JP2009026639A - Manufacturing method of electrode sheet, and capacitance type input device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrode sheet capable of forming an electrode part superior in conductivity and transparency, and with a fine pattern on an insulating transparent base material. <P>SOLUTION: The manufacturing method of the electrode sheet has a process of forming a conductive coating film by a conductive polymer solution containing π-conjugated conductive polymer, a soluble polymer, and a solvent on one face or both faces of an insulating transparent base material, and a process of forming the electrode part by dry-etching the conductive coating film. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electrode sheet used for a capacitance type input device or the like. The present invention also relates to a capacitive input device provided in a portable audio device or the like.

As a transparent electrode of an input device such as a touch panel or a capacitance type input device, an electrode including a π-conjugated conductive polymer such as polythiophene as a conductive component has been studied.
Since π-conjugated conductive polymer is supplied in the form of an aqueous solution, screen printing using an aqueous solution of π-conjugated conductive polymer as an ink has been studied as a conventional method for forming patterned electrodes. It has been. The ink for screen printing must have a certain degree of viscosity, but from the viewpoint of solubility, the solid content concentration of the aqueous solution of the π-conjugated conductive polymer is low, so the viscosity is low. Not suitable for.
Therefore, Patent Documents 1 and 2 propose a method in which a thickener is added to an aqueous solution of a π-conjugated conductive polymer to obtain a viscosity suitable for screen printing.
Special table 2002-500408 gazette Japanese Patent No. 3855167

However, when the thickener was added, the concentration of the π-conjugated conductive polymer was relatively lowered, and the conductivity was lowered. For this reason, in an input device (particularly a capacitance-type input device) provided with an electrode sheet on which electrode portions are formed by screen printing, the operation reliability may be lowered. Moreover, since transparency is also lowered (especially haze is increased), the visibility of the image formed on the back side of the electrode sheet and the light of the light emitter disposed on the back side of the electrode sheet may be reduced. there were.
Furthermore, since there are restrictions on the types and amounts of thickeners that can be added to the π-conjugated conductive polymer aqueous solution, even if a thickener is added to the π-conjugated conductive polymer aqueous solution, sufficient printability is achieved. It was not improved. Therefore, it was difficult to form a fine pattern of electrode portions on an insulating transparent substrate even when using an ink obtained by adding a thickener to a π-conjugated conductive polymer aqueous solution.
The present invention has been made in view of the above circumstances, and provides an electrode sheet manufacturing method capable of forming an electrode portion having a high conductivity and transparency and a fine pattern on an insulating transparent substrate. With the goal.
In addition, there is provided a capacitive input device having high operational reliability and high visibility of an image formed on the back side of the electrode sheet and light of a light emitter disposed on the back side of the electrode sheet. For the purpose.

The present invention includes the following aspects.
[1] A step of forming a conductive coating film on one side or both sides of an insulating transparent substrate with a conductive polymer solution containing a π-conjugated conductive polymer, a solubilized polymer and a solvent;
And a step of dry-etching the conductive coating film to form an electrode portion.
[2] The method for producing an electrode sheet according to [1], wherein the dry etching is plasma etching.
[3] The method for producing an electrode sheet according to [1], wherein the dry etching is ultraviolet light etching.
[4] A capacitance-type input device comprising an electrode sheet manufactured by the method for manufacturing an electrode sheet according to any one of [1] to [3].

According to the method for producing an electrode sheet of the present invention, it is possible to form an electrode part having a fine pattern with high conductivity and transparency on an insulating transparent substrate.
The capacitance-type input device of the present invention has high operational reliability, and also has high visibility such as an image formed on the back side of the electrode sheet and light of a light emitter disposed on the back side of the electrode sheet. .

<Method for producing electrode sheet>
An embodiment of the method for producing an electrode sheet of the present invention will be described.
The electrode sheet manufacturing method according to the present embodiment includes a first step of forming a conductive coating film on one side of the insulating transparent substrate, and a drawing on one side of the insulating transparent substrate 11 as shown in FIG. A second step of forming the circuit 12 and a third step of forming the electrode portions 13, 13... From the conductive coating film as shown in FIG. Is the method.

