JP2009016442A - Thermoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a thermoelectric module utilizing a conventionally suggested thin film thermoelectric material has disadvantages such as incapability of increasing a temperature difference, greater heat loss from a board that leads to low efficiency, a smaller amount of heat absorption, difficulty in handling, difficulty in manufacture, etc. <P>SOLUTION: A thermoelectric element includes an insulating board (1), a first electrode (2b) formed on one surface of the insulating board (1), a second electrode (3c) formed on one surface of the insulating board (1) to be isolated from the first electrode (2b), a third electrode (9c) formed on the other surface of the insulating board (1) and connected to the second electrode (3c) through a through-hole (4) provided on the insulating board (1), and a first conductive first thermoelectric material (5b) formed on one surface of the insulating board (1) as a thin film so as to be in contact with the first electrode (2b) and the second electrode (3c). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a thermoelectric element using a thin film thermoelectric material.

In recent years, high-performance thermoelectric materials using a superlattice structure have been developed, but in general, they can only be made as thin films (10 nm to 10 μm) on a substrate, so that they are generally used as thermoelectric modules. It was difficult to do. This is because a thermoelectric material of about 1 mm square is required to produce a thermoelectric module.
Japanese Unexamined Patent Publication No. 06-029581 JP 06-188464 A Japanese Patent Laid-Open No. 10-173110 JP 2002-253426 A

  In addition, thermoelectric modules using thin-film thermoelectric materials have been proposed, but there are problems such as a large temperature difference, large heat loss due to the substrate and poor efficiency, low heat absorption, difficult to use, and difficult to manufacture. It was.

  The thermoelectric element according to the first invention includes an insulating substrate (1), a first electrode (2b) formed on one surface of the insulating substrate (1), and the insulating substrate (1). A second electrode (3c) formed on one side of the first electrode (2b) and spaced apart from the first electrode (2b), and formed on the other side of the insulating substrate (1), the insulating substrate (1) A third electrode (9c) connected to the second electrode (3c) by a through hole (4) provided in the first electrode (1) on the one surface of the insulating substrate (1). 2b) and a first thermoelectric material of the first conductivity type (5b) formed in a thin film so as to be in contact with the second electrode (3c).

  In the thermoelectric element, by passing a current between the first electrode (2b) and the second electrode (3c), the interface between the first electrode (2b) and the first thermoelectric material (5b) and At the interface between the second electrode (3c) and the first thermoelectric material (5b), heat absorption and heat generation occur due to the Peltier effect. As a result, a temperature difference corresponding to both ends of the first thermoelectric material (5b) is generated. In the thermoelectric element, the second electrode (3c) formed on one surface of the insulating substrate (1) and the third electrode (9c) formed on the other surface are connected by a through hole (4). Therefore, it is possible to realize a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b) is formed as a thin film only on one surface of the substrate (1), the production is simple. Furthermore, since a current flows in the in-plane direction of the thermoelectric material (5b) formed with a thin film to obtain a temperature difference, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased.

  According to a second invention, in the first invention, the insulating substrate (1) is formed on the one surface so as to be separated from the first electrode (2b) and the second electrode (3c). A fourth electrode (2c) and a second thin film formed on the one surface of the insulating substrate (1) so as to be in contact with the second electrode (3c) and the fourth electrode (2c) And a second thermoelectric material (6c) of a conductive type.

  In the thermoelectric element, by passing a current between the first electrode (2b) and the fourth electrode (2c), [the interface between the first electrode (2b) and the first thermoelectric material (5b)]. , Interface between fourth electrode (2c) and second thermoelectric material (6c)] and [interface between second electrode (3c) and first thermoelectric material (5b), second electrode (3c) And the second thermoelectric material (6c)], heat absorption and heat generation occur due to the Peltier effect. As a result, a temperature difference corresponding to both ends of each thermoelectric material (5b, 6c) is generated. In the thermoelectric element, the second electrode (3c) formed on one surface of the insulating substrate (1) and the third electrode (9c) formed on the other surface are connected by a through hole (4). Therefore, it is possible to realize a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b, 6c) is formed as a thin film only on one surface of the substrate (1), the production is simple. Furthermore, in order to obtain a temperature difference by flowing a current in the in-plane direction of the thermoelectric material (5b, 6c) formed into a thin film, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased. .

