JP2009021144A - Led light emitting device and manufacturing method of led light emitting device - Google Patents

Led light emitting device and manufacturing method of led light emitting device Download PDF

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JP2009021144A
JP2009021144A JP2007183863A JP2007183863A JP2009021144A JP 2009021144 A JP2009021144 A JP 2009021144A JP 2007183863 A JP2007183863 A JP 2007183863A JP 2007183863 A JP2007183863 A JP 2007183863A JP 2009021144 A JP2009021144 A JP 2009021144A
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light emitting
led
base
emitting device
holding
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Teruo Miyamoto
照夫 宮本
Tatsuo Otaki
龍雄 大滝
Kentaro Ohashi
健太郎 大橋
Koji Uchida
浩二 内田
Toshiya Sugano
俊也 菅野
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Taisei Electronic Industries Co Ltd
Iwasaki Denki KK
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Taisei Electronic Industries Co Ltd
Iwasaki Denki KK
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Priority to JP2007183863A priority Critical patent/JP2009021144A/en
Publication of JP2009021144A publication Critical patent/JP2009021144A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a LED light emitting device and a manufacturing method of the LED light emitting device superior in assembling performance. <P>SOLUTION: This LED light emitting device comprises a light emitting module 2 constituted by mounting a LED 29 on a substrate 26, and a positioning member 33 having a locking hole 34 for locking the LED 29 of the light emitting module 2. The positioning member 33 is retained by a retaining portion 22 formed on a base 20 through a retaining member 36 in such a state that the LED 29 is locked in the locking hole 34 of the positioning member 33, thus the light emitting module 2 can be fixed to the base 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ＬＥＤを備えるＬＥＤ発光装置及びＬＥＤ発光装置の製造方法に関する。   The present invention relates to an LED light emitting device including an LED and a method for manufacturing the LED light emitting device.

従来、照明装置において、基板に実装されたＬＥＤを有する発光モジュールを備え、ＬＥＤを光源として用いたものが知られている（例えば、特許文献１参照）。
発光モジュールをベースに取り付けて照明装置を組み立てる方法としては、照明装置のベースに雌ねじ部を形成すると共に、発光モジュールの基板にこの雌ねじ部と対応する貫通孔を設け、ビスを貫通孔を介して雌ねじ部に螺合し、ビス止めによって発光モジュールをベースに組み付ける方法（以下、「第一の方法」という。）が知られている。また、上記の方法の他、クリームハンダ等の接着剤を介して発光モジュールをベースに取り付ける方法（以下、「第二の方法」という。）や、ベースに弾性変形可能な係止爪等を設けると共に、発光モジュールの基板にこの係止爪と対応した係止孔等を設け、これら係止片等と係止孔等とを係合させることにより、発光モジュールを弾発的にベースに取り付ける方法（以下、「第三の方法」という。）が知られている。
特開２００４−２４１３１８号公報 2. Description of the Related Art Conventionally, an illumination device is known that includes a light emitting module having an LED mounted on a substrate and uses the LED as a light source (see, for example, Patent Document 1).
As a method of assembling the lighting device by attaching the light emitting module to the base, a female screw portion is formed in the base of the lighting device, a through hole corresponding to the female screw portion is provided in the substrate of the light emitting module, and a screw is inserted through the through hole. There is known a method (hereinafter referred to as “first method”) in which a light emitting module is assembled to a base by screwing into a female screw portion and screwing. In addition to the above method, a method of attaching the light emitting module to the base via an adhesive such as cream solder (hereinafter referred to as “second method”), a locking claw that can be elastically deformed, and the like are provided on the base. In addition, a method for elastically attaching the light emitting module to the base by providing a locking hole or the like corresponding to the locking claw on the substrate of the light emitting module and engaging the locking piece or the like with the locking hole or the like. (Hereinafter referred to as “third method”) is known.
JP 2004-241318 A

しかしながら、上述した３つの方法によって発光モジュールをベースに取り付ける場合、以下の問題があった。すなわち、第一の方法では、発光モジュールをベースに取り付ける際、取り付け工程においてベースに雌ねじ部を形成し、基板に貫通孔を形成し、さらに所定のビスを螺合させるという作業が必要であり、製造に係る作業が煩雑であった。
また、第二の方法では、発光モジュールの取り付け作業が簡略化されるものの、発光モジュールを接着剤によってベースに一度固着してしまうと、これを取り外すことが非常に困難となる。したがって、例えば、ＬＥＤ素子の寿命に伴い発光モジュールを交換する必要が生じた際、容易に交換することができずメンテナンス性が悪いという問題があった。
また、第三の方法では、ベースや発光モジュールの基板に専用の係止爪や係止孔等を設ける必要があるため、ベースや基板を基材から成形する際に、その係止爪や係止孔を設けるための設備や製造工程が必要になると共に、発光モジュールを取り付ける際に、これら係止爪と係止孔とを対向させ確実に係合させる必要があるため、取り付けに係る作業が煩雑化する、という問題があった。 However, when the light emitting module is attached to the base by the three methods described above, there are the following problems. That is, in the first method, when attaching the light emitting module to the base, it is necessary to form an internal thread part in the base in the attachment process, form a through hole in the substrate, and further screw a predetermined screw. The work related to manufacturing was complicated.
Further, in the second method, the mounting operation of the light emitting module is simplified, but once the light emitting module is fixed to the base with an adhesive, it is very difficult to remove it. Therefore, for example, when it becomes necessary to replace the light emitting module with the life of the LED element, there is a problem that it cannot be easily replaced and the maintainability is poor.
Further, in the third method, since it is necessary to provide a dedicated locking claw, a locking hole, or the like on the base or the substrate of the light emitting module, the locking claw or the locking Equipment and manufacturing processes for providing the stop holes are required, and when attaching the light emitting module, it is necessary to make the engaging claws and the engaging holes face each other and securely engage them. There was a problem of complication.

本発明は、上述した事情に鑑みてなされたものであり、組み立て性に優れたＬＥＤ発光装置及びこのＬＥＤ発光装置の製造方法を提供することを目的とする。   This invention is made | formed in view of the situation mentioned above, and aims at providing the LED light-emitting device excellent in the assembly property, and the manufacturing method of this LED light-emitting device.

上記目的を達成するために、本発明は、ＬＥＤ発光装置において、基板にＬＥＤを実装した発光モジュールと、この発光モジュールのＬＥＤを係止する係止孔を有した位置決め部材とを備え、前記位置決め部材の係止孔にＬＥＤを係止させた状態で、前記位置決め部材を保持部材を介してベースに設けた保持部に保持させることにより、前記発光モジュールを前記ベースに固定可能としたことを特徴とする。   In order to achieve the above object, the present invention provides an LED light emitting device comprising: a light emitting module having an LED mounted on a substrate; and a positioning member having a locking hole for locking the LED of the light emitting module. The light emitting module can be fixed to the base by holding the positioning member on a holding portion provided on the base via a holding member in a state where the LED is locked in the locking hole of the member. And

この構成によれば、位置決め部材にＬＥＤを係止させるだけで発光モジュールが所定の取り付け位置に位置決めされ、そして、発光モジュールを位置決めした状態で、保持部材によって位置決め部材をベースに固定するだけで、ＬＥＤを有する発光モジュールのベースへの位置決め及び固定のための作業が完了する。
したがって、発光モジュールをベースに取り付ける際に、ねじを螺合させる作業や、また、発光モジュールとベースを正確に弾発的に係止させる必要がなく、ＬＥＤ発光装置の組み立てが容易となる。 According to this configuration, the light emitting module is positioned at a predetermined mounting position simply by locking the LED to the positioning member, and with the light emitting module positioned, the positioning member is simply fixed to the base by the holding member. The operation for positioning and fixing the light emitting module having the LED to the base is completed.
Therefore, when attaching the light emitting module to the base, it is not necessary to screw the screw, and it is not necessary to accurately and elastically lock the light emitting module and the base, and the LED light emitting device can be easily assembled.

また本発明は、上記発明のＬＥＤ発光装置において、前記位置決め部材及び前記保持部材は、前記発光モジュールのＬＥＤを、前記ＬＥＤの放射光を制御する光学系に応じて規定される所定の位置に位置決め固定することを特徴とする。
この構成によれば、位置決め部材及び保持部材を用いて発光モジュールをベースに固定するだけで、ＬＥＤの光を制御する光学系との間の相対的な位置決めがなされるため、光学系が設けられる事を前提としたＬＥＤ発光装置の組み立てが容易となる。 According to the present invention, in the LED light emitting device according to the above invention, the positioning member and the holding member position the LED of the light emitting module at a predetermined position defined according to an optical system that controls the emitted light of the LED. It is fixed.
According to this configuration, since the light emitting module is simply fixed to the base using the positioning member and the holding member, relative positioning with the optical system for controlling the light of the LED is performed, and thus the optical system is provided. As a result, it is easy to assemble the LED light emitting device.

