25) and the first element tie bar 12 (first convex portion 16) by pressing. As a result, the resin leakage path Rrs can be more reliably narrowed.

  Further, as described above, an optically coupled semiconductor device manufacturing method to which the optically coupled semiconductor device lead frame according to the present embodiment is applied will also be described as the present embodiment. The method for manufacturing an optically coupled semiconductor device according to the present embodiment can be similarly applied to the optically coupled semiconductor device lead frame according to another embodiment, except for a pressing process in which pressing is performed. It is.

  The optically coupled semiconductor device manufacturing method according to the present embodiment includes a first lead frame preparation process, a second lead frame preparation process, a lead frame fitting process, a pressing process, and a resin sealing process.

  In the first lead frame preparation step, the first element lead frame 10 including the first element frame frame portion 11 and the first element tie bar 12 extending in the crossing direction from the first element frame frame portion 11 is included. A first optical semiconductor element chip (not shown) is mounted on the first element header portion 14 to prepare the first element lead frame 10.

  In the second lead frame preparation step, the second element lead frame 20 including the second element frame frame portion 21 and the second element tie bar 22 extending in the intersecting direction from the second element frame frame portion 21 is included. A second optical semiconductor element chip (not shown) is mounted on the second element header to prepare a second element lead frame 20.

  In the lead frame fitting step, the first element tie bar 12 is fitted into the groove 25 of the second element frame frame 21 by overlapping the first element lead frame 10 and the second element lead frame 20.

  After the lead frame fitting step (the state in which the first element lead frame 10 and the second element lead frame 20 are overlapped), press working is performed.

  In the pressing step, the first element tie bar 12 presses a region (press processing region Ps) extending between the first convex portion 16 and the groove portion 25 which is opposed to the groove portion 25 on the side surface on the resin sealing portion 30 side.

  After the pressing step, the resin sealing portion 30 is formed by a resin sealing step to which a known transfer mold technique is applied.

  In the resin sealing step, the resin sealing portion 30 is formed so that the first optical semiconductor element chip and the second optical semiconductor element chip can be optically coupled with the first element tie bar 12 fitted in the groove 25. Form.

  In the manufacturing method of the optically coupled semiconductor device according to the present embodiment, the region extending over the groove 25 and the first convex portion 16 (pressed region Ps) is pressed after the lead frame fitting step. Even when the lead frame for use is downsized, the resin leakage path Rrs is narrowed to prevent leakage of the sealing resin in the resin sealing process, and the process defects are reduced and the high-precision resin sealing portion 30 is provided. Can be formed.

<Embodiment 6>
A lead frame for an optically coupled semiconductor device according to Embodiment 6 of the present invention will be described with reference to FIGS. The present embodiment is a modification that can be applied to the lead frame for an optically coupled semiconductor device shown in the first to fifth embodiments.

  The basic configuration of the optically coupled semiconductor device lead frame according to the present embodiment is the same as that of the optically coupled semiconductor device lead frame according to the first to fifth embodiments. Is mainly described for different matters.

  FIG. 12 is a plan view showing a second element lead frame constituting the optically coupled semiconductor device lead frame (modification 8) according to the sixth embodiment of the present invention.

  In the second element lead frame 20 according to the present embodiment, the second element frame frame portion 21 includes a through hole 28 in the vicinity of the groove portion 25.

  Therefore, it is possible to absorb the thermal expansion of the optically coupled semiconductor device lead frame (second element lead frame 20) during resin sealing, and it is possible to absorb stress and improve fitting accuracy.

  FIG. 13 is a plan view showing a lead frame for a first element constituting a lead frame for optically coupled semiconductor devices (Modification 9) according to Embodiment 6 of the present invention.

  In the first element lead frame 10 according to the present embodiment, the first element frame frame portion 11 includes a through hole 18 in the vicinity of the first element tie bar 12.

  Therefore, it is possible to absorb the thermal expansion of the optically coupled semiconductor device lead frame (first element lead frame 10) during resin sealing, and it is possible to absorb the stress and improve the fitting accuracy.

