JP2009029962A - Heat storage resin coating and board having heat storage property using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat storage resin coating excellent in sound absorbing characteristics in a low frequency region and in heat insulating characteristics and capable of achieving heat control. <P>SOLUTION: The heat storage resin coating 1 comprises a resin coating 11 and a heat storage material 12 filling the resin coating 11 as dispersed. The resin coating 11 comprises a silicone resin, an acrylic resin or the like. The heat storage material 12 comprises microcapsules containing a phase change substance. The microcapsule as the heat storage material 12 comprises a minute sphere composed of a phase change substance 12a covered with a wall film 12b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat storage resin film and a board having heat storage using the same, and more particularly to a heat storage resin film having excellent heat insulation and sound insulation characteristics in a low frequency region and a board having heat storage using the same. .

  Generally, in the building material market, a heat insulating material made of glass wool is widely used (for example, see Patent Document 1).

  Glass wool as such a heat insulating material imparts heat insulation performance by relaxing the heat conduction of the voids present inside the glass wool, and the heat insulation performance is defined by the thickness of the material, the porosity, etc. Performance improvement and cost reduction are almost in the state of completion.

  On the other hand, in the glass wool as such a heat insulating material, although higher heat control is required, an effective material has not been developed at present.

JP-A-9-170276

  The present invention provides, for example, a heat storage resin film capable of heat control by dispersing a heat storage material in a resin film used in a low-frequency sound absorbing material, and a board having heat storage using the same. It is aimed.

  The heat storage resin film according to the first aspect of the present invention is obtained by dispersing a heat storage material in a resin film.

  According to a second aspect of the present invention, in the heat storage resin film of the first aspect, the heat storage material is composed of microcapsules containing a phase change material.

  According to a third aspect of the present invention, in the heat storage resin film of the first aspect or the second aspect, the resin film is made of a silicone resin or an acrylic resin.

  According to a fourth aspect of the present invention, in the heat storage resin film according to any one of the first to third aspects, the resin film contains an inorganic compound and / or carbon fiber.

  The board having heat storage property according to the fifth aspect of the present invention includes a heat storage resin film according to any one of the first aspect to the fourth aspect, and a porous layer laminated on the back side of the heat storage resin film. And a porous body layer made of a porous material.

  The board having heat storage property according to the sixth aspect of the present invention includes a heat storage resin film according to any one of the first aspect to the fourth aspect, and a porous layer laminated on the back side of the heat storage resin film. A porous body layer made of a porous material and another porous body layer made of a porous material laminated on the front side of the heat storage resin film.

  According to a seventh aspect of the present invention, in the board having heat storage properties according to the fifth aspect or the sixth aspect, the porous body layer and / or the other porous body layer is either glass wool or rock wool, It consists of these mixtures.

  According to the heat storage resin film of the first to seventh aspects of the present invention and the board having heat storage properties using the same, since the heat storage material is dispersed in the resin film, the heat storage material is configured. By changing the melting point of the phase change material, it is possible to provide a board that can be thermally controlled and has excellent heat insulation and heat absorption characteristics in a low frequency region.

Hereinafter, preferred embodiments of a heat storage resin film of the present invention and a board having heat storage properties using the same will be described with reference to the drawings.
[Example 1]
FIG. 1 shows a cross-sectional view of a heat storage resin film in the first embodiment of the present invention.

  In the figure, a heat storage resin film 1 of the present invention includes a resin film 11 and a heat storage material 12 dispersed and filled in the resin film 11.

  The heat storage material 12 includes a microcapsule containing a phase change material (PCM “Phase Change Material”).

  The microcapsule as the heat storage material 12 is composed of a minute sphere in which the periphery of the phase change material 12a is covered with a wall film 12b. As the phase change material 12a of the microcapsule, for example, paraffins having a melting point near 20 ° C. and a large latent heat amount are used, and as the wall film 12b of the microcapsule, for example, melamine resin or non-formalin is used. Yes.