本発明は、上記発明のＬＥＤ発光装置において、前記位置決め部材に、前記ＬＥＤから前記基板側に放射された光を、前記ＬＥＤで照射すべき方向に反射する反射面を設けたことを特徴とする。
この構成によれば、位置決め部材が、ＬＥＤから基板へ向かい無駄になる光を反射面で照射方向に反射することにより、光の使用効率の向上が図られる。 In the LED light-emitting device according to the present invention, the positioning member is provided with a reflecting surface that reflects light emitted from the LED to the substrate side in a direction to be irradiated by the LED. .
According to this configuration, the positioning member reflects light that is wasted from the LED toward the substrate in the irradiation direction by the reflecting surface, thereby improving the light use efficiency.

本発明は、上記発明のＬＥＤ発光装置において、前記保持部材を、その外周部を塑性変形させた状態で、前記ベースの前記保持部に保持させ、前記保持部材を介して前記位置決め部材を前記保持部に保持させることを特徴とする。
この構成によれば、保持部に保持部材を嵌め込むことによって、容易に保持部材を保持部に保持させ、これにより、位置決め部材をベースに固定することができるため、ＬＥＤ発光装置の組み立て作業が容易になる。
また、保持部をベースから取り外し、その外周部の塑性変形を修復することにより、当該保持部を繰り返し使用することができ、取り付け作業のやり直しや、ＬＥＤ発光装置を分解してのメンテナンスを可能にすることができる。 According to the present invention, in the LED light-emitting device according to the above invention, the holding member is held by the holding portion of the base in a state where the outer peripheral portion is plastically deformed, and the positioning member is held via the holding member. It is made to hold | maintain to a part.
According to this configuration, the holding member can be easily held by the holding portion by fitting the holding member into the holding portion, and thereby the positioning member can be fixed to the base. It becomes easy.
Also, by removing the holding part from the base and repairing the plastic deformation of its outer peripheral part, the holding part can be used repeatedly, enabling re-installation work and maintenance by disassembling the LED light emitting device can do.

また、上記発明のＬＥＤ発光装置において、前記位置決め部材における前記発光モジュールの前記基板と対向する箇所が絶縁材で形成されていてもよい。
この構成によれば、位置決め部材における基板と対向する箇所が絶縁材で形成されているため、位置決め部材が基板と接触した際にも、基板に設けられた配線が短絡する、ということがない。
また、上記発明のＬＥＤ発光装置において、前記位置決め部材と、前記保持部材とが一体的に形成されていてもよい。
この構成によれば、ＬＥＤ発光装置の部品点数が減り、製造コストの削減を図ることができる。 Moreover, the LED light-emitting device of the said invention WHEREIN: The location facing the said board | substrate of the said light emitting module in the said positioning member may be formed with the insulating material.
According to this configuration, since the portion of the positioning member that faces the substrate is formed of the insulating material, the wiring provided on the substrate is not short-circuited even when the positioning member contacts the substrate.
In the LED light-emitting device of the above invention, the positioning member and the holding member may be integrally formed.
According to this configuration, the number of parts of the LED light-emitting device is reduced, and the manufacturing cost can be reduced.

また、上記目的を達成するために本発明は、基板にＬＥＤを実装した発光モジュールを有するＬＥＤ発光装置の製造方法において、前記発光モジュールをベースに載置し、前記ＬＥＤを、前記ＬＥＤの放射光を制御する光学系に応じて規定される所定の位置に位置決め固定した状態で、位置決め部材を前記ベースに載置した後、保持部材を押圧部材によってベースへ向かって押圧し、前記保持部材の外周を前記ベースの保持部に圧入して、前記保持部材を固定することを特徴とする。
この方法によれば、押圧部材を利用して簡単にＬＥＤ発光装置を組み立てることができるため、ＬＥＤ発光装置の組み立て作業が容易になると共に、組み立てに要する時間を短縮することができる。
特に、位置決め部材及び保持部材を用いて発光モジュールをベースに固定するだけで、ＬＥＤの光を制御する光学系との間の相対的な位置決めがなされるため、光学系が設けられる事を前提としたＬＥＤ発光装置の組み立てが容易となる。 In order to achieve the above object, the present invention provides a method of manufacturing an LED light-emitting device having a light-emitting module in which an LED is mounted on a substrate. After the positioning member is placed on the base in a state where it is positioned and fixed in accordance with the optical system that controls the optical system, the holding member is pressed toward the base by the pressing member, and the outer periphery of the holding member Is pressed into the holding portion of the base to fix the holding member.
According to this method, since the LED light-emitting device can be easily assembled using the pressing member, the assembly operation of the LED light-emitting device is facilitated and the time required for the assembly can be shortened.
In particular, it is assumed that the optical system is provided because the light emitting module is simply fixed to the base using the positioning member and the holding member, and the relative positioning with respect to the optical system for controlling the light of the LED is made. As a result, the LED light emitting device can be easily assembled.

本発明によれば、位置決め部材にＬＥＤを係止させるだけで発光モジュールが所定の取り付け位置に位置決めされ、そして、発光モジュールを位置決めした状態で、保持部材によって位置決め部材をベースに固定することで、ＬＥＤを有する発光モジュールのベースへの位置決め及び固定のための作業が完了するため、発光モジュールをベースに取り付ける際に、従来のように、ねじを螺合させる作業や、発光モジュールとベースを正確に弾発的に係止させる必要がなく、ＬＥＤ発光装置の組み立てが容易となる。   According to the present invention, the light emitting module is positioned at a predetermined mounting position simply by locking the LED to the positioning member, and with the light emitting module positioned, the positioning member is fixed to the base by the holding member, Since the work for positioning and fixing the light emitting module with the LED to the base is completed, when attaching the light emitting module to the base, the work of screwing in the screw or attaching the light emitting module and the base accurately as before. There is no need for elastic locking, and the LED light emitting device can be easily assembled.

以下、図面を参照して本発明の実施の形態について説明する。
＜第１実施形態＞
図１は、本実施の形態に係る照明装置１の斜視図であり、図２は、この照明装置１の断面図である。
照明装置１は、光源であるＬＥＤ２９を実装した発光モジュール２（図２）から放射される光を所定の照射方向へ照射する装置であり、発光モジュール２を内部に備えるＬＥＤ発光装置３と、このＬＥＤ発光装置３の上方にボルトを介して連結され、発光モジュール２が放射する光を制御するための光学素子の一例たる反射鏡を光学系（光学素子）４として有している。 Embodiments of the present invention will be described below with reference to the drawings.
<First Embodiment>
FIG. 1 is a perspective view of the lighting device 1 according to the present embodiment, and FIG. 2 is a cross-sectional view of the lighting device 1.
The illumination device 1 is a device that irradiates light emitted from a light emitting module 2 (FIG. 2) on which an LED 29 as a light source is mounted in a predetermined irradiation direction. The LED light emitting device 3 that includes the light emitting module 2 therein, An optical system (optical element) 4 includes a reflecting mirror that is connected to the LED light emitting device 3 via a bolt and is an example of an optical element for controlling light emitted from the light emitting module 2.