  According to a third invention, in the first invention, the insulating substrate (1) is formed on the one surface so as to be separated from the first electrode (2b) and the second electrode (3c). A fourth hole (3b) and a through hole formed on the other surface of the insulating substrate (1) and spaced apart from the third electrode (9c) and provided in the insulating substrate (1) A fifth electrode (9b) connected to the fourth electrode (3b) by (4), and the first electrode (2b) and the fourth electrode on the one surface of the insulating substrate (1). And a second thermoelectric material (6b) of the second conductivity type formed in a thin film so as to be in contact with the electrode (3b).

  In the thermoelectric element, by passing a current between the second electrode (3c) and the fourth electrode (3b), [the interface between the first electrode (2b) and the first thermoelectric material (5b)]. , Interface between first electrode (2b) and second thermoelectric material (6b)] and [interface between second electrode (3c) and first thermoelectric material (5b), fourth electrode (3b) And the second thermoelectric material (6b)], heat absorption and heat generation occur due to the Peltier effect. As a result, a temperature difference corresponding to both ends of each thermoelectric material (5b, 6b) is generated. In the thermoelectric element, the second electrode (3c), the fourth electrode (3b) formed on one surface of the insulating substrate (1), and the third electrode (9c) formed on the other surface, Since the fifth electrode (9b) is connected to each other through the through hole (4), it is possible to realize a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface. it can. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b, 6b) is formed in a thin film only on one surface of the substrate (1), the production is simple. Furthermore, in order to obtain a temperature difference by flowing a current in the in-plane direction of the thermoelectric material (5b, 6b) formed into a thin film, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased. .

  In a fourth aspect based on the first aspect, the width of the joint between each of the first electrode (2b) and the second electrode (3c) and the first thermoelectric material (5b) is It is characterized by being larger than the thickness of the first thermoelectric material (5b).

  In the thermoelectric element, the electrical resistance and thermal resistance of the junction are reduced, and the peripheral current density and thermal density are also reduced, so that loss is reduced and performance is improved.

  According to a fifth invention, in the first invention, the thickness of each of the first electrode (2b) and the second electrode (3c) is larger than the thickness of the first thermoelectric material (5b). It is characterized by.

  In the thermoelectric element, the electrical resistance and thermal resistance of the junction are reduced, and the peripheral current density and thermal density are also reduced, so that loss is reduced and performance is improved.

  In a sixth aspect based on the first aspect, the insulating substrate (1) has a heat insulating portion (15) formed at least at a part of a lower portion of the portion where the first thermoelectric material (5b) is formed. It is characterized by.

  According to the thermoelectric element, heat loss due to the substrate (1) can be reduced, and performance can be improved.

  According to a seventh invention, in the first invention, the surface area of the first electrode (2b) is larger than the surface area of the second electrode (3c).

  In the thermoelectric element described above, a current is passed between the first electrode (2b) and the second electrode (3c) so that the first electrode (2b) having a large surface area becomes the heat absorption side electrode. The endothermic area on one side of 1) (the area where heat is generated) can be increased, and the thermal resistance of the endothermic electrode can be lowered to improve performance.

  In an eighth aspect based on the first aspect, the first electrode (2b) is formed higher in the vertical direction of the insulating substrate (1) than the second electrode (3c). Features.

  In the thermoelectric element, when a heat transfer plate is provided on the first electrode (2b), a groove is formed on the heat transfer plate to provide a space between the second electrode (3c) and the heat transfer plate. Since it is not necessary to apply, it is easy to manufacture.

  According to a ninth invention, in the first invention, the first thermoelectric material (5b) includes the first electrode (2b) and the second electrode (3c) and the insulating substrate (1). It is formed in the level | step difference part.

  According to the thermoelectric element, it is not necessary to make the substrate (1) and the upper surfaces of the electrodes (2b, 3c) flush with each other, so that the substrate (1) can be easily manufactured.

  In a tenth aspect based on the first aspect, each of the first electrode (2b) and the second electrode (3c) includes the first thermoelectric material (5b) and the insulating substrate (1 ) To cover the step portion.