(First step)
In this embodiment, a method of printing or applying a conductive polymer solution to the entire surface of one side of the insulating transparent substrate 11 is applied as a method of forming a conductive coating film.

As the insulating transparent substrate 11, for example, a transparent resin film, a glass plate, or the like is used.
Examples of the resin material constituting the transparent resin film include polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinyl alcohol, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyacryl, polycarbonate, polyvinylidene fluoride, polyarylate, and styrene. Based elastomer, polyester based elastomer and the like. Among these resin materials, polyethylene terephthalate is preferable from the viewpoint of strength and the like.
The insulating property in the present invention means that the volume resistivity is 10 ¹² Ω · cm or more. Further, the term “transparent” means that the light transmittance when visible light is transmitted is 75% or more.

  The thickness of the insulating transparent substrate 11 is preferably 10 to 100 μm. If the thickness of the insulating transparent substrate 11 is 10 μm or more, it is difficult to break, and if it is 100 μm or less, the electrode sheet 10 can be thinned.

  The conductive polymer solution is a solution containing a π-conjugated conductive polymer, a solubilized polymer, and a solvent. The coating film formed from the conductive polymer solution is transparent.

Examples of the π-conjugated conductive polymer include polypyrrole, polythiophene, poly (N-methylpyrrole), poly (3-methylthiophene), poly (3-methoxythiophene), and poly (3,4-ethylenedioxythiophene). ) And the like. Among these, polypyrrole and poly (3,4-ethylenedioxythiophene) are preferable from the viewpoint of conductivity.
In addition, polyacetylene, polyparaphenylene, polyaniline, polyphenylene vinylene, polythionaphthene, or the like can be used as the π-conjugated conductive polymer.

  The solubilized polymer is a polymer that coordinates to a π-conjugated conductive polymer and solubilizes a π-conjugated conductive polymer that is insoluble in a solvent alone. As the solubilizing polymer, for example, a polymer having an anion group, a polymer having an electron withdrawing group, and the like are used.

Specific examples of the polymer having an anion group include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polyacryl sulfonic acid, polymethacryl sulfonic acid, poly (2-acrylamido-2-methylpropane sulfonic acid), poly Isoprene sulfonic acid, polyvinyl carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacryl carboxylic acid, polymethacryl carboxylic acid, poly (2-acrylamido-2-methylpropane carboxylic acid), polyisoprene carboxylic acid, polyacrylic acid, etc. Is mentioned.
Specific examples of the polymer having an electron-withdrawing group include polyacrylonitrile, polymethacrylonitrile, acrylonitrile-styrene resin, acrylonitrile-butadiene resin, acrylonitrile-butadiene-styrene resin, and hydroxy group or amino group-containing resin. Resin (for example, cyanoethyl cellulose), polyvinyl pyrrolidone, alkylated polyvinyl pyrrolidone, nitrocellulose and the like.

  The content of the solubilized polymer is preferably in the range of 0.1 to 10 mol, more preferably in the range of 1 to 7 mol, with respect to 1 mol of the π-conjugated conductive polymer. When the content of the solubilized polymer is 0.1 mol or more, the doping effect on the π-conjugated conductive polymer becomes strong and the conductivity is sufficiently satisfied. In addition, dispersibility and solubility in a solvent are improved, and a uniform conductive polymer solution can be easily obtained. Further, when the content of the solubilized polymer is 10 mol or less, sufficient conductivity is obtained because the π-conjugated conductive polymer is sufficiently contained.

  Examples of the solvent include water, methanol, ethanol, propanol, butanol, acetone, methyl ethyl ketone, hexane, benzene, toluene, N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide. , Hexamethylene phosphortriamide, acetonitrile, benzonitrile, cresol, phenol, xylenol, ethylene carbonate, propylene carbonate, dioxane, diethyl ether, ethylene glycol dialkyl ether, propylene glycol dialkyl ether, ethylene glycol, propylene glycol, polyethylene glycol dialkyl ether, Polypropylene glycol dialkyl ether, such as 3-methyl-2-oxazolidinone And the like. These may be used alone or as a mixture of two or more, or as a mixture with another organic solvent.