It is explanatory drawing explaining the lead frame for 1st elements which comprises the lead frame for optically coupled semiconductor devices which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is an arrow of (A). It is an end view which shows the end surface of the cross section in BB. It is explanatory drawing explaining the lead frame for 2nd elements which comprises the lead frame for optically coupled semiconductor devices which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a side view of (A). It is. It is a top view which shows the state which formed the resin sealing part with respect to the lead frame for optical coupling semiconductor devices which concerns on embodiment of this invention. It is explanatory drawing explaining the principal part structure of the lead frame for optically coupled semiconductor devices which concerns on Embodiment 1 of this invention, (A) is an enlarged plan view, (B) is the arrow BB of (A). It is an end view which shows the end surface of a cross section. It is an enlarged plan view which expands and shows the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 2 of this invention (modification 1). It is an enlarged plan view which expands and shows the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 2 of this invention (modification 2). It is explanatory drawing explaining the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 3 of this invention (modification 3), (A) is an enlarged plan view, (B) is the arrow of (A). It is an end view which shows the cross section by the code | symbol BB. It is an end elevation which shows the cross section in the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 3 of this invention (modification 4). Since the plan view can be configured in the same manner as in the third modification, the illustration is omitted. It is an end elevation which shows the cross section in the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 3 of this invention (modification 5). Since the plan view can be configured in the same manner as in the third modification, the illustration is omitted. It is explanatory drawing explaining the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 4 of this invention (modification 6), (A) is an enlarged plan view, (B) is the arrow of (A). It is an end view which shows the cross section by the code | symbol BB. It is an enlarged plan view which expands and shows the principal part structure of the lead frame for optical coupling semiconductor devices which concerns on Embodiment 5 of this invention (modification 7). It is a top view which shows the lead frame for 2nd elements which comprises the lead frame for optical coupling semiconductor devices which concerns on Embodiment 6 of this invention (modification 8). It is a top view which shows the lead frame for 1st elements which comprises the lead frame for optical coupling semiconductor devices which concerns on Embodiment 6 of this invention (modification 9). It is explanatory drawing explaining the lead frame for 1st elements which comprises the conventional lead frame for optical coupling semiconductor devices, (A) is a top view, (B) is an end elevation in the arrow BB of (A). It is. It is explanatory drawing explaining the lead frame for 2nd elements which comprises the conventional lead frame for optical coupling semiconductor devices, (A) is a top view, (B) is a side view of (A). It is a top view which shows the state which overlap | superposed the lead frame for 1st elements and the lead frame for 2nd elements which comprise the conventional lead frame for optical coupling semiconductor devices. It is a top view which shows the state which formed the resin sealing part with respect to the conventional lead frame for optical coupling semiconductor devices. It is explanatory drawing which shows the state of the resin leak path | route when forming a resin sealing part with respect to the conventional lead frame for optical coupling semiconductor devices, (A) is an enlarged plan view, (B) is an arrow of (A). It is an end view which shows the end surface of the cross section by reference BB. It is explanatory drawing which shows a state in case the resin leak path | route when forming a resin sealing part with respect to the conventional lead frame for optical coupling semiconductor devices is short, (A) is an enlarged plan view, (B) is (A). It is an end view which shows the end surface of the cross section by arrow BB of).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 1st element lead frame 11 1st element frame frame 12 1st element tie bar 12h Fitting thin plate part 13 1st element lead terminal 14 1st element header part 15 Bending part 16 1st convex part 16h Thin plate Part 16sp Inclined part 16st Step part 17 Second convex part 18 Through hole 20 Second element lead frame 21 Second element frame frame part 22 Second element tie bar 23 Second element lead terminal 24 Second element header part 25 Groove portion 25b Groove bottom portion 26 Recess portion 26h Thin plate portion 26sp Inclined portion 26st Stepped portion 27 Third convex portion 28 Through hole 30 Resin sealing portion Gi Gap Lg Length Ps Press working region Rfa Resin filling region Rrs Resin leakage path Tf, Tf1, Tf2 Plate thickness Tt, Tt1, Tt2 Plate thickness Wf Width

Claims (13)