  According to the thermoelectric element, it is not necessary to make the substrate (1) and the electrodes (2b, 3c) coplanar, so that the substrate (1) can be easily manufactured.

  In an eleventh aspect based on the first aspect, the insulating substrate (1) is composed of a laminated substrate of a base substrate (1a) and a heat insulating substrate (1b).

  In the above thermoelectric element, the insulating substrate (1) has a laminated structure of a base substrate (1a) having high strength and a heat insulating substrate (1b) having high heat insulating properties, so that both heat insulating properties and rigidity / strength are compatible. Can do.

  In the thermoelectric element according to the first invention, the second electrode (3c) formed on one surface of the insulating substrate (1) and the third electrode (9c) formed on the other surface are through holes ( Since they are connected by 4), it is possible to realize a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b) is formed as a thin film only on one surface of the substrate (1), the production is simple. Furthermore, since a current flows in the in-plane direction of the thermoelectric material (5b) formed with a thin film to obtain a temperature difference, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased.

  In the thermoelectric element according to the second aspect of the invention, the second electrode (3c) formed on one surface of the insulating substrate (1) and the third electrode (9c) formed on the other surface are through holes ( Since they are connected by 4), it is possible to realize a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b, 6c) is formed as a thin film only on one surface of the substrate (1), the production is simple. Furthermore, in order to obtain a temperature difference by flowing a current in the in-plane direction of the thermoelectric material (5b, 6c) formed into a thin film, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased. .

  In the thermoelectric element according to the third invention, the second electrode (3c) and the fourth electrode (3b) formed on one surface of the insulating substrate (1) and the third electrode formed on the other surface. Since the (9c) and the fifth electrode (9b) are connected to each other through the through hole (4), a thermoelectric module that absorbs heat from one surface of the insulating substrate (1) and dissipates heat from the other surface is provided. Can be realized. This is easy to use because it has the same format as a conventional thermoelectric module. Further, since the thermoelectric material (5b, 6b) is formed in a thin film only on one surface of the substrate (1), the production is simple. Furthermore, in order to obtain a temperature difference by flowing a current in the in-plane direction of the thermoelectric material (5b, 6b) formed into a thin film, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference can be increased. .

  In the thermoelectric elements according to the fourth and fifth inventions, the electrical resistance and thermal resistance of the joint portion are reduced, and the current density and thermal density of the periphery are also reduced, so that loss is reduced and performance is improved.

  According to the thermoelectric element of the sixth invention, the heat loss due to the substrate (1) can be reduced, and the performance can be improved.

  In the thermoelectric device according to the seventh aspect of the invention, a current is passed between the first electrode (2b) and the second electrode (3c) so that the first electrode (2b) having a large surface area becomes the heat absorption side electrode. As a result, the endothermic area on one surface of the substrate (1) (the area of the part where the endotherm is generated) can be increased, and the thermal resistance of the endothermic electrode can be lowered to improve the performance.

  In the thermoelectric element according to the eighth aspect of the invention, when a heat transfer plate is provided on the first electrode (2b), a groove is formed to provide a space between the second electrode (3c) and the heat transfer plate. Since it is not necessary to apply to the heat transfer plate, the production becomes easy.

  According to the thermoelectric elements of the ninth and tenth inventions, it is not necessary to make the substrate (1) and the upper surfaces of the electrodes (2b, 3c) flush with each other, so that the substrate (1) can be easily manufactured.

  In the thermoelectric element according to the eleventh invention, the insulating substrate (1) has a laminated structure of a base substrate (1a) having a high strength and a heat insulating substrate (1b) having a high heat insulating property. Can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, substantially the same parts are denoted by the same reference numerals, and description thereof will not be repeated.

[First Embodiment]
A schematic structure of the thermoelectric module according to the first embodiment is shown in FIGS. 1 is a schematic plan view seen from the upper surface (front surface) of the substrate, FIG. 2 is a schematic plan view seen from the lower surface (back surface) of the substrate, and FIG. 3 is a schematic sectional view of the substrate.