  Here, the melting point (phase change point) of the phase change material as the heat storage material 12 used in the present invention is preferably set around 20 ° C. Moreover, it is preferable that the diameter of the microcapsule as the heat storage material 12 is about 1 to several hundred μm.

  The microcapsule as the heat storage material 12 having such a configuration can be microencapsulated by a known method, for example, a method of spraying a thermoplastic resin on the surface of the heat storage particles (Japanese Patent Laid-Open No. 62-45680). .

  According to the microcapsule as the heat storage material 12 having such a configuration, heat can be repeatedly absorbed and released. Specifically, the phase change material 12a existing inside the wall film 12b exhibits a heat storage and cold storage action of absorbing and releasing latent heat in the process of phase change from solid to liquid, or from liquid to solid. The temperature at which such an effect is exhibited can be adjusted by changing the melting point of the paraffin which is the phase change material 12a. In addition, as such a microcapsule as the heat storage material 12, a heat storage cold storage microcapsule manufactured by Miki Riken Kogyo Co., Ltd. is suitable.

  The resin film 11 is preferably a material exhibiting excellent sound absorption characteristics in a low frequency region of about 100 Hz to less than about 200 Hz, specifically, a resin film constituting a low frequency sound absorbing material previously developed by the present inventors. .

  The resin film 11 is formed of a material that has flame retardancy and does not generate harmful gases during combustion. Specifically, the silicone resin is a compound containing any one of Si, Ca, Sr, Ba, Al, and Mg at a ratio of 2: 1 to 1: 1, or Si, Ca, Sr, Ba, Al, Mg. It is formed by mixing an inorganic compound composed of a mixture of compounds containing any one of the above.

  In the film-shaped resin film 11 having such a structure, the porous chamber portion of the network-structured silicone resin is mixed with barium sulfate having a high bulk density and a small particle size, so that it is nonflammable and flexible. In addition, a film having a predetermined surface density can be formed.

  FIG. 2 is an explanatory diagram showing the sound absorption coefficient, surface density, film thickness, heat generation amount, and heat generation rate of the film-shaped resin film 11 in the embodiment of the present invention together with a comparative example.

  Here, the film-like resin film 11 in this example is formed by mixing a silicone resin with barium sulfate, silica, calcium carbonate, and strontium carbonate in a ratio of 2: 1, and is made of urethane as a comparative example. A membrane is used.

  The calorific value was measured by the method specified in Article 2, Item 9 of the Building Standard Law, and the heat generation rate was measured by the method specified by ISO5660.

From the figure, the film-like resin film 11 in this example can obtain the same sound absorption coefficient and surface density as those of the comparative example even if the film thickness is made about 1/3 that of the comparative example. it can. Moreover, it can adapt to the nonflammable grade prescribed | regulated to Building Standard Act Article 2 No. 9, and also can make a combustion heat release rate less than [200kW / m < ² >] * 10sec.

  Next, various performances required for the film-shaped resin film 11 having such a configuration will be described.

First, it is preferable to use a resin film 11 having a combustion heat generation amount per unit area of 8 MJ / m ² or less. If the amount of combustion heat generated per unit area of the resin film 11 exceeds 8 MJ / m ² , it will not conform to the non-combustible grade specified in the Building Standard Act Article 2 No. 9 which is the applicable law of the product according to this embodiment. is there. The amount of combustion heat generated by the resin film 11 can be adjusted by the type and amount of the inorganic filler to be blended with the resin for the raw material of the resin film 11.

According to the film-shaped resin film 11 made of a silicone resin containing such an inorganic compound, a unit area in a combustion calorific value test specified by ISO 5660 in a test piece having a width of 100 mm, a length of 100 mm, and a thickness of 3 to 50 mm. The amount of heat generated by combustion can be reduced to 8 MJ / m ² or less.

Second, it is preferable to use a resin film 11 having a combustion heat generation rate of [200 kW / m ² ] · less than 10 sec. This is because if the heat release rate of the resin film 11 is [200 kW / m ² ] • 10 sec or more, it does not conform to the non-combustible grade specified in Article 2, Item 9 of the Building Standards Act.