The conductive polymer solution preferably contains polyfunctional acrylic having two or more unsaturated double bonds. The polyfunctional acrylic polymerizes and crosslinks when the conductive coating film is formed. Therefore, when polyfunctional acrylic is included, the film strength, hot water resistance, and moisture resistance of the conductive coating film increase.
Examples of the polyfunctional acrylic include dipropylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, and modified bisphenol A. Bifunctional such as di (meth) acrylate, dimethylol dicyclopentadi (meth) acrylate, PEG400 di (meth) acrylate, PEG300 di (meth) acrylate, PEG600 di (meth) acrylate, N, N′-methylenebisacrylamide Acrylic, trimethylolpropane tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, glycerin propoxytri (meth) acrylate Relate, trifunctional acrylics such as pentaerythritol tri (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (penta) (meth) 4) or more functional acrylics such as acrylate and dipentaerythritol monohydroxypenta (meth) acrylate, and 2 or more functional urethane acrylates.

  The polyfunctional acrylic content in the conductive polymer solution is preferably 0.05 to 50% by mass, and more preferably 0.1 to 40% by mass. When the polyfunctional acrylic content is less than 0.05% by mass, water resistance, hot water resistance, and moisture resistance may be insufficient. On the other hand, when the content of the polyfunctional acrylic is more than 50% by mass, the content of the π-conjugated conductive polymer in the conductive coating film is decreased, and it becomes difficult to obtain sufficient conductivity.

In addition, the conductive polymer solution contains one or both of N-hydroxyalkyl (meth) acrylamide and N-alkoxyalkyl (meth) acrylamide because film strength, hot water resistance and moisture resistance are higher. Is preferred.
Examples of N-hydroxyalkyl (meth) acrylamide include N-hydroxymethyl (meth) acrylamide (N-methylol (meth) acrylamide), N-hydroxyethyl (meth) acrylamide, N-hydroxypropyl (meth) acrylamide, N -Hydroxybutyl acrylamide etc. are mentioned.
Examples of N-alkoxyalkyl (meth) acrylamide include N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-isobutoxymethyl (meth) acrylamide, and the like. Is mentioned.

  The content of these (meth) acrylamide compounds is preferably 1 to 5000 parts by mass, and 50 to 500 parts by mass with respect to 100 parts by mass in total of the π-conjugated conductive polymer and the solubilized polymer. Is more preferable. When the content of the (meth) acrylamide compound is less than 1 part by mass, conductivity and heat resistance may be insufficient. On the other hand, when the content of the (meth) acrylamide compound exceeds 5000 parts by mass, the content of the π-conjugated conductive polymer in the conductive coating film decreases, and it is difficult to obtain sufficient conductivity.

The conductive polymer solution preferably contains a dopant in order to make the conductivity higher.
Examples of the dopant include halogens such as iodine and bromine, Lewis acids such as PF ₅ , AsF ₅ , and BF ₃ , proton acids such as HF, HCl, and H ₂ SO _4, paratoluenesulfonic acid, and paramethoxyethyltoluenesulfonic acid. Organic acids, transition metal compounds such as FeCl ₃ and TiCl ₄ , organic substances such as tetracyanodimethane, tetracyanotetraazanaphthalene and chloranil, alkali metals such as Li, Na and K, alkaline earth such as Ca, Sr and Ba And the like.

Examples of the method for printing the conductive polymer solution containing the above components on the entire one surface of the insulating substrate 11 include screen printing, offset printing, gravure printing, flexographic printing, and the like.
Examples of the coating method include a method using a coating device such as a bar coater, a die coater, a comma coater, a spray coater, or a roll coater.

  It is preferable to dry after printing or coating. Examples of the drying method include a hot air drying method, an infrared drying method, and a vacuum drying method.

The content of the π-conjugated conductive polymer in the conductive coating formed by the first step as described above is preferably 10 to 95% by mass. If the content of the π-conjugated conductive polymer is 10% by mass or more, sufficient conductivity can be secured, and if it is 95% by mass or less, a conductive coating film can be easily formed.
The thickness of the conductive coating film is preferably 0.1 to 5 μm. If the thickness of the conductive coating film is 0.1 μm or more, sufficient conductivity can be secured, and if it is 5 μm or less, the coating film can be easily formed.