  As shown in FIG. 1, in this thermoelectric module, a plurality of strip-like heat absorption side electrodes (2a to 2h), heat radiation side electrodes (3a to 3i), p-type thermoelectric material (5a) are formed on the upper surface of the insulating substrate (1). ~ 5h), n-type thermoelectric materials (6a ~ 6h) are formed. These are the heat dissipation side electrode (3a), n-type thermoelectric material (6a), heat absorption side electrode (2a), p type thermoelectric material (5a), heat dissipation side electrode (3b), ..., p type thermoelectric material (5h), heat dissipation The side electrodes (3i) are arranged in this order, and the electric wires (7, 8) are connected to the heat radiation side electrodes (3a, 3i) at both ends. Each of the p-type thermoelectric material (5a-5h) and the n-type thermoelectric material (6a-6h) is formed into a thin film by a method such as vapor deposition so as to be in contact with the adjacent electrodes (2a-2h, 3a-3i). Yes. On the other hand, on the lower surface of the insulating substrate (1), as shown in FIG. 2, a plurality of strip-shaped heat radiation side electrodes (9a to 9i) are formed. As shown in FIG. 3, each of the heat radiation side electrodes (3a to 3i) formed on the upper surface of the insulating substrate (1) is connected to the corresponding heat radiation side of the lower surface of the insulating substrate (1) by a through hole (4). It is connected to the electrodes (9a to 9i). The through hole (4) is formed, for example, by forming a hole in the substrate (1) and filling it with a paste.

  The substrate (1) is preferably insulative and highly heat-insulating. This is to prevent heat leakage from the heat dissipation side (high temperature side) to the heat absorption side (low temperature side). As the material of the substrate (1), glass, resin, foamed resin, and the like are conceivable.

  Each electrode (2a to 2h, 3a to 3i, 9a to 9i) is preferably formed of a material (for example, copper, aluminum, etc.) having low electrical resistance and high thermal conductivity. In addition, each electrode (2a-2h, 3a-3i, 9a-9i) has nickel, gold, etc. in order to improve the bonding with each thermoelectric material (5a-5h, 6a-6h) or increase the durability. It is desirable to plate.

  As shown in FIG. 3, heat transfer plates (12, 13) are provided above and below the substrate (1) via insulating layers (10, 11), respectively. This is because the heat is made uniform and the heat flows from the upper surface to the lower surface of the module, which makes it possible to use the same as a normal thermoelectric module and make it easy to use. In addition, in the heat absorption side heat transfer plate (12), in order to avoid heat conduction between each thermoelectric material (5a to 5h, 6a to 6h) and each heat radiation side electrode (3a to 3i), a groove-like space ( 14) is formed.

  In the thermoelectric module of the present embodiment, by passing a current through the wires (7, 8) between the electrodes (3a, 3i) (see FIG. 1), each heat absorption side electrode (2a-2h) and each thermoelectric material (5a- 5h, 6a-6h) endothermic heat is generated, and heat dissipation is generated at the interface between each heat radiation side electrode (3a-3i) and each thermoelectric material (5a-5h, 6a-6h). As a result, a temperature difference corresponding to both ends of each thermoelectric material (5a to 5h, 6a to 6h) is generated. In the thermoelectric module of the present embodiment, the heat radiation side electrodes (3a to 3i) formed on the upper surface of the insulating substrate (1) and the heat radiation side electrodes (9a to 9i) formed on the lower surface are connected by a through hole (4). Therefore, heat is absorbed from the heat absorption side heat transfer plate (12) and the heat absorption side electrodes (2a to 2h) on the upper surface of the substrate (1), and the heat dissipation side electrodes (3a to 3i) and the heat dissipation side heat transfer plates (13 ) Is a type of thermoelectric module that dissipates heat. This is easy to use because it has the same format as a conventional thermoelectric module.

  Further, since the thermoelectric materials (5a to 5h, 6a to 6h) are formed only on the upper surface of the substrate (1), it is not necessary to turn the substrate (1) upside down in the manufacturing process, and the production is easy.