この光学系４は、図２に示すように、円柱状の基材の内部に、その先端から基端へ向かうに従って縮径した回転放物面状の凹部６が反射面９として形成されており、この凹部６の上開口部７が光の照射開口として機能する。また、凹部６の基端側には、凹部６の底部、すなわち、反射面９の焦点位置近傍が切り落とされて上開口部７よりも小径でありＬＥＤ２９よりも若干大きな下開口部８が形成されている。
そして、光学系４にＬＥＤ発光装置３を連結して照明装置１を構成した場合には、図２に示すように、ＬＥＤ発光装置３のＬＥＤ２９が、上記下開口部８に臨む位置、すなわち、光学系４の反射面９の焦点位置に位置決め固定される。
このような照明装置１においては、砲弾型のＬＥＤ２９から放射された光は、上開口部７を通って光学系４に入射し、この光学系４の反射面９にて進行方向が制御されて上開口部７から照射光として照明装置１の外へ放射される。
また、光学系４の外周には、図１に示すように、放熱用の複数のフィン５が形成されており、発光モジュール２が発する熱が光学系４から効率良く放出され、ＬＥＤ２９の長寿命化が図られている。 As shown in FIG. 2, the optical system 4 includes a cylindrical parabolic substrate in which a paraboloidal concave portion 6 whose diameter decreases from the distal end toward the proximal end is formed as a reflecting surface 9. The upper opening 7 of the recess 6 functions as a light irradiation opening. Further, on the base end side of the concave portion 6, the bottom portion of the concave portion 6, that is, the vicinity of the focal position of the reflecting surface 9 is cut off to form a lower opening portion 8 having a smaller diameter than the upper opening portion 7 and slightly larger than the LED 29. ing.
When the lighting device 1 is configured by connecting the LED light emitting device 3 to the optical system 4, as shown in FIG. 2, the position where the LED 29 of the LED light emitting device 3 faces the lower opening 8, that is, It is positioned and fixed at the focal position of the reflecting surface 9 of the optical system 4.
In such an illuminating device 1, light emitted from the bullet-shaped LED 29 enters the optical system 4 through the upper opening 7, and the traveling direction is controlled by the reflecting surface 9 of the optical system 4. It is radiated | emitted out of the illuminating device 1 as irradiation light from the upper opening part 7. FIG.
Further, as shown in FIG. 1, a plurality of fins 5 for heat dissipation are formed on the outer periphery of the optical system 4, and heat generated by the light emitting module 2 is efficiently released from the optical system 4, and the LED 29 has a long life. It is planned.

なお、ＬＥＤ２９と反射面９との相対位置関係を微調整するために、ＬＥＤ発光装置３の当該ＬＥＤ２９が反射面９の焦点位置になるように、ＬＥＤ発光装置３と光学系４との間にスペーサを介在させＬＥＤ２９を位置決め固定したり、或いは、ＬＥＤ発光装置３において後述するベース２０と発光モジュール２との間に高さ調整用のスペーサを介在させＬＥＤ２９を位置決め固定したりする構成としてもよい。   In addition, in order to finely adjust the relative positional relationship between the LED 29 and the reflecting surface 9, the LED 29 of the LED light emitting device 3 is positioned between the LED light emitting device 3 and the optical system 4 so that the LED 29 becomes the focal position of the reflecting surface 9. The LED 29 may be positioned and fixed by interposing a spacer, or the LED 29 may be positioned and fixed by interposing a height adjusting spacer between the base 20 and the light emitting module 2 described later in the LED light emitting device 3. .

本実施形態に係る光学系４は、以下の製造方法によって製造されている。すなわち、光学系４の外形の形状が彫り込まれた専用の金型に、光学系４の材料となる円柱状の高純度アルミニウム（本実施形態では純度約９９．７％のものを使用）を入れた後、この金型を専用の鍛造プレス装置の所定の位置にセットする。この鍛造プレス装置は、光学系４の一次成形品を鍛造するための装置であり、先端が上記凹部６の形状と略同一の形状に形成された押し型を有している。金型を鍛造プレス装置にセットした後、鍛造プレス装置が作動されると、上記押し型の先端が金型の内部に挿入され、この押し型の圧力によって、金型に彫り込まれた形状と同形状の外形、及び、押し型の先端の形状と同形状の凹部を有した一次成形品が鍛造される。   The optical system 4 according to this embodiment is manufactured by the following manufacturing method. In other words, cylindrical high-purity aluminum (in this embodiment, having a purity of about 99.7%) used as the material of the optical system 4 is put into a dedicated mold in which the outer shape of the optical system 4 is engraved. After that, the mold is set at a predetermined position of a dedicated forging press apparatus. This forging press device is a device for forging a primary molded product of the optical system 4 and has a pressing die whose tip is formed in substantially the same shape as the shape of the recess 6. After the die is set in the forging press device, when the forging press device is operated, the tip of the pressing die is inserted into the die and the same shape as the shape carved into the die by the pressure of the pressing die. A primary molded product having a shape outer shape and a recess having the same shape as the shape of the tip of the pressing die is forged.

次いで、上記ＬＥＤ発光装置３について、より具体的に説明する。
図３は、ＬＥＤ発光装置３の斜視図であり、図４は、上記ＬＥＤ発光装置３の分解斜視図である。
図４に示すように、ＬＥＤ発光装置３は、筐体たるベース２０と、このベース２０上に載置された発光モジュール２と、この発光モジュール２をベース２０内で位置決めするための位置決め部材３３と、この位置決め部材３３をベース２０に固定するための保持部材３６とを備えている。
上記ベース２０は、図３及び図４に示すように、有底円筒形状をなしており、円筒部分が、上記発光モジュール２が保持される保持部２２として構成され、また、その底面が上記発光モジュール２が載置される載置部２１として構成されている。
またベース２０には、ＬＥＤ発光装置３と光学系４とを連接する際にボルトが貫通するねじ孔２３が形成されている。また、このベース２０には、その側面の一部を切り欠いてベース凹部２４が形成され、このベース凹部２４には、外部電源に接続された電源コードが差し込まれるコネクタ２５が嵌め込まれている。 Next, the LED light emitting device 3 will be described more specifically.
FIG. 3 is a perspective view of the LED light emitting device 3, and FIG. 4 is an exploded perspective view of the LED light emitting device 3.
As shown in FIG. 4, the LED light emitting device 3 includes a base 20 as a housing, a light emitting module 2 placed on the base 20, and a positioning member 33 for positioning the light emitting module 2 in the base 20. And a holding member 36 for fixing the positioning member 33 to the base 20.
As shown in FIGS. 3 and 4, the base 20 has a bottomed cylindrical shape, and the cylindrical portion is configured as a holding portion 22 for holding the light emitting module 2, and its bottom surface is the light emitting device. It is comprised as the mounting part 21 in which the module 2 is mounted.
The base 20 is formed with a screw hole 23 through which a bolt passes when the LED light emitting device 3 and the optical system 4 are connected. Further, the base 20 is formed with a base recess 24 by cutting out a part of the side surface thereof, and a connector 25 into which a power cord connected to an external power source is inserted is fitted into the base recess 24.

上記ベース２０の載置部２１には、図４に示すように、発光モジュール２が載置される。この発光モジュール２は、平面視六角形の基板２６を有し、この基板２６上には、電気的に接続された２つの給電部２７が形成されている。ＬＥＤ２９は、上記２つの給電部２７のそれぞれと、ＬＥＤ２９の電力の供給を受けるためのリード２８と電気的に接続され、基板２６上に実装されている。このＬＥＤ２９は、図４に示すように、箱形状をした樹脂製の鍔部３０と、この鍔部３０の上面に突出して形成された、発光素子（不図示）を封止するための封止部３１とを有している。
また、基板２６には、図４に示すように、上記コネクタ２５と一端が接続されたリード線３２の他端が電気的に接続されており、基板２６上の回路パターンやＬＥＤ２９には、上記電源コード、上記コネクタ２５、及び、このリード線３２を介して電力が供給される構成となっている。 As shown in FIG. 4, the light emitting module 2 is placed on the placement portion 21 of the base 20. The light emitting module 2 includes a hexagonal substrate 26 in plan view, and two electrically connected power feeding portions 27 are formed on the substrate 26. The LED 29 is electrically connected to each of the two power supply units 27 and the lead 28 for receiving the power supply of the LED 29, and is mounted on the substrate 26. As shown in FIG. 4, the LED 29 includes a box-shaped resin flange 30 and a seal for sealing a light emitting element (not shown) formed on the upper surface of the flange 30. Part 31.
As shown in FIG. 4, the other end of the lead wire 32 having one end connected to the connector 25 is electrically connected to the substrate 26. Power is supplied through the power cord, the connector 25, and the lead wire 32.