(Second step)
As a method for forming the routing circuit 12, for example, a method in which a conductive paste is printed on the insulating transparent base material 11 in a pattern in which the routing circuit 12 is formed, and a metal foil is bonded to the insulating transparent base material 11. Thereafter, the method of etching the metal foil in a pattern in which the routing circuit 12 is formed, the metal plating film is formed on the insulating transparent substrate 11, and the metal plating film is then patterned in the pattern in which the routing circuit 12 is formed. Etching method and the like can be mentioned.

The conductive paste contains conductive particles, a binder, and a solvent.
Examples of the material of the conductive particles include gold, silver, copper, nickel, carbon, and an alloy containing two or more of these. Among these, silver is preferable because of its excellent conductivity.

Examples of the binder include various resins such as polyester, acrylic, urethane, fluorine, silicone, and epoxy. These resins may be used alone or in combination of two or more.
The binder may be a radiation curable resin. Here, the radiation curable resin is a resin that is cured by radiation such as ultraviolet rays or electron beams.
Specific examples of the radiation curable resin include a radiation curable prepolymer. Radiation curable prepolymers include, for example, radical polymerization types such as ester acrylates, ether acrylates, urethane acrylates, epoxy acrylates, amino resin acrylates, acrylic resin acrylates, unsaturated polyesters, and cationic polymerizations such as epoxy resins and resins having vinyl ethers. And thiol / ene addition type in which an oligomer having an aryl group or acryloyl group and polythiol are combined.

  Examples of the method for printing the conductive paste include screen printing, offset printing, gravure printing, flexographic printing, etc. Among them, screen printing is preferable.

As the metal foil, for example, electrolytic copper foil, rolled copper foil, electrolytic nickel foil, stainless steel foil, aluminum foil or the like is used.
Examples of the metal plating film include plating films of gold, silver, copper, nickel, and the like.

Examples of the etching method of the metal foil or the metal plating film include a method of placing a mask on the metal foil or the metal plating film and performing wet etching or dry etching.
The masking used here covers the portion of the metal foil or metal plating film that becomes the routing circuit 12, and the same masking as that applied in the dry etching described later is used.

  The thickness of the routing circuit 12 is preferably 5 to 50 μm. If the thickness of the routing circuit 12 is 5 μm or more, even if the routing circuit 12 is etched in the third step, the routing circuit 12 having a sufficient thickness remains, and if it is 50 μm or less, the electrode sheet 10 is thinned. it can.

(Third step)
The electrode portion 13 formed in the third step of the present embodiment example has a sector shape with a central angle of 30 degrees. A total of nine electrode portions 13 are formed, and these are assembled into a circular shape.
When the patterned electrode portions 13, 13... Are formed from the conductive coating film, dry etching for etching without using an etching solution is applied.
Examples of dry etching include plasma etching, photoetching, ion beam etching, and the like. Among these, plasma etching and photoetching are preferable because the electrode portion 13 having a finer pattern can be easily formed.

Plasma etching may be either a method of causing radicals generated by plasma to collide with an object to be etched or a method of causing ions generated by plasma to collide with an object to be etched (reactive ion etching method). The reactive ion etching method is preferable because it can be etched precisely.
In the reactive ion etching method, for example, the etching rate of gold is about 15 nm / min, and the etching rate of polymer is 50 to 300 nm / min.

Various etching conditions when the reactive ion etching method is applied are appropriately set according to the size, thickness, type of etching apparatus, and the like of the conductive coating film.
Examples of the gas (etching gas) that is a source of ions include argon gas, chlorine-based gas (BCl ₃ , Cl ₂ , CCl _4, etc.), fluorine-based gas (CF ₄ , CHF ₃ , C ₂ F ₆ , SF). ₆ ) and the like. Argon gas is preferred because of its versatility. When argon gas is used, Ar ⁺ generated by plasma collides with the conductive coating film.

When SPC-100 manufactured by Hitachi High-Technologies Corporation is used as the plasma etching apparatus and argon gas is used as the etching gas, the argon gas supply rate is preferably ³ to 7 cm ³ / min. The degree of vacuum is preferably 10-30 Pa.