  In addition, in order to obtain a temperature difference by flowing current in the in-plane direction of the thermoelectric material (5a-5h, 6a-6h) formed into a thin film, the distance from the low temperature side to the high temperature side can be increased, and the temperature difference is increased. Can be taken. Specifically, the thickness of each thermoelectric material (5a to 5h, 6a to 6h) is t, the width is W (see FIG. 1), the length is L (see FIG. 3), and each electrode (2a to 2h, 3a to 3i). ) Is assumed to be Lc (see FIG. 3), the current flows in the in-plane direction of the thin film, so that a temperature difference is also applied in the in-plane direction, and L can be increased even in the thin film. A large temperature difference can be taken. In addition, by making W significantly larger than t (for example, about 1000 times) and L for about 10 times t, for example, the element form factor (L / tW) can be made equivalent to that of a normal Peltier module. Therefore, the same characteristics (resistance, heat absorption, efficiency, etc.) as those of a normal Peltier module can be obtained. Further, by making t a thin film of about 10 μm, W is extremely larger than t (for example, about 1000 times), and L is made about 10 times t, for example, the volume of thermoelectric material (LtW) can be changed to a normal Peltier module. The volume of the thermoelectric material used can be reduced to about 1/100. As a result, resource saving and cost reduction and environmental compatibility are greatly improved.

  In addition, the bonding surface between each electrode (2a to 2h, 3a to 3i) and each thermoelectric material (5a to 5h, 6a to 6h) reduces the electrical resistance and thermal resistance of the bonded portion, and the current density and In order to reduce the heat density and the loss, it is desirable to make it large (specifically, Lc> t). However, if it is too large, the material is wasted and an optimum value exists. For the same reason, the thickness of each electrode (2a to 2h, 3a to 3i) is desirably larger than the thickness of each thermoelectric material (5a to 5h, 6a to 6h).

[Second Embodiment]
A schematic cross-sectional view of a thermoelectric module according to the second embodiment is shown in FIG. In this thermoelectric module, a slit-like heat insulating portion (15) is formed in a part of the substrate (1) portion on the lower surface of each thermoelectric material (5a to 5h, 6a to 6h). Thereby, heat leak can be prevented and performance can be improved. As a method for forming the heat insulating portion (15), only the portion (15) of the substrate (1) is removed or made porous. For example, only the portion (15) of the substrate (1) is made of another material (low melting point), and after depositing the thermoelectric material (5a-5h, 6a-6h), the portion (15) is melted by heat treatment, etc. There is a way.

[Third Embodiment]
A schematic cross-sectional view of a thermoelectric module according to the third embodiment is shown in FIG. In this thermoelectric module, the surface area of each heat absorption side electrode (2a to 2h) formed on the upper surface of the substrate (1) is made larger than the surface area of each heat radiation side electrode (3a to 3i). As a result, the endothermic area on the upper surface of the substrate (1) can be increased, and the thermal resistance on the endothermic side can be lowered to improve performance. Further, by increasing the surface area of each heat radiation side electrode (9a to 9i) formed on the lower surface of the substrate (1), the heat resistance on the heat radiation side can be similarly lowered.

[Fourth Embodiment]
A schematic cross-sectional view of a thermoelectric module according to the fourth embodiment is shown in FIG. In this thermoelectric module, the heat absorption side electrodes (2a to 2h) on the upper surface of the substrate (1) are formed higher than the heat radiation side electrodes (3a to 3i). This eliminates the need for grooving the heat absorption side heat transfer plate (12), facilitating production. As a method of forming the heat absorption side electrodes (2a to 2h) higher than the heat dissipation side electrodes (3a to 3i), there are methods such as joining another member or thickening the plating only at that portion.

[Fifth Embodiment]
A schematic cross-sectional view of the thermoelectric module according to the fifth embodiment is shown in FIG. In this thermoelectric module, between each electrode (2a-2h, 3a-3i) (on the step between the substrate (1) and each electrode (2a-2h, 3a-3i)) thermoelectric material (5a-5h, 6a ~ 6h) is formed. This eliminates the need for the upper surface of the substrate (1) and the electrodes (2a to 2h, 3a to 3i) to be the same plane, making it easier to fabricate the substrate (1) (copper foil plating And can be created in the same way as a normal printed circuit board). As a method for producing such a thermoelectric module, electrodes (2a to 2h, 3a to 3i) are formed on the substrate (1), and then between each electrode (2a to 2h, 3a to 3i) (substrate (1) And thermoelectric materials (5a to 5h, 6a to 6h) are formed by vapor deposition or the like at the step portions between the electrodes and the electrodes (2a to 2h, 3a to 3i).