上記発光モジュール２には、図３及び図４に示すように、発光モジュール２を覆って当該発光モジュール２のＬＥＤ２９を位置決めする位置決め部材３３が設けられている。
この位置決め部材３３は、図４に示すように、円板形状をなした絶縁性を有する薄い樹脂製の部材であり、中央に上記ＬＥＤ２９の封止部３１の基端における径と略同一径を有した係止孔３４が形成されている。位置決め部材３３の外径は、上記ベース２０の保持部２２の内径と略同一である。
すなわち、位置決め部材３３は、図３に示すように、係止孔３４にＬＥＤ２９の封止部３１が挿入されて係止すると共に、保持部２２の内周に嵌め込まれる。この状態においては、発光モジュール２は、ＬＥＤ２９の封止部３１が位置決め部材３３の係止孔３４に係止されるため、当該位置決め部材３３とＬＥＤ２９との相対位置が規制され、さらに、位置決め部材３３の外周（縁部）が保持部２２の内周面に嵌め込まれて係合することで、保持部２２に対する位置決め部材３３の係止孔３４の相対位置、すなわち、保持部２２に対するＬＥＤ２９の相対位置が規制されることとなる。これにより、ベース２０内の所定の位置にＬＥＤ２９が位置決めされる。この所定の位置は、例えば、光学系４によって規定される位置であり、本実施形態では、光学系４が反射鏡であるため、その焦点位置が所定の位置決め位置として規定されることとなる。 As shown in FIGS. 3 and 4, the light emitting module 2 is provided with a positioning member 33 that covers the light emitting module 2 and positions the LED 29 of the light emitting module 2.
As shown in FIG. 4, the positioning member 33 is a thin resin member having a disk shape and having insulating properties, and has a diameter substantially equal to the diameter at the base end of the sealing portion 31 of the LED 29 at the center. A holding hole 34 is formed. The outer diameter of the positioning member 33 is substantially the same as the inner diameter of the holding portion 22 of the base 20.
That is, as shown in FIG. 3, the positioning member 33 is fitted into the inner periphery of the holding portion 22 while the sealing portion 31 of the LED 29 is inserted and locked in the locking hole 34. In this state, since the sealing portion 31 of the LED 29 is locked in the locking hole 34 of the positioning member 33, the relative position between the positioning member 33 and the LED 29 is regulated in the light emitting module 2. The outer periphery (edge portion) of 33 is fitted into and engaged with the inner peripheral surface of the holding portion 22, whereby the relative position of the locking hole 34 of the positioning member 33 with respect to the holding portion 22, that is, the LED 29 relative to the holding portion 22. The position will be regulated. As a result, the LED 29 is positioned at a predetermined position in the base 20. This predetermined position is, for example, a position defined by the optical system 4. In this embodiment, since the optical system 4 is a reflecting mirror, the focal position is defined as a predetermined positioning position.

位置決め部材３３の上面の全域には、光反射性を有するフィルム３５が貼り付けられている。すなわち、位置決め部材３３にＬＥＤ２９を係止させたときには、係止孔３４からＬＥＤ２９が突出するため、当該ＬＥＤ２９から基板２６側に向かって放射され照明に寄与しない光が前掲図２の矢印Ｙ１に示すように、位置決め部材３３のフィルム３５にて反射され下開口部８を通って光学系４に進入し、当該光学系４から照射光として取り出されることとなる。これにより、照明装置１の効率の向上が図られる。   A film 35 having light reflectivity is attached to the entire upper surface of the positioning member 33. That is, when the LED 29 is locked to the positioning member 33, the LED 29 protrudes from the locking hole 34. Therefore, light that is emitted from the LED 29 toward the substrate 26 and does not contribute to illumination is indicated by an arrow Y1 in FIG. As described above, the light is reflected by the film 35 of the positioning member 33, enters the optical system 4 through the lower opening 8, and is extracted from the optical system 4 as irradiation light. Thereby, the improvement of the efficiency of the illuminating device 1 is achieved.

位置決め部材３３の上方には、図３及び図４に示すように、保持部材３６が取り付けられる。この保持部材３６は、図４に示すように、可塑性を有する金属で形成された薄い輪状の部材であり、その外周に、外側に突出して形成された４つの突起３７が所定の間隔をあけて形成されている。この保持部材３６の外径は、ベース２０の保持部２２の内径と略同一の大きさである。なお、保持部材３６は、弾性を有する材料にて形成されていてもよい。
この保持部材３６は、ベース２０において位置決め部材３３を固定するための部材であり、図３及び図４に示すように、保持部２２の内周に嵌め込まれて取り付けられる。保持部材３６が保持部２２の内周に嵌め込まれると、上記４つの突起３７のそれぞれが保持部２２の内周面に沿って根元から折り曲がるように塑性変形し、保持部２２の内周を外側へ向かって押圧する。このとき、保持部材３６は、この突起３７の押圧力、及び、突起３７と保持部２２の内周との接触部分に生じる摩擦力によって、保持部２２に保持され、保持部２２の内部において固定され、そして、位置決め部材３３を下方へ向かって押圧して固定する。このとき、位置決め部材３３は、図２に示すように、保持部材３６と上記ＬＥＤ２９の鍔部３０によって挟持されて、ベース２０内で保持、固定されると共に、発光モジュール２は、この位置決め部材３３とベース２０の載置部２１とで挟持される。
なお、保持部材３６が弾性を有する材料にて形成されている場合、保持部材３６が保持部２２の内周にはめ込まれると、４つの突起３７のそれぞれが保持部２２の内周面に沿って根元から折り曲がるように弾性変形する。このとき、保持部材３６は、突起３７の押圧力、及び、突起３７と保持部２２の内周との接触部分に生じる摩擦力によって、保持部２２の内部において固定される。 As shown in FIGS. 3 and 4, a holding member 36 is attached above the positioning member 33. As shown in FIG. 4, the holding member 36 is a thin ring-shaped member formed of a metal having plasticity, and four protrusions 37 that protrude outward are formed at a predetermined interval on the outer periphery thereof. Is formed. The outer diameter of the holding member 36 is substantially the same as the inner diameter of the holding portion 22 of the base 20. Note that the holding member 36 may be formed of an elastic material.
The holding member 36 is a member for fixing the positioning member 33 in the base 20, and is fitted and attached to the inner periphery of the holding portion 22 as shown in FIGS. 3 and 4. When the holding member 36 is fitted into the inner periphery of the holding portion 22, each of the four protrusions 37 is plastically deformed so as to bend from the root along the inner peripheral surface of the holding portion 22, and the inner periphery of the holding portion 22 is Press outward. At this time, the holding member 36 is held by the holding portion 22 by the pressing force of the protrusion 37 and the frictional force generated at the contact portion between the protrusion 37 and the inner periphery of the holding portion 22, and is fixed inside the holding portion 22. Then, the positioning member 33 is pressed downward and fixed. At this time, as shown in FIG. 2, the positioning member 33 is sandwiched between the holding member 36 and the collar portion 30 of the LED 29, held and fixed in the base 20, and the light emitting module 2 is positioned in the positioning member 33. And the mounting portion 21 of the base 20.
When the holding member 36 is formed of an elastic material, when the holding member 36 is fitted into the inner periphery of the holding portion 22, each of the four protrusions 37 extends along the inner peripheral surface of the holding portion 22. Elastically deforms so that it can be bent from the root. At this time, the holding member 36 is fixed inside the holding portion 22 by the pressing force of the protrusion 37 and the frictional force generated at the contact portion between the protrusion 37 and the inner periphery of the holding portion 22.

次いで、ＬＥＤ発光装置３の製造方法として、発光モジュール２をベース２０に組み付ける際の作業手順について図５及び図６を参照して説明する。
発光モジュール２のベース２０への組み付けの際には、図５の上部に示す押圧部材３８を使用する。この押圧部材３８は、保持部２２の内周の径より僅かに小さい径の円筒状（中空円柱状）をなし、その底面側（押圧側）の縁部に、凹状の切り欠き部３９を形成したものである。 Next, as a method for manufacturing the LED light-emitting device 3, an operation procedure when the light-emitting module 2 is assembled to the base 20 will be described with reference to FIGS. 5 and 6.
When the light emitting module 2 is assembled to the base 20, a pressing member 38 shown in the upper part of FIG. 5 is used. The pressing member 38 has a cylindrical shape (hollow columnar shape) having a diameter slightly smaller than the inner peripheral diameter of the holding portion 22, and a concave cutout portion 39 is formed at the edge of the bottom surface side (pressing side). It is a thing.