  Examples of photoetching include ultraviolet photoetching that etches by irradiation with ultraviolet rays. As the ultraviolet rays, light using harmonics such as an excimer laser or a YAG laser can be used.

At the time of dry etching, masking is disposed on the portion of the surface of the conductive coating film that becomes the electrode portion 13.
As the masking, for example, a resist agent, a dry film, a masking tape in which slits are formed on a removable fine adhesive tape by a cutting plotter, a laser, or the like is used. These thicknesses are preferably thicker than the conductive coating film. When masking made of a resist agent, a dry film, a masking tape, or the like is used, a portion that becomes the electrode portion 13 appears by removing after the plasma etching.
Further, as masking, a masking plate in which slits are formed by performing etching, laser drilling, punching, machining, or the like on a metal plate such as stainless steel can also be used. Since such a masking plate can be used repeatedly, it is suitable for forming the same electrode portion continuously.
In the case of performing photoetching, the masking must be made of a light shielding material.

Since the manufacturing method of the electrode sheet 10 described above is not a method of forming the patterned electrode portion 13 by applying screen printing, it is not necessary to add a thickener to the conductive polymer solution. Therefore, the conductive coating film formed from the conductive polymer solution is excellent in conductivity and transparency, and the patterned electrode portion 13 formed from such a conductive coating film is also excellent in conductivity and transparency.
Moreover, the electrode part 13 of a fine pattern can be formed on an insulating transparent base material by dry-etching a conductive coating film.

Incidentally, wet etching and blast etching are generally known as etching methods, and the electrode portion 13 can be formed even when these etching methods are applied. However, according to wet etching using an aqueous alkali solution, workability is reduced, and a process for discarding the aqueous alkali solution must be performed, which is complicated. Moreover, according to the blast etching, the abrasive used for blasting or the scraped material easily adheres to the surface of the electrode part 13 or the surface of the insulating transparent base material 11, so that the transparency is lowered. Yes.
In contrast to these methods, dry etching does not handle an alkaline aqueous solution, so that the workability is high. In addition, since the scraped material has a small mass and can be easily discharged from the etching chamber by vacuum evacuation or the like, it is difficult to adhere to the surface of the electrode portion 13 and the surface of the insulating transparent substrate 11, thereby reducing transparency. Can be prevented.

In addition, the manufacturing method of the electrode sheet of this invention is not limited to embodiment mentioned above. In the embodiment described above, the conductive coating film is formed on one side of the insulating transparent base material 11, but the conductive coating film may be formed on both surfaces of the insulating transparent base material 11.
In the above-described embodiment, the electrode portion 13 is formed after the routing circuit 12 is formed. However, the routing circuit 12 may be formed after the electrode portion 13 is formed.
In the present invention, the pattern of the electrode portions is not limited. For example, a pattern in which a plurality of electrode portions 14, 14,... Are arranged in one direction on the insulating transparent substrate 11 as shown in FIG. It may be.

<Capacitance type input device>
An embodiment of the capacitive input device of the present invention will be described.
FIG. 4 shows a capacitive input device according to this embodiment. The capacitance type input device 1 includes an electrode sheet 10, a voltage application unit 20, a capacitance detection unit 30, a determination unit 40, a display board 50, and a light emitter 60.
The electrode sheet 10 in the present embodiment is obtained by the manufacturing method described above.
The voltage application part 20 applies the adjacent electrode parts 13 and 13 with a predetermined voltage.
The capacitance detection unit 30 detects the amount of change in capacitance between the adjacent electrode units 13 and 13.
The determination unit 40 is connected to the capacitance detection unit 30 and determines that an input has been made when the amount of change in capacitance detected by the capacitance detection unit 30 exceeds a threshold value.
The display board 50 is installed on the surface of the electrode unit 13. Specific examples of the display board 50 include a board provided with a letter and a colored board.
The light emitter 60 is a light emitting diode (LED) or the like, and is installed on the back side (the side opposite to the human side) of the electrode sheet. In addition, the light emitter 60 is connected to the determination unit 40 and emits light or extinguishes when it is determined that the light has been input.