[Sixth Embodiment]
A schematic cross-sectional view of a thermoelectric module according to the sixth embodiment is shown in FIG. In this thermoelectric module, each electrode (2a-2h, 3a-3i) is placed on each thermoelectric material (5a-5h, 6a-6h) (substrate (1) and each thermoelectric material (5a-5h, 6a-6h) And so as to cover the stepped part). This eliminates the need for the substrate (1) and the electrodes (2a to 2h, 3a to 3i) to be on the same plane, thus facilitating the production of the substrate (1). As a method for manufacturing such a thermoelectric module, first, only the through holes (4) of the heat radiation side electrodes (3a to 3i, 9a to 9i) are formed on the substrate (1), and the thermoelectric material (5a ˜5h, 6a to 6h), and then the heat radiation side electrodes (3a to 3i) and the heat absorption side electrodes (2a to 2h) are formed by vapor deposition or the like.

[Seventh Embodiment]
FIG. 9 shows a schematic cross-sectional view of the thermoelectric module according to the seventh embodiment. In this thermoelectric module, the substrate is a laminated substrate of a base substrate (1a) and a heat insulating substrate (1b), and the upper surface is a heat insulating substrate (1b). The reason for this will be described below.

  It is desirable that the substrate used in the thermoelectric module has as good a thermal insulation performance as possible (low thermal conductivity). As an effective method for reducing the thermal conductivity, it is conceivable to make the substrate porous (foam). However, in order to reduce the thermal conductivity as much as possible, it is necessary to increase the volume of the void portion (increase the foaming rate), thereby reducing the rigidity and strength of the substrate, making it difficult to handle, The required strength as a module cannot be obtained. On the other hand, if the rigidity and strength are increased, sufficient heat insulation cannot be obtained, and the performance of the module is deteriorated.

  In the present embodiment, since the base substrate (1a) is used with high strength and the substrate (1b) with high heat insulation is laminated on the upper surface, it is possible to achieve both heat insulation and rigidity / strength, A module having high performance and high strength can be manufactured. The reason why the upper surface is the heat insulating substrate (1b) is that there is a thermoelectric element (5a-5h, 6a-6h) on the upper surface, and there is a temperature difference in this part (each heat radiation side electrode (3a-3i) and each heat absorption side) Since there is a temperature difference between the electrodes (2a to 2h), if the heat insulation of the substrate is poor, heat flows back from each heat dissipation side electrode (3a to 3i) to each heat absorption side electrode (2a to 2h), resulting in poor performance. This is because it is necessary to insulate this part as much as possible. On the contrary, the base substrate (1a) side has a heat insulating layer (1b) between the heat absorption side electrodes (2a to 2h), so there is little back flow of heat, and the heat radiation side electrodes (3a to 3i, 9a to 9i) ) Through-hole (4), and since this part has the same temperature, there is no heat transfer, and even if the heat insulation is small, the performance degradation is small.

  As a method for manufacturing such a substrate, another heat insulating substrate (1b) is bonded on the base substrate (1a), and the heat insulating substrate (1b) is formed on the base substrate (1a) by a method such as vapor deposition. The heat insulating layer (1b) is formed on the surface of the base substrate (1a) by heat treatment or chemical treatment.

[Other Embodiments]
In the thermoelectric module of the present invention, the heat absorption side is described as the upper surface (the surface on which the thermoelectric material is formed) and the heat dissipation side is described as the lower surface, but this is not limitative. The heat dissipation side may be the upper surface and the heat absorption side may be the lower surface.

  Although the thermoelectric module of the present invention describes a cooling module using the Peltier effect, it is not limited to this. Power generation using the Seebeck effect with the same structure by connecting a load instead of a power supply, applying heat input to the heat absorption side from the outside, and dissipating heat from the heat dissipation side (the temperature on the heat absorption side is higher than that on the heat dissipation side) It can be a module.