According to the film-shaped resin film 11 made of a silicone resin containing such an inorganic compound, in a combustion exothermic rate test specified by ISO 5660, in a test piece having a width of 100 mm, a length of 100 mm, and a thickness of 3 to 50 mm, combustion heat generation The speed can be [200 kW / m ² ] · less than 10 sec.

In the present invention, about 50% of the microcapsules as the heat storage material 12 are dispersed in the resin film 11 having a surface density of about 3 kg / m ² (content of microcapsules: 1.5 kg / m ² ).

According to the heat storage resin film 1 having such a configuration, the phase change material 12a (paraffin) has excellent sound absorption characteristics in a low frequency region of about 100 Hz to less than 200 Hz and constitutes a microcapsule as the heat storage material 12. It is possible to provide a heat insulating material capable of thermal control by adjusting the melting point.
[Example 2]
FIG. 3 shows a cross-sectional view of a board having heat storage properties using the heat storage resin film 1 shown in FIG. In the figure, parts common to those in FIG. 1 are denoted by the same reference numerals and detailed description thereof is omitted.

  In FIG. 3, a board 2 having a heat storage property of the present invention includes a heat storage resin film 1 and a porous body layer 3 laminated on the back side (the side opposite to the sound source side) of the heat storage resin film 1. I have.

The porous body layer 3 is formed of a flame retardant material, specifically, a felt material (silica) made of board-like or felt-like glass wool or ceramic fibers. In the present embodiment, the porous body layer 3 is made of glass wool having a bulk density of 32 kg / m ³ (32K).

  The thickness of the porous body layer 3 is preferably 1 to 100 mm. This is because if the thickness is less than 1 mm, the sound absorption effect due to the vibration of the skeleton portion of the porous body layer 3 decreases, and if the thickness exceeds 100 mm, the vibration as a plate material decreases and the sound absorption effect decreases. In consideration of the strength and space factor as the heat storage resin film 1, the porous body layer 3 having a thickness of 10 to 50 mm is suitable.

  In the present embodiment, the porous body layer 3 is laminated on the resin film 11 because the resin film 11 portion acts as an additional mass, that is, the role of a weight, and the porous body layer 3 functions as a spring, that is, an air spring. This is because it acts and absorbs sound due to film vibration.

  The porous body layer 3 having such a configuration has excellent sound absorption characteristics over a wide range from a low frequency region to a high frequency region, and has effective damping properties for reducing solid propagation sound and vibration. Demonstrate.

  In addition, in order to improve the freedom degree of a product form and to simplify the construction in the field, it is preferable that the resin film 11 is integrated with the porous body layer 3 by adhesion, a silicone graft reaction, or the like.

FIG. 4 is an explanatory diagram showing the sound absorption characteristics of the board 2 having heat storage properties in the second embodiment together with a comparative example. In this figure, the horizontal axis is frequency [Hz], the vertical axis is the reverberation chamber method sound absorption coefficient, L1 is the sound absorption characteristic of a conventional sound absorber with a porous body (glass wool) thickness of 50 mm, and L2 is the surface density of 3 kg. / M ² , heat storage in which 50% of microcapsules as the heat storage material 12 (microcapsule content: 1.5 kg / m ² ) are dispersed in a resin film 11 made of a silicone resin having a thickness of 0.5 mm. On the back surface side (the side opposite to the sound source side) of the heat-resisting resin film 1 and a bulk density of 32 kg / m ³ (32K) and a standard size (length 609 mm × width 910 mm × thickness 50 mm) The sound absorption characteristic of the board 2 which has the thermal storage property in the 2nd Example which laminated | stacked the porous body layer 3 which consists of glass wool is shown.