そして、発光モジュール２をベース２０に組み付ける際には、まず、ベース２０の載置部２１に発光モジュール２を載置する。次いで、この発光モジュール２を覆うように位置決め部材３３を被せると共に、この位置決め部材３３の係止孔３４からＬＥＤ２９の封止部３１を突出させてＬＥＤ２９を係止孔３４に係止させ、位置決め部材３３とＬＥＤ２９との相対位置を規制する。このとき、位置決め部材３３の外周（縁部）がベース２０の保持部２２の内周面と係合することにより、保持部２２に対する位置決め部材３３の係止孔３４の相対位置、すなわち、保持部２２に対するＬＥＤ２９の相対位置が規制され、ＬＥＤ２９の位置決めが行われる。そして、保持部材３６を保持部２２の内周に嵌め込んだ状態で位置決め部材３３の上に載置する。   When the light emitting module 2 is assembled to the base 20, first, the light emitting module 2 is mounted on the mounting portion 21 of the base 20. Next, the positioning member 33 is covered so as to cover the light emitting module 2, and the sealing portion 31 of the LED 29 is protruded from the locking hole 34 of the positioning member 33 so that the LED 29 is locked to the locking hole 34. The relative position between the LED 33 and the LED 29 is regulated. At this time, the outer periphery (edge) of the positioning member 33 engages with the inner peripheral surface of the holding portion 22 of the base 20, so that the relative position of the locking hole 34 of the positioning member 33 with respect to the holding portion 22, that is, the holding portion. The relative position of the LED 29 with respect to 22 is regulated, and the LED 29 is positioned. Then, the holding member 36 is placed on the positioning member 33 in a state where the holding member 36 is fitted into the inner periphery of the holding portion 22.

その後、図５に示すように、上記切り欠き部３９と上記リード線３２とを上下方向において対向させた状態で、押圧部材３８を図５中の矢印に示す方向へ押すことにより、保持部材３６を保持部２２の内周に嵌め込みつつ押し込む。その際、この押し込みに応じて、保持部材３６の外周に形成された４つの突起３７は、保持部２２の内周に接触しつつ、根元から上方へ向かって塑性変形し、保持部２２の内周に圧入されて固定される。
保持部材３６は、押圧部材３８によって、鍔部３０の上面と位置決め部材３３の下面が接触し、かつ、位置決め部材３３の上面と保持部材３６の下面とが接触する状態（図２の状態）に至るまで押し込まれる。このとき、図２に示すように、位置決め部材３３は、発光モジュール２を位置決めしつつ、鍔部３０と保持部材３６とで挟持され、また、発光モジュール２は、位置決め部材３３と載置部２１とで挟持される。このようにして、ＬＥＤ発光装置３は、製造される。 Thereafter, as shown in FIG. 5, the pressing member 38 is pushed in the direction indicated by the arrow in FIG. 5 with the notch 39 and the lead wire 32 facing each other in the vertical direction, thereby holding the member 36. Is pushed into the inner periphery of the holding portion 22. At this time, the four protrusions 37 formed on the outer periphery of the holding member 36 are plastically deformed upward from the root while being in contact with the inner periphery of the holding portion 22 in response to the pushing. It is press-fitted around and fixed.
The holding member 36 is brought into a state where the upper surface of the collar 30 and the lower surface of the positioning member 33 are in contact with each other by the pressing member 38 and the upper surface of the positioning member 33 and the lower surface of the holding member 36 are in contact with each other (the state shown in FIG. 2). It is pushed in. At this time, as shown in FIG. 2, the positioning member 33 is sandwiched between the collar portion 30 and the holding member 36 while positioning the light emitting module 2, and the light emitting module 2 is positioned between the positioning member 33 and the mounting portion 21. It is pinched by. In this way, the LED light emitting device 3 is manufactured.

ＬＥＤ発光装置３を分解する際は、保持部材３６を保持部２２から抜き取ることによって、保持部２２における保持部材３６の保持を解除する。これにより、ベース２０における位置決め部材３３の固定が解除され、これに伴い、発光モジュール２の固定が解除され、ＬＥＤ発光装置３を分解することができる。
そして、再度、発光モジュール２をベース２０に組み付ける際には、保持部材３６の突起３７の塑性変形を指などで延ばすなどして戻し、上述した手順にしたがって組み付けを行う。
なお、保持部材３６が弾性を有する材料にて形成されている場合には、保持部２２における保持部材３６の保持を解除すると、突起３７は、弾性力により元の形状に戻るため、突起３７を指で伸ばす、という作業を省くことができる。 When disassembling the LED light emitting device 3, the holding member 36 is removed from the holding unit 22, thereby releasing the holding member 36 from the holding unit 22. Thereby, the fixing of the positioning member 33 in the base 20 is released, and accordingly, the fixing of the light emitting module 2 is released, and the LED light emitting device 3 can be disassembled.
Then, when the light emitting module 2 is assembled to the base 20 again, the plastic deformation of the projection 37 of the holding member 36 is extended by a finger or the like, and the assembly is performed according to the above-described procedure.
When the holding member 36 is made of a material having elasticity, when the holding member 36 is released from the holding portion 22, the protrusion 37 returns to its original shape due to the elastic force. The work of extending with a finger can be omitted.

以上説明したように、本実施形態によれば、ＬＥＤ発光装置３のベース２０において、発光モジュール２は、位置決め部材３３によって位置決めされる。さらに、発光モジュール２は、この位置決め部材３３が保持部材３６によって固定されることにより、ベース２０において位置決めされつつ固定されるため、発光モジュール２をベース２０に取り付ける際に、ねじを螺合させる作業や、また、発光モジュール２とベース２０を正確に弾発的に係止させる必要がなく、製造に係る作業が単純化される。また、発光モジュール２は、保持部２２における保持部材３６の保持を解除することにより、簡単にベース２０から取り外すことができるため、メンテナンス性が良好である。
また、本実施の形態によれば、位置決め部材３３及び保持部材３６によって、発光モジュール２のＬＥＤ２９を、光学系４の反射面９の焦点の位置に位置決め固定するため、例えばＬＥＤ２９を光学系４の反射面９の焦点の位置に位置決めするべく、ベース２０の所定の位置に雌ねじ部を設け、この雌ねじ部にねじを螺合させて発光モジュール２をねじ止めし、位置決めする、といった煩雑な作業を経ることなく、ＬＥＤ２９を光学系４の反射面９の焦点の位置に容易に位置決めすることができる。 As described above, according to the present embodiment, the light emitting module 2 is positioned by the positioning member 33 in the base 20 of the LED light emitting device 3. Furthermore, since the light emitting module 2 is fixed while being positioned on the base 20 by fixing the positioning member 33 by the holding member 36, an operation of screwing screws when attaching the light emitting module 2 to the base 20 is performed. In addition, the light emitting module 2 and the base 20 do not need to be accurately and elastically locked, and the manufacturing work is simplified. Moreover, since the light emitting module 2 can be easily detached from the base 20 by releasing the holding of the holding member 36 in the holding portion 22, the maintenance performance is good.
Further, according to the present embodiment, the LED 29 of the light emitting module 2 is positioned and fixed at the focal position of the reflecting surface 9 of the optical system 4 by the positioning member 33 and the holding member 36. In order to position the reflecting surface 9 at the focal position, an internal thread portion is provided at a predetermined position of the base 20, and the light emitting module 2 is screwed and positioned by screwing the screw into the internal thread portion. The LED 29 can be easily positioned at the focal point of the reflecting surface 9 of the optical system 4 without passing through.

また、本実施の形態によれば、位置決め部材３３の上面に光反射性を有するフィルム３５が貼り付けられており、このフィルム３５が、発光モジュール２から発光される光のうち基板２６側に向かう放射光を照射方向へ向かって反射し、この光を利用可能とするため、光の使用効率を向上することができる。
また、本実施形態によれば、保持部材３６の外周に形成された４つの突起３７が塑性変形した状態で保持部２２の内周に接触し、この突起３７を介して保持部材３６が保持部２２に保持される。このため、保持部２２に保持部材３６を嵌め込むことによって、容易に保持部材３６を保持部２２に保持させることができるので、ＬＥＤ発光装置３の作成が容易である。
また、本実施形態によれば、位置決め部材３３が絶縁材で形成されているため、位置決め部材３３が基板２６と接触した際に、基板２６に設けられた配線が短絡する、ということがない。 Further, according to the present embodiment, the film 35 having light reflectivity is attached to the upper surface of the positioning member 33, and this film 35 is directed toward the substrate 26 in the light emitted from the light emitting module 2. Since the emitted light is reflected toward the irradiation direction and this light can be used, the light use efficiency can be improved.
Further, according to the present embodiment, the four protrusions 37 formed on the outer periphery of the holding member 36 come into contact with the inner periphery of the holding portion 22 in a state of plastic deformation, and the holding member 36 is held via the protrusion 37 by the holding member 36. 22 is held. For this reason, since the holding member 36 can be easily held by the holding portion 22 by fitting the holding member 36 into the holding portion 22, the LED light emitting device 3 can be easily created.
Further, according to the present embodiment, since the positioning member 33 is formed of an insulating material, when the positioning member 33 comes into contact with the substrate 26, the wiring provided on the substrate 26 is not short-circuited.