  The thermoelectric element of the present invention is suitable for a cooling device or the like that cools or generates heat by using a Peltier effect by passing a current through the element.

Schematic plan view of the thermoelectric module according to the first embodiment Schematic plan view of the thermoelectric module according to the first embodiment Schematic sectional view of a thermoelectric module according to the first embodiment Schematic sectional view of a thermoelectric module according to the second embodiment Schematic sectional view of a thermoelectric module according to the third embodiment Schematic sectional view of a thermoelectric module according to the fourth embodiment Schematic sectional view of a thermoelectric module according to a fifth embodiment Schematic sectional view of a thermoelectric module according to a sixth embodiment Schematic sectional view of a thermoelectric module according to a seventh embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating board | substrate 1a Base board | substrate 1b Heat insulation board | substrate 2a-2h Heat absorption side electrode 3a-3i, 9a-9i Heat radiation side electrode 4 Through hole 5a-5h p-type thermoelectric material 6a-6h n-type thermoelectric material 15 Heat insulation part

Claims (11)

An insulating substrate (1);
A first electrode (2b) formed on one surface of the insulating substrate (1);
A second electrode (3c) formed on the one surface of the insulating substrate (1) and spaced apart from the first electrode (2b);
A third electrode (9c) formed on the other surface of the insulating substrate (1) and connected to the second electrode (3c) by a through hole (4) provided in the insulating substrate (1). )When,
A first thermoelectric material of a first conductivity type formed in a thin film so as to be in contact with the first electrode (2b) and the second electrode (3c) on the one surface of the insulating substrate (1). 5b)
The thermoelectric element characterized by the above-mentioned. In claim 1,
A fourth electrode (2c) formed on the one surface of the insulating substrate (1) and spaced apart from the first electrode (2b) and the second electrode (3c);
A second thermoelectric material of the second conductivity type formed in a thin film on the one surface of the insulating substrate (1) so as to be in contact with the second electrode (3c) and the fourth electrode (2c). 6c)
The thermoelectric element characterized by the above-mentioned. In claim 1,
A fourth electrode (3b) formed on the one surface of the insulating substrate (1) so as to be separated from the first electrode (2b) and the second electrode (3c);
The fourth electrode is formed on the other surface of the insulating substrate (1) by being separated from the third electrode (9c) and by a through hole (4) provided in the insulating substrate (1). A fifth electrode (9b) connected to (3b);
A second thermoelectric material of the second conductivity type formed in a thin film on the one surface of the insulating substrate (1) so as to be in contact with the first electrode (2b) and the fourth electrode (3b). 6b)
The thermoelectric element characterized by the above-mentioned. In claim 1,
The width of the junction between each of the first electrode (2b) and the second electrode (3c) and the first thermoelectric material (5b) is larger than the thickness of the first thermoelectric material (5b). ,
The thermoelectric element characterized by the above-mentioned. In claim 1,
The thickness of each of the first electrode (2b) and the second electrode (3c) is larger than the thickness of the first thermoelectric material (5b).
The thermoelectric element characterized by the above-mentioned. In claim 1,
The insulating substrate (1) is
A heat insulating part (15) is formed in at least a part of the lower part of the part where the first thermoelectric material (5b) is formed;
The thermoelectric element characterized by the above-mentioned. In claim 1,
The surface area of the first electrode (2b) is larger than the surface area of the second electrode (3c).
The thermoelectric element characterized by the above-mentioned. In claim 1,
The first electrode (2b) is formed higher in the vertical direction of the insulating substrate (1) than the second electrode (3c).
The thermoelectric element characterized by the above-mentioned. In claim 1,
The first thermoelectric material (5b) is:
Formed on the step portion between each of the first electrode (2b) and the second electrode (3c) and the insulating substrate (1);
The thermoelectric element characterized by the above-mentioned. In claim 1,
Each of the first electrode (2b) and the second electrode (3c)
Formed so as to cover a step portion between the first thermoelectric material (5b) and the insulating substrate (1);
The thermoelectric element characterized by the above-mentioned. In claim 1,
The insulating substrate (1) is
Consists of a laminated substrate of a base substrate (1a) and a heat insulating substrate (1b),
The thermoelectric element characterized by the above-mentioned.

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