JP2009028923A - 接合方法、接合体および配線基板 - Google Patents
接合方法、接合体および配線基板 Download PDFInfo
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- JP2009028923A JP2009028923A JP2007192704A JP2007192704A JP2009028923A JP 2009028923 A JP2009028923 A JP 2009028923A JP 2007192704 A JP2007192704 A JP 2007192704A JP 2007192704 A JP2007192704 A JP 2007192704A JP 2009028923 A JP2009028923 A JP 2009028923A
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| WO2012066096A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum verbinden von substraten und damit erhältliche verbundstruktur |
| JP2012161831A (ja) * | 2011-02-09 | 2012-08-30 | Mitsubishi Electric Corp | 基板の製造方法 |
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| DE102010044114A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden von Substraten und damit erhältliche Verbundstruktur |
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| JP2012161831A (ja) * | 2011-02-09 | 2012-08-30 | Mitsubishi Electric Corp | 基板の製造方法 |
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| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
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| US9889635B2 (en) | 2012-12-13 | 2018-02-13 | Corning Incorporated | Facilitated processing for controlling bonding between sheet and carrier |
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| US11331692B2 (en) | 2017-12-15 | 2022-05-17 | Corning Incorporated | Methods for treating a substrate and method for making articles comprising bonded sheets |
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| CN112936878B (zh) * | 2019-12-10 | 2023-02-28 | 丰田自动车株式会社 | 熔敷接合方法及熔敷接合体 |
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