また、本実施形態によれば、押圧部材３８を利用して、簡単にＬＥＤ発光装置３を製造することができるため、ＬＥＤ発光装置３の製造に係る作業が単純化されると共に、製造に係る時間を短縮することができ製造コストの削減を図ることができる。   Moreover, according to this embodiment, since the LED light-emitting device 3 can be easily manufactured using the press member 38, the operation | work which concerns on manufacture of the LED light-emitting device 3 is simplified, and it concerns on manufacture. Time can be shortened and manufacturing cost can be reduced.

＜第２実施形態＞
本実施形態では、ベース６０に複数の発光モジュール２が設けられ、これら発光モジュール２のそれぞれに、透過型光学素子の一例たるレンズ型の光学系６１が対応して設けられたＬＥＤ発光装置６２について説明する。
図７は、ＬＥＤ発光装置６２の斜視図（後述の蓋体６４をベース６０に取り付ける前の状態における斜視図）であり、図８は、ＬＥＤ発光装置６２に設けられた発光モジュール２のうち１つの発光モジュール２の断面図である。なお、これらの図において、図２および図３に示す構成要素と同じものについては同一の符号を付し、その説明を省略する。 Second Embodiment
In the present embodiment, a plurality of light emitting modules 2 are provided on a base 60, and an LED light emitting device 62 in which a lens type optical system 61 as an example of a transmissive optical element is provided for each of the light emitting modules 2. explain.
FIG. 7 is a perspective view of the LED light emitting device 62 (a perspective view in a state before a lid 64 described later is attached to the base 60), and FIG. 8 is one of the light emitting modules 2 provided in the LED light emitting device 62. 3 is a cross-sectional view of two light emitting modules 2. In these drawings, the same components as those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and the description thereof is omitted.

図７に示すように、本実施形態では、板状のベース６０に、上面視略円形の凹部６３が複数設けられている。これらの凹部６３は、第１実施形態にて説明した保持部２２に相当するものであり、凹部６３の内部に、発光モジュール２が配設されている。このとき、第１実施形態と同様に、位置決め部材３３及び保持部材３６により、発光モジュール２のＬＥＤ２９が凹部６３の内で所定の位置に位置決め固定されている。
このベース６０には、各発光モジュール２を覆うように蓋体６４が取り付けられる。このとき蓋体６４とベース６０との間には、若干の隙間を有して構成しても良い。 As shown in FIG. 7, in the present embodiment, the plate-like base 60 is provided with a plurality of concave portions 63 having a substantially circular shape when viewed from above. These recesses 63 correspond to the holding unit 22 described in the first embodiment, and the light emitting module 2 is disposed inside the recesses 63. At this time, as in the first embodiment, the LED 29 of the light emitting module 2 is positioned and fixed at a predetermined position in the recess 63 by the positioning member 33 and the holding member 36.
A lid 64 is attached to the base 60 so as to cover each light emitting module 2. At this time, a slight gap may be provided between the lid body 64 and the base 60.

蓋体６４には、ベース６０に設けた凹部６３に対向する箇所に、レンズ型の光学系６１が設けられている。すなわち、発光モジュール２は、図８に示すように、ベース６０に蓋体６４が取り付けられた際に、ＬＥＤ２９が上記光学系６１の直下（特に、光学中心上）に配置されるように、位置決め部材３３及び保持部材３６により凹部６３に対して位置決め固定されることとなる。   The lid 64 is provided with a lens-type optical system 61 at a location facing the recess 63 provided in the base 60. That is, as shown in FIG. 8, the light emitting module 2 is positioned so that the LED 29 is disposed immediately below the optical system 61 (particularly on the optical center) when the lid 64 is attached to the base 60. The member 33 and the holding member 36 are positioned and fixed with respect to the recess 63.

そして、ＬＥＤ２９から放射された光は、図８の矢印Ｙ３に示すように、直上の光学系６１に入射し、当該光学系６１によって進行方向が制御されて照射光として光学系６１から出射される。このとき、ＬＥＤ２９から基板２６側に向かう光は、図８の矢印Ｙ４に示すように、位置決め部材３３の上面に貼り付けられたフィルム３５によって光学系６１に向けて反射され当該光学系６１から照射光として外部へ放たれる。   And the light radiated | emitted from LED29 enters into the optical system 61 immediately above as shown by the arrow Y3 of FIG. 8, the advancing direction is controlled by the said optical system 61, and it is radiate | emitted from the optical system 61 as irradiation light. . At this time, the light traveling from the LED 29 toward the substrate 26 is reflected toward the optical system 61 by the film 35 attached to the upper surface of the positioning member 33 and irradiated from the optical system 61 as indicated by an arrow Y4 in FIG. It is released outside as light.

本実施形態によれば、第１実施形態と同様に、位置決め部材３３及び保持部材３６により発光モジュール２をベース６０の凹部６３に取り付ける構成としたため、ねじを螺合させる作業等が必要がなく、組み立て作業が容易となる。
特に本実施形態のように、多数の発光モジュール２を備えたＬＥＤ発光装置６２では、各ＬＥＤ２９の位置決め固定を容易に行うことができるため、組み付けに要する時間の大幅な短縮を図ることができる。 According to the present embodiment, as in the first embodiment, since the light emitting module 2 is attached to the concave portion 63 of the base 60 by the positioning member 33 and the holding member 36, there is no need for an operation of screwing screws, etc. Assembling work becomes easy.
In particular, in the LED light emitting device 62 including a large number of light emitting modules 2 as in the present embodiment, the positioning and fixing of the LEDs 29 can be easily performed, so that the time required for assembly can be greatly shortened.

＜第３実施形態＞
上述した第１実施形態では、位置決め部材３３及び保持部材３６がそれぞれ別部材であったが、第３実施形態では、これら２部材が一体的に形成されているＬＥＤ発光装置５０について説明する。
図９は、本実施形態に係るＬＥＤ発光装置５０の分解斜視図である。なお、この図において、図４に示す構成要素と同じものについては同一の符号を付し、その説明を省略する。
本実施形態では、図９に示すように、位置決め部材５１の外周に、外側に突出して形成された４つの突起５２が所定の間隔をあけて形成されている。この位置決め部材５１がベース２０に取り付けられると、位置決め部材５１は、第１実施形態と同様、発光モジュール２を位置決めし、さらに、位置決め部材５１は、上記突起５２が塑性変形しつつ保持部２２の内周に接触することにより、保持部２２の内周において固定される。
なお、位置決め部材５１は、弾性を有する材料にて形成されていてもよく、この場合、位置決め部材５１は、突起５２が弾性変形しつつ保持部２２の内周に接触することにより、保持部２２の内周において固定される。
この第２実施形態によれば、上述した第１実施形態と同様の効果を得ることができると共に、以下の効果を得ることができる。すなわち、第二実施形態では、第一実施形態における位置決め部材３３及び保持部材３６（図４参照）の機能を、１つの位置決め部材５１（図９参照）で実現するため、部品点数を削減することができ、製造に係るコストの削減を図ることができる。 <Third Embodiment>
In the first embodiment described above, the positioning member 33 and the holding member 36 are separate members. In the third embodiment, an LED light emitting device 50 in which these two members are integrally formed will be described.
FIG. 9 is an exploded perspective view of the LED light emitting device 50 according to the present embodiment. In this figure, the same components as those shown in FIG. 4 are denoted by the same reference numerals, and the description thereof is omitted.
In the present embodiment, as shown in FIG. 9, four protrusions 52 formed to protrude outward are formed on the outer periphery of the positioning member 51 at a predetermined interval. When the positioning member 51 is attached to the base 20, the positioning member 51 positions the light emitting module 2 as in the first embodiment, and the positioning member 51 further includes the holding portion 22 while the projection 52 is plastically deformed. The inner periphery of the holding part 22 is fixed by contacting the inner periphery.
The positioning member 51 may be formed of an elastic material. In this case, the positioning member 51 contacts the inner periphery of the holding portion 22 while the protrusion 52 is elastically deformed, thereby holding the holding portion 22. It is fixed on the inner periphery of the.
According to the second embodiment, the same effects as those of the first embodiment described above can be obtained, and the following effects can be obtained. That is, in the second embodiment, since the functions of the positioning member 33 and the holding member 36 (see FIG. 4) in the first embodiment are realized by one positioning member 51 (see FIG. 9), the number of parts is reduced. And cost for manufacturing can be reduced.