As shown by L1, the conventional sound absorbing material has a high sound absorption coefficient in a high frequency region exceeding about 200 Hz, but has a low sound absorption coefficient in a low frequency region of about 200 Hz or less. Thus, it can be seen that the board 2 having heat storage in the second embodiment has a low sound absorption coefficient in a high frequency region exceeding about 200 Hz, but a high sound absorption coefficient in a low frequency region of about 200 Hz or less. Therefore, if the board 2 having such a heat storage property is used, similarly to the first embodiment, it is possible to provide a heat insulating material having excellent sound absorption characteristics in a low frequency region and capable of thermal control. .
[Example 3]
FIG. 5 is a cross-sectional view of a board having heat storage properties in a third embodiment of the present invention. In the figure, parts common to those in FIG. 3 are denoted by the same reference numerals and detailed description thereof is omitted.

  In FIG. 5, the board 4 having the heat storage property of the present invention includes a heat storage resin film 1, a porous body layer 3 laminated on the back side (the side opposite to the sound source side) of the heat storage resin film 1, Another porous body layer 5 laminated on the front surface side (sound source side) of the conductive resin film 1. Here, the other porous body layer 5 is composed of the same material as the porous body layer 3.

FIG. 6 shows the thermal conductivity of the conventional sound absorbing material and the board 4 having heat storage properties in this embodiment. Here, the comparative example shows a conventional sound-absorbing material in which a board (porous body layer) made of glass wool having a bulk density of 32 kg / m ³ (32K) is produced with standard dimensions (length 609 mm × width 910 mm × thickness 50 mm). In the example, the surface density is 3 kg / m ² , and 50% of the microcapsules as the heat storage material 12 are contained in the resin film 11 made of a silicone resin having a thickness of 0.5 mm (content of microcapsules: 1. 5 kg / m ² ) The dispersed heat storage resin film 1 and the front surface and both surfaces of the heat storage resin film 1 have a bulk density of 32 kg / m ³ (32K) and a fixed size (length 609 mm × width 910 mm × The board 4 which has the thermal storage property in the 3rd Example which laminated | stacked the porous body layers 3 and 5 which consist of glass wool of thickness 50mm) is shown.

From the figure, it can be seen that the thermal conductivity of the board 4 having heat storage properties in the example is about 1/4 smaller than that of the comparative example, and the heat insulation characteristics are greatly improved. Therefore, if the board 4 having such a heat storage property is used, it is possible to provide a heat insulating material having excellent sound absorption characteristics in the low frequency region and capable of thermal control, as in the third embodiment. .
[Example 4]
In the above-described embodiment, the case where the resin film 11 is formed of a silicone resin containing an inorganic compound is described. However, the resin film 11 is made of an acrylic resin at a ratio of 2: 1 to 1: 1 with Si, Ca, Inorganic compound consisting of a compound containing any one of Sr, Ba, Al, Mg or a mixture of compounds containing any one of Si, Ca, Sr, Ba, Al, Mg, and the following carbon fiber are mixed. You may form with what you did.

  In the resin film 11 having such a configuration, by adding carbon fiber to the acrylic resin, a resin film having a predetermined surface density can be formed in addition to being nonflammable and flexible.

  Here, it is preferable to use carbon fibers having a fiber diameter of 10 to 30 μm, an average length of 0.3 to 2 mm, and an addition amount of 0.5 to 10 parts relative to the main acrylic resin. Here, the fiber diameter is set to 10 to 30 μm because the bond between the resins is lowered when the fiber diameter is less than 10 μm, and the flexibility of the resin is lowered when the fiber diameter exceeds 30 μm. The average length is set to 0.3 to 2 mm because the bond between the resins decreases when the average length is less than 0.3 mm, and the average length exceeds 2 mm. This is because the flexibility of the resin is lowered. Furthermore, the reason why the addition amount is set to 0.5 to 10 parts with respect to the main acrylic resin is that when the addition amount is less than 0.5 parts with respect to the main acrylic resin, the bond between the resins decreases. This is because when the amount exceeds 10 parts with respect to the main acrylic resin, the flexibility of the resin decreases.

  FIG. 7 is an explanatory diagram showing the sound absorption coefficient, surface density, film thickness, heat generation amount, and heat generation rate of the resin film in Example 4 together with a comparative example.