A first element frame frame, a first element tie bar extending in a cross direction from the first element frame frame, and a first element lead terminal extending from the first element tie bar; A first element lead frame having a first element header portion on which the first optical semiconductor element chip is mounted, a second element frame frame portion, and an intersecting direction from the second element frame frame portion A second element tie bar extended to the second element tie bar, and a second element header portion disposed on the tip of the second element lead terminal extended from the second element tie bar and mounted with the second optical semiconductor element chip. The first optical semiconductor element chip and the second optical semiconductor element chip can be optically coupled by overlapping the first element frame frame portion and the second element frame frame portion. Na An optical coupling semiconductor device lead frame for forming the optical coupling semiconductor device by forming a resin sealing portion so on purpose made,
The second element frame frame portion has a groove portion into which the first element tie bar is fitted when the first element frame frame portion and the second element frame frame portion are overlapped with each other.
The lead frame for an optically coupled semiconductor device, wherein the first element tie bar has a first convex portion facing the groove on a side surface on the resin sealing portion side. The lead frame for an optically coupled semiconductor device according to claim 1,
The lead frame for an optically coupled semiconductor device, wherein the groove portion has a concave portion that meshes with the first convex portion on a side surface facing the first element tie bar. A lead frame for an optically coupled semiconductor device according to claim 1 or 2,
The lead frame for an optically coupled semiconductor device, wherein the first element tie bar has a second convex portion along the second element frame frame portion on a side surface on the resin sealing portion side. A lead frame for an optically coupled semiconductor device according to claim 1 or 2,
The lead frame for an optically coupled semiconductor device, wherein the second element frame frame portion has a third convex portion along the first element tie bar on a side surface on the resin sealing portion side. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 4,
The first convex portion has a thin plate portion made thinner than the plate thickness of the first element tie bar, and the concave portion has a thin plate portion made thinner than the plate thickness of the second element frame frame portion, The lead frame for an optically coupled semiconductor device, wherein the thin plate portion of the first convex portion and the thin plate portion of the concave portion are disposed on opposite surfaces and are overlapped with each other. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 4,
The side surface of the first convex portion has an inclined portion inclined from one surface to the other surface, and the side surface of the concave portion has an inclined portion inclined from one surface to the other surface, The lead frame for an optically coupled semiconductor device, wherein the inclined portion of the first convex portion and the inclined portion of the concave portion are arranged so as to face each other and overlap each other. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 4,
The first convex portion has a stepped portion having a plurality of plate thicknesses thinner than the plate thickness of the first element tie bar, and the concave portion has a plurality of plates thinner than the plate thickness of the second element frame frame portion. A step portion having a thickness, wherein the step portion of the first convex portion and the step portion of the concave portion are arranged on opposite surfaces to be engaged with each other. A lead frame for an optically coupled semiconductor device. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 4,
The groove portion has a groove bottom portion serving as a bottom surface in the middle of the plate thickness of the second element frame frame portion, and the fitting thin plate portion to be fitted into the groove portion of the first element tie bar is the first thin film portion. A lead frame for an optically coupled semiconductor device, wherein the lead frame is thinner than the thickness of the element tie bar. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 8,
A lead frame for an optically coupled semiconductor device, wherein a region of the groove and the first convex portion is pressed. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 9,
The lead frame for an optically coupled semiconductor device, wherein the frame frame portion for the second element includes a through hole in the vicinity of the groove portion. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 10,
The lead frame for an optically coupled semiconductor device, wherein the first element frame frame portion includes a through hole in the vicinity of the first element tie bar. A lead frame for an optically coupled semiconductor device according to any one of claims 1 to 11,
The first element tie bar and the second element tie bar corresponding to the resin sealing part are formed so as to be flush with each other in a state in which the first element tie bar is fitted in the groove part. A lead frame for an optically coupled semiconductor device. A first optical semiconductor is provided in a first element header portion of a first element lead frame having a first element frame frame portion and a first element tie bar extending in a crossing direction from the first element frame frame portion. A first lead frame preparation step for preparing a first element lead frame by mounting an element chip; a second element frame frame portion; and a second element frame frame portion extending from the second element frame frame portion in a crossing direction A second lead frame preparation step of preparing a second element lead frame by mounting a second optical semiconductor element chip on a second element header portion of a second element lead frame having a tie bar; and the first element A lead frame fitting in which the first element tie bar is fitted into a groove portion of the second element frame frame by overlapping the lead frame for the second element and the lead frame for the second element The resin sealing portion is formed so that the first optical semiconductor element chip and the second optical semiconductor element chip can be optically coupled with the first element tie bar fitted into the groove. A method of manufacturing an optically coupled semiconductor device comprising a resin sealing step,
After the lead frame fitting step, a pressing step is performed in which the first element tie bar presses a region extending between the first convex portion and the groove portion that the side surface on the resin sealing portion side faces the groove portion. An optically coupled semiconductor device manufacturing method comprising:

Images