＜第４実施形態＞
本実施形態では、発光モジュール２を４個備えるＬＥＤ発光装置７１について説明する。なお、本実施形態で使用されている発光モジュール２の構成は、第１実施形態で使用されている発光モジュール２の構成と同一である。 <Fourth embodiment>
In the present embodiment, an LED light emitting device 71 including four light emitting modules 2 will be described. In addition, the structure of the light emitting module 2 used by this embodiment is the same as the structure of the light emitting module 2 used by 1st Embodiment.

図１０は、ＬＥＤ発光装置７１の斜視図であり、図１１は、上記ＬＥＤ発光装置７１の分解斜視図であり、図１２は、ＬＥＤ発光装置７１を横から見た図である。
ＬＥＤ発光装置７１は、４つの発光モジュール２を固定するための装置であり、板状のベース８２と、これらの図に示すように、このベース８２の上面に突設された８本のピン状の保持部８４と、ベース８２おいて保持部８４で囲まれた箇所に載置された発光モジュール２と、この発光モジュール２を位置決めするための位置決め部材９２と、この位置決め部材９２を固定するための保持部材８６と、を有している。 10 is a perspective view of the LED light emitting device 71, FIG. 11 is an exploded perspective view of the LED light emitting device 71, and FIG. 12 is a view of the LED light emitting device 71 as viewed from the side.
The LED light emitting device 71 is a device for fixing the four light emitting modules 2, and has a plate-like base 82 and eight pin-like shapes protruding from the upper surface of the base 82 as shown in these drawings. Holding part 84, the light emitting module 2 placed at a location surrounded by the holding part 84 in the base 82, a positioning member 92 for positioning the light emitting module 2, and for fixing the positioning member 92 Holding member 86.

上記ベース８２は、図１０及び図１１に示すように、板形状の部材であり、その上面には、ピン状の８本の保持部８４が照射方向へ突出した形状で設けられており、ベース８２においてこれら保持部８４によって囲まれた箇所に載置部８５が形成されている。これら８本の保持部８４は、ベース８２の上面に略等間隔で突設されており、詳細は後述するが、保持部材８６がベース８２に取り付けられた際、その保持部材８６の外周が、全ての保持部８４と接触する構成となっている。   As shown in FIGS. 10 and 11, the base 82 is a plate-shaped member. On the upper surface of the base 82, eight pin-shaped holding portions 84 are provided so as to protrude in the irradiation direction. In 82, a mounting portion 85 is formed at a location surrounded by the holding portions 84. These eight holding portions 84 project from the upper surface of the base 82 at substantially equal intervals, and will be described in detail later. When the holding member 86 is attached to the base 82, the outer periphery of the holding member 86 is It is configured to be in contact with all the holding portions 84.

この載置部８５には、図１１に示すように、４つの発光モジュール２が所定の間隔をあけて載置されており、この４つの発光モジュール２の上方には、この４つの発光モジュール２を覆うように、位置決め部材９２が取り付けられる。
この位置決め部材９２は、図１０に示すように、絶縁性を有する部材で成形された、正面視長方形の薄い部材であり、同一の径を有した４つの係止孔９３が長手方向に所定の間隔をあけて形成されている。この係止孔９３の径は、ＬＥＤ２９の封止部３１の基端における径と略同一の大きさである。また、位置決め部材９２の上面の全域には、光反射性を有するフィルム９４が貼り付けられている。
この位置決め部材９２は、図１０及び図１２に示すように、係止孔９３のそれぞれにＬＥＤ２９の封止部３１を貫通させた状態で、載置部８５に取り付けられる。その際、発光モジュール２のそれぞれは、それらのＬＥＤ２９の封止部３１が位置決め部材９２の係止孔９３に係止することにより、載置部８５において位置決めされると共に、この位置決め部材９２は、その外周が保持部８４に保持され、保持部８４において位置決めされる。このように、４つの発光モジュール２のそれぞれは、位置決め部材９２によってベース８２の載置部８５の所定の位置に位置決めされる。
また、上述したように、位置決め部材９２の上面には、光反射性を有するフィルム９４が貼り付けられているため、図１２の矢印Ｙ２に示すように、ＬＥＤ２９から放射された光うち下方へ向かう光の一部が、このフィルム９４により上方へ向かって反射する構成となっている。 As shown in FIG. 11, the four light emitting modules 2 are placed on the mounting portion 85 at a predetermined interval. Above the four light emitting modules 2, the four light emitting modules 2 are mounted. A positioning member 92 is attached so as to cover.
As shown in FIG. 10, the positioning member 92 is a thin member having a rectangular shape when viewed from the front, formed of an insulating member, and has four locking holes 93 having the same diameter in the longitudinal direction. It is formed at intervals. The diameter of the locking hole 93 is substantially the same as the diameter at the base end of the sealing portion 31 of the LED 29. A film 94 having light reflectivity is attached to the entire upper surface of the positioning member 92.
As shown in FIGS. 10 and 12, the positioning member 92 is attached to the placement portion 85 in a state where the sealing portion 31 of the LED 29 is passed through each of the locking holes 93. At that time, each of the light emitting modules 2 is positioned in the mounting portion 85 by locking the sealing portion 31 of the LED 29 in the locking hole 93 of the positioning member 92, and the positioning member 92 is The outer periphery is held by the holding portion 84 and positioned by the holding portion 84. As described above, each of the four light emitting modules 2 is positioned at a predetermined position of the mounting portion 85 of the base 82 by the positioning member 92.
Further, as described above, since the light reflecting film 94 is attached to the upper surface of the positioning member 92, the light emitted from the LED 29 is directed downward as indicated by the arrow Y2 in FIG. A part of the light is reflected upward by the film 94.

位置決め部材９２の照射方向には、図１０〜図１２に示すように、保持部材８６が設けられる。
この保持部材８６は、図１１に示すように、可塑性を有する金属で形成された正面視長方形の薄い部材であり、中央が大きく切り欠かれている。
なお、保持部材８６は、弾性を有する材料にて形成されていてもよい。
この保持部材８６は、ベース８２の載置部８５において、位置決め部材９２を固定するための部材であり、図１２に示すように、その下面が、位置決め部材９２の上面に接触し、かつ、位置決め部材９２を下方へ向かって付勢した状態で、保持部８４で囲まれた空間に嵌めこまれる。このとき、保持部材８６の外周は、保持部８４の全てに塑性変形しつつ接触する構成となっており、保持部材８６と保持部８４との間に生じる摩擦力によって、保持部材８６が保持部８４に保持される。保持部材８６が固定されると、図１２に示すように、位置決め部材９２は、この保持部材８６とＬＥＤ２９の鍔部３０によって挟持されると共に、発光モジュール２は、位置決め部材９２と載置部８５とで挟持される。
なお、保持部材８６が弾性を有する材料にて形成されている場合、保持部材８６の外周は、保持部８４に弾性変形しつつ接触し、保持部材８６と保持部８４との間に生じる摩擦力によって、保持部材８６は、保持部８４に保持される。 As shown in FIGS. 10 to 12, a holding member 86 is provided in the irradiation direction of the positioning member 92.
As shown in FIG. 11, the holding member 86 is a thin member having a rectangular shape when viewed from the front and made of a metal having plasticity.
Note that the holding member 86 may be formed of an elastic material.
The holding member 86 is a member for fixing the positioning member 92 in the mounting portion 85 of the base 82, and its lower surface is in contact with the upper surface of the positioning member 92 as shown in FIG. The member 92 is fitted into the space surrounded by the holding portion 84 in a state where the member 92 is biased downward. At this time, the outer periphery of the holding member 86 is configured to come into contact with all of the holding portion 84 while being plastically deformed, and the holding member 86 is held by the frictional force generated between the holding member 86 and the holding portion 84. 84. When the holding member 86 is fixed, as shown in FIG. 12, the positioning member 92 is sandwiched between the holding member 86 and the collar portion 30 of the LED 29, and the light emitting module 2 includes the positioning member 92 and the mounting portion 85. It is pinched by.
When the holding member 86 is formed of an elastic material, the outer periphery of the holding member 86 comes into contact with the holding portion 84 while being elastically deformed, and a frictional force is generated between the holding member 86 and the holding portion 84. Thus, the holding member 86 is held by the holding portion 84.