  Here, the resin film 11 in Example 4 is formed by mixing barium sulfate, silica, calcium carbonate, strontium carbonate, aluminum hydroxide, and magnesium hydroxide in an acrylic resin at a ratio of 2: 1. A resin film made of urethane is used.

  The calorific value was measured by the method specified in Article 2, Item 9 of the Building Standard Law, and the heat generation rate was measured by the method specified by ISO5660.

From the figure, the resin film 11 in Example 4 can obtain the sound absorption coefficient and surface density equivalent to those of the comparative example even if the film thickness is made about 1/3 thinner than the film thickness of the comparative example. Moreover, it can adapt to the nonflammable grade prescribed | regulated to Building Standard Act Article 2 No. 9, and also can make a combustion heat release rate less than [200kW / m < ² >] * 10sec.

  In the above-described embodiments, the present invention is described with specific embodiments shown in the drawings. However, the present invention is not limited to these embodiments, and as long as the effects of the present invention are exhibited, You may comprise as follows.

  1stly, in the above-mentioned Example, although the case where the resin film which consists of a silicone resin containing an inorganic material is used as a low frequency sound-absorbing material is described, instead of this, the resin film which does not contain an inorganic material, Or you may use what consists of a laminated body which laminated | stacked metal foil on the single side | surface or both surfaces of the resin film.

  Secondly, in the above-described embodiment, the case where glass wool is used as the porous body is described. Instead, inorganic fiber aggregates such as rock wool, cellulose fiber, coarse wool felt, animal hair felt, Any of organic fiber aggregates such as PET fiber felt and polyethylene felt, metal fiber aggregates, or a mixture thereof may be used.

  Third, in the above-described embodiment, the case where glass wool is used as the porous body is described, but instead of this, inorganic materials such as foamed cement, foamed glass and glass sintered body, foamed urethane, Using organic materials such as foamed silicone, foamed styrene, foamed polyethylene, and foamed polypropylene, sintered metal particles, inorganic materials, or binders of metal materials with organic binders, or mixtures thereof Also good.

Sectional drawing of the thermal storage resin film in the 1st Example of this invention. Explanatory drawing which shows the sound absorption coefficient of the resin film in the 1st Example of this invention, a surface density, a film thickness, the emitted-heat amount, and the heat-generation rate. Sectional drawing of the board which has heat storage property in the 2nd Example of this invention. Explanatory drawing which shows the sound absorption characteristic of the board which has the thermal storage property in the 2nd Example of this invention. Sectional drawing of the board which has the thermal storage property in the 3rd Example of this invention. Explanatory drawing which shows the heat conductivity of the board which has heat storage property in the 3rd Example of this invention. Explanatory drawing which shows the sound absorption coefficient of a resin film in the 4th Example of this invention, a surface density, a film thickness, the emitted-heat amount, and the heat-generation rate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Thermal storage resin film 11 ... Resin film 12 ... Thermal storage material 12a ... Phase change material 12b ... Wall film 2, 4 ... Board with thermal storage 3, 5, ... Porous body layer

Claims (7)

  A heat storage resin film comprising a heat storage material dispersed in a resin film.   The heat storage resin film according to claim 1, wherein the heat storage material comprises a microcapsule containing a phase change material.   The heat storage resin film according to claim 1, wherein the resin film is made of a silicone resin or an acrylic resin.   The heat storage resin film according to any one of claims 1 to 3, wherein the resin film contains an inorganic compound and / or carbon fiber.   A heat storage resin film comprising: the heat storage resin film according to any one of claims 1 to 4; and a porous body layer made of a porous material laminated on a back side of the heat storage resin film. Having a board.   The heat storage resin film according to any one of claims 1 to 4, a porous body layer made of a porous material laminated on a back surface side of the heat storage resin film, and a front surface side of the heat storage resin film. A board having heat storage characteristics, comprising: another porous body layer made of a porous material laminated on the board.   The board having heat storage properties according to claim 5 or 6, wherein the porous body layer and / or the other porous body layer is made of glass wool, rock wool, or a mixture thereof.

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