This electrostatic capacitance type input device 1 is used as follows.
First, the electrodes 13, 13... Are applied at a predetermined voltage by the voltage application unit 20, and the capacitance between the adjacent electrode units 13, 13 is monitored by the capacitance detection unit 30.
When a person brings a finger close to the display board 50, the capacitance between the electrode portions 13 and 13 changes due to the proximity of the finger. The capacitance detection unit 30 detects the amount of change in the capacitance and transmits the value to the determination unit 40. Then, when the change amount of the capacitance exceeds the threshold value, the determination unit 40 determines that the input has been made, and transmits a signal of the determination result to a control unit (not shown) or the like.

  Since the capacitance-type input device 1 described above includes the electrode sheet 10 having high conductivity and transparency manufactured by the above-described manufacturing method, the operation reliability is high, and the light emitter 60 on the back surface side of the electrode sheet 10. Visibility of light generated from is high.

An aqueous solution of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid (Vitron PJ-500, manufactured by H.C. Stark) was applied to one side of a 50 μm thick polyethylene terephthalate (PET) film with a bar coater. did. Thereafter, drying was performed to form a conductive coating film having a thickness of 200 nm and a surface resistivity of 1000Ω. The total light transmittance of the laminate of the PET film and the conductive coating film was 85%.
Next, a silver paste was screen-printed on the surface of the PET film on which the conductive coating film was formed to form a routing circuit 12 having a thickness of 18 μm as shown in FIG.

Next, a resist agent (# 228T, manufactured by Asahi Chemical Research Co., Ltd.) that can be peeled off by placing a metal mask having openings in the same pattern as the pattern of the electrode portion to be obtained on the surface of the conductive coating film. Was printed to a thickness of 80 μm and cured by heating at 150 ° C. for 10 minutes.
Next, the laminate of the PET film on which the resist agent is printed and the conductive coating film is inserted into the etching chamber of a plasma etching apparatus (SPC-100, manufactured by Hitachi Haiku Technologies), and the degree of vacuum in the etching chamber is 20 Pa and argon gas is supplied. The conductive coating film was plasma-etched for 2 minutes under the conditions of an amount of 5 cm ³ / min and an output of 600 W. By this etching, as shown in FIG. 2, eight fan-shaped electrode portions 13 were formed in a circular shape. During etching, a part of the surface of the routing circuit 12 is also removed, but the thickness of the routing circuit 12 is much thicker than the conductive coating film, and the silver etching rate is slower than the etching rate of the polymer. No effect at all.
Thereafter, the cured resist agent was picked with tweezers and peeled off from the obtained electrode part 13 to obtain an electrode sheet 10.
The insulation between the electrode portions 13 and 13 of the obtained electrode sheet 10 was examined with a digital multimeter. As a result, insulation between the electrode portions 13 and 13 was ensured, and it was confirmed that the electrode portions 13 were formed in a desired pattern by dry etching.

It is a top view which shows the routing circuit formed in one embodiment of the manufacturing method of the electrode sheet of this invention. It is a top view which shows the electrode sheet formed in one embodiment of the manufacturing method of the electrode sheet of this invention. It is a top view which shows the other example of the electrode sheet manufactured by the manufacturing method of the electrode sheet of this invention. It is a figure explaining one example of an embodiment of a capacitance type input device of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capacitance type input device 10 Electrode sheet | seat 11 Insulating transparent base material 12 Leading circuit 13, 14 Electrode part 20 Voltage application part 30 Capacitance detection part 40 Determination part 50 Display board
60 illuminant

Claims (4)

Forming a conductive coating film on one or both surfaces of the insulating transparent substrate with a conductive polymer solution containing a π-conjugated conductive polymer, a solubilized polymer and a solvent;
And a step of dry-etching the conductive coating film to form an electrode portion.   The method for producing an electrode sheet according to claim 1, wherein the dry etching is plasma etching.   2. The method for producing an electrode sheet according to claim 1, wherein the dry etching is ultraviolet light etching.   A capacitance-type input device comprising an electrode sheet manufactured by the method for manufacturing an electrode sheet according to claim 1.

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