以上説明したように、本実施形態によれば、複数の発光モジュール２を、位置決め部材９２及び保持部材８６によって、同時にベースに位置決め及び固定することができるため、第１実施形態と同様、発光モジュール２をベース８２に固定する際、ねじを螺合させる作業や、また、発光モジュール２とベース８２を正確に弾発的に係止させる必要がなく、製造に係る作業が単純化される。また、発光モジュール２は、保持部８４における保持部材８６の保持を解除することにより、簡単にベース８２から取り外すことができるため、メンテナンス性が良好である。   As described above, according to the present embodiment, since the plurality of light emitting modules 2 can be positioned and fixed to the base at the same time by the positioning member 92 and the holding member 86, the light emitting module as in the first embodiment. When fixing 2 to the base 82, it is not necessary to screw the screw, and it is not necessary to elastically lock the light emitting module 2 and the base 82 in a precise manner, thereby simplifying the manufacturing work. Moreover, since the light emitting module 2 can be easily removed from the base 82 by releasing the holding of the holding member 86 in the holding portion 84, the maintainability is good.

なお、上述した実施の形態は、あくまでも本発明の一態様を示すものであり、本発明の範囲内で任意に変形および応用が可能である。
また、第１実施形態において、位置決め部材３３にＬＥＤ２９の封止部３１の基端における径と同じ大きさの径を有する係止孔３４を設け、この係止孔３４の内周によって、封止部３１の外周を支持する構成となっているが、これは、例えば、係止孔３４の径を封止部３１の基端における径より大きく形成し、この係止孔３４の内周に中心へ向かって突出した突起を３つ以上形成し、これら突起により封止部３１を支持する構成としてもよい。すなわち、係止孔３４の形状は任意であり、位置決め部材３３を確実に支持可能な形状であればよい。同様のことは、第２，第３実施形態についても言うことができる。
また、第３実施形態において、８本のピン状の保持部８４が、保持部材８６を保持する構成としているが、保持部材８６の本数はこの本数に限らず、また、形状もピン状に限らず、例えば、複数の板状の壁を設け、この壁によって保持部材８６を保持する構成としてもよい。すなわち、保持部８４の形状は任意であり、位置決め部材９２を保持可能な形状であればよい。同様のことは、第１，第２実施形態についても言うことができる。 The above-described embodiment is merely an aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention.
In the first embodiment, the positioning member 33 is provided with a locking hole 34 having the same diameter as that of the base end of the sealing portion 31 of the LED 29, and sealing is performed by the inner periphery of the locking hole 34. The outer periphery of the portion 31 is supported. For example, the diameter of the locking hole 34 is larger than the diameter at the proximal end of the sealing portion 31, and the center of the locking hole 34 is centered on the inner periphery. It is good also as a structure which forms the three or more protrusions which protruded toward, and supports the sealing part 31 by these protrusions. That is, the shape of the locking hole 34 is arbitrary, and any shape that can reliably support the positioning member 33 may be used. The same can be said for the second and third embodiments.
Further, in the third embodiment, the eight pin-shaped holding portions 84 are configured to hold the holding member 86, but the number of the holding members 86 is not limited to this number, and the shape is also limited to the pin shape. Instead, for example, a plurality of plate-like walls may be provided, and the holding member 86 may be held by the walls. That is, the shape of the holding portion 84 is arbitrary, and may be any shape that can hold the positioning member 92. The same can be said for the first and second embodiments.

第１実施形態に係る照明装置の斜視図。The perspective view of the illuminating device which concerns on 1st Embodiment. 第１実施形態に係る照明装置の断面図。Sectional drawing of the illuminating device which concerns on 1st Embodiment. 第１実施形態に係るＬＥＤ発光装置の斜視図。The perspective view of the LED light-emitting device which concerns on 1st Embodiment. 第１実施形態に係るＬＥＤ発光装置の分解斜視図。The disassembled perspective view of the LED light-emitting device which concerns on 1st Embodiment. 第１実施形態に係るＬＥＤ発光装置の製造方法を説明するための図。The figure for demonstrating the manufacturing method of the LED light-emitting device which concerns on 1st Embodiment. 第１実施形態に係るＬＥＤ発光装置の製造方法を説明するための図。The figure for demonstrating the manufacturing method of the LED light-emitting device which concerns on 1st Embodiment. 第２実施形態に係るＬＥＤ発光装置の斜視図。The perspective view of the LED light-emitting device concerning 2nd Embodiment. 第２実施形態に係るＬＥＤ発光装置の断面図。Sectional drawing of the LED light-emitting device which concerns on 2nd Embodiment. 第３実施形態に係るＬＥＤ発光装置の分解斜視図。The disassembled perspective view of the LED light-emitting device which concerns on 3rd Embodiment. 第４実施形態に係るＬＥＤ発光装置の斜視図。The perspective view of the LED light-emitting device which concerns on 4th Embodiment. 第４実施形態に係るＬＥＤ発光装置の分解斜視図。The disassembled perspective view of the LED light-emitting device which concerns on 4th Embodiment. 第４実施形態に係るＬＥＤ発光装置の側面図。The side view of the LED light-emitting device which concerns on 4th Embodiment.

符号の説明Explanation of symbols

２ 発光モジュール
３，５０，６２，７１ ＬＥＤ発光装置
４，６１ 光学系
２０，６０，８２ ベース
２２，８４ 保持部
２６ 基板
２９ ＬＥＤ
３３，９２ 位置決め部材
３４，９３ 係止孔
３５，９４ フィルム
３６，８６ 保持部材
３８ 押圧部材 2 Light emitting module 3, 50, 62, 71 LED light emitting device 4, 61 Optical system 20, 60, 82 Base 22, 84 Holding unit 26 Substrate 29 LED
33, 92 Positioning member 34, 93 Locking hole 35, 94 Film 36, 86 Holding member 38 Pressing member

Claims (5)

基板にＬＥＤを実装した発光モジュールと、
この発光モジュールのＬＥＤを係止する係止孔を有した位置決め部材とを備え、
前記位置決め部材の係止孔にＬＥＤを係止させた状態で、前記位置決め部材を保持部材を介してベースに設けた保持部に保持させることにより、前記発光モジュールを前記ベースに固定可能とした
ことを特徴とするＬＥＤ発光装置。 A light emitting module having LEDs mounted on a substrate;
A positioning member having a locking hole for locking the LED of the light emitting module;
The light emitting module can be fixed to the base by holding the positioning member on a holding portion provided on the base via a holding member in a state where the LED is locked in the locking hole of the positioning member. LED light emitting device characterized by the above. 前記位置決め部材及び前記保持部材は、前記発光モジュールのＬＥＤを、前記ＬＥＤの放射光を制御する光学系に応じて規定される所定の位置に位置決め固定する
ことを特徴とする請求項１に記載のＬＥＤ発光装置。 The said positioning member and the said holding member position and fix LED of the said light emitting module in the predetermined position prescribed | regulated according to the optical system which controls the emitted light of the said LED. LED light emitting device. 前記位置決め部材に、前記ＬＥＤから前記基板側に放射された光を、前記ＬＥＤで照射すべき方向に反射する反射面を設けた
ことを特徴とする請求項１又は２に記載のＬＥＤ発光装置。 The LED light-emitting device according to claim 1, wherein the positioning member is provided with a reflecting surface that reflects light emitted from the LED toward the substrate in a direction in which the LED is to be irradiated. 前記保持部材を、その外周部を塑性変形または弾性変形させた状態で、前記ベースの前記保持部に保持させ、前記保持部材を介して前記位置決め部材を前記保持部に保持させる
ことを特徴とする請求項１ないし３のいずれか一項記載のＬＥＤ発光装置。 The holding member is held by the holding portion of the base in a state where the outer peripheral portion is plastically deformed or elastically deformed, and the positioning member is held by the holding portion via the holding member. The LED light-emitting device according to any one of claims 1 to 3. 基板にＬＥＤを実装した発光モジュールを有するＬＥＤ発光装置の製造方法において、
前記発光モジュールをベースに載置し、
前記ＬＥＤを、前記ＬＥＤの放射光を制御する光学系に応じて規定される所定の位置に位置決め固定した状態で、位置決め部材を前記ベースに載置した後、
保持部材を押圧部材によってベースへ向かって押圧し、前記保持部材の外周を前記ベースの保持部に圧入して、前記保持部材を固定する
ことを特徴とするＬＥＤ発光装置の製造方法。 In the manufacturing method of the LED light emitting device having the light emitting module in which the LED is mounted on the substrate,
Place the light emitting module on the base,
After placing the positioning member on the base in a state where the LED is positioned and fixed at a predetermined position defined according to an optical system that controls the emitted light of the LED,
A method for manufacturing an LED light emitting device, comprising: pressing a holding member toward a base by a pressing member, press-fitting an outer periphery of the holding member into a holding portion of the base, and fixing the holding member.
JP2007183863A 2007-07-13 2007-07-13 Led light emitting device and manufacturing method of led light emitting device Pending JP2009021144A (